JP2000332179A - Structure for securing terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a structure for securing a wire bonding terminal to a resin case for semiconductor device in which defective bonding can be prevented by enhancing adhesion strength of the terminal to the resin case. SOLUTION: A terminal 40 secured to a resin case 60 has rear surface 40b bonded tightly to the surface 64 at the base part 600 of the resin case 60 and surface 40a exposed, as a pad part being wire bonded, to the base part 600 of the resin case 60. The terminal 40 is integrally molded of resin such that the forward end part 41 thereof extending from the pad part is covered by the projecting part 61 of the resin case 60 and bonded thereto.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal fixing structure for fixing, to a pedestal portion of a resin case, a terminal to be connected to the outside, particularly a terminal to be wire-bonded on its surface.

[0002]

2. Description of the Related Art FIG. 9 is a view showing a structure for fixing terminals of a conventional semiconductor device.
(B) is a fixed sectional view of the terminal, and (c) is a sectional view of the back surface of the fixed terminal.

[0003] The terminal fixing structure of the semiconductor device includes a terminal 15.
Has a thickness T1 on the mounting surface 64 of the L-shaped pedestal portion 600 of the resin case 60 provided on the semiconductor device 100.
The surface of the terminal 15 and the surface of the electrode 25 of the semiconductor element 28 mounted on the substrate 10 are pressed by the fine metal wire 30 protruded from the through hole of the bonding wedge tool 80. And are bonded by ultrasonic vibration.

[0004]

As described above, in the conventional terminal fixing structure of the semiconductor device, the terminal fixed by resin has an open surface and a small thickness in the embedding direction. When the wedge tool is moved after bonding, the pulling force on the wire accompanying the lifting of the wedge tool causes the terminal to pull out of the case, which tends to shift the position with respect to the resin case. The terminal may move due to the ultrasonic vibration during connection, which may result in bonding failure. An object of the present invention is to solve these problems, and an object of the present invention is to improve the fixing adhesion strength of a terminal to a resin case and to realize a terminal fixing structure capable of preventing a bonding failure in particular.

[0005]

In order to achieve the above object, the present invention provides a terminal fixing structure for fixing a terminal connected to the outside on a surface to a pedestal portion of a resin case, wherein the terminal comprises: The terminal is characterized by being covered and fixed with a resin case over a part of the front surface through the end from the back surface.

In a terminal fixing structure for fixing a terminal to be connected to the outside on a front surface of a resin case on a front surface, a fixing hole is formed in the terminal, and the terminal is formed from a rear surface of the terminal. A part of the surface is covered with a resin case and fixed through the fixing hole.

In a terminal fixing structure for fixing a terminal to be connected to the outside on a surface of a resin case on a pedestal portion, the terminal has a U-shaped cross section. Characterized by being fixed so as to sandwich the back surface of the pedestal portion and the surface of the pedestal portion, and further having its tip bent and embedded in the surface of the pedestal portion and fixed to the resin case. is there.

In a terminal fixing structure for fixing a terminal to be connected to the outside on a surface of a resin case on a surface of the terminal, the terminal has a triangular processing burr having a sharpened lower surface at the tip end of the terminal. The processing burr is embedded in the surface of the pedestal portion of the resin case and fixed to the resin case in a state where the terminal is in close contact with the surface of the pedestal portion of the resin case. .

In a terminal fixing structure for fixing a terminal, which is connected to the outside on the front surface, to a pedestal portion of a resin case, the terminal has an irregular shape on the back surface of the terminal.
The uneven portion is embedded in the surface of the pedestal portion of the resin case and is fixed to the resin case in a state of being in close contact with the surface of the pedestal portion of the resin case.

In a terminal fixing structure for fixing a terminal to be connected to the outside on a surface of a resin case to a pedestal portion of the resin case, the terminal has a pad portion only on a surface portion to be connected to the outside. A portion exposed from the pedestal portion and different from the surface portion is embedded in the pedestal portion of the resin case and fixed to the resin case.

Further, the terminal is characterized in that a cross section of the terminal is bent into a convex shape, and a surface portion thereof is formed as the pad portion.

Further, the terminal has a cross section substantially U-shaped.
It is characterized in that it is bent into a character shape and the surface portion is formed as the pad portion.

In a terminal fixing structure for fixing a terminal to be connected to the outside on a surface of a resin case, a plurality of the terminals are arranged side by side, and a predetermined portion of each terminal has The cross section is formed as a convex shaped part,
The convex shape portion is embedded in a pedestal portion of the resin case, and the convex shape portions of the terminals adjacent to each other are formed in different portions of the terminal. Is what you do.

In a terminal fixing structure for fixing a terminal to be connected to the outside on a surface of a resin case to a pedestal portion of the resin case, the terminal extends from a back side of the terminal to a part of the surface through a side portion. It is characterized by being covered and fixed by a case.

In a terminal fixing structure for fixing a terminal to be connected to the outside on a pedestal portion of a resin case, a concave portion is formed in a part of a side surface of the terminal, and the concave portion is formed of the resin. It is characterized by being embedded in a case.

Further, in a terminal fixing structure for fixing a terminal to be connected to the outside on a surface of a resin case to a pedestal portion, a part of the terminal is driven, and the driven portion is bent. And a protruding portion embedded in the pedestal portion of the resin case.

Further, the projection is formed in a plurality of places, and each projection is bent in the same direction.

Further, the protrusion is formed at a plurality of positions, and each of the protrusions is bent in opposite directions.

[0019]

Embodiments of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are views showing a fixing structure of a terminal of a semiconductor device according to a first embodiment of the present invention. FIG. 1A is a diagram for explaining the entire semiconductor device, and FIG. ,
(C) is a fixed top view of the terminal.

The same components from the first embodiment to the twelfth embodiment are described in the first embodiment, and the description is omitted in other embodiments.

The terminal fixing structure of the semiconductor device is a structure in which the terminal 40 is embedded and fixed in the pedestal portion 600 of the resin case 60 provided in the semiconductor device 1.
Of the semiconductor element 28 mounted on the substrate 10 and the surface of the electrode 25 of the semiconductor element 28 are pressed against the fine metal wires 30 drawn out from the through holes of the bonding wedge tool 80, and the bonding connection is made by ultrasonic vibration.

In the structure for fixing a terminal of a semiconductor device according to the first embodiment of the present invention, the terminal 40 fixed on a pedestal portion 600 of a resin case 60 provided in the semiconductor device 1 is provided.
Is formed of a thin metal material in a rectangular shape. Then, the back surface 40b of the terminal 40 is in close contact with the front surface 64 of the pedestal portion 600 of the resin case 60, and the front surface 40a of the terminal 40 is used as a pad for wire bonding.
0 is exposed from the base portion 600. Further, a tip portion 41 of the terminal 40 extending from the pad portion 40 a is covered with a projecting portion 61 of the resin case 60. Such a terminal 4
The fixing of 0 can be realized by integrally molding a resin material with a mold and fixing the resin material to the resin case 60.

Thus, the terminals 40 fixed to the resin case 60 are connected to the surface 64 of the base 600 of the resin case 60.
The fixing strength is strengthened by the close contact with the resin case and the pressing by the pressing surface 60a of the protruding portion 61 of the resin case 60,
When the wedge tool 80 is moved after the bonding, it is possible to prevent a displacement or the like due to the lifting of the wire 30 to the terminal 40. In particular, the movement of the terminal 40 due to ultrasonic vibration during bonding connection can be prevented, and the reliability of bonding can be improved. Further, since the shape of the terminal 40 is not different from the conventional one, it can be realized only by changing the mold, and the fixing structure is simplified, and the cost can be reduced.

Next, a structure for fixing a terminal of a semiconductor device according to a second embodiment of the present invention will be described. 2A and 2B are diagrams showing a terminal fixing structure of a semiconductor device according to a second embodiment of the present invention. FIG. 2A is a fixed sectional view of the terminal, and FIG. 2B is a fixed top view of the terminal.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
It is formed of a thin metal material having a rectangular shape and a fixing hole 42 provided at the center thereof. The back surface 40b of the terminal 40 is in close contact with the front surface 64 of the pedestal portion 600 of the resin case 60, and the front surface 40a of the terminal 40 is exposed from the pedestal portion 600 of the resin case 60 as a pad portion to be wire-bonded. Further, the resin case 60 has a T-shaped protrusion 6 having a cross section larger than the diameter of the fixing hole 42 protruding from the pad portion surface 40 a through the fixing hole 42 of the terminal 40.
2 are formed. The terminal 40 is sandwiched between the pressing surface 63 of the protrusion 62 and the surface 64 of the pedestal 600 of the resin case 60. The terminal 40 is fixed integrally with a resin material by using a metal mold.
It can be realized by being fixed to the.

Thus, the terminal 40 fixed to the resin case 60 is connected to the surface 64 of the pedestal 600 of the resin case 60.
The fixing strength is strengthened by the close contact with the projections 62 and the pressing by the pressing surfaces 63 of the protruding portions 62 of the resin case 60, and when the wedge tool 80 is moved after bonding,
It is possible to prevent a displacement or the like due to the lifting of the wire 30 to the terminal 40. In particular, the movement of the terminal 40 due to ultrasonic vibration during bonding connection can be prevented, and the reliability of bonding can be improved.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to a third embodiment of the present invention. FIG. 3 is a diagram illustrating a terminal fixing structure of a semiconductor device according to a third embodiment of the present invention.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
Its cross section has a U-shape, and its tip 44 is bent inward and molded of a thin metal material. The terminal 40 is fixed to the resin case 60 so as to sandwich the back surface 60b of the pedestal portion 600 of the resin case 60 and the front surface 60c of the pedestal portion 600. The surface 40 a of the terminal 40 fixed to the front surface 60 c of the pedestal portion 600 of the resin case 60 is exposed from the pedestal portion 600 of the resin case 60 as a pad portion to be wire-bonded. Further, the distal end portion 44 of the terminal 40 extended from the pad portion 40a is bent to form the pedestal portion 600 of the resin case 60.
Is embedded in the inside 65 of the. The terminal 40 is fixed integrally with a resin material by using a metal mold.
It can be realized by being fixed to the.

Thus, the terminal 40 fixed to the resin case 60 is connected to the back surface 60 of the pedestal portion 600 of the resin case 60.
b and the surface 60c of the pedestal portion 600 by being sandwiched therebetween, and furthermore, the distal end portion 44 of the terminal 40 is fixed to the resin case 60.
The fixing strength is strengthened by being fixed by being embedded in the interior 65 of the pedestal portion 600, and the wire 30 connected to the terminal 40 when the wedge tool 80 is moved after bonding.
And the movement of the terminal 40 due to ultrasonic vibration at the time of bonding connection can be prevented, and the reliability of bonding can be improved. Furthermore, the terminal 40 can be held by the front end portion 44 and the wall back surface 60b of the pedestal portion 600, and the terminal 40 after resin filling does not shift due to the flow pressure at the time of resin injection in the mold. The position accuracy of the position 40 can be improved.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to a fourth embodiment of the present invention. FIG. 4 is a diagram showing a terminal fixing structure of a semiconductor device according to the fourth and fifth embodiments of the present invention, and FIG. 4A is a structural diagram according to the fourth embodiment.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
It has a rectangular shape and is formed of a thin metal material with a pointed triangular shaped burr left on its lower surface 45. The back surface 40b of the terminal 40 is
The processing burr on the lower surface 45 of the tip end of the terminal 40 is embedded in the interior 66 of the pedestal portion 600 of the resin case 60 in close contact with the surface 64 of the pedestal portion 600. Such fixing of the terminals 40 can be realized by integrally molding the resin 40 with a resin material and fixing the terminals 40 to the resin case 60.

Thus, the terminal 40 fixed to the resin case 60 is connected to the surface 64 of the pedestal 600 of the resin case 60.
The fixing strength is strengthened by the close contact with the wedge tool 80 after the bonding, and the fixing by embedding the processing burr of the lower end surface 45 of the terminal 40 into the interior 66 of the pedestal portion 600 of the resin case 60. The displacement of the terminal 40 due to the lifting of the wire 30 to the terminal 40 and the movement of the terminal 40 due to ultrasonic vibration at the time of bonding connection can be prevented, and the reliability of bonding can be improved.

Further, the shape of the terminal 40 can be realized only by leaving the processing burr, and the fixing structure thereof is simplified, and the cost can be reduced.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to a fifth embodiment of the present invention. FIG. 4 is a view showing a structure for fixing a terminal of a semiconductor device according to the fourth and fifth embodiments of the present invention, and FIG. 4B is a structural view according to the fifth embodiment.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
A rectangular back surface 46 is formed of a thin metal material in an uneven shape. Then, the back surface 46 of the terminal 40 is in close contact with the front surface 68 of the pedestal portion 600 of the resin case 60 and
Are formed so as to be embedded in the interior 68 of the pedestal portion 600 of the resin case 60. Such a terminal 4
The fixing of 0 can be realized by integrally molding a resin material with a mold and fixing the resin material to the resin case 60.

Thus, the terminals 40 fixed to the resin case 60 are connected to the surface 68 of the pedestal portion 600 of the resin case 60.
To the resin case 6
The fixing strength is enhanced by embedding in the interior 68 of the pedestal portion 600, and the displacement due to the lifting of the wire 30 to the terminal 40 during the movement of the wedge tool 80 after the bonding and the superposition during the bonding connection. The movement of the terminal 40 due to the sound wave vibration can be prevented, and the reliability of bonding can be improved.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to a sixth embodiment of the present invention. FIG. 5 is a diagram showing a structure for fixing the terminals of the semiconductor device according to the sixth and seventh embodiments of the present invention, and FIG. 5A is a structural diagram according to the sixth embodiment.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the pedestal portion 600 of the resin case 60 is formed of a thin metal material having a substantially convex cross section in the front-rear direction. The resin case 60 serves as a pad portion on which the surface 40a of the convex portion of the terminal 40 is wire-bonded.
Of the pad portion 40a.
Ob is in close contact with the surface 70 of the pedestal 600 of the resin case 60. Further, both end portions extending from the pad portion 40a are bent into L-shaped shapes 47 and 48, respectively, and are embedded in the insides 69 and 71 of the pedestal portion 600 of the resin case 60. The terminal 40 is fixed integrally with a resin material by using a metal mold.
It can be realized by being fixed to the.

Thus, the terminals 40 fixed to the resin case 60 are connected to the surface 70 of the pedestal 600 of the resin case 60.
The fixing strength is strengthened by the close contact with the terminal 40 and the fixing by embedding the end portions 47 and 48 of the back surface 40b of the terminal 40 bent into the L shape into the insides 69 and 71 of the pedestal portion 600 of the resin case 60, When moving the wedge tool 80 after bonding, the wire 30
And the movement of the terminal 40 due to ultrasonic vibration at the time of bonding connection can be prevented, and the reliability of bonding can be improved.

Further, the terminal 40 is connected to the front and rear ends 4.
It is possible to hold the terminal 40 at 7, 48, and to improve the positional accuracy of the terminal 40 after resin filling without causing a positional deviation of the terminal 40 due to the flow pressure at the time of injecting the resin into the mold.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to a seventh embodiment of the present invention. FIG. 5 is a diagram showing a structure for fixing the terminals of the semiconductor device according to the sixth and seventh embodiments of the present invention, and FIG. 5B is a structural diagram according to the seventh embodiment.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
The cross section in the left-right direction is formed in a U-shape with a thin metal material. The U-shaped central surface 40a of the terminal 40 is used as a pad for wire bonding.
The back surface of the pad portion 40 a is exposed to the surface of the pedestal portion 600 of the resin case 60. Further, left and right end portions 49 of the pad portion 40a are each bent into a U-shape, and
Is formed so as to be embedded in the interior 72 of the pedestal portion 600. The fixing of the terminals 40 can be realized by integrally molding with a resin material and fixing to the resin case 60.

As a result, the terminal 40 fixed to the resin case 60 is brought into close contact with the surface of the pedestal portion 600 of the resin case 60, and furthermore, the both ends 49 of the terminal 40 bent into a U-shape are attached to the resin case 60. Inside 7 of pedestal part 600
Fixing strength is strengthened by fixing by embedding in 2,
When the wedge tool 80 is moved after bonding, displacement of the terminal 30 due to the lifting of the wire 30 to the terminal 40 and movement of the terminal 40 due to ultrasonic vibration at the time of bonding connection can be prevented, and the reliability of bonding can be improved. .

Next, a description will be given of a terminal fixing structure of a semiconductor device according to an eighth embodiment of the present invention. 6A and 6B are diagrams showing a terminal fixing structure of a semiconductor device according to an eighth embodiment of the present invention. FIG. 6A is a fixed sectional view of the terminal, and FIG. 6B is a fixed top perspective view of the terminal.

The terminal fixing structure of the present semiconductor device has a structure in which a plurality of terminals are arranged side by side, and the adjacent terminals are arranged so as not to interfere with each other even if the interval between the adjacent terminals is reduced as much as possible. Has been changed. In the terminals 50 and 51 fixed on the pedestal portion 600 of the resin case 60 in the present structure, one of the adjacent terminals 50 has a protruding portion 53 having a convex cross section at the tip thereof. A portion 90 is formed on the back surface of the terminal 50, and the other terminal 51 is provided with a projection 54 having a convex cross section at an intermediate portion on the rear surface of the terminal 51 as a convex portion 91. These convex portions 90 and 91 are provided at different positions from each other so as not to overlap. The surfaces of the terminals 50 and 51 serve as pad portions to be wire-bonded.
0, and the back surface of the pad portion is in close contact with the surface of the pedestal portion 600 of the resin case 60. And terminal 5
The protrusions 53 and 54 of the resin case 6
The pedestal 600 is formed so as to be embedded in the interior 73 of the pedestal 600. The terminals 50 and 51 can be fixed by integrally molding them with a resin material and fixing them to the resin case 60.
In the shape of the terminal 40 according to the present embodiment, a projection having a convex cross section is provided. However, regardless of this, a projection having a rectangular shape or the like is provided and embedded in the pedestal 600 of the resin case 60. The fixing strength may be enhanced.

As a result, the terminals 50 and 51 fixed to the resin case 60 are brought into close contact with the surface of the pedestal portion 600 of the resin case 60, and the projections 53 and 54 of the terminals 50 and 51 are further attached to the resin case 60. Inside 7 of pedestal part 600
Fixing strength is strengthened by fixing by embedding in 3,
When the wedge tool 80 is moved after bonding, displacement of the terminal 30 due to the lifting of the wire 30 to the terminal 40 and movement of the terminal 40 due to ultrasonic vibration at the time of bonding connection can be prevented, and the reliability of bonding can be improved. . In addition, the positions of the protruding parts of each adjacent terminal are alternately changed so that they do not interfere with each other at the tip end and the middle part. Can be installed.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to a ninth embodiment of the present invention. FIGS. 7A and 7B are views showing a structure for fixing a terminal of a semiconductor device according to ninth and tenth embodiments of the present invention. FIG. 7A is a structural sectional view according to the ninth embodiment, and FIG. () Is a structural top view according to the ninth embodiment.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
It has a rectangular shape and is formed of a thin metal material. The back surface 40b of the terminal 40 is connected to the pedestal portion 600 of the resin case 60.
The surface 40a of the terminal 40 is exposed to the pedestal portion 600 of the resin case 60 as a pad portion to be wire-bonded. Also, the resin case 60 has a central portion of the pad portion 40a and both left and right ends (corresponding to side portions).
A projection 74 is formed so as to press a part 55 of the surface of the terminal 40.
The pedestal portion 600 is sandwiched between the pedestal portion 600 and the surface 64 of the base portion 600. The fixing of the terminals 40 can be realized by integrally molding with a resin material and fixing to the resin case 40.

Thus, the terminals 40 fixed to the resin case 60 are connected to the surface 64 of the base 600 of the resin case 60.
The fixing strength is strengthened by the close contact with the wedge tool 8 after the bonding, and the fixing of the protrusion 40 of the resin case 60 to the surface portion 55 of the terminal 40 by the pressing surface 74a.
When the wire 30 is moved, the displacement of the terminal 40 due to the lifting of the wire 30 to the terminal 40 and the movement of the terminal 40 due to the ultrasonic vibration at the time of bonding connection can be prevented, and the reliability of bonding can be improved. Further, since the shape of the terminal 40 is not different from the conventional one, it can be realized only by changing the mold, and the fixing structure can be simplified and the cost can be reduced.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to a tenth embodiment of the present invention. FIGS. 7A and 7B are diagrams showing a structure for fixing terminals of semiconductor devices according to ninth and tenth embodiments of the present invention. FIG. 7C is a cross-sectional view of the structure according to the tenth embodiment, and FIG. () Is a structural top view according to the tenth embodiment.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
The upper surface 40a is formed of a thin sheet metal material, and is provided with concave concave portions 56 at both left and right ends (corresponding to side portions) of the upper surface 40a. The back surface 40b of the terminal 40 is connected to the pedestal portion 600 of the resin case 60.
The surface 40a of the terminal 40 is exposed to the pedestal portion 600 of the resin case 60 as a pad portion to be wire-bonded. The resin case 60 has a protrusion 75 embedded therein so as to press the surface of the concave portion 56 of the pad portion.
And the surface 64 of the pedestal portion 600 of the resin case 60. The fixing of the terminals 40 can be realized by integrally molding with a resin material and fixing to the resin case 60.

Thus, the terminal 40 fixed to the resin case 60 is connected to the surface 64 of the pedestal portion 600 of the resin case 60.
The fixing strength is enhanced by the close contact with the terminal 40 and the pressing of the terminal 40 against the concave portion 56 by the pressing surface 75 a of the protruding portion 75 of the resin case 60, and the wire to the terminal 40 when the wedge tool 80 moves after bonding. It is possible to prevent displacement of the terminal 40 due to the lifting of the terminal 30 and movement of the terminal 40 due to ultrasonic vibration at the time of bonding connection, and improve the reliability of bonding.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to an eleventh embodiment of the present invention. FIGS. 8A and 8B are views showing the structure for fixing the terminals of the semiconductor device according to the eleventh and twelfth embodiments of the present invention. FIG. 8A is a structural sectional view according to the eleventh embodiment, and FIG. () Is a structural top view according to the eleventh embodiment.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
It is molded from a thin metal plate having a rectangular shape, and tongue-shaped projections 57 are provided by punching in several places in the front-rear direction at the center of the upper surface 40a. The projecting portion 57 is formed by being bent in the same direction with respect to the back surface side of the terminal 40. The upper surface 40a is exposed as a pad portion to be wire-bonded to the pedestal portion 600 of the resin case 60, and the back surface of the pad portion 40a is in close contact with the surface 64 of the pedestal portion 600 of the resin case 60. Further, a protruding portion 57 provided on the back surface of the pad portion 40 a is embedded in the interior 76 of the pedestal portion 600 of the resin case 60. The fixing of the terminals 40 can be realized by integrally molding with a resin material and fixing to the resin case 60.

Thus, the terminal 40 fixed to the resin case 60 is connected to the surface 64 of the pedestal 600 of the resin case 60.
To the terminal 40 during the movement of the wedge tool 80 after bonding, by tightly attaching the protrusions 57 of the terminal 40 to the interior 76 of the pedestal portion 600 of the resin case 60 and by fixing the protrusion. Wire 30
And the movement of the terminal 40 due to ultrasonic vibration at the time of bonding connection can be prevented, and the reliability of bonding can be improved.

Next, a description will be given of a terminal fixing structure of a semiconductor device according to a twelfth embodiment of the present invention. FIG. 8 is a view showing a structure for fixing terminals of semiconductor devices according to eleventh and twelfth embodiments of the present invention. FIG. 8 (c) is a structural sectional view according to the twelfth embodiment, and FIG. It is a structure top view by 12th Embodiment.

In the terminal fixing structure of the present semiconductor device, the terminal 40 fixed on the base 600 of the resin case 60 is
It is formed of a rectangular thin metal plate, and is formed in the vicinity of the front and rear ends of the central portion of the upper surface 40a by being bent in opposite directions to the rear surface side. The upper surface 40a is exposed as a pad portion to be wire-bonded to the pedestal portion 600 of the resin case 60, and the back surface of the pad portion 40a is in close contact with the surface 64 of the pedestal portion 600 of the resin case 60. Further, a protruding portion 58 provided on the back surface of the pad portion 40a and bent in the opposite direction is formed inside the pedestal portion 600 of the resin case 60.
7 to be embedded therein. The terminal 40 is fixed integrally with a resin material by resin molding.
It can be realized by being fixed to the. In the shape of the terminal 40 according to the present embodiment, L-shaped protrusions 58 in opposite directions are provided in the vicinity of both front and rear ends.
Regardless, a protrusion having a U-shape or the like may be provided and embedded in the pedestal portion 600 of the resin case 60 to enhance the fixing strength.

Thus, the terminal 40 fixed to the resin case 60 is connected to the surface 64 of the pedestal 600 of the resin case 60.
To the terminal 40 during the movement of the wedge tool 80 after bonding, because of the close contact with the terminal 40 and the fixing by embedding the protrusion 58 of the terminal 40 into the interior 77 of the pedestal 600 of the resin case 60. Wire 30
And the movement of the terminal 40 due to ultrasonic vibration at the time of bonding connection can be prevented, and the reliability of bonding can be improved.

Further, the terminals 40 can be held by the projecting portions 57 provided in directions opposite to each other. The position accuracy of the terminal 40 can be improved, and the fixing strength can be further enhanced.

In the above embodiment, the wire bonding is symmetrical. However, the present invention is not limited to this, and other welding with vibration may be symmetrical.

[0062]

As described above, according to the present invention, in the terminal fixing structure, the fixing strength of the terminal to the resin case is enhanced, and particularly, when the wedge tool is moved after bonding, the wire to the terminal is moved. This prevents the displacement due to the lifting of the terminal, prevents the terminal from moving due to the ultrasonic vibration at the time of bonding connection, and improves the reliability of bonding.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a terminal fixing structure of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a terminal fixing structure of a semiconductor device according to a second embodiment of the present invention.

FIG. 3 is a diagram illustrating a terminal fixing structure of a semiconductor device according to a third embodiment of the present invention.

FIG. 4 is a diagram showing a terminal fixing structure of a semiconductor device according to fourth and fifth embodiments of the present invention.

FIG. 5 is a diagram showing a structure for fixing terminals of a semiconductor device according to sixth and seventh embodiments of the present invention.

FIG. 6 is a diagram illustrating a terminal fixing structure of a semiconductor device according to an eighth embodiment of the present invention.

FIG. 7 is a diagram showing a terminal fixing structure of a semiconductor device according to ninth and tenth embodiments of the present invention.

FIG. 8 is a diagram showing a terminal fixing structure of a semiconductor device according to eleventh and twelfth embodiments of the present invention.

FIG. 9 is a diagram showing a terminal fixing structure of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Substrate 25 ... Electrode of semiconductor element 28 ... Semiconductor element 30 ... Thin metal wire 40 ... Terminal 50 ... Power element 60 ... Resin case 80 ... Wedge tool

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Norimitsu Yukimatsu 1-2-28 Gosho-dori, Hyogo-ku, Kobe-shi, Hyogo Inside Fujitsu Ten Co., Ltd. 1-2-2, Fujitsu Ten Co., Ltd. (72) Inventor Takafumi Yasuhara 1-2-2, Goshodori, Hyogo-ku, Kobe-shi, Hyogo F-term in Fujitsu Ten Co., Ltd. 5F044 AA07

Claims (14)

[Claims] 1. A terminal fixing structure for fixing a terminal, which is connected to the outside on a front surface, to a pedestal portion of a resin case, wherein the terminal extends from a back surface of the terminal to a part of the front surface through an end portion. A terminal fixing structure characterized by being covered and fixed by a case. 2. A terminal fixing structure for fixing a terminal, which is connected to the outside on a front surface, to a pedestal portion of a resin case, wherein the terminal has a fixing hole formed therein, and the terminal is formed from a rear surface of the terminal. A terminal fixing structure, wherein the terminal is covered and fixed with a resin case over a part of the surface through the fixing hole. 3. A terminal fixing structure for fixing a terminal connected to the outside on a surface to a pedestal portion of a resin case, wherein the terminal has a U-shaped cross section. The terminal is characterized by being fixed so as to sandwich the back surface of the pedestal portion and the surface of the pedestal portion, and further having its tip bent and embedded in the surface of the pedestal portion and fixed to the resin case. Fixed structure. 4. A terminal fixing structure for fixing a terminal connected to the outside on a surface to a pedestal portion of a resin case, wherein the terminal has a triangular processing burr whose tip lower surface is sharp. Wherein the processing burr is embedded in the surface of the pedestal portion of the resin case and fixed to the resin case in a state where the terminal is in close contact with the surface of the pedestal portion of the resin case. Construction. 5. A terminal fixing structure for fixing a terminal, which is connected to the outside on a front surface, to a pedestal portion of a resin case, wherein the terminal has a back surface formed in an uneven shape, and the pedestal of the resin case. The terminal fixing structure, wherein the concave and convex portions are embedded in the surface of the pedestal portion of the resin case in a state of being in close contact with the surface of the portion, and are fixed to the resin case. 6. A terminal fixing structure for fixing a terminal to be connected to the outside on a surface to a pedestal portion of a resin case, wherein the terminal is a pad portion only on a surface portion to be connected to the outside. A terminal fixing structure, wherein a portion exposed from the pedestal portion and different from the surface portion is embedded in the pedestal portion of the resin case and fixed to the resin case. 7. The terminal fixing structure according to claim 6, wherein the terminal is formed by bending a cross section of the terminal into a convex shape, and a surface portion thereof is formed as the pad portion. 8. The terminal according to claim 6, wherein a cross section of the terminal is bent into a substantially inverted U-shape, and a surface portion thereof is formed as the pad portion. Fixed structure. 9. A terminal fixing structure for fixing a terminal to be connected to the outside on a surface of a resin case on a surface, wherein a plurality of said terminals are arranged, and a predetermined portion of each of said terminals is provided. The cross section is formed as a convex shape portion, and the convex shape portion is embedded in the pedestal portion of the resin case, and the convex shape portions of the terminals adjacent to each other are
A terminal fixing structure, wherein the terminal is formed of different portions from each other. 10. A terminal fixing structure for fixing a terminal, which is connected to the outside on the front surface, to a pedestal portion of a resin case, wherein the terminal extends from a back surface of the terminal to a part of the front surface via a side portion. A terminal fixing structure characterized by being covered and fixed by a case. 11. A terminal fixing structure for fixing a terminal connected to the outside on a surface to a pedestal portion of a resin case, wherein a concave portion is formed in a part of a side surface of the terminal, and the concave portion is formed of the resin. A terminal fixing structure characterized by being embedded in a case. 12. A terminal fixing structure for fixing a terminal to be connected to the outside on a pedestal portion of a resin case on a surface, wherein a part of the terminal is driven, and the driven part is bent. And a projecting portion embedded in the pedestal portion of the resin case. 13. The terminal fixing structure according to claim 12, wherein the projecting portions are formed at a plurality of positions, and each of the projecting portions is bent in the same direction. 14. The terminal fixing structure according to claim 12, wherein the projecting portions are formed at a plurality of positions, and each of the projecting portions is bent in opposite directions.