JP2000332178A - Surface mount electronic part and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To connect an electronic part easily and surely with an external wiring circuit while protecting well. SOLUTION: The surface mount electronic part comprises an electronic part 20 having an electrode part 22 on the outer surface, electrode bands 16 each comprising a flexible insulating film 11 having a conductor layer 13 on the surface where the conductor layer 13 is bonded, on one end side thereof, to the electrode part 22 of the electronic part 20 and turned down, on the other end side thereof, to direct outward, and resin shells 42, 44 having a recess 45 for exposing the conductor layer 13a of the electrode band 16 directing outward to the inner surface. Connecting work with an external circuit is carried out utilizing the exposed conductor layer 13a in the rear of the recess 45.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component for surface mounting and a method for manufacturing the same, and more particularly, to a method for directly wiring a small electronic component such as a diode without using connection terminals or connection wires. The present invention is directed to a surface mounting electronic component that can be mounted on a circuit and a method of manufacturing such a surface mounting electronic component.

[0002]

2. Description of the Related Art Conventionally, in order to mount a minute electronic component such as a diode on a wiring circuit such as a printed circuit board, the electronic component is provided with leg-shaped connection terminals protruding from its outer surface in advance. A general technique is to extend the connection terminals to the electrodes of the wiring circuit and join them by soldering or the like.

[0003] In some resistance elements, the outer surface of the element itself serves as an electrode. Such an electronic component is arranged directly on the wiring circuit, and the electrodes of the electronic component and the electrodes of the wiring circuit are joined by soldering or the like. There is also known a technique of encapsulating an electronic component in an insulating resin such as an epoxy resin in order to protect the electronic component from mechanical or electrical influences from the outside.

In such a resin encapsulation technique, leg-shaped connection terminals electrically connected to the electronic component are provided outside the encapsulation resin in order to extract the electrodes of the electronic component embedded in the encapsulation resin to the outside. A technique of protruding or a technique of embedding a circuit board electrically connected to an electronic component and having an electrode on the surface while exposing the circuit board to the surface of the encapsulating resin is adopted.

[0005]

The technique of connecting an electronic component to an external wiring circuit using a leg-shaped connection terminal requires a lot of labor for forming or attaching the connection terminal to the electronic component, and the manufacturing cost is increased. However, there are problems such as high cost and poor workability of mounting work. The finer connection terminals provided on the fine electronic components are also difficult to handle for transportation and storage.

In the method of directly connecting an electronic component to an external circuit, there is a concern that damage such as heat or impact may be given to the electronic component during a soldering operation or the like. The solder adheres to the surface of the electronic component other than the target electrode, causing a problem of poor connection and electrical damage. The technique of encapsulating a connection circuit board having electrodes on the surface together with electronic components in a resin requires time and effort to manufacture the connection circuit board,
The number of work steps for electrically connecting the electronic component and the connection circuit board also increases.

Furthermore, if there are extra conductors between the electronic component and the external wiring circuit, such as connection terminals, connection circuit boards, and conductors connecting the connection circuit board and the electronic components,
There is also a problem that electrical performance such as high frequency characteristics is adversely affected. An object of the present invention is to make it possible to easily and reliably connect an electronic component to an external wiring circuit while protecting the electronic component well.

[0008]

An electronic component for surface mounting according to the present invention comprises an electronic component main body, an electrode strip, and a resin shell. The electronic component body has an electrode portion on the outer surface. The electrode strip is made of a flexible insulating film having a conductor layer on the surface, and the conductor layer is joined to the electrode part of the electronic component body at one end, and folded at the other end so that the conductor layer faces outward. Become. The resin outer shell has a concave portion in which the electronic component body and the electrode band are sealed, and the conductor layer of the electrode band facing outward is exposed on the inner surface. [Electronic component body] The present invention can be applied to electronic components used in ordinary electric and electronic technical fields. In addition to single-function electronic elements such as resistors, capacitors, diodes, and transistors,
An integrated circuit element in which a large number of functional elements are incorporated is also applicable. Light emitting diodes, acoustic components, sensor components, and the like are also applicable.

The electronic component is provided with an electrode portion for connecting to an external circuit at least on a part of the outer surface. One entire surface of the electronic component may be one electrode portion. A pair of electrode parts can be provided symmetrically on two opposing surfaces of the electronic component. A plurality of electrode portions can be provided on one surface of the electronic component. In some cases, a plurality of pairs of electrode portions may be provided symmetrically on the facing surface of the electronic component. [Electrode band] For the flexible insulating film, a resin material used as an insulating material in ordinary electronic materials, such as a polyimide resin, is used. Materials for flexible circuit boards can be used.

Although the thickness of the flexible insulating film varies depending on the material, it is, for example, about 5 to 200 μm, preferably 10 to 25 μm. As for the flexibility of the film, since it is not repeatedly deformed in the use form of the completed electronic component, it is sufficient that the film has enough flexibility to be able to fold the electrode band in the manufacturing process. .

The conductive layer is made of a conductive metal such as copper, nickel or gold or a metal alloy, and is formed on the surface of the flexible insulating film by plating or various thin film forming means. The conductor layer may be a single layer, or may be a multilayer formed by combining a plurality of materials. For example, a copper layer with a gold layer formed on the surface is used. The thickness of the conductor layer is set to about several μm to several tens μm, although it varies depending on usage conditions such as current capacity. The higher the thickness of the conductive layer and the higher the conductivity of the metal, the better the high frequency characteristics.

The electrode strip plays a role in drawing out the electrode portion of the electronic component body to near the surface of the resin shell. The shape of the electrode band is set according to the electrode shape required for connection to the electrode portion of the electronic component body and an external wiring circuit. Normally,
What is necessary is just to form a narrow strip shape. The width of the electrode strip is set in consideration of workability such as the above-mentioned folding operation, electric performance, and the like. Specifically, it is set in the range of about 0.05 to 5 mm, preferably about 0.2 to 2 mm.

The conductor layer on one end side of the electrode strip is joined to the electrode part of the electronic component body. The joining means is soldering or brazing,
Bonding means used for normal electrode connection and electrical connection of electronic components, such as conductor paste connection and direct welding, are employed. The electrode band is formed so that the conductor layer connected to the electrode portion of the electronic component main body changes from the state in which the electronic component main body, that is, the inside faces, to the state in which the conductive layer faces the outside behind the electronic component main body. The end is folded outward. The conductor layer facing outward serves as an electrode for connection to an external wiring circuit. [Resin outer shell] An insulating resin material for resin encapsulation or package of a normal electronic component is used. Specifically, a polyimide resin, an epoxy resin, or the like can be given. A material having good adhesiveness to the electronic component body or the electrode strip is preferable.

The resin outer shell may have a polyhedral shape such as a cube or a rectangular parallelepiped. A three-dimensional shape having a curved surface or an inclined surface such as a columnar shape, an elliptical columnar shape, or a conical shape can also be adopted. However, when mounting on a flat surface such as an external wiring circuit,
It is preferable that the surface for attachment is a flat surface. The electronic component body and the electrode strip are sealed in the resin outer shell. It is preferable that the electronic component main body and the electrode strip are sealed so as to be exposed to the outside as little as possible except for a part necessary for connection with the outside.

However, the resin outer shell has a concave portion in which the outer conductor layer of the electrode strip is exposed on the inner surface. The recess is
It is formed in an arrangement structure suitable for connection to an external wiring circuit or the like. It is preferable that a part of the concave portion is arranged on a mounting surface when the electronic component is connected to an external wiring circuit. If the conductor layer of one electrode band is exposed for each recess, the exposed conductor layer can be reliably connected to an external electrode with solder or the like supplied to the recess. A plurality of exposed conductor layers may be arranged in one recess while being sufficiently isolated from each other.

In the case where the resin outer shell has a ridge such as a rectangular parallelepiped, a concave portion can be formed on both sides of the ridge. If one surface of the ridge is used as a mounting surface for an external wiring circuit or the like, an open recessed space is formed on the other surface of the ridge, so that solder can easily enter there. Specifically, a concave portion can be formed in the rectangular parallelepiped resin outer shell between the bottom surface and the side surface serving as the mounting surface. [External Surface Exposed Portion] The end of one end side of the electrode strip can be disposed so as to be exposed along the outer surface of the resin outer shell with the conductor layer facing outward.

If a portion of the conductor layer connected to the electrode portion of the electronic component body is disposed so as to be exposed on the outer surface of the resin outer shell,
The electronic component body can be inspected by applying the inspection probe to the exposed portion. After the electronic component is mounted on a wiring circuit or the like, it can be used for inspection of the wiring circuit. The exposed portion also has a heat radiation function of releasing heat generated by the electronic component body to the outside. [Manufacture of electronic components] Basically, resin sealing technology, package technology, electrode connection technology, and the like of ordinary electronic components can be used.

A method combining the following steps can be adopted. A step of preparing an electrode band supply material having a conductive layer disposed on the surface of a flexible insulating film and having a large number of electrode bands arranged at intervals and a pair of side bands connecting both ends of each electrode band continuously ( a). (B) a step of disposing an electrode band supply material on each of two opposing surfaces of the electronic component body, and joining a conductor layer of the electrode band included in the electrode band supply material to each of the electrode portions on each surface of the electronic component body; .

A step (c) of separating one end of the electrode strip from a side strip of the electrode strip supply material outside of a joint portion to the electronic component body.
. Step (d) of folding back the other end of the electrode strip, which does not separate the side strip, so that the conductor layer faces outward together with the side strip.
. An electrode band in which the electronic component body and a part of the electrode band are mounted on a molding die having a mold part with which a part of the conductor layer facing outward is in contact, and the remaining part of the electrode band and the electrode band are continuously provided. A step (e) of supplying a resin to the molding die to form a resin outer shell while the side band of the supply material is arranged outside the molding die.

The step (f) of separating the electrode band sealed in the molded resin shell from the electrode band supply material existing outside the resin shell. The electrode band supply material is manufactured in the form of a long tape, and while the electrode band supply material is continuously supplied, the steps of joining the electronic component body, folding the electrode band, and forming the resin shell are sequentially performed. If so, surface mount electronic components can be efficiently and continuously produced.

In the steps (c) and (f) for separating the electrode strip from the side strip, a cutting or cutting device such as a press cutter or a punching device is used. The molding of the resin shell
Normal molding means such as injection molding and extrusion molding are employed. However, the mold is provided with a mold part in which a part of the conductor layer facing outward is abutted so that at least a part of the conductor layer of the electrode band facing outward is exposed without being covered with the resin. Keep it. The mold portion that comes into contact with the conductor layer is arranged in a shape portion for forming a concave portion in the resin outer shell.

The resin molding is performed in a state where the electrode strip is connected to the electrode strip supply material. The connecting portion between the side band of the electrode band supply material arranged outside the mold and the electrode band arranged inside the mold is arranged in a through structure provided in the mold.
The resin shell may be formed in a final shape at one time, but may be formed in two steps in consideration of the shape structure of the electronic component body and the electrode band. By performing the two-stage molding, it is possible to reliably and easily expose a part of the conductor layer of the electrode band and form a concave portion.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Surface-mounted electronic components are manufactured through the steps shown in FIGS. [Electrode band supply material] As shown in FIG. 1B, the electrode band supply material 10 is made of a polyimide resin and has a thickness of, for example, 20 μm.
m flexible insulating film 11 and a conductor layer 13 laminated on the surface thereof. The conductor layer 13 has, for example, a thickness of 1
It consists of a copper layer of 0 μm and a gold plating layer having a thickness of several μm formed on its surface. Since the gold plating layer has excellent conductivity and is a thin film, high-frequency characteristics can be improved.

As shown in FIG. 1A, the electrode band supply material 10
Is a side band 1 which is in the form of a band and extends along both sides.
2, and a plurality of narrow strip-shaped electrode strips 16 connecting the side strips 12 on both sides at regular intervals. A rectangular hole 14 is formed between the adjacent electrode strips 16 and the side strips 12, 12. At both ends in the length direction of the electrode strip supply material 10, mounting holes 18 are formed so as to penetrate therethrough.
It is used to handle, transport, and support the electrode band supply material 10.

An example of the dimensions of the electrode band supply material 10 will be described. The overall width is 15 mm, the length is 70 mm, and the width of the electrode strip 16 is 0.3
mm, the length between the side bands 12, 12 can be 5 mm, and the interval between the electrode bands 16 can be 5 mm. [Joining of Electronic Component and Electrode Band] As shown in FIG. 2, the electronic component body 20 is a diode having a rectangular parallelepiped shape. Two opposing surfaces of the electronic component body 20 are electrode portions 22, 22. As the dimensions of the electronic component body 20, for example, the electrode part 22 is 0.35 mm square, and the distance between the electrode parts 22, 22 is 2 mm.
One having a thickness of 00 μm is used.

The electrode part 22 on the opposing surface of the electronic component body 20,
22 so that the conductor layer 13 of the electrode strip 16 abuts on each side of the electronic component body 20.
0 is placed. The width of the electrode strip 16 is
Is slightly wider than the width. The electronic component body 20 is arranged at the center in the length direction of the electrode strip 16. The conductor layer 13 of the electrode strip 16 and the electrode part 22 of the electronic component body 20 are joined by welding. Specifically, for example, the electrode band supply material 1
The heat press can be performed from the outside to the electronic component body 20 from outside. Soldering may be performed with a solder material interposed between the conductor layer 13 and the electrode portion 22.

The electronic component body 20 is bonded to each electrode band 16 of the electrode band supply material 10. [Folding of Electrode Bands] As shown in FIG. 3, the electrode bands 16, 16 joined to the electrode portions 22, 22 of the electronic component body 20 are formed.
Of these, one end is cut just outside the electrode portions 22, 22. The electrode strip 16 and the side strip 12 outside the cut portion are removed. The workability is good if the electrode portions 22 of the plurality of electronic component bodies 20 are cut at once by a press cutter or the like.

As shown in FIG. 4, the electrode band 16 on the uncut side and the side band 12 (not shown) on which the electrode band 16 is connected are folded back from the end of the electrode portion 22 in a U-shape. The folded electrode band 16 is arranged in parallel with the electrode band 16 of the portion joined to the electrode portion 22 at an interval, and the conductor layer 13 of the electrode band 16 is arranged facing outward. If the folding operation is performed while holding the side band 12, the plurality of electrode bands 16 can be easily folded at the same time. [First-stage resin molding] As shown in FIG.
The electronic component body 20 folded back into a letter shape is
Attach to 31.

The mold cavity 32 of each of the molds 30 and 31 has a rectangular parallelepiped shape slightly larger than the outer shape of the electronic component body 20. The conductor layer 13 on the outer surface of the folded electrode strip 16 is arranged in contact with the inner surface of the mold cavity 32. Side band 12
(Not shown), the electrode strip 16 is
One of the electrode strips 16 and the side strips 12 are arranged outside the mold 31 so as to extend to the outside through one through portion.

In this state, a polyimide resin common to the insulating film 11 is supplied to the mold cavity 32 to perform resin molding. After the molded resin is sufficiently dried, it is removed from the mold. As shown in FIG. 6, the outer periphery of the electronic component body 20 is covered with a rectangular parallelepiped resin outer shell 42. However, the electrode band 16 where the conductor layer 13 faces outward is the resin outer shell 4.
2 is exposed on the surface. The electrode strip 16 extending outside the resin outer shell 42 is supported by a side strip 12 (not shown). [Second-stage resin molding] As shown in FIG. 7, the electronic component body 20 enclosed in the resin outer shell 42 is mounted on the molds 34 and 35.

The mold cavity 36 of each of the molding dies 34 and 35 has a rectangular parallelepiped shape slightly larger than the outer shape of the resin outer shell 42.
At the lower end of the opposing inner surface of the mold cavity 36, there are convex portions 37, 37 protruding inward. When the resin shell 42 including the electronic component body 20 is mounted on the mold cavity 36, the lower end surface of the resin shell 42 contacts the bottom surface of the mold cavity 36, and the resin shell 4
A part of the conductor layer 13 of the electrode strip 16 exposed on both side surfaces of the mold abuts on the projection 37 of the mold cavity 36. The electrode strip 16 extending from the resin outer shell 42 to the outside extends through the mold 35 to the outside. The electrode strip 16 and the side strip 12 are arranged in the outer space of the mold 35.

In this state, the same polyimide resin as described above is supplied to the mold cavity 36 to perform resin molding. As shown in FIG. 8A, the outer periphery of the resin outer shell 42 is further covered with a rectangular parallelepiped resin outer shell 44. A concave portion 45 having a shape corresponding to the convex portion 37 of the molding die 35 is formed in a portion of the resin outer shell 44 near the bottom of the opposing side surface. The concave portion 45 exists from the side surface of the rectangular parallelepiped resin outer shell 44 to the bottom surface 47.
Of the electrode strips 16 exposed on the outer periphery of the resin outer shell 42, the front end portion is covered with the resin outer shell 44. The outer portion of the U-shaped turn of the electrode strip 16 is exposed on the inner surface of the recess 45.

The tip of the electrode strip 16 extends outside the resin shell 44 and is connected to the side strip 12 (not shown). The portion of the electrode strip 16 extending outside the resin outer shell 44 is cut and separated from the electrode strip 16 sealed inside the resin outer shell 44.
The electrode strip 16 outside the cut and separated portion is the side strip 12
Removed with. [Appearance Structure of Electronic Component] As shown in FIG. 8 (b), the manufactured electronic component P for surface mounting has the electronic component body 20 encapsulated in resin outer shells 44 and 42 each having a substantially rectangular parallelepiped shape. Thus, physical and electrical protection of the electronic component body 20 can be reliably achieved. It is possible to prevent moisture and moisture in the external environment from entering the electronic component body 20.

A rectangular concave portion 45 is arranged on the lower side surface of the electronic component P having a rectangular parallelepiped shape. The lower end of the recess 45 reaches the bottom surface 47. A part of the conductor layer 13 of the electrode strip 16 is exposed 13 a on the inner surface of the recess 45. The conductor layer exposed portion 13a is formed on the bottom surface 4 of the inner side surface of the concave portion 45.
It is arranged upward from a position slightly higher than 7. Since the gold layer is disposed on the surface of the conductor layer exposed portion 13a,
It is hardly corroded and has good electrical connectivity.

On the upper surface of the electronic component P, the end surface of the trace of the electrode band 16 extending to the outside of the resin outer shell 44 is exposed. An exposed portion of the electrode strip 16 may be covered by applying an insulating film or applying an insulating resin on the upper surface of the electronic component P. When mounting the electronic component P having such a structure on a printed circuit board or the like, the bottom surface 47 where the concave portion 45 is exposed on the opposite side is arranged on the mounting surface. The bottom surface 47 is a mounting surface for mounting. If solder is supplied to and melted in the space formed by the mounting surface and the concave portion 45, the solder fills the space surrounded by the concave portion 45 and the mounting surface, and the electrode on the mounting surface and the exposed portion 13a of the conductive layer are separated from each other. Join. Solder may be formed in advance on the electrode on the mounting surface, and after the electronic component P is arranged, the solder may be re-melted and joined to the exposed conductor layer 13a. Joining by so-called solder reflow is also possible.

In the mounting method described above, the molten solder reliably enters the inside of the recess 45 due to its fluidity and wettability, and establishes connection between the electrode on the mounting surface and the exposed conductor layer 13a. It is possible to prevent the solder from protruding to the surface of the resin outer shell 44 outside the concave portion 45 and other portions of the mounting surface. Short-circuit defects and the like due to solder protrusion hardly occur. Since the connection can be made with a relatively small amount of solder just to fill the recess 45, there is no waste of solder. Exposed conductor layer 13a and electronic component body 20
Means that there is an interval corresponding to the turn of the electrode band 16,
During that time, the resin outer shell 42 is buried, so that the heat of the soldering operation is directly transmitted to the electronic component main body 20 and the performance of the electronic component main body 20 can be prevented from being impaired. [Test electrode] The embodiment shown in FIG.
Has an inspection electrode on its outer surface.

The basic structure and the manufacturing method are the same as those of the above-described embodiment, and the steps of the above-described embodiment shown in FIGS. As shown in FIG. 9A, the electrode strip 16 extending outside the resin shell 44 is formed.
Is cut at a position slightly away from the outer surface of the resin outer shell 44. Then, a portion of the electrode strip 1 extending outside the resin outer shell 44.
5 is bent inward from the root and arranged along the surface of the resin outer shell 44.

As shown in FIG. 9 (b), a pair of electrode bands projecting portions 15 are arranged on the upper surface of the rectangular parallelepiped electronic component P, and the conductor layer 13 is formed on the surface of the projecting portion 15. It is exposed. Since the conductor layer 13 is connected to the electrode portion 22 of the electronic component main body 20, the performance inspection of the electronic component main body 20, that is, the electronic component P can be performed by applying a test probe to the conductor layer 13. The overhang 15 functions as an inspection electrode. After the electronic component P is mounted, it can be used for inspection of the mounted wiring circuit.

The conductor layer 13 of the overhang 15 also functions as a heat radiating surface for radiating heat generated in the electronic component body 20 to the outside. Metals such as copper and gold constituting the conductor layer 13 have a higher thermal conductivity than the resin constituting the resin outer shells 42 and 44, so that the metal can be efficiently formed through the conductor layer 13 in contact with the electronic component body 20. Heat can be dissipated. [Step Structure] The embodiment shown in FIG. 10 has the same basic structure as the embodiment shown in FIG. 8, but has a slightly different appearance.

The resin outer shell 44 is formed only on the upper part without covering the lower part of the resin outer shell 42. Electronic components P
Has a double stepped rectangular parallelepiped shape having a large upper part and a small lower part. In other words, the concave portions 45 are continuously arranged not only on a part of the side surface but on the entire side surface. When the electronic component P having the above structure is mounted, the solder enters the space between the electrode on the mounting surface and the concave portion 45, and the exposed conductor layer 13a can be reliably connected. [Multi-electrode structure] The embodiment shown in FIG. 11 is provided with a large number of electrodes for external connection.

The basic structure is common to the embodiment shown in FIG. However, as the electronic component body 20, a thick semiconductor chip or the like having a plurality of pairs of electrode portions 22 on the opposing side surfaces is used. After bonding or folding the electrode strip 16 to each of the plurality of pairs of electrode portions 22, the whole is sealed with a resin outer shell 42 and a resin outer shell 44. The arrangement intervals of the electrode bands 16 in the electrode band supply material 10 are set in accordance with the arrangement intervals of the electrode portions 22 of the electronic component body 20.

In the manufactured electronic component P, a plurality of concave portions 45 are arranged on both side surfaces, and the exposed conductor layer 13a is exposed on the inner surface of each concave portion 45. When the electronic component P having such a structure is surface-mounted, even if a large number of connection points are arranged on the same side surface, solder enters each of the concave portions 45 to connect the exposed conductor layer 13a and the electrodes on the mounting surface. Since the connection can be made, it is possible to prevent a short circuit between the electrodes and a connection failure.

[0043]

According to the electronic component for surface mounting of the present invention, the main body of the electronic component is covered with the resin outer shell, so that the physical and electrical protection can be reliably achieved. Since the electrode layer connected to the electrode portion of the electronic component body is turned back to expose the conductor layer on the surface of the resin outer shell, connection to an external wiring circuit is facilitated.

In particular, since the exposed portion of the conductor layer is present on the inner surface of the recess provided in the resin outer shell, when the solder is connected to an external wiring circuit, the solder surely enters the inside of the recess and the conductor layer is exposed. The exposed portion and the electrode of the external circuit can be firmly joined. This prevents solder from adhering to unnecessary or inconvenient locations. In the method for manufacturing a surface-mount electronic component of the present invention, an electrode band supply material having an electrode band is joined to an electrode portion of the electronic component body, and a resin outer shell that covers the outer periphery of the electronic component body in a state where the electrode band is folded back. The surface-mounting electronic component having the specific structure described above can be obtained only by molding, so that the electronic component having the above-described excellent functions can be obtained easily and reliably.

In particular, since a large number of electrode strips can be continuously connected to the electronic component main body, folded back, and resin-molded while the electrode strip supply member is connected to the electrode strip supply material, it can be used for mechanization and automation of the manufacturing process. Is also a suitable method.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention, and is a plan view (a) and an enlarged sectional view (b) of an electrode band supply material.

FIG. 2 is a cross-sectional view illustrating an initial stage in a manufacturing process.
(a) and side view (b)

FIG. 3 is a sectional view showing the next stage.

FIG. 4 is a sectional view showing the next stage.

FIG. 5 is a sectional view showing the next stage.

FIG. 6 is a sectional view showing the next stage.

FIG. 7 is a sectional view showing the next stage.

FIG. 8 is a sectional view (a) and a perspective view (b) of the manufactured electronic component.

FIG. 9 is a sectional view (a) and a perspective view (b) of an electronic component showing another embodiment.

FIG. 10 is a perspective view of an electronic component representing another embodiment.

FIG. 11 is a perspective view of an electronic component representing another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electrode band supply material 11 Insulating film 12 Side band 13 Conductive layer 13a Exposed part 15 Overhang part 16 Electrode band 20 Electronic component main body 30, 31, 34, 35 Mold 42, 44 Resin shell 45 Depression 47 Bottom

Continuation of the front page F term (reference) 5F067 AA03 AA13 AA15 AA16 AB04 AB10 BB18 BB19 BC12 BC15 BE10 CC03 CC08 CD02 CD07 CD10 DA05 DB01 DC17 DE04 DF20 EA04

Claims (5)

[Claims] An electronic component main body having an electrode portion on an outer surface thereof, and a flexible insulating film having a conductor layer on a surface thereof, wherein the conductor layer is joined to an electrode portion of the electronic component main body at one end, and the other end thereof In the above, an electrode band formed by folding the conductor layer so as to face outward, and a resin outer shell having a recess in which the electronic component body and the electrode band are sealed, and the conductor layer facing outward in the electrode band is exposed to the inner surface. And a surface-mounting electronic component comprising: 2. The electronic component for surface mounting according to claim 1, wherein an end on one end side of the electrode strip is disposed so as to be exposed along the outer surface of the resin outer shell with the conductive layer facing outward. 3. The surface mounting electronic device according to claim 1, wherein the electronic component body has a plurality of electrode portions on two opposing surfaces, and the electrode band is connected to each of the electrode portions. parts. 4. The method of manufacturing an electronic component for surface mounting according to claim 1, wherein a conductive layer is disposed on a surface of the flexible insulating film, and a large number of electrode strips are disposed at intervals. Preparing an electrode band supply material having a pair of side bands connecting both ends of each of the electrode bands.
(a), an electrode band supply material is disposed on each of two opposing surfaces of the electronic component main body, and a conductor layer of the electrode band included in the electrode band supply material is provided for each electrode portion on each surface of the electronic component main body. (B), separating one end of the electrode band from the side band of the electrode band supply material outside the bonding portion to the electronic component body, and (c) separating the side band of the electrode band. Step (d) of folding back the other end not separated so that the conductor layer faces outward together with the side band
The electronic component body and a part of the electrode band are mounted on a molding die having a mold part with which a part of the conductor layer facing the outside contacts, and the remaining part of the electrode band and the electrode band are continuously provided. A step (e) of supplying a resin to the molding die to form a resin outer shell with the side band of the electrode band supply material arranged outside the molding die; and an electrode enclosed in the molded resin outer shell. (F) separating the band from an electrode band supply material existing outside the resin outer shell. 5. The method according to claim 5, wherein the step (f) comprises separating the electrode band enclosed in the resin shell from the electrode band supply material with a part of the electrode band protruding outside the resin shell. (1) and a step (f-2) of folding and arranging a part of the electrode band protruding outside the resin outer shell on the outer surface of the resin outer shell with the conductor layer facing outward. A method for manufacturing the electronic component for surface mounting according to the above.