JP2000331921A - Aligner, aligner system, and manufacture of device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To discriminate abnormal values due to the faults of the measurement means of an aligner from the those caused by external factors, when its measurement means for atmospheric pressure, etc., indicate abnormal values, by referring the abnormal- operation preventing means of the exposure apparatus to the measured results of a measurement object in other exposure apparatuses too, and by preventing the expo sure apparatus from operating in an abnormal state. SOLUTION: By checking the fluctuating amounts of atmospheric pressures measured in a short term, barometers 19A, 19B are so set as to deem them as being abnormal, when they exceed a fixed value. That is, when deciding this abnormality, by using the difference between the measured values by the two barometers 19A, 19B in a projective exposure apparatus and using the difference between the atmospheric pressure values measured in the present time and in the last time, whether the fluctuations of the measured values of the atmospheric pressure are caused by the faults of the barometers 19A, 19B themselves or by external factors is decided. Then, when the faults of the barometers 19A, 19B themselves, by substituting the atmospheric pressure value of another exposure apparatus for the one of this exposure apparatus in a fixed term or temporarily, the corrections of its focal position and its magnification are performed to enable continuing of its processing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus that measures a predetermined object to be measured in an apparatus and prevents the apparatus from operating under abnormal conditions based on the measurement result. The present invention relates to an exposure apparatus system having the same and a device manufacturing method capable of using the same.

[0002]

2. Description of the Related Art In recent years, in response to demands for high integration of semiconductor devices such as ICs and LSIs, the high integration has been increasingly accelerated. Various improvements have been made to improve the resolution of a reduction type projection exposure apparatus (stepper) that forms a circuit pattern image of a mask (reticle) on a photosensitive substrate using a projection optical system and exposes the photosensitive substrate in a step-and-repeat manner. Has been made.

[0003] The optical performance (imaging magnification and imaging performance) of a projection optical system for reducing and projecting a pattern on a reticle surface onto a wafer surface varies variously due to environmental changes, for example, changes in atmospheric pressure. In a recent projection exposure apparatus requiring a high resolution, an error in optical performance caused by a change in atmospheric pressure is a serious problem, and it is important to correct the error in optical performance for projection. I have.

To solve this problem, Japanese Patent Laid-Open Publication No. 06-342 discloses
No. 755 discloses a table on which a semiconductor wafer is placed, an illumination optical system, a reticle having a desired transfer pattern, and a lens group including a plurality of lenses. A projection optical system that projects onto a surface, a magnification adjusting mechanism that adjusts the projection magnification of the transfer pattern onto the semiconductor wafer by moving the reticle or the lens on the reticle side of the projection optical system, and the projection optical system And a focus position adjusting mechanism for adjusting a focus position with respect to the semiconductor wafer, wherein the method includes the steps of: detecting a change in atmospheric pressure or an atmospheric pressure of the reduced projection exposure apparatus; And the distance between the projection optical system and the table is relatively changed in accordance with the change in the atmospheric pressure or the environmental pressure. A second step of performing an operation of adjusting a focal position of the projection optical system with respect to the semiconductor wafer by the focal position adjusting mechanism to be adjusted independently of the operation of adjusting the projection magnification by the magnification adjusting mechanism; and the transfer of the reticle. And a third step of transferring a pattern onto the semiconductor wafer. A projection exposure method has been proposed.

In Japanese Patent Application Laid-Open No. 08-305034, a pattern of a first object is projected on a second object by a projection optical system.
An apparatus for projecting onto an object, an air pressure detecting means for detecting a change in air pressure related to the projection optical system, a wavelength changing means for changing a wavelength of light used for projecting a pattern of the first object, and the air pressure detecting means And a wavelength changing means for changing a wavelength of light used for projecting the pattern of the first object so as to correct a change in the relative refractive index of the glass material of the projection optical system due to the change in the atmospheric pressure. A characteristic projection exposure method has been proposed. With these methods, when projecting the pattern on the reticle surface onto the wafer surface by the projection optical system, the atmospheric pressure fluctuation in daily life and the fluctuation of the optical performance corresponding to the atmospheric pressure of the installation location can be appropriately set by a pressure measurement means or the like. By using the adjustment mechanism, it is possible to achieve a projection exposure apparatus capable of easily obtaining a high optical performance by making a good correction and a method of manufacturing a device using the same.

[0006]

However, the barometric pressure measuring means for providing information which is the basis for determining the correction amount,
It is rare that a malfunction occurs and an abnormal value is measured due to factors such as electrical noise. Noticing that, if the projection exposure apparatus corrects the focal position and the projection magnification using the focus adjustment mechanism and the magnification adjustment mechanism based on the abnormal value measured by the atmospheric pressure measurement means, the pattern transferred to the semiconductor wafer However, there arises a problem that the device becomes defective. Also,
Since a semiconductor exposure apparatus is a very complicated and precise apparatus, when exposing a semiconductor, it is necessary to keep an environment such as temperature and humidity in the apparatus within a certain range in addition to the atmospheric pressure. Therefore, conventionally, when those environmental values are out of a certain range, it is determined that some abnormality has occurred in the device,
Environmental values such as atmospheric pressure and temperature may be affected by an environment outside the apparatus such as weather or a clean room environment, and even if an abnormal value is obtained, it is not necessarily a failure of the apparatus. In such a case, at present, it is difficult to determine whether the abnormality is caused by a change in the environment outside the apparatus.

In view of the above-mentioned problems of the prior art, an object of the present invention is to provide an exposure apparatus, an exposure apparatus system, and a device manufacturing method. When the measuring means indicates an abnormal value, it is possible to distinguish a case where the abnormal value is due to a failure of the measuring means, and further to distinguish a case where the other part of the apparatus is out of order. Second, even if the abnormal value is due to a failure of the measuring means, the device manufacturing can be continued without stopping the operation of the device.

[0008]

In order to achieve the above object, an exposure apparatus according to the present invention comprises a measuring means for measuring a predetermined object to be measured in the apparatus, and an apparatus which operates under abnormal conditions based on the measurement result. An exposure apparatus comprising: an abnormal operation preventing unit configured to prevent the apparatus from operating; wherein the abnormal operation preventing unit operates in an abnormal state of the apparatus with reference to a measurement result of another apparatus on the measurement target. It is characterized in that it prevents. In this configuration, when the measurement unit indicates an abnormal measurement value, the cause is determined by also referring to the measurement result in another device,
Based on this result, the continuation of the operation under the abnormal condition is prevented. Therefore, it is appropriately determined whether the abnormal value is caused by the device itself or a cause outside the device.
When the abnormal value is caused by an abnormality of the measuring means of the device, appropriate measures are taken, such as continuing the operation by using the measurement result of another device as a substitute value.

An exposure apparatus system according to the present invention comprises an exposure apparatus and a management apparatus for managing the exposure apparatus, which constitute a computer network. And a registering means for receiving and registering a measurement value of each exposure apparatus measured in response thereto. In this configuration, the measurement values acquired and registered by the management apparatus from each exposure apparatus are used in various forms. For example, when a measurement value of a predetermined measurement target in an exposure apparatus is abnormal, the latest registered measurement value is supplied to the exposure apparatus as a substitute value. Alternatively, based on the registered measurement values, it is accurately determined whether an abnormal measurement value of a predetermined measurement target in an exposure apparatus is caused by the apparatus.

[0010] Further, another exposure apparatus system of the present invention comprises:
An exposure apparatus system including an exposure apparatus and a management apparatus that manages the exposure apparatus, which configures a computer network, wherein the management apparatus includes a measurement unit that performs measurement on a predetermined measurement target, and measures a measurement result obtained by the measurement unit. , Transmitted to each of the exposure apparatuses via the network. In this configuration, for example, when a measurement value of a predetermined measurement target in an exposure apparatus is abnormal, the latest measurement value measured by the management apparatus is supplied to the exposure apparatus as a substitute value, whereby The exposure apparatus continues its operation.

Further, in the device manufacturing method of the present invention, a predetermined object to be measured in the exposure apparatus is measured, and the exposure apparatus is operated based on the measurement result while preventing the exposure apparatus from operating under abnormal conditions. In a device manufacturing method for manufacturing a device by performing exposure with an apparatus, an operation of the exposure apparatus in an abnormal state is prevented by also referring to a measurement result of another exposure apparatus or another apparatus for the measurement target. It is characterized by the following. Also in this configuration, similarly to the exposure apparatus of the present invention, it is appropriately determined whether the abnormal value is caused by the apparatus itself or a cause outside the apparatus, and when the abnormal value is caused by an abnormality of the measuring unit of the apparatus. In this case, appropriate measures are taken, such as continuing the operation using the measurement result of another device as a substitute value.

[0012]

In a preferred embodiment of the exposure apparatus according to the present invention, the other apparatus is a management apparatus which manages another exposure apparatus which forms a computer network or an exposure apparatus included in the network. The abnormal operation prevention unit refers to the latest measurement result of the measurement target acquired and held by the management device from the exposure device included in the network or by its own measurement unit. The measurement target includes the atmospheric pressure, and the abnormal operation preventing unit receives the latest measurement result of the atmospheric pressure from the management device, and corrects the projection magnification and the focal position at the time of exposure based on the supply. The measurement results supplied at that time take into account the machine differences between the exposure apparatuses included in the network. Abnormal operation prevention means, the measurement means is to measure the atmospheric pressure, when the measurement result of the atmospheric pressure is abnormal, and when the abnormality is due to the measurement means, as an alternative value of the abnormal measurement result, The measurement result is supplied. Also, a transmission unit for transmitting the measurement result of the measurement target to the management device,
This transmission means transmits the measurement result including the device number and the measurement date and time. The measurement target includes, besides the atmospheric pressure, temperature or humidity, or a vacuum pressure for adsorbing and holding the substrate to be exposed during exposure.

Further, the abnormal operation preventing means includes an abnormality detecting means for detecting an abnormality based on a measurement result by the measuring means. The abnormality detecting means determines that one of the measuring means is abnormal when the difference between the measured values of the two measuring means for measuring the same type of measurement object exceeds a predetermined range. Further, when the difference between the current measurement result by these measurement means and the previous measurement result performed a predetermined time before exceeds a predetermined range, it is determined that those measurement means are abnormal. When the abnormality detecting means detects the abnormality, the abnormal operation preventing means outputs or displays a warning or error to that effect.

Alternatively, the abnormality detecting means detects the abnormality based on a measurement result of the measuring object by the measuring means and a measurement result of the same measuring object in another same type of exposure apparatus on a computer network to which the apparatus belongs. Perform The same type of exposure apparatus is installed in the same clean room, and the abnormality detection unit controls the measurement result by the measurement unit in the apparatus and the same type of measurement target in another same type of exposure apparatus, or further controls the environment of the clean room. When the measurement result of the same type of measurement object in the environmental control device that indicates the same type of abnormal change also indicates an abnormal change outside the device, and only the measurement result by the measurement means in the device indicates an abnormal change. Is determined to be abnormal inside the apparatus. The abnormality detection means is
When it is determined that there is an abnormality inside the device,
If the results of measurements by a plurality of measuring means on different measuring objects which are related to each other in the apparatus also show abnormal changes, the part in the apparatus to which the measuring means relates is abnormal and one When only the measurement result by the measuring means indicates an abnormal change, it is determined that the measuring means is abnormal.

In a preferred embodiment of the exposure apparatus system according to the present invention, the management apparatus has means for calculating a machine difference of a measured value between the projection exposure apparatuses based on a registered measured value of each exposure apparatus. When the management apparatus receives an inquiry about the latest measurement value for the measurement target from each exposure apparatus, the management apparatus responds to the inquiry by exposing the latest measurement value registered by the registration unit to the exposure value. Send to device. At this time, the latest measurement value is extracted based on the information on the measurement date and time registered in association with the measurement value. Then, a measured value obtained by taking into account the machine difference between the respective exposure apparatuses obtained from the registered measured value is transmitted. In a preferred embodiment of another exposure apparatus system according to the present invention, the management apparatus is configured to control the exposure apparatus when each of the exposure apparatuses inquires about the measurement result of the measurement target, or to always perform the , The measurement result is transmitted, and it is possible to set which of these methods is to be used for transmission.

[0016]

[Embodiment 1] FIG. 1 is a schematic view of a main part of a projection exposure apparatus according to a first embodiment of the present invention. In the figure, 1 is a reticle on which a circuit pattern is drawn, 2 is a reticle chuck that sucks and holds the reticle 1, 3 is a reticle driving device attached to the reticle chuck 2, 4 is a reticle stage that supports the reticle driving device 3, 5 Is a reduction type projection lens system (projection optical system), 6A and 6B are field lenses of a partial lens system constituting the projection lens system 5, and 7 is a single glass material constituting a part of the projection lens system 5. 8, a lens driving device for moving the field lens 6A in the direction of the optical axis AX of the projection lens system 5, 9 a wafer coated with a photosensitive agent such as a resist, 10
Denotes a wafer chuck that holds the wafer 9 by suction, 11 denotes a wafer driving device attached to the wafer chuck 10, 12 supports the wafer driving device 11, and the optical axis AX of the projection lens system 5.
Is a wafer stage that is movable in a plane orthogonal to.

The reticle driving device 3 and the wafer driving device 11 each comprise a piezoelectric element or the like, and the reticle chuck 2 is displaced in the optical axis AX direction of the projection lens system 5 by the reticle driving device 3 to move the reticle 1 in the optical axis AX direction. Then, the wafer chuck 10 is displaced in the optical axis AX direction of the projection lens system 5 by the wafer driving device 11 to move the wafer 9 in the optical axis AX direction. The lens driving device 8 moves the field lens 6A in the optical axis AX direction of the projection lens system 5 using air pressure, a piezoelectric element, or the like. As a specific structure of the lens driving device 8, the one disclosed in JP-A-62-32613 or the like can be applied.

The driving of the reticle chuck 2 by the reticle driving device 3 is performed based on a signal from a reticle driving control system 13. At this time, the position of the reticle 1 in the optical axis AX direction is detected by a reticle position detector 15. Also,
Similarly, the driving of the field lens 6A by the lens driving device 8 is performed based on a signal from the lens driving control system 16, and at this time, the position of the field lens 6A in the optical axis AX direction is detected by the lens position detector 17. The reticle position detector 15 and the lens position detector 17 can be composed of various position detectors such as an optical encoder.

The driving of the wafer chuck 10 by the wafer driving device 11 is performed based on a signal from the wafer driving control system 14. At this time, the position of the (surface of) the wafer 9 in the optical axis AX direction is detected by the focus detector 18. Is done. The focus detector 18 is composed of, for example, an air sensor or an optical sensor conventionally used in this type of projection exposure apparatus. Each signal from the reticle position detector 15, lens position detector 17, and focus position detector 18 is input to the microprocessor 23.

Pressure sensors (pressure measuring means) 19A and 19B, a temperature sensor 20 and a humidity sensor 21 are provided for detecting changes in atmospheric pressure, air temperature and temperature around the projection lens system 5. Lens temperature sensor 22 for detecting temperature changes due to light absorption of
Are provided, and these various sensors 19A, 19B,
Signals from 20 to 22 are also input to the microprocessor 23. Reticle drive control system 13, lens drive control system 1
6 and the wafer drive control system 14
3 is controlled. The components 13 to 17 constitute a part of the driving means.

An illumination system 24 illuminates the circuit pattern of the reticle 1 with uniform illuminance. The illumination system 24 has an oscillation wavelength λ
A KrF excimer laser that emits a laser beam of = 248.4 nm is provided as a light source for exposure. Lighting system 24
Is directed onto the wafer 9 through the reticle 1 and the projection lens system 5, and the circuit pattern image of the reticle 1 is reduced and projected on the wafer 9.

The illumination system 24 includes a laser light source 27 that emits a light beam whose oscillation wavelength is controlled by a wavelength selection element drive control system 32 to be described later. The light beam from the laser light source 27 is transmitted through a condenser lens 25 to a mirror 26. To uniformly illuminate the reticle 1 surface. Laser light source 27
Has a laser resonator 28 and a wavelength selection element 29. 30
Is a wavelength selection element driving device for driving the wavelength selection element 29,
31 is a wavelength selection element angle detector for detecting the angle of the wavelength selection element 29, 32 is a wavelength selection element drive control system for controlling the drive of the wavelength selection element 29, and each of these elements is one element of the wavelength variable means. Make up.

The microprocessor 23 has its memory 40
A calculation formula for calculating the relative refractive index change of air between the lens systems of the projection lens system 5 based on the average pressure measurement values of the two pressure sensors 19A and 19B is programmed therein. In the formula, the amount of change in the atmospheric pressure from a predetermined reference value is a variable. Then, in order to cope with fluctuations in atmospheric pressure, the atmospheric pressure is measured each time a wafer to be processed is carried into the projection exposure apparatus, and the projection exposure is performed by changing the projection exposure wavelength based on the measurement result. Thereby, the image performance of the projection optical system is always kept good against the atmospheric pressure fluctuation.

The memory 40 has two pressure sensors 19A.
And 19B are recorded, and the setting information of the threshold A for judging whether or not there is an abnormality based on the values obtained from these barometric pressure sensors, and at any time intervals, The setting information of the threshold value B for determining whether or not there is an abnormality based on the new and old pressure values measured by the pressure sensors, and the difference between the pressure sensors 19A and 19B are registered. The microprocessor 23 detects a pressure abnormality based on the information in the memory 40 and the pressure values measured by the pressure sensors 19A and 19B. In the case of an abnormality, a warning is issued by the alarm device 41.

FIG. 3 is a block diagram schematically showing an exposure apparatus system having a plurality of such projection exposure apparatuses 53. Each projection exposure device 53 is connected to a centralized management device 52 via a network 51, and is configured to be able to exchange data with both. Central management device 5
At the same time, the remote control 2 can cause each of the projection exposure apparatuses 53 to execute the atmospheric pressure measurement by a remote command instructing each of the projection exposure apparatuses 53 to measure the atmospheric pressure. Then, the central control device 52 receives the atmospheric pressure value measured by each projection exposure device 53 at the same time from each projection exposure device 53 and registers it in the memory 54 in the central control device 52. Further, the central management device 52 calculates in advance the difference between the barometers between the projection exposure apparatuses 53 based on the atmospheric pressure values of the respective projection exposure apparatuses 53 at the same time registered in the memory 54. Register with. When an inquiry about the latest atmospheric pressure value is received from each projection exposure apparatus 53,
A value obtained by adding the machine difference between the projection exposure devices 53 to the latest atmospheric pressure value is transmitted to the projection exposure device 53.

FIG. 2 is a flowchart showing the operation of the apparatus shown in FIG. In this apparatus, correction for atmospheric pressure fluctuation is performed at the time of loading a wafer, correcting a focus, or the like. Also, in consideration of the case where the apparatus is not in operation, the atmospheric pressure is periodically measured, and the result is registered in the memory 40.

As shown in FIG. 2, when a job is started (step S101), first, steps S102 to S1 are performed.
In step 04, the wafer is loaded and the focus is corrected, and the pressure is measured using the two barometers 19A and 19B when the wafer is loaded and the focus is corrected. However, the difference between the two units has been measured in advance,
It is stored in the memory 40 as an offset and managed.

Next, in step S105, the pressure values measured by the barometers 19A and 19B are compared,
It is determined whether or not the difference between the two measured values is equal to or greater than a threshold A set in the memory 40. If it is determined that the difference between the measured values is equal to or greater than the threshold value A, it is determined that one of the barometers is in an abnormal state, and the process proceeds to step S110. If it is determined that the difference between the measured values is not more than the threshold value A, step S106
Proceed to.

In step S106, the previous pressure value stored in the memory 40 is read, and the difference between the previous pressure value and the current pressure value measured in step S104 is equal to or greater than the threshold value B set in the apparatus. Is determined. The previous air pressure value is the latest value among values measured at the time of wafer loading or focus correction, or at fixed time intervals, for example, at 10 minute intervals. When it is determined that the difference between the previous and current barometric pressure values is equal to or greater than the threshold value B, it is determined that both the barometers 19A and 19B are in an abnormal state, and the process proceeds to step S110. If it is determined that the difference between the previous and current barometric pressure values is not greater than or equal to the threshold B, the currently measured barometric pressure value is determined to be normal, and the process proceeds to step S107.

In step S107, the current atmospheric pressure value, device number, and date and time are transmitted to the central management device 52 via the network 51. When the central management device 52 receives this, it registers it in the memory 54. Central management device 52
Always receives the latest atmospheric pressure value from each projection exposure apparatus 53 and records it in the memory 54.

Next, in step S108, the focus position and the projection magnification are corrected based on the atmospheric pressure value measured in step S104, and in step S109, the circuit pattern is exposed, and the job ends.

On the other hand, when the process proceeds to step S110,
Output an alarm. Next, in step S111, the central management device 52 is inquired of the latest atmospheric pressure value registered in the memory 54, and the value obtained by adding the machine difference between the projection exposure devices 53 to the latest atmospheric pressure value is concentrated. Received from the management device 52. Next, in step S112, the received pressure value replaces the pressure value measured in step S104, and the process proceeds to step S108. Therefore, in steps S108 and S109, the focus position and the projection magnification are corrected based on the replaced atmospheric pressure value, and the circuit pattern is exposed.

The reason why such processing is adopted is as follows. The atmospheric pressure fluctuates greatly in the long term, but does not fluctuate significantly in the short term. In addition, it can be assumed that the pressure fluctuation occurring in the clean room causes almost the same pressure fluctuation in each projection exposure apparatus in the clean room. However, if noise occurs in the projection exposure apparatus due to some trouble such as poor contact between the cable and connector, the barometer may pick up the noise and malfunction, resulting in a change of 1.5 hpa in a short time. Such a change can obviously be considered a malfunction.

Therefore, in this embodiment, the amount of fluctuation of the atmospheric pressure in a short period obtained by the measurement is checked, and when the amount of fluctuation becomes a certain value or more, the barometers 19A and 19B are regarded as abnormal. I have. That is, when judging an abnormality, two barometers 19A and 1 in the projection exposure apparatus are used.
By using the difference between the measured values by 9B and the difference between the present and previous measured values, it is determined whether the fluctuation of the measured value of the atmospheric pressure is due to a failure of the meter itself or an external factor. (Steps S105 and S10
6). This is useful for investigating the cause thereafter, and also plays a role as one information for shortening the time until recovery from the failure.

However, the barometers 19A and / or 19
Stopping the apparatus immediately when it is determined that B is abnormal and stopping the production leads to a decrease in productivity. As a result, production schedules may not be achieved. Therefore, in this embodiment, in order to avoid the stop of the apparatus, the pressure value of another exposure apparatus is substituted for a fixed period or temporarily (steps S111 and S112) to correct the focal position and the projection magnification. , The processing can be continued.

[Second Embodiment] In the first embodiment, the central control device 52 registers the pressure value from each projection exposure device 53, and calculates the difference between the projection exposure devices 53 to the latest pressure value. The added value is transmitted to the inquired semiconductor exposure apparatus 53. Instead, in the present embodiment, the barometric pressure sensor 55 is provided in the central management apparatus 52 in FIG.
The same atmospheric pressure value is transmitted to all the projection exposure apparatuses 53. Then, the barometric pressure value measured by the barometric pressure sensor 55 connected to the central management device 52 is
A means for selecting whether to always transmit to each projection exposure device 53 or to transmit the latest pressure value managed by the central control device 52 only when the pressure value of each projection exposure device 53 is abnormal, is provided. The pressure value is transmitted to each projection exposure device 53 according to the setting.

[Embodiment 3] FIG. 4 is a perspective view showing the appearance of a semiconductor exposure apparatus according to a third embodiment of the present invention. As shown in FIG. 1, the semiconductor exposure apparatus has a temperature control chamber 101 for controlling the environmental temperature of the apparatus main body, and an EWS having a CPU disposed therein for controlling the apparatus main body.
A main body 106, an EWS display device 102 for displaying predetermined information in the device, a monitor TV 105 for displaying image information obtained through an image pickup means in the device main body, and an operation panel 103 for performing predetermined input to the device. , An EWS keyboard 104 and the like. In the figure, 107 is an ON-OFF switch, 108 is an emergency stop switch, 109 is various switches, a mouse, etc., 110 is a LAN communication cable, 111
Is the exhaust duct of the heat generated from the console function, and 11
Reference numeral 2 denotes a chamber exhaust device. The semiconductor exposure apparatus main body is installed inside the chamber 101.

The EWS display 102 is of a thin flat type such as EL, plasma, liquid crystal, etc., is housed in the front of the chamber 101, and is connected to the EWS main body 106 by a LAN cable 110. Operation panel 10
3. A keyboard 104, a monitor TV 105, and the like are also installed on the front surface of the chamber 101 so that a console operation similar to the conventional console operation can be performed from the front surface of the chamber 101.

FIG. 5 is a diagram showing the internal structure of the apparatus shown in FIG. FIG. 1 shows a stepper as a semiconductor exposure apparatus. In the drawing, reference numeral 202 denotes a reticle, and 203, a wafer. When a light beam emitted from the light source device 204 illuminates the reticle 202 through the illumination optical system 205, the pattern on the reticle 202 is exposed by the Can be transferred to a layer. The reticle 202 is supported by a reticle stage 207 for holding and moving the reticle 202. Wafer 203
Is exposed while being vacuum-sucked by the wafer chuck 291. The wafer chuck 291 is mounted on the wafer stage 20.
9 allows movement in each axis direction. Above the reticle 202, a reticle optical system 281 for detecting the amount of displacement of the reticle is arranged. Above the wafer stage 209, an off-axis microscope 282 is arranged adjacent to the projection lens 206. Off-axis microscope 282
The main function is to detect the relative position between the internal reference mark and the alignment mark on the wafer 203.
A reticle library 220 and a wafer carrier elevator 230, which are peripheral devices, are arranged adjacent to the stepper body, and necessary reticles and wafers are transferred to the stepper body by the reticle transfer device 221 and the wafer transfer device 231.

The chamber 101 is mainly composed of an air conditioner room 210 for controlling the temperature of air, a filter box 213 for filtering fine foreign matters to form a uniform flow of clean air, and a booth 214 for shutting off the environment of the apparatus from the outside. Have been. In the chamber 101, the air conditioner room 210
The air whose temperature has been adjusted by the cooler 215 and the reheat heater 216 therein is supplied into the booth 214 by the blower 217 through the air filter g. This booth 2
The air supplied to 14 is taken into air conditioner room 210 again from return port ra, and circulates through chamber 101.
Normally, the chamber 101 is not strictly a complete circulation system. To maintain the inside of the booth 214 at a positive pressure at all times, about 10% of the amount of circulating air outside the booth 214 is supplied to the air conditioning room 210.
Is introduced through a blower from an outside air inlet oa provided in the air conditioner. In this way, the chamber 101 enables the environment temperature where the apparatus is placed to be kept constant and the air to be kept clean. The light source device 204 is provided with an intake port sa and an exhaust port ea in preparation for cooling of the ultra-high pressure mercury lamp and generation of toxic gas at the time of laser abnormality, and a part of the air in the booth 214 passes through the light source device 204 to be air-conditioned. The air is forcibly exhausted to factory equipment via a dedicated exhaust fan provided in the machine room 210. Further, a chemical adsorption filter cf for removing a chemical substance in the air is connected to the outside air inlet o of the air conditioner room 210.
a and the return port ra.

FIG. 6 is a block diagram showing an electric circuit configuration of the apparatus shown in FIG. In the figure, reference numeral 301 denotes a main body CPU that controls the entire apparatus, and is composed of a central processing unit such as a microcomputer or a minicomputer. 30
2 is a wafer stage driving device, 303 is an alignment detection system such as an off-axis microscope, 304 is a reticle stage driving device, 305 is an illumination system such as a light source device, 306 is a shutter driving device, 307 is a focus detection system, and 308 is Z drive. These devices are controlled by the main body CPU 301. Reference numeral 309 denotes a transfer system such as a reticle transfer device or a wafer transfer device; 310, an air pressure sensor; 311, a temperature sensor; and 312, a humidity sensor.

Reference numeral 300 denotes an auxiliary storage device 314, a display 317, a keyboard 316, and an external storage device 31.
5 is a console unit having
3 is for giving various commands and parameters relating to the operation of the exposure apparatus. That is, it is for exchanging information with the operator. The auxiliary storage device 314 is, for example, a hard disk, in which a database is constructed, and various parameters and management data thereof are recorded. External storage device 3
The FDD 15 may be an FDD (floppy disk drive) or a MOD (magneto-optical disk drive). Reference numeral 318 denotes a network interface which uses TCP / I as a protocol for communication.
A standard network protocol such as P is often used, but a commonly used protocol such as NetWare may be used. The programs and data are read from the external storage device 315 and stored in the medium, and are stored in the auxiliary storage device 314.

In this semiconductor exposure apparatus, environmental values such as atmospheric pressure, temperature and humidity in the apparatus must be kept constant in order to perform semiconductor exposure with high accuracy. However, these environmental values include changes in atmospheric pressure due to weather, room temperature in clean rooms,
It is easily affected by the environment outside the exposure apparatus such as a change in humidity.
Therefore, even if these environmental values in the exposure apparatus indicate abnormal values, whether the environment of the air conditioner or the like in the exposure apparatus is a failure of the control device or the measurement sensor such as the atmospheric pressure sensor 310, or the environment outside the exposure apparatus. Conventionally, it has been difficult to immediately determine whether a change has occurred.

Therefore, in this embodiment, as shown in FIG. 7, a plurality of semiconductor exposure apparatuses 404 of the same model installed in a clean room 401 are connected by a network communication network 402 via a network interface 318. The exposure apparatuses 404 check each other's environmental values such as atmospheric pressure, temperature, and humidity. If the environment values of all the exposure apparatuses 404 change in the same manner, it is determined that the change of the environment values is caused by the environment change outside the exposure apparatus 404, and the operator is notified of the abnormal environment outside the exposure apparatus 404. That a specific exposure apparatus 4
If the environmental value changes only in the exposure apparatus 4
It is determined that an abnormality has occurred in the exposure apparatus 404, and the operator is notified that an abnormality has occurred in the exposure apparatus 404. Also,
When a plurality of environmental values, such as atmospheric pressure, temperature, and humidity, in a certain exposure apparatus 404 indicate values different from those of another exposure apparatus 404, it is determined that an abnormality has occurred in the function of the chamber of the exposure apparatus 404, and the operator is notified. It notifies that an abnormality has occurred in the exposure device 404. The semiconductor exposure apparatus 40
4 is described with reference to FIGS.

FIG. 8 is a flowchart showing the operation of exposure apparatus 404 for performing such processing. As shown in the figure, when the process is started, in step 501, environmental values affected by environmental changes such as atmospheric pressure, temperature, and humidity are acquired from all the exposure apparatuses 404 of the same model on the network at regular intervals. Then, in step 502, it is determined whether or not the environmental values of all the exposure apparatuses have changed in the same manner. If it is determined that the environmental values of all the exposure apparatuses 404 have changed in the same manner, the process proceeds to step 5
Proceeding to 10, the operator is informed that the environment outside the exposure apparatus has changed or that there is a high possibility that the environment control equipment outside the exposure apparatus is abnormal, and the process ends.
For example, when the air pressure of all the exposure apparatuses 404 changes at the same rate, it is determined that the weather has changed, and when the temperature changes at the same rate, the clean room 401 is changed.
It is determined that there is a possibility that an abnormality has occurred in the environmental control of the server.

If it is determined in step 502 that the environmental values of all the exposure apparatuses have not changed in the same manner, the process proceeds to step 503, where it is determined whether there is an environmental value different from the other exposure apparatuses. judge. If it is determined that there is no environment value different from that of the other exposure apparatuses, the process proceeds to step 50.
Returning to step 1, if it is determined that there is a different environment value, the process proceeds to step 504. In step 504, it is determined whether other environmental values are different from those of the other exposure apparatuses. If the other environment values are also different, it is determined in step 505 that an abnormality has occurred in the environment control device in the exposure apparatus, and the flow advances to step 507. Otherwise, in step 506, it is determined that the sensor for measuring the environmental value is abnormal, and the process proceeds to step 507.

For example, if it is determined in step 503 that the temperature inside the exposure apparatus is an abnormal value, and if it is determined in step 504 that the humidity is also an abnormal value, the process proceeds to step 506 in which the chamber apparatus for controlling air conditioning is abnormal. When it is determined in step 504 that the humidity is normal, it is determined in step 506 that the temperature sensor is abnormal.

In step 507, it is determined whether or not the difference from the environmental value of another exposure apparatus is within a predetermined value. If the difference is within the predetermined value, the flow advances to step 508 to display a warning message. If not, an error message is displayed in step 509, and the process ends.

FIG. 9 is a flow chart showing a process for a vacuum pressure value for sucking a wafer. As shown in the figure, when the process is started, in step 601,
Vacuum pressures are acquired at regular intervals from all exposure apparatuses of the same model on the network, and in step 602, it is determined whether the vacuum pressures of all exposure apparatuses have changed in the same manner. If it has changed in the same manner, the process proceeds to step 610, where it is notified to the operator that there is a high possibility that an abnormality has occurred in the compressor controlling the vacuum pressure in the clean room, and the process ends.
If not, step 603
Then, it is determined whether or not the vacuum pressure in the exposure apparatus has a value different from that of another exposure apparatus. If the value does not indicate a different value, the process returns to step 601. If the value indicates a different value, it is determined in step 604 whether or not the vacuum piping pressure is different from that of another exposure apparatus. If they are different, it is determined in step 605 that an abnormality has occurred in the vacuum mechanism in the exposure apparatus, and the flow advances to step 607, and
If they are not different, it is determined in step 606 that the vacuum pressure measurement sensor is abnormal, and then step 60
Proceed to 7.

In step 607, it is determined whether or not the difference between the vacuum pressures of the other exposure apparatuses is equal to or less than a predetermined value. If the difference is not more than the predetermined value, a warning message is displayed in step 608 and the processing is terminated. If not, an error message is displayed in step 609, and the process ends.

<Embodiment of Device Manufacturing Method> Next, an embodiment of a device manufacturing method using the above-described exposure apparatus or exposure apparatus system will be described. FIG. 10 shows a micro device (a semiconductor chip such as an IC or an LSI, a liquid crystal panel,
2 shows a flow of manufacturing a CD, a thin-film magnetic head, a micromachine, and the like. In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 11 shows a detailed flow of the wafer process (step 4). Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a resist is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus or exposure method to align and print the circuit pattern of the mask on a plurality of shot areas of the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the production method of this embodiment, it is possible to produce a large-sized device, which was conventionally difficult to produce, at low cost.

[0053]

As described above, according to the present invention, the operation in an abnormal state is prevented by also referring to the measurement results of other devices, so that the measuring means shows abnormal measurement values. In this case, the cause can be accurately determined, and the continuation of the operation under the abnormal condition can be accurately prevented. For example, even when the atmospheric pressure measurement means indicates an abnormal value, whether the abnormal value is a failure of an environmental control device such as an air conditioner in the exposure apparatus or a measurement sensor such as a pressure sensor, or an environmental change outside the exposure apparatus. In addition to appropriately and promptly determining whether or not it is due to abnormal values, preventing erroneous correction due to abnormal values, using the latest atmospheric pressure value obtained from the management device etc. as a substitute, without stopping the device, processing Can continue.

Also, the latest measurement result can be supplied to each exposure apparatus by the management apparatus. If the measurement value of a predetermined measurement object in each exposure apparatus is abnormal, the value is registered as an alternative value. The latest measured value is supplied to the exposure apparatus, and device manufacturing can be continued without stopping the operation of the exposure apparatus.

[Brief description of the drawings]

FIG. 1 is a schematic view of a main part of a projection exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing the operation of the apparatus of FIG.

FIG. 3 is a block diagram schematically showing an exposure apparatus system including a plurality of the projection exposure apparatuses shown in FIG.

FIG. 4 is a perspective view showing an appearance of a semiconductor exposure apparatus according to a third embodiment of the present invention.

FIG. 5 is a diagram showing the internal structure of the device of FIG.

6 is a block diagram showing an electric circuit configuration of the device shown in FIG.

FIG. 7 is a block diagram schematically showing an exposure apparatus system including the apparatus shown in FIG.

8 is a flowchart showing an operation of the exposure apparatus in the system of FIG.

9 is a flowchart showing a process for a vacuum pressure value for sucking a wafer in the exposure apparatus in the system of FIG. 7;

FIG. 10 is a flowchart illustrating a device manufacturing method that can use the exposure apparatus of the present invention.

FIG. 11 is a detailed flowchart of a wafer process in FIG. 10;

[Explanation of symbols]

1: reticle, 2: reticle chuck, 3: reticle driving device, 4: reticle stage, 5: projection lens system, 6
A, 6B: field lens, 7: lens system, 8: lens driving device, 9: wafer, 10: wafer chuck, 1
1: wafer drive unit, 12: wafer stage, 13: reticle drive control system, 14: wafer drive control system, 15: reticle position detector, 16: lens drive control system, 17: lens position detector, 18: focus position Detector, 19
A, 19B: barometric pressure sensor, 20: temperature sensor, 21: humidity sensor, 22: lens temperature sensor, 23: microprocessor, 24: illumination system, 25: condenser lens, 2
6: mirror, 27: laser light source, 28: laser resonator,
29: wavelength selection element, 30: wavelength selection element driving device, 3
1: wavelength selection element angle detector, 32: wavelength selection element drive control system, 40: memory device, 41: alarm device, 5
1: network, 52: central control device, 53: projection exposure device, 54: memory device, 55: barometric pressure sensor, 30
0: console unit, 301: main CPU, 31
3: Console CPU, 317: Display, 31
0: barometric pressure sensor, 311: temperature sensor, 312: humidity sensor, 318: network interface, 40
1: clean room, 402: network communication network, 4
04: semiconductor exposure apparatus.

Claims (25)

[Claims] 1. An exposure apparatus comprising: a measuring unit for measuring a predetermined measurement target in an apparatus; and an abnormal operation preventing unit for preventing the apparatus from operating under an abnormal state based on the measurement result. An exposure apparatus, wherein the abnormal operation preventing means prevents operation of the apparatus in an abnormal state with reference to a measurement result of the apparatus to be measured in another apparatus. 2. The exposure apparatus according to claim 1, wherein the other apparatus is another management apparatus that manages another exposure apparatus that forms a computer network or an exposure apparatus included in the network. apparatus. 3. The abnormal operation prevention unit refers to the latest measurement result of the measurement target acquired and held by the management device from an exposure device included in the network or by its own measurement unit. The exposure apparatus according to claim 2, wherein the exposure apparatus is an apparatus. 4. The measurement target includes atmospheric pressure, and the abnormal operation preventing means receives supply of the latest measurement result of the atmospheric pressure from the management device, and based on the supply of a projection magnification and a focus position at the time of exposure. The exposure apparatus according to claim 3, wherein the exposure apparatus performs correction. 5. The exposure apparatus according to claim 4, wherein the measurement result received includes a difference between exposure apparatuses included in the network. 6. The measuring means is for measuring atmospheric pressure, and the abnormal operation preventing means is provided when the measurement result of the atmospheric pressure by the measuring means is abnormal and the abnormality is due to the measuring means. 6. The exposure apparatus according to claim 4, wherein the apparatus receives the measurement result as an alternative. 7. The exposure apparatus according to claim 2, further comprising a transmission unit configured to transmit a measurement result of the measurement target to the management device. 8. The exposure apparatus according to claim 7, wherein the transmission unit transmits the measurement result including a device number and a measurement date and time. 9. The apparatus according to claim 1, wherein the measurement object includes an atmospheric pressure, a temperature, or a humidity, or a vacuum pressure for adsorbing and holding the substrate to be exposed at the time of exposure.
The exposure apparatus according to any one of claims 1 to 8, wherein 10. The apparatus according to claim 1, wherein said abnormal operation preventing means includes an abnormality detecting means for detecting an abnormality based on a measurement result by said measuring means.
Exposure apparatus according to Item. 11. The measuring means is two measuring means for measuring the same kind of measuring object, and the abnormality detecting means measures the difference when a difference between the measured values by these measuring means exceeds a predetermined range. 11. The method according to claim 10, wherein one of the means is determined to be abnormal.
3. The exposure apparatus according to claim 1. 12. The abnormality detecting means, when the difference between the current measurement result by the measurement means and the previous measurement result performed a predetermined time ago exceeds a predetermined range, determines that the measurement means is abnormal. 12. The exposure apparatus according to claim 10, wherein the exposure apparatus determines that there is an exposure. 13. The abnormal operation preventing means according to claim 10, wherein when the abnormality detecting means detects an abnormality, a warning or error is output or displayed to that effect. The exposure apparatus according to claim 1. 14. The measurement result of the measurement object by the measurement means, and the measurement result of the same measurement object in another exposure apparatus of the same type on a computer network to which the apparatus belongs. The exposure apparatus according to any one of claims 10 to 13, wherein the abnormality is detected on the basis of: 15. The exposure apparatus of the same type is installed in the same clean room, and the abnormality detection unit is configured to determine a measurement result of the measurement unit in the apparatus and a measurement target of the same type in the exposure apparatus of the same type, or When the measurement result of the same type of measurement target in the environment control device that controls the environment of the clean room similarly shows an abnormal change, it is an abnormality outside the device, and only the measurement result by the measurement unit in the device is abnormal. 15. The exposure apparatus according to claim 14, wherein when an unusual change is detected, it is determined that the abnormality is inside the apparatus. 16. The abnormality detecting means, when judging that the abnormality is inside the apparatus, causes the measurement results of a plurality of the measuring means related to different measurement targets related to each other in the apparatus to be similarly abnormal. Indicates that the part in the apparatus related to those measuring means is abnormal, and when only the measurement result by one measuring means indicates an abnormal change, it is determined that the measuring means is abnormal. 16. The exposure apparatus according to claim 15, wherein the determination is performed. 17. An exposure apparatus system comprising an exposure apparatus and a management apparatus for managing the same, which constitutes a computer network, wherein the management apparatus instructs each exposure apparatus to perform measurement on a predetermined measurement target. An exposure apparatus system comprising: an instructing unit for performing the registration, and a registration unit for receiving and registering the measured value of each exposure apparatus measured in accordance with the instruction. 18. The exposure apparatus according to claim 17, wherein said management apparatus has means for calculating a machine difference of a measurement value between each projection exposure apparatus based on a registered measurement value of each exposure apparatus. system. 19. When the management apparatus receives an inquiry about the latest measurement value for the measurement object from each of the exposure apparatuses, the management apparatus responds to the inquiry from among the measurement values registered by the registration unit. 19. The exposure apparatus system according to claim 17, wherein the latest one is transmitted to the exposure apparatus. 20. The management device according to claim 1, wherein the management device extracts the latest measurement value based on information on a measurement date and time registered in association with the measurement value.
10. The exposure apparatus system according to 9. 21. When transmitting the measured value, the management device transmits a measured value obtained from the registered measured value and taking into account machine differences between the respective exposure apparatuses. 21. The exposure apparatus system according to claim 19, wherein: 22. An exposure apparatus system comprising an exposure apparatus and a management apparatus for managing the same, which constitutes a computer network, wherein the management apparatus includes a measuring unit for performing measurement on a predetermined measurement object, and An exposure apparatus system for transmitting a measurement result by the means to each exposure apparatus via the network. 23. The management apparatus transmits the measurement result to each of the exposure apparatuses when each of the exposure apparatuses inquires about the measurement result of the measurement object, or always transmits the measurement results to each of the exposure apparatuses. 23. The exposure apparatus system according to claim 22, wherein the transmission is performed by using any one of these methods. 24. The exposure apparatus according to claim 1, wherein the exposure apparatus is one of the exposure apparatuses according to claim 1.
24. The exposure apparatus system according to any one of 23. 25. A device which measures a predetermined measurement object in an exposure apparatus and performs exposure by the exposure apparatus based on the measurement result while preventing the exposure apparatus from operating under abnormal conditions. A device manufacturing method for manufacturing a device, wherein an operation of the exposure apparatus in an abnormal state is prevented by also referring to a measurement result of another exposure apparatus or another apparatus for the measurement object. .