JP2000321339A - Semiconductor element failure analyzer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor element failure analyzer using an EMS capable of freely moving between various kinds of measurement devices such as a semiconductor tester and allowing easy direct connection with the measurement devices having various shapes. SOLUTION: In this analyzer, an EMS 1 is directly mounted on a base stand 2 having casters 10, and height adjustment mechanisms 2a and width adjustment mechanisms 2b in an area allowing setting of a measurement device 3. Light shielding necessary for use of the EMS 1 is realized by shielding only between an optical object lens 9 and a semiconductor element socket 4 storing an analyzed object (a semiconductor element) at least requiring a light shield state. The semiconductor element socket 4 is fixed on the base stand 2 through a fixing/shielding plate 6 and a fixing plate 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device failure analysis apparatus used for failure analysis of a semiconductor device.

[0002]

2. Description of the Related Art FIG. 5 is a schematic block diagram showing a semiconductor device failure analyzer using a conventional emission microscope (hereinafter referred to as an EMS). In the figure, 1 is an EMS, 3 is a measuring device such as a semiconductor tester, 4 is a semiconductor element socket for accommodating a semiconductor element to be analyzed, 8 is a measuring board connected to the measuring device 3,
9 is an optical objective lens provided in the EMS1, and 17 is E
A manipulator section for supporting the MS1 in a movable state;
Numeral 11 denotes a floor on which the manipulator 17 and the measuring device 3 are installed, numeral 18 denotes a balancer mounted on the manipulator 17, and numeral 19 denotes a dark room in which the EMS 1 is installed. .

A conventional semiconductor device failure analyzer using EMS1 includes an EMS1 installed in a dark room 19 and a manipulator section 17 for supporting the EMS1 movably in the X-axis, Y-axis and Z-axis directions. In addition, below the EMS 1, there is a structure in which various measuring devices 3 such as a semiconductor tester can be arbitrarily installed. In such a semiconductor device failure analysis device using the EMS1, the location of the failure leakage current of the semiconductor device is specified by observing the hot electron phenomenon in the pinch-off region of the MOS transistor and detecting the weak light emission generated at this time as a light emission image. At the same time, a pattern in the semiconductor element is detected as a reflection image, and a fault leakage current portion is specified by image synthesis. In the light emission observation, photon counting is performed for an arbitrary time from the start of observation, and steady weak light emission is detected. In this case, the operating state of the semiconductor element is set in the measuring device 3 such as a semiconductor tester to reproduce a state in which a fault leakage current is occurring.

At present, various types of semiconductor devices are used, and each semiconductor device is generally inspected by a dedicated measuring device. Therefore, the above-described analysis using EMS is performed on various semiconductor devices. To do so, the analyzer must be connected to various types of measuring devices. In addition, when performing the above analysis in a semiconductor mass production factory or the like that owns and inspects various types of measuring devices, the semiconductor element and the semiconductor element socket that are the objects to be analyzed are connected to a measuring unit connected via a measuring board or the like. Since the analyzer is connected to a measuring device having a different shape, it is necessary that the analyzer can move freely and can be easily connected to various measuring devices.

[0005]

The conventional semiconductor device failure analyzer using EMS is configured as described above, and the EMS1 is controlled by the manipulator 17 shown in FIG.
In the method of supporting EM, the total weight of the analyzer is EM
Since the weight of the manipulator 17 and the additional weight of the balancer section 18 and the like are added to the weight of S1, the weight becomes considerable, and the movement between the measuring devices 3 becomes difficult, and the setup takes time and effort. there were. When the EMS 1 is used, it is indispensable to be in a light-shielded state. Therefore, a large dark room 19 (dark box) is required, and the analysis device becomes large in size. Since the area occupied by the measuring device 3 installed in the device 19 is limited, there is a problem that the size of the measuring device 3 that can be connected is also limited. Further, since the EMS 1 has an optical system part, it must be consistent with the object to be observed as in a general microscope, and the EMS 1 is affected by vibrations from the apparatus itself and peripheral parts and vibrations of the cooling fan of the measuring apparatus 3 and the like. In addition, there has been a problem that a shift occurs in a light emission image due to a light emission phenomenon of the observed object and a reflection image of the semiconductor element pattern, and it is not possible to accurately identify a failed portion.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. In a semiconductor device failure analysis device using EMS, various types of measurement devices such as semiconductor testers can be freely moved. It is an object of the present invention to provide a semiconductor device failure analysis device which can be connected to measurement devices of various shapes easily and directly.

[0007]

A semiconductor device failure analyzer according to the present invention includes an emission microscope as an optical system analyzer, an emission microscope mounted and supported above, and an object to be analyzed below the emission microscope. Base having a structure for installing a measurement device connected to the base via a measurement substrate, a vibration isolation mechanism provided on the base, and a light shielding mechanism for shielding light only between the objective lens of the emission microscope and the object to be analyzed. It is provided with. Further, the base mount is provided with casters for movement. In addition, the base mount is provided with a height and width adjustment mechanism in a region where the measuring device is installed.

The objective lens and the object to be analyzed of the emission microscope are fixed by fixing the object to be analyzed to a base frame via a fixing plate. Further, the objective lens and the object to be analyzed of the emission microscope are fixed by fixing a measurement substrate on which the object to be analyzed is mounted to a base frame via a fixing plate. The electrical connection between the measurement board and the measurement device is made via an internal cable of the measurement device.

An emission microscope, which is an optical system analysis device, a measurement device connected to an object to be analyzed via a measurement substrate, and an opening only in an analysis object mounting portion provided on the measurement substrate. An adapter jig, a holder for holding the emission microscope mounted and supported on the measurement substrate via the measurement substrate and the adapter jig, and a light shielding mechanism for shielding light only between the objective lens of the emission microscope and the object to be analyzed. And a vibration isolation mechanism for improving the matching between the objective lens of the emission microscope and the object to be analyzed.
The adapter jig protects the mounting surface of the measurement board and is made of a material having an insulating property, a light shielding property, and a vibration absorbing property. Further, the adapter jig can be shared by a plurality of measuring devices. In addition, by configuring the fixing plate for fixing the objective lens and the analyte of the emission microscope using a material having a light shielding function,
The fixed plate is used as a light shielding mechanism between the objective lens of the emission microscope and the object to be analyzed. In addition, the light shielding mechanism between the objective lens of the emission microscope and the analyte is
This is a dark curtain provided between the objective lens of the emission microscope and the object to be analyzed.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, a semiconductor device failure analysis apparatus using EMS according to an embodiment of the present invention will be described with reference to the drawings. 1 is a schematic configuration diagram showing a semiconductor device failure analysis device using EMS according to a first embodiment of the present invention, (a) is a front view, (b) is a top view,
(C) has shown the side view, respectively. In the figure, 1
EMS, 2 is a base mount that supports the EMS 1 mounted thereon, and a height adjustment mechanism 2a by extension and contraction of both legs.
And a width adjusting mechanism 2b by the expansion and contraction operation of the gantry upper plate portion. Reference numeral 3 denotes a measuring device such as a semiconductor tester, 4 denotes a semiconductor element socket for accommodating a semiconductor element to be analyzed, and 5 denotes an anti-vibration mechanism provided on the base mount 2.
This is a mechanism for preventing the vibration from the floor 11 on which is installed to be transmitted to the EMS 1. Reference numeral 6 denotes a fixed / light-shielding plate which is mounted on the semiconductor element socket 4 and fixes the semiconductor element socket 4 and has a light-shielding function. Reference numeral 7 denotes a fixed / light-shielding plate 6 fixed to the base frame 2 and a fixed / light-shielding plate 6 and a base. A fixing plate serving as a light shielding means between the gantry 2; 8, a measuring substrate connected to the measuring device 3; 9, an optical objective lens provided in the EMS 1; 10; a caster provided for moving the base gantry 2; Reference numeral 11 denotes a floor on which the base frame 2 is installed.

In the semiconductor device failure analyzer according to the present embodiment, the base gantry 2 supporting the EMS 1 has the height adjusting mechanism 2a and the width adjusting mechanism 2b.
Measuring devices 3 of various shapes and sizes can be installed below the EMS 1, that is, inside the base mount 2.
The X / Y / Z axis moving mechanism of the EMS 1 is built in the EMS 1 main body, and is configured to move the optical system objective lens 9. Further, the optical system objective lens 9 of the EMS 1 and the semiconductor element socket 4 containing the object to be analyzed are fixed and fixed.
The light shielding state is maintained by the light shielding plate 6 and the fixed plate 7. As a countermeasure against vibration, the semiconductor element socket 4 accommodating the object to be analyzed is fixed to the base gantry 2 via the fixing / light shielding plate 6 and the fixing plate 7, and the semiconductor element socket 4 between the optical system objective lens 9 of the EMS 1 and the semiconductor element socket 4. Improves consistency.

According to the present embodiment, since the EMS 1 is directly mounted and held on the base pedestal 2 having the casters 10, the movement between the measuring devices 3 is facilitated.
The base mount 2 includes a height adjustment mechanism 2a and a width adjustment mechanism 2b.
EMS1, the lower part of EMS1, namely, the base stand 2
The shape and size of the measuring device 3 installed inside the device are not limited. Light shielding, which is indispensable when using the EMS 1, has a structure in which light is shielded only between the semiconductor element socket 4 accommodating the object to be analyzed (semiconductor element) and the optical objective lens 9, the light shielding state of which is a minimum. A large dark room is not required, and the semiconductor device failure analyzer can be reduced in size and weight. Further, since the semiconductor element socket 4 accommodating the object to be analyzed is fixed to the base pedestal 2 via the fixing / shielding plate 6 and the fixed plate 7, the optical system objective lens 9 of the EMS 1 supported by the base pedestal 2 and The matching between the semiconductor element sockets 4 is improved, and a highly reliable emission image and reflection image can be obtained.

Embodiment 2 FIG. In the first embodiment, a fixing device for fixing the semiconductor element socket 4 to the base frame 2 is provided.
A light-shielding region was formed between the optical system objective lens 9 of the EMS 1 and the semiconductor element socket 4 containing the object to be analyzed by using the light-shielding plate 6 and the fixing plate 7, as shown in FIG.
The same effect as in the first embodiment can be obtained by providing the dark curtain 12 between the optical system objective lens 9 in S1 and the semiconductor element socket 4 containing the object to be analyzed.

Embodiment 3 In the first embodiment, the EMS
As a countermeasure against vibration for improving the matching between the optical system objective lens 9 and the semiconductor element socket 4, the semiconductor element socket 4 was fixed to the base base 2 via the fixing / light shielding plate 6 and the fixing plate 7. The end of the fixing plate 7 mounted on the base stand 2 is fixed and the semiconductor socket 4 is fixed via the light shielding plate 6.
May be connected directly to the device, or as shown in FIG.
Since the other end of the fixed plate 7 is directly connected to the measurement substrate 8 to be separated from the measurement device 3 and to be a measure against vibration,
The effects of the first embodiment or more can be obtained. In this configuration, the X / Y / Z axis moving mechanism of the EMS 1 may be realized by moving the fixed plate 7 instead of moving the optical system objective lens 9. Further, as a connecting means between the measuring board 8 and the measuring device 3, no new wiring is provided, and the existing interior wiring cable 13 of the measuring device 3 is used, so that the reproducibility of the failure phenomenon is not changed and the measuring device 3 is not changed. 3 can be absorbed by the distribution cable 13.

Embodiment 4 FIG. 4 is a schematic configuration diagram showing a semiconductor device failure analysis device using EMS according to a fourth embodiment of the present invention, where (a) is a front view, (b) is a top view,
(C) has shown the side view, respectively. In the figure, 1
Reference numeral 4 denotes a holding unit that holds the EMS 1, and is configured such that the center of gravity of the entire constituent device is at the center of the holding unit 14 when the EMS 1 is mounted. Reference numeral 15 denotes an adapter jig disposed between the holding unit 14 that supports the EMS 1 and the measurement substrate 8 on the measurement device 3 and is made of a material having insulation and vibration absorption such as rubber. 1 and 2 are denoted by the same reference numerals and description thereof is omitted.

The semiconductor device failure analysis apparatus according to the present embodiment is constructed by assembling parts such as the EMS 1 main body and the holding section 14 which are disassembled and transported on the measurement apparatus 3 and the measurement board 8. First, an adapter jig 15 having a shape exposing only the semiconductor element socket 4 is disposed on the measuring device 3 having the measuring substrate 8 connected to the upper surface. Next, the holding unit 14, the anti-vibration mechanism unit 5, and the EMS 1, which are transported in a disassembled state on the adapter jig 15.
By arranging the main body in order, the adapter jig 15 and the holding portion 14 are placed on the measuring device 3 having the measuring substrate 8 on the upper surface.
Thus, a semiconductor element failure analyzer having a structure in which the EMS 1 is directly mounted can be obtained.

In the present embodiment, a rubber material is used as the material of the adapter jig 15 disposed on the measurement substrate 8, but the protection of the mounting surface and the mounted components on the surface of the measurement substrate 8, insulation, and vibration Any material that can realize light absorption and light shielding of a light emitting element such as an LED included in a mounted component may be used. In addition, the adapter jig 15 can be provided as a dedicated product for each measuring device, or can be shared by a plurality of measuring devices 3 depending on the structure and members of the adapter jig 15. Can be connected to any kind of measuring device 3. Further, between the optical system objective lens 9 of the EMS 1 and the semiconductor element socket 4, a blackout curtain 1 is provided.
2, a light-shielding state is formed. Further, in the present embodiment, the vibration isolation mechanism 5 is disposed between the holding unit 14 and the EMS 1, but between the floor 11 and the measuring device 3, between the measuring device 3 and the adapter jig 15, and between the adapter jig 15 and the EMS 1. The same effect can be obtained by disposing between the and the holding portion 14.

According to the present embodiment, the semiconductor element failure analyzer is constructed by assembling parts such as the EMS1 main body and the holding unit 14 which are disassembled and transported.
The transport of the components between the measuring devices 3 is facilitated, and
By setting the center of gravity of the entire semiconductor device failure analysis apparatus at the center of the holding section 14, the holding section 14 can be made of a lightweight material such as an aluminum material. Setup is easy. Also,
Since the EMS 1 is mounted on the measuring device 8 via the holding unit 14, the space for installing the semiconductor element failure analyzer is not required, and the space can be saved. Further, by disposing the adapter jig 15 between the measuring device 3 having the measuring substrate 8 connected to the upper surface and the holding portion 14 supporting the EMS 1,
The EMS 1 can be connected to the measuring devices 3 having different shapes and sizes. Further, the adapter jig 15 can be shared between a plurality of measuring devices 3. Also, EMS
The light shielding, which is indispensable when the device is used, has a structure in which light is shielded only between the semiconductor element socket 4 and the optical system objective lens 9 which require a minimum light shielding state, thereby eliminating the need for a large dark room and reducing the size of the semiconductor element analyzer. , Can be reduced in weight.

[0019]

As described above, according to the present invention, the EM
By mounting and supporting S on a base frame having casters, movement between measurement devices becomes easy, and
Since the base mount having a structure in which a measuring device is installed has a height and width adjusting mechanism, the EMS can be connected to measuring devices of various shapes and sizes. Further, the EMS can be mounted and held on the measuring apparatus via an adapter jig, a holding section, a vibration isolating section, and the like for the purpose of protecting and insulating the mounting surface of the measuring board, thereby reducing the size of the apparatus. Further, the EM mounted on the measuring device
S, holding unit, vibration isolation mechanism, etc. are disassembled and transported,
The transfer of the components between the measuring devices is facilitated. Further, by arranging the adapter jig between the measuring device and the holding portion for holding the EMS, it is possible to connect the measuring device having different shapes and sizes to the EMS. Also, EMS
The shading, which is indispensable during use, is to be analyzed (semiconductor element)
By shielding light only between the optical system and the objective lens of the optical system, a large dark room is not necessary, and the semiconductor device failure analyzer can be reduced in size and size.
The weight can be reduced. In addition, by adopting a structure in which the object to be analyzed (semiconductor element) is fixed to a base mount supporting the EMS, the consistency between the optical system objective lens of the EMS and the object to be analyzed (semiconductor element) is improved, and the reliability is improved. High analysis can be performed.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a semiconductor device failure analysis device according to a first embodiment of the present invention.

FIG. 2 is a schematic configuration diagram showing a semiconductor element failure analysis device according to a second embodiment of the present invention.

FIG. 3 is a schematic configuration diagram showing a semiconductor element failure analysis device according to a third embodiment of the present invention.

FIG. 4 is a schematic configuration diagram showing a semiconductor device failure analysis device according to a fourth embodiment of the present invention.

FIG. 5 is a schematic configuration diagram showing a conventional semiconductor device failure analysis device of this type.

[Explanation of symbols]

1 EMS, 2 base stand, 2a height adjustment mechanism, 2
b Width adjustment mechanism, 3 measuring device, 4 semiconductor element socket, 5 anti-vibration mechanism, 6 fixed / light shield plate, 7 fixed plate,
8 Measurement board, 9 Optical objective lens, 10 Casters, 11 Floor surface, 12 Dark curtain, 13 Interior wiring cable, 14 Holder, 15 Adapter jig.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/66 H01L 21/66 T (72) Inventor Tamio Koga 2-3-2 Marunouchi 2-chome, Chiyoda-ku, Tokyo F term in Mitsubishi Electric Corporation (reference) 2G011 AA01 AC04 AE03 AF06 2G032 AA00 AD01 AD08 AF08 AK04 2H052 AD02 AF02 4M106 AA04 BA04 BA10 CA70 DB11 DB18 DB19 DB21 DB30 9A001 BB05 KK16 LL05

Claims (11)

[Claims] 1. An emission microscope, which is an optical system analysis device, and a measurement device, which is mounted above and supports the emission microscope and connected to an object to be analyzed via a measurement substrate below the emission microscope. A semiconductor device comprising: a base mount having a structure to perform the above, a vibration isolation mechanism provided in the base mount, and a light blocking mechanism for blocking light only between the objective lens of the emission microscope and the object to be analyzed. Failure analysis device. 2. The semiconductor device failure analysis apparatus according to claim 1, wherein the base frame is provided with a caster for movement. 3. The semiconductor device failure analysis apparatus according to claim 1, wherein the base mount is provided with a height and width adjustment mechanism in a region where the measurement device is installed. 4. The object according to claim 1, wherein the objective lens and the object to be analyzed of the emission microscope are fixed by fixing the object to be analyzed to a base mount via a fixing plate. A semiconductor device failure analysis apparatus according to claim 1. 5. The objective lens and the object to be analyzed of the emission microscope are fixed by fixing a measurement substrate on which the object to be analyzed is mounted to a base frame via a fixing plate. 4. The device for analyzing a failure of a semiconductor device according to claim 3. 6. The electrical connection between the measurement substrate and the measurement device,
6. The semiconductor device failure analysis device according to claim 5, wherein the measurement is performed via an internal cable of the measurement device. 7. An emission microscope, which is an optical system analysis device, a measurement device connected to the object to be analyzed via a measurement substrate, and an opening only in the object mounting portion provided on the measurement substrate. An adapter jig having: a holding unit for holding the emission microscope mounted and supported on the measurement substrate via the measurement substrate and the adapter jig; and only between the objective lens of the emission microscope and the object to be analyzed. 1. A semiconductor device failure analysis apparatus comprising: a light shielding mechanism for shielding light from a light source; and a vibration isolation mechanism for improving the consistency between the objective lens of the emission microscope and the object to be analyzed. 8. The semiconductor element failure analysis apparatus according to claim 7, wherein the adapter jig is made of a material having an insulating property, a light shielding property, and a vibration absorbing property while protecting the mounting surface of the measurement board. . 9. The semiconductor element failure analysis device according to claim 8, wherein the adapter jig can be shared by a plurality of measurement devices. 10. A fixing plate for fixing an objective lens of an emission microscope and an object to be analyzed by using a material having a light-shielding function, whereby the fixing plate is provided between the objective lens of the emission microscope and the object to be analyzed. 5. The device according to claim 4, wherein the device is used as a light shielding mechanism. 11. The light shielding mechanism between an objective lens of an emission microscope and an object to be analyzed is a dark curtain provided between the objective lens of the emission microscope and the object to be analyzed. The semiconductor device failure analysis device according to any one of claims 1 to 4.