JP2000317835A - Flattening machining method and device for semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute dressing and brushing process by a single machine by mounting a dressing tool and a brushing tool on a common arm for oscillating the tools from the vicinity of center of rotation of a polishing surface of a grinding wheel surface to the vicinity of the outermost peripheral edge. SOLUTION: An arm 8 having a dressing tool 12 and a brushing tool 19 is disposed through a direct acting guide on an oscillating shaft 5. An annular brushing tool 9 is disposed to surround the dressing tool 12. In the dressing process, the dressing tool 12 is lowered to be in contact with the surface of a grinding wheel 29. By the oscillating shaft 5, the dressing tool is repeatedly oscillated from the vicinity of the center of the grinding wheel 29 to the vicinity of the outermost peripheral edge. Similarly, the brushing process can be executed in parallel. Compressed air is supplied to an air cylinder 27, and the dressing tool is repeatedly oscillated with the brushing tool 19 in contact with the surface of the grinding wheel 29.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing method and apparatus used in a process of manufacturing a semiconductor integrated circuit, and more particularly to a polishing method and apparatus for continuously achieving high-precision polishing.

[0002]

2. Description of the Related Art With miniaturization and high integration of semiconductor devices, it is necessary to increase the number of wiring layers in which wiring layers and insulating layers are stacked. In this case, unevenness is unavoidable on the surface of the semiconductor wafer, and when exposing and transferring a circuit pattern, the optical system having a small depth of focus cannot focus on the circuit pattern, resulting in poor resolution. As a solution to this, an insulating film is formed after the completion of the wiring process, and the insulating film is polished flat so that the above-described flattening process is performed to avoid exposure defects. From the above background, as one of the semiconductor device manufacturing processes, the development of precise planarization processing technology for semiconductor wafers is urgently required.

As a conventional flattening processing means, there is a chemical mechanical polishing method (CMP). In CMP, for example, a polishing pad made of a foamed urethane resin in the form of a thin sheet is attached to a platen and rotated, and a polishing liquid called a polishing slurry is supplied onto the polishing pad. The semiconductor wafer held by the wafer holder is pressed against the polishing pad to flatten the insulating film on the semiconductor wafer. This method is also called a loose abrasive processing method.

[0004] However, it has been pointed out that the CMP processing method has various development problems such as a flattening ability depending on a pattern dimension, a high cost of consumables, and a short life of a polishing pad.

[0005] As a technique for solving such a problem of the CMP processing method, a concept of flattening processing by a fixed abrasive polishing method using a grindstone is disclosed in W09710613. The flattening process using a grindstone is characterized by using a grindstone containing abrasive grains made of cerium oxide or the like instead of a polishing pad in CMP, in addition to being able to perform stable flattening regardless of pattern dimensions. Since it can be processed without using an expensive polishing slurry, effects such as low cost and excellent flattening ability as compared with CMP can be expected.

Japanese Patent Application No. 10-226873 discloses that in order to maintain this excellent flattening ability, dressing (grinding) of the grindstone surface and surface treatment means using ultrasonic waves instead of brushing or brushing are effective. Is described.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to enable a dressing and brushing process to be performed by a single machine in a fixed-abrasive polishing means using a grindstone so as to continuously exert a high flattening ability. Another object of the present invention is to provide a low-cost flattening method and apparatus excellent in maintainability.

[0008]

According to the present invention, in order to enable the dressing step and the brushing step to be performed simultaneously or selectively and independently, the dressing tool and the brushing tool are concentrically rotatable independently of each other. Driving means and the dressing tool and the brushing tool attached to a shaft and allowing the dressing tool and the brushing tool to independently contact the grinding surface of the grindstone surface, from the vicinity of the rotation center of the grinding surface of the grindstone surface to the vicinity of the outermost peripheral edge. It is characterized in that it is mounted on a common arm for swinging movement.

Further, in the apparatus of the present invention, the attachment and detachment of the dressing tool, which is a consumable part, can be performed by reversing a single screw, and similarly, the holding of the brush dressing tool, which is a consumable part, uses a permanent magnet. By using the magnetic attraction force, the desorption property is improved.

[0010]

FIG. 1 is a longitudinal sectional view of a flattening apparatus equipped with a dressing means and a brushing means according to a first embodiment of the present invention (both of these means are simply referred to as a dresser). FIG. 2 shows a plan view, and FIG. 2 shows a top view thereof. In the figure, 1 is a processing apparatus main body, 2 is a motor, 3 is a housing, 4 is a bearing of each part,
5 is a swing shaft, 6a and 6b are tapered plates, 7a and 7b are tapered plates, 8 is an arm, 9 is a motor, 10a is a feed screw, 1
0b is a nut, 11 is a linear guide, 12 is a dressing tool, 13 is a spindle rotating shaft, 14 is a housing, 15
Is a spherical seat, 16a and 16b are pulleys, 17 is a belt,
8 is a motor, 19 is a brushing tool, 22 is a pin, 2
3 is a housing, 24 is a motor, 25a and 25b are gears, 26 is a lever, 27 is an air cylinder, 28 is a hexagon socket head bolt, 29 is a grindstone, 30 is a housing, 31 is a motor, 32 is a surface plate, and 33 is a cover. Processing substrate (semiconductor wafer),
34 is a wafer polishing holder, 35 is a polishing arm, 36 is a holding member, 37 is a lid, and 38 is a brush rotating shaft.

Hereinafter, in this specification, members having the same reference numerals indicate members having equivalent functions. Note that the present invention relates to a dresser and does not refer to other equipment associated with a processing apparatus in detail.

A dresser is a feed screw 1 for cutting drive for cutting a dressing tool 12 into a grindstone 29 on a swing shaft 5 held via a rotatable bearing 4 with a processing apparatus main body 1.
0a, a feed screw nut 10b, a cutting drive motor 9, and a linear guide 11 (shown in FIG. 2).
1 and an arm 8 provided with a dressing tool 12 and a brushing tool 19 is provided.
Hereinafter, in this specification, the feed screw 10a for the cutting drive, the motor 9 for the cutting drive, and the linear motion guide 11 are collectively referred to as a cutting drive unit. A grindstone 29 having excellent flattening performance is bonded on the grindstone platen 32 and is connected to the processing apparatus main body 1 via a rotatable bearing 4.

The dressing tool 12 is connected to a spindle rotating shaft 13, and the spindle rotating shaft 13 is held by a housing 14 via a rotatable bearing 4.
The housing 14 is connected to the arm 8 via a spherical seat 15. Hereinafter, in the present specification, these are collectively referred to as a spindle unit. A pulley 16a is fixed to the other end of the spindle rotation shaft 13, and is connected via a belt 17 to a pulley 16b fixed to a motor 18 for rotating the spindle.

An annular brushing tool 19 is arranged at a position coaxial with the dressing tool 12 so as to surround the dressing tool 12.
9 is held on a housing 23 via a rotatable bearing 4, and the housing 23 is connected to a motor 24 for rotating the brushing tool 19 via gears 25a, 25b.
Hereinafter, in this specification, these members are collectively referred to as a brush portion.

The brushing tool 19 can move up and down with respect to the polishing surface of the grindstone 29 independently of the dressing tool 12. In this embodiment, the housing 23
One end of the lever 26 is connected to the other end of the air cylinder 27.
And via a rotatable bearing 4. Leverage 26
Is connected to an arm 8 via a rotatable bearing 4. The brushing tool 19 is driven up and down with the bearing 4 connected to the arm 8 as a fulcrum as the air cylinder 27 is driven up and down.

The dressing step employs the following procedure.
The cutting drive unit is driven while the grindstone 29 is being rotated by the motor 31, and the dressing tool 12 is moved to the grindstone 2.
9 Lower until it touches the surface. At this time, it is desirable that the dressing tool 12 is rotated by the motor 18. After the dressing tool 12 and the grindstone 29 come into contact,
The cutting drive unit is further driven to lower the dressing tool 12 by 1 μm so as to cut into the grindstone 29. In this state, the dressing tool is repeatedly rocked from the vicinity of the center of the grindstone 29 to the outermost peripheral edge by the rocking shaft 5, thereby completing the dressing (sharpening) process on the surface of the grindstone 29.

The brushing step can be performed in parallel with the same operation as the dressing step. Compressed air is supplied to the air cylinder 27 to make the rotatable bearing 4 perform a circular motion around the fulcrum, thereby bringing the brushing tool 19 into contact with the surface of the grindstone 29. By adjusting the pressure of the compressed air supplied to the air cylinder 27, the pressing force of the brushing tool 19 and the grindstone 29 can be controlled. At this time, it is desirable that the brushing tool 19 is rotated by the motor 24. In this state, the brushing tool 19 is
Is repeatedly rocked from the vicinity of the center of the grindstone 29 to the outermost peripheral edge, whereby the brushing step on the surface of the grindstone 29 is completed.

Processing of the semiconductor wafer 33 is performed in the following procedure. The semiconductor wafer 33 is suction-fixed to the lower surface of the wafer polishing holder 34 such that the processing surface faces downward. The wafer polishing holder 34 is connected to the polishing arm 35 and
The semiconductor wafer 33 is pressed against the grindstone 29 while the wafer 9 and the wafer polishing holder 34 are rotated with respect to each other. The above-described processing step of the semiconductor wafer 33 is performed after the above-mentioned dressing step and / or the brushing step or in parallel during the step.

As described above, the dressing tool 12
And the brushing tool 19 were held on the same arm 8,
A dressing condition and a brushing condition depending on the type of the grindstone 29 are provided by attaching to two independently rotatable concentric shafts so that the dressing process and the brushing process for the grindstone 29 can be simultaneously or independently selected and performed. Can be optimally controlled. From this, the surface of the grindstone 29 that has been activated stably can be constantly maintained. That is, a stable flattening ability can be exhibited. Dressing tool 1
By holding the brush 2 and the brushing tool 19 on the same arm 8, the size and cost of the processing apparatus can be reduced.

In the dressing step, the surface of the grindstone 29 is ground. The processed shape of the grindstone 29 after the grinding greatly affects the flattening of the semiconductor wafer 33. Therefore, it is essential to adjust the inclination of the dressing tool 12 with respect to the grindstone 29. The inclination of the center of rotation of the dressing tool 12 with respect to the grindstone 29 is such that the surface of the grindstone 29 after dressing has a Mt. Fuji shape.
It has been found that the surface has a mortar shape.

The second feature of the apparatus shown in the first embodiment is that the adjustment can be easily performed. That is, by mounting the cutting drive unit on the swinging shaft 5 and adjusting only the inclination of the swinging shaft 5, the surface state of the grinding stone 29 after dressing can be adjusted so as not to have the above-mentioned sliver-like shape.

On the other hand, in a configuration in which the swing shaft 5 is mounted on the cutting drive unit, which has been often used in the past,
It is necessary to adjust two points, that is, the inclination adjustment of the linear motion guide 11 and the inclination of the swing shaft 5. Naturally, the members holding them, for example, the housing 3 and the holding member 36, are also required to be processed with high precision.

According to the first embodiment of the present invention, the holding member 36 of the linear motion guide 11 and the housing 3 of the swing shaft 5 do not require high-precision machining, and the inclination of the housing 3 with respect to the grindstone 29 is not required. You only need to adjust it. The linear motion guide 11 is a whetstone 29
Even if the vertical movement is performed while tilting with respect to the angle, only the absolute cutting amount has an effect. This problem is caused by measuring the instruction value to the cutting motor 9 and the vertical amount of the dressing tool 12 in advance. Can be easily corrected.

As a means for adjusting the inclination of the oscillating shaft 5, a generally used shim, spherical seat or the like may be used, but in this embodiment, a pair of tapered plates 6a, 6b,
7a and 7b are shifted by 90 degrees from each other in the housing 3.
And the processing apparatus main body 1. One taper plate 6
a is coupled to the processing apparatus main body 1, and the other tapered plate 6b is rotatably arranged with another set of tapered plates 7a. The tapered plate 7a is rotatably disposed with respect to the other tapered plate 7b connected to the housing 3.

By rotating the tapered plate 6b with the tapered plates 7a and 7b fixed to the housing 3, the housing 3, ie, the swing shaft 5, is inclined in the roll direction by an amount corresponding to the rotation angle and the taper angle. After adjusting the inclination in the roll direction, the tapered plates 6a and 6b are fixed, and the other set of tapered plates 7a is rotated. As a result, the swing shaft 5 is inclined in the pitch direction. By performing the above operations, it is possible to adjust the pitch of the swing shaft 5 and the inclination of the roll with respect to the grindstone 29 so as to have a desired vertical accuracy, and furthermore, the coupling area between the housing 3 and the processing apparatus main body 1 is reduced. Since it can be widely taken, the rigidity of the joint can be improved.

The adjustment of the inclination of the dressing tool 12 will now be described.
The housing 14 is connected to the arm 8 via a spherical seat 15. The inclination of the dressing tool 12 can be adjusted by adjusting the spherical seat 15 so that desired vertical accuracy can be obtained with respect to the grindstone 29, similarly to the swing shaft 5. Therefore, the arm 8 does not require particularly high-precision processing. Here also the swing shaft 5
Although a tapered plate such as 6a and 6b may be used similarly to the above, the spherical seat 15 is employed in the present embodiment in order to reduce the weight of the spindle portion and to facilitate adjustment in a narrow place. Thereby, the pitch of the dressing tool 12 with respect to the grindstone 29 and the inclination of the roll can be adjusted.

As described above, by disposing the cutting drive unit between the swinging shaft 5 and the spindle unit, a high-precision component processing is not required, the rigidity is not impaired, and an inexpensive component configuration is achieved. Fine adjustment of the inclination of the dressing tool 12 with respect to the grindstone 29 can be easily realized.

FIG. 3 is a longitudinal sectional view of the spindle portion and the brush portion of the first embodiment shown in FIG.

The dressing tool 12 is a consumable item, and needs to be replaced at an appropriate time. In addition, the dressing tool 12 requires high rotational accuracy. Therefore, when an unreasonable external force is applied to the spindle rotating shaft 13 when the dressing tool 12 is attached or detached, the rotation accuracy is not reproduced, and as a result, the flatness of the surface of the grindstone 29 after the dressing is not obtained. .

In this embodiment, the replacement operation can be performed easily and easily. That is, the dressing tool 12 has a convex tapered shaft, and the spindle rotating shaft 13 on which the dressing tool 12 is mounted has a concave tapered hole that fits with the convex tapered shaft of the dressing tool 12. A threaded hole is provided in the end face of the convex tapered shaft of the dressing tool 12. The spindle rotating shaft 13 is held by a housing 14 via a rotatable bearing 4, and the housing 14 and the arm 8 are connected via the spherical seat 15 described above.

Inside the spindle rotating shaft 13, a hexagon socket head bolt 28 that fits into a screw hole provided on the convex tapered shaft of the dressing tool 12 is housed. It is characterized in that a hexagonal wrench (not shown) for rotating the hexagon socket head cap screw 28 is covered with a lid 37 having a hole large enough to be inserted.

The procedure for replacing the dressing tool 12 in this embodiment is as follows. While holding the side surface of the dressing tool 12 where the grindstone is not fixed, the hexagon socket head cap screw 28 is rotated in a loosening direction using a wrench (not shown). Because the dressing tool 12 is fitted with the taper of the dressing tool 12 and the spindle rotating shaft 13. The operation of just loosening the hexagon socket head cap screw 28 does not cause the spindle rotating shaft 13 to be detached. When the hexagon socket head cap screw 28 is further loosened, the screw head of the hexagon socket head cap bolt 28 will eventually interfere with the lid 37. When the operation of loosening the hexagon socket head bolt 28 is further continued from this state, the hexagon socket head bolt 28 generates a force in a direction in which the dressing tool 12 is separated from the spindle rotation shaft 13. Therefore, the dressing tool 12 falls freely by gravity and can be removed from the spindle rotating shaft 13.

Next, the procedure for mounting the dressing tool 12 on the spindle rotating shaft 13 is performed in the following procedure. The dressing tool 12 is inserted into the spindle rotating shaft 13. By rotating the above-mentioned hexagon socket head cap screw 28 in a tightening direction using a wrench (not shown), the dressing tool 12 is gradually pulled upward and fitted into the tapered hole of the spindle rotating shaft 13. Then, the mounting of the dressing tool 12 on the spindle rotating shaft 13 is completed.
Since the dressing tool 12 is always fastened to the spindle rotating shaft 13 with a hexagon socket head cap screw 28, the dressing tool 12 does not drop due to a failure such as an impact or poor fitting.

As described above, with a simple configuration in which the hexagon socket head cap screw 28 is sealed inside the spindle rotating shaft 13, an excessive external force can be applied by a single operation of a wrench (not shown). The dressing tool 12 can be easily attached and detached without applying a force to the dressing tool, and an accident in which the dressing tool 12 is dropped can be prevented beforehand. Therefore, a stable dressing process of the grindstone 29 can be performed even after the replacement of the dressing tool 12.

Since the brushing tool 19 is a consumable item and needs to be replaced promptly at an appropriate time, the brushing tool 19 must be configured to be easily detachable. In this embodiment, the magnetic attraction force using the permanent magnet 20 is used for coupling the brushing tool 19 and the brush rotating shaft 38 as shown in FIG.

The brush rotating shaft 38 of the brushing tool 19
The magnetic material 21 is attached to the coupling surface. In this embodiment, a martensitic stainless steel subjected to a rust prevention treatment is used. After removing the brushing tool 19, the magnetic material 21 is reused for a new brushing tool 19. On the other hand, the permanent magnet 20 is embedded in the brush rotating shaft 38.

In this embodiment, a plurality of inexpensive rod-shaped permanent magnets 20 are arranged on the circumference instead of expensive ring-shaped permanent magnets. Thus, a desired attractive force can be obtained by adjusting the number of the bar-shaped permanent magnets 20.

In the present embodiment, the pin 22 is pressed into the brush rotating shaft 38 to stop the rotation of the brushing tool 19, and the brushing tool 19 is provided with a pin hole into which the pin 22 is inserted. With this configuration, the attraction force of the permanent magnet 20 may be a force enough to hold the weight of the brushing tool 19, and there is no need to form a special magnetic circuit for increasing the magnetic attraction force.

When the brushing tool 19 is pressed against the grindstone 29, the rotational force of the brushing tool 19 caused by the friction between the brushing tool 19 and the grindstone 29 is carried by the brush rotating shaft 38 and the pin 22 fitted to the brushing tool 19. Therefore, the brushing tool 19 does not come off during the brushing process. In this embodiment, a suction force of 300 gf is generated with respect to the own weight of the brushing tool 19, and the brushing tool 19 can be operated with one hand.
Can be easily attached and detached.

According to the attaching / detaching means of the brushing tool 19 described above, the attaching / detaching of the brushing tool 19 can be carried out without using any tools, and in addition to the inexpensive combination of the permanent magnet 20 and the magnetic material 22, a special magnetic material can be used. It is inexpensive because no circuit is required.

FIG. 4 is a longitudinal sectional view showing another dresser of the present invention, and FIG. 5 is a plan view thereof. This embodiment is different from the first embodiment in that the cutting drive unit of the dressing tool 12 is limited to the spindle unit. The configurations of the spindle section and the brush section are the same as those in the first embodiment, and only the main parts are denoted by reference numerals.

That is, in this embodiment, the linear motion guide 11 is directly connected to the spherical seat 15 fitted to the spindle housing 14.
And a feed screw 10a and a feed screw nut 10b. The inclination adjusting means of the swing shaft 5 and the inclination adjusting means of the dressing tool 12 are performed in the same procedure as in the first embodiment. According to the present embodiment, the grinding wheel 2 of the dressing tool 12
By limiting the cutting drive of the dressing tool 12 to the spindle portion without impairing the ease of adjusting the inclination with respect to the inclination 9, the structure of the arm 8 can be significantly simplified, so that the dresser itself can be reduced in size and weight. In addition, cost reduction is achieved.

FIG. 6 is a longitudinal sectional view showing only a spindle portion of a dresser according to another embodiment of the present invention. FIG.
Is different from the previous embodiments in that an ultrasonic generator 40 is arranged in place of the brushing tool 19. The ultrasonic generator 40 and the housing 23 are connected by means of magnetic attraction generated between the permanent magnet 20 and the magnetic material 21 in the same manner as the above-mentioned connecting means of the brushing tool 19 and the brush rotating shaft 38. The linear motion guides 11 are arranged at three places in the housing 23, and the rails 39 fixed to the arm 8 are inserted into each of the linear motion guides 11. The housing 23 is held on the arm 8 via an air cylinder 27.

To use the ultrasonic generator 40, the air cylinder 27 is driven, and the housing 23 holding the ultrasonic generator 40 is driven by the linear motion guide 11 as a guide.
This is performed by lowering to a predetermined position along 9. When not using the ultrasonic generator 40, the air cylinder 27 is driven,
Retreat to the arm 8 side. When the ultrasonic generator 40 is used instead of the brushing tool 19, the structure of the arm 8 is significantly simplified, so that the dresser itself can be reduced in size, weight, and cost.

Although the dresser described above is limited to an example applied to a fixed abrasive processing method, it goes without saying that the present invention can also be applied to a conventional loose abrasive processing method. The processing apparatus provided with the dresser according to the present invention is also applied to the manufacture of optical elements having fine surface structures such as semiconductor elements, liquid crystal display elements, micromachines, magnetic disk substrates, optical disk substrates, and Fresnel lenses. be able to.

[0046]

According to the present invention, the dressing tool and the brushing tool are mounted on the same arm, and the dressing step and the brushing step for the grindstone can be simultaneously or independently selected and performed. It is possible to optimally control the dressing conditions and brushing conditions depending on the type of the grinding wheel, and therefore, it is possible to always maintain a stable and activated grinding wheel surface.
That is, a stable flattening ability can be exhibited.

Also, by having a structure in which the dressing tool and the brushing tool, which are consumables, can be easily attached and detached, excellent maintenance is realized. By storing the dressing tool and the brushing tool in the same arm, The size and cost of the processing device can be reduced.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a flattening apparatus having a dresser according to a first embodiment of the present invention.

FIG. 2 is a top view of a flattening apparatus provided with a dresser according to the first embodiment of the present invention.

FIG. 3 is a longitudinal sectional view of a spindle unit in the dresser according to the first embodiment of the present invention.

FIG. 4 is a longitudinal sectional view of a flattening apparatus provided with a dresser according to a second embodiment of the present invention.

FIG. 5 is a top view of a flattening apparatus provided with a dresser according to a second embodiment of the present invention.

FIG. 6 is a longitudinal sectional view of a spindle unit in a dresser according to a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Processing apparatus main body, 2 ... Motor, 3 ... Housing, 4 ...
Bearing, 5: swing shaft, 6a, 6b: tapered plate, 7a, 7
b ... taper plate, 8 ... arm, 9 ... motor, 10a ... feed screw, 10b ... nut, 11 ... linear guide, 12 ... dressing tool, 13 ... spindle rotating shaft, 14 ... housing, 15 ... spherical seat, 16a, 16b ... pulley, 17 ... belt, 18 ... motor, 19 ... brushing tool, 20 ...
Permanent magnet, 21 magnetic material, 22 pin, 23 housing, 24 motor, 25a, 25b gear, 26 lever, 27 air cylinder, 28 hexagon socket head bolt, 2
9: grinding stone, 30: housing, 31: motor, 32: surface plate, 33: semiconductor wafer, 34: wafer polishing holder, 3
5: polishing arm, 36: holding member, 37: lid, 38: brush rotating shaft, 40: ultrasonic generator.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masafumi Kanyu 1-280 Higashi Koikekubo, Kokubunji-shi, Tokyo Inside the Central Research Laboratory of Hitachi, Ltd. Inside the Central Research Laboratory (72) Inventor Souichi Katagiri 1-280 Higashi Koigakubo, Kokubunji-shi, Tokyo Inside the Central Research Laboratory Hitachi, Ltd. (72) Shigeo Moriyama 882 Ma, Hitachinaka-shi, Ibaraki Measuring Instruments Hitachi, Ltd. Within the group (72) Inventor Takayasu Furukawa 882 Ma, Hitachinaka-shi, Ibaraki Pref. Hitachi, Ltd.Measurement Instruments Group (72) Inventor Shigeo Otsuki 882 Ma, Hitachinaka-shi, Ibaraki Pref.Hitachi, Ltd. F-term (reference) 3C047 AA06 AA31 BB01 BB12

Claims (10)

[Claims] 1. A method of flattening the surface of a workpiece while pressing the surface of a substrate serving as a workpiece against a polishing surface of a grindstone holding and holding abrasive grains and relatively moving the grindstone and the substrate. A flattening method characterized by simultaneously performing dressing of the polished surface of the whetstone and brushing or ultrasonic cleaning of the polished surface. 2. The flattening method according to claim 1, wherein
A rotary diamond grindstone is used as the dressing tool, and a rotary brush is used as the brushing tool. The two tools are attached to independently rotatable concentric shafts, and the two tools are simultaneously or independently. Flattening method characterized in that it can be brought into contact with the polished surface of a whetstone 3. The flattening method according to claim 1, wherein
A rotary diamond grindstone as the dressing tool, using an ultrasonic generator as the ultrasonic cleaning tool,
Arrange the above dressing tool and ultrasonic generator coaxially,
A flattening method, characterized in that the two tools are simultaneously or independently movable up and down in the vertical direction with respect to the polished surface of the whetstone, and a dressing is performed on the polished surface. 4. An apparatus for flattening the surface of a workpiece while pressing a surface of a substrate as a workpiece against a polishing surface of a grindstone holding and holding abrasive grains and relatively moving the grindstone and the substrate. A flattening apparatus comprising: means for dressing the polishing surface; means for brushing the polishing surface; and means for independently driving the dressing means and the brushing means. 5. The flattening apparatus according to claim 4, wherein
A rotary diamond grindstone as a tool for performing the dressing, a rotary brush arranged so as to surround the grindstone of the dressing means as a tool for performing the brushing, and the two tools are independently disposed on respective concentric axes. A flattening apparatus comprising a driving means mounted on a rotatable shaft and capable of independently bringing the dressing tool and the brushing tool into contact with the polishing surface of the whetstone. 6. The flattening apparatus according to claim 5, wherein
A rotary diamond grindstone as a tool for performing the dressing is provided with an ultrasonic generator in place of the tool for performing the brushing, and the two tools are attached to shafts arranged on concentric axes, respectively, and the dressing tool and the A flattening apparatus comprising a driving means for bringing a sonic cleaning device into contact with or approaching the polishing surface of the whetstone simultaneously or independently of each other. 7. A dressing tool and a brushing tool according to claim 5, a oscillating portion for repeatedly oscillating the two tools from a position near the center of rotation of the polishing surface of the grinding wheel to a position near the outermost peripheral edge, and the oscillating device. A cutting drive unit that is coupled to the unit and that can drive the dressing tool into the grindstone in a fixed size;
A flattening apparatus comprising: a spindle section for rotating the dressing tool; and a brush drive section for rotating the brush or a brush drive section for rotating the brush and pressing the brush against the grindstone. 8. The flattening apparatus according to claim 4, wherein a shape of the polished surface of the whetstone after dressing is set to a rotation axis of the dressing tool and a rotation axis of the oscillating portion. A flattening apparatus characterized in that a means for controlling the tilt by independently tilting is provided. 9. The flattening apparatus according to claim 4, wherein said spindle portion is formed of a dressing tool, a convex tapered shaft for holding said dressing tool, and said convex tapered shaft. A rotary shaft having a concave tapered hole that can be inserted, and a holding table that holds the rotary shaft via a rotatable bearing, a screw hole is provided at one end of the convex tapered shaft, and the screw hole is provided. A flattening apparatus characterized in that a screw to be fitted is rotatably sealed inside the rotary shaft from outside the spindle portion. 10. The flattening apparatus according to claim 4, wherein the brush or the ultrasonic generator is held by using a magnetic force with respect to an axis for holding the brush or the ultrasonic generator. A flattening device characterized by the following.