JP2000311850A - Aligner, lithography system, manufacturing method of device and the device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the structure of a mask-carrying system in the interior of an aligner from becoming complicated, when a ceiling carrier system is adopted from the outside as the mask-carrying system with respect to the aligner. SOLUTION: A C/D 16 is connected with the side of the front surface of an aligner main body 12 in an in-line and a delivery boat 42 for carrying a mask R housed in a mask container by a ceiling carrier system 44, which is moved along an orbit Hr of a ceiling part, carrying out and in is provided on the side of the connection part of the optical axis of a projection optical system PL with the C/D 16. For this, a mask-carrying system 64 can be arranged on the side of the front surface of the optical system PL, hereby a substrate carrying system 76, which is arranged on the side of the C/D in the main body 12, and the mask-carrying system 64 can be arranged in the main body 12 in a state which is arranged vertically in the main body 12 and a sophistication of the structure of the system 64 in an aligner can be prevented from being generated. As the constitution of the system 64 in this case, roughly similar constitution as that of the carrying system of a conventional aligner can be adopted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus, a lithography system, a device manufacturing method and a device, and more particularly, to an exposure apparatus used in a lithography process for manufacturing a micro device such as a semiconductor device and a liquid crystal display device. And a lithography system including the exposure apparatus, a device manufacturing method using the lithography system, and a device manufactured by the method.

[0002]

2. Description of the Related Art Conventionally, in a lithography process for manufacturing a semiconductor device or the like, an exposure apparatus such as a so-called stepper or a so-called scanning stepper has been mainly used. KrF excimer laser devices have been used relatively frequently as light sources. Recently, these exposure apparatuses have been installed in Coater / Develope
r: hereinafter, appropriately abbreviated as “C / D”) and a lithography system connected in-line is becoming mainstream. This is because in the lithography process, each process of resist application, exposure, and development is performed as a series of processes, and it is necessary to prevent intrusion of dust and the like into the apparatus in any of the process steps, and to perform the above-described series of processes. Is performed as efficiently as possible.

FIG. 18 is a plan view showing a configuration of a lithography system mainly used in the related art. The lithography system 300 shown in FIG. 18 has an exposure apparatus main body 306 in which an excimer laser apparatus 302 such as KrF or ArF is used as an exposure light source and the excimer laser apparatus 302 is connected via a drawing optical system 304 called a beam matching unit. And a C / D 308 connected to the exposure apparatus main body 306 in-line. The lithography system 300 is also called left in-line because the C / D 308 is arranged on the left side surface of the exposure apparatus main body 306. In FIG. 18, an OHV (Over Hea) is provided at the front end of the C / D 308.
d Vehicle) or OHT (Over Head Transfer), an overhead traveling automatic transport system or AGV (Auto G
A plurality of wafer containers 310 that are carried in and out by a self-propelled carrier called a uided vehicle are installed. As a wafer container, an open carrier (hereinafter abbreviated as “OC” as appropriate) or a front opening unified pod (Fr.
ont Opening Unified Pod: hereinafter, abbreviated as “FOUP”). As the reticle container, a closed container such as a standard mechanical interface (SMIF) pod is used. In FIG. 18, the symbol Hw indicates the trajectory of the OHV.

The lithography system 300 shown in FIG.
In the case of adopting a configuration in which the reticle container is transported by OHV as in the case of the wafer side, FIG.
As shown in FIG. 9A, a housing 312 having a reticle delivery port with an OHV is mounted on an exposure apparatus main body 306.
It is more preferable to dispose it on the side of the exposure apparatus main body 306 as shown in FIG. This is because the trajectory Hr of the automatic transfer system on the reticle side intersects the trajectory Hw in FIG.
In (B), the trajectory Hr and the trajectory Hw are parallel and do not intersect each other, so that the trajectory arrangement is easy.

However, it is rare that a lithography system is installed alone in a clean room. In an actual factory, a plurality of lithography systems are installed in a clean room. In addition, since the clean room in which the lithography system is installed is very expensive, it is desirable to reduce the floor area. Therefore, it is required to efficiently arrange a large number of lithography systems in a limited space. Have been.

However, since the overall planar shape of the above-described left in-line lithography system or the opposite right in-line lithography system has a complicated shape, when a plurality of lithography systems are arranged in a clean room, dead space is reduced. This increases the space efficiency of the clean room.

In order to improve such inconvenience, recently,
As shown in FIG. 20, a lithography system called "in-line" is used in which a C / D 308 is connected in-line to the front side of the exposure apparatus main body 306. Previously inline lithography system 4
At 00, the OH on the reticle side as well as the wafer side
When V is adopted, on the front side of the exposure apparatus main body 306,
Since the C / D 308 is arranged, it is easiest to arrange the housing 312 having the delivery port of the reticle container indicated by the symbol R in FIG. Can also be seen. In this case, the trajectory Hr and the trajectory Hw are parallel to each other. In FIG. 20, a hatched area MA indicates a maintenance area of the laser device 302.

[0008]

However, the pre-inline lithography system 400 of FIG.
In the exposure apparatus, the delivery port of the reticle container is located on the side opposite to the entrance of the wafer,
Since the structure of the reticle transport system in the exposure apparatus main body 306 becomes complicated, and an excimer laser apparatus and an illumination optical system associated therewith exist on the rear side of the exposure apparatus main body,
The design of the reticle transport system is restricted.

When the exposure apparatus main body 306 has a structure that allows maintenance not only from both sides but also from the front side, it is necessary to remove the C / D in order to secure a maintenance area on the front side of the exposure apparatus main body. However, such an operation is very difficult, so that the advantage of the exposure apparatus that maintenance can be performed from the front side cannot be utilized.

Further, in the above-described conventional exposure apparatus and lithography system, since only one reticle container delivery port is provided, the time required for the entire reticle conveyance including reticle exchange becomes unnecessarily long. This is because, as described above, since the design of the reticle transport system is restricted, it is impossible to unnecessarily provide a reticle container (or reticle) loading / unloading port.

The present invention has been made under such circumstances, and a first object of the present invention is to provide a method in which a ceiling transport system is adopted as a mask transport system for an exposure apparatus from the outside. An object of the present invention is to provide an exposure apparatus and a lithography system which can prevent the structure of a mask transport system from becoming complicated.

A second object of the present invention is to provide an exposure apparatus and a lithography system which can effectively utilize the advantage of the exposure apparatus that maintenance can be performed from the front side, in addition to the above objects. is there.

A third object of the present invention is to provide a lithography system capable of minimizing a change in the design of a mask transport system in an exposure apparatus and shortening the time required for the entire transport of the mask including replacement of the mask. Is to do.

It is a fourth object of the present invention to provide a device manufacturing method capable of improving the productivity of a highly integrated device.

[0015]

The invention according to claim 1 is connected in-line with a substrate processing apparatus (16),
An exposure apparatus for transferring a pattern of a mask (R) onto a substrate (W) via a projection optical system (PL), wherein the substrate processing apparatus can be connected to a front side, which is one side in the longitudinal direction. At the same time, on the side of the optical axis of the projection optical system connected to the substrate processing apparatus, the mask is moved by the ceiling transport system (44) that moves along a trajectory (Hr) extending from the ceiling to the mask. Mask container to store (40 or 140)
Delivery port (42)
Or 142).

According to this, the optical axis of the projection optical system is connected to the substrate processing apparatus, that is, on the front side opposite to the rear side of the exposure apparatus where the normal illumination optical system is provided, and is extended to the ceiling. A transfer port for loading and unloading the mask while it is stored in the mask container by the ceiling transfer system that moves along the trajectory is provided, so that the mask transfer system can be arranged in front of the projection optical system. This makes it possible to arrange a mask transport system vertically above and below a substrate transport system arranged for transporting substrates on the substrate processing apparatus side in the exposure apparatus. In the case where a transport system is employed, the structure of the transport system for the mask in the exposure apparatus can be prevented from becoming complicated.
In this case, as the transport system of the mask, a configuration substantially similar to the transport system of the conventional exposure apparatus can be adopted.

Further, when the substrate processing apparatus is connected to the front side of the exposure apparatus, and when the ceiling transport system for the substrate is employed in the same manner as in the past, the trajectory and the trajectory of the ceiling transport system of the mask container are parallel. Can be arranged.

In this case, the other end of the in-line interface section (18) to which the substrate processing apparatus (16) is connected at one end may be connectable. In such a case, the substrate processing apparatus is connected to the front side of the exposure apparatus via the in-line interface unit. As a result, a sufficient maintenance area is provided between the front side of the exposure apparatus and the substrate processing apparatus. When the exposure apparatus has a structure that allows maintenance from not only both sides but also the front side, maintenance work can be easily performed from the front side. Therefore, the advantage of the exposure apparatus that maintenance can be performed from the front side can be effectively utilized.

In this case, the inline interface section (18) may be configured as described in claim 3.
May be detachable. In such a case, since the inline interface unit can be easily removed, the space generated by removing the inline interface unit can also be used as a maintenance area for the exposure apparatus. Therefore, maintenance work from the front side of the exposure apparatus is further facilitated.

In the exposure apparatus according to the first aspect of the present invention, as in the fourth aspect of the present invention, at least two mask containers are arranged at the transfer port along a path of the ceiling transport system. It may be possible. In such a case, the mask container can be loaded and unloaded to and from a plurality of locations of the transfer port by one or more ceiling transport systems moving along the same track, and a plurality of mask containers can be simultaneously transferred to the transfer port. By transporting the masks in the respective mask containers onto the mask holding member of the exposure apparatus, the time required for the entire mask transport can be reduced as compared with the case where the mask containers are transported one by one from the outside. Can be shortened.

In the exposure apparatus according to each of the first and fourth aspects of the present invention, as in the fifth aspect of the present invention, the delivery port is provided at a height of approximately 900 mm from the floor. good. In such a case, the mask container can be carried in and out of the delivery port by a manual operation of the operator, and this operation can be performed under optimal conditions from the viewpoint of ergonomics.

In the lithography system according to the present invention, the pattern of the mask (R) is projected onto the projection optical system (P).
L) an exposure device for transferring the image onto the substrate (W) via the exposure device; and an exposure device disposed on a front side of the floor surface (F) where the exposure device is installed, which is one side in the longitudinal direction of the exposure device. The substrate is moved by a first ceiling transport system (28) that moves along a first track (Hw) extending in a direction orthogonal to the longitudinal direction of the exposure apparatus on a ceiling portion. A substrate processing apparatus (16) which is carried in and out while being stored in a substrate container (24) for storing the substrate;
A second ceiling transport moving along a second trajectory (Hr) extending in parallel with the first trajectory on the ceiling between the optical axis of the projection optical system and the substrate processing apparatus. A delivery port (42 or 142) for carrying in and out the mask in a state where the mask is housed in a mask container (40 or 140) for housing the mask is provided.

According to this, the movable member moves along the second trajectory between the optical axis of the projection optical system and the substrate processing apparatus, that is, on the front side opposite to the rear side of the exposure apparatus provided with the normal illumination optical system. Since the second ceiling transport system has a transfer port through which the mask is loaded and unloaded in a state where the mask is stored in the mask container, the transport system of the mask can be arranged on the front side of the projection optical system, A mask transport system can be arranged vertically above and below the substrate transport system arranged for transporting substrates on the substrate processing apparatus side in the exposure apparatus, and a ceiling transport system is used as a mask transport system for the exposure apparatus from outside. In the case of adoption, it is possible to prevent the structure of the transport system of the mask inside the exposure apparatus from becoming complicated. In this case, as the transport system of the mask inside the exposure apparatus, a configuration substantially similar to the mask transport system of the conventional exposure apparatus can be adopted.

Further, the first orbit of the first ceiling transport system for carrying in / out the substrate accommodated in the substrate container with respect to the substrate processing apparatus, and the second orbit are parallel to each other and the exposure apparatus. Are arranged in a direction perpendicular to the longitudinal direction of the ceiling, the arrangement of the track with respect to the ceiling is easy.

In this case, as in the invention according to claim 7, the exposure apparatus only needs to have a maintenance area from at least both sides. This is because a sufficient maintenance area can be secured on both sides of the exposure apparatus.

In the lithography system according to each of the sixth and seventh aspects of the present invention, as in the eighth aspect of the present invention, the lithography system is disposed between the exposure apparatus and the substrate processing apparatus and connects the two. May be further provided. In such cases,
Since an empty space is created in the area on the side of the inline interface section on the front side of the exposure apparatus, if the exposure apparatus has a structure that allows maintenance from the front side, the above empty space is used as a maintenance area for exposure. Maintenance can be easily performed from the front side of the apparatus.

In this case, as in the invention according to claim 9, the mask container (40 or 140) is arranged in parallel with the in-line interface section (18) and is controlled by the second ceiling transport system (44). A mask transport system housing (22 or 122) having a transfer port (42 or 142) at the ceiling thereof for carrying in and out the mask (R) while being housed therein, and having a transport system for the mask therein; May be further provided. That is, a mask delivery port by a ceiling transport system may be provided in a housing that can be externally attached to the exposure apparatus, and this housing may be arranged in the empty space.

[0028] In the lithography system according to claims 6 and 9, as in the invention according to claim 10, at least two mask containers can be arranged at the transfer port along the second track. May be. In such a case, the mask container can be loaded and unloaded to and from a plurality of locations of the delivery port by one or more ceiling transport systems using the second track, and the plurality of mask containers are simultaneously present in the delivery port. By transferring the mask in each mask container onto the mask holding member of the exposure apparatus,
The time required for the entire mask transport can be reduced as compared with the case where the mask containers are transported one by one from the outside.

[0029] In the lithography system according to each of the sixth, ninth and tenth aspects of the present invention, as in the eleventh aspect of the present invention, the delivery port is substantially nine feet from the floor.
It may be provided at a height of 00 mm. In such a case, the mask container can be carried in and out of the delivery port by a manual operation of the operator, and this operation can be performed under optimal conditions from the viewpoint of ergonomics.

In the lithography system according to the ninth aspect of the present invention, as in the twelfth aspect of the present invention, the lithography system is arranged in parallel with the in-line interface section (18) adjacent to the mask transport system housing (22). The apparatus may further include a substrate container extension housing (20) disposed and having the substrate container extension port (60). In such a case, the above-mentioned empty space can be used effectively by arranging the mask transport system housing and the substrate container extension housing side by side in the empty space generated on the lateral side of the inline interface section.

In each of the ninth and twelfth aspects of the present invention, as in the thirteenth aspect, the mask transport system housing (22) has one surface substantially flush with one side surface of the exposure apparatus. The carry-in / out port (52) for the mask container may be provided on the one surface side. In such a case, a track of an automatic transfer system such as an AGV is laid on the floor along the side surface of the exposure apparatus, so that a mask container loading / unloading port provided on the one surface side of the mask transfer system housing. Thus, the loading / unloading of the mask container storing the mask can be realized by the automatic transfer system. It should be noted that the mask container may be carried in and out manually.

In the lithography system according to the twelfth aspect, as in the fourteenth aspect, the substrate container expansion housing (20) has one surface thereof on one side surface of the exposure apparatus and the mask transport system. One surface of the housing (22) is substantially flush with one surface, and an additional port (60) of the substrate container is provided on one surface thereof, and a loading / unloading port of the mask container is provided on the one surface of the mask transport system housing. (52) may be provided. In such a case, the track of an automatic transfer system such as an AGV is laid on the floor along the side surface of the exposure apparatus, so that the substrate container expansion housing is provided via the substrate container expansion port provided on the one surface side of the substrate container expansion housing. The substrate container can be loaded and unloaded by the automatic transfer system, and the mask container containing the mask is loaded and unloaded by the automatic transfer system via the transfer port of the mask container provided on the one side of the mask transfer system housing. be able to. In this case, the trajectory of the automatic transport system of the mask container and the trajectory of the automatic transport system of the substrate container can be shared.

In the lithography system according to the eighth aspect, as in the fifteenth aspect, the lithography system is arranged in parallel with the in-line interface section (18),
The apparatus may further include a board container addition housing (20) having the board container addition port (60). That is, a housing for adding a substrate container which can be externally attached to the exposure apparatus may be provided, and this housing may be arranged in the empty space.

[0034] In this case, the board container extension housing (20) may be configured as described in claim 16.
May have one surface substantially flush with one side surface of the exposure apparatus, and the additional port (60) may be provided on one surface side. In such a case, by laying a track of an automatic transfer system such as an AGV on the floor surface along the side surface of the exposure apparatus, an automatic transfer vehicle is provided through an additional port provided on the one surface side of the substrate container additional housing. With this, the substrate container can be carried in and out. It should be noted that the substrate container may be carried in and out manually by using a manual carrier.

In this case, a port for carrying in and out the mask container may be provided on the one side surface of the exposure apparatus. In such a case, by an automatic carrier traveling on the same track,
It is possible to carry in / out the substrate container through the additional port and carry out / out the mask container through the carry-in / out port.

In the lithography system according to each of the fourteenth and seventeenth aspects of the invention, as in the eighteenth aspect, the additional port and the carry-in / out port have the same height from the floor. It is desirable to be provided at a position of a predetermined height. In such a case, when carrying in and out the substrate container and the mask container manually, the height from the ergonomically appropriate floor surface is approximately 900 m.
An additional port and a carry-in / out port may be provided at a height of about m.

In the lithography system according to each of the eighth, ninth, and twelfth aspects of the present invention, the nineteenth aspect of the present invention provides
The inline interface section (18) may be detachable. In such a case, since the inline interface section can be easily removed, if the exposure apparatus has a structure capable of maintenance from the front side in addition to both sides, the space generated by removing the inline interface section can be reduced. It can be used as a maintenance area for an exposure apparatus. Therefore, maintenance work from the front side of the exposure apparatus is further facilitated.

In the lithography system according to the ninth and thirteenth aspects of the present invention, as in the twentieth aspect, the mask transport system housing (22) may be detachable. In such a case, since the mask transport system housing can be easily removed, when the exposure apparatus has a structure that can be maintained from the front side in addition to both sides, the space generated by removing the mask transport system housing can be reduced. It can be used as a maintenance area for an exposure apparatus. Therefore, maintenance work from the front side of the exposure apparatus is further facilitated.

In the lithography system according to each of the fifteenth and sixteenth aspects of the present invention, as described in the twenty-first aspect, the substrate container extension housing (2
0) may be detachable. In such a case, since the substrate container extension housing can be easily removed, maintenance work from the front side of the exposure apparatus is further facilitated for the same reason as described above.

According to a twenty-second aspect of the present invention, there is provided an exposure apparatus for transferring a pattern of a mask (R) onto a substrate (W) via a projection optical system (PL), and an inline connection to the exposure apparatus, The first track (H
w) a substrate processing apparatus (16) that is carried in and out while the substrate is stored in a substrate container (24) that stores the substrate by a first ceiling transport system (28) that moves along w). A second trajectory (Hr) extending parallel to the first trajectory on the ceiling in the lithography system.
A mask container (140) in which the mask stores the mask by a second ceiling transport system (44) moving along
A delivery port (142) is provided below the second track so that at least two mask containers can be arranged along the second track while being carried in and out while being stored in the second track. And

According to this, the mask is carried in and out while being stored in the mask container storing the mask by the second ceiling transport system moving along the second track provided on the ceiling portion. In addition, since at least two delivery ports capable of disposing the mask containers along the second track are provided below the second track, one or more ceiling transports that move along the second track are provided. The system allows loading and unloading of a mask container to and from a plurality of transfer ports, and a plurality of mask containers can be simultaneously present in the transfer port. By transporting the mask upward, the time required for the entire transport of the mask (when replacing the It can be shortened to include).
Further, since the first track and the second track are provided in parallel with each other on the ceiling, the track can be easily arranged (laying work). Further, the transfer port can be provided on the connection side of the optical axis of the projection optical system with the substrate processing apparatus, that is, on the front side opposite to the rear side of the exposure apparatus where the normal illumination optical system is provided. In addition, a mask transport system can be arranged on the front side of the projection optical system, so that the same configuration as the transport system of the conventional exposure apparatus can be adopted as the mask transport system.

In this case, as in the invention according to claim 23, the delivery port is approximately 900 meters from the floor.
It may be provided at a height of mm. In such a case, the mask container can be carried in and out of the delivery port by a manual operation of the operator, and this operation can be performed under optimal conditions from the viewpoint of ergonomics.

In each of the inventions described in claims 22 and 23, the delivery port may be provided in the exposure apparatus as in the invention described in claim 24, or the invention described in claim 25. The delivery port may be provided separately from the exposure apparatus, and may be provided in a mask transport system housing having a transport system for a mask housed in the mask container therein.

In the lithography system according to each of the above-mentioned inventions, the substrate container and the mask container are sealed containers each having an openable / closable door. There may be. In such a case, dust and the like can be prevented from entering the inside of the substrate container and the mask container, so that the cleanness of the clean room can be set to a class of about 100 to 1000, and the cost of the clean room can be reduced. be able to.

In this case, the mask container may be a closed-bottom container of a bottom open type.

In the lithography system according to any one of claims 6 to 27, the light source of the exposure apparatus is not particularly limited. For example, as in the invention described in claim 28, the exposure apparatus is an ultraviolet pulse laser light source. May be an exposure apparatus that uses a light source for exposure.

In the lithography system according to any one of claims 6 to 28, the substrate processing apparatus may be a coater (resist coating apparatus), a developer (developing apparatus), or the like. As in the invention, the substrate processing apparatus may be a coater / developer.
In such a case, a series of processes of resist coating, exposure, and development performed in the lithography process can be efficiently performed by the lithography system in an environment in which dust and the like are almost certainly prevented from entering the apparatus.

The invention according to claim 30 is a device manufacturing method including a lithography step, wherein the lithography step uses the lithography system according to claim 28 or 29.

[0049] Accordingly, since the use of lithographic system of claim 28 or 29 in a lithography process, a pulsed laser light source, for example, ArF excimer laser device, to perform the exposure of the high resolution by using a F ₂ laser device, etc. In addition, a series of processes of resist coating, exposure, and development can be efficiently performed in an environment in which dust and the like are almost certainly prevented from entering the apparatus. Therefore, the productivity (including the yield) of a highly integrated device can be improved.

A device according to a thirty-first aspect of the present invention is characterized by being manufactured by the device manufacturing method according to the thirtieth aspect.

[0051]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a schematic perspective view of a lithography system according to a first embodiment including an exposure apparatus according to the present invention.

The lithography system 10 of FIG.
The cleanliness is set in a clean room having a class of about 100 to 1,000. This lithography system 1
Reference numeral 0 denotes an exposure apparatus main body 12 disposed on the floor F of the clean room, and a longitudinal direction of the exposure apparatus main body 12 (FIG. 1).
Rear side (rear) side (+ X
Side), a laser device 14 as a pulsed laser light source, which is a light source for exposure, disposed on the floor surface F at a predetermined interval;
The front side (−X
Side), a C / D 16 as a substrate processing apparatus arranged at a predetermined interval, and an inline interface unit 1 for connecting the exposure apparatus body 12 and the C / D 16 inline.
8. FOUP extension housing 20, FOUP as a substrate container extension housing arranged in parallel with inline interface section 18 and adjacent to housing (environmental chamber) 12A of exposure apparatus main body 12
Adjacent to the UP extension housing 20 and in-line
A reticle port housing 22 as a mask transport system housing arranged in parallel with the interface unit 18;
And a beam matching unit BMU or the like as a routing optical system for optically connecting the exposure apparatus main body 12 and the laser apparatus 14.

In the present embodiment, the exposure apparatus main body 12,
It is assumed that the outer dimensions of the laser device 14 and the C / D 16 are the same as those of the conventional example described above.

The laser device 14 is, for example, a KrF that oscillates a pulse light in the far ultraviolet region having an oscillation wavelength of 248 nm.
Excimer laser device, ArF excimer laser device, or the like F ₂ laser device which oscillates the pulsed light in the vacuum ultraviolet region of oscillation wavelength 157nm is used for oscillating a pulsed light in the vacuum ultraviolet region of the oscillation wavelength 193 nm.

The exposure apparatus body 12 may be of a type that transfers a reticle pattern onto a wafer by a step-and-repeat method, or a type that transfers a reticle pattern onto a wafer by a step-and-scan method. The exposure device body 12 and the laser device 1
4 and the beam matching unit BMU constitute an exposure apparatus according to the present invention. Exposure apparatus body 12
Has a structure that allows maintenance from four directions: front, rear, left and right.

FIG. 2 is a plan view of a clean room in which the lithography system 10 is installed. In FIG. 2, a hatched area of the floor F indicates a maintenance area of the exposure apparatus main body 12, and a double-hatched area WMA is an area which also serves as a maintenance area of the laser apparatus 14 and the exposure apparatus main body 12. Is shown.

As shown in FIG. 2, in the present embodiment, the area of the floor surface F having a width D including the maintenance areas on both sides (both sides in the Y direction) of the exposure apparatus main body 12 (between the dotted lines in FIG. 2). The laser device 14 is disposed in the area where the laser device 14 is located, and there is no portion of the laser device 14 projecting from the maintenance areas on both sides of the exposure apparatus main body 12. Therefore, in the lithography system 10 of the present embodiment and the exposure apparatus constituting the lithography system, the required lateral width of the floor surface F can be reduced as compared with the lithography system of FIG.

As is apparent from a comparison between the length L1 'in FIG. 2 and the length L1 in FIG.
It can be seen that in the present embodiment, the required vertical dimension of the floor surface F (the longitudinal direction of the exposure apparatus main body) is reduced by the maintenance area of the excimer laser device.

The maintenance areas on both sides of the exposure apparatus main body 12 are areas that must be originally secured.

The beam matching unit BMU comprises:
As shown in FIG. 3, which is a right side view of the lithography system 10, most of the lithography system 10 is disposed under the floor below the floor F on which the exposure apparatus main body 12 is installed. Normally, the floor of a clean room is formed by laying a large number of columns planted at predetermined intervals on the ground and a rectangular mesh-like floor member on the columns in a matrix. Therefore, the beam matching unit BMU can be easily arranged under the floor by removing some floor members and the pillars below the floor member.

Returning to FIG. 1, the lower end of the chamber serving as the housing of the C / D 16 is partially protruded on the side opposite to the exposure apparatus main body 12, and the front opening unified as a substrate container is provided on the upper surface of the protruding portion. Pods (Front Open
ing Unified Pod: hereafter abbreviated as “FOUP”) 2
A mounting table 26 for mounting a plurality of the plurality 4 is formed.
As shown in FIGS. 2 and 3, facing the mounting table 26, the ceiling has a first track as a first track in a direction (Y direction) orthogonal to the longitudinal direction of the exposure apparatus main body 12. A guide rail Hw extends. The first guide rail Hw moves along the first guide rail Hw,
An OHV 28 as a first ceiling transfer system for transferring a wafer stored in the FOUP 24 is suspended and supported. The FOUP 24 accommodates a plurality of wafers at predetermined intervals in the vertical direction and has an opening on only one surface, and has a door (lid) 25 (see FIG. 6) for opening and closing the opening. (Sealed wafer cassette), for example, is the same as the transport container disclosed in JP-A-8-279546.

In the present embodiment, the FOUP 24 containing the wafer W by the OHV 28 is carried in and out of the mounting table 26.

The inline interface unit 18
Has a housing and a wafer transfer system (not shown) housed in the housing. The wafer transfer system transfers a wafer between the C / D 16 and the exposure apparatus main body 12. In the present embodiment, the inline interface unit 18 has a structure that can be easily removed. That is, a detachable structure is adopted as the inline interface unit 18.

FIG. 4A schematically shows a cross-sectional view of the reticle port housing 22, and FIG. 4B schematically shows a vertical cross-sectional view of the reticle port housing 22. I have. 4A corresponds to a cross section taken along line AA in FIG. 4B, and FIG. 4B corresponds to a cross section taken along line BB in FIG. 4A.

Here, FIGS. 4A and 4B
The reticle port housing 22 will be described with reference to FIG.

The reticle port housing 22 has a structure which can be detachably connected to the FOUP extension housing 20 here. The reticle port housing 22 includes a chamber 3 serving as a housing.
0, a horizontal articulated robot (scalar robot) 32 as a transfer system for a mask (reticle) disposed at one end (+ Y side) in the Y direction inside the chamber 30, and a chamber 3
0 from the floor surface on the other side wall (−Y side) in the Y direction
A carrier mounting portion 34 provided at a height of 0 mm, and an ID reader 3 provided above the carrier mounting portion 34
6, a carrier stock unit 38 and the like provided above the ID reader 36;

The reticle is carried in and out of the reticle carrier 40 as a mask container by an OHV 44 described later near the corner at the −Y direction end and at the −X direction end of the ceiling of the chamber 30. A transfer port 42 is provided. The reticle is mounted on the reticle carrier 4 almost above the transfer port 42.
A second guide rail Hr as a trajectory (and a second trajectory) of the OHV 44 as a second ceiling transport system for transporting the OLV 44 stored in a state of being accommodated in the housing 0 extends along the Y direction (see FIG. 2). ).

The scalar robot 32 shown in FIG.
As shown in FIG. 4 (B), an arm 33A which can freely expand and contract and rotate in the XY plane, and a driving unit 33B for driving the arm 33A are provided. The scalar robot 32 is mounted on an upper surface of a support member 48 that moves up and down along a column guide 46 extending upward from the floor surface at the + Y side end inside the chamber 30. Therefore, the arm 33A of the scalar robot 32 can move up and down in addition to expansion and contraction and rotation in the XY plane.
The vertical movement of the support member 48 is caused by the movement of the movable member 49A and the support guide 46 provided integrally with the support member 48.
This is performed by a linear actuator 50 (see FIG. 4A) including a stator 49B extending in the direction.

A reticle carrier carry-in / out port 52 is formed on the −Y side wall of the chamber 30 so as to correspond to the carrier mounting portion 34. Through this carry-in / out port 52, the reticle carrier 40 is carried into / out of the carrier mounting portion 34 manually by an operator.

In this embodiment, the reticle carrier 4
0, as shown in FIG.
A and a lid 40B, and a closed-type reticle carrier that houses the reticle R therein is used. The lid 40B of the reticle carrier 40 is fixed to the container main body 40A by a lock mechanism 40C, and by releasing the lock mechanism 40C, the lid 40B is moved from the container main body as shown in FIG. It can be removed. Release of lock mechanism 40C and lid 4
The removal of OB is performed by an opening / closing mechanism (not shown) called an opener provided inside the FOUP extension housing 20 arranged adjacent to the reticle port housing 22.

More specifically, as shown in FIG. 4B, a pair of support members capable of supporting both end portions of the bottom surface of the reticle carrier 40 are provided near the upper end of the + X side wall of the chamber 30. A shelf 54 made of a member is provided perpendicular to the surface of the side wall. When the reticle carrier 40 is placed on the shelf 54, a rectangular opening 56 slightly larger than the lid 40B is formed in the side wall of the chamber 30 where the lid 40B faces. Correspondingly, an opening / closing member sized to just close the opening 56 is provided in the opening / closing mechanism. In a normal state (a state in which the reticle carrier is not set), the inside of the FOUP extension housing 20 on the back side of the side wall of the chamber 30 is open to the outside, that is, the reticle port housing 22 side. The opening 56 is closed by fitting into the opening 56 so as not to cause the opening.

On the other hand, the lid 40 of the reticle carrier 40
The opening and closing of B is performed as follows. That is, the arm 33A of the scalar robot 32 moves the shelf 54 from the carrier mounting portion 34 or the carrier stock portion 38.
After the reticle carrier 40 is transported upward, the reticle carrier 40 is pressed against the side wall of the chamber 30.
At this time, the lid 40B is pressed against the opening / closing member. Next, an engagement / lock release mechanism (a mechanism for engaging the lid 40B by vacuum suction or mechanical connection and engaging the lid 40B and releasing the lock mechanism 40C provided on the lid 40B) is provided by the opening / closing mechanism. Activated. As a result, the lock mechanism 40C of the reticle carrier 40 is released, and the lid 40B is transported to the storage place inside the FOUP extension housing 20 integrally with the opening / closing member. Thus, the opening operation of the lid 40B is performed. Lid 40B
Is performed in a procedure reverse to the above-described opening operation.
A method similar to the method of opening and closing the lid by the opening and closing mechanism described here is disclosed in detail in Japanese Patent Application Laid-Open No. 8-279546.

The reticle container is SMIF
(Standard Mechanical Interface) A closed container such as a pod may be used.

The ID reader 36 is attached to the inside of the −Y side wall of the chamber 30 via an attachment member 37 as shown in FIG. 4B. Slightly above the ID reader 36, a shelf 58 made of a pair of support members sandwiches the ID reader 36 in plan view,
It is provided vertically on the side wall. The ID reader 36
This is for reading ID information given as a barcode or a two-dimensional code to the reticle carrier 40 placed on the shelf 58. Here, a barcode reader or a two-dimensional code reader is used. In this case, the ID information of the reticle R housed in the reticle carrier 40 is attached with a bar code on the bottom surface of the container body 40A of the reticle carrier 40. Note that the reticle carrier 40 may be formed of a transparent member, and ID information may be recorded in a portion (including an end surface) outside the pattern region of the reticle R using a barcode. Further, a magnetic head or the like may be used as the ID reader, and the ID information may be recorded on a magnetic tape or the like corresponding to the magnetic head.

The carrier stock section 38 is for temporarily storing the reticle carrier 40, and is composed of a plurality of shelves arranged at predetermined intervals in the Z direction.

The FOUP extension housing 20 has a structure that can be detachably connected to a housing (environmental chamber) 12 A of the exposure apparatus main body 12.
As shown in FIG. 1, the FOUP extension housing 20 is provided with a FOUP extension port 60 on the other side in the Y direction (−Y side). This FOUP expansion port 6
The height of the lower surface from the floor surface is the same as the loading / unloading port 5 described above.
As in the case of No. 2, it is approximately 900 mm. here,
The FOUP extension port 60 is set to be approximately 900 mm from the floor when the wafer is 12 inches in size.
Assuming that an operator carries a FOUP by a PGV (manual type transport vehicle) and carries it in and out of the apparatus, it is generally about 900 mm from the floor from an ergonomic point of view. This is because it is considered most desirable. For the same reason, the above-mentioned carry-in / out port 52 is also about 900 mm from the floor surface.

In the case of this embodiment, the reticle carrier 40
Surface of the chamber 30 provided with the carry-in / out port 52 of
FOUP extension port 6 of FOUP extension housing 20
The surface provided with 0 is substantially the same as the outer surface of the right side wall of the housing (environmental chamber 12A) of the exposure apparatus main body 12.

The FOUP extension housing 20 has a chamber 62 as a housing as shown in the cross-sectional view of FIG. This chamber 62 actually contains FOU
A partition wall (not shown) that partitions the chamber 62 into upper and lower portions is provided at a position above the P addition port 60. A part of the reticle transport system 64 shown in FIG. 3 is arranged in a space above the partition wall. Some of the components include the reticle carrier 40 described above.
The opening / closing mechanism of the lid 40B is included. Further, as shown in FIG. 6, the space below the partition wall is a partition wall 6.
6 are divided into two parts. This partition wall 66
FOUP2 in the space surrounded by the side wall of the chamber 62 and
A FOUP table 68 for installing the FOUP 4 is provided.
On the FOUP table 68, the FOUP 24 carried in via the additional port 60 is installed.

In order to remove the wafer from the FOUP 24, it is necessary to press the FOUP 24 against the opening 66a of the partition wall 66 and open and close the door 25 through the opening 66a. For this reason, in the present embodiment, an opening / closing mechanism (opener) 70 for the door 25 is disposed at the + Y side portion of the partition wall 66. The opening 66a is formed at a position substantially facing the additional port 60 described above.

Further, an opening / closing member having a mechanism for releasing a key (not shown) provided on the door 25 is housed inside the opening / closing mechanism 70 while the door 25 is engaged by vacuum suction or mechanical connection. ing. The opening and closing of the door 25 by the opening and closing mechanism 70 is performed in the same manner as the lid 40B of the reticle carrier 40 described above. Such details are disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 8-279546. In a normal state (a state in which the FOUP is not set), the opening / closing member fits into the opening 66a so that the inside of the partition wall 66 does not open to the outside.
6a is closed.

A horizontal articulated robot (scalar robot) 72 is arranged on the + Y side of the opening / closing mechanism 70 in the chamber 62 so as to face the FOUP table 68. This horizontal articulated robot (hereinafter, abbreviated as “robot” as appropriate) 72 includes an arm 73A that can freely expand and contract, rotate (turn) in the XY plane, and move up and down within a predetermined stroke range. And a driving unit 73B for driving.

Next, a series of operations until a wafer is taken out from the FOUP 24 on the FOUP table 68 will be briefly described. Although the operation of each unit in the following description of the operation is performed under the control of a main control device (not shown), a description of the main control device will be omitted below to avoid complication of the description.

When the FOUP 24 transported by the PGV or AGV (self-propelled transport vehicle) is set on the FOUP table 68, the FOUP table 68 is driven in the + Y direction by a slide mechanism (not shown), The FOUP 24 is pressed against the partition wall. This is because F is not changed even after the door 25 is opened.
Because it is necessary to maintain a high degree of cleanness in the OUP, the door 25
After the FOUP 24 is opened, the inside of the FOUP 24 may be less clean than the inside of the partition wall 66.
This is to prevent direct contact with the space outside of 6.

Next, the door 25 of the FOUP 24 is opened by the opening / closing mechanism 70 using the opening / closing member.

Next, the arm 73A is driven up and down by the driving unit 73B of the robot 72 according to the height of the wafer to be accessed. That is, the wafer to be accessed and the obstacles underneath (wafer or FOUP)
The arm 73A is driven up to a height at which the arm 73A can be inserted into the gap (bottom of 24).

Next, in the driving portion 73B of the robot 72, the arm 73A is rotated and expanded and contracted to insert the arm 73A under the target wafer, and then slightly raised to place the wafer on the arm 73A and contract the arm 73A. FO the wafer
The wafer is taken out of the UP 24 and transferred to a predetermined position (position of a virtual line W4) of a wafer loader system described later provided in the environmental chamber 12A of the exposure apparatus main body 12. This transfer is performed by rotating and expanding / contracting the arm 73A of the robot 72. Therefore, an opening 62a is formed at a predetermined height from the floor surface, for example, at a position of approximately 600 mm from the side wall in the + X direction of the chamber 62, and a side wall portion of the environmental chamber 12A of the exposure apparatus main body 12 facing the opening 62a. The opening 12b is also formed. The operation after the wafer is taken out of the FOUP 24 will be described later.

Returning to FIG. 1, on the right side wall of the environmental chamber 12A of the exposure apparatus main body 12, a display operation section 74 having a monitor display, a touch panel, and the like is provided at a position substantially corresponding to the height of human eyes. Is provided.

The environmental chamber 12A
As shown in FIG. 3, an illumination optical system IOP for illuminating a reticle R as a mask with a laser beam introduced by a beam matching unit BMU, and a reticle stage RST as a mask stage for holding the reticle R, as shown in FIG. , A projection optical system PL, a wafer stage WST as a substrate stage that holds the wafer W as a substrate and moves two-dimensionally in XY, a wafer loader system 76, and the like.

When the exposure apparatus including the exposure apparatus main body 12 and the laser apparatus 14 is of a static exposure type such as a stepper, the reticle stage RST is configured to be finely driven in the XY plane. In the case of a scanning type such as a stepper, in addition to the fine driving in the XY plane, it is configured to be able to be driven within a predetermined stroke range in a predetermined scanning direction, for example, the X direction (or Y direction).

A wafer holder 100 is mounted on the wafer stage WST as shown in FIG.
The wafer W is held by the wafer holder 100 by vacuum suction or the like. As shown in FIG. 6, a stage delivery arm 98, which will be described later, is provided at both ends in the Y direction on the upper surface (wafer mounting surface) side of the wafer holder 100.
X into which the claw at the tip of the unload X-axis arm 96 can be inserted.
Notches 102a, 10a of a predetermined depth extending in
2b is formed.

The wafer loader system 76 includes an environmental chamber 1 as shown in FIG.
-X side in 2A (inline interface unit 18
6) in the Y direction (FIG. 6) at a predetermined interval in the X direction.
The first and second Y guides 78 and 80 extend in the left and right directions in FIG. 6, respectively, and the X guide 82 located above (on the front side in FIG. 6) and extends in the X direction (vertical direction in FIG. 6). It is provided as a transport guide. Among them, the first Y guide 78 forms an unloading side conveyance guide, and the second Y guide 80 forms a loading side conveyance guide.

On the upper surface of the first Y guide 78, a slider 84 driven along a Y guide 78 by a linear motor (not shown) is mounted. The axis table 86 is fixed.

On the + Y side (left side in FIG. 6) of the second Y guide 80, a horizontal articulated robot (scalar robot) 88 is arranged. This horizontal articulated robot (hereinafter abbreviated as “robot” as appropriate) 88 includes an arm 89A that can freely expand and contract and rotate in the XY plane and can move up and down by a predetermined amount, and drives this arm 89A. And a driving unit 89B. The robot 88 exchanges the wafer W with the in-line interface unit 18. For exchanging the wafer W, an opening 19a is formed in the housing 19 of the in-line interface section 18 on the side wall of the exposure apparatus body 12 on the side of the connection with the environmental chamber 12A, as shown in FIG. An opening 12c is also formed in the side wall of the environmental chamber 12A opposed to the opening.

On the upper surface of the second Y guide 80, a slider 90 driven along a Y guide 80 by a linear motor (not shown) or the like is mounted. A table 92 is provided.

The X guide 82 is driven by a vertical movement / sliding mechanism (not shown) including a mover of a linear motor to move along the X guide.
4. An unloading X-axis arm 96 is provided.

The load X-axis arm 94 is driven by a vertical movement / sliding mechanism (not shown).
It is movable from a position near the end of the X guide 82 near the position indicated by 4 'in the -X direction to a predetermined loading position (wafer transfer position) indicated by a solid line 94, and is movable within a predetermined range in the vertical direction. ing. A stage transfer arm 98 is arranged near the loading position. Also, unload X-axis arm 9
6 is driven by a vertical movement / slide mechanism (not shown),
In FIG. 6, from the position indicated by the imaginary line 96 ′ to the position of the stage transfer arm 98 described above, it is movable along a moving surface below the moving surface of the load X-axis arm 94 and a predetermined range in the vertical direction. Is movable.

The environmental chamber 12
A partition wall (not shown) is provided above the first and second Y guides 78 and 80 inside A, and the reticle is transported in a space above the partition wall as shown in FIG. The remaining portion of the system 64 (the portion other than the above-mentioned part including the opening / closing mechanism of the lid of the reticle carrier) is arranged. As the reticle transport system 64, for example,
A known reticle transport system having a configuration similar to that of the reticle loader system disclosed in Japanese Patent Publication No. 240366 is partially used.

Next, the operation of the exposure apparatus according to this embodiment configured as described above will be described with reference to FIG. 6, focusing on a wafer transfer sequence by a wafer loader system.

First, the operation for exchanging wafers with the C / D 16 via the in-line interface unit 18 will be described. Although the operation of each unit in the following description of the operation is performed under the control of a main control device (not shown), a description of the main control device will be omitted below to avoid complication of the description. For the same reason, the description of the ON / OFF operation of the vacuum chuck and the like at the time of transferring the wafer is omitted.

It is assumed that the wafer W on which the resist application has been completed has been transferred to a predetermined delivery position by the wafer transfer system in the in-line interface unit 18.

A. The arm 89A is extended / retracted and turned by the drive unit 89B of the robot 88, and the opening 12
c, inline interface section 18 via 19a
And reaches below the wafer W held by a holding member (not shown) at a predetermined transfer position. Next, the arm 89A is driven upward by the driving unit 89B,
The wafer W is transferred from the holding member to the arm 89A.

Next, in the drive section 89B, the arm 89A holding the wafer W is extended and retracted and turned to transfer the wafer W to a position indicated by a virtual line W2. At this time, the load Y-axis table 92 has moved to the position indicated by the virtual line 92 '.

B. Next, the arm 8 is driven by the driving unit 89B.
9A is driven downward, and the wafer W is transferred from the arm 89A to the load Y-axis table 92. The transfer of the wafer may be performed by raising the load Y-axis table 92.

Next, the slider 90 is driven in the −Y direction integrally with the load Y-axis table 92 by a linear motor or the like (not shown), and the wafer W is transferred to the position indicated by the imaginary line W3. At the time when the wafer W is transferred to the virtual line W3, the load X-axis arm 94 is in a range that does not interfere with the wafer W at the position of the virtual line W3 (for example, the virtual line W8).
(To the vicinity of the position indicated by the dotted line)) and stands by at a position near the position indicated by the virtual line 94 '. Next, the load X-axis arm 94 is driven by a vertical movement / slide mechanism (not shown) toward the position indicated by the imaginary line 94 ′, and the center of the wafer W substantially coincides with the center of the claw portion of the load X-axis arm. Stop at

Next, the load X-axis arm 94 is driven upward by the vertical movement / slide mechanism, and the wafer W is transferred from the load Y-axis table 92 to the load X-axis arm 94. The transfer of the wafer W may be performed by lowering the load Y-axis table 92.

C. After the completion of the transfer of the wafer W to the load X-axis arm 94, the load X-axis arm 94 is driven by the vertical movement / slide mechanism from the position of the virtual line 94 'in FIG. As a result, the wafer W is transferred to the position indicated by the virtual line W5.

In this case, when the load X-axis arm 94 starts moving toward the loading position, the load Y-axis table 92 is moved by a linear motor (not shown) to transfer the next wafer. It is moved to the movement position.

D. When the load X-axis arm 94 moves to the loading position, it is driven downward by a vertical movement / slide mechanism, and the wafer W is moved to the load X-axis arm 94.
Is transferred to the stage transfer arm 98 from The transfer of the wafer W may be performed by raising the stage transfer arm 98.

When the above-mentioned transfer is completed, the load X-axis arm 94 starts to move to the position indicated by the imaginary line 94 'for carrying the next wafer by the vertical movement / slide mechanism.

When the load X-axis arm 94 retreats from the loading position, the stage transfer arm 98 is driven upward by a predetermined amount by a vertical movement mechanism (not shown). Next, the unloading X-axis arm 96 is moved up and down (not shown).
The slide mechanism is driven to a position directly below the stage transfer arm 98 at the loading position. Then, the stage transfer arm 98 and the unload X-axis arm 96 wait at that position.

E. On the other hand, the load X-axis arm 9
4. While the operations (including the standby operation) of the stage transfer arm 98 and the unload X-axis arm 96 are performed,
On wafer stage WST, an exposure process (alignment, exposure) of another wafer W transferred onto wafer stage WST before that is performed.

When the transfer of the pattern of reticle R to each shot area of wafer W on wafer stage WST, that is, when the exposure is completed, wafer stage WST is moved to the end of exposure shown in FIG. The wafer W is moved from the position to the loading position, and the exposed wafer W is transferred to the unloading position (that is, the loading position).

When moving wafer stage WST to the loading position, unload X-axis arm 96
The claw provided with the suction portion at the tip engages the notches 102a and 102b of the wafer holder 100.

When the movement of wafer stage WST is completed, unloading X-axis arm 96 is driven up by a predetermined amount by a vertical movement / slide mechanism (not shown), and exposed wafer W from wafer holder 100 on wafer stage WST. Is transferred to the unload X-axis arm 96 and unloaded from above the wafer holder 100.

Next, the unloading X-axis arm 96 is driven to the position shown by the imaginary line 96 'in FIG. 6 by the vertical movement / sliding mechanism. As a result, the wafer W is transferred from the loading position indicated by the imaginary line W5 to the position indicated by the imaginary line W8 by the unload X-axis arm 96.

However, if the unloading Y-axis table 86 is not at the position shown by the solid line before the operation of the previous sequence has been completed, the unloading X-axis arm 96 is made to stand by at the position shown by the solid line in FIG.

When the unload X-axis arm 96 retreats from the loading position, the stage transfer arm 98 is driven downward by a vertical movement mechanism (not shown), and the unexposed wafer W is transferred from the stage transfer arm 98 onto the wafer holder 100. (Loaded). When the stage transfer arm 98 is lowered, the claw provided with the suction portion at the tip of the stage transfer arm 98 engages with the notches 102a and 102b of the wafer holder 100.

When stage transfer arm 98 is lowered to a position separated by a predetermined distance from the back surface of wafer W, wafer stage WST is moved toward a start position of an exposure sequence by a stage controller (not shown). After that, an exposure sequence (search alignment, fine alignment such as EGA, exposure) for the wafer W on the wafer holder 100 is started. Since this exposure sequence is the same as that of a normal scanning stepper or stepper, a detailed description is omitted.

When the wafer stage WST is moved to the start position of the above-described exposure sequence,
Since the notches 102a and 102b are formed in the wafer stage WST, the wafer stage WST is smoothly moved without the wafer holder 100 coming into contact with the claw portion of the stage transfer arm 98.

As described above, in the present embodiment, when replacing the wafer on the wafer holder 100, the wafer stage W
Since the high-speed movement operation of the ST is efficiently used, the wafer exchange time can be reduced, and the throughput can be improved.

When the wafer stage WST is retracted from the loading position, the stage transfer arm 98 is driven up by the vertical movement mechanism (not shown) to the wafer transfer position with the load X-axis arm 94 at the loading position.

F. On the other hand, when the wafer W is transported to the position indicated by the imaginary line W8, the unload X-axis arm 96 is driven downward by the vertical movement / slide mechanism, and is moved from the unload X-axis arm 96 to the unload Y-axis table 86. The wafer W is delivered. When the transfer is completed, the unloading X-axis arm 96 is driven to the loading position by the vertical movement / sliding mechanism, and is put on standby for unloading the next wafer.

The unloading X-axis arm 96 is unloaded Y
When the unloading Y-axis table 86 is moved to a position on the axis table 86 which does not interfere with the wafer W, the unloading Y-axis table 86 is driven integrally with the slider 84 to a position indicated by a virtual line 86 'in FIG. You. Thereby, the wafer W is transferred from the position of the virtual line W8 to the position indicated by the virtual line W1.

G. Next, the driving unit 89 of the robot 88
The arm 89A is rotated and expanded and contracted by B, is inserted below the exposed wafer W supported by the unloading Y-axis table 86, and is then driven up by a predetermined amount. As a result, the wafer W is transferred from the unload Y-axis table 86 to the arm 89A. When the transfer is completed, the unloading Y-axis table 86 is moved to the position indicated by the solid line in FIG. 6 by a linear motor (not shown) for carrying the next wafer.

The unloading Y-axis table 86 has the virtual line 8
When the arm 89A is retracted from the position 6 ', the arm 89A is extended and retracted and rotated by the drive unit 89B, and the exposed wafer W is returned to a predetermined transfer position in the in-line interface unit 18, and thereafter, the arm 89A is moved to the environmental chamber. Return to the standby position in 12A.

The exposed wafer W returned to the inside of the in-line interface section 18 is transferred to the inside of the C / D 16 by a wafer drive system (not shown).

As described above, the operation sequence for exchanging a wafer with the C / D 16 via the in-line interface unit 18 is performed.

Next, the wafer is stored and stored by the FOUP 24.
An operation sequence when transporting and using will be described.

In this case, first, as described above,
The unexposed wafer W taken out of the FOUP 24 on the FOUP table 68 is transferred by the arm 73A of the robot 72 to the position of the virtual line W4, and is transferred to the standby Y-axis table 92 at the position of the virtual line 92 ″. Passed.

Thereafter, the above-mentioned b. (When the wafer is exchanged with the C / D 16). ~ F. Is carried out, and the exposed wafer W is carried to a position indicated by a virtual line W11 in FIG.

When wafer W is transferred to position W11,
In the driving unit 73B of the robot 72, the arm 73A is inserted below the wafer W held on the unloading Y-axis table 86 at the position of the virtual line 86 ", and is driven upward by a predetermined amount.
As a result, the wafer W is transferred from the unloaded Y-axis table 86 to the arm 73A of the robot 72. Then
The arm 73A of the robot 72 is extended, retracted, rotated and raised by the driving unit 73B, and the wafer W is moved from the position W11 to the position W.
Conveyed to 10. Specifically, the wafer W is transported by the arm 73A to a height at which the wafer W is to be stored, and the arm 73A is extended so that the wafer W is slightly above the storage step in the FOUP 24.
Then, the arm 73A is lowered to transfer the wafer W to the storage stage, and the arm 73A is contracted and retracted out of the FOUP.

As described above, when the processing of all the wafers in the FOUP 24 has been completed, the opening / closing mechanism 70
The door 25 of the OUP 24 is closed and locked. Then, the FOUP table 68 is-
Driven in Y direction, FOUP2 by PGV, AGV, etc.
Wait for the transfer of No. 4.

As described in detail above, in the exposure apparatus according to the present embodiment, the C / D 16 can be connected to the front side, which is one side in the longitudinal direction, and the optical axis of the projection optical system PL can be connected. OHV4 that moves along a second guide rail Hr extending from the ceiling on the side of the connection with the C / D.
4, the reticle R is provided in the reticle carrier 40 with the transfer port 42 through which the reticle R is carried in and out. Therefore, the connection side of the optical axis of the projection optical system PL with the C / D 16, that is, the illumination optical system IOP A reticle transport system 64 can be arranged on the front side opposite to the rear side of the provided exposure apparatus, and a reticle transport system in the exposure apparatus when the OHV is used as a reticle transport system from the outside to the exposure apparatus. Can be prevented from becoming complicated.
In this case, the reticle transport system 64 can be arranged vertically above and below the wafer loader system 76. In this case, the reticle transport system can adopt a configuration substantially similar to the transport system of the conventional exposure apparatus.

The C / D 16 is connected to the front side of the exposure apparatus, and the OHV 28 for the wafer is employed in the same manner as in the prior art. The trajectory Hw and the trajectory Hr of the OHV 44 are used.
And are parallel. Therefore, it is easy to arrange the track with respect to the ceiling.

In the present embodiment, the laser device 1 is located within the area of the floor surface F having a width including the maintenance areas on both sides of the exposure apparatus main body 12, which must be originally secured.
By arranging the four, there is no portion of the laser device 14 projecting from the maintenance area on both sides of the exposure device main body 12, and the required floor area can be reduced accordingly.

In the present embodiment, the exposure apparatus main body 12 has a structure capable of performing maintenance from four directions, that is, left, right, front and rear. A part of the maintenance area on the rear side of the exposure apparatus main body 12 and the maintenance area of the laser device 14 are provided. WMA
And the exposure apparatus body 12 and the laser apparatus 1 so that
4 are arranged on the floor F, the laser device 1
The required floor area can be reduced as compared with the case where the maintenance area 4 and the maintenance area of the exposure apparatus main body 12 are separately provided.

In this embodiment, the laser device 14
Is connected to the exposure apparatus main body 12 via the beam matching unit BMU, and the beam matching unit BM
U is arranged under the floor F on which the exposure apparatus main body 12 is installed, so that the beam matching unit B
Since there is no MU (obstacle), maintenance work and the like can be performed comfortably and easily. However, the beam matching unit BMU (routing optical system) may be arranged above the floor F on which the exposure apparatus main body 12 is installed. Even in such a case, there is no big trouble at the time of maintenance or the like.

In this embodiment, the exposure apparatus main body 12
Since the C / D 16 as the substrate processing apparatus can be connected to the opposite side of the laser apparatus 14 via the in-line interface section 18, the C / D 16 is connected to the exposure apparatus main body 12 in-line. The lithography system 10 is of the so-called pre-in-line type and has a generally rectangular planar shape as a whole. Therefore, when arranging a plurality of such lithography systems 10 in a clean room, the lithography systems 10 can be arranged more efficiently than the left inline or right inline type.

Further, since an empty space is formed in the area on the side of the in-line interface section 18 in front of the exposure apparatus main body 12, the space is effectively used as a maintenance area, so that the front of the exposure apparatus main body 12 can be used. Maintenance can be performed easily,
The advantage of the exposure apparatus that maintenance can be performed from the front can be effectively utilized.

In the lithography system 10 according to the present embodiment, the length in the vertical direction is longer than that of the conventional pre-inline lithography system by the length of the in-line interface section 18. 12 are arranged on the floor surface F so that a part of the maintenance area on the rear surface side of the laser device 12 and the maintenance area of the laser device 14 are common, the length L in FIG.
As is apparent from a comparison between 2 ′ and the above-described length L2 in FIG. 20, the maintenance area from the front surface is consequently hardly increased as compared with the conventional pre-inline type lithography system. It can be seen that has been secured.

In the lithography system 10 according to the present embodiment, the transfer port 42 of the reticle carrier 40 which is arranged in parallel with the in-line interface unit 18 and stores the reticle R carried in / out by the OHV 44 is provided on the ceiling. Since a reticle port housing 22 having a reticle transport system therein and a FOUP expansion housing 20 having a FOUP expansion port 60 disposed in parallel with the inline interface section 18 adjacent thereto are provided. The effective use of the empty space generated on the side of the inline interface unit 18 is achieved.

In the lithography system 10 according to the present embodiment, the FOUP extension housing 20 has one surface substantially flush with one side surface of the exposure apparatus (exposure apparatus main body 12) and one surface of the reticle port housing 22. A FOUP extension port 60 is provided on one side, and a reticle carrier carry-in / out port 52 is provided on the reticle port housing 22 on the one side.

Therefore, for example, as shown in FIG. 7, the lithography system 10 and the lithography in which the arrangement of a part of the lithography system 10 (in-line interface unit, reticle port housing, FOUP extension housing) are reversed left and right. System 10 '
When a layout in which a plurality of cameras are arranged side by side in a clean room is adopted, an orbit of an automatic transfer system such as an AGV (shown by a reference sign AGV1 in FIG. 7) along one side surface of the exposure apparatus (exposure apparatus body 12) Is laid on the floor surface, the FOUP 24 can be carried in / out by the automatic transport system via the FOUP extension port 60 of the FOUP extension housing 20, and the FOUP 24 is provided on the one side of the reticle port housing 22. A reticle carrier 40 containing a reticle can be carried in and out by an automatic conveyance system via a reticle carrier carry-in / out port 52. In this case, the trajectory of the automatic transport system of the reticle carrier and the trajectory of the automatic transport system of the FOUP can be shared. Also, in this case, in the direction perpendicular to the trajectory AGV1, C
A track (indicated by the symbol AGV2 in FIG. 7) such as an AGV for carrying in / out the FOUP to / D16 may be arranged. The FOUP can be transported to a plurality of C / Ds by the automatic transport system using the AGV2 as a track.

In the lithography system 10 according to the present embodiment, the FOUP extension port 60 and the reticle carrier carry-in / out port 52 are at the same height from the floor, that is, approximately 900 mm. Since the FOU is provided at a height of about the same, the FOU is manually operated using a PGV (manual carrier) without using an AGV or the like.
When carrying in / out of P and carrying out / out of the reticle carrier manually, it becomes possible to perform such work in a state that is considered to be ideal from an ergonomic point of view.

In this embodiment, since the inline interface section 18 is detachable, the inline interface section 18 can be easily removed, and the space generated after the inline interface section 18 is removed can be removed. That is, the maintenance area can be expanded to the portion where the inline interface unit 18 was connected, and maintenance work from the front side of the exposure apparatus main body 12 becomes easier. In the present embodiment, the reticle port housing 22
Since the FOUP extension housing 20 is detachable, the FOUP extension housing 20 can be easily removed, and the space generated after the removal can be used as a maintenance area, and the maintenance from the front side of the exposure apparatus main body 12 can be performed. Work is easier. That is, in the present embodiment, maintenance of the exposure apparatus main body can be performed from the front side in exactly the same manner as a so-called stand-alone exposure apparatus, and maintenance work can be performed from the front side in addition to both sides. It is possible to make the most of the advantages of the exposure apparatus in the form.

However, the configuration of the lithography system according to the present embodiment is merely an example, and it goes without saying that the present invention is not limited to this. That is, the reticle port housing 22 and the FOUP extension housing 20
May be arranged in the in-line interface unit 18 in parallel. However, when the reticle port housing 22 is not provided separately from the exposure apparatus main body 12, a delivery port corresponding to the reticle delivery port 42 is connected to the environmental chamber 12 of the exposure apparatus main body 12.
A must be provided on the front side of the ceiling of A.

For example, when only the reticle port housing 22 as a mask transport system housing is arranged adjacent to the exposure apparatus main body 12 in parallel with the inline interface section 18, the carry-in / out port 52 is connected to the reticle port housing 22. May be provided on the side of the chamber 30 facing the C / D 16. However, in this case, since the loading / unloading operation of the reticle carrier needs to be performed manually, the height of the loading / unloading port 52 from the floor surface is approximately 900.
It is desirable to set it to about mm.

Of course, when only the reticle port housing 22 is arranged adjacent to the exposure apparatus main body 12 in parallel with the in-line interface section 18, one surface of the reticle port housing 22 is exposed similarly to the above embodiment. The main body 12 may be substantially flush with one side surface, and a reticle carrier carry-in / out port 52 may be provided on the one surface side. In such a case, a track of an automatic transfer system such as an AGV is laid on the floor surface along the side surface of the exposure apparatus main body 12, so that the track is automatically transferred via a carry-in / out port provided on one surface side of the reticle port housing 22. The reticle carrier 40 containing the reticle can be carried in and out by the transport system.

In any of the above cases, if the exposure apparatus (exposure apparatus main body 12) can be maintained not only on both sides but also on the front side, a wide maintenance area can be secured on the front side of the exposure apparatus to perform maintenance. In order to further facilitate the operation, it is desirable that at least one of the inline interface unit 18 and the reticle port housing 22 is detachable.

For example, when only the FOUP expansion housing 20 as a substrate container expansion housing is arranged adjacent to the exposure apparatus main body 12 in parallel with the inline interface section, the FOUP expansion port 60 is connected to the FOUP expansion port. C / D of chamber 62 of housing 20
16 may be provided. However, in this case, it is necessary to manually carry out the loading / unloading operation of the FOUP by using a manual transport vehicle. Therefore, it is desirable to set the height of the additional port 60 from the floor surface to approximately 900 mm.

Of course, when only the FOUP extension housing 20 is arranged adjacent to the exposure apparatus main body 12 in parallel with the in-line interface section 18, one surface of the FOUP extension housing 20 is exposed similarly to the above embodiment. One side surface of the main body 12 may be substantially flush with one side surface, and a FOUP extension port 60 may be provided on one surface side. In such a case, the FOUP can be carried in and out by the automatic transport vehicle through the additional port 60 by laying the track of the automatic transport system such as an AGV on the floor along the side surface of the exposure apparatus.

In any of the above cases, if the exposure apparatus (exposure apparatus main body 12) has a structure capable of performing maintenance from the front side in addition to both sides, a wide maintenance area is secured on the front side of the exposure apparatus to perform maintenance. To make the work easier, the inline interface unit 18 and FO
It is desirable that at least one of the UP additional housings 20 is detachable.

In the above embodiment, the exposure apparatus main body 1
Although the case where 2 has a structure capable of performing maintenance from four directions of left, right, front and back has been described, the present invention is not limited to this. That is, the exposure apparatus according to the present invention only needs to have a structure that allows maintenance from at least both sides. In this case, however, it is necessary to provide a delivery port corresponding to the reticle delivery port 42 on the front side of the ceiling of the environmental chamber 12A of the exposure apparatus main body 12. In this case, the C / D 16 may be connected to the front side of the exposure apparatus (the exposure apparatus main body 12) without passing through the in-line interface unit 18. As described above, even when the exposure apparatus and the C / D 16 are connected in-line in front, a reticle carrier carry-in / out port may be provided on one side surface of the exposure apparatus.

In the lithography system 10 of the above embodiment, since the C / D 16 is used as the substrate processing apparatus, a series of resist coating, exposure, and development processes performed in the lithography process are performed in the apparatus. It can be performed efficiently in an environment in which intrusion of dust or the like is almost certainly prevented. However, the present invention is not limited to this, and a lithography system according to the present invention may be configured by connecting a coater (resist coating apparatus), a developer (developing apparatus), and the like as a substrate processing apparatus to an exposure apparatus main body in-line.

In the above embodiment, a closed reticle carrier 40 having an openable / closable lid (door) 40B is used as a mask container, and a closed FOUP 24 having an openable / closable door 25 is used as a substrate container. However, if such a container is used, even if the cleanliness of the clean room is set to a class of about 100 to 1000, the container (reticle carrier and F
This is because dust and the like can be prevented from entering the OUP), and thereby the cost of the clean room can be reduced. However, the present invention is not limited to this. For example, when the lithography system is installed in a clean room having a degree of cleanliness of about class 1, an open type container such as an open carrier is used as a substrate container, and the like. The reticle carrier may not be a closed type.

<< Second Embodiment >> Next, a second embodiment of the present invention will be described with reference to FIGS. here,
The same reference numerals are used for the same or equivalent components as those in the first embodiment, and the description thereof will be simplified or omitted.

FIG. 8 is a schematic perspective view of a lithography system 110 according to the second embodiment, and FIG.
A plan view of the lithography system 110 is shown in FIG.
Shows a side view of a lithographic system.

This lithography system 110 is similar to that shown in FIG.
As shown in FIG. 2, an exposure apparatus including an exposure apparatus main body 12, a beam matching unit BMU, and a laser device 14, and a substrate processing apparatus connected to the front side of the exposure apparatus main body 12 via an inline interface unit 18 are provided. The exposure apparatus includes a C / D 16 and a reticle port housing 122 as a mask transport system housing which is arranged in parallel with the inline interface unit 18 on the front side of the exposure apparatus main body 12 and is connected to the exposure apparatus main body 12.

In the second embodiment, the exposure apparatus main body 12
The above-mentioned side of the environmental chamber 12A on the −Y side is approximately 900
A FOUP extension port 60 is provided at a height of mm. The internal structure of the environmental chamber 12A where the FOUP expansion port 60 is provided is the same as the inside of the FOUP expansion housing 62 of FIG.

The reticle port housing 122 is provided with three reticle carriers 140 as mask containers as shown in FIGS.
A transfer port 142 that can be arranged along r is provided. The height of the transfer port 142 from the floor is approximately 900 m above the floor from an ergonomic point of view as described above.
m height. This transfer port 142
The reticle carrier 140 can be carried in and out by the OHV 44, and is also suitable for an operator to manually carry in and out the reticle carrier 140 transported by the PGV or the like.

Here, as the reticle carrier 140, an SMIF (Standard Mechanical Interface) pod, which is a closed-bottom open-type container capable of storing a plurality of reticles vertically at predetermined intervals, is used. The reticle carrier 140 includes a carrier body integrally provided with a plurality of storage shelves for accommodating the reticle R at predetermined intervals in a vertical direction, a cover fitted into the carrier body from above, and a bottom wall of the carrier body. And a lock mechanism for locking the cover. Of course, the reticle carrier 140 uses one reticle R.
It may be one that stores only one sheet.

In correspondence with the structure of reticle carrier 140 described above, transfer port 142 of reticle port housing 122 on which reticle carrier 140 is loaded and loaded.
In the portion, three openings slightly larger than the carrier body of the reticle carrier 140 are provided at predetermined intervals in the Y-axis direction. These openings are normally closed by an opening / closing member constituting an opening / closing mechanism (not shown) housed inside the reticle port housing 122. The opening / closing member engages with the bottom surface of the carrier body by vacuum suction or mechanical connection, and releases a locking mechanism (not shown) provided on the carrier body (hereinafter referred to as “engage / lock” for convenience). Release mechanism).

In the opening / closing mechanism, the lock mechanism is released by an opening / closing member engaging / unlocking mechanism, and after the carrier body is engaged, the opening / closing member is moved downward by a predetermined amount to thereby provide a reticle port housing 122. The carrier main body holding a plurality of reticles can be separated from the cover in a state where the inside and outside of the carrier are separated.
In other words, the cover of the reticle carrier 140 can be opened in a state where the inside and the outside of the reticle port housing 122 are isolated.

Then, a plurality of sheets (or one
After the carrier main body holding the reticle is separated from the cover, a reticle transport system 64 as a mask transport system including a robot (not shown) is used in FIG.
The reticle is transported along a path indicated by an arrow A therein, and stored in a reticle storage unit (not shown) provided inside the exposure apparatus main body 12. Then, a reticle is exchanged between the reticle storage unit and the reticle stage RST by a reticle loader (not shown).

On the other hand, when the purpose of the reticle stored in the reticle storage unit is completed, such as when the exposure using the reticle is completed, the reticle transport system 64 moves the transfer port 142 along the reverse path to the above-described path. The carrier is conveyed to a lower position, and the carrier body is integrated with the cover by the opening / closing mechanism in a procedure reverse to the procedure described above, and waits for carrying out by the OHV 44. Note that reticle stage R
When transporting the reticle R from the ST to the delivery port 142, the reticle may be carried out without being stored in the reticle storage unit. Further, the reticle storage section described above is not necessarily provided, and the reticle may be directly exchanged between the reticle stage RST and the carrier body separated from the cover.

The structure of the other parts is the same as that of the first embodiment.

According to the lithography system 110 of the second embodiment configured as described above, the same effect as that of the first embodiment can be obtained. In addition, the reticle is moved by the OHV 44 that moves along the guide rail Hr provided on the ceiling, so that the reticle carrier 1
The reticle port housing 122 is provided in the reticle port housing 122 below the guide rail Hr. , OHV 44, the reticle carrier 140 can be carried in and out of three locations of the delivery port 142. In this embodiment, at least three reticle carriers 140 can be present in the delivery port 142 at the same time. By transporting the reticle in the reticle carrier 140 onto the reticle stage RST of the exposure apparatus, the time required for the entire reticle transport (including the exchange time) is reduced as compared with the case where the reticle carriers 140 are transported one by one from the outside. Can be Improvement of throughput is possible.

A transfer port 142 is provided on the side of the connection of the optical axis of the projection optical system PL with the C / D 16, that is, on the front side opposite to the rear side of the exposure apparatus provided with the normal illumination optical system IOP. Therefore, a reticle transport system can be arranged on the front side of the projection optical system PL, and the transport system of the conventional exposure apparatus can be slightly modified and used as the reticle transport system.

Since the transfer port 142 is provided at a height of approximately 900 mm from the floor,
The reticle carrier 140 can be carried into and out of the transfer port 142 by a manual operation of the operator, and this operation can be performed under optimal conditions from an ergonomic point of view.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIGS. Here, the same reference numerals are used for the same or equivalent components as those in the above-described second embodiment, and the description thereof will be simplified or omitted.

FIG. 11 is a schematic perspective view of a lithography system 120 according to the third embodiment, FIG. 12 is a plan view of the lithography system 120, and FIG. A side view is shown.

The lithography system 120 is generally configured similarly to the lithography system 110 according to the second embodiment described above, but differs in the following points.

That is, the lithography system 12
0, a projection 13 is formed at the end of the environmental chamber 12A of the exposure apparatus main body 12 in the −X direction, and a mask is formed on the upper surface of the projection 13 as shown in FIGS. A delivery port 142 is provided in which three reticle carriers 140 can be arranged along the guide rails Hr. Further, in this case, the reticle in the carrier main body which is carried into the transfer port 142 and whose cover is removed by the opening / closing mechanism (not shown) is located above the FOUP extension port 60 via a space on the + Y side of the FOUP extension port 60. It is transported to the reticle storage unit. The configuration of the other parts is the same as that of the lithography system 110 according to the second embodiment described above.
Is similar to

According to the lithography system 120 of the third embodiment, the same effects as those of the above-described second embodiment can be obtained, and the inline interface unit 18 can be obtained.
Can be set shorter, so that the footprint can be reduced accordingly.

<< Fourth Embodiment >> Next, a fourth embodiment of the present invention will be described with reference to FIGS. 14 (A) and 14 (B). Here, the same reference numerals are used for the same or equivalent components as those of the above-described first and second embodiments, and the description thereof will be simplified or omitted.

FIG. 14A is a plan view of a lithography system 130 according to the fourth embodiment.
(B) shows a front view of the lithography system 130.

As apparent from FIGS. 14A and 14B, the lithography system 130 according to the fourth embodiment is different from the so-called pre-in-line type lithography system according to the first to third embodiments. Differently, a C / D 1 as a substrate processing apparatus is provided on the left side of the exposure apparatus body 12.
6 is a connected left in-line type.

This lithography system 130 is similar to that shown in FIG.
As shown in FIG. 4A, an exposure device including an exposure device main body 12, a beam matching unit BMU, and a laser device 14, a C / D 16 connected in-line to the left side of the exposure device main body 12, A reticle port housing 122 as a mask transport system housing connected near the front end of the right side of the exposure apparatus body 12 is provided.

The lithography system 130 of the present embodiment
At the left end on the front side of the environmental chamber 12A of the exposure apparatus body 12, a FOUP extension port 60 is provided at a height of approximately 900 mm above the floor from an ergonomic point of view as described above. The internal structure of the environmental chamber 12A where the FOUP expansion port 60 is provided is the same as the inside of the FOUP expansion housing 62 of FIG.

As shown in FIG. 14 (A), three reticle carriers 140 as mask containers can be arranged and transferred along the guide rail Hr as the second track to the reticle port housing 122. A port 142 is provided. This transfer port 142
Is about 900 mm above the floor from an ergonomic point of view as described above. The transfer port 142 is connected to the SMIF by the OHV 44 as described above.
(Standard Mechanical Interface) The reticle carrier 140 composed of a pod can be carried in and out, and the reticle carrier 140 transported by a PGV or the like is also suitable for an operator to carry in and out manually.

In this case, as is clear from FIG. 14A, the OHV 28 as the first ceiling transfer system for carrying the FOUP 24 containing the wafer into and out of the mounting table of the C / D 16.
The guide rail Hw as a first track on which the trajectory moves and the guide rail Hr as an OHV 44 as a second ceiling transport system for carrying in / out the reticle carrier 140 to / from the transfer port 142 move parallel to the ceiling of the clean room. Part (ceiling surface).

In the lithography system 130, although not shown, a robot for exchanging wafers between the inside of the C / D 16 and the wafer loader system 76 in the environmental chamber 12A of the exposure apparatus main body 12 includes: FOU carried into FOUP extension port 60
The exchange of wafers between the P24 and the wafer loader system 76 is also performed.

In the reticle carrier 140 carried into the transfer port 142, the cover and the carrier main body are separated, and a plurality of reticles separated from the cover are held in the same manner as in the second embodiment. The reticle in the carrier body is transferred by a reticle transport system as a mask transport system including a robot (not shown) along a path shown by an arrow B in FIG. The reticle is stored in a reticle storage unit (not shown) provided inside the apparatus main body 12, and a reticle is exchanged between the reticle storage unit and the reticle stage RST by a reticle loader (not shown).

On the other hand, when the reticle stored in the reticle storage section has completed its purpose, such as when the exposure using the reticle has been completed, the reticle transport system along the reverse path to the transfer port 142 along the path described above. It is transported to a lower position.

According to the lithography system 130 configured as described above, for the same reason as in the above-described second embodiment, the entire reticle transport is required as compared with the case where the reticle carriers 142 are transported one by one from the outside. The time (including the replacement time) can be shortened, and the throughput can be improved accordingly.

Further, the delivery port 142 is connected to the exposure apparatus main body 1 irrespective of the portion where the illumination optical system IOP is provided.
2 is provided near the front end of the right side surface, so that a reticle transport system can be arranged in this portion. As the reticle transport system, the transport system of the conventional exposure apparatus can be slightly modified and used. Can be.

<< Fifth Embodiment >> Next, a fifth embodiment of the present invention will be described with reference to FIGS. 15 (A) and 15 (B). Here, the same reference numerals are used for the same or equivalent components as those of the above-described fourth embodiment, and the description thereof will be simplified or omitted.

FIG. 15A is a plan view of a lithography system 150 according to the fifth embodiment.
(B) shows a front view of the lithography system 150.

The lithography system 150 is generally configured similarly to the lithography system 130 according to the fourth embodiment described above, but differs in the following points.

That is, the lithography system 15
0, a recess is formed in the vicinity of the front end of the right side surface of the environmental chamber 12A of the exposure apparatus body 12, and a mask container is formed on the upper surface of the recess as shown in FIGS. 15 (A) and (B). Reticle carrier 140 as
Are provided along the three guide rails Hr. The configuration of other parts
Lithography system 1 according to the fourth embodiment described above.
It is the same as 30.

According to the lithography system 150 according to the fifth embodiment, the same effects as those of the above-described fourth embodiment can be obtained. In addition, the comparison between FIG. 14A and FIG. Thus, the footprint can be narrowed.

In each of the above embodiments, the reticle is taken out of the carrier main body from which the cover is separated and transported to the reticle storage unit or the reticle stage RST. However, the carrier main body is transported integrally with the reticle. May be. At this time, if the carrier body has a storage shelf for holding a plurality of reticles, the carrier body can be used instead of the reticle storage unit. The number of reticles stored in the carrier body may be one. Further, an inert gas such as helium or nitrogen, or chemically clean dry air (for example, a humidity of about 5% or less) may be sealed in the carrier body.
It is effective for an exposure apparatus having a diameter of about nm or less. In this exposure apparatus, an inert gas is supplied into the housing in which the reticle stage RST is arranged, and a transport path from the carrier body, from which the cover is separated, to the housing is also installed in the housing. An active gas is supplied.

In each of the above embodiments, the case where the laser device 14 such as an ArF, KrF excimer laser, or an F ₂ laser is used as the light source of the exposure device has been described.
It goes without saying that the exposure apparatus and the lithography system according to the present invention are not limited to these. For example, when a laser device is used as a light source, the laser device may be a YAG laser device that uses its harmonics as exposure light, or a laser beam may be applied to an EUV light generating material such as a copper tape to emit a laser beam at a wavelength of 5 nm.
A laser plasma device that generates light in the soft X-ray region (EUV light) of about 15 nm or a high-power laser excited by a semiconductor laser can also be used.

Further, the light source of the exposure apparatus according to the present invention,
That is, illumination light for exposure is not particularly limited.
Far ultraviolet (DU) such as bright lines (g-line, i-line, etc.)
V) a DUV exposure apparatus that uses light as illumination light for exposure,
ArF excimer laser light, F _TwoVacuum ultraviolet light such as laser light
Not only VUV exposure equipment using (VUV) light but also C /
Exposure equipment connected in-line to substrate processing equipment such as D
If the device is installed in an X-ray exposure device, electron beam exposure device, etc.
The invention is applicable.

[0195] Also, for example, not limited to an ArF excimer laser light or F ₂ laser beam as vacuum ultraviolet light, infrared region oscillated from a DFB semiconductor laser or a fiber laser, or a single-wavelength laser beam in the visible range, e.g. A harmonic that is amplified by a fiber amplifier doped with erbium (or both erbium and ytterbium) and wavelength-converted to ultraviolet light using a nonlinear optical crystal may be used.

Of course, not only an exposure apparatus used for manufacturing a semiconductor element, but also an exposure apparatus used for manufacturing a display including a liquid crystal display element for transferring a device pattern onto a glass plate, and manufacturing a thin film magnetic head The present invention can also be applied to an exposure apparatus used to transfer a device pattern onto a ceramic wafer, an exposure apparatus used to manufacture an imaging device (such as a CCD), and the like.

In addition to a micro device such as a semiconductor element, a glass substrate or a mask is used for manufacturing a reticle or a mask used in an optical exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, and the like. The present invention is also applicable to an exposure apparatus that transfers a circuit pattern onto a silicon wafer or the like. Here, a transmissive reticle is generally used in an exposure apparatus using DUV (far ultraviolet) light or VUV (vacuum ultraviolet) light, and quartz glass is used as a reticle substrate.
Quartz glass, fluorite, magnesium fluoride, quartz, or the like doped with fluorine is used. In a proximity type X-ray exposure apparatus or an electron beam exposure apparatus, a transmission mask (stencil mask, membrane mask) is used.
And a silicon wafer or the like is used as a mask substrate.

The magnification of the projection optical system may be not only a reduction system but also any one of an equal magnification system and an enlargement system. Further, as the projection optical system, when an excimer laser is used, quartz or fluorite is used as a glass material, and when an EUV light is used, a reflection type optical system is used, and a reticle of a reflection type may be used.

The illumination optical system (IOP) and the projection optical system (PL) each composed of a plurality of lenses are incorporated in the body of the exposure apparatus, and optical adjustment is performed. Stage W
The exposure apparatus of the above embodiment can be manufactured by attaching the ST to the body of the exposure apparatus, connecting wiring and piping, and further performing overall adjustment (electrical adjustment, operation confirmation, and the like). It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

<< Device Manufacturing Method >> Next, an embodiment of a device manufacturing method using the above-described lithography system in a lithography process will be described.

FIG. 16 shows devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads,
The flowchart of the example of manufacture of a micromachine etc. is shown. As shown in FIG.
In 1 (design step), a function / performance design of a device (for example, a circuit design of a semiconductor device) is performed, and a pattern design for realizing the function is performed. Subsequently, in step 202 (mask manufacturing step)
A mask on which the designed circuit pattern is formed is manufactured. On the other hand, in step 203 (wafer manufacturing step)
A wafer is manufactured using a material such as silicon.

Next, in step 204 (wafer processing step), using the mask and the wafer prepared in steps 201 to 203, an actual circuit or the like is formed on the wafer by lithography or the like as described later. . Next, in step 205 (device assembly step), device assembly is performed using the wafer processed in step 204. Step 205 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.

Finally, step 206 (inspection step)
In step, inspections such as an operation confirmation test and a durability test of the device manufactured in step 205 are performed. After these steps, the device is completed and shipped.

FIG. 17 shows a detailed flow example of step 204 in the case of a semiconductor device. In FIG. 17, step 211 (oxidation step)
In, the surface of the wafer is oxidized. Step 212
In the (CVD step), an insulating film is formed on the wafer surface. In step 213 (electrode formation step), electrodes are formed on the wafer by vapor deposition. Step 2
At 14 (ion implantation step), ions are implanted into the wafer. Steps 211 to 214 described above
Each of them constitutes a pre-processing step in each stage of wafer processing, and is selected and executed according to a necessary process in each stage.

In each stage of the wafer process, when the above-mentioned pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step 2
In 15 (resist forming step), a photosensitive agent is applied to the wafer. Subsequently, in step 216 (exposure step), the circuit pattern of the mask is transferred onto the wafer by the lithography system (exposure apparatus) described above. Next, in step 217 (development step), the exposed wafer is developed, and in step 218 (etching step), the exposed members other than the portion where the resist remains are removed by etching. Then, in step 219 (resist removing step), unnecessary resist after etching is removed.

By repeating these pre-processing and post-processing steps, multiple circuit patterns are formed on the wafer.

When the device manufacturing method of the present embodiment described above is used, the lithography system of each of the above embodiments is used in the exposure step (step 216), so that the laser device comprising an ArF excimer laser device, an F ₂ laser device, etc. Since the exposure is performed using the vacuum ultraviolet light output from 14 as illumination light for exposure, exposure with high resolution is possible, and a series of processes of resist coating, exposure, and development can be performed by intrusion of dust and the like into the apparatus. Can be performed efficiently in an environment in which is almost certainly prevented. Therefore, the productivity (including the yield) of a highly integrated device can be improved.

[0208]

As described above, according to the exposure apparatus according to the first, fourth, and fifth aspects of the present invention, a ceiling transport system such as an OHV is used as a transport system on the mask side from the outside to the exposure apparatus. Even if it is adopted, there is an effect that the structure of the mask transport system in the exposure apparatus can be prevented from becoming complicated.

According to the exposure apparatus according to the second and third aspects of the present invention, in addition to the above effects, when the exposure apparatus can be maintained from the front side, the advantage can be effectively utilized. There is an effect that can be.

According to the lithography system according to each of the sixth and seventh aspects of the present invention, even when a ceiling transport system such as an OHV is adopted as a transport system on the mask side with respect to the exposure apparatus from the outside, the lithography system can be used for exposure. There is an effect that the structure of the mask transport system in the apparatus can be prevented from becoming complicated.

Further, according to the lithography system according to each of the inventions of claims 8 to 21, even if a ceiling transport system such as an OHV is adopted as a transport system on the mask side from the outside to the exposure apparatus, the exposure can be performed. The structure of the mask transport system in the apparatus can be prevented from becoming complicated, and the advantage can be effectively utilized when the exposure apparatus can be maintained from the front side.

Further, according to the lithography system of each of the inventions described in claims 22 to 25, the design change of the mask transport system in the exposure apparatus is suppressed as much as possible, and the time required for the entire transport of the mask including the mask replacement is reduced. There is an effect that it can be shortened.

Further, according to the lithography system according to each of the twenty-sixth and twenty-seventh aspects, the effect that the cost of the clean room can be reduced can be obtained.

Further, according to the lithography system of the present invention, it is possible to obtain an effect that high-resolution exposure can be performed.

Further, according to the lithography system of the present invention, a series of processes of resist coating, exposure and development can be efficiently performed in an environment in which dust and the like are almost certainly prevented from entering the apparatus. The effect that the operation can be performed can also be obtained.

According to the device manufacturing method of the present invention, there is an effect that the productivity of a highly integrated device can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a lithography system according to a first embodiment including an exposure apparatus according to the present invention.

FIG. 2 is a plan view of a clean room in which the lithography system of FIG. 1 is installed.

FIG. 3 is a right side view of the lithography system of FIG. 1;

FIG. 4A is a transverse sectional view showing a reticle port housing, and FIG. 4B is a longitudinal sectional view showing a reticle port housing.

5 (A) is a longitudinal sectional view showing a structure of a reticle carrier, and FIG. 5 (B) is a view showing a state where a lid of the reticle carrier of FIG. 5 (A) is removed.

FIG. 6 is a partially omitted horizontal cross-sectional view showing an exposure apparatus main body and a FOUP extension housing connected thereto.

FIG. 7 is a plan view showing an example of a layout when a plurality of lithography systems of FIG. 1 are arranged.

FIG. 8 is a schematic perspective view showing a lithography system according to a second embodiment.

FIG. 9 is a plan view showing the lithography system of FIG. 8;

FIG. 10 is a side view showing the lithography system of FIG. 8;

FIG. 11 is a schematic perspective view showing a lithography system according to a third embodiment.

FIG. 12 is a plan view showing the lithography system of FIG. 11;

FIG. 13 is a side view showing the lithography system of FIG. 11;

FIG. 14A is a plan view showing a lithography system according to a fourth embodiment, and FIG. 14B is a plan view of FIG.
It is a front view showing the lithography system of (A).

FIG. 15A is a plan view showing a lithography system according to a fifth embodiment, and FIG. 15B is a plan view of FIG.
It is a front view showing the lithography system of (A).

FIG. 16 is a flowchart for explaining an embodiment of a manufacturing method for manufacturing a device according to the present invention.

FIG. 17 is a flowchart showing a process in step 204 of FIG. 16;

FIG. 18 is a plan view showing a conventional left-in-line lithography system.

19A is a diagram showing an example of a case where a ceiling transport system is also used on the reticle side in the lithography system of FIG. 18; and FIG. 19B is a diagram showing a case where the lithography system of FIG. FIG. 11 is a diagram showing another example in which a ceiling conveyance system is adopted.

FIG. 20 is a plan view showing a conventional pre-in-line lithography system.

[Explanation of symbols]

Reference Signs List 10: lithography system, 12: exposure apparatus main body (part of exposure apparatus), 14: excimer laser apparatus (laser apparatus, part of exposure apparatus), 16: C / D (substrate processing apparatus), 18: in-line interface Part, 20 ... F
OUP extension housing (substrate container extension housing), 22: reticle port housing (mask transport system housing), 24: FOUP (substrate container), 2
8 OHV (first ceiling transport system), 40 reticle carrier (mask container), 40B lid (door), 42 delivery port, 44 OHV (ceiling transport system, second ceiling transport system), F ... Floor surface, BMU ... Beam matching unit (part of the exposure apparatus), Hw ... First guide rail (first track), Hr ... Second guide rail (track, second track).

Claims (31)

[Claims] 1. An exposure apparatus connected in-line with a substrate processing apparatus to transfer a pattern of a mask onto a substrate via a projection optical system, wherein the substrate processing apparatus has a front surface on one side in the longitudinal direction. The mask can be connected to the side of the projection optical system and connected to the substrate processing apparatus on the side of the optical axis of the projection optical system. An exposure apparatus comprising: a delivery port that is carried in and out while being stored in a mask container to be stored. 2. The exposure apparatus according to claim 1, wherein the other end of an in-line interface unit to which the substrate processing apparatus is connected at one end is connectable. 3. The exposure apparatus according to claim 2, wherein the other end of the in-line interface unit is detachably connectable. 4. The exposure apparatus according to claim 1, wherein at least two mask containers can be arranged in the transfer port along a path of the ceiling transport system. 5. The delivery port is approximately 9 meters from the floor.
The exposure apparatus according to claim 1, wherein the exposure apparatus is provided at a height of 00 mm. 6. An exposure apparatus for transferring a pattern of a mask onto a substrate via a projection optical system; and an exposure apparatus disposed on a front side of the floor on which the exposure apparatus is installed, which is one side in the longitudinal direction of the exposure apparatus. The substrate is connected to the exposure apparatus in-line, and the substrate is moved by a first ceiling transport system that moves along a first trajectory extending in a direction perpendicular to the longitudinal direction of the exposure apparatus on the ceiling. A substrate processing apparatus that is carried in and out while being stored in a substrate container that stores therein, between the optical axis of the projection optical system and the substrate processing apparatus; A transfer port is provided for transferring the mask in and out while the mask is stored in a mask container that stores the mask by a second ceiling transport system that moves along a second track that extends in parallel. Lithograph characterized by the following: System. 7. The lithography system according to claim 6, wherein the exposure apparatus can perform maintenance from at least both sides. 8. The apparatus according to claim 6, further comprising an in-line interface disposed between said exposure apparatus and said substrate processing apparatus and connecting said two.
A lithographic system according to claim 1. 9. A ceiling port having a delivery port which is arranged in parallel with the in-line interface unit and in which the mask is carried in and out while being accommodated in the mask container by the second ceiling transport system. The lithography system according to claim 8, further comprising a mask transport system housing having the mask transport system therein. 10. The lithography system according to claim 6, wherein the transfer port is capable of arranging at least two mask containers in a line along the second track. 11. The lithography system according to claim 6, wherein the transfer port is provided at a height of approximately 900 mm from a floor surface. 12. The apparatus according to claim 9, further comprising a substrate container extension housing disposed adjacent to the mask transport system housing and in parallel with the in-line interface section, and having a substrate container extension port. A lithographic system as described. 13. The mask transport system housing has one surface substantially flush with one side surface of the exposure apparatus,
The lithography system according to claim 9, wherein a port for loading and unloading the mask container is provided on the one surface side. 14. The substrate container extension housing has one surface substantially flush with one side surface of the exposure apparatus and one surface of the mask transport system housing, and an extension port for the substrate container is provided on one surface side. 13. The lithography system according to claim 12, wherein a port for loading and unloading the mask container is provided on the one surface side of the mask transport system housing. 15. The lithography system according to claim 8, further comprising a substrate container extension housing having an extension port of the substrate container, which is arranged in parallel with the in-line interface unit. 16. The substrate container extension housing, wherein one surface thereof is substantially flush with one side surface of the exposure apparatus, and the extension port is provided on one surface side. A lithographic system according to claim 1. 17. The lithography system according to claim 16, wherein a port for loading and unloading the mask container is provided on the one side surface of the exposure apparatus main body. 18. The lithography system according to claim 14, wherein the additional port and the carry-in / out port are provided at positions at the same predetermined height from the floor. . 19. The apparatus according to claim 8, wherein said in-line interface unit is detachable.
A lithographic system according to any one of claims 2 to 18. 20. The lithography system according to claim 9, wherein the mask transport system housing is detachable. 21. The board container extension housing is detachable.
A lithographic system according to claim 6, 22. An exposure apparatus for transferring a pattern of a mask onto a substrate via a projection optical system, and a first apparatus connected in-line to the exposure apparatus and extending in a predetermined direction on a ceiling.
A lithography system comprising: a substrate processing apparatus that is loaded and unloaded in a state where the substrate is stored in a substrate container that stores the substrate by a first ceiling transfer system that moves along a track of The mask is carried in and out while being stored in a mask container that stores the mask by a second ceiling transport system that moves along a second track extending parallel to the first track. A lithography system, wherein a delivery port capable of disposing at least two mask containers along the second track is provided below the second track. 23. The lithography system according to claim 22, wherein the transfer port is provided at a height of approximately 900 mm from the floor. 24. The transfer port according to claim 22, wherein the transfer port is provided in the exposure apparatus.
A lithographic system according to claim 1. 25. The transfer port, wherein the transfer port is provided separately from the exposure apparatus and is provided in a mask transport system housing having a transport system for a mask housed in the mask container therein. A lithographic system according to claim 22 or 23. 26. The lithography system according to claim 6, wherein the substrate container and the mask container are closed containers provided with a door that can be opened and closed. 27. The lithography system according to claim 26, wherein the mask container is a bottom-open type closed container. 28. The lithography system according to claim 6, wherein the exposure apparatus is an exposure apparatus using an ultraviolet pulse laser light source as an exposure light source. 29. The lithography system according to claim 6, wherein the substrate processing apparatus is a coater / developer. 30. A device manufacturing method including a lithography step, wherein the lithography step uses the lithography system according to claim 28 or 29. 31. A device manufactured by the device manufacturing method according to claim 30.