JP2000308964A5 - Sample polishing device and sample polishing method - Google Patents
Sample polishing device and sample polishing method Download PDFInfo
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- JP2000308964A5 JP2000308964A5 JP1999120681A JP12068199A JP2000308964A5 JP 2000308964 A5 JP2000308964 A5 JP 2000308964A5 JP 1999120681 A JP1999120681 A JP 1999120681A JP 12068199 A JP12068199 A JP 12068199A JP 2000308964 A5 JP2000308964 A5 JP 2000308964A5
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- 238000005498 polishing Methods 0.000 title description 71
- 239000000463 material Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
【特許請求の範囲】
【請求項１】 試料保持面を有する保持定盤の前記試料保持面に裏面が保持された平板状の試料の表面を研磨パッドに押付けて研磨する試料研磨装置において、
前記試料保持面は、前記試料の厚さのばらつきを裏面側で吸収する弾性層を略全面に亘って具備することを特徴とする試料研磨装置。
【請求項２】 前記弾性層は、前記試料の裏面と対面する表面に負圧吸引用の吸引路を有する請求項１記載の試料研磨装置。
【請求項３】 試料保持面を有する保持定盤の前記試料保持面に裏面が保持された平板状の試料の表面を研磨パッドに押付けて研磨する試料研磨装置において、
前記試料保持面は、前記試料の厚さのばらつきを裏面側で吸収する弾性層と、
該弾性層に積層され、前記試料の裏面を吸着保持する吸着層と
を具備することを特徴とする試料研磨装置。
【請求項４】 前記吸着層は、前記試料の裏面と対面する表面に負圧吸引用の吸引路を有する合成樹脂板により形成してある請求項３記載の試料研磨装置。
【請求項５】 前記吸着層はバッキングフィルムにより形成してある請求項３記載の試料研磨装置。
【請求項６】 前記バッキングフィルムの前記試料と対面する表面に負圧吸引用の吸引路を形成してある請求項５記載の試料研磨装置。
【請求項７】 前記弾性層はショア硬度が４０以下の材料を用いてなる請求項１乃至請求項６の何れかに記載の試料研磨装置。
【請求項８】 試料研磨装置が有する保持定盤の試料保持面に試料の厚さのばらつきを吸収する弾性層を接合し、
該弾性層の表面に平板状の試料の裏面を対面させて試料を保持し、
試料の表面に研磨パッドを押付けて試料を研磨することを特徴とする試料研磨方法。
[Claims]
1. In a sample polishing apparatus for polishing a flat sample whose back surface is held on the sample holding surface of a holding surface plate having a sample holding surface by pressing it against a polishing pad.
The sample polishing apparatus is characterized in that the sample holding surface is provided with an elastic layer that absorbs variations in the thickness of the sample on the back surface side over substantially the entire surface.
2. The sample polishing apparatus according to claim 1, wherein the elastic layer has a suction path for negative pressure suction on a surface facing the back surface of the sample.
Claim3In a sample polishing device for polishing by pressing the front surface of a flat sample whose back surface is held on the sample holding surface of a holding surface plate having a sample holding surface against a polishing pad.
The sample holding surface includes an elastic layer that absorbs variations in the thickness of the sample on the back surface side.
With an adsorption layer laminated on the elastic layer and adsorbing and holding the back surface of the sample
A sample polishing device, characterized in that it is provided with.
Claim4The adsorption layer is formed of a synthetic resin plate having a suction path for negative pressure suction on the surface facing the back surface of the sample.RequestThe sample polishing apparatus according to claim 3.
Claim5The adsorption layer is formed of a backing film.RequestThe sample polishing apparatus according to claim 3.
6. The sample polishing apparatus according to claim 5, wherein a suction path for negative pressure suction is formed on the surface of the backing film facing the sample.
Claim71. The elastic layer is made of a material having a shore hardness of 40 or less.To any of claims 6.The sample polishing device described.
8. An elastic layer that absorbs variations in sample thickness is joined to the sample holding surface of the holding surface plate of the sample polishing device.
The back surface of the flat sample is made to face the surface of the elastic layer to hold the sample.
A sample polishing method characterized by pressing a polishing pad against the surface of a sample to polish the sample.
【０００１】
【発明の属する技術分野】
本発明は、半導体基板等の平板状の試料を研磨する試料研磨装置及び試料研磨方法に関し、更に詳しくは、前記試料の裏面を保持し、表面を研磨パッドに押付ける保持定盤における試料保持面部分の構成に関する。
[0001]
[Technical field to which the invention belongs]
The present invention relates to a sample polishing device and a sample polishing method for polishing a flat sample such as a semiconductor substrate. More specifically, the sample holding surface in a holding surface plate that holds the back surface of the sample and presses the front surface against a polishing pad. Regarding the composition of parts.
本発明は斯かる事情に鑑みてなされたものであり、保持定盤の試料保持面に、試料の厚さのばらつきを裏面側で吸収する弾性層を略全面に亘って設けることにより、試料の厚さのばらつきを弾性層によって吸収し、研磨するとき試料の表面に加わる押圧力のばらつきを小さくし、試料の研磨量の均一性を良好にすることができる試料研磨装置を提供することを目的とし、また、前記試料保持面に、試料の厚さのばらつきを裏面側で吸収する弾性層と、該弾性層に積層され、前記試料の裏面を吸着保持する吸着層とを設けることにより、試料の研磨量の均一性を良好にできるとともに、試料の吸着保持性を良好にすることができる試料研磨装置及び試料研磨方法を提供することを目的とする。 The present invention has been made in view of such circumstances, and by providing an elastic layer for absorbing variations in sample thickness on the back surface side on the sample holding surface of the holding platen, the sample can be prepared over substantially the entire surface. It is an object of the present invention to provide a sample polishing apparatus capable of absorbing the variation in thickness by an elastic layer, reducing the variation in the pressing force applied to the surface of the sample during polishing, and improving the uniformity of the polishing amount of the sample. Further, by providing the sample holding surface with an elastic layer that absorbs the variation in the thickness of the sample on the back surface side and an adsorption layer that is laminated on the elastic layer and holds the back surface of the sample by adsorption. It is an object of the present invention to provide a sample polishing apparatus and a sample polishing method capable of improving the uniformity of the polishing amount of the sample and improving the adsorption and holding property of the sample.
【００１４】
【課題を解決するための手段】
本発明に係る試料研磨装置は、試料保持面を有する保持定盤の前記試料保持面に裏面が保持された平板状の試料の表面を研磨パッドに押付けて研磨する試料研磨装置において、前記試料保持面は、前記試料の厚さのばらつきを裏面側で吸収する弾性層を略全面に亘って具備することを特徴とする。
本発明に係る試料研磨装置は、前記弾性層は、前記試料の裏面と対面する表面に負圧吸引用の吸引路を有することを特徴とする。
0014.
[Means for solving problems]
The sample polishing apparatus according to the present invention is a sample polishing apparatus for polishing a flat sample whose back surface is held on the sample holding surface of a holding platen having a sample holding surface by pressing it against a polishing pad. The surface is characterized by having an elastic layer that absorbs variations in the thickness of the sample on the back surface side over substantially the entire surface.
The sample polishing apparatus according to the present invention is characterized in that the elastic layer has a suction path for negative pressure suction on the surface facing the back surface of the sample.
本発明に係る試料研磨装置は、試料保持面を有する保持定盤の前記試料保持面に裏面が保持された平板状の試料の表面を研磨パッドに押付けて研磨する試料研磨装置において、前記試料保持面は、前記試料の厚さのばらつきを裏面側で吸収する弾性層と、該弾性層に積層され、前記試料の裏面を吸着保持する吸着層とを具備することを特徴とする。The sample polishing apparatus according to the present invention is a sample polishing apparatus for polishing a flat sample whose back surface is held on the sample holding surface of a holding platen having a sample holding surface by pressing it against a polishing pad. The surface is characterized by including an elastic layer that absorbs variations in the thickness of the sample on the back surface side, and an adsorption layer that is laminated on the elastic layer and holds the back surface of the sample by adsorption.
本発明に係る試料研磨装置は、前記吸着層は、前記試料の裏面と対面する表面に負圧吸引用の吸引路を有する合成樹脂板により形成してあることを特徴とする。
本発明に係る試料研磨装置は、前記吸着層はバッキングフィルムにより形成してあることを特徴とする。
The sample polishing apparatus according to the present invention is characterized in that the adsorption layer is formed of a synthetic resin plate having a suction path for negative pressure suction on the surface facing the back surface of the sample .
The sample polishing apparatus according to the present invention is characterized in that the adsorption layer is formed of a backing film.
本発明に係る試料研磨装置は、前記バッキングフィルムの前記試料と対面する表面に負圧吸引用の吸引路を形成してあることを特徴とする。The sample polishing apparatus according to the present invention is characterized in that a suction path for negative pressure suction is formed on the surface of the backing film facing the sample.
本発明に係る試料研磨装置は、前記弾性層はショア硬度が４０以下の材料を用いてなることを特徴とする。 The sample polishing apparatus according to the present invention is characterized in that the elastic layer is made of a material having a shore hardness of 40 or less.
本発明に係る試料研磨方法は、試料研磨装置が有する保持定盤の試料保持面に試料の厚さのばらつきを吸収する弾性層を接合し、該弾性層の表面に平板状の試料の裏面を対面させて試料を保持し、試料の表面に研磨パッドを押付けて試料を研磨することを特徴とする。In the sample polishing method according to the present invention, an elastic layer that absorbs variations in sample thickness is bonded to the sample holding surface of the holding platen of the sample polishing device, and the back surface of the flat sample is formed on the surface of the elastic layer. It is characterized in that the sample is held face-to-face and a polishing pad is pressed against the surface of the sample to polish the sample.
本発明にあっては、平板状の試料の厚さのばらつきを吸収する弾性層に試料の裏面を全面に亘って対面させ、該試料を全面に亘って弾性層に弾性的に保持させることができるため、試料の表面を研磨パッドに押付けて研磨するとき、試料の厚さのばらつきに見合って弾性層が撓み、試料は研磨パッドと接触する表面が研磨パッドの表面に沿って平坦状に倣いながら変形し、試料の表面に加わる押圧力のばらつきを小さくでき、この押圧力のばらつきが小さい状態で試料を研磨することができる。従って、試料の表面を全面に亘ってほぼ均一の研磨量で研磨することができ、試料の研磨量の均一性を良好にすることができる。In the present invention, the back surface of the sample is faced with an elastic layer that absorbs the variation in the thickness of the flat sample over the entire surface, and the sample is elastically held by the elastic layer over the entire surface. Therefore, when the surface of the sample is pressed against the polishing pad for polishing, the elastic layer bends according to the variation in the thickness of the sample, and the surface of the sample in contact with the polishing pad follows the surface of the polishing pad in a flat shape. However, it is deformed and the variation in the pressing force applied to the surface of the sample can be reduced, and the sample can be polished in a state where the variation in the pressing force is small. Therefore, the surface of the sample can be polished with a substantially uniform polishing amount over the entire surface, and the uniformity of the polishing amount of the sample can be improved.
本発明にあっては、試料の裏面を吸着層に対面させて試料を良好に吸着することができ、しかも、吸着層は試料の厚さのばらつきを裏面側で吸収する弾性層に積層されているため、試料の表面を研磨パッドに押付けて研磨するとき、試料の厚さのばらつきに見合って弾性層が撓み、試料は研磨パッドと接触する表面が研磨パッドの表面に沿って平坦状に倣いながら変形することができる。その結果、試料の表面に加わる押圧力のばらつきを小さくでき、この押圧力のばらつきが小さい状態で試料を研磨することができる。従って、試料の表面を全面に亘ってほぼ均一の厚さに研磨することができ、試料の研磨量の均一性を良好にすることができる。In the present invention, the back surface of the sample is made to face the adsorption layer so that the sample can be adsorbed satisfactorily, and the adsorption layer is laminated on the elastic layer that absorbs the variation in the thickness of the sample on the back surface side. Therefore, when the surface of the sample is pressed against the polishing pad for polishing, the elastic layer bends in accordance with the variation in the thickness of the sample, and the surface of the sample in contact with the polishing pad follows the surface of the polishing pad in a flat shape. It can be transformed while. As a result, the variation in the pressing force applied to the surface of the sample can be reduced, and the sample can be polished in a state where the variation in the pressing force is small. Therefore, the surface of the sample can be polished to a substantially uniform thickness over the entire surface, and the uniformity of the polishing amount of the sample can be improved.
本発明にあっては、試料が弾性層に直接接触しないため、弾性層のショア硬度を例えば３０以下に小さくし、研磨量の均一性をより良好にした場合における弾性層の耐久性を高めることができる。また試料の吸着層を弾性層に比べて硬質な材料で形成できるため、吸着層の表面に負圧吸引用の溝や孔を設けたとしても、弾性層に設ける場合に比べて、この溝や孔の周辺部の変形による試料の引き込まれ現象を抑えることができる。その結果、この試料の引き込まれによる均一性悪化の問題の発生を抑えることができる。これは、弾性層のショア高度が３０以下と小さい場合、特に有効である。 In the present invention, since the sample does not come into direct contact with the elastic layer, the shore hardness of the elastic layer is reduced to, for example, 30 or less, and the durability of the elastic layer is enhanced when the uniformity of the polishing amount is improved. Can be done. Further, since the adsorption layer of the sample can be formed of a material harder than the elastic layer, even if a groove or a hole for negative pressure suction is provided on the surface of the adsorption layer, the groove or the hole is compared with the case where the groove or the hole is provided in the elastic layer. It is possible to suppress the phenomenon of sample drawing due to deformation of the peripheral portion of the hole. As a result, it is possible to suppress the occurrence of the problem of deterioration of uniformity due to the drawing of this sample. This is particularly effective when the shore altitude of the elastic layer is as small as 30 or less.
本発明にあっては、バッキングフィルムによる吸着力及び負圧吸引力によって試料を吸着することができるため、バッキングフィルムによる吸着力によって吸着するだけの場合に比較して試料Ｗの吸着力を高くすることができる。In the present invention, since the sample can be adsorbed by the suction force of the backing film and the negative pressure suction force, the suction force of the sample W is increased as compared with the case where the sample is simply adsorbed by the suction force of the backing film. be able to.
本発明にあっては、弾性層のショア硬度を４０とすることによって試料の研磨量の均一性を９．６％に改善でき、また、ショア硬度を３０とすることによって前記均一性を８．６％に改善でき、さらに、ショア硬度を２０とすることによって前記均一性を７．３％に改善でき、ショア硬度を小さくすることによって前記均一性をより一層良好にできるのであるが、弾性層のショア硬度が例えば５０である場合、試料の研磨量の均一性は２２％であり、ショア硬度が４０を超えるのは好ましくない。 In the present invention, the uniformity of the polishing amount of the sample can be improved to 9.6% by setting the shore hardness of the elastic layer to 40, and the uniformity can be improved to 8. by setting the shore hardness to 30. The uniformity can be improved to 6%, the uniformity can be improved to 7.3% by setting the shore hardness to 20, and the uniformity can be further improved by reducing the shore hardness. When the shore hardness of the sample is, for example, 50, the uniformity of the polishing amount of the sample is 22%, and it is not preferable that the shore hardness exceeds 40.
【００５０】
【発明の効果】
以上詳述した如く本発明によれば、試料の厚さのばらつきを吸収する弾性層に試料の裏面を全面に亘って対面させ、該試料を全面に亘って弾性層に弾性的に保持させることができるため、試料の表面を研磨パッドに押付けて研磨するとき、前記試料の厚さのばらつきを前記弾性層によって良好に吸収でき、研磨するとき試料の表面に加わる押圧力のばらつきを小さくでき、試料の研磨量の均一性を良好にすることができる。
0050
【Effect of the invention】
As described in detail above , according to the present invention, the back surface of the sample is made to face the elastic layer that absorbs the variation in the thickness of the sample over the entire surface, and the sample is elastically held by the elastic layer over the entire surface. Therefore, when the surface of the sample is pressed against the polishing pad for polishing, the variation in the thickness of the sample can be satisfactorily absorbed by the elastic layer, and the variation in the pressing force applied to the surface of the sample during polishing can be reduced. The uniformity of the polishing amount of the sample can be improved.
本発明によれば、試料の裏面を吸着層に対面させて試料を良好に吸着することができ、しかも、吸着層は試料の厚さのばらつきを裏面側で吸収する弾性層に積層されているため、試料の表面を研磨パッドに押付けて研磨するとき、前記試料の厚さのばらつきを前記弾性層によって良好に吸収でき、研磨するとき試料の表面に加わる押圧力のばらつきを小さくでき、試料の研磨量の均一性を良好にすることができる。 According to the present invention, the back surface of the sample can be made to face the adsorption layer to satisfactorily adsorb the sample, and the adsorption layer is laminated on the elastic layer that absorbs the variation in the thickness of the sample on the back surface side. Therefore, when the surface of the sample is pressed against the polishing pad for polishing, the variation in the thickness of the sample can be satisfactorily absorbed by the elastic layer, and the variation in the pressing force applied to the surface of the sample during polishing can be reduced. The uniformity of the polishing amount can be improved.
本発明によれば、ショア硬度が４０以下の比較的軟質の材料が試料を保持するため、試料の表面を研磨パッドに押付けて研磨するとき、前記試料の厚さのばらつきを前記材料によってより一層良好に吸収でき、研磨するとき試料の表面に加わる押圧力のばらつきをより一層小さくでき、試料の研磨量の均一性をより一層良好にすることができる。 According to the present invention, since a relatively soft material having a shore hardness of 40 or less holds the sample, when the surface of the sample is pressed against a polishing pad for polishing, the variation in the thickness of the sample is further increased by the material. It can be absorbed well, the variation of the pressing force applied to the surface of the sample during polishing can be further reduced, and the uniformity of the polishing amount of the sample can be further improved.
本発明によれば、試料が弾性層に直接接触しないため、弾性層のショア硬度を例えば３０以下に小さくし、研磨量の均一性をより良好にした場合における弾性層の耐久性を高めることができる。 According to the present invention, since the sample does not come into direct contact with the elastic layer, the shore hardness of the elastic layer can be reduced to, for example, 30 or less, and the durability of the elastic layer can be improved when the uniformity of the polishing amount is improved. it can.
本発明によれば、バッキングフィルムによる吸着力及び負圧吸引力によって試料Ｗを吸着することができるため、バッキングフィルムの吸着力によって吸着するだけの場合に比較して試料の吸着力を高くすることができる。 According to the present invention, since the sample W can be adsorbed by the suction force of the backing film and the negative pressure suction force, the suction force of the sample is increased as compared with the case where the sample W is only adsorbed by the suction force of the backing film. Can be done.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12068199A JP2000308964A (en) | 1999-04-27 | 1999-04-27 | Sample polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12068199A JP2000308964A (en) | 1999-04-27 | 1999-04-27 | Sample polishing device |
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| Publication Number | Publication Date |
|---|---|
| JP2000308964A JP2000308964A (en) | 2000-11-07 |
| JP2000308964A5 true JP2000308964A5 (en) | 2005-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12068199A Pending JP2000308964A (en) | 1999-04-27 | 1999-04-27 | Sample polishing device |
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| JP (1) | JP2000308964A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102607586B1 (en) * | 2018-11-05 | 2023-11-30 | 삼성디스플레이 주식회사 | Substrate supportiong device and method of polishing substrate using the same |
-
1999
- 1999-04-27 JP JP12068199A patent/JP2000308964A/en active Pending
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