JPS63144954A - Plane polishing device - Google Patents

Plane polishing device

Info

Publication number
JPS63144954A
JPS63144954A JP61292213A JP29221386A JPS63144954A JP S63144954 A JPS63144954 A JP S63144954A JP 61292213 A JP61292213 A JP 61292213A JP 29221386 A JP29221386 A JP 29221386A JP S63144954 A JPS63144954 A JP S63144954A
Authority
JP
Japan
Prior art keywords
work
pressure
pressure fluid
pressure head
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP61292213A
Other languages
Japanese (ja)
Other versions
JPH0767665B2 (en
Inventor
Seiichi Maeda
Hatsuyuki Arai
Isao Nagahashi
Shiyunji Hakomori
Original Assignee
Speedfam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Co Ltd filed Critical Speedfam Co Ltd
Priority to JP61292213A priority Critical patent/JPH0767665B2/en
Publication of JPS63144954A publication Critical patent/JPS63144954A/en
Publication of JPH0767665B2 publication Critical patent/JPH0767665B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To make applied force act on a work back uniformly so as to improve finished flatness by laying pressure fluid, as pressure fluid, between a pressure head and a work, in a plane polishing device such as semiconductor wafer, etc. CONSTITUTION:A work 12 engaged with the step part 16a of a work holder 16 is absorbed and held by vacuum suction through a suction hole 20 and a tube 24 and pressed against a surface board 10 which rotates and polished. Then, pressure fluid from a tube 27 and a port 14 is supplied and filled up in space 30 between a pressure head 11 and a work 12, pressing the work 12 against the surface board 10 with uniform surface pressure. This work holder 6 is never applied with biased, since so supported as to be free in rocking by the pressure head 11 through a diaphragm 17, and further the sealing effect of a seal member 18 is improved too, and flapping at the peripheral part of the work can be prevented. In this way, the work can be finished into high flatness and there is no fear of dirty and injury attaching to the back of the work.
JP61292213A 1986-12-08 1986-12-08 Flat polishing machine Expired - Fee Related JPH0767665B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61292213A JPH0767665B2 (en) 1986-12-08 1986-12-08 Flat polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61292213A JPH0767665B2 (en) 1986-12-08 1986-12-08 Flat polishing machine

Publications (2)

Publication Number Publication Date
JPS63144954A true JPS63144954A (en) 1988-06-17
JPH0767665B2 JPH0767665B2 (en) 1995-07-26

Family

ID=17778979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61292213A Expired - Fee Related JPH0767665B2 (en) 1986-12-08 1986-12-08 Flat polishing machine

Country Status (1)

Country Link
JP (1) JPH0767665B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232159A (en) * 1989-03-03 1990-09-14 Speedfam Co Ltd Method and device for surface polishing
JPH02243263A (en) * 1989-03-16 1990-09-27 Hitachi Ltd Polishing device
JPH08267357A (en) * 1995-03-31 1996-10-15 Nec Corp Abrasive device of substrate and abrasive method thereof
JPH08339979A (en) * 1995-04-10 1996-12-24 Matsushita Electric Ind Co Ltd Holder for substrate to be polished and polishing method for substrate
US5791973A (en) * 1995-04-10 1998-08-11 Matsushita Electric Industrial Co., Ltd. Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
GB2336555B (en) * 1998-04-20 2000-08-30 Nec Corp Polishing apparatus
US7101261B2 (en) 1995-06-09 2006-09-05 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444299A (en) * 1977-09-13 1979-04-07 Uingoo Kk Grinding method and apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444299A (en) * 1977-09-13 1979-04-07 Uingoo Kk Grinding method and apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232159A (en) * 1989-03-03 1990-09-14 Speedfam Co Ltd Method and device for surface polishing
JPH02243263A (en) * 1989-03-16 1990-09-27 Hitachi Ltd Polishing device
JPH08267357A (en) * 1995-03-31 1996-10-15 Nec Corp Abrasive device of substrate and abrasive method thereof
JPH08339979A (en) * 1995-04-10 1996-12-24 Matsushita Electric Ind Co Ltd Holder for substrate to be polished and polishing method for substrate
US5791973A (en) * 1995-04-10 1998-08-11 Matsushita Electric Industrial Co., Ltd. Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
US5921853A (en) * 1995-04-10 1999-07-13 Matsushita Electric Industrial Co., Ltd. Apparatus for polishing substrate using resin film or multilayer polishing pad
US7101261B2 (en) 1995-06-09 2006-09-05 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
GB2336555B (en) * 1998-04-20 2000-08-30 Nec Corp Polishing apparatus

Also Published As

Publication number Publication date
JPH0767665B2 (en) 1995-07-26

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Legal Events

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