JP2000306935A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an inexpensive resin-sealed semiconductor device by omitting a cutting step after resin sealing. SOLUTION: Bumps 4 are formed at pad parts 3, which are input/output terminals of a semiconductor element 2. The bumps 4 are made of a metallic material, such as gold or solder. Then, a lead terminal 5 formed in a slender plate-like form is electrically connected to each pad part 3 via the corresponding bump 4. The terminal 5 is formed of a highly conductive metallic material with some degree of rigidity, such as steel and Fe-Ni alloys, for example. Then, the semiconductor element 2 and the base end of each lead terminal 5 are molded with a sealing resin 6 to obtain a prescribed semiconductor device 1. A thermosetting resin material is used as the sealing resin 6. As a last step, the terminals 5 are molded and a prescribed mark is given to the surface of the sealed resin 6, as necessary, to thereby obtain the semiconductor device 1 as a finished product.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a structure of a semiconductor device in which a semiconductor element and a lead terminal connected to a pad portion of the semiconductor element are integrally resin-sealed, and to a method of manufacturing the semiconductor device. In particular, the present invention relates to a configuration of the lead terminal and a method for connecting to a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, a semiconductor element and a lead terminal connected to a pad portion of the semiconductor element are integrally resin-sealed to protect the semiconductor element from an external environment and to connect or connect the semiconductor element to a printed circuit board. 2. Description of the Related Art Semiconductor devices that facilitate mounting are widely known. As a method for manufacturing this type of semiconductor device, for example, as described in “ASIC Packaging Technology Handbook”, pp. 296 to 320, after bonding a semiconductor element to a lead frame, the semiconductor element is bonded. The mainstream method is to introduce a lead frame into a heating mold, seal the periphery of the semiconductor element with a thermosetting resin, and then cut unnecessary parts of the lead frame to obtain a semiconductor device of the desired shape. It has become.

FIGS. 5 and 6 show a structure of a general lead frame which has been conventionally known, and a manufacturing process of a semiconductor device using the lead frame.

[0005] As shown in FIG. 5, the lead frame 7 of the present embodiment is formed in a strip shape, and the setting portions 115 of the semiconductor elements are formed at equal intervals along the longitudinal direction of the lead frame 8. A tab 10 for mounting a semiconductor element is formed at the center of each setting section 115 via a tab suspension lead 11, and a required number of inner leads 1 are formed around the tab.
2 and an outer lead 13 subsequent thereto are formed in a predetermined arrangement via a tie bar 14. Further, the lead frame 8 has a transfer round hole 116 for engaging a transfer pin (not shown) when the lead frame 7 is transferred in the longitudinal direction, and a setting part 115 required for each process. A positioning slot 9 for fixing to a mold or the like is provided.

The manufacture of a semiconductor device is performed through the steps shown in FIG. That is, a required semiconductor element is obtained by dicing a wafer manufactured according to a conventional method (procedure S1).
This semiconductor element is die-bonded to the semiconductor element setting section 115 of the lead frame 7 via an adhesive (procedure S
2). The pad portion of the die-bonded semiconductor element and the inner lead 12 are wire-bonded with a gold wire (step S3). The lead frame 7 to which the semiconductor element is wire-bonded is sequentially introduced into the mold, the semiconductor element and the inner lead 12 are sealed with resin, and the semiconductor element is shut off from the outside air (step S4). Next, outer lead 1
After performing the solder plating (procedure S5) and the required marking on the sealing resin surface (procedure S6), unnecessary lead portions are cut and the required outer leads 13 are formed (procedure S7). Finally, select good products from among the products,
A required semiconductor device is obtained (procedure S8).

[0006]

As described above, according to the conventional method of manufacturing a semiconductor device, the lead frame 8 or the tab suspension lead 1 which becomes unnecessary after the completion of the semiconductor device.
(1) Since the tie bars 14 and the like must be formed on the lead frame 7, the member cost of the lead frame 7 becomes high. Further, since equipment and steps for cutting unnecessary portions of the lead frame 7 are required, it is unavoidable to enlarge the manufacturing equipment and complicate the manufacturing process. As a result, there is a problem that the manufacturing cost of the semiconductor device becomes expensive.

SUMMARY OF THE INVENTION The present invention has been made to solve the above deficiencies of the prior art, and has as its object to provide an inexpensive resin-sealed semiconductor device in which a cutting step after resin sealing is omitted. Is to do.

[0008]

In order to solve the above-mentioned problems, the present invention relates to a method of manufacturing a semiconductor device, in which a step of individually connecting a linear or plate-like lead terminal to each pad portion of a semiconductor element. And enclosing the semiconductor element to which the lead terminal is connected in a cavity of a mold, and sealing the periphery of the semiconductor element including a part of the lead terminal with a resin. The configuration is such that a predetermined semiconductor device is obtained without cutting the lead terminals.

In order to facilitate connection of the lead terminals, it is preferable that bumps are provided on each pad portion of the semiconductor element prior to connection of the lead terminals.

When the semiconductor element is sealed with a resin, the mold includes a fixed mold and a movable mold in order to prevent the sealing resin from adhering to the tip of the lead terminal. Using a mold provided with a recess for accommodating the lead terminal on the mating surface of the two molds, accommodating the semiconductor element and the base end of the lead terminal in the cavity of the mold, and It is particularly preferable that the tip of the lead terminal is housed in the recess and the semiconductor element is sealed with resin.

On the other hand, with respect to the configuration of the semiconductor device, a step of setting a bump on a pad portion of a semiconductor element, a step of individually connecting a linear or plate-shaped lead terminal for each bump, and a step of connecting the lead terminal The obtained semiconductor element is housed in a cavity of a mold, and a step of sealing the periphery of the semiconductor element including a part of the lead terminal with resin is performed. The structure was obtained without performing.

When a linear or plate-like lead terminal is individually connected to each pad portion formed on the semiconductor element, an expensive lead frame frame, tab suspension lead, tie bar, etc., which become unnecessary after completion of the semiconductor device, are provided. It is not necessary to use a suitable lead frame, and it is not necessary to cut the lead frame after sealing the periphery of the semiconductor element with resin, so that a required semiconductor device can be manufactured at low cost.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a semiconductor device and a method of manufacturing the same according to the present invention will be described with reference to FIGS. FIG. 1 is a table showing a manufacturing process of the semiconductor device according to the embodiment, and FIG. 2 is an explanatory diagram showing a resin molding method of the semiconductor device according to the embodiment. In addition,
FIG. 1A is a perspective view of a semiconductor element on which bumps are formed and a cross-sectional view of the semiconductor element cut along a cutting plane AA. FIG. 1B is a perspective view of a semiconductor element to which lead terminals are connected. And a cross-sectional view of the semiconductor element cut along the AA cutting plane,
FIG. 1C is a perspective view of the semiconductor device after resin sealing and AA
A cross-sectional view of the semiconductor device taken along a cut surface is displayed.

In manufacturing the semiconductor device 1 of the present embodiment, as shown in FIG. 1A, first, bumps 4 are formed on pad portions 3 which are input / output terminals of a semiconductor element 2. The bump 4 can be formed using a metal material such as gold or solder.

Next, as shown in FIG. 1B, an elongated plate-shaped lead terminal 5 is electrically connected to each pad portion 3 via the bump 4. The lead terminal 5 is formed of a highly conductive metal material having a certain degree of rigidity, such as copper or an Fe—Ni alloy. Also,
The connection of the lead terminal 5 to the bump 4 can be performed by means such as ultrasonic bonding or thermocompression bonding.

Next, as shown in FIG. 1C, the semiconductor element 2 and the base end of the lead terminal 5 are molded with a sealing resin 6 to obtain a completed semiconductor device 1. Sealing resin 6
Any resin material can be used if necessary.However, since it has high rigidity and excellent electrical insulation, and also has excellent water resistance, for example, a thermosetting resin material such as an epoxy resin It is particularly preferred to use In addition, similarly to the semiconductor device according to the conventional example, it is of course possible to form the lead terminal 5 into a required shape or to display a required mark on the surface of the sealing resin 6 after resin sealing. .

The resin sealing of the semiconductor element 2 can be performed using a mold 15 shown in FIG. As shown in FIGS. 2 (b) and 2 (c), the molding die of the present embodiment is composed of a fixed die 16 and a movable die 17, and the mating surfaces of these two dies 16 and 17 have , Sealing resin 6 of required shape
Is formed. The movable die 17 is formed with a lead terminal housing recess 18 for housing the front end of the lead terminal 5 connected to the semiconductor element 2. The semiconductor device 1 having a protruding portion can be molded. In addition, the mold 1 of this example
5, as shown in FIG. 2A, eight mold cavities 22 are formed, and each mold cavity 22 is communicated via a pot portion 19, a runner 20 and a gate 21. , So that eight semiconductor devices can be formed at the same time.

When the semiconductor element 2 is sealed with a resin, first, as shown in FIGS. 2A and 2B, the semiconductor element 2 is housed in a cavity 16a formed in a movable mold 17 and the semiconductor element 2 is sealed. The tip of the lead terminal 5 connected to the element 2 is housed in the lead terminal housing recess 18. Next, the movable mold 17 is raised to couple the fixed mold 16 and the movable mold 17 as shown in FIGS. 2B and 2C, and the pot is placed in the mold cavity 22 formed thereby. The resin supplied through the part 19, the runner 20, and the gate 21 is injected at a high pressure to form the sealing resin 6 having a predetermined shape. Finally, the movable mold 17 is lowered to take out the molded product, and the required semiconductor device 1 is obtained.

According to the manufacturing method of the present embodiment, the lead terminals 5 formed in an elongated plate shape are connected to each of the pad portions 3 provided on the semiconductor element 2, so that the lead frame frame, the tab suspension leads and the like are connected. It is not necessary to use an expensive lead frame having a tie bar or the like, and the cutting process of the lead frame after the resin sealing of the semiconductor element 2 can be omitted, so that the manufacturing cost of the semiconductor device 1 can be reduced. In addition, since the lead terminal housing recess 18 is formed in the mold 15 and the tip of the lead terminal 5 is housed in the recess 18 to mold the sealing resin 6, the tip of the lead terminal 5 is formed. The semiconductor device having a predetermined shape exposed from the side surface of the sealing resin 6 can be easily formed, and the manufacturing cost of the semiconductor device 1 can be reduced from this point as well.

In this embodiment, the lead terminal housing recess 18 is formed only in the movable mold 17. However, the lead terminal housing recess 18 having a predetermined shape is divided into both the fixed mold 16 and the movable mold 17. Of course, it is also possible to form.

Next, a second embodiment of the semiconductor device according to the present invention will be described with reference to FIG. FIG. 3 is a perspective view and a sectional view of the semiconductor device according to the present embodiment.

The semiconductor device 1 of this embodiment is similar to that of FIG.
As apparent from (b), the pad portion 3 of the semiconductor element 2
Instead of connecting the elongated plate-shaped lead terminals 5 via the bumps 4, metal wires 23 are directly connected to the pad portions 3. The metal wire 23 can be formed of a highly conductive metal material such as gold or aluminum, and a connection method using a wire bonding technique can be used as a method for connecting to the pad portion 3.

The semiconductor device 1 of this embodiment has the same effects as those of the semiconductor device of the first embodiment. In addition, since the metal wire 23 is directly connected to the pad portion 3 of the semiconductor element 2, the bump to the pad portion 3 4 and the production of the plate-like lead terminal 5 and the connection of the lead terminal to the bump 4 can be omitted, and the production of the required semiconductor device 1 can be further facilitated, and the production cost can be reduced. be able to.

The semiconductor device 1 of the present invention can be mounted or mounted on a printed circuit board in the same manner as a normal package type IC chip. You can also. FIG. 4 shows a semiconductor device 1 according to the present invention,
FIG. 4 is a partially cut plan view showing a case where the present invention is applied to a C card, and an antenna coil 27 is connected to a lead terminal 5 or a metal wire 23 of the semiconductor device 1 to produce a semiconductor module 25 having required communication characteristics; Semiconductor module 25
Is embedded in a base 26 formed in a card shape having a predetermined size to form a non-contact IC card 24. A winding can be used as the antenna coil 27, and the antenna coil 27 is connected to the lead terminal 5 or the metal wire 23 by means such as wedge bonding, solder connection, welding, or conductive paste connection.

As described above, when the non-contact IC card 24 is manufactured using the semiconductor device 1 of the present invention, the semiconductor device 1 itself is inexpensive.
Can be manufactured at low cost.

[0026]

According to the first aspect of the present invention, a plate-like or linear lead terminal is connected to each pad portion provided on the semiconductor element, so that a lead frame frame, a tab suspension lead and a tie bar are provided. It is not necessary to use an expensive lead frame provided with a semiconductor device and the like, and cutting of the lead frame after resin sealing of the semiconductor element can be omitted, so that the manufacturing cost of the semiconductor device can be reduced.

According to the second aspect of the present invention, since bumps are provided on each pad portion of the semiconductor element prior to connection of the lead terminal, connection of the lead terminal to each pad portion can be facilitated. The manufacturing cost of the device can be further reduced.

According to the third aspect of the present invention, the lead terminal receiving recess is formed in the mold, and the leading end of the lead terminal is received in the recess to mold the sealing resin. A semiconductor device having a predetermined shape whose portion is exposed from the side surface of the sealing resin can be easily formed, and the manufacturing cost of the semiconductor device can be reduced.

According to a fourth aspect of the present invention, there is provided a semiconductor device comprising: a step of providing a bump on a pad portion of a semiconductor element; a step of individually connecting a linear or plate-shaped lead terminal for each of the bumps; The obtained semiconductor device is housed in a cavity of a mold, and is manufactured through a step of sealing the periphery of the semiconductor element including a part of the lead terminal with a resin. It is not necessary to use an expensive lead frame provided with a tie bar or the like, and the cutting process of the lead frame after resin sealing of the semiconductor element can be omitted, so that the manufacturing cost of the semiconductor device can be reduced.

[Brief description of the drawings]

FIG. 1 is a table showing a manufacturing process of a semiconductor device according to a first embodiment.

FIG. 2 is an explanatory diagram illustrating a resin molding method of the semiconductor device according to the first embodiment.

FIG. 3 is a perspective view and a cross-sectional view of a semiconductor device according to a second embodiment.

FIG. 4 is a non-contact IC mounted with a semiconductor device according to the present invention.
It is the top view which cut a part of card.

FIG. 5 is a configuration diagram of a conventionally known general lead frame.

FIG. 6 is a flowchart showing a manufacturing process of a semiconductor device using a conventionally known general lead frame.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Semiconductor element 3 Pad part 4 Bump 5 Lead terminal 6 Sealing resin 15 Mold die 16 Fixed die 17 Movable die 18 Lead terminal storage concave part 22 Mold cavity 23 Metal wire 24 Non-contact IC card 25 Semiconductor module 26 Base 27 Antenna coil

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/50 H01L 23/50 U // B29L 31:34 (72) Inventor Isamu Yoshida Totsuka, Yokohama-shi, Kanagawa 292, Yoshida-cho, Ward, Tokyo Hitachi, Ltd. Production Technology Research Laboratories (72) Inventor Yasuo Amano 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture F-term in Hitachi, Ltd. Production Technology Research Lab. CB01 CB12 4F206 AA39 AD19 AH37 JA02 JB17 4M109 AA01 BA01 CA21 FA01 5F061 AA01 BA01 CA21 5F067 AA00 BA01 BA06 BB19 BE10 DE01

Claims (4)

[Claims] 1. A step of individually connecting a linear or plate-like lead terminal to each pad portion of a semiconductor element, storing the semiconductor element to which the lead terminal is connected in a cavity of a molding die, and Sealing the periphery of the semiconductor element including a part of the terminal with a resin, and obtaining a predetermined semiconductor device without cutting the lead terminal after the resin sealing. . 2. The method for manufacturing a semiconductor device according to claim 1, wherein prior to connection of said lead terminals, bumps are provided on each pad portion of said semiconductor element. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the mold comprises a fixed mold and a movable mold, and a recess for accommodating the lead terminal is formed on a mating surface of the two molds. Using the provided one, the semiconductor element and the base end of the lead terminal are housed in the cavity of the molding die, and the tip end of the lead terminal is housed in the housing recess. A method for manufacturing a semiconductor device, comprising sealing an element with a resin. 4. A step of placing a bump on a pad portion of a semiconductor element, a step of individually connecting a linear or plate-like lead terminal for each of the bumps, and a step of forming a semiconductor element to which the lead terminal is connected by molding metal. A step of sealing the periphery of the semiconductor element including a part of the lead terminal with a resin and enclosing the lead terminal in a mold cavity, and obtaining the lead terminal without cutting the lead terminal after the resin sealing. A semiconductor device characterized by the above-mentioned.