JP2000306847A - Treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve workability in inspection and the like of a gas feeding system. SOLUTION: A treatment apparatus has a plurality of treatment units stored in a frame box 2. In a treatment step, a treatment gas is fed to each treatment unit via a pressure adjusting unit 4 and a flow-rate control unit 5 in a gas feeding system. A first storage box 11 for storing the flow-rate control unit 5 is provided at the upper part of the frame box 2, and a second storage box 12 for storing the pressure adjusting unit 4 as a whole is provided at a position, that is lower than the upper part of the frame box 2 and that facilitates working.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a processing apparatus.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, an object to be processed, for example, a semiconductor wafer is oxidized, diffused,
Various processing apparatuses are used to perform processes such as film formation and annealing. As the processing apparatus, there are known a batch processing apparatus capable of processing a large number of semiconductor wafers at a time, and a single-wafer processing apparatus which processes semiconductor wafers one by one. In particular, a single-wafer processing apparatus can relatively easily perform uniform processing within a surface of a semiconductor wafer and processing that requires rapid temperature rise and fall, and accordingly, with the increase in wafer size and miniaturization of semiconductor elements. It is increasingly being used.

[0003] As the processing device, a common enclosure type (referred to as the former) having a plurality of processing units housed in a housing, and an independent enclosure having a plurality of processing units individually housed in the housing. There is a type (referred to as the latter) which is configured to perform processing by supplying a gas such as a processing gas to each processing unit via a pressure adjusting unit and a flow control unit of a gas supply system. I have. In the flow rate control unit, the flow rate is set on a screen of a liquid crystal display device provided on the front surface of the processing apparatus, and thereafter, the flow rate is automatically controlled. On the other hand, in the pressure adjusting section, the pressure is manually set, and thereafter, the pressure gauge may be checked on a daily or regular basis.

[0004]

However, in the former processing apparatus, the pressure adjusting section and the flow rate controlling section of the gas supply system are arranged at the upper part of the housing (for example, at a height of 2400 mm from the floor) due to the installation space. ), It is necessary to use a step ladder or a stepladder to set and check the pressure, and there is a problem that the operation is difficult. On the other hand, in the latter processing apparatus, since the pressure adjustment unit and the flow control unit of the gas supply system are provided in the upper part (for example, at a height of 2000 mm from the floor) in the housing,
Although the work is easier than the former, even if a common gas is used, the pressure must be set and checked for each processing unit, and the work is difficult.

[0005] The present invention has been made in consideration of the above circumstances, and has as its object to provide a processing apparatus that improves the workability of a gas supply system.

[0006]

Means for Solving the Problems In the present invention, claim 1 is provided.
The processing apparatus includes a plurality of processing units housed in a housing, and performs processing by supplying a gas such as a processing gas to each processing unit via a pressure adjustment unit and a flow control unit of a gas supply system. In the first aspect, the first housing box accommodating the flow rate control unit is installed at the upper part of the housing, and the second housing box accommodating the pressure adjusting unit collectively is easier to work than the upper part of the housing. It is characterized by being installed in a place.

According to a second aspect of the present invention, a plurality of processing units individually housed in a housing are provided, and a gas such as a processing gas is supplied to each processing unit via a pressure adjusting unit and a flow control unit of a gas supply system. In a processing apparatus for supplying and performing processing, a housing for each of the processing units accommodates a flow control unit for a common gas common to a plurality of processing units, and a pressure adjustment unit and a flow control unit for a unique gas different for each processing unit. A first storage box is installed, and a second storage box that collectively stores the common gas pressure regulators is installed in a place where it is easy to work.

[0008]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

In FIGS. 1 and 2 showing a first embodiment of the present invention, reference numeral 1 denotes a single-wafer processing apparatus (for example, a heat treatment apparatus). A processing chamber (process chamber) 3 which is a plurality of processing units is provided, and a gas such as a processing gas is supplied to each processing chamber 3 via a pressure adjusting unit 4 and a flow rate control unit 5 of a gas supply system, and a predetermined processing gas A predetermined process, such as CVD, is performed at a process temperature and a process pressure.

The processing apparatus 1 has a transfer chamber 6 provided with a transfer arm mechanism (not shown) for transferring an object to be processed, for example, a semiconductor wafer. Are connected through a gate valve 7. These processing chambers 3 are configured to perform different processing, for example, two by two, but may be configured to individually perform the same processing or different processing.

A loading / unloading port 8 having an opening / closing gate for loading / unloading a cassette, which is a transport container containing a plurality of, for example, about 25 semiconductor wafers, is provided at a front portion (front surface portion) of the housing 2. The transfer chamber 3 is provided with a pair of left and right cassette chambers 9 for accommodating cassettes facing the loading / unloading port 8. Further, a cooling chamber 10 for cooling the semiconductor wafer after the heat treatment is connected to the transfer chamber 6.

The processing chamber 3, the transfer chamber 6, the cooling chamber 10, and the cassette chamber 9 can be evacuated to a predetermined pressure, for example, about several Torr by an exhaust system having a decompression pump (not shown). The gas supply system is a pipe (different for each gas type) for supplying a processing gas from a gas supply source of a factory to each processing chamber 3 via a pressure regulator 4 and a flow controller 5.
A pipe for supplying an inert gas, for example, nitrogen gas, to each of the processing chambers 3, the transfer chamber 6, the cooling chamber 10, and the cassette chamber 9 in order to replace the internal atmosphere with an inert gas; A supply pipe and the like are provided (not shown). By the transfer arm (not shown) in the transfer chamber 6, one semiconductor wafer can be removed from the cassette in the cassette chamber 9.
The semiconductor wafers are taken out one by one and carried into a predetermined processing chamber 3. After a predetermined processing in the processing chamber 3, the processed semiconductor wafer is transferred to the processing chamber 3.
After being discharged from the cooling chamber 10 and cooled in the cooling chamber 10, it is returned to the cassette in the cassette chamber 9.

A gas box 11, which is a first storage box for storing the flow rate control unit 5 of the gas supply system, is installed on the upper part of the housing 2, and the operation is lower than the upper part of the housing 2. In a place where it is easy to perform, the pressure adjusting section 4 of the gas supply system is provided.
A regulator box 12, which is a second storage box that collectively stores therein, is installed. The gas box 11
In the illustrated example, four are installed corresponding to the processing chambers 3. Each gas box 11 accommodates a pipe connected to the corresponding processing chamber 3, a flow control mechanism including a flow control valve provided in the pipe, an on-off valve (shut-off valve), and the like (not shown).

A liquid crystal display device having a screen for setting and displaying a process recipe, a gas flow rate, and the like is provided on a front portion of the housing 2. A separate display device is also provided on the rear surface of the housing 2. The control unit of the display device receives various signals, and is configured to generate an alarm when, for example, the gas pressure of the gas supply system decreases.

On the other hand, an entrance / exit door 13 for maintenance is provided at a rear portion of the housing 2, and a rear area of the housing 2 is a maintenance area 14. The maintenance area 14 includes a step 1 for approaching the entrance door 13.
The regulator box 12 is installed on one side of the step 15. Various pipes are provided in the step 15.

In the regulator box 12, gas supplied from a gas supply source of a factory is supplied.
A pipe for distribution to the flow control unit 5, a manual pressure regulating valve provided in the pipe, a gauge for measuring and displaying gas pressure, and the like are accommodated (not shown). The regulator box 12 and the gas box 11 have an airtight structure so that they do not leak to the outside even if gas leaks inside, and the inside is exhausted by an exhaust system having a gas leak sensor. , Safety is improved.

A door 16 is provided on the front surface of the regulator box 12 for setting and checking pressure. Preferably, the door 16 is provided with a window made of a transparent material so that the inside can be seen.

According to the processing apparatus 1 having the above configuration,
The flow control unit 5 in the gas supply system is housed in the gas box 11 which is the first housing box, and is arranged at the upper part of the housing 2.
The pressure adjustment unit 4 in the gas supply system is connected to the gas box 1
1 and collectively housed in a regulator box 12 which is a second housing box, which is lower than the upper part of the housing 2 and which is easy to work, in this embodiment, on a step 15 of a maintenance area 14. The arrangement facilitates setting of pressure and checking of pressure which must be performed on a daily or regular basis, thereby improving operability and operability.

That is, the setting of the gas flow rate in the flow rate control unit 5 in the gas box 11 is performed on the screen of the display device on the front surface of the housing 2, and the flow rate control unit 5 is automated and requires almost no touch. Although there is no problem even if it is arranged at a high position in the upper part of the housing 2, since the pressure adjustment unit 4 needs manual pressure setting and daily inspection, it is operated by being arranged on the step 15 of the maintenance area 14. And inspection work can be performed easily. Further, since the regulator box 12 of the pressure adjusting section 4 is installed on the step 15 of the maintenance area 14 which is lower than the upper part of the housing 2, it is not necessary to use a stepladder or the like, and the work can be performed safely. .

FIGS. 3 and 4 show a processing apparatus according to a second embodiment of the present invention. The processing apparatus 1 of the first embodiment is of a common enclosure type in which a plurality of processing chambers (processing units) 3 are housed in one (common) housing 2, whereas the present embodiment is different from the first embodiment. Is an independent enclosure type in which a plurality of processing chambers (processing units) 3 are individually accommodated in a housing 22. In the processing device 21 of the present embodiment, the same parts as those of the processing device 1 of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the clean room of the factory, an operation area 24 having a high degree of cleanliness by a partition wall 23,
It is divided into a maintenance area 25 having a low cleanness, and the processing apparatus 21 of the present embodiment is installed in the maintenance area 25. On the partition wall 23,
A loading / unloading port 26 having an opening / closing gate for loading / unloading the cassette is provided.

Each of the housings 22 is independent and installed on the floor 27 of the maintenance area 25. Case 2
In the upper part of 2, a flow control unit 5 a of a gas (common gas) commonly used by a plurality of processing units 3, a pressure adjusting unit 4 b of a unique gas (unique gas) used for each processing unit 3, A gas box 31, which is a first storage box that stores the flow control unit 5b, is provided. The pressure adjusting section 4b of the unique gas does not necessarily need to be housed in the common gas box 31, but is housed in a housing box (regulator box) independent of the gas box 31 if it is in the housing 22. It may be.

The common gas pressure adjusting section 4a is collectively housed in a regulator box 32 which is a second housing box.
It is installed in an easy-to-work place separated from the inside. The unique gas flow controller 5b in each of the casings 22 is supplied with the unique gas from the gas supply source of the factory via the pipe 28 through the unique gas pressure regulator 4b in the casing 22. In addition, a common gas flow control unit 5a in each housing 22 is shared by a pipe 29 from a gas supply source in a factory via a pressure adjusting unit 4a in an independent regulator box 32 outside the housing 22. Gas is supplied.

Examples of the common gas include a cleaning gas and an inert gas (nitrogen gas). The intrinsic gas is mainly a processing gas. In addition, when a unique gas is newly added due to a change in a process, or when a processing gas that cannot be directly supplied from a factory is used (for example, when a processing gas is supplied by being vaporized from a liquid material), a virtual line is used. As shown by, the gas box 41 may be attached to the side of the housing 22 as appropriate. In the gas box 41, a pressure adjusting section and a flow rate controlling section of the additional specific gas are appropriately accommodated.

According to the processing apparatus 21 of the present embodiment, in the gas supply system, the common gas flow control section 5a common to the plurality of processing chambers (processing sections) 3 and the pressure of the unique gas different for each processing section 3 The adjustment unit 4b and the flow control unit 5b are housed in a gas box 31 serving as a first storage box and arranged in each housing 22, and the pressure adjustment unit 4a for common gas is used as a regulator box serving as a second storage box. Since they are collectively housed in the space 32 and arranged in a place where they can be easily worked, the setting and inspection of the pressure of the common gas can be easily performed at one place, and the operability or the workability can be improved. Further, in the processing device 21 of the independent enclosure type, for example, when the process of one processing chamber 3 is changed, it is sufficient to replace each module in units of the housing 22 without replacing the gas supply system piping or the like. , The process can be easily changed.

Although the embodiment of the present invention has been described in detail with reference to the drawings, the present invention is not limited to the above embodiment, and various design changes and the like can be made without departing from the gist of the present invention. Is possible. For example, in the first embodiment, the regulator box is installed on the step of the maintenance area, but may be installed on the floor of the maintenance area.

[0027]

According to the present invention as described above, the following effects can be obtained.

(1) According to the first aspect of the present invention, a plurality of processing units housed in a housing are provided, and each processing unit is provided with a processing gas or the like via a pressure adjusting unit and a flow control unit of a gas supply system. In a processing apparatus that performs processing by supplying a gas, a first storage box housing the flow rate control unit is installed on an upper part of the housing, and a second storage box housing the pressure adjustment unit collectively is provided. Since it is installed in an easy-to-work place lower than the upper part of the housing, pressure can be easily set and checked, and workability can be improved.

(2) According to the second aspect of the present invention, a plurality of processing units individually housed in the housing are provided, and each processing unit performs processing via the pressure adjusting unit and the flow control unit of the gas supply system. In a processing apparatus that performs processing by supplying a gas such as a gas, a flow control unit of a common gas common to a plurality of processing units and a pressure adjustment unit and a flow rate of a unique gas different for each processing unit are provided in the housing of each processing unit Since the first storage box containing the control unit was installed and the second storage box containing the common gas pressure adjustment unit was installed in an easy-to-work place, the setting and inspection of the common gas pressure were easy. It can be easily performed in one place, and workability can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the processing apparatus of FIG.

FIG. 3 is a plan view showing a processing apparatus according to a second embodiment of the present invention.

FIG. 4 is a diagram showing one module of the processing apparatus of FIG. 3;

[Explanation of symbols]

 1,21 processing device 2,22 housing 3 processing chamber (processing unit) 4,4a, 4b pressure adjusting unit 5,5a, 5b flow control unit 11,31 gas box (first storage box) 12,32 regulator box (Second storage box)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4K030 EA01 KA41 LA15 5F045 BB10 BB20 DQ17 EB02 EB08 EE04 EN04 HA24

Claims (2)

[Claims] 1. A processing apparatus comprising a plurality of processing units housed in a housing, and performing processing by supplying a gas such as a processing gas to each processing unit via a pressure adjusting unit and a flow control unit of a gas supply system. In the first aspect, the first housing box accommodating the flow rate control unit is installed at the upper part of the housing, and the second housing box accommodating the pressure adjusting unit collectively is easier to work than the upper part of the housing. A processing device characterized by being installed in a place. 2. A plurality of processing units individually housed in a housing, and processing is performed by supplying a gas such as a processing gas to each processing unit via a pressure adjusting unit and a flow control unit of a gas supply system. In the processing apparatus, a first storage box housing a flow control unit for a common gas common to a plurality of processing units and a pressure adjustment unit and a flow control unit for a unique gas different for each processing unit is provided in a housing of each processing unit. A processing apparatus, wherein a second storage box, which is installed and collectively accommodates the common gas pressure regulators, is installed in a place where it is easy to work.