JP2000305160A - Exposure surface and light receiving surface adjustment mechanism for camera - Google Patents

Abstract

PROBLEM TO BE SOLVED: To coincide the exposure surface of a silver salt film and the light receiving surface of an imaging device with the image forming surface of an object image as a single-lens reflex camera used for both of a silver salt and a digital still photographing actions. SOLUTION: This adjustment mechanism is constituted so that a back cover for a film U1 having a pressing plate 19 regulating the position of the exposure surface of the silver salt film F is fitted to a camera main body and the film F is made to press-contact with the plate 19 so that the exposure surface is aligned with the image forming surface of the object image when the object image is recorded on the film F. When the object image is picked up, a back cover for image pickup U2 having a CCD 41 is fitted to the camera main body so that the sensor C of the CCD 41 is coincident with the image forming surface of the object image.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silver halide digital still camera capable of recording a subject image on a silver halide film and recording the same subject image as image data in a memory. The present invention relates to a single-lens reflex type silver halide digital still camera that can selectively record a subject image in one of memories.

[0002]

2. Description of the Related Art Conventionally, a single-lens reflex type silver halide digital still dual-use camera capable of recording an image on a silver halide film or capturing an image with an image pickup device such as a CCD and recording it in a memory is known. . In such a single-lens reflex camera, two back lids are prepared, and when recording an image on a silver halide film, a back lid with a film pressure plate is used, and when capturing an image, A back cover provided with an image sensor is used.

[0003] When a back cover provided with a film pressure plate is attached to a camera, the position of the exposure surface of the silver halide film is defined by a film guide member provided in the camera body. This is the position of the image plane. on the other hand,
When the back cover provided with the image sensor inside is mounted on the camera, the image sensor is arranged at the position of the exposure surface of the silver halide film. As a result, the subject image that has passed through the lens is formed on the image sensor, and is recorded in the memory as image data.

[0004]

However, the image pickup device is generally thicker than a silver halide film, and the light receiving surface of the image pickup device is located inside, not on the surface. Therefore,
The position of the light receiving surface of the image sensor when the back cover is closed does not match the exposed surface of the silver halide film. That is, the position of the light receiving surface of the image sensor does not match the position of the imaging surface of the subject image. If a subject is imaged with such an arrangement of the image sensor, an unclear unfocused subject image is recorded in the memory.

SUMMARY OF THE INVENTION The present invention provides a single-lens reflex type silver halide digital still camera which can easily match the position of the exposure surface of the silver halide film and the light receiving surface of the image sensor with the position of the imaging surface of the subject image. The purpose is to:

[0006]

The exposure surface and light receiving surface adjustment mechanism of the camera according to the present invention comprises a photographing operation control means for controlling a photographing operation for recording a subject image on a silver halide film via a photographing optical system. An image capturing operation control means for controlling an image capturing operation for generating an image signal corresponding to a subject image formed on an image sensor via a photographing optical system by photoelectric conversion, and a position of an exposure surface of the silver halide film to a film back cover. An exposure surface defining means defined by a pressure plate provided in the imaging device housing area for arranging the image sensor behind the imaging optical system, the exposure surface defining means of the exposure surface of the silver halide film By defining the position, the position of the exposure surface of the silver halide film coincides with the position of the imaging surface of the subject image by the photographing optical system, and by arranging the image sensor in the image sensor housing area, Position of the light receiving surface of the image element is characterized in that coincides with the position of the focal plane of the object image.

The pressure plate is arranged so that the surface of the pressure plate is disposed behind the position of the exposure surface of the silver halide film by the thickness of the silver halide film when the back cover for the film is mounted on the camera body. It is desirable to be provided inside the lid.

[0008] It is preferable that the exposure surface defining means defines the position of the exposure surface of the silver halide film by pressing the back surface of the silver halide film against the pressure plate when the film back cover is mounted on the camera body.

The exposure surface defining means is provided with two sprockets on both sides of the pressing plate so as not to block the recording area of the silver halide film, and presses the silver halide film against the pressing plate by engaging the silver halide film with the sprocket. It is desirable.

[0010] The sprocket is preferably engaged with the silver halide film from the side of the exposed surface of the silver halide film, and the position of the engaged portion is desirably behind the surface of the pressure plate. Thereby, the silver halide film is pressed against the pressure plate.

The imaging device is provided on the back cover of the camera, and when the imaging back cover provided with the imaging device is attached to the camera body, the position of the surface of the imaging device is different from the position of the imaging plane of the subject image. Preferably, it is attached to the inside of the back cover so that it coincides.

It is desirable that the photographing back cover be mounted on the camera body so that the photographing operation control means can photograph a subject. The subject image formed on the light receiving surface of the imaging device by the imaging operation control means is preferably recorded as image data in a memory.

It is desirable that the image sensor has a thickness greater than that of the silver halide film, and that the light receiving surface of the image sensor be located inside the image sensor. Further, the image forming area of the image sensor is the same as the recording area of the silver halide film, the dimensions of the image sensor,
It is desirable that the area is larger than the recording area.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A single-lens reflex type silver halide digital still camera which is an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing the main internal configuration of a silver halide digital still camera. In this single-lens reflex camera, a back cover applied when recording an image on a silver halide film and a back cover applied when capturing an image with an image sensor such as a CCD are separately prepared. In FIG.
A back cover for recording an image on a silver halide film is attached to the camera body.

The photographing optical system 11 includes a plurality of lenses (not shown) and an aperture (not shown), and is detachable from the camera body 10. A back cover U1 for a film is attached to the camera body 10, and the back cover U for a film is provided.
1 is a pressure plate 1 for pressing the silver halide film F
9 are provided. In FIG. 1, the optical axis E of the photographing optical system 11 is indicated by a dashed line, and the film back lid U1 side is the rear side and the photographing optical system 11 side is the front along the optical axis E.

A quick return mirror 12 for selectively changing the path of the optical axis E is provided in the camera body 10 and is arranged behind the photographing optical system 11. The quick return mirror 12 is moved from an inclined position (hereinafter, referred to as a down position) to a horizontal position (hereinafter, referred to as a two-dot chain line).
(In the up position). While the shutter 17 does not operate (while the silver halide film F is not exposed), the quick return mirror 12 is placed in the down position. However, when the shutter 17 operates, the quick return mirror 12 is rotated from the down position to the up position. (Bounced up) and stopped at the up position for a predetermined time.

When the photographing operation is not performed, the light reflected by the subject M converges through the photographing optical system 11 and is guided by the quick return mirror 12 toward the focusing plate 13. That is, the subject image formed by the photographing optical system 11 is formed on a focus plate 13 provided above the quick return mirror 12,
It is observed by the photographer via the finder 15. At this time, the focus of the observed subject image corresponds to the focus of the subject image on the exposure surface of the silver halide film F,
When the observed subject image is in focus, a clear subject image is recorded on the silver halide film F.

A shutter 17 is arranged behind the quick return mirror 12 along the optical axis E. The shutter 17 is a so-called focal plane shutter in which a front curtain and a rear curtain move vertically in conjunction with each other. Behind the shutter 17, the position R of the exposure surface of the silver halide film F
Is attached to the film back cover U1. At the position R of the exposure surface of the silver halide film F defined by the pressure plate 19, the position of the imaging surface of the subject image by the photographing optical system 11 is determined.

On both sides of the pressure plate 19 along the lateral direction (lateral direction) of the camera body 10, one sprocket (not shown) for guiding the feeding of the silver halide film F is arranged one by one. The engagement between the silver halide film F and the sprocket causes the silver halide film F to be pressed against the pressure plate 19 provided inside the back cover U1.

Incidentally, one end of the film back cover U1 is pivotally attached to the camera body 10, whereby the film back cover U1 is
Can be opened and closed.

A release switch (not shown) is provided on the upper part of the camera body 10, and when the release switch is fully pressed, the quick return mirror 12 moves to the up position, and interlocks with this movement. The shutter 17 is opened for a predetermined time. Thereby, the photographing optical system 11
Is formed on the exposure surface of the silver halide film F.

The silver halide film F is stored in a patrone (not shown) in the form of a roll, and the patrone is stored in a patrone chamber (not shown) provided at one side of the camera body 10. The silver halide film F pulled out of the patrone passes through the movement path of the silver halide film F defined by the sprockets arranged on both sides of the pressure plate 19 and the pair of guide pieces 19a, and the other side position in the camera body 10 is set. And is wound on a take-up spool (not shown) provided at the end. When the patrone containing the silver halide film F is loaded into the camera body 10 and the photographing operation is sequentially performed, the silver halide film F is fed while being guided by two sprockets and a pair of guide pieces 19a, and wound. It is sequentially wound up by a take-up spool.

Below the quick return mirror 12,
An AF (auto focus) unit 30 used for automatic focus adjustment is provided. The AF unit 30 is provided with optical lenses 31 and 32, a mirror 33, and a licensor 34 in which light receiving elements are arranged. I have. On the back surface of the quick return mirror 12, a sub mirror 16 is provided. When the quick return mirror 12 having the property of a half mirror is at the down position, light passing through the imaging optical system 11 is reflected by the sub mirror 16,
The AF unit 30 is guided downward. And AF
The light that has entered the unit 30 is collected by the optical lenses 31 and 32, and guided to the light receiving surface of the licensor 34 via the mirror 33. Thereby, the subject M and the camera body 10
Is measured, and the focal length is adjusted. Such automatic focusing is performed when the release switch is half-pressed.

When the release switch is half-pressed, the brightness of the subject M is measured by a photometric light-receiving element (not shown) provided in the viewfinder 15, whereby an appropriate exposure amount for the silver halide film F is obtained. Is determined.

FIG. 2 is a top view of the film back cover U1. FIG. 3 is a view of the pressure plate 19 viewed from the side.

Inside the back cover U1 for the film, a pressure plate 19
A pair of guide pieces 19a (see FIG. 3) for defining the position R of the exposure surface of the silver halide film F correspond to the height of the silver halide film F on the surface 19s of the pressure plate 19. It is formed as follows. When the silver halide film F is pressed against the pressure plate 19, the pressing plate 19
Is mounted on the film back cover U1 such that the position R of the exposure surface of the film plate coincides with the position of the image forming surface of the subject image, and the position Y of the surface 19s of the pressure plate 19 is, as shown in FIG. It is behind the position R of the exposure surface of the film F by the thickness dF of the silver halide film F.

As shown in FIG. 2, the width B of the exposure surface for one screen of the silver halide film (hereinafter referred to as a recording area) is smaller than the length 19E of the pressure plate 19 in the left-right direction. In the present embodiment, an aperture for passing light passing through the photographing optical system 11 only to the recording area of the silver halide film F is used.
Although the frame member having the (window) is not provided behind the shutter 17, the plane area perpendicular to the optical axis E of the space where the quick return mirror 12 is provided in front of the shutter 17 is formed of the silver halide film F. Since it is equal to the recording area, the pressure plate 19
Light reaching the area other than the recording area of the silver halide film F on the surface 19s of the silver halide film F need not be considered.

FIG. 4 shows that the silver halide film F is
FIG. 2 is a view of the internal configuration of the camera body 10 when the camera body is loaded into the camera, as viewed from above.

As shown in FIG. 4, the silver halide film F drawn from the patrone PT engages with the sprocket S1 and presses against the pressure plate 19 along the feeding passage guided by the guide piece 19a. , Is engaged with the sprocket S2 and wound around the take-up spool MT. At this time, the back surface (surface opposite to the exposed surface) of the silver halide film F is pressed against the pressure plate 19. The sprocket S1 and the sprocket S2 are separated by the same distance from the optical axis E, and are arranged symmetrically with respect to the optical axis E as a center line.

The silver halide film F is provided with perforations (not shown) for feeding the silver halide film F to the take-up spool MT at both upper and lower ends, and the perforations at one end (upper side) are sprockets. It is engaged with the protrusion K1 provided on S1. The sprockets S1 and S2 are attached to the camera body 10 side, and members (not shown) connecting the camera body 10 and the sprockets S1 and S2 are provided below the sprockets S1 and S2.
Are formed.

FIG. 5 is a perspective view of the sprocket S1.

The sprocket S1 rotates about the axis U, and the position of the disk SH provided with the projection K1 corresponds to the position of the perforation P on the upper side of the silver halide film F. The protrusions K1 are formed at 90-degree intervals on the circumference of the disk SH, and the protrusions K at the position ω on the circumference are provided.
1 engages with the perforations P. At this time, the projection K1 engages with the perforation P from the exposure surface side of the silver halide film F.

When the sprocket S1 (projection K1) is rotated about the axis U (counterclockwise as viewed in the figure) by feeding the silver halide film F toward the take-up spool MT, the perforations P The projection K1 at the engaged position ω moves due to the rotation of the sprocket S1, and the projection K1 newly moved to the position ω engages with the perforation P of the silver halide film F. While the silver halide film F is being fed (while the sprocket S1 is rotating), the perforations P of the silver halide film F successively engage with the projections K1 at the position ω, whereby the silver halide film F Move to the take-up spool MT side one after another.
At this time, the silver halide film F is in sliding contact with the pressure plate 19.

The sprocket S2 has the same shape as the sprocket S1, and the projection K2 engages with the perforation P of the silver halide film F.

FIG. 6 shows sprockets S1 and S2 and pressure plate 1
FIG. 9 is a diagram showing a positional relationship with No. 9;

The projection K1 of the sprocket S1 engages with the perforation P from the exposure surface side (hereinafter, referred to as the surface side) of the silver halide film F.
It is located ahead of the surface of the silver halide film F. The position X of the engaging portion す る at which the protrusion K1 engages with the perforation P of the silver halide film F is behind the position Y of the surface 19s of the pressure plate 19. The position X of the engaging portion Λ is also the position of the engaging portion σ where the projection K2 of the sprocket S2 and the perforation P engage.

Silver halide film F and sprockets S1, S2
And the position X of the engaging portion Λ, σ is located behind the position Y of the surface 19s of the pressure plate 19, and the patrone PT and the take-up spool MT are located ahead of the positions of the sprockets S1, S2. Therefore, the silver halide film F is pressed by the pressure plate 19 in the feeding passage defined by the guide piece 19a in a state where the silver film F extends straight without being loosened.

As described above, in the present embodiment, the aperture is formed and the film guide member for defining the feeding passage of the silver halide film F is not provided in the camera body 10, but instead of the silver halide film F To two sprockets S1, S
2, the silver halide film F
, Thereby defining the position R of the exposed surface of the silver halide film F.

FIG. 7 is a diagram showing a main electric circuit that operates when the film back cover U1 is attached to the camera body 10. As shown in FIG.

The system control circuit 40 has a CPU (not shown) for arithmetic processing inside, and performs overall control of the camera body 10.

A power switch 49, a release half-press switch 50, a release full-press switch 51, and a film back detection circuit 48 are connected to the system control circuit 40. The release half-press switch 50 and the release full-press switch 51 are switches for detecting the pressed state of the release switch provided on the upper part of the camera body 10, and the film back detection circuit 48 includes a film back cover U1. Is a circuit for detecting that the camera body 10 is mounted. When the power switch 49 is turned on, the silver halide film F is loaded into the camera body 10, and the film back cover U1 is mounted on the camera body 10, the image of the subject M can be recorded on the silver halide film F. When the release switch is fully pressed, the photographing optical system 1
The subject image passing through 1 is recorded on the silver halide film F by opening the shutter 17. Note that a power supply circuit 52 is connected to the system control circuit 40.

In the photometric circuit 46, the brightness of the subject M is
It is measured based on the amount of light detected by the light receiving element in the finder 15 shown in FIG. Then, an appropriate exposure amount is obtained based on the measured brightness, and the
Shutter speed and the aperture value of the aperture Z are determined. In the distance measuring circuit 47, the distance between the subject M and the camera body 10 is measured based on the distance data detected by the AF unit 30 (see FIG. 1). Then, the lens provided in the photographing optical system 11 is driven by the lens drive circuit 42 based on the measured distance. Such photometry and distance measurement are executed when the release half-press switch 50 is turned on.

The shutter 17 is driven by a shutter drive circuit 44, and the aperture Z is also stopped down by an aperture drive circuit 53. The driving of the shutter 17 and the driving of the aperture Z are executed when the release full-press switch 51 is turned on. At this time, the aperture Z is driven according to an aperture value determined based on photometry. The shutter 17 also
It is driven according to a shutter speed determined based on photometry. In the strobe circuit 45, strobe light emission control is performed.

In the frame number detecting circuit 54, the silver halide film F
The feeding amount of the silver halide film F is detected by counting the perforations. The film sensitivity detection circuit 55 detects the sensitivity of the silver halide film F. In the film winding / rewinding drive circuit 43, the silver halide film F
Winding and rewinding are controlled.

FIG. 8 is a plan view of the image sensor applied in the present embodiment as viewed from the front. FIG. 9 is a side view of the image sensor, partially showing the inside of the image sensor. The position of the light receiving surface of the image sensor will be described with reference to FIGS.

FIG. 8 shows a CCD 41 which is a solid-state image pickup device applied in this embodiment. When light strikes a sensor (light receiving surface) C on which a photoelectric conversion element is provided, an image is formed by photoelectric conversion. A signal is generated. The image forming region (hatched portion) H of the sensor C is formed to be equal to the recording region of the silver halide film F.

In general, a colorless and transparent cover glass G is put on the solid-state imaging device such as the CCD 41 so as to protect the sensor C. Therefore, the CCD 41
Is larger than the recording area of the silver halide film F.

As shown in FIG. 9, the surface on the light receiving surface side of the CCD 41 is formed by a cover glass G covering the sensor C, and an air layer A is formed between the sensor C and the cover glass G. Have been. Therefore, the thickness D of the CCD 41 is the total thickness of the cover glass G and the sensor C and the air layer A. A pin P for arranging the CCD 41 on a circuit board is provided on the back side of the CCD 41.
N are mounted side by side.

As described above, the thickness D of the CCD 41 is larger than the thickness of the silver halide film F, and the sensor C is
41 is located inside the CCD 41, not on the surface of the imaging optical system 11 side. That is, the sensor C, which is the light receiving surface of the CCD 41, is located behind the surface of the CCD 41 along the optical axis.

In this embodiment, since the film guide member on which the aperture is formed is not provided behind the shutter 17, an accommodation area for accommodating the CCD 41 is formed behind the shutter 17. And the CCD 41 is arranged such that the position R of the exposed surface of the silver halide film F and the position of the sensor C of the CCD 41 coincide with each other.

FIG. 10 is a diagram showing the internal structure of the camera when the back cover provided with the image pickup device is attached. Except for the arrangement of the image pickup device, FIG. Same as the internal configuration.

A circuit board CT to which pins PN are soldered is provided behind the CCD 41, and fixing screws (not shown) are provided inside the back cover U2 for imaging via the circuit board CT. Into a screw hole (not shown). Thus, the CCD 41 is fixed to the imaging back cover U2.

An image pickup device accommodating area for accommodating the CCD 41 is formed behind the shutter 17, and when the imaging back lid U2 is mounted on the camera body 10, the position of the sensor C of the CCD 41 is changed to a silver halide film. The position R of the exposure surface of F,
That is, the position coincides with the position of the imaging plane of the subject image.

An LCD (not shown), which is a liquid crystal display device, is provided on the front side of the imaging back cover U2, and the captured subject image is displayed. A mode selection dial (not shown) is provided on the upper part of the camera body 10, and, for example, an aperture priority mode, a shutter priority mode, a reproduction mode, and the like are selected by operating the mode selection dial.
Further, an up switch,
A down switch (both not shown) is provided. For example, an aperture value in the aperture priority mode is selected by operating an up switch and a down switch.

FIG. 11 is a diagram showing the position of the image plane of the subject image when the two back lids U1 and U2 are mounted on the camera body 10, respectively.

As shown in FIG. 11, the film back cover U1
Is mounted on the camera body 10, the silver halide film F is pressed against the pressure plate 19, and when the imaging back lid U2 is mounted on the camera body 10, the CCD 41 is arranged in the imaging element housing area. . Thereby, the positions of the exposure surface of the silver halide film F and the sensor C (light receiving surface) of the CCD 41 coincide with the position of the image forming surface of the subject image.

FIG. 12 shows a state in which the camera back cover U2 is
FIG. 3 is a block diagram showing a main electric circuit that operates when the electronic device is mounted on a “0”. Circuit board CT on which CCD 41 is disposed
When the camera back lid U2 is attached to the camera body 10,
It is connected to a circuit board (not shown) in the camera body 10.

The system control circuit 40 is connected to an up switch 54, a down switch 55, a selection mode detection circuit 56, and a digital back detection circuit 57 in addition to the power switch 49, the release half-press switch 50, and the release full-press switch 51. Have been. Mode selection detection circuit 5
At 6, the mode selected by operating the mode selection dial is detected. The digital back detection circuit 57
In this case, the attachment of the imaging back lid U2 to the camera body 10 is detected.

When an imaging operation is performed with the imaging back lid U2 attached to the camera body 10, the subject image is
An image is formed in the sensor C 41, and an image signal corresponding to the image is generated by photoelectric conversion. The CCD 41 is controlled by a CCD driving circuit 60, and an image signal for one screen is
It is read by the CD drive circuit 60. The reset signal is removed from the image signal read from the CCD 41 in a correlated double sampling circuit (CDS) 61 and the A / A
In the D converter 62, the analog signal is converted into a digital signal.

The digitized image signal is sent to the signal processing circuit 63. In the signal processing circuit 63, various image processing such as gamma correction and contour correction processing are performed, and the processed image signal is sent to the field memory 70 via the system control circuit 40. As a result, an image signal for one screen is temporarily stored in the field memory 70.

The image signal temporarily stored in the field memory 70 is sent again to the system control circuit 40 and is subjected to a compression process. The compressed image signal is stored in the flash memory 72 as image data. In addition,
The control of writing and reading of image signals to and from the field memory 70 is performed by the field memory controller 6.
7 and the control of writing and reading of image signals to and from the flash memory 72 is performed by the flash memory controller 71.

When the reproduction mode is selected by the mode selection dial and the image recorded on the LCD 66 is reproduced,
The stored image data is read from the flash memory 72, decompressed by the system control circuit 40, and temporarily sent to the field memory 70. The image signal temporarily stored in the field memory 70 is
D / A converter 6 via system control circuit 40
4 and converted from a digital signal to an analog signal.

The analogized image signal is subjected to predetermined processing in an LCD drive circuit 65, and a voltage is applied to the LCD 66 based on the image signal to generate an L signal.
The CD 66 is driven. Then, when the backlight 69 is turned on, the subject image is reproduced and displayed on the LCD 66. The lighting of the backlight 69 is controlled by the backlight drive circuit 68.

The timing generator 58 is controlled by the system control circuit 40 to control the CCD driving circuit 60, the CDS 61, the A / D converter 33, and the signal processing circuit 6
3. It outputs sample pulses and the like to the D / A converter 64, the LCD drive circuit 65, and the field memory controller 67, and controls these operations.

FIG. 13 is a flowchart showing the procedure of the photographing operation and the photographing operation. When the back lid U1 for film or the back lid U2 for imaging is mounted on the camera body 10, a shooting operation or an imaging operation is started.

In step 101, it is determined whether or not the camera back cover U2 is attached to the camera body 10. That is, the imaging back lid U2 is attached to the camera body 10,
It is determined whether it is in the closed state.

In step 101, the back lid U2 for imaging
Is not attached, and it is determined that the film back cover U1 is attached, the process proceeds to step 102. In step 102, the system control circuit 40 is set so as to execute the photographing operation, and the process proceeds to step 103. Step 1
In 03, it is determined whether the release switch is half-pressed and the release half-press switch 50 is in the ON state.
If it is determined that the release half-press switch 50 is in the ON state, the process proceeds to step 104. Release half-press switch 5
If it is determined that 0 is not in the ON state, Step 1 is repeated until the release half-press switch 50 is turned ON.
03 is executed.

In step 104, the brightness of the subject and the distance to the subject are measured by the distance measuring circuit 46 and the photometric circuit 57. Then, an aperture value and a shutter speed are determined based on the measured brightness, and automatic focus adjustment is performed based on the measured distance. When the photometry and the automatic focus adjustment are performed, the process proceeds to step 105.

In step 105, the release switch is half released, and the release half depression switch 50 is turned off.
It is determined whether it is in the state. If it is determined that the release half-press switch 50 is in the OFF state, the process proceeds to step 10.
Return to 3. If it is determined that the release push switch 50 is not in the OFF state, the process proceeds to step 106.

In step 106, it is determined whether or not the release switch is fully pressed, and whether or not the release full-press switch 51 is ON. Release full-press switch 51 is O
If it is determined that the state is the N state, the process proceeds to step 107.
When it is determined that the release full-press switch 51 is not in the ON state, the process returns to step 105.

In step 107, the stop Z is set to step 1
The aperture is stopped down to the aperture value determined by step 04, and the shutter 17 is opened for the time determined by step 104. By driving the aperture Z and the shutter 17, the silver halide film F is exposed. At this time, the position of the exposure surface of the silver halide film F coincides with the position of the imaging surface of the subject image, and the focused subject image is
Will be recorded. When the subject image is recorded on the silver halide film F, the process proceeds to step 108.

In step 108, when the silver halide film F is fed by the film winding / rewinding circuit 43 and the silver halide film F is fed, a series of photographing operations ends.

In step 101, the back lid U2 for imaging
When it is determined that is mounted on the camera body 10, the process proceeds to step 109. In step 109, the system control circuit 40 is set so that the imaging operation is performed, and the process proceeds to step 110.

The execution of steps 110 to 114 is the same as the execution of steps 103 to 107. That is, when the release switch is half-pressed, distance measurement and photometry are performed, and when the release switch is fully pressed, the CCD 41 is exposed, whereby an image signal corresponding to a subject image is obtained.
At this time, the position of the sensor (light receiving surface) C of the CCD 41 is
The position of the subject image coincides with the position of the image forming plane, and the subject image
An image is formed on the sensor C of the CD 41. Then, in step 115, the image signal is read from the CCD 41 and compressed in the system control circuit 40. The compressed image signal is stored in the flash memory 72 as image data. When the subject image is stored in the flash memory 72 as image data, a series of imaging operations ends.

As described above, according to the present embodiment, when a subject image is recorded on the silver halide film F, the position of the exposure surface of the silver halide film F is defined by pressing the silver halide film F against the pressure plate 19. You. Accordingly, it is not necessary to provide a film guide member for defining the position of the exposure surface of the silver halide film F in the camera body 10, and instead, the CCD 41
Is formed behind the shutter 17 so that the position of the sensor C of the CCD 41 can be matched with the position of the image forming plane of the subject image during imaging.
Therefore, the photographing operation for the silver halide film F and the CCD
Regardless of which imaging operation is performed by 41, a focused subject image is recorded.

Since the conventional single-lens reflex camera for a silver halide film has a structure in which a film guide member is removed and two sprockets are provided, the configuration and mechanism of a single-lens reflex camera manufactured so far are largely changed. Thus, a single-lens reflex type silver halide digital still camera can be manufactured.

The configuration in which the film guide member 18 is provided as in the present embodiment is applied not only to a single-lens reflex type silver halide digital still camera but also to a compact silver halide digital still camera. Is also good.

[0079]

As described above, according to the present invention, the positions of the exposure surface of the silver halide film and the light receiving surface of the image sensor can be easily matched with the position of the image forming surface of the subject image.

[Brief description of the drawings]

FIG. 1 is a diagram showing an internal configuration of a single-lens reflex camera equipped with a film back cover.

FIG. 2 is a top view of a film back cover.

FIG. 3 is a side view of a pressure plate.

FIG. 4 is a top view of the internal configuration of the camera when a silver halide film is loaded.

FIG. 5 is a perspective view showing a sprocket.

FIG. 6 is a diagram showing a positional relationship between a sprocket and a surface of a pressure plate.

FIG. 7 is a block diagram showing an electric circuit of the camera.

FIG. 8 is a plan view of the image sensor viewed from the front.

FIG. 9 is a diagram of the image sensor viewed from the side.

FIG. 10 is a diagram showing an internal configuration of a single-lens reflex camera equipped with an imaging back cover.

FIG. 11 is a diagram illustrating a position of an image forming plane of a subject image.

FIG. 12 is a block diagram showing an electric circuit of the camera.

FIG. 13 is a flowchart illustrating a procedure of a photographing operation and an imaging operation.

[Explanation of symbols]

 Reference Signs List 11 shooting optical system 19 pressure plate 19s surface of pressure plate 41 CCD (imaging device) 72 flash memory (memory) C sensor (light receiving surface) E optical axis F silver halide film S1 sprocket S2 sprocket R position of exposure surface X position of engaging portion Y Position of the surface of the pressure plate U1 Back cover for film U2 Back cover for imaging

Claims (10)

[Claims] 1. A photographing operation control means for controlling a photographing operation for recording a subject image on a silver halide film via a photographing optical system, and according to a subject image formed on an image sensor via the photographing optical system. Imaging operation control means for controlling an imaging operation for generating an image signal by photoelectric conversion, and an exposure surface defining means for defining the position of the exposure surface of the silver halide film by a pressure plate provided on a film back cover, An image pickup device housing area for arranging the image pickup device behind the photographing optical system is formed, and the position of the exposure surface of the silver halide film is defined by the exposure surface defining means, thereby exposing the silver halide film. The position of the surface coincides with the position of the image forming plane of the subject image by the photographing optical system, and by arranging the image sensor in the image sensor housing area, the light receiving surface of the image sensor is Location is the exposure surface and the light receiving surface adjusting mechanism of the camera, characterized in that to match the position of the focal plane of the object image. 2. The pressure plate, wherein the surface of the pressure plate is disposed behind the position of the exposure surface of the silver halide film by the thickness of the silver halide film when the back cover for film is mounted on a camera body. The exposure surface and light receiving surface adjusting mechanism of the camera according to claim 1, wherein the mechanism is provided inside the film back cover. 3. The exposure surface defining means presses the back surface of the silver halide film against the pressure plate when the back cover for film is mounted on a camera body, to thereby adjust the position of the exposure surface of the silver halide film. 3. The mechanism for adjusting an exposure surface and a light receiving surface of a camera according to claim 2, wherein the mechanism is defined. 4. The exposure surface defining means has two sprockets on both sides of the pressure plate so as not to block the recording area of the silver halide film, and engages the silver halide film with the sprocket. The exposure surface and light receiving surface adjusting mechanism of the camera according to claim 3, wherein the silver halide film is pressed against the pressure plate. 5. The method according to claim 1, wherein the sprocket is engaged with the silver halide film from an exposure surface side of the silver halide film, and a position of the engagement portion is behind a position of a surface of the pressure plate. The mechanism for adjusting the exposure surface and the light receiving surface of the camera according to claim 4. 6. The image pickup device is provided on a back cover of a camera, and when the imaging back cover provided with the image pickup device is attached to a camera body, the position of the surface of the image pickup device is the silver halide film. 2. The exposure surface and light receiving surface adjusting mechanism of the camera according to claim 1, wherein the mechanism is attached to the inside of the imaging back cover so as to coincide with the position of the exposure surface. 7. The exposure of a camera according to claim 6, wherein by mounting the back cover for the image sensor on the camera body, the image capturing operation control means can capture an image of a subject. Surface and light receiving surface adjustment mechanism. 8. The camera according to claim 7, wherein a subject image formed on the light receiving surface of the image sensor by the image pickup operation control means is recorded as image data in a memory. Surface adjustment mechanism. 9. The image pickup device according to claim 1, wherein the image pickup device has a thickness greater than that of the silver halide film, and a light receiving surface of the image pickup device is located inside the image pickup device. Exposure surface and light receiving surface adjustment mechanism of the camera. 10. An image forming area of the image pickup device is the same size as a recording region of the silver halide film, and a size of the image pickup device is larger than a recording region of the silver halide film. An exposure surface and light receiving surface adjustment mechanism for the camera according to claim 1.