JP3563997B2 - Camera exposure and light receiving surface adjustment mechanism - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a silver halide digital still camera that can record a subject image on a silver halide film and also record the same subject image as image data in a memory. The present invention relates to a single-lens reflex type silver halide digital still camera capable of selectively recording an image.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a single-lens reflex type silver halide digital still camera capable of recording an image on a silver halide film or capturing an image with an imaging device such as a CCD and recording the image in a memory is known. In such a single-lens reflex camera, two back lids are prepared, when recording an image on a silver halide film, a back lid with a film pressure plate is used, and when capturing an image, A back cover provided with an image sensor is used.
[0003]
When the camera is equipped with a back cover provided with a film pressure plate, the position of the exposure surface of the silver halide film is defined by a film guide member provided in the camera body. Position. On the other hand, when the camera has the back cover provided with the image sensor inside, the image sensor is arranged at the position of the exposure surface of the silver halide film. As a result, the subject image that has passed through the lens is formed on the image sensor, and is recorded in the memory as image data.
[0004]
[Problems to be solved by the invention]
However, the imaging device is generally thicker than the silver halide film, and the light receiving surface of the imaging device is located inside, not on the surface. Therefore, the position of the light receiving surface of the image sensor when the back cover is closed does not match the exposed surface of the silver halide film. That is, the position of the light receiving surface of the image sensor does not match the position of the imaging surface of the subject image. When an image of a subject is taken with such an arrangement of the image sensor, an out-of-focus blurred subject image is recorded in the memory.
[0005]
SUMMARY OF THE INVENTION An object of the present invention is to provide a single-lens reflex type silver halide digital still dual-use camera that can easily match the position of the exposure surface of the silver halide film and the light receiving surface of the image sensor with the position of the imaging surface of the subject image. And
[0006]
[Means for Solving the Problems]
The exposure surface and light receiving surface adjustment mechanism of the camera according to the present invention includes: a photographing operation control unit that controls a photographing operation for recording a subject image on a silver halide film via a photographing optical system; and an imaging device via the photographing optical system. Imaging operation control means for controlling an imaging operation of generating an image signal corresponding to a subject image formed by photoelectric conversion, and a detachably provided rear surface of an imaging optical system, the position of an exposure surface of a silver halide film. A film guide member for defining, and by removing the film guide member, an image pickup device accommodation area for arranging the image pickup device is formed, and by mounting the film guide member, an object image is formed on the silver halide film. It is possible to record, and by removing the film guide member and placing the image sensor in the image sensor housing area, the image is captured by the image sensor. It is possible to image the image, the position of the light receiving surface of the exposed surface and the imaging element of the silver halide film characterized in that coincides with the position of the focal plane of the subject image by the photographing optical system.
[0007]
It is desirable that the film guide member be attachable by screwing in the imaging element housing area.
[0008]
The image sensor is provided on the back cover of the camera, and such that the position of the light receiving surface of the image sensor matches the position of the imaging surface of the subject image when the back cover provided with the image sensor is attached to the camera body. It is desirable to be attached inside the back cover.
[0009]
It is desirable that the back cover provided with the image sensor be mounted on the camera body so that the image capturing operation control means can capture the subject image. The subject image formed on the light receiving surface of the imaging device by the imaging operation control means is preferably recorded as image data in a memory.
[0010]
It is desirable that the image sensor has a thickness greater than that of the silver halide film, and that the light receiving surface of the image sensor be located inside the image sensor. Also, the area of the light receiving surface of the image sensor is the same as the area of the exposed surface of one screen of the silver halide film, and the dimensions of the image sensor are desirably larger than the area of the exposed surface of one screen.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a single lens reflex type silver halide digital still camera which is an embodiment of the present invention will be described with reference to the drawings.
[0012]
FIG. 1 is a diagram showing a main internal configuration of a silver halide digital still camera. In this single-lens reflex camera, a back cover applied when recording an image on a silver halide film and a back cover applied when capturing an image with an image sensor such as a CCD are separately prepared. In FIG. 1, a back cover for recording an image on a silver halide film is attached to a camera body.
[0013]
The photographing optical system 11 includes a plurality of lenses (not shown) and an aperture (not shown), and is detachable from the camera body 10. A back cover U1 for a film is attached to the camera body 10, and a pressure plate 19 for pressing the silver halide film F is provided inside the back cover U1 for a film. In FIG. 1, the optical axis E of the photographing optical system 11 is indicated by an alternate long and short dash line. Hereinafter, the film back lid U1 side is defined as the rear side along the optical axis E, and the photographing optical system 11 side is defined as the front side.
[0014]
A quick return mirror 12 is provided in the camera body 10 and is arranged behind the photographing optical system 11. The quick return mirror 12 can rotate within a range from an inclined position (hereinafter, referred to as a down position) to a horizontal position (hereinafter, referred to as an up position) indicated by a two-dot chain line. While the shutter 17 does not operate (while the silver halide film F is not exposed), the quick return mirror 12 is placed in the down position. When the shutter 17 operates, the quick return mirror 12 is rotated from the down position to the up position. (Bounced up) and stopped in the up position for a predetermined time.
[0015]
When the photographing operation is not performed, the light reflected by the subject M converges through the photographing optical system 11 and is guided by the quick return mirror 12 toward the focusing plate 13. That is, a subject image formed by the photographing optical system 11 is formed on a focus plate 13 provided above the quick return mirror 12, and is observed by the photographer via the pentaprism 14 and the finder 15. At this time, the focus of the observed subject image corresponds to the focus of the subject image on the exposure surface of the silver halide film F. When the observed subject image is in focus, a clear Recorded on film F.
[0016]
A shutter 17 is disposed behind the quick return mirror 12 along the optical axis E. The shutter 17 is provided to adjust the exposure amount of the silver halide film F, and is a so-called focal plane shutter in which a front curtain and a rear curtain move vertically in conjunction with each other. Behind the shutter 17, a film rail adapter (film guide member) 18 for defining the position R of the exposure surface of the silver halide film F is attached. The position of the imaging plane of the subject image is determined at the position R of the exposure surface of the silver halide film F along the optical axis E defined by the film rail adapter 18.
[0017]
The film rail adapter 18 has an opening (not shown) at a portion facing the exposure surface of the silver halide film F, and light passing through the photographing optical system 11 passes through the opening and passes through the silver halide film F To reach. The area of the opening (aperture) coincides with the area of the exposure surface for one screen of the silver halide film F. When the film back cover U1 is mounted on the camera body, the silver halide film F is pressed against the film rail adapter 18 by the press plate 19 attached to the inside of the back cover U1 via a leaf spring (not shown). You.
[0018]
In addition, one end of the film back cover U1 is pivotally attached to the camera body 10, whereby the film back cover U1 can be opened and closed.
[0019]
A release switch (not shown) is provided on the upper part of the camera body 10. When the release switch is fully pressed, the quick return mirror 12 moves to the up position, and the shutter 17 is moved in conjunction with this movement. It is opened for a predetermined time. As a result, the subject image is formed on the exposure surface of the silver halide film F via the opening in the film rail adapter 18.
[0020]
The silver halide film F is stored in a patrone (not shown) in the form of a roll, and the patrone is stored in a patrone room (not shown) provided at one side of the camera body 10. The silver halide film F pulled out of the patrone passes through the movement path of the silver halide film F defined by the pair of guide rails 18a and the guide pieces 18b, and is wound at the other side in the camera body 10. It is wound on a spool (not shown). When the cartridge containing the silver halide film F is loaded into the camera body 10 and the photographing operation is sequentially performed, the silver halide film F is fed while being restrained by the pair of guide rails 18a and the guide pieces 18b. It is moved one screen at a time so as to cross the opening in the rail adapter 18 and is sequentially wound up by the winding spool.
[0021]
Below the quick return mirror 12, an AF (auto focus) unit 30 used for automatic focus adjustment is arranged. The AF unit 30 includes optical lenses 31 and 32, a mirror 33, and a light receiving element. The arranged licensors 34 are provided. A sub-mirror 16 is provided on the back surface of the quick return mirror 12, and when the quick return mirror 12 having the property of a half mirror is at the down position, light passing through the imaging optical system 12 is reflected by the sub-mirror 16, and AF The unit 30 is guided downward. The light that has entered the AF unit 30 is condensed by the optical lenses 31 and 32, and is guided to the light receiving surface of the licensor 34 via the mirror 33. Thereby, the distance between the subject M and the camera body 10 is measured, and the focal length is adjusted. Such automatic focus adjustment is performed when the release switch is half-pressed.
[0022]
When the release switch is half-pressed, the brightness of the subject M is measured by a photometric light receiving element (not shown) provided in the finder 15, thereby determining an appropriate exposure amount for the silver halide film F. .
[0023]
FIG. 2 is a perspective view showing the film rail adapter 18 provided in the camera 10. However, in this drawing, the film rail adapter 18 as viewed from the film back cover U1 is shown.
[0024]
An opening 18c is provided at the center of the film rail adapter 18 so that light (subject image) passing through the photographing optical system 11 reaches the exposure surface of the silver halide film F. The region coincides with the region of the exposure surface for one screen of the silver halide film F.
[0025]
The film rail adapter 18 has a pair of guide rails 18a formed near the upper and lower edges of the opening 18c so as to correspond to the position of the perforation P of the silver halide film F. Further, three guide pieces 18b are formed in pairs on the upper and lower sides of the pair of guide rails 18a, respectively, and the guide pieces 18b are provided so as to correspond to the vertical length I of the silver halide film F. I have. The movement path of the silver halide film F is defined by the guide rails 18a and the guide pieces 18b, and the silver halide film F is fed along the movement path during photographing. At this time, the silver halide film F comes into sliding contact with the pressure plate 19 provided inside the film back cover U1.
[0026]
The film rail adapter 18 is provided so as to be detachable in the camera body 10, and a pair of screw holes 18d is provided on both sides in the longitudinal direction of the film rail adapter 18. When an image is recorded on the silver halide film F, that is, when the film back cover U1 is used, a screw (not shown) is passed through a screw hole 18d, and a screw hole (not shown) provided in the camera body 10. ). Thus, the film rail adapter 18 is fixed at a position behind the photographing optical system 11 (back of the shutter 17) along the optical axis E.
[0027]
FIG. 3 is a diagram showing a main electric circuit that operates when the film back cover U1 is attached to the camera body 10. As shown in FIG.
[0028]
The system control circuit 40 has a CPU (not shown) for arithmetic processing inside, and performs overall control of the camera body 10.
[0029]
A power switch 49, a release half-press switch 50, a release full-press switch 51, and a film back detection circuit 48 are connected to the system control circuit 40. The release half-press switch 50 and the release full-press switch 51 are switches for detecting the pressed state of the release switch provided on the upper part of the camera body 10, and the film back detection circuit 48 includes a back cover U1 for film. Is a circuit for detecting that the camera body 10 is mounted. When the power switch 49 is turned on, the silver halide film F is loaded into the camera body 10, and the back lid U1 for a film is mounted on the camera body 10, an image of the subject M can be recorded on the silver halide film F. When the release switch is fully depressed, the subject image passing through the photographing optical system 11 is recorded on the silver halide film F by opening the shutter 17. Note that a power supply circuit 52 is connected to the system control circuit 40.
[0030]
In the photometric circuit 46, the brightness of the subject M is measured based on the amount of light detected by the light receiving element in the viewfinder 15 shown in FIG. Then, an appropriate exposure amount is obtained based on the measured brightness, and the shutter speed of the shutter 17 and the aperture value of the aperture Z are determined. In the distance measuring circuit 47, the distance between the subject M and the camera body 10 is measured based on the distance data detected by the AF unit 30 (see FIG. 1). Then, the lens provided in the photographing optical system 11 is driven by the lens driving circuit 42 based on the measured distance. Such photometry and distance measurement are executed when the release half-press switch 50 is turned on.
[0031]
The shutter 17 is driven by a shutter drive circuit 44, and the aperture Z is also stopped down by the aperture drive circuit 53. The drive of the shutter 17 and the drive of the aperture Z are executed when the release full-press switch 51 is turned on. At this time, the aperture Z is driven according to an aperture value determined based on photometry. The shutter 17 is also driven according to a shutter speed determined based on photometry. In the strobe circuit 45, strobe light emission control is performed.
[0032]
The frame number detection circuit 54 detects the feed amount of the silver halide film F by counting the perforations of the silver halide film F. The film sensitivity detection circuit 55 detects the sensitivity of the silver halide film F. The film winding / rewinding drive circuit 43 controls winding and rewinding of the silver halide film F.
[0033]
FIG. 4 is a plan view of the image sensor applied in the present embodiment as viewed from the front. FIG. 5 is a side view of the image sensor, partially showing the inside of the image sensor. The position of the light receiving surface of the image sensor will be described with reference to FIGS.
[0034]
FIG. 4 shows a CCD 41 which is a solid-state imaging device applied in the present embodiment. When light strikes a sensor (light receiving surface) C on which a photoelectric conversion element is provided, an image signal is generated by photoelectric conversion. I do. The region (hatched portion) H of the sensor C is formed so as to be equal to the region of the exposure surface for one screen of the silver halide film F.
[0035]
Generally, in order to protect the sensor C, a colorless and transparent cover glass G is put on the sensor C on the solid-state imaging device such as the CCD 41. Therefore, the dimensions of the CCD 41 are larger than the area of the exposed surface of the silver halide film F. That is, the dimensions of the CCD 41 are larger than the area (aperture) of the opening 18c in the film rail adapter 18.
[0036]
As shown in FIG. 5, the surface on the light receiving surface side of the CCD 41 is formed by a cover glass G covering the sensor C, and an air layer A is secured between the sensor C and the cover glass G. . Therefore, the thickness D of the CCD 41 is the total thickness of the cover glass G and the sensor C and the air layer A. On the back side of the CCD 41, pins PN for arranging the CCD 41 on a circuit board are mounted side by side.
[0037]
As described above, the thickness D of the CCD 41 is larger than the thickness of the silver halide film F, and the sensor C is located inside the CCD 41 instead of the surface of the CCD 41 on the film rail adapter 18 side. That is, the sensor C, which is the light receiving surface of the CCD 41, is located behind the surface of the CCD 41 along the optical axis. Therefore, even if the CCD 41 is pressed against the film rail adapter 18, the sensor C inside the CCD 41 does not coincide with the position of the image forming plane of the subject image adjusted to the position of the exposure surface of the silver halide film F.
[0038]
When the area of the sensor C in the CCD 41 is equal to the area of the exposure surface of the silver halide film F, the dimensions of the CCD 41 main body are adjusted to the area of the exposure surface of the silver halide film F, that is, the area of the opening 18 c in the film rail adapter 18. The CCD 41 is moved toward the photographing optical system 11 through the opening 18c to make the position of the sensor C coincide with the position of the exposure surface of the silver halide film F, that is, the position of the imaging surface of the subject image. Can not.
[0039]
Therefore, in the present embodiment, in order to match the position of the sensor C of the CCD 41 with the position of the image forming plane of the subject image, the film rail adapter 18 is detached from the camera body 10 when capturing the subject M.
[0040]
FIG. 6 is a diagram showing an internal configuration of the camera when a back cover provided with an image sensor is attached. However, the internal configuration of the camera is the same as that shown in FIG. 1 except that the film rail adapter 18 is removed and a back cover for imaging is attached.
[0041]
Behind the CCD 41, a circuit board CT to which pins PN are soldered is provided, and the fixing screw N is inserted into a screw hole Q provided inside the imaging back cover U2 via the circuit board CT. Can be fitted. Thus, the CCD 41 is fixed to the imaging back cover U2.
[0042]
Since the film rail adapter 18 has been removed, an image sensor housing area large enough to house the CCD 41 is formed behind the shutter 17. When the camera back lid U2 is attached to the camera body 10, the surface of the CCD 41 moves forward from the position of the exposure surface of the silver halide film F, and the position of the sensor C of the CCD 41 moves to the position of the exposure surface of the silver halide film F. , That is, the position of the imaging plane of the subject image, the CCD 41 is attached to the imaging back lid U2.
[0043]
An LCD (not shown), which is a liquid crystal display device, is provided on the front side of the imaging back cover U2, and the captured subject image is displayed. A mode selection dial (not shown) is provided on the upper part of the camera body 10, and, for example, an aperture priority mode, a shutter priority mode, a reproduction mode, and the like are selected by operating the mode selection dial. Further, an up switch and a down switch (both not shown) are provided on the upper portion of the camera body 10, and for example, an aperture value in the aperture priority mode is selected by operating the up switch and the down switch.
[0044]
FIG. 7 is a diagram showing the position of the image forming plane of the subject image when the two back lids U1 and U2 are attached to the camera body 10, respectively.
[0045]
As shown in FIG. 7, when the film back cover U1 was attached to the camera body 10, the film rail adapter 18 was attached to the inside of the camera body 10, and the imaging back cover U2 was attached to the camera body 10. In this case, the film rail adapter 18 is removed from the camera body 10. Thereby, the positions of the exposure surface of the silver halide film F and the sensor C (light receiving surface) of the CCD 41 coincide with the position of the image forming surface of the subject image.
[0046]
FIG. 8 is a block diagram showing main electric circuits that operate when the imaging back cover U2 is attached to the camera body 10. The circuit board CT on which the CCD 41 is disposed is connected to a circuit board (not shown) in the camera body 10 when the camera back lid U2 is mounted on the camera body 10.
[0047]
The system control circuit 40 is connected to an up switch 54, a down switch 55, a selection mode detection circuit 56, and a digital back detection circuit 57 in addition to the power switch 49, the release half-press switch 50, and the release full-press switch 51. . The mode selection detection circuit 56 detects the mode selected by operating the mode selection dial. In addition, the digital back detection circuit 57 detects the attachment of the imaging back cover U2 to the camera body 10.
[0048]
When an imaging operation is performed with the imaging back lid U2 attached to the camera body 10, a subject image is formed on the sensor C of the CCD 41, and an image signal corresponding thereto is generated by photoelectric conversion. The CCD 41 is controlled by a CCD drive circuit 60, and an image signal for one screen is read out by the CCD drive circuit 60. The reset noise of the image signal read from the CCD 41 is removed by a correlated double sampling circuit (CDS) 61, and the analog signal is converted into a digital signal by an A / D converter 62.
[0049]
The digitized image signal is sent to the signal processing circuit 63. In the signal processing circuit 63, various image processing such as gamma correction and contour correction processing are performed, and the processed image signal is sent to the field memory 70 via the system control circuit 40. As a result, an image signal for one screen is temporarily stored in the field memory 70.
[0050]
The image signal temporarily stored in the field memory 70 is sent again to the system control circuit 40 and is subjected to compression processing. The compressed image signal is stored in the flash memory 72 as image data. The control of writing and reading of image signals to and from the field memory 70 is performed by the field memory controller 67, and the control of writing and reading of image signals to and from the flash memory 72 is performed by the flash memory controller 71.
[0051]
When the reproduction mode is selected by the mode selection dial and the image recorded on the LCD 66 is reproduced, the stored image data is read from the flash memory 72, decompressed by the system control circuit 40, and temporarily stored in the field memory 70. Sent to The image signal temporarily stored in the field memory 70 is sent to the D / A converter 64 via the system control circuit 40, and is converted from a digital signal to an analog signal.
[0052]
The analog image signal is subjected to predetermined processing in an LCD drive circuit 65, and a voltage is applied to the LCD 66 based on the image signal to drive the LCD 66. Then, when the backlight 69 is turned on, the subject image is reproduced and displayed on the LCD 66. The lighting of the backlight 69 is controlled by the backlight drive circuit 68.
[0053]
The timing generator 58 controls the CCD drive circuit 60, the CDS 61, the A / D converter 33, the signal processing circuit 63, the D / A converter 64, the LCD drive circuit 65, and the field memory controller 67 based on the control of the system control circuit 40. In response to this, a sample pulse or the like is output to control these operations.
[0054]
FIG. 9 is a flowchart showing the procedure of the photographing operation and the imaging operation. When the back lid U1 for film or the back lid U2 for imaging is attached to the camera body 10, a photographing operation or a photographing operation is started.
[0055]
In step 101, it is determined whether or not the camera back lid U2 is attached to the camera body 10. That is, it is determined whether or not the imaging back cover U2 is attached to the camera body 10 and is in a closed state.
[0056]
If it is determined in step 101 that the imaging back cover U2 is not mounted and the back cover U1 for film is mounted, the process proceeds to step 102. However, it is assumed that the film rail adapter 18 is mounted in the camera body 10. In step 102, the system control circuit 40 is set to execute the photographing operation, and the process proceeds to step 103. In step 103, it is determined whether the release switch is half-pressed and the release half-press switch 50 is ON. If it is determined that the release half-press switch 50 is in the ON state, the process proceeds to step 104. When it is determined that the release half-push switch 50 is not in the ON state, Step 103 is repeatedly executed until the release-push switch 50 is turned ON.
[0057]
In step 104, the brightness of the subject and the distance to the subject are measured by the distance measuring circuit 46 and the photometric circuit 57. Then, an aperture value and a shutter speed are determined based on the measured brightness, and automatic focus adjustment is performed based on the measured distance. When the photometry and the automatic focus adjustment are performed, the process proceeds to step 105.
[0058]
In step 105, it is determined whether or not the release switch is released and the release switch 50 is in the OFF state. If it is determined that the release push switch 50 is in the OFF state, the process returns to step 103. If it is determined that the release push switch 50 is not in the OFF state, the process proceeds to step 106.
[0059]
In step 106, it is determined whether the release switch is fully pressed and the release full-press switch 51 is ON. If it is determined that the release full-press switch 51 is in the ON state, the process proceeds to step 107. If it is determined that the release full-press switch 51 is not in the ON state, the process returns to step 105.
[0060]
In step 107, the aperture Z is reduced to the aperture value determined in step 104, and the shutter 17 is opened for a time determined in step 104. The silver halide film F is exposed by the driving of the diaphragm Z and the shutter 17 as described above. At this time, the position of the exposure surface of the silver halide film F coincides with the position of the imaging surface of the subject image, and the focused subject image is recorded on the silver halide film F. When the subject image is recorded on the silver halide film F, the process proceeds to step 108.
[0061]
In step 108, when the silver halide film F is fed by the film winding / rewinding circuit 43 and the silver halide film F is fed, a series of photographing operations ends.
[0062]
If it is determined in step 101 that the imaging back cover U2 has been attached to the camera body 10, the process proceeds to step 109. However, it is assumed that the film rail adapter 18 has been removed from the camera body 10. In step 109, the system control circuit 40 is set so that the imaging operation is performed, and the process proceeds to step 110.
[0063]
The execution of steps 110 to 114 is the same as the execution of steps 103 to 107. That is, when the release switch is half-pressed, distance measurement and photometry are performed, and when the release switch is fully depressed, the CCD 41 is exposed, whereby an image signal corresponding to a subject image is obtained. At this time, the position of the sensor (light receiving surface) C of the CCD 41 matches the position of the imaging surface of the subject image, and the subject image is formed on the sensor C of the CCD 41. Then, in step 115, the image signal is read from the CCD 41 and is compressed in the system control circuit 40. The compressed image signal is stored in the flash memory 72 as image data. When the subject image is stored in the flash memory 72 as image data, a series of imaging operations ends.
[0064]
As described above, according to the present embodiment, the film rail adapter 18 is mounted in the camera body 10 when recording an image on the silver halide film F, and the film rail adapter 18 is removed when capturing an object with the CCD 41. As a result, the position of the sensor C inside the CCD 41 when the imaging back lid U2 is attached to the camera body 10 coincides with the position of the imaging plane of the subject image determined at the position R of the exposure surface of the silver halide film F. Regardless of whether the photographing operation on the silver halide film F or the photographing operation by the CCD 41 is performed, a focused subject image is recorded.
[0065]
The film rail adapter 18 is attached with a screw in the camera body 10. Therefore, the film rail adapter 18 can be easily attached / detached, and switching between the photographing operation and the imaging operation can be performed in a short time without any trouble.
[0066]
Since the film guide member (film rail adapter 18) provided in the conventional single-lens reflex camera for silver halide film is made detachable, the configuration and mechanism of the single-lens reflex camera manufactured up to now can be changed. A single-lens reflex type silver halide digital still camera can be manufactured without major changes.
[0067]
The configuration in which the film rail adapter 18 is provided as in the present embodiment may be applied not only to a single-lens reflex type silver halide digital still camera but also to a compact silver halide digital still camera.
[0068]
【The invention's effect】
As described above, according to the present invention, it is possible to easily match the positions of the exposure surface of the silver halide film and the light receiving surface of the image sensor with the position of the imaging surface of the subject image.
[Brief description of the drawings]
FIG. 1 is a diagram showing an internal configuration of a single-lens reflex camera equipped with a film back cover.
FIG. 2 is a perspective view showing a film rail adapter.
FIG. 3 is a block diagram showing an electric circuit of the camera.
FIG. 4 is a plan view of the image sensor viewed from the front.
FIG. 5 is a side view of the image sensor.
FIG. 6 is a diagram showing an internal configuration of a single-lens reflex camera equipped with an imaging back cover.
FIG. 7 is a diagram illustrating a position of an image forming plane of a subject image.
FIG. 8 is a block diagram showing an electric circuit of the camera.
FIG. 9 is a flowchart showing a procedure of a photographing operation and an imaging operation.
[Explanation of symbols]
11 Shooting optical system
18 Film rail adapter (film guide member)
18a film rail
18b Guide piece
18c opening
41 CCD (Imaging device)
72 Flash memory (memory)
C sensor (light receiving surface)
F Silver halide film
Back cover for U1 film
U2 back cover for imaging

Claims (7)

Shooting operation control means for controlling a shooting operation for recording a subject image on a silver halide film via a shooting optical system,
Imaging operation control means for controlling an imaging operation for generating an image signal corresponding to a subject image formed on an imaging element by photoelectric conversion via the imaging optical system,
A film guide member for defining a position of an exposure surface of the silver halide film, which is provided detachably behind the photographing optical system,
By removing the film guide member, an image sensor housing area for arranging the image sensor is formed,
By mounting the film guide member, a subject image can be recorded on the silver halide film, and by removing the film guide member and disposing the image pickup device in the image pickup device housing area, the image pickup can be performed. An element image can be captured by the element, and a position of an exposure surface of the silver halide film and a position of a light receiving surface of the image sensor coincide with a position of an image plane of the object image by the imaging optical system. A mechanism for adjusting the exposure surface and light receiving surface of the camera. The exposure surface and light receiving surface adjustment mechanism of the camera according to claim 1, wherein the film guide member is attachable by screwing in the image pickup device housing area. The image sensor is provided on the back cover of a camera, and the position of the light receiving surface of the image sensor when the back cover provided with the image sensor is attached to the camera body and the position of the image forming surface of the subject image The mechanism for adjusting an exposure surface and a light receiving surface of a camera according to claim 1, wherein the mechanism is attached to the inside of the back cover so as to match. 4. The exposure surface of the camera according to claim 3, wherein the back cover provided with the image sensor is mounted on the camera body so that a subject image can be captured by the imaging operation control unit. And light receiving surface adjustment mechanism. The exposure surface and light receiving surface adjusting mechanism of the camera according to claim 4, wherein a subject image formed on the light receiving surface of the image sensor by the image capturing operation control means is recorded as image data in a memory. The exposure surface of the camera according to claim 1, wherein the imaging element has a thickness compared to the silver halide film, and a light receiving surface of the imaging element is located inside the imaging element. And light receiving surface adjustment mechanism. The region of the light receiving surface of the image sensor is the same as the region of the exposure surface for one screen of the silver halide film, and the dimension of the image sensor is larger than the region of the exposure surface for one screen. The exposure surface and light receiving surface adjusting mechanism of the camera according to claim 1 or 3.

Images