JP2000304836A - Hall element for peripheral opposing type hall motor and peripheral opposing type hall motor - Google Patents
Hall element for peripheral opposing type hall motor and peripheral opposing type hall motorInfo
- Publication number
- JP2000304836A JP2000304836A JP11122399A JP11122399A JP2000304836A JP 2000304836 A JP2000304836 A JP 2000304836A JP 11122399 A JP11122399 A JP 11122399A JP 11122399 A JP11122399 A JP 11122399A JP 2000304836 A JP2000304836 A JP 2000304836A
- Authority
- JP
- Japan
- Prior art keywords
- hall element
- hall
- motor
- rotor
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、周対向型ホール
モータ用ホール素子および周対向型ホールモータに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hall element for a circumferentially opposed hall motor and a circumferentially opposed hall motor.
【０００２】[0002]
【従来の技術】小型周対向型ホールモータとしては、例
えば、図３に示すものが知られている。この周対向型ホ
ールモータは、ロータ５５とステータ５０とを有し、ロ
ータ５５は円周方向にＮ極とＳ極が交互に着磁されたマ
グネット５３を有し、ステータ５０はステータコア５２
にステータコイル５４を捲回してなる電磁石を、ロータ
５５のマグネット５３に対向させて配置してあり、ロー
タ５５が軸５７を中心にして回転可能になっている。2. Description of the Related Art As a small circumferentially opposed Hall motor, for example, the one shown in FIG. 3 is known. This circumferentially opposed Hall motor has a rotor 55 and a stator 50. The rotor 55 has a magnet 53 in which N and S poles are alternately magnetized in the circumferential direction.
An electromagnet formed by winding a stator coil 54 is disposed so as to face the magnet 53 of the rotor 55, and the rotor 55 is rotatable about a shaft 57.
【０００３】この周対向型ホールモータの基板５６に
は、ロータ５５のマグネット５３の磁束密度に応じた検
出電圧を出力しモータ制御器に信号を送るホール素子５
１が、ステータ５０のステータコア５２の先端付近で、
ステータコアとステータコアの間に配置されている。A hall element 5 for outputting a detection voltage corresponding to the magnetic flux density of the magnet 53 of the rotor 55 and sending a signal to a motor controller is provided on a substrate 56 of the circumferentially opposed Hall motor.
1 is near the tip of the stator core 52 of the stator 50,
It is arranged between the stator cores.
【０００４】このホール素子５１は小型の表面実装タイ
プのものであって、図４に示すように、感磁部ペレット
３２がパッケージ３５の中央部のダイパッド３６に配置
されている。このホール素子５１は、基板５６に取り付
けられた場合に感磁部ペレット３２の感磁部３４が基板
５６に対向するように、リードフォーミングが施されて
いる（図５参照）。The Hall element 51 is of a small surface mount type. As shown in FIG. 4, a magnetosensitive part pellet 32 is arranged on a die pad 36 at the center of a package 35. The Hall element 51 is subjected to lead forming such that the magnetically sensitive part 34 of the magnetically sensitive part pellet 32 faces the substrate 56 when attached to the substrate 56 (see FIG. 5).
【０００５】[0005]
【発明が解決しようとする課題】このように、ホール素
子５１がステータ５０のステータコア５２の先端付近で
ステータコアとステータコアの間に配置されているの
で、ステータ５０を構成するステータコイル５４により
発生された磁界がノイズとして検出され、ホールモータ
の回転を安定させる上で不具合が生じるという問題点が
あった。As described above, since the Hall element 51 is disposed between the stator core and the stator core near the tip of the stator core 52 of the stator 50, the Hall element 51 is generated by the stator coil 54 constituting the stator 50. There is a problem that a magnetic field is detected as noise and a problem occurs in stabilizing the rotation of the Hall motor.
【０００６】また、感磁部３４が基板５６側に向けられ
ているので、ホール素子パッケージ内での磁気的なギャ
ップによりロータと感磁部３４との距離が相対的に大き
くなるため、感磁部３４での磁束密度を大きくするには
限界があり、従って、ホール素子５１の出力電圧をより
大きくするには限界があった。Further, since the magnetic sensing portion 34 is directed toward the substrate 56, the distance between the rotor and the magnetic sensing portion 34 becomes relatively large due to a magnetic gap in the Hall element package. There is a limit in increasing the magnetic flux density in the portion 34, and thus there is a limit in increasing the output voltage of the Hall element 51.
【０００７】本発明の第１の目的は、このような問題点
を解決し、周対向型ホールモータに取り付けた場合に、
ステータの磁界に起因するノイズを低減させることがで
きるとともに、出力電圧をより大きくすることができる
周対向型ホールモータ用ホール素子を提供することにあ
る。[0007] A first object of the present invention is to solve such a problem, and when mounted on a circumferentially opposed hall motor,
It is an object of the present invention to provide a hall element for a circumferentially opposed hall motor that can reduce noise caused by a magnetic field of a stator and can further increase an output voltage.
【０００８】本発明の第２の目的は、このような問題点
を解決し、より円滑に回転させることができる周対向型
ホールモータを提供することにある。A second object of the present invention is to solve such a problem and to provide a circumferentially opposed Hall motor that can be rotated more smoothly.
【０００９】[0009]
【課題を解決するための手段】本発明の周対向型ホール
モータ用ホール素子は、ダイパッド上にホール素子ペレ
ットを設け、該ホール素子ペレットのボンディングパッ
ドをリードと電気的に接続し、モールドパッケージ化し
た周対向型ホールモータ用ホール素子において、前記ホ
ール素子ペレットを設けた前記ダイパッドをパッケージ
の中心部からその長手方向にずらして設けたことを特徴
とする。According to the present invention, there is provided a Hall element for a circumferentially opposed type hole motor, wherein a Hall element pellet is provided on a die pad, and a bonding pad of the Hall element pellet is electrically connected to a lead to form a mold package. In the above-described hall element for a circumferentially opposed type hole motor, the die pad provided with the hall element pellet is provided so as to be displaced from the center of the package in the longitudinal direction.
【００１０】この周対向型ホールモータ用ホール素子
は、リードを、ダイパッド上のホール素子ペレット上面
に対して逆向きに設けることができる。In this Hall element for a peripherally opposed Hall motor, the leads can be provided in a direction opposite to the upper surface of the Hall element pellet on the die pad.
【００１１】本発明の周対向型ホールモータは、円周方
向にＮ極とＳ極を交互に着磁してなるロータと、巻き線
を捲回したステータコアを所定の個数だけ前記ロータに
対向させて配置してなるステータとを備え、請求項１に
記載の周対向型ホールモータ用ホール素子を、所定の取
り付け位置に、そのパッケージ内のホール素子ペレット
との距離が短い側のパッケージ端を前記ロータ側に向け
て取り付けたことを特徴とする。A circumferentially opposed Hall motor according to the present invention comprises a rotor formed by alternately magnetizing north and south poles in a circumferential direction, and a predetermined number of stator cores having windings wound facing the rotor. A hall element for a circumferentially opposed Hall motor according to claim 1, wherein the package end on a side where a distance from a hall element pellet in the package is short is located at a predetermined mounting position. It is characterized by being attached to the rotor side.
【００１２】本発明の周対向型ホールモータは、円周方
向にＮ極とＳ極を交互に着磁してなるロータと、巻き線
を捲回したステータコアを所定の個数だけ前記ロータに
対向させて配置してなるステータとを備え、請求項２に
記載の周対向型ホールモータ用ホール素子を、所定の取
り付け位置に、そのパッケージ内のホール素子ペレット
との距離が短い側のパッケージ端を前記ロータ側に向け
て取り付けたことを特徴とする。A circumferentially opposed Hall motor according to the present invention comprises a rotor formed by alternately magnetizing N poles and S poles in a circumferential direction, and a predetermined number of stator cores wound with windings facing the rotor. And a circumferentially opposed Hall motor Hall element according to claim 2, wherein the package end on the side where the distance from the Hall element pellet in the package is short is located at a predetermined mounting position. It is characterized by being attached to the rotor side.
【００１３】本発明で用いるペレットは、アルミナやフ
ェライトのようなセラミック，ガラス，有機物，あるい
はＳｉやＧａＡｓなどの半導体単結晶などの物質で作ら
れる。その表面上に真空蒸着などの手法で、ＩｎＡｓ，
ＧａＡｓ，ＩｎＳｂなどの高電子移動度を示す半導体薄
膜を形成したのちパターニングを行い、あるいはＧａＡ
ｓなどの基板にシリコンなどをイオン注入して活性層を
形成した後パターニングを行ってなる感磁部が配置され
ている。The pellet used in the present invention is made of a material such as ceramics such as alumina or ferrite, glass, an organic material, or a semiconductor single crystal such as Si or GaAs. On the surface, InAs,
After forming a semiconductor thin film such as GaAs or InSb which shows high electron mobility, patterning is performed, or GaAs or InSb is formed.
A magnetically sensitive portion is formed by patterning after forming an active layer by ion implantation of silicon or the like into a substrate such as s.
【００１４】[0014]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１５】本発明は、ホールモータのステータの磁界
に起因するノイズを低減させるとともに、ホール素子の
出力電圧をより大きくするため、ホール素子パッケージ
内で、感磁部ペレットの感磁部の中心を、ホール素子パ
ッケージの中心からロータ側にずらすようにした。According to the present invention, in order to reduce the noise caused by the magnetic field of the stator of the Hall motor and to further increase the output voltage of the Hall element, the center of the magnetically sensitive part of the magnetically sensitive part pellet is located within the Hall element package. The center of the Hall element package is shifted to the rotor side.
【００１６】ホール素子パッケージ内で、感磁部ペレッ
トの感磁部の中心を、ホール素子パッケージの中心から
ロータ側にずらすには、（１）感磁部ペレット上で感磁
部の中央部をシフトさせるか、（２）感磁部ペレットそ
のものの位置をホール素子パッケージ内でホール素子パ
ッケージ中心からシフトさせるか、（３）上記（１），
（２）の方法を同時に行うかが考えられる。To shift the center of the magneto-sensitive part of the magneto-sensitive element pellet from the center of the Hall element package to the rotor side in the Hall element package, (1) (2) shifting the position of the magnetosensitive part pellet itself from the center of the Hall element package in the Hall element package;
It is conceivable that the method (2) is performed simultaneously.
【００１７】上記（１）のようにしたホール素子を作製
する場合、感磁部ペレット内にむだな面積が生じること
になり、感磁部ペレット、ひいてはホール素子を小型化
することが困難になり、その上、コスト的にも好ましく
ない。When manufacturing the Hall element as described in the above (1), a useless area is generated in the magnetically sensitive part pellet, and it becomes difficult to reduce the size of the magnetically sensitive part pellet and, consequently, the Hall element. In addition, it is not preferable in terms of cost.
【００１８】上記（２）のようにしたホール素子を作製
する場合、感磁部ペレットのコストは同一である上、他
の製造工程も通常の表面実装型ホール素子と同一もしく
は非常に近いものとすることができ、安定した生産が可
能である。When manufacturing the Hall element as described in (2) above, the cost of the magneto-sensitive part pellet is the same, and the other manufacturing steps are the same as or very close to those of the ordinary surface mount Hall element. And stable production is possible.
【００１９】そこで、上記（２）のようにしたホール素
子を第１の実施の形態で詳細に説明する。Therefore, the Hall element according to the above (2) will be described in detail in the first embodiment.
【００２０】本発明で用いるホール素子の感磁部の材料
としては、III−V族化合物半導体が用いられ、特に、Ｉ
ｎＡｓ，ＩｎＳｂ，ＧａＡｓが好ましい。As the material of the magnetic sensing portion of the Hall element used in the present invention, a III-V compound semiconductor is used.
nAs, InSb, and GaAs are preferred.
【００２１】＜第１の実施の形態＞図１は本発明の第１
の実施の形態を示す。図１において、１１はリードフレ
ームであって、その厚さが０．１５ｍｍであり、リード
間隔は規格通りであるが、ダイパッド１６のみが中心部
からリードフレームの長手方向にずらして設けてある。
１２はＩｎＡｓホール素子ペレット（以下、単にペレッ
トという）であって、０．３６ｍｍ角であり、その厚さ
が０．３ｍｍである。<First Embodiment> FIG. 1 shows a first embodiment of the present invention.
An embodiment will be described. In FIG. 1, reference numeral 11 denotes a lead frame having a thickness of 0.15 mm and a lead interval as specified, but only the die pad 16 is provided shifted from the center in the longitudinal direction of the lead frame.
Reference numeral 12 denotes an InAs Hall element pellet (hereinafter simply referred to as a pellet), which is 0.36 mm square and 0.3 mm in thickness.
【００２２】このペレット１２は慣用の方法により得ら
れたものである。直径５０．８ｍｍの半絶縁性ＧａＡｓ
基板上に、ＩｎＡｓを蒸着し、ついで、パターニングを
施して感磁部を形成し、さらに、電極パターンおよびボ
ンディングパッドを形成することにより当該基板上に所
定数のホール素子が得られ、その後、所定数のホール素
子が形成された半絶縁性ＧａＡｓ基板をダイシングする
ことにより所定数のホール素子ペレットが得られる。The pellets 12 are obtained by a conventional method. 50.8 mm diameter semi-insulating GaAs
On the substrate, InAs is deposited, followed by patterning to form a magneto-sensitive portion, and further, by forming an electrode pattern and a bonding pad, a predetermined number of Hall elements are obtained on the substrate. By dicing the semi-insulating GaAs substrate on which a number of Hall elements are formed, a predetermined number of Hall element pellets can be obtained.
【００２３】ペレット１２は、慣用の方法により、リー
ドフレーム１１のダイパッド１６上にダイボンディング
され、ダイボンディングされたペレット１２は４つのボ
ンディングパッドがワイヤ１３により所定のリードにワ
イヤボンディングされる。ワイヤボンディングが終了す
ると、リードフレーム１１は従来例と同一のモールド金
型でトランスファモールドによりエポキシ樹脂封止さ
れ、その後、図５に示すようにリードフォーミングが施
される。The pellet 12 is die-bonded to the die pad 16 of the lead frame 11 by a conventional method, and the die-bonded pellet 12 has four bonding pads wire-bonded to predetermined leads by wires 13. When the wire bonding is completed, the lead frame 11 is sealed with epoxy resin by transfer molding using the same mold as in the conventional example, and thereafter, lead forming is performed as shown in FIG.
【００２４】パッケージングされたホール素子の感磁部
１５の中心は、ホール素子パッケージの中心部より０．
６ｍｍだけ端にずれた位置、すなわち、ホール素子パッ
ケージ側端から０．４ｍｍの位置に感磁部１５の中心が
位置するようになった。The center of the magnetic sensing part 15 of the packaged Hall element is 0.1 mm from the center of the Hall element package.
The center of the magneto-sensitive portion 15 is located at a position shifted to the end by 6 mm, that is, a position 0.4 mm from the end of the Hall element package.
【００２５】このようにして作製したホール素子を図３
に示すホールモータ内の従来と同一取り付け位置に取り
付けた場合、ホール素子の感磁部１５のみが従来例に比
較して０．６ｍｍだけロータ５５側にずれた位置に位置
するようになった。よって、感磁部１５における磁束密
度が従来例に比較して増加した。FIG. 3 shows the Hall element thus manufactured.
(1), only the magneto-sensitive portion 15 of the Hall element is located at a position shifted by 0.6 mm toward the rotor 55 as compared with the conventional example. Therefore, the magnetic flux density in the magnetic sensing part 15 was increased as compared with the conventional example.
【００２６】実施例を説明すると、このホール素子をホ
ールモータに取り付け、ロータを回転させて出力電圧波
形を観測したところ、ロータからの磁界による出力電圧
が２０ｍＶp-pであり、ステータコイルからのノイズ磁
界による出力電圧が５ｍＶp-pであり、従って、Ｓ／Ｎ
比は４であった。このようにＳ／Ｎ比が従来例に比較し
て向上したので、ホールモータがより円滑に回転するよ
うになった。To explain the embodiment, when this Hall element is mounted on a Hall motor and the rotor is rotated to observe the output voltage waveform, the output voltage due to the magnetic field from the rotor is 20 mVp-p, and the noise from the stator coil is The output voltage due to the magnetic field is 5 mVp-p and therefore the S / N
The ratio was 4. As described above, the S / N ratio is improved as compared with the conventional example, so that the hall motor rotates more smoothly.
【００２７】これに対して、従来の技術の項で説明した
タイプのホール素子は、ホール素子の感磁部の中心が、
ホール素子パッケージの中心部、すなわち、ホール素子
パッケージ側端から１．０ｍｍの位置に位置している。
このホール素子をホールモータに取り付け、ロータを回
転させて出力電圧波形を観測したところ、ロータからの
磁界による出力電圧が１０ｍＶp-pであり、ステータコ
イルからのノイズ磁界による出力電圧が１０ｍＶp-pで
あり、従って、Ｓ／Ｎ比が１であった。On the other hand, in the Hall element of the type described in the section of the prior art, the center of the magneto-sensitive portion of the Hall element is
It is located at the center of the Hall element package, that is, at a position 1.0 mm from the side end of the Hall element package.
When this Hall element was mounted on a Hall motor and the rotor was rotated to observe the output voltage waveform, the output voltage due to the magnetic field from the rotor was 10 mVp-p, and the output voltage due to the noise magnetic field from the stator coil was 10 mVp-p. And therefore the S / N ratio was 1.
【００２８】従って、本実施の形態のホール素子は、ス
テータの磁界に起因するノイズを低減させることができ
るとともに、出力電圧をより大きくすることができた。Therefore, the Hall element according to the present embodiment can reduce noise caused by the magnetic field of the stator and can further increase the output voltage.
【００２９】＜第２の実施の形態＞本実施の形態は第１
の実施の形態との比較でいえば、リードの方向が異な
る。すなわち、第１の実施の形態では、図５に示すよう
に、リードが感磁部側にくるように、すなわち、感磁部
がホール素子パッケージの下面側にくるようにリードフ
ォーミングを施した。その結果、感磁部１５がホール素
子パッケージ上面から０．５５ｍｍの位置に位置するよ
うになった。これに対して、本実施の形態では、図２に
示すように、リードが感磁部１５と逆側にくるように、
すなわち、感磁部１５がホール素子パッケージの上面側
にくるようにリードフォーミングを施した。その結果、
感磁部１５がホール素子パッケージ上面から０．２５ｍ
ｍの位置に位置するようになった。<Second Embodiment> This embodiment is a first embodiment.
In comparison with the embodiment, the direction of the lead is different. That is, in the first embodiment, as shown in FIG. 5, the lead forming is performed such that the lead comes to the magnetic sensing part side, that is, the magnetic sensing part comes to the lower surface side of the Hall element package. As a result, the magnetic sensing part 15 is located at a position of 0.55 mm from the upper surface of the Hall element package. On the other hand, in the present embodiment, as shown in FIG.
That is, lead forming was performed so that the magnetically sensitive portion 15 was located on the upper surface side of the Hall element package. as a result,
The magnetic sensing part 15 is 0.25 m from the top of the Hall element package.
m.
【００３０】実施例を説明すると、このように作製した
ホール素子をホールモータ内の第１の実施の形態と同一
の取り付け位置に取り付け、ロータを回転させて出力電
圧波形を観測したところ、ロータからの磁界による出力
電圧が２８ｍＶp-pとなり、ステータコイルからのノイ
ズ磁界による出力電圧は７ｍＶp-pとなって、Ｓ／Ｎ比
は４であった。このように従来例に比較して出力電圧が
高くなり、またＳ／Ｎ比が向上したので、ホールモータ
がより円滑に回転するようになった。To explain the embodiment, the Hall element manufactured in this manner is mounted at the same mounting position in the Hall motor as in the first embodiment, and the output voltage waveform is observed by rotating the rotor. Was 28 mVp-p, the output voltage due to the noise magnetic field from the stator coil was 7 mVp-p, and the S / N ratio was 4. As described above, the output voltage is higher and the S / N ratio is improved as compared with the conventional example, so that the Hall motor rotates more smoothly.
【００３１】[0031]
【発明の効果】以上説明したように、本発明によれば、
本発明に係る周対向型ホールモータ用ホール素子を周対
向型ホールモータ内の取り付け位置に取り付けた場合、
ステータの磁界に起因するノイズを低減させることがで
きるとともに、出力電圧をより大きくすることができ
る。As described above, according to the present invention,
When the hall element for the circumferentially opposed hall motor according to the present invention is attached to a mounting position in the circumferentially opposed hall motor,
The noise caused by the magnetic field of the stator can be reduced, and the output voltage can be further increased.
【図１】本発明の第１の実施の形態を示す一部破断平面
図である。FIG. 1 is a partially broken plan view showing a first embodiment of the present invention.
【図２】本発明の第２の実施の形態を示す断面図であ
る。FIG. 2 is a sectional view showing a second embodiment of the present invention.
【図３】周対向型ＤＣブラシレスモータの構造の一例を
示すとともにホール素子の取り付け位置を示す断面図で
ある。FIG. 3 is a cross-sectional view showing an example of a structure of a circumferentially opposed DC brushless motor and showing a mounting position of a Hall element.
【図４】従来例におけるリードフレームの形状およびダ
イパッドの位置を示す平面図である。FIG. 4 is a plan view showing a shape of a lead frame and a position of a die pad in a conventional example.
【図５】従来例における感磁部ペレットのモールドパッ
ケージ内での配置例を示す断面図である。FIG. 5 is a cross-sectional view showing an example of arrangement of a magneto-sensitive part pellet in a mold package in a conventional example.
１１ リードフレーム １２ ホール素子ペレット １３ ワイヤ １４ モールドパッケージ １５ 感磁部 １６ ダイパッド ５１ ホール素子 ５２ ステータコア ５３ マグネット ５４ ステータコイル ５５ ロータ ５６ 基板 ５７ 軸 DESCRIPTION OF SYMBOLS 11 Lead frame 12 Hall element pellet 13 Wire 14 Mold package 15 Magnetic sensing part 16 Die pad 51 Hall element 52 Stator core 53 Magnet 54 Stator coil 55 Rotor 56 Substrate 57 Axis
Claims (4)
け、該ホール素子ペレットのボンディングパッドをリー
ドと電気的に接続し、モールドパッケージ化した周対向
型ホールモータ用ホール素子において、 前記ホール素子ぺレットを設けた前記ダイパッドをパッ
ケージの中心部からその長手方向にずらして設けたこと
を特徴とする周対向型ホールモータ用ホール素子。A hall element pellet is provided on a die pad, a bonding pad of the hall element pellet is electrically connected to a lead, and the hall element pellet is formed in a mold package. A hall element for a circumferentially opposed type hole motor, wherein the provided die pad is provided so as to be shifted from a center portion of the package in a longitudinal direction thereof.
イパッド上のホール素子ペレット上面に対して逆向きに
設けたことを特徴とする周対向型ホールモータ用ホール
素子。2. The hall element for a circumferentially opposed hall motor according to claim 1, wherein the lead is provided in a direction opposite to an upper surface of the hall element pellet on the die pad.
なるロータと、 巻き線を捲回したステータコアを所定の個数だけ前記ロ
ータに対向させて配置してなるステータとを備え、 請求項１に記載の周対向型ホールモータ用ホール素子
を、所定の取り付け位置に、そのパッケージ内のホール
素子ペレットとの距離が短い側のパッケージ端を前記ロ
ータ側に向けて取り付けたことを特徴とする周対向型ホ
ールモータ。3. A rotor in which N and S poles are alternately magnetized in a circumferential direction, and a stator in which a predetermined number of stator cores having windings wound are arranged to face the rotor. The Hall element for a circumferentially opposed Hall motor according to claim 1 is mounted at a predetermined mounting position, with a package end having a shorter distance from a Hall element pellet in the package facing the rotor. A peripheral facing type hall motor characterized by the following.
なるロータと、 巻き線を捲回したステータコアを所定の個数だけ前記ロ
ータに対向させて配置してなるステータとを備え、 請求項２に記載の周対向型ホールモータ用ホール素子
を、所定の取り付け位置に、そのパッケージ内のホール
素子ペレットとの距離が短い側のパッケージ端を前記ロ
ータ側に向けて取り付けたことを特徴とする周対向型ホ
ールモータ。4. A rotor in which N and S poles are alternately magnetized in a circumferential direction, and a stator in which a predetermined number of stator cores each having a winding are arranged so as to face the rotor. The hall element for a circumferentially opposed hall motor according to claim 2, which is mounted at a predetermined mounting position with a package end having a shorter distance from a hall element pellet in the package facing the rotor side. A peripheral facing type hall motor characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11122399A JP4256978B2 (en) | 1999-04-19 | 1999-04-19 | Circumferentially opposed hall motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11122399A JP4256978B2 (en) | 1999-04-19 | 1999-04-19 | Circumferentially opposed hall motor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000304836A true JP2000304836A (en) | 2000-11-02 |
| JP4256978B2 JP4256978B2 (en) | 2009-04-22 |
Family
ID=14555669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11122399A Expired - Fee Related JP4256978B2 (en) | 1999-04-19 | 1999-04-19 | Circumferentially opposed hall motor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4256978B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007051953A (en) * | 2005-08-18 | 2007-03-01 | Asahi Kasei Electronics Co Ltd | Magnetic encoder |
| JP2012208063A (en) * | 2011-03-30 | 2012-10-25 | Asahi Kasei Electronics Co Ltd | Position detecting device and actuator using the same |
-
1999
- 1999-04-19 JP JP11122399A patent/JP4256978B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007051953A (en) * | 2005-08-18 | 2007-03-01 | Asahi Kasei Electronics Co Ltd | Magnetic encoder |
| JP2012208063A (en) * | 2011-03-30 | 2012-10-25 | Asahi Kasei Electronics Co Ltd | Position detecting device and actuator using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4256978B2 (en) | 2009-04-22 |
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