JP2000304605A - Pyroelectric infrared radiation sensor - Google Patents
Pyroelectric infrared radiation sensorInfo
- Publication number
- JP2000304605A JP2000304605A JP11114358A JP11435899A JP2000304605A JP 2000304605 A JP2000304605 A JP 2000304605A JP 11114358 A JP11114358 A JP 11114358A JP 11435899 A JP11435899 A JP 11435899A JP 2000304605 A JP2000304605 A JP 2000304605A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- cap
- pyroelectric
- infrared radiation
- pyroelectric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、人体等から発せら
れる赤外線を検出する焦電型赤外線センサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pyroelectric infrared sensor for detecting infrared rays emitted from a human body or the like.
【０００２】[0002]
【従来の技術】焦電素子を用いた赤外線センサは、出力
される信号が微弱であるため、該信号をアンプにより増
幅して利用するのが普通である。そのため、電磁波ノイ
ズの影響を受けやすく、誤動作を防止するために金属製
のパッケージ内に納めて、電磁シールド性を実現してい
る。2. Description of the Related Art In an infrared sensor using a pyroelectric element, since an output signal is weak, it is usual that the signal is amplified by an amplifier and used. Therefore, it is easily affected by electromagnetic wave noise, and is housed in a metal package to prevent malfunction, thereby achieving electromagnetic shielding.
【０００３】焦電型赤外線センサの一例を図３に示す。
図３はＴＯ−５型パッケージと呼ばれるパッケージの例
である。FIG. 3 shows an example of a pyroelectric infrared sensor.
FIG. 3 shows an example of a package called a TO-5 type package.
【０００４】焦電型赤外線センサは、焦電素子３と、そ
の焦電素子３を機械的に支持すると共に電気信号を伝え
るスペーサー４と、表面に電気配線パターンを有する回
路基板７と、この回路基板７に実装されるＦＥＴ５およ
び抵抗チップ６と、回路基板７を取付けると共に回路基
板７からの電気信号を外部へ取り出す機能を有する端子
８が取り付けられたステム１２と呼ばれるベース部分
と、赤外線透過フィルターの窓材１が取付けられた蓋の
役目をするキャップ２とで構成されている。そして、ス
テム１２とキャップ２をそれぞれ金属製とし、両者を溶
接することでセンサ内部の気密性を確保すると共に、高
い電磁シールド性を実現している。なお、上記焦電型赤
外線センサでは、回路基板上に抵抗チップを実装してい
るが、焦電素子の抵抗率が小さい場合は、抵抗を用いな
くても構わない。The pyroelectric infrared sensor includes a pyroelectric element 3, a spacer 4 for mechanically supporting the pyroelectric element 3 and transmitting an electric signal, a circuit board 7 having an electric wiring pattern on a surface thereof, An FET 5 and a resistor chip 6 mounted on the substrate 7, a base portion called a stem 12 to which the circuit board 7 is attached and a terminal 8 having a function of extracting an electric signal from the circuit board 7 to the outside, and an infrared transmission filter And a cap 2 serving as a lid to which the window member 1 is attached. The stem 12 and the cap 2 are each made of metal, and the two are welded to ensure airtightness inside the sensor and realize high electromagnetic shielding. In the pyroelectric infrared sensor, a resistor chip is mounted on a circuit board. However, when the resistivity of the pyroelectric element is small, the resistor may not be used.
【０００５】ところが、上記焦電型赤外線センサは、ス
テム１２が比較的高価であること、キャップ２とステム
１２を溶接するための高額な溶接機が必要であることか
ら、焦電型赤外線センサの製造コストが高くなるといっ
た問題があった。However, the pyroelectric infrared sensor has a relatively expensive stem 12 and requires an expensive welding machine for welding the cap 2 and the stem 12. There is a problem that the manufacturing cost is increased.
【０００６】そこで、焦電型赤外線センサのコストを低
下させるために、ステムを使用しない焦電型赤外線セン
サが提案されている（登録実用新案第３００３７０６
号）。上記センサでは、回路基板をキャップ内に挿入
後、キャップの開口部を封止剤で充填封止することで気
密性を確保し、回路基板のグランド配線とキャップを導
通させることで電磁シールド性を得ている。Therefore, in order to reduce the cost of the pyroelectric infrared sensor, a pyroelectric infrared sensor that does not use a stem has been proposed (registered utility model No. 3003706).
issue). In the above sensor, after the circuit board is inserted into the cap, the opening of the cap is filled and sealed with a sealing agent to secure airtightness, and the grounding of the circuit board is electrically connected to the cap to provide electromagnetic shielding. It has gained.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、上記焦
電型赤外線センサでは、無線機等が発する高周波の電磁
ノイズはシールドされるものの、周波数の低い電磁ノイ
ズ、例えば商用電源等に起因する５０Ｈｚ程度の電磁ノ
イズをシールドできなかった。However, in the above-described pyroelectric infrared sensor, high-frequency electromagnetic noise generated by a wireless device or the like is shielded, but low-frequency electromagnetic noise, for example, about 50 Hz caused by a commercial power supply or the like. Electromagnetic noise could not be shielded.
【０００８】そこで本発明の目的は、ステムを使用しな
い焦電型赤外線センサにおいて、センサ内部の気密性を
確保するとともに、低周波から高周波まで充分な電磁シ
ールド性が得られる焦電センサを提供することにある。Accordingly, an object of the present invention is to provide a pyroelectric infrared sensor that does not use a stem and that secures airtightness inside the sensor and provides sufficient electromagnetic shielding from low frequencies to high frequencies. It is in.
【０００９】[0009]
【課題を解決するための手段】上記課題を解決するた
め、本発明の焦電型赤外線センサは、受光する赤外線量
に応じて電気信号を出力する焦電素子とＦＥＴを実装し
た回路基板と、該回路基板に取り付けられた電源端子と
出力端子とグランド端子と、前記焦電素子へ赤外線を取
り入れるための赤外線透過フィルターが取り付けられた
窓を有する金属製のキャップとを備えた焦電型赤外線セ
ンサにおいて、該キャップ内に挿入された回路基板の焦
電素子とＦＥＴが実装されている側と反対側の面が導体
箔で覆われているとともに、回路基板のグランド配線、
グランド端子、導体箔、キャップとが電気的に接続さ
れ、且つ回路基板周縁部のキャップと回路基板の間の隙
間が封止材により封止されていることを特徴としてい
る。In order to solve the above-mentioned problems, a pyroelectric infrared sensor according to the present invention comprises a pyroelectric element for outputting an electric signal in accordance with an amount of infrared light received, a circuit board on which an FET is mounted, and A pyroelectric infrared sensor including a power terminal, an output terminal, a ground terminal attached to the circuit board, and a metal cap having a window with an infrared transmission filter for taking in infrared rays into the pyroelectric element. In the above, the surface of the circuit board inserted into the cap opposite to the side on which the pyroelectric element and the FET are mounted is covered with conductive foil, and the ground wiring of the circuit board,
The ground terminal, the conductive foil, and the cap are electrically connected to each other, and the gap between the cap and the circuit board at the periphery of the circuit board is sealed with a sealing material.
【００１０】本発明では、回路基板の焦電素子等が実装
されている側と反対側の面を導体箔で覆い、この導体箔
を回路基板のグランド配線、グランド端子、キャップと
電気的に接続させているため、低周波から高周波まで充
分な電磁シールド性が得られている。According to the present invention, the surface of the circuit board opposite to the side on which the pyroelectric element and the like are mounted is covered with a conductive foil, and this conductive foil is electrically connected to the ground wiring, the ground terminal, and the cap of the circuit board. Therefore, sufficient electromagnetic shielding properties are obtained from low frequencies to high frequencies.
【００１１】また、回路基板周縁部のキャップと回路基
板の間の隙間を封止材により封止することで、焦電素
子、ＦＥＴが実装されているセンサ内部の気密性を実現
している。Further, by sealing the gap between the cap at the peripheral portion of the circuit board and the circuit board with a sealing material, airtightness inside the sensor on which the pyroelectric element and the FET are mounted is realized.
【００１２】[0012]
【発明の実施の形態】本発明では、回路基板の焦電素子
等が実装されていない側の面を導体箔で覆っているが、
電磁ノイズに対するシールド性を向上させるためには、
導体箔はグランド端子以外の端子と導通しない程度に、
可能な限り全面を覆うことが望ましい。導体箔の材質は
特に問わないが、コストの面から銅箔が好ましい。In the present invention, the surface of the circuit board on which the pyroelectric element and the like are not mounted is covered with a conductive foil.
To improve the shielding performance against electromagnetic noise,
To the extent that the conductive foil does not conduct with terminals other than the ground terminal,
It is desirable to cover the entire surface as much as possible. The material of the conductor foil is not particularly limited, but copper foil is preferred from the viewpoint of cost.
【００１３】回路基板のグランド配線、グランド端子、
導体箔とキャップとの電気的接続には、導電性樹脂や半
田が用いられる。なお、キャップと回路基板のグランド
配線あるいは導体箔の電気的接続に関しては、キャップ
に突起等を設け、この突起のバネ性による機械的な接触
も利用できる。A ground wiring, a ground terminal,
Conductive resin or solder is used for electrical connection between the conductor foil and the cap. For electrical connection between the cap and the ground wiring or conductive foil on the circuit board, a projection or the like may be provided on the cap, and mechanical contact due to the spring property of the projection may be used.
【００１４】また、本発明では、回路基板周縁部のキャ
ップと回路基板の間の隙間を封止材により封止すること
でセンサ内部の気密性を確保しているが、封止材として
は半田または樹脂等が使用できる。In the present invention, the airtightness inside the sensor is ensured by sealing the gap between the cap at the peripheral portion of the circuit board and the circuit board with a sealing material. Alternatively, a resin or the like can be used.
【００１５】半田で封止する場合は、回路基板とキャッ
プが接する回路基板周縁部を、回路基板の外縁全周に渡
って半田付けすることにより、センサ内部の気密性が確
保できる。In the case of sealing with solder, the airtightness inside the sensor can be ensured by soldering the periphery of the circuit board where the circuit board and the cap are in contact with the entire outer periphery of the circuit board.
【００１６】また、封止材として樹脂を用いる場合は、
回路基板周縁部のみならずキャップの開口部全体を樹脂
により封止してもよい。When a resin is used as a sealing material,
Not only the periphery of the circuit board but also the entire opening of the cap may be sealed with resin.
【００１７】[0017]
【実施例】以下、図１と図２に示す実施例に基づいて本
発明を詳細に説明する。 （１）基板側の組み立て 回路基板７には、片面に焦電素子、ＦＥＴ、抵抗を実装
するための電気配線パターンが設けられ、もう一方の面
には全面に導体箔として銅箔９が設けられた両面スルー
ホール基板を用いた。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the embodiments shown in FIGS. (1) Assembly on the Board Side The circuit board 7 is provided with an electric wiring pattern for mounting a pyroelectric element, an FET, and a resistor on one surface, and a copper foil 9 as a conductive foil is provided on the entire surface on the other surface. Used double-sided through-hole substrate.
【００１８】回路基板７に設けた端子穴に３本の端子８
（電源端子、出力端子、グランド端子）を装着し、半田
で回路基板７の電気配線パターンと端子８の一端とを電
気的に接続した。また、グランド端子を装着する端子穴
は、回路基板７のグランド配線と反対面に形成された銅
箔９とを電気的に接続するスルーホールとなっている。Three terminals 8 are provided in terminal holes provided in the circuit board 7.
(Power supply terminal, output terminal, ground terminal) were attached, and the electric wiring pattern of the circuit board 7 was electrically connected to one end of the terminal 8 by soldering. The terminal holes for mounting the ground terminals are through holes that electrically connect the ground wiring of the circuit board 7 and the copper foil 9 formed on the opposite surface.
【００１９】次に、この回路基板７にスペーサー４とＦ
ＥＴ５および抵抗チップ６を取り付け、最後にスペーサ
ー４へ焦電素子３を取り付けた。Next, the spacer 4 and the F
The ET 5 and the resistor chip 6 were attached, and finally, the pyroelectric element 3 was attached to the spacer 4.
【００２０】なお、本実施例では回路基板上に抵抗チッ
プを実装したが、従来の技術でも述べたように焦電素子
の抵抗率が小さい場合は、抵抗を用いなくてもよい。ま
た、焦電素子はスペーサーを用いずに表面に凹凸加工を
施した回路基板の凸部に取り付けてもよい。 （２）キャップへの基板の組み込み 図２に示すように、窓材１を取り付けたキャップ２へ基
板７を組み込んだ後、キャップ２と銅箔９とを半田によ
り接続した。これで、回路基板のグランド配線、グラン
ド端子、導体箔、キャップとが電気的に接続される。In this embodiment, the resistor chip is mounted on the circuit board. However, if the resistivity of the pyroelectric element is small as described in the prior art, the resistor may not be used. Further, the pyroelectric element may be attached to a convex portion of a circuit board whose surface is made uneven without using a spacer. (2) Incorporation of Substrate into Cap As shown in FIG. 2, after incorporating the substrate 7 into the cap 2 to which the window material 1 was attached, the cap 2 and the copper foil 9 were connected by soldering. Thus, the ground wiring, the ground terminal, the conductive foil, and the cap of the circuit board are electrically connected.
【００２１】最後に、キャップ２の開口部を樹脂１１で
充填することでセンサ内部を気密封止した。Finally, the inside of the sensor was hermetically sealed by filling the opening of the cap 2 with the resin 11.
【００２２】なお、本実施例では、キャップ側面に突起
を設けるとともに（図２参照）、キャップと回路基板の
形状を長円とした。突起を設けることによりキャップ内
における回路基板の挿入位置が規定され、長円とするこ
とによりキャップと回路基板の回転方向のズレが防止さ
れる。 （３）評価 本発明の焦電型赤外線センサによれば、比較的高価な構
成部品であるステムを用いなくとも、例えば４［ｋｇ／
ｃｍ2］のヘリウムガス中に１４時間放置した後、ヘリ
ウムリーク検出器で測定されるリーク量は９．９×１０
-9［Ｐａ・ｍ3／ｓ］以下であり、従来のステムを用い
た焦電型赤外線センサと同等の気密性が得られた。In this embodiment, a projection is provided on the side surface of the cap (see FIG. 2), and the shape of the cap and the circuit board are oblong. By providing the projection, the insertion position of the circuit board in the cap is defined, and by making the shape oval, the cap and the circuit board are prevented from being displaced in the rotational direction. (3) Evaluation According to the pyroelectric infrared sensor of the present invention, for example, 4 [kg /
cm 2 ] of helium gas for 14 hours, the leak amount measured by a helium leak detector is 9.9 × 10
−9 [Pa · m 3 / s] or less, and airtightness equivalent to that of a conventional pyroelectric infrared sensor using a stem was obtained.
【００２３】また、５０Ｈｚで約４０ｄＢの増幅率を持
つ商用電源駆動の増幅器に、本発明の焦電型赤外線セン
サを搭載して増幅信号をオシロスコープで観測すると、
５０Ｈｚ成分のノイズは約２０［ｍＶｐ−ｐ］であり、
従来のステムを用いた焦電型赤外線センサと同等の電磁
シールド性が得られる。When the pyroelectric infrared sensor of the present invention is mounted on a commercial power supply driven amplifier having an amplification factor of about 40 dB at 50 Hz, and an amplified signal is observed with an oscilloscope,
The noise of the 50 Hz component is about 20 [mVp-p],
An electromagnetic shielding property equivalent to that of a pyroelectric infrared sensor using a conventional stem can be obtained.
【００２４】なお、回路基板の一方の面を導体箔で覆わ
ない以外は本発明の実施例と同様に作製した焦電型赤外
線センサでは、同５０Ｈｚ成分ノイズは約２００［ｍＶ
ｐ−ｐ］であり、充分な電磁シールド特性が得られなか
った。In the pyroelectric infrared sensor manufactured in the same manner as in the embodiment of the present invention except that one surface of the circuit board is not covered with the conductive foil, the 50 Hz component noise is about 200 mV.
pp], and sufficient electromagnetic shielding characteristics could not be obtained.
【００２５】[0025]
【発明の効果】本発明の焦電型赤外線センサによれば、
製造コストを抑制できる簡単な構造にも関わらず、低周
波から高周波までの充分な電磁シールド性が得られると
ともに、高い気密性を実現することで耐環境性にも優れ
た焦電型赤外線センサが得られる。According to the pyroelectric infrared sensor of the present invention,
Despite a simple structure that can reduce manufacturing costs, a pyroelectric infrared sensor that provides sufficient electromagnetic shielding from low frequencies to high frequencies and achieves high environmental resistance by realizing high airtightness can get.
【図１】本発明の一実施例の焦電型赤外線センサの分解
透視図。FIG. 1 is an exploded perspective view of a pyroelectric infrared sensor according to an embodiment of the present invention.
【図２】本発明の一実施例の焦電型赤外線センサの断面
図（一部拡大）FIG. 2 is a cross-sectional view (partially enlarged) of a pyroelectric infrared sensor according to one embodiment of the present invention.
【図３】従来の焦電型赤外線センサの分解透視図。FIG. 3 is an exploded perspective view of a conventional pyroelectric infrared sensor.
１：赤外線透過フィルター ２：キャップ ３：焦電素子 ４：スペーサー ５：ＦＥＴ ６：抵抗チップ ７：回路基板 ８：端子（電源端子、出力端子、グランド端子） ９：導体箔 １０：導通取り箇所 １１：基板の固定・封止樹脂 １２：ステム 1: Infrared transmission filter 2: Cap 3: Pyroelectric element 4: Spacer 5: FET 6: Resistive chip 7: Circuit board 8: Terminal (power supply terminal, output terminal, ground terminal) 9: Conductive foil 10: Conduction connection point 11 ： Board fixing / sealing resin 12 ： Stem
───────────────────────────────────────────────────── フロントページの続き (72)発明者 松崎 敏栄 秋田県大館市字舘下19−２ 住友金属鉱山 株式会社電子部品事業部内 Ｆターム(参考） 2G065 AA04 AB02 BA13 BA14 BA36 BA38 BB27 CA12 DA20 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Toshie Matsuzaki 19-2, Tateshita, Odate-shi, Akita Sumitomo Metal Mining Co., Ltd. Electronic Components Division F-term (reference) 2G065 AA04 AB02 BA13 BA14 BA36 BA38 BB27 CA12 DA20
Claims (1)
力する焦電素子とＦＥＴを実装した回路基板と、該回路
基板に取り付けられた電源端子と出力端子とグランド端
子と、前記焦電素子へ赤外線を取り入れるための赤外線
透過フィルターが取り付けられた窓を有する金属製のキ
ャップとを備えた焦電型赤外線センサにおいて、該キャ
ップ内に挿入された回路基板の焦電素子とＦＥＴが実装
されている面と反対側の面が導体箔で覆われているとと
もに、回路基板のグランド配線、グランド端子、導体
箔、キャップとが電気的に接続され、且つ回路基板周縁
部のキャップと回路基板の間の隙間が封止材により封止
されていることを特徴とする焦電型赤外線センサ。1. A circuit board on which a pyroelectric element for outputting an electric signal in accordance with an amount of infrared rays received and a FET are mounted, a power supply terminal, an output terminal, a ground terminal mounted on the circuit board, and the pyroelectric element. In a pyroelectric infrared sensor having a metal cap having a window fitted with an infrared transmission filter for taking in infrared light, a pyroelectric element and a FET of a circuit board inserted in the cap are mounted. The surface opposite to the surface on which the circuit board is located is covered with conductive foil, and the ground wiring, ground terminals, conductive foil, and cap of the circuit board are electrically connected to each other, and between the cap and the circuit board at the periphery of the circuit board. Wherein the gap is sealed by a sealing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11114358A JP2000304605A (en) | 1999-04-22 | 1999-04-22 | Pyroelectric infrared radiation sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11114358A JP2000304605A (en) | 1999-04-22 | 1999-04-22 | Pyroelectric infrared radiation sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000304605A true JP2000304605A (en) | 2000-11-02 |
Family
ID=14635737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11114358A Withdrawn JP2000304605A (en) | 1999-04-22 | 1999-04-22 | Pyroelectric infrared radiation sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000304605A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013064689A (en) * | 2011-09-20 | 2013-04-11 | Nec Access Technica Ltd | Infrared sensor system |
| CN106813782A (en) * | 2017-02-16 | 2017-06-09 | 东莞传晟光电有限公司 | Miniature attachment pyroelectric infrared sensor |
| CN109738075A (en) * | 2019-02-15 | 2019-05-10 | 东莞传晟光电有限公司 | A kind of TO pedestal pyroelectric sensor |
| CN111610699A (en) * | 2019-02-22 | 2020-09-01 | 上海微电子装备（集团）股份有限公司 | Mask alignment sensor and photoetching machine |
| CN112420913A (en) * | 2020-10-10 | 2021-02-26 | 杭州敏和光电子技术有限公司 | Packaging structure applied to infrared sensor and packaging method of infrared sensor |
| CN112781734A (en) * | 2020-12-18 | 2021-05-11 | 杭州麦乐克科技股份有限公司 | Pyroelectric sensor and packaging method thereof |
-
1999
- 1999-04-22 JP JP11114358A patent/JP2000304605A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013064689A (en) * | 2011-09-20 | 2013-04-11 | Nec Access Technica Ltd | Infrared sensor system |
| CN106813782A (en) * | 2017-02-16 | 2017-06-09 | 东莞传晟光电有限公司 | Miniature attachment pyroelectric infrared sensor |
| CN109738075A (en) * | 2019-02-15 | 2019-05-10 | 东莞传晟光电有限公司 | A kind of TO pedestal pyroelectric sensor |
| CN111610699A (en) * | 2019-02-22 | 2020-09-01 | 上海微电子装备（集团）股份有限公司 | Mask alignment sensor and photoetching machine |
| CN112420913A (en) * | 2020-10-10 | 2021-02-26 | 杭州敏和光电子技术有限公司 | Packaging structure applied to infrared sensor and packaging method of infrared sensor |
| CN112781734A (en) * | 2020-12-18 | 2021-05-11 | 杭州麦乐克科技股份有限公司 | Pyroelectric sensor and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20060704 |