JP2000299500A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JP2000299500A JP2000299500A JP11108118A JP10811899A JP2000299500A JP 2000299500 A JP2000299500 A JP 2000299500A JP 11108118 A JP11108118 A JP 11108118A JP 10811899 A JP10811899 A JP 10811899A JP 2000299500 A JP2000299500 A JP 2000299500A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting diode
- emitting element
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 238000007789 sealing Methods 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004397 blinking Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発光ダイオードに関
し、中でも高輝度型と言われる発光ダイオードに関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode, and more particularly, to a light-emitting diode of high brightness type.
【０００２】[0002]
【従来の技術】例えば工事現場を表示するために、その
周囲にポール状の赤色の点滅灯が設置されている。この
種の点滅灯は、内部に乾電池を装着するポールと、この
ポールの上端に発光部を設けてなり、発光部は赤色で透
明な樹脂でケースを形成し、このケースの内方に複数の
豆電球を等間隔に配置して形成されている。こうしたも
のでは豆電球での電力消費が大きく乾電池を頻繁に取り
替えなくてはならないこと、また豆電球の断線も多いこ
とから耐久性にも問題があった。そこで、こうした問題
を解消するために例えば実用新案登録第２５７９２２１
号公報に開示されているように豆電球に代えて高輝度型
の発光ダイオードを用いたものが提案されている。2. Description of the Related Art A pole-shaped red flashing light is installed around a construction site, for example, to indicate the construction site. This type of flashing light has a pole in which a dry battery is mounted, and a light emitting part provided on the upper end of the pole.The light emitting part is formed of a red transparent resin case, and a plurality of light emitting parts are provided inside the case. The miniature bulbs are formed at equal intervals. In these devices, the power consumption of the miniature bulb is large, and the batteries must be replaced frequently, and the disconnection of the miniature bulb often causes a problem in durability. Then, in order to solve such a problem, for example, utility model registration No. 2579221
As disclosed in Japanese Patent Application Laid-Open Publication No. H10-209, a device using a high-brightness light emitting diode instead of a miniature bulb has been proposed.
【０００３】上記公報の赤色の点滅灯に用いられる発光
ダイオードは一般的な高輝度型の発光ダイオードであっ
て、図１３に示すようにアノード電極１１６、ボンディ
ングワイヤ１１７、発光素子１１８、カソード電極１１
９を直列状に連結した状態で円筒形の透明封止樹脂１２
０にモールドしてある。そして発光素子１１８は、カソ
ード極線１１９透明封止樹脂１２０側端部に形成された
放物面形の反射鏡１２２中央部分に電気的に接合された
状態で載置されており、反射鏡１２２で反射した発光素
子１１８の光が外方に出る部分の透明封止樹脂１２０部
分は球面状にして発光素子１１８の光を広げる凸レンズ
部分１３０にしてある。The light emitting diode used for the red flashing light of the above publication is a general high brightness type light emitting diode. As shown in FIG. 13, an anode electrode 116, a bonding wire 117, a light emitting element 118, and a cathode electrode 11 are used.
9 are connected in series to form a cylindrical transparent sealing resin 12.
It is molded to 0. The light emitting element 118 is placed in a state of being electrically connected to a central portion of a parabolic reflector 122 formed at the end of the cathode polar line 119 on the transparent sealing resin 120 side. The portion of the transparent sealing resin 120 where the light of the light-emitting element 118 reflected by the light-emitting element goes out is formed as a convex lens portion 130 for making the light of the light-emitting element 118 spread by making it spherical.
【０００４】斯かる一般的な発光ダイオードでは、円筒
形の透明封止樹脂１２０の一端側部に設置された発光素
子１１８の光が他端部側に形成された凸レンズ部分１３
０でスポット光になるようにしてあることから、赤色の
点滅灯の発光部の前後二方向に光を照射する場合、円筒
状の軸芯を光を照射する方向にして発光ダイオードを配
設しなくてはならず、その結果、点滅灯の発光部の幅が
前後に分厚く大型のものになってしまうという問題があ
った。そこで、かかる問題を解消するものとして上記実
用新案登録第２５７９２２１号公報のものが提案されて
いる。この後方に記載された赤色の点滅灯は、上記一般
的な発光ダイオードを、円筒形の透明封止樹脂の軸芯を
発光部のケース内に放射状に配設するとともに、このケ
ースの周縁部分に凸レンズ部分でスポット状になった光
を前後に分ける変更手段を設け、この変更手段で発光素
子の光を前後二方向に分光するようになっている。In such a general light emitting diode, light from a light emitting element 118 installed on one end of a cylindrical transparent encapsulating resin 120 emits light to a convex lens portion 13 formed on the other end.
When the light is emitted in two directions before and after the light emitting portion of the red flashing light, the light emitting diode is arranged with the cylindrical axis oriented in the direction of the light emission. As a result, there is a problem that the width of the light emitting portion of the flashing lamp becomes thicker and larger in the front and rear direction. In order to solve such a problem, Japanese Utility Model Registration No. 2579221 has been proposed. The red flashing light described at the back of the general light-emitting diode has a cylindrical transparent sealing resin axis radially arranged in the case of the light-emitting portion, and a peripheral portion of the case. There is provided a changing means for dividing the light which has become spot-shaped at the convex lens portion into front and rear portions, and the changing means splits the light of the light emitting element in two front and rear directions.
【０００５】[0005]
【発明が解決しようとする課題】ところが、上記公報に
記載された一般的な発光ダイオードを用いた点滅灯で
は、発光ダイオードとこれで発生したスポット光を前後
二方向に分光する変更手段とが遠く離れていることか
ら、例えばスポット光の光軸が変更手段の中心から前後
にずれると、ずれた方向、前方にずれると前方へ照射す
る光量が増えて明るくなる反面、後方への照射光量が減
少して暗くなり、前後のバランスが崩れてしまうという
問題があった。特に、発光ダイオードの発光素子と変更
手段との距離が離れるにつれ、上記問題が顕著となる。
また、発光ダイオードの外径誤差によっても発光ダイオ
ードの取付位置がずれ、その結果、発光素子と変更手段
との位置がずれることもある。However, in the flashing lamp using a general light emitting diode described in the above publication, the light emitting diode and the changing means for dispersing the spot light generated by the light emitting diode in two front and rear directions are far from each other. For example, if the optical axis of the spot light is shifted forward or backward from the center of the changing means, the amount of light emitted forward increases if the optical axis of the spot light shifts forward or backward, while the amount of light emitted backward decreases. Then, there was a problem that the front and rear balance was lost. In particular, as the distance between the light emitting element of the light emitting diode and the changing unit increases, the above-described problem becomes more remarkable.
Further, the mounting position of the light emitting diode may be shifted due to an outer diameter error of the light emitting diode, and as a result, the position of the light emitting element and the changing unit may be shifted.
【０００６】従って、製作誤差のない発光ダイオードを
正確に取付なくてはならず、手間と熟練を要し、製造コ
ストも高くなってしまうという問題があった。本発明は
上記問題点に鑑み提案されたもので、所望の方向に正確
に照射できることは勿論のこと、異なる方向にも光量の
バランスのとれた、或いは所望するバランスの光量を正
確に照射できるようにした発光ダイオードを提供できる
ようにすることにより、手間と熟練を要することなく、
これを使用する装置の製造コストを低減できるようにす
ることを目的とするものである。Therefore, there has been a problem that a light emitting diode having no manufacturing error must be accurately mounted, and labor and skill are required, and the manufacturing cost is increased. The present invention has been proposed in view of the above problems, and it is possible to accurately irradiate a desired amount of light in a desired direction, as well as to accurately irradiate light in a desired direction. By providing a light-emitting diode with reduced complexity, without the need for labor and skill,
It is an object of the present invention to reduce the manufacturing cost of an apparatus using the same.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明にかかる発光ダイオードは、アノード電極、ボ
ンディングワイヤ、発光素子、カソード電極を直列状に
連結した状態で透明封止樹脂に封止してなる発光ダイオ
ードにおいて、透明封止樹脂の一部に発光素子の光を反
射させる反射面を設けたことを特徴とするものである。In order to achieve the above object, a light emitting diode according to the present invention is sealed in a transparent sealing resin with an anode electrode, a bonding wire, a light emitting element, and a cathode electrode connected in series. In the light emitting diode thus formed, a reflection surface for reflecting light of the light emitting element is provided on a part of the transparent sealing resin.
【０００８】上記透明封止樹脂の一部形成する反射面
は、透明封止樹脂に一体に形成したり、反射面を金属箔
貼着もしくは金属蒸着により鏡面に形成することや、反
射面の少なくとも一部を凹面鏡にすること、さらには透
明封止樹脂を側面視でＶ形に形成して反射面を二面、又
は多角錐に形成して反射面を複数面形成するようにした
ことも特徴とするものである。[0008] The reflecting surface which is partially formed of the transparent encapsulating resin may be formed integrally with the transparent encapsulating resin, the reflecting surface may be formed as a mirror surface by sticking a metal foil or metal vapor deposition, or at least the reflecting surface may be formed. It is also characterized in that a part is made into a concave mirror, and furthermore, a transparent sealing resin is formed in a V shape in a side view, and two reflecting surfaces are formed, or a plurality of reflecting surfaces are formed by forming a polygonal pyramid. It is assumed that.
【０００９】また、透明封止樹脂の少なくとも一部に反
射面で反射した光を拡大するためのレンズを形成した
り、カソード電極の透明封止樹脂側端部に反射鏡を形成
し、該反射鏡に発光素子を電気的に接続された状態で設
置したことも特徴の１つである。In addition, a lens for expanding the light reflected on the reflection surface is formed on at least a part of the transparent sealing resin, or a reflecting mirror is formed on an end of the cathode electrode on the side of the transparent sealing resin, and the reflection is performed. One of the features is that the light emitting element is installed in a state of being electrically connected to the mirror.
【００１０】[0010]
【発明の実施の形態】以下、本発明の発光ダイオードに
係る実施の形態を図面に基づいて説明する。図１は、本
発明の発光ダイオードを組み込んだ誘導灯の分解斜視図
であって、図中符号１は誘導灯を全体的に示す。この誘
導灯１は、内部に電池２及び点滅用電気回路部３を収納
するとともに、外方にスイッチ４を設けた有底筒状の握
り部５と、この握り部５の上端部に取付けられ内部に複
数の発光ダイオード６を収納する筒状の発光部７とを備
えてなる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the light emitting diode according to the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view of a guide light incorporating a light emitting diode of the present invention, and reference numeral 1 in the figure indicates the guide light as a whole. The guide light 1 houses a battery 2 and an electric circuit portion 3 for blinking inside, and has a bottomed cylindrical grip portion 5 provided with a switch 4 outside, and is attached to an upper end portion of the grip portion 5. A cylindrical light-emitting section 7 for housing a plurality of light-emitting diodes 6 therein is provided.
【００１１】この発光部７は図２に示すように外筒８ａ
と内筒８ｂとからなり、外筒８ａは赤色に着色された透
明の合成樹脂で形成され、その内周面部分には外筒８ａ
の軸芯方向に延びる断面三角形状のプリズム９が形成さ
れている。一方、内筒８ｂは、四角錐状のマイクロプリ
ズム１０を表裏の何れか一面に形成した可撓性を有する
透明な合成樹脂シートで形成されている。また、発光部
６に収納される複数のダイオード６は、図１に示すよう
に発光部７の内部の側方で上下に延び、中間部分を透明
な円板１１に支持された電極線１２・１３に略等間隔に
取付られており、電極線１２・１３はその下端部が点滅
用電気回路部３から延出されたリード線１４・１５に連
結されている。As shown in FIG. 2, the light emitting section 7 has an outer cylinder 8a.
And an inner cylinder 8b. The outer cylinder 8a is formed of a transparent synthetic resin colored red, and has an outer cylinder 8a
A prism 9 having a triangular cross-section is formed extending in the axial direction. On the other hand, the inner cylinder 8b is formed of a transparent transparent synthetic resin sheet having the quadrangular pyramid-shaped microprisms 10 formed on either one of the front and back surfaces. The plurality of diodes 6 housed in the light emitting section 6 extend vertically on the side inside the light emitting section 7 as shown in FIG. The lower ends of the electrode wires 12 and 13 are connected to lead wires 14 and 15 extending from the blinking electric circuit portion 3, respectively.
【００１２】そして、発光部６に収納される複数のダイ
オード６の夫々は、図３に示すようにアノード電極１
６、ボンディングワイヤ１７、発光素子１８、カソード
電極１９を直列に連結した状態で透明封止樹脂２０に封
止してある。上記ダイオード６の夫々は、透明封止樹脂
２０が短寸の四角柱状に形成され、その下端寄り部にア
ノード電極１６、ボンディングワイヤ１７、発光素子１
８、カソード電極１９を設けてあり、透明封止樹脂２０
の上端部には発光素子１８の光を反射させる反射面２１
が形成されている。Each of the plurality of diodes 6 housed in the light emitting section 6 has an anode electrode 1 as shown in FIG.
6, the sealing wire 20, the light emitting element 18, and the cathode electrode 19 are sealed in a transparent sealing resin 20 in a state of being connected in series. In each of the diodes 6, a transparent encapsulating resin 20 is formed in a short rectangular column shape, and an anode electrode 16, a bonding wire 17, a light emitting element 1
8, a cathode electrode 19 is provided, and a transparent sealing resin 20 is provided.
A reflection surface 21 for reflecting light of the light emitting element 18
Are formed.
【００１３】上記反射面２１は、図４に示すように透明
封止樹脂２０の上端部を側面視において“Ｖ”形に切り
欠いた状態にして二面形成してあり、この“Ｖ”形の開
角は約９０度に形成してある。また、発光素子１８を載
置するカソード電極１９の透明封止樹脂２０内側の端部
は凹曲面状の反射鏡２２に形成してあり、この反射鏡２
２の略中央部分に発光素子１８を電気的に接合した状態
で設置してある。上記のように形成されたダイオード６
が組み込まれた誘導灯１は、スイッチ４を“オン”にす
ると、握り部５に収納された電池２からので電流が点滅
用電気回路部３で制御されて間歇的にダイオード６に供
給されて発光素子１８を点滅発光させる。As shown in FIG. 4, the reflecting surface 21 is formed on two sides by cutting the upper end of the transparent sealing resin 20 into a "V" shape in a side view. Is formed at about 90 degrees. Further, an end inside the transparent sealing resin 20 of the cathode electrode 19 on which the light emitting element 18 is mounted is formed as a concave curved reflecting mirror 22.
The light emitting element 18 is installed at a substantially central portion of the light emitting element 2 in a state of being electrically connected thereto. Diode 6 formed as described above
When the switch 4 is turned on, the current from the battery 2 housed in the grip portion 5 is controlled by the blinking electric circuit portion 3 and supplied to the diode 6 intermittently. The light emitting element 18 flashes and emits light.
【００１４】この発光素子１８が発光すると、反射面２
１側の光はその儘、その他の周面から放散される光は凹
曲面状の反射鏡２２で反射されて強力な光源となり、反
射面２１に到達する。 反射面２１に到達した光は、反
射面２１が図 に示すように“Ｖ”形の開角が約９０度
に形成されていることから、この反射面２１で左右の２
方向に略均等に屈折される。しかして左右の２方向に分
光された光の夫々は、内筒８のマイクロプリズムマイク
ロプリズム１０と外筒８ａの断面三角形状のプリズム９
で屈折並びに反射されて発光部６の周囲に線乃至は帯状
に放射されるので、誘導灯１の発光部はダイオード６の
数だけの複数段線乃至は帯状に光り、発光部７の全体も
明るくなる。When the light emitting element 18 emits light, the reflecting surface 2
The light on one side remains as it is, and the light radiated from the other peripheral surface is reflected by the concave curved reflecting mirror 22 to become a strong light source and reaches the reflecting surface 21. The light that has reached the reflecting surface 21 has a “V” -shaped opening angle of about 90 degrees as shown in FIG.
The light is refracted almost uniformly in the direction. Thus, each of the light split in two directions, left and right, is converted into a microprism microprism 10 of the inner cylinder 8 and a prism 9 having a triangular cross section of the outer cylinder 8a.
Are refracted and reflected by the light source and are radiated in the form of a line or a band around the light-emitting unit 6. It becomes bright.
【００１５】尚、上記実施の形態では透明封止樹脂２０
の上端部を“Ｖ”形に切り欠いてフラットな二面で反射
面２１を形成するようにしてあるが、これを図４中、想
像線図Ａで示すように“Ｖ”形空間２３側に膨らませて
凹面鏡２４に形成するようにしてもよい。こうした場合
には発光素子１８の光りが反射面２１で反射する時に、
この凹面鏡２４でその照射範囲を拡大することができ
る。また、反射面２１で反射する光りの照射範囲を拡大
する場合、図 及び図 に示すように透明封止樹脂２０
を円柱形若しくは断面小判形に形成し、この平面視で半
円状部分２５を凸レンズにすることによっても照射範囲
を拡大することができる。In the above embodiment, the transparent sealing resin 20 is used.
The upper surface is cut into a “V” shape to form a reflective surface 21 with two flat surfaces, which are formed on the “V” space 23 side as shown by an imaginary diagram A in FIG. May be formed on the concave mirror 24. In such a case, when the light of the light emitting element 18 is reflected by the reflection surface 21,
With this concave mirror 24, the irradiation range can be enlarged. When the irradiation range of the light reflected by the reflection surface 21 is enlarged, as shown in FIGS.
Is formed in a cylindrical shape or an oval cross section, and the semicircular portion 25 is formed as a convex lens in plan view, so that the irradiation range can be enlarged.
【００１６】また、上記実施の形態では透明封止樹脂２
０の上端部を“Ｖ”形に切り欠いて反射面２１を二面形
成するようにしてあるが、これを例えば図７に示すよう
に四角柱の上端を四角錐に形成すると四面の反射面２１
を形成することができ、これを誘導灯１に組み込んだ場
合、図８に示すように誘導灯１の発光部６への光りの分
散がより均一なものにすることができるし、図示は省略
したが透明封止樹脂２０の上端部を円錐状にした場合に
は発光素子１８の光りを周囲に略均等に分散させること
ができる。更に、この四面の反射面２１を形成する透明
封止樹脂２０を図９に示すように円柱形若しくは断面小
判形に形成すると、上述したと同様にこの平面視で半円
状部分２５を凸レンズにして照射範囲を拡大することが
できる。In the above embodiment, the transparent sealing resin 2
The upper end of the square 0 is notched in a “V” shape to form two reflecting surfaces. For example, as shown in FIG. 7, when the upper end of a quadrangular prism is formed as a quadrangular pyramid, four reflecting surfaces are formed. 21
When this is incorporated in the guide light 1, the distribution of light to the light emitting portion 6 of the guide light 1 can be made more uniform as shown in FIG. However, when the upper end of the transparent sealing resin 20 is formed in a conical shape, the light of the light emitting element 18 can be substantially uniformly dispersed around. Further, when the transparent sealing resin 20 forming the four reflecting surfaces 21 is formed in a cylindrical shape or an oval cross section as shown in FIG. 9, the semicircular portion 25 is formed into a convex lens in plan view as described above. Thus, the irradiation range can be expanded.
【００１７】加えて、上記実施の形態では本発明のダイ
オード６を誘導灯１に組み込んだものを例に説明してあ
るがこうしたものに限られず、例えば図１０及び図１２
に示すように、工事現場を表示する点滅灯２６にも実施
したり、図示は省略したが透明な合成樹脂チューブに発
光ダイオードを入れたもの等、種々のものに実施するこ
とができる。また、図１０及び図１１に示すものではケ
ーシング２８の表面に想像線図Ｂで示すように凸レンズ
を形成し、光の照射範囲を拡大するようにすることもで
きる。因みに上記実施の形態では反射面２１を透明封止
樹脂２０に直接形成するようにしてあるが、これを図１
２に示すように反射面２１を形成したキャップ２９を透
明封止樹脂２０に嵌着するようにしてもよいことは勿論
である。また、上述の各反射面２１には金属箔を貼着し
たり、金属蒸着により鏡面を形成することができるのは
言うまでもないことである。In addition, in the above-described embodiment, the case where the diode 6 of the present invention is incorporated in the guide light 1 is described as an example. However, the present invention is not limited to such an example.
As shown in (1), the present invention can be applied to various types of lighting such as a blinking light 26 for displaying a construction site, or a light emitting diode inserted in a transparent synthetic resin tube (not shown). In FIGS. 10 and 11, a convex lens can be formed on the surface of the casing 28 as shown by an imaginary line B to enlarge the light irradiation range. Incidentally, in the above embodiment, the reflecting surface 21 is formed directly on the transparent sealing resin 20.
As shown in FIG. 2, the cap 29 having the reflection surface 21 may be fitted to the transparent sealing resin 20 as a matter of course. It goes without saying that a metal foil can be attached to each of the above-mentioned reflecting surfaces 21 or a mirror surface can be formed by metal evaporation.
【００１８】[0018]
【発明の効果】本発明の発光ダイオードは以上に説明し
たように、アノード電極、ボンディングワイヤ、発光素
子、カソード電極を直列状に連結した状態で封止する透
明封止樹脂の一部に発光素子の光を反射させる反射面
を、一体もしくは別体で設けるようにしてあるので、発
光素子と反射面とが近接した状態で正確に位置決めされ
る。これにより、従来のように発光素子からの光がこれ
を屈折させる反射手段の中心から前後にずれるのを防止
でき、前後への照射のバランスが崩れてしまうのを防止
することができる。勿論、発光素子の光と反射面との位
置を故意にずらして前後の照射のバランスを所望のバラ
ンスにすることもできる。As described above, the light emitting diode of the present invention has a light emitting element formed by a part of the transparent sealing resin for sealing the anode electrode, the bonding wire, the light emitting element, and the cathode electrode in a state of being connected in series. The reflection surface for reflecting the light is provided integrally or separately, so that the light emitting element and the reflection surface are accurately positioned in close proximity. Thus, it is possible to prevent the light from the light emitting element from deviating back and forth from the center of the reflection unit that refracts the light as in the related art, and to prevent the balance of the irradiation to the front and rear from being lost. Of course, it is also possible to intentionally shift the position of the light of the light emitting element and the reflection surface to balance the irradiation before and after the desired balance.
【００１９】上記のように発光素子と反射面とが近接し
た状態で正確に位置決めされるので、本発明の発光ダイ
オードを装着して種々の製品を製作する場合にも、手間
と熟練をようすることなく、発光ダイオードを正確に取
付けることができ、製造コストも低減することができる
という利点もある。As described above, since the light emitting element and the reflecting surface are accurately positioned in close proximity to each other, even when various products are manufactured by mounting the light emitting diode of the present invention, labor and skill are required. There is also an advantage that the light emitting diode can be mounted accurately without any problems and the manufacturing cost can be reduced.
【図１】は本発明の発光ダイオードを組み込んだ誘導灯
の分解斜視図である。FIG. 1 is an exploded perspective view of a guide light incorporating a light emitting diode of the present invention.
【図２】は本発明の発光ダイオードを組み込んだ誘導灯
の発光部の分解斜視図である。FIG. 2 is an exploded perspective view of a light emitting portion of the guide light incorporating the light emitting diode of the present invention.
【図３】は本発明の発光ダイオードの拡大斜視図であ
る。FIG. 3 is an enlarged perspective view of a light emitting diode of the present invention.
【図４】は本発明の発光ダイオードの側面図である。FIG. 4 is a side view of the light emitting diode of the present invention.
【図５】は本発明の発光ダイオードの封止樹脂の変形例
を示す斜視図である。FIG. 5 is a perspective view showing a modified example of the sealing resin of the light emitting diode of the present invention.
【図６】は本発明の発光ダイオードの封止樹脂の変形例
の平面図である。FIG. 6 is a plan view of a modification of the sealing resin of the light emitting diode of the present invention.
【図７】は本発明の発光ダイオードの反射面の変形例を
示す斜視図である。FIG. 7 is a perspective view showing a modification of the reflection surface of the light emitting diode of the present invention.
【図８】は本発明の発光ダイオードの反射面の変形例の
作用説明図である。FIG. 8 is an operation explanatory view of a modification of the reflection surface of the light emitting diode of the present invention.
【図９】は本発明の発光ダイオードの反射面の変形例に
おける封止樹脂の変形例を示す斜視図である。FIG. 9 is a perspective view showing a modification of the sealing resin in a modification of the reflection surface of the light emitting diode of the present invention.
【図１０】は本発明の発光ダイオードを点滅灯に組み込
んだ状態の１部切欠き斜視図である。FIG. 10 is a partially cutaway perspective view showing a state in which the light emitting diode of the present invention is incorporated in a flashing light.
【図１１】は本発明の発光ダイオードを点滅灯に組み込
んだ時の作用説明図である。FIG. 11 is an operation explanatory view when the light emitting diode of the present invention is incorporated in a flashing light.
【図１２】は本発明の発光ダイオードの反射面の更に別
の変形例を示す分解斜視図である。FIG. 12 is an exploded perspective view showing still another modification of the reflection surface of the light emitting diode of the present invention.
【図１３】は従来の発光ダイオードの斜視図である。FIG. 13 is a perspective view of a conventional light emitting diode.
６・・・発光ダイオード １６・・・アノード電極 １７・・・ボンデイングワイヤー １８・・・発光素子 １９・・・カソード電極 ２０・・・封止樹脂 ２１・・・反射面 6 ... Light Emitting Diode 16 ... Anode Electrode 17 ... Bonding Wire 18 ... Light Emitting Element 19 ... Cathode Electrode 20 ... Sealing Resin 21 ... Reflecting Surface
Claims (7)
素子、カソード電極を直列状に連結した状態で透明封止
樹脂に封止してなる発光ダイオードにおいて、透明封止
樹脂の一部に発光素子の光を反射させる反射面を設けた
ことを特徴とする発光ダイオード。1. A light emitting diode in which an anode electrode, a bonding wire, a light emitting element, and a cathode electrode are connected in series and sealed in a transparent sealing resin. A light emitting diode, comprising a reflection surface for reflecting light.
とを特徴とする請求項１に記載の発光ダイオード。2. The light emitting diode according to claim 1, wherein the reflection surface is formed integrally with the transparent sealing resin.
り鏡面に形成されたことを特徴とする請求項１又は請求
項２に記載の発光ダイオード。3. The light emitting diode according to claim 1, wherein the reflection surface is formed on a mirror surface by sticking a metal foil or depositing a metal.
とを特徴とする請求項１乃至請求項３の何れか１項に記
載の発光ダイオード。4. The light-emitting diode according to claim 1, wherein at least a part of the reflection surface is a concave mirror.
射面を二面、又は多角錐に形成して反射面を複数面形成
したことを特徴とする発光ダイオード。5. A light emitting diode comprising a transparent encapsulating resin formed in a V-shape in a side view and two reflecting surfaces or a polygonal pyramid to form a plurality of reflecting surfaces.
封止樹脂の少なくとも一部をレンズ状に形成したことを
特徴とする請求項１、請求項２、請求項５の何れか１項
に記載の発光ダイオード。6. The method according to claim 1, wherein at least a part of the transparent sealing resin is formed in a lens shape in order to enlarge the light reflected on the reflecting surface. A light-emitting diode according to the item.
鏡を形成し、該反射鏡に発光素子を電気的に接続された
状態で設置したことを特徴とする請求項１に記載の発光
ダイオード。7. The cathode according to claim 1, wherein a reflecting mirror is formed at an end of the cathode electrode on the side of the transparent sealing resin, and the light emitting element is installed in a state electrically connected to the reflecting mirror. Light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11108118A JP2000299500A (en) | 1999-04-15 | 1999-04-15 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11108118A JP2000299500A (en) | 1999-04-15 | 1999-04-15 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000299500A true JP2000299500A (en) | 2000-10-24 |
Family
ID=14476386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11108118A Pending JP2000299500A (en) | 1999-04-15 | 1999-04-15 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000299500A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317977A (en) * | 2004-04-29 | 2005-11-10 | Lg Phillips Lcd Co Ltd | Led lamp unit |
| JP2006099117A (en) * | 2004-09-24 | 2006-04-13 | Shogen Koden Kofun Yugenkoshi | Lighting package |
| WO2006044328A1 (en) * | 2004-10-12 | 2006-04-27 | Cree, Inc. | Side-emitting optical coupling device |
| EP1665384A2 (en) * | 2003-09-19 | 2006-06-07 | Mattel, Inc. | Multidirectional light emitting diode unit |
| US7322721B2 (en) | 2004-09-25 | 2008-01-29 | Samsung Electronics Co., Ltd. | Side emitting device, backlight unit using the same as light source and liquid crystal display employing the backlight unit |
| JP2008022031A (en) * | 2004-05-28 | 2008-01-31 | Samsung Electro-Mechanics Co Ltd | Led package and backlight assembly for liquid crystal display device using the same |
| US7543965B2 (en) | 2004-10-29 | 2009-06-09 | Samsung Electronic Co., Ltd | Side light-emitting device, backlight unit having the side light-emitting device, and liquid crystal display apparatus employing the backlight unit |
| WO2009093498A1 (en) * | 2008-01-22 | 2009-07-30 | Alps Electric Co., Ltd. | Led package and manufacturing method therefor |
| JP2012231023A (en) * | 2011-04-26 | 2012-11-22 | Enplas Corp | Luminous flux control member, light emitting device with luminous flux control member, and surface light source apparatus with light emitting device |
| JP2013012632A (en) * | 2011-06-30 | 2013-01-17 | Enplas Corp | Luminous flux control member, light emitting device, and surface light source device |
| US9557033B2 (en) | 2008-03-05 | 2017-01-31 | Cree, Inc. | Optical system for batwing distribution |
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1999
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1665384A4 (en) * | 2003-09-19 | 2010-09-08 | Mattel Inc | Multidirectional light emitting diode unit |
| EP1665384A2 (en) * | 2003-09-19 | 2006-06-07 | Mattel, Inc. | Multidirectional light emitting diode unit |
| US8152338B2 (en) | 2004-04-29 | 2012-04-10 | Lg Display Co., Ltd. | LED lamp unit |
| JP2005317977A (en) * | 2004-04-29 | 2005-11-10 | Lg Phillips Lcd Co Ltd | Led lamp unit |
| US7950831B2 (en) | 2004-04-29 | 2011-05-31 | Lg Display Co., Ltd. | Recessed LED lamp unit |
| JP4579761B2 (en) * | 2004-04-29 | 2010-11-10 | エルジー ディスプレイ カンパニー リミテッド | LED lamp unit |
| JP2008022031A (en) * | 2004-05-28 | 2008-01-31 | Samsung Electro-Mechanics Co Ltd | Led package and backlight assembly for liquid crystal display device using the same |
| JP2006099117A (en) * | 2004-09-24 | 2006-04-13 | Shogen Koden Kofun Yugenkoshi | Lighting package |
| US7322721B2 (en) | 2004-09-25 | 2008-01-29 | Samsung Electronics Co., Ltd. | Side emitting device, backlight unit using the same as light source and liquid crystal display employing the backlight unit |
| WO2006044328A1 (en) * | 2004-10-12 | 2006-04-27 | Cree, Inc. | Side-emitting optical coupling device |
| US8541795B2 (en) | 2004-10-12 | 2013-09-24 | Cree, Inc. | Side-emitting optical coupling device |
| US9287474B2 (en) | 2004-10-12 | 2016-03-15 | Cree, Inc. | Side-emitting optical coupling device |
| US7543965B2 (en) | 2004-10-29 | 2009-06-09 | Samsung Electronic Co., Ltd | Side light-emitting device, backlight unit having the side light-emitting device, and liquid crystal display apparatus employing the backlight unit |
| WO2009093498A1 (en) * | 2008-01-22 | 2009-07-30 | Alps Electric Co., Ltd. | Led package and manufacturing method therefor |
| US9557033B2 (en) | 2008-03-05 | 2017-01-31 | Cree, Inc. | Optical system for batwing distribution |
| JP2012231023A (en) * | 2011-04-26 | 2012-11-22 | Enplas Corp | Luminous flux control member, light emitting device with luminous flux control member, and surface light source apparatus with light emitting device |
| JP2013012632A (en) * | 2011-06-30 | 2013-01-17 | Enplas Corp | Luminous flux control member, light emitting device, and surface light source device |
| JP2019186274A (en) * | 2018-04-03 | 2019-10-24 | シチズン電子株式会社 | Light-emitting device |
| JP7164315B2 (en) | 2018-04-03 | 2022-11-01 | シチズン電子株式会社 | light emitting device |
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