JP3484918B2 - Light emitting diode device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED device which can be used for a monochromatic or mixed color (multicolor) illumination, a light source and a display using a light emitting diode (hereinafter referred to as "LED").

[0002]

2. Description of the Related Art Generally, an LED has a shell-shaped outer shape, and has a directivity by a lens portion at an end thereof, and has been used as a monochromatic point light source.

In the case of mixing a plurality of conventional LED lights, a common light diffusing plate is arranged on an LED chip which is a light emitting source of a plurality of LEDs, and the plurality of colors are mixed there. In addition, a common lens is arranged on the light emitting sources of a plurality of LEDs, and the LED light is allowed to pass through the lenses to mix a plurality of colors.

Further, in the case of combining a plurality of bullet-shaped types with a plurality of colors, the colors are mixed at a distance of at least 10 cm or more.

[0005]

However, a plurality of LEDs are required.
In the case where a common light diffusing plate is provided on the LED chip as the light emitting source to mix a plurality of LED lights, the light transmittance by the light diffusing plate is reduced and the brightness is reduced. . Further, in a case where a common lens is provided on the light emitting sources of a plurality of LEDs and a plurality of colors are mixed by the LED light in the lens, the plurality of colors are independently recognized when they are close to the light source, and the predetermined distance is set. Color mixture cannot be obtained if the distance is not exceeded.

[0006] As another prior art, Japanese Patent Laid-Open No. 1-1433
No. 66, Japanese Patent Laid-Open No. 2-51287, and the like.

The techniques disclosed in both publications embed an LED chip in a reflector. In this case, stress is generated in the LED chip and the wire portion due to the shrinkage of the synthetic resin when the reflector is molded, and the LED chip and the wire are manufactured or used. The reflector undergoes expansion and contraction due to the influence of temperature, and in the worst case, it may be damaged. Therefore, the technologies disclosed in both publications limit the size of the reflector.

Therefore, the present invention does not reduce the LED light transmittance of the LED chip, which is a light emitting source, and
An object of the present invention is to provide an LED device having a structure capable of obtaining a color mixture of a plurality of LED lights even at a relatively short distance and further greatly expanding the degree of freedom regarding the size and shape of the reflector.

[0009]

An LED according to claim 1.
Device includes a light emitting unit which is arranged to emit emission light of one or more light emitting diode chips in a particular direction, the one
Leading electric power to the light emitting portion of the above light emitting diode chip, a plurality of lead frames radially arranged with the light emitting portion as a center and shifted by about 90 degrees, and the light emitting portion are arranged at a substantially central position, A multi-cut reflector which is separated from the light-emitting portion and has a plurality of minute flat surfaces on which concave mirror portions are formed so as to reflect light emitted from the one or more light-emitting diode chips, and the multi-cut reflector comprises: It is made of a transparent material of synthetic resin, and the plurality of minute planes are formed on the outer peripheral surface thereof, and a metal film is formed on the plurality of minute planes, and the light emission is made at the center of the facing surfaces of the concave mirror section. While forming a storage recess for storing the part ,
A housing for housing the lead frame centered on the housing recess.
A groove is formed.

The light emitting portion of the LED device according to a second aspect is embedded in a substantially hemispherical body made of a transparent synthetic resin centering on the one or more LED chips.

In the LED device according to a third aspect of the present invention , a buffer material is filled in the recessed portion of the multi-cut reflector and the light emitting portion.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

FIG. 1 is an overall perspective view of an LED device according to the first embodiment of the present invention, and FIG. 2 is an overall perspective view of an LED unit used in the LED device according to the first embodiment of the present invention (a). ) And (b) to (d) are a plan view (b), a side view (c), and a front view (d) in the case of an LED unit array used in an LED device.

In FIG. 1 and FIG. 2, the light emitting portion 11 is 1
Mold more than one LED chip with transparent synthetic resin,
The lead frame 12 is arranged so as to emit the emitted light in a specific direction, that is, in the present embodiment, downward.
13, 14 and 15 are one or more L embedded in the light emitting unit 11.
It guides power to the ED chip. The light emitting unit 11 in which these one or more LED chips are arranged so as to emit the emitted light in a specific direction and the lead frames 12, 13, 14, 15 for guiding the electric power to the one or more LED chips are The LED unit 10 of the form is constructed.

Lead frames 12, 13, 14, 15
Is radially extended from the light emitting portion 11 in which one or more LED chips are molded with transparent epoxy or silicon, and is bent downward at a right angle. The bending point is the outer circumference of the multi-cut reflector 20 described later.

The light emitting portion 11 is formed by molding one or more LED chips with a synthetic resin such as transparent epoxy resin, and has a substantially hemispherical shape with one or more LED chips arranged at the center position. is doing. With this configuration, the emitted light reaches perpendicularly to the surface of the light emitting unit 11, and the light easily passes through the molding resin.

LED unit 10 used for LED device
2 is used as an LED unit array,
(B) to (d).

That is, the lead frames 12-1, 13-1, 1
4-1 and 15-1 extend radially from the light emitting portion 11-1 in which one or more LED chips are molded with a transparent synthetic resin, and are bent downward at right angles to form the LED unit 10-1. It is configured. Then, the adjacent LED units 10
-2 similarly, lead frames 12-2, 13-2, 14-2,
The reference numeral 15-2 extends radially from the light emitting portion 11-2 obtained by molding one or more LED chips with a transparent synthetic resin, and is bent downward at a right angle. Then, the lead frame 12-1 of the LED unit 10-1 and the LED unit 10-2
The lead frame 13-2 of the LED unit 10
The lead frame 15-1 of -1 and the lead frame 14-2 of the LED unit 10-2 are connected by the short-circuit line S. Similarly, the LED unit 10-3 and the LED unit 10-4 are sequentially connected to the short-circuit line S. Therefore, 1
When controlling the lighting of more than one LED chip, the short-circuit line S is cut and a desired circuit is constructed.

FIG. 3 is an explanatory view showing an example of wire bonding of an LED unit used in the LED device according to the first embodiment of the present invention. FIG.
(B) is a case of two colors, and (c) is a case of three colors.

In FIG. 3A, in the wire bonding of the LED unit used in the LED device of this embodiment, the lead frames 12 and 13 and the lead frames 14 and 15 are used as common electrodes, and the ends of the lead frames 14 and 15 are used. The cathode side of the red LED chip (or the yellow LED chip) 16 is joined to the base 14a with a conductive adhesive, and the red LED chip (or the yellow LED chip)
The anode side of 16 is wire-bonded to the tip electrode portions 12a of the lead frames 12 and 13 using a wire 16a. After that, the red LED chip (or the yellow LED chip) 16, the lead frames 12 and 13 including the tip electrode portion 12a and the end base 14a.
Along with the tips of the lead frames 14 and 15, the light emitting portion 11 is formed by being molded with a transparent synthetic resin and accommodated in a package having a substantially hemispherical lower portion. The lead frames 12, 13, 14, and 15 are connected to each other by the light emitting unit 1.
The center axis of the package 1 is offset from the center of the package 90 degrees, and the packages are arranged radially. As a result, a stable joined state is maintained with respect to the circumference of the multi-cut reflector 20.

In FIG. 3B, in the wire bonding of the LED unit used in the LED device of this embodiment, the lead frames 12 and 13 are for supplying power to the yellow LED chip 16Y, and the lead frames 14 and 1 are used.
Reference numeral 5 is for supplying power to the red LED chip 16R. These are yellow LED chips 1 on the end of the lead frame 12.
6Y cathode side is joined with a conductive adhesive to make a yellow LED
The anode side of the chip 16Y is wire-bonded to the end of the lead frame 13 using the wire 16Ya, and the red LED is attached to the end of the lead frame 15.
The cathode side of the chip 16R is joined with a conductive adhesive, and the anode side of the red LED chip 16R is connected to the lead frame 1.
4 is wire-bonded to the end of No. 4 by using a wire 16Ra.

After this, the yellow LED chip 16Y,
Red LED chip 16R, lead frames 12 and 13
Along with the tips of the lead frames 14 and 15, they are molded with a transparent synthetic resin and housed in a package having a substantially hemispherical lower part, which constitutes a light emitting portion 11A. The lead frames 12, 13, 14, and 15 are arranged radially with their central axes deviated from each other by 90 degrees with respect to the center of the light emitting section 11A. As a result, a stable joined state is maintained with respect to the circumference of the multi-cut reflector 20.

In FIG. 3C, the lead frame 12 has a yellow LED chip 16 for wire bonding of the LED unit used in the LED device according to the present embodiment.
For Y power supply and the lead frame 13 is red L
The ED chip 16R and the lead frame 15 are for supplying power to the blue LED chip 16B. Lead frame 14
Supplies electric power in pairs with the lead frames 12, 13, 15 and has a wide joint base 14A formed at the end thereof, and the yellow LED is provided on the surface of the joint base 14A.
The cathode side of the chip 16Y and the cathode side of the red LED chip 16R are joined with a conductive adhesive. Then, the lead frame 12 and the anode side of the yellow LED chip 16Y are wire-bonded using the wire 16Yb, and the lead frame 13 and the anode side of the red LED chip 16R are wire-bonded using the wire 16Rb. Furthermore, on the surface of the bonding base 14A, a blue LED
The insulating substrate side of the chip 16B is joined, and the cathode side thereof is wire-bonded to the lead frame 14 using the wire 16Ba, and the blue LED chip 16B is also used.
The anode side is wire-bonded to the lead frame 15 using the wire 16Bb.

The tips of the yellow LED chip 16Y, the red LED chip 16R, the blue LED chip 16B, and the lead frames 12, 13, 15 are molded together with the joint base 14A of the lead frame 14 by a transparent synthetic resin, Is housed in a substantially hemispherical package,
It constitutes the light emitting unit 11B. This lead frame 1
2, 13, 14, 15 are connected to each other by the lead frame 14
Which is the center of the joining base portion 14A, and its central axis is deviated from the center of the light emitting portion 11B by 90 degrees, and
It is arranged radially. As a result, a stable joined state is maintained with respect to the circumference of the multi-cut reflector 20. Further, by using the lead frame 14 having a different shape, it is possible to expand the usage.

By the way, the material of the substantially hemispherical package forming the light emitting portion 11 used in the above embodiment is
By using a colorless transparent material or a colored transparent material, color correction can be performed or light emission of a desired color can be performed.

Although red, yellow and blue LEDs are used as the LED chips in the above embodiment, green LEDs may be used and the combination thereof can be arbitrarily selected.

FIG. 4 is a plan view (a), a front view (b), a bottom view (c) of a multi-cut reflector used in the LED device according to the first embodiment of the present invention, and a sectional view (d) viewed from the front. ). Further, FIG. 5 is a structural explanatory view of a multi-cut reflector used in the LED device in the first embodiment of the present invention, and FIG. 6 is a multi-cut reflector used in the LED device in the first embodiment of the present invention. It is a geometric pattern explanatory view which showed the multi cut.

In FIG. 4, the upper surface of a multi-cut reflector 20 such as colorless transparent or colored transparent synthetic resin made of acrylic or the like has a substantially circular shape in the plan view, and the light emitting portion 1 is provided at the center.
A storage recess 21 having a hemispherical shape for storing 1 is formed.
Further, the lead grooves 22, 23, 24, 25 for accommodating the lead frames 12, 13, 14, 15 radially from the center of the upper surface of the multi-cut reflector 20, that is, the center of the accommodating recess 21 at equal intervals. The multi-cut reflector 20 is formed with a cylindrical portion 26 having the same diameter as the upper surface and a multi-cut portion 27 having a plurality of minute flat surfaces on the lower front surface. The cylindrical portion 26 also has lead grooves 22, 23, 24, 25 for accommodating the lead frames 12, 13, 14, 15 formed on its peripheral surface, and the lead frames 12, 13, 14, 15 easily move around. It is supposed not to. Multi-cut part 27
As shown in FIG. 4 (c), six equilateral triangular planes are taken at the lowest point, and six equilateral triangular planes each having one side are formed on the outer circumference of each side of the hexagon. Further, two planes are formed between the planes of the six equilateral triangles.

According to experiments conducted by the inventors, the radius R of the multi-cut portion 27 formed of a plurality of minute planes forming the curved surface of the multi-cut reflector 20 and the substantially circular center of the upper surface of the multi-cut reflector 20, that is, , The radius r of the cylindrical portion 26 is 1.15 ≦ R /, as shown in FIG.
Let r ≤ 1.6. In addition, the radius r of the column portion 26 and the red LED chip (or yellow, blue, green LED chip)
The relationship with the distance t from the LED chip arrangement position M such as 16 to the lower end of the multi-cut portion 27 is 0.8 ≦ t−r / 2 ≦ 1.2.

Further, the distance t from the arrangement position M of the LED chips such as the red LED chips (or the yellow, blue and green LED chips) 16 to the lower end of the multi-cut portion 27,
The relationship between the width x of a plurality of minute planes of the multi-cut portion 27 is: 2.5 ≦ x ≦ t when there are two LED chips, and 2.0 ≦ when there are three LED chips. It is desirable that x ≦ t.

With this configuration, when molded from synthetic resin, it is possible to obtain a color mixture of a plurality of LED lights in a wide field of view.

In particular, under the above-mentioned conditions, it has been confirmed that the light emitted from a plurality of LEDs is a bright color (a color with a glaring feeling) and they are mixed. Of course, when the fresh color expression is suppressed, or when the fresh color expression is not desired, it is possible to set it slightly apart from the above condition or ignoring the above condition.

In this embodiment, as shown in FIG. 4 (c), the multi-cut portion 27 has an equilateral triangular plane at the lowest point.
Individual pieces were taken, and six equilateral triangular planes each having the side as one side were formed on the outer periphery of each side of the hexagon, and two planes were formed between the planes of the six equilateral triangles. But
When implementing the present invention, a geometric pattern as shown in FIG. 6 may be used. Of course, 16-, 24-, and 36-sided cuts can be used, as used in jewelry.

FIG. 6 (a) is the center of the cylindrical portion 26A and the lowest point which is the center of the multi-cut portion 27A. The plane of the equilateral triangle is divided into six, and 9 of the 6 divided triangles are divided.
This is the formation of a plane of individual equilateral triangles. In addition, FIG.
(B) is the center of the cylindrical portion 26B, and is the lowest point that is the center of the multi-cut portion 27B. The lowest point is divided into eight equal parts, and a concentric circle is drawn on the outer side of the lowest point. This is to sequentially form a square plane consisting of points intersecting with the intermediate point of the previous eight equally divided angles. FIG. 6 (c) is the center of the cylindrical portion 26C, and is the lowest point which is the center of the multi-cut portion 27C, and is divided into six equal parts with the lowest point as the center, and a concentric circle is drawn on the outer side thereof. A quadrangular plane is formed by the intersections of the concentric circles and the intermediate points of the previous six equally divided angles.

The LED device thus constructed is assembled as follows.

First, as shown in FIG. 3, LED chips of a single color or a plurality of colors are arranged on the lead frames 12, 13, 14, 15 which are radially arranged, and necessary wire bonding is performed, and then the lead frame 12 is formed. , 13, 14, 1
The tip of 5 and the LED chip of a single color or a plurality of colors are molded with a transparent synthetic resin, and the lower part is housed in a substantially hemispherical package to form the light emitting section 11.

On the other hand, as shown in FIG. 4, in the center of the upper surface of the multi-cut reflector 20, a storage recess 21 for storing the light emitting portion 11 and a storage recess 2 for the multi-cut reflector 20 are provided.
Radial from the center of the lead frame 12, 13, 1
Lead grooves 22, 23, 24, 25 accommodating 4, 15
Further, a cylindrical portion 26 having the same diameter as the upper surface and a multi-cut portion 27 having a plurality of minute flat surfaces at the lower front portion are integrally formed on the upper front portion of the multi-cut reflector 20 by injection molding. Then, a metal such as aluminum is sputtered, vapor-deposited, plated, on the multi-cut portion 27.
Highly reflective film A reflective film made of a metal film is formed by in-mold molding or the like. It should be noted that it is not always necessary to form a reflection film of a metal film around the columnar portion 26, but in the case of forming a metal film, the lead grooves 22, 23, 24 and 25 are formed between the lead frames 12, 13, 14, and 15. The metal film is not formed so that the short circuit of does not occur. Alternatively, it is necessary to remove the conductivity by applying an insulating material or the like.

The package of the light emitting portion 11 is housed in the housing recess 21 at the center of the upper surface of the multi-cut reflector 20 thus formed, and the lead frames 12, 13, 14, 15 are provided in the lead grooves 22, 23, 24, 25. Insert. Then, with the package of the light emitting unit 11 housed in the housing recess 21 of the multi-cut reflector 20, they are not joined together. That is, the housing recess 21 of the multi-cut reflector 20 and the package of the light emitting unit 11 are fitted to each other without interposing a filler. Of course, silicone oil or the like may be put between them, or a gel or sol may be interposed. Then, the lead grooves 22, 23, 2
The lead frames 12, 13, 14, and 15 are joined to 4, 25, and the LED unit 10 and the multi-cut reflector 2 are connected.
An LED device is configured by integrating 0 and 0.

Here, in the light emitting portion 11 in which the one or more LED chips are embedded in the center of the substantially hemisphere made of transparent synthetic resin, the LED light from the one or more LED chips has a substantially hemisphere shape. Since the light is radiated from the center of the multi-cut reflector 20 and is not reflected by the peripheral surface, the light is efficiently emitted and the storage recess 21 of the multi-cut reflector 20 formed in the spherical shape is formed.
Is incident on. Even in that case, since the light is incident in the direction perpendicular to the surface, the light is efficiently reflected without being reflected.

If a material having the same refractive index is filled between the housing recess 21 of the multi-cut reflector 20 and the package of the light-emitting portion 11 to form a discontinuous surface, a plurality of multi-cut reflectors 20 will be formed. Can reduce reflections other than the minute plane, and when gel or sol that functions as a buffer is used, even when the multi-cut reflector 20 expands and contracts depending on temperature, it can be blocked. it can.

As described above, in the LED device of this embodiment, one or more LED chips are arranged so as to emit the emitted light in a specific direction, for example, in the lower part of FIG. 10 and lead frames 12, 13, 14, 15 for guiding electric power to one or more LED chips of the light emitting unit 10, and the light emitting unit 10 at a substantially central position to reflect light emitted from the one or more LED chips. As described above, the multi-cut reflector 20 is provided with the multi-cut reflector 20 including a plurality of minute flat surfaces on which the metal film is formed on the outer surface of the multi-cut portion 27 to form the concave mirror portion.

Therefore, the emitted light of one or more LED chips is reflected by the multi-cut portion 27 which is composed of a plurality of minute planes of the multi-cut reflector 20 and is emitted in a vivid color (a glaring color). Mixed colors. Moreover, since the LED light mixed in the entire opening surface of the multi-cut reflector 20 is obtained, the transmittance is not lowered because the LED light diffusion plate of the LED chip, which is the light emitting source, is not used. Further, it is possible to obtain a color mixture of a plurality of LED lights even at a relatively short distance.

In the multi-cut reflector 20 of this embodiment, a metal film is formed on the outer surface of the multi-cut portion 27 so as to reflect light emitted from one or more LED chips to form a concave mirror portion. In the case of implementing the present invention, a metal film is formed on the inner surface of the multi-cut portion 27 so as to reflect the emitted light from one or more LED chips. It may be a synthetic resin body having a plurality of minute flat surfaces on which concave mirror portions are formed, or the multi-cut portion 27 or the multi-cut reflector 20 may be formed of a thin metal plate. However, with the configuration as in this embodiment, the manufacturing is simple, the degree of freedom in size and shape is high, and the manufacturing can be performed with high yield.

Further, since the multi-cut reflector 20 is formed by forming a metal film on a plurality of minute planes, the reflection efficiency inside the multi-cut reflector 20 is improved and the light emission of the LED device of this embodiment is made bright. can do. However, the multi-cut reflector 20 in the case of implementing the present invention does not necessarily have a metal film on a plurality of micro-planes of the multi-cut reflector 20 if total reflection is obtained depending on the refractive index and the position of the light source. Need not be formed.

Then, the multi-cut reflector 20 is
It is made of a transparent material of synthetic resin and has a plurality of minute planes formed on the outer peripheral surface thereof, and a metal film is formed on the plurality of minute planes, and the light emitting section 10 is housed in the center of the opposing surfaces of the concave mirror section. Since the storage recess 21 is formed, it can be formed by injection molding, is easy to manufacture, has flexibility in size and shape, and can be manufactured with high yield.

Further, the light emitting portion 10 and the lead frame 1
The reference numerals 2, 13, 14, and 15 are provided by radially disposing a plurality of lead frames 12, 13, 14, and 15 with the light emitting unit 10 as the center, and therefore, the multi-cut reflector 20.
Even if the mounting surface is circular, the lead frames 12, 13,
14 and 15 are arranged at the circumferential position, and LE is installed during manufacturing and assembly.
The D unit 10 and the multi-cut reflector 20 do not move relative to each other. Therefore, the assembly accuracy can be improved.

By the way, the light emitting unit 10 of the above embodiment
In the case of implementing the present invention, the number may be four or more, and as a result, one or more LED chips emit light in a specific direction. It may be arranged so as to emit light. In addition, in the present embodiment, the LED chip is used as the multi-cut reflector 2.
The emitted light is emitted in the direction of the approximate center of 0. However, when the present invention is carried out, the size and number of the multi-cut surfaces of the multi-cut reflector 20 may be changed to
The error range can be determined.

In addition, the lead frame 12 for guiding electric power to one or more LED chips of the light emitting unit 10 of the above embodiment,
Although 13, 14, and 15 are arranged at equal angles from the center of the light emitting unit 10, when the present invention is carried out, they are not necessarily limited to equal angles. For example, when the multi-cut reflectors 20 are continuously arranged in a line, the angles can be different. Also, L
The number of lead frames that lead power to the LED chips can be set arbitrarily depending on the number of ED chips.

The plurality of minute flat metal films formed on the outer peripheral surface of the multi-cut reflector of the above-described embodiment are not limited to aluminum, and a material having a light reflectance such as silver can be used. is there.

Furthermore, the one or more LEDs of the above embodiment
The chip used is not packaged in a bullet shape or the like, but when embodying the present invention, it can also be used as an LED chip incorporated in an LED lamp packaged in a bullet shape or the like. . In this type of embodiment, the light emitting unit 10 is large, but this does not pose a problem in terms of characteristics.

Although not shown in the embodiments of the present invention, the brightness of each LED chip is adjusted by an external control circuit such as current control or pulse control so that the required color mixture is controlled. .

[0052]

As it is evident from the foregoing description, in the LED device of claim 1, a light emitting unit which is arranged to emit emission light of one or more light emitting diode chips in a particular direction, the 1
A plurality of lead frames, which guide electric power to the light emitting portions of at least one light emitting diode chip, are radially arranged around the light emitting portion with a shift of approximately 90 degrees, and the light emitting portions are provided at a substantially central position. A multi-cut reflector that is separated from the light-emitting portion and has a plurality of minute flat surfaces on which concave mirror portions are formed so as to reflect the light emitted from the one or more light-emitting diode chips. A synthetic resin transparent body, the plurality of minute flat surfaces are formed on the outer peripheral surface of the transparent body, and a metal film is formed on the plurality of minute flat surfaces. While forming a storage recess for storing the light emitting unit ,
A housing for housing the lead frame centered on the housing recess.
A groove is formed.

Therefore, the emitted light of one or more LED chips is reflected by the multi-cut reflector consisting of a plurality of minute planes of the multi-cut reflector, the one or more LED chips are reflected in the multi-cut number, and Since they are superposed, they are mixed in a fresh color (color with a glare), so that the quality of the mixed light is improved and a high-grade feeling is obtained. In addition, since the LED light mixed in the entire opening surface of the multi-cut reflector can be obtained, it is not necessary to use a diffusion plate for the LED light of the LED chip which is the light emitting source, so that the transmittance is not lowered. Also,
Depending on the number and angle of the multi-cuts, it is possible to obtain a color mixture of a plurality of LED lights at a relatively short distance and in a wide field of view. Furthermore, it can be formed by injection molding, is easy to manufacture, has flexibility in size and shape, and can be manufactured with high yield. There is no possibility that the LED chip is affected by thermal changes and stress is concentrated under the influence of external temperature at the time of manufacture or use, and the LED chip is damaged. Since a plurality of lead frames are radially arranged around the light emitting portion, the lead frames are stably arranged on the surface where the multi-cut reflector is arranged, and the LE frame is mounted during manufacturing and assembly.
The D unit and the multi-cut reflector do not move relative to each other. In particular, the light emitting portions are arranged radially with a shift of approximately 90 degrees from each other, and electric power is guided to one or more light emitting diode chips of the light emitting portions, so that they do not move relative to each other. Therefore, the assembly accuracy can be improved. Special
In the multi-cut reflector,
Formed a lead groove to accommodate the lead frame as the core
Because it is a thing, the lead frame does not move easily
Can be installed as

In addition to the effect of claim 1, since the light emitting portion of the LED device in claim 2 is one in which the one or more LED chips are embedded in the center of a substantially hemisphere made of transparent synthetic resin. Then, the LED light from the one or more LED chips is radiated radially from the center of the substantially hemisphere,
Since it is not reflected by the peripheral surface, efficient emission is performed.

[0055] Since the light emitting portion and the housing recess of the multicut reflector LED device in claim 3, is made by filling a cushioning material, according to claim 1 or claim
In addition to the effect described in any one of 2) , even if the multi-cut reflector expands and contracts depending on the temperature, it can be blocked.

[Brief description of drawings]

FIG. 1 shows L in a first embodiment of the present invention.
It is the whole ED apparatus perspective view.

FIG. 2 shows L in the first embodiment of the present invention.
(A) is an overall perspective view of an LED unit used in an ED device, and (b) to (d) are a plan view (b), a side view (c), and a front view of an LED unit array used in an LED device. It is a figure (d).

FIG. 3 shows L in the first embodiment of the present invention.
It is explanatory drawing which shows the example of the wire bonding of the LED unit used for ED apparatus, (a) is a monochrome, (b)
Shows the case of two colors, and (c) shows the case of three colors.

FIG. 4 shows L in the first embodiment of the present invention.
It is the top view (a), front view (b), bottom view (c), and sectional view (d) seen from the front of the multi-cut reflector used in an ED device.

FIG. 5 shows L in the first embodiment of the present invention.
It is a structure explanatory view of the multi-cut reflector used by an ED apparatus.

FIG. 6 shows L in the first embodiment of the present invention.
It is a geometric pattern explanatory view which showed the multicut of the multicut reflector used with an ED apparatus.

[Explanation of symbols]

10 LED Unit 11 Light-Emitting Sections 12, 13, 14, 15 Lead Frame 20 Multi-Cut Reflector 21 Storage Recesses 22, 23, 24, 25 Lead Groove 26 Cylindrical Section 27 Multi-Cut Section R Multi-Cut Section Radius r Cylindrical Section Radius M LED chip arrangement position t Distance from LED chip arrangement position to the lower end of the multi-cut portion x width of a plurality of minute planes of the multi-cut portion

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akihiro Honma 1 Ochiai, Nagahata, Ojiai, Kasuga-cho, Nishikasugai-gun, Aichi Prefecture (56) Reference JP 5-291627 (JP, A) JP JP 2-51287 (JP, A) JP 59-151478 (JP, A) JP 50-56199 (JP, A) Actual development 63-105365 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 33/00

Claims (3)

(57) [Claims] 1. A light emitting part in which one or more light emitting diode chips are arranged to emit light emitted in a specific direction, and an electric power is applied to the light emitting part of the one or more light emitting diode chips. directing, with a focus on the light emitting portion, disposed a plurality of lead frames arranged in <br/> morphism shaped release shifted approximately 90 degrees, the light emitting portion in a substantially central position, separated from the light emitting portion And a multi-cut reflector including a plurality of minute flat surfaces on which concave mirror portions are formed so as to reflect light emitted from the one or more light-emitting diode chips, the multi-cut reflector being a transparent body of synthetic resin. A housing for forming the plurality of minute flat surfaces on the outer peripheral surface thereof, forming a metal film on the plurality of minute flat surfaces, and housing the light emitting portion in the center of the facing surface of the concave mirror portion. to form a recess, the Lee about the pay recess
A light emitting diode device having a lead groove for accommodating a window frame . 2. The light emitting diode device according to claim 1, wherein the light emitting portion is embedded in a substantially hemispherical body made of a transparent synthetic resin centering on the one or more light emitting diode chips. Wherein said light emitting portion and the housing recess of the multicut reflector, light-emitting diode device according to any one of claims 1 or claim 2, characterized by being filled with a buffer material.