JP2000294914A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device which can suppress deterioration of the quality of solder printing, even if mounting by a different system is executed on the same main face of a printing wiring board, and to provide a manufacture method thereof. SOLUTION: This manufacturing method of a semiconductor device is provided with a process for preparing a printed wiring board, where first to fourth SMD lands 3-6 connected by solder printing technology using a squeegee and a COB land connected with other connection systems are formed on a main face 1, the SMD lands are arranged in an almost straight line, and the COB land is not arranged on the straight line and a process for positioning and installing a stencil on the main face 1 of the printed wiring board, solder is supplied onto a stencil and at least on the SMD lands by the squeeze 7. As a result, deterioration of the quality of solder printing can be suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a semiconductor component is mounted on a printed wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 4A is a plan view showing one main surface of a conventional printed wiring board, and FIG.
The SMD (Surface Mount D) is attached to the printed wiring board shown in (a).
evice) is a perspective view showing a state where it is mounted. FIG. 5 (a)
5B is a plan view showing the other main surface of the conventional printed wiring board, and FIG. 5B is a perspective view showing a state where a COB (Chip On Board) is mounted on the printed wiring board shown in FIG. FIG.

First, one main surface 101 shown in FIG.
And a printed wiring board having the other main surface 102 shown in FIG. On one main surface 101 of the printed wiring board, first to eighth SMD lands 103 to 110 are formed. Also, the other main surface 1 of the printed wiring board
02 are formed with first to eighth COB lands 131 to 138, and the surfaces of these COB lands are plated with Au.

Next, as shown in FIG. 5B, first to eighth COBs 14 are formed on the other main surface 102 of the printed wiring board.
1 to 148 are mounted. The first to eighth COBs are
A bare chip is directly assembled on the eighth COB lands 131 to 138, and the chip is mounted by overcoating the chip with a resin.

Thereafter, a stencil (not shown) for solder printing is prepared. The stencil is provided with openings penetrating regions corresponding to the first to eighth SMD lands 103 to 110. Next, this stencil is shown in FIG.
The printed wiring board shown in (a) is positioned and placed on one main surface 101 of the printed wiring board.

Next, solder is supplied onto the stencil by a rubber squeegee (not shown). Thus, the solder is transferred onto the main surface 101 of the printed wiring board through the opening of the stencil, and as a result, the solder is printed on the first to eighth SMD lands 103 to 110.

Thereafter, the first to eighth SMDs 121 to 128 are mounted on the first to eighth SMD lands, respectively. Next, by reflowing the printed wiring board, as shown in FIG.
The first to eighth SMDs 121 to 128 are mounted on the SMD 01. Thus, a conventional semiconductor device is manufactured.

[0008]

In the conventional semiconductor device, as described above, the SMD is mounted on one main surface of the printed wiring board and the COB is mounted on the other main surface. SMD and C on the same main surface of the printed wiring board
We avoided implementing both OBs.

The reason is as follows. When mounting an SMD and a COB on the same main surface of a printed wiring board, the SMD is mounted by first mounting the COB, then performing solder printing on the SMD land, and performing reflow. For this reason, when solder printing is performed on the SMD land, since a convex portion made of COB is formed on the main surface of the printed wiring board, a convex portion is also provided on the stencil so as to fit the convex portion. With such a convex portion, when the solder is supplied onto the stencil using a squeegee, the squeegee floats due to the convex portion on the stencil. When the solder is supplied in such a state, the solder is not printed on the SMD lands around the COB. As a result, a mounting failure of the SMD occurs. For this reason, SMD and CO are placed on the same main surface of the printed wiring board.
B had avoided implementing both.

On the other hand, there is an increasing demand for higher density of semiconductor devices mounted on a printed wiring board. For this reason, it is necessary to avoid mounting of different types such as SMD and COB on the same main surface of the printed wiring board. It is becoming impossible.
From such demands, when mounting by different types of mounting is inevitable, it is conceivable to suppress the occurrence of mounting defects by increasing the interval between the different types of mounting as much as possible. However, if the distance is set to be large as described above, the demand for high-density mounting cannot be sufficiently satisfied.

Also, due to the strong demand for high-density mounting,
If mounting is performed on the same main surface of the printed wiring board by a different method and the interval cannot be made large, SM
The quality of the solder printing process at the time of D mounting is deteriorated, and the soldering quality is lowered and becomes unstable. As a result, the yield is deteriorated, and the manufacturing cost is increased.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to suppress the deterioration in the quality of solder printing even when mounting is performed on the same main surface of a printed wiring board by a different method. A semiconductor device and a method for manufacturing the same are provided.

[0013]

In order to solve the above-mentioned problems, a semiconductor device according to the present invention is provided with a first component connected to the same main surface of a printed wiring board by a solder printing technique using a squeegee. A semiconductor device mounted with a second component connected by another connection method, wherein the printed wiring board includes a first virtual area in which only the first component is mounted on a substantially straight line; A second virtual area where only the second component is mounted is located at a position different from the extension of the first virtual area. Preferably, the first component is an SMD, and the second component is a bare chip mounted with COB.

In the method of manufacturing a semiconductor device according to the present invention, a first component land connected by a solder printing technique using a squeegee and a second component land connected by another connection method are formed on a main surface. Preparing a printed wiring board, wherein the first component lands are arranged substantially on a straight line, and the second component lands are not arranged on the straight line; and Positioning a stencil on the main surface of the board and placing the stencil on the stencil and supplying solder over at least the first component land by a squeegee. And Further, it is preferable that the second component is a component in which a projection by the second component is present with respect to a main surface of the printed wiring board in the step of positioning and placing the stencil. .

In the method of manufacturing a semiconductor device, the first component lands are arranged substantially linearly on the main surface of the printed wiring board, and the second component lands are not arranged on the straight line.
By dividing the first component land formation region and the second component land formation region in this manner, when performing solder printing using a squeegee on the first component land, all the first land portions are formed.
Solder can be reliably printed on the component land, the quality of solder printing can be improved, and the quality of soldering can be improved.

In the method of manufacturing a semiconductor device, the squeegee has a recess for avoiding contact with the stencil on the second component land when solder is supplied onto the stencil by the squeegee. It is also possible that Thereby, when the squeegee is moved to supply the solder on the stencil, it is possible to prevent the squeegee from coming into contact with the protrusion by the second component, and as a result, without being affected by the protrusion. Solder can be printed on the first component land.

A semiconductor device according to the present invention comprises a first component connected by the solder printing technique using a squeegee and a second component connected by another connection method on the same main surface of the printed wiring board. A first component mounted substantially linearly on the printed wiring board, and a second component mounted on a region other than the substantially straight line of the printed wiring board.
Wherein the first component has a stencil aligned and mounted on the main surface of the printed wiring board, and is located on the stencil and at least above a land for the first component. It is characterized by being mounted by supplying solder with a squeegee.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1A and 1B are perspective views illustrating a method for manufacturing a semiconductor device according to the first embodiment of the present invention.

First, as shown in FIG. 1A, a printed wiring board on which both SMD and COB are mounted on one main surface 1 is prepared. The main surface 1 of this printed wiring board has first to first
Fourth SMD lands 3 to 6 and first to fourth COB lands (not shown) are formed. First to fourth SMD
The lands 3 to 6 are arranged on a substantially straight line on the main surface 1 of the printed wiring board, and no COB lands are arranged on the straight line. The first to fourth COB lands are arranged on a substantially straight line on the main surface 1, and S
Do not place MD land. Au plating is applied to the surface of these COB lands.

Next, on the main surface 1 of the printed wiring board,
The fourth COBs 21 to 24 are mounted. First to fourth CO
B is mounted by directly assembling a bare chip on the first to fourth COB lands and overcoating the chip with a resin.

Thereafter, a stencil (not shown) for solder printing is prepared. The stencil includes first to fourth S
Openings are provided in areas corresponding to the MD lands 3 to 6. Next, the stencil is positioned and placed on the main surface 1 of the printed wiring board shown in FIG.

Next, solder (not shown) is supplied onto the stencil by, for example, a rubber squeegee 7. That is, after moving the squeegee 7 from the SMD lands 3 to 6 to the COBs 21 to 24 on the stencil, the squeegee 7 is moved from the COB to the SMD lands to spread the solder over the entire surface of the stencil. That is, squeegee 7
Is moved on the stencil in a direction substantially perpendicular to the substantially linear arrangement of the SMD lands. As a result, the solder is transferred onto the main surface 1 of the printed wiring board through the opening of the stencil, and as a result, the solder is printed on the first to fourth SMD lands 3 to 6. The squeegee 7 may be moved at least over the opening of the stencil (on the SMD land) while contacting the stencil. Therefore, after the squeegee 7 has passed over the SMD land, the squeegee 7 may be stopped and the squeegee 7 may be moved again in the opposite direction on the SMD land, or the squeegee 7 may be moved upward and the stencil may be moved on the COB. The squeegee 7 may be moved without contacting the squeegee.

Thereafter, as shown in FIG.
The first to fourth SMDs 13 to 16 are mounted on the fourth SMD lands 3 to 6, respectively, and the printed wiring board is reflowed. Thereby, the first to fourth SMDs 13 to 16 are mounted on the main surface 1 of the printed wiring board. Thus, the semiconductor device according to the present embodiment is manufactured.

According to the first embodiment, the SMD lands are arranged substantially linearly on the main surface 1 of the printed wiring board.
No COB lands of different mounting types are arranged on the straight line. By separating the COB land formation region and the SMD land formation region in this manner, when performing the solder printing using the squeegee 7 on the SMD lands 3 to 6, the solder can be reliably printed on all the SMD lands, and the solder printing is performed. The quality can be improved, and the soldering quality can be improved. Therefore, even when mounting is performed by the different types on the same main surface of the printed wiring board, it is possible to suppress occurrence of mounting failure of the SMD.

FIG. 2 is a perspective view for explaining a method of manufacturing a semiconductor device according to a second embodiment of the present invention.
1 are given the same reference numerals, and only different portions will be described.

The squeegee 8 used to supply the solder onto the stencil has a notch 8a at the end face that contacts the stencil. The notch 8a is for preventing the squeegee 8 from coming into contact with the projections (projections) formed by the COBs 21 to 24 during solder printing.

That is, the squeegee 8 moves on a stencil (not shown) in a direction substantially parallel to the substantially linear arrangement of the SMD lands 3 to 6, thereby supplying the solder onto the stencil. At this time, the protrusions caused by the COBs 21 to 24 are avoided by the notches 8a. For this reason, squeegee 8
Can move on the stencil without contacting the projection. Thereby, the solder can be printed on the SMD land without being affected by the protrusion.
Therefore, similarly to the first embodiment, the quality of solder printing can be improved, and the quality of soldering can also be improved. Thus, even when mounting is performed on the same main surface of the printed wiring board by a different method, occurrence of mounting failure of the SMD can be suppressed.

FIG. 3 is a perspective view showing a modification of the squeegee shown in FIG. The squeegee 9 is provided with a notch (slit) 9a on an end face that comes into contact with the stencil. The cuts 9a are for preventing the squeegee 9 from contacting the protrusions of the COB during solder printing.

In this modified example, the same effect as in the second embodiment can be obtained.

The present invention is not limited to the above embodiment, but can be implemented with various modifications. For example,
In the first and second embodiments, the SMD is mounted on the main surface of the printed wiring board, but is not limited thereto.
It is also possible to mount a component other than the SMD and connected by a solder printing technique using a squeegee on the main surface of the printed wiring board.

In the above-described embodiment, the COB is mounted on the main surface of the printed wiring board. However, the present invention is not limited to this, and is present on the printed wiring board when performing solder printing using a squeegee. Other components can be mounted as long as they are convex components.

In the second embodiment, the notch 8a is provided in the squeegee 8, but the shape of the notch exists on the printed wiring board when performing solder printing using the squeegee. Any other shape can be used as long as it can avoid the convex parts.

[0034]

As described above, according to the present invention, a first component land connected by a solder printing technique using a squeegee and a second component land connected by another connection method are mainly used. The printed wiring board is formed on a surface, and the first component lands are arranged on a substantially straight line, and the second component lands are not arranged on the straight line. Therefore, it is possible to provide a semiconductor device and a method for manufacturing the same, which can suppress a decrease in the quality of solder printing even when mounting is performed on the same main surface of the printed wiring board by a different method.

[Brief description of the drawings]

FIGS. 1A and 1B are perspective views illustrating a method for manufacturing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a perspective view illustrating a method for manufacturing a semiconductor device according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing a modification of the squeegee shown in FIG. 2;

FIG. 4 (a) is a plan view showing one main surface of a conventional printed wiring board, and FIG. 4 (b) shows an SMD mounted on the printed wiring board shown in FIG. 4 (a). It is a perspective view showing a state.

FIG. 5A is a plan view showing the other main surface of a conventional printed wiring board, and FIG. 5B is a diagram in which a COB is mounted on the printed wiring board shown in FIG. 5A. It is a perspective view showing a state.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 One main surface of a printed wiring board 3 First SM
D land 4 Second SMD land 5 Third SM
D land 6 Fourth SMD land 7,8 Squeegee 8a Notch 9 Squeegee 9a Notch 13 First SM
D 14 Second SMD 15 Third S
MD 16 Fourth SMD 21 First C
OB 22 Second COB 23 Third C
OB 24 Fourth COB 101 One main surface of printed wiring board 102 The other main surface of printed wiring board 103 to 110 First to eighth SMD lands 121 to 128 First to eighth SMD 131 to 138 First To eighth COB land 141 to 148 first to eighth COB land

Claims (6)

[Claims] A semiconductor device in which a first component connected by a solder printing technique using a squeegee and a second component connected by another connection method are mounted on the same main surface of a printed wiring board. The printed wiring board has a first virtual region in which only the first component is mounted on a substantially straight line, and only the second component in a position different from the extension of the first virtual region. And a second virtual area mounted on the semiconductor device. 2. The semiconductor device according to claim 1, wherein said first component is an SMD, and said second component is a bare chip mounted with COB. 3. A first component land connected by a solder printing technique using a squeegee and a second component land connected by another connection method are formed on a main surface, and the first component land is connected to the first component land by another connection method. Preparing a printed wiring board in which the component lands are arranged substantially on a straight line and the second component lands are not arranged on the straight line; and positioning a stencil on the main surface of the printed wiring board. A method of manufacturing a semiconductor device, comprising: a step of mounting together; and a step of supplying solder by a squeegee onto the stencil and above at least the first component land. 4. The second component is a component in which a projection of the second component is present with respect to a main surface of the printed wiring board in a step of positioning and placing the stencil. 4. The method for manufacturing a semiconductor device according to claim 3, wherein: 5. The squeegee is formed with a recess for avoiding contact with the stencil on the second component land when solder is supplied onto the stencil by the squeegee. The method for manufacturing a semiconductor device according to claim 3, wherein 6. A semiconductor device having a first component connected by a solder printing technique using a squeegee and a second component connected by another connection method mounted on the same main surface of a printed wiring board. A first component mounted on the printed wiring board substantially on a straight line; and a second component mounted on an area other than the substantially straight line of the printed wiring board. The first component is mounted by positioning a stencil on the main surface of the printed wiring board and placing the solder on the stencil and above at least the first component land by a squeegee. A semiconductor device characterized in that: