JP2000294355A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JP2000294355A JP2000294355A JP11104219A JP10421999A JP2000294355A JP 2000294355 A JP2000294355 A JP 2000294355A JP 11104219 A JP11104219 A JP 11104219A JP 10421999 A JP10421999 A JP 10421999A JP 2000294355 A JP2000294355 A JP 2000294355A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- contact
- coil
- electrodes
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明はＩＣ本体の底面に
バンプが配列形成されてなる、いわゆるインナー面実装
タイプのＩＣに使用されるソケットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket used for a so-called inner surface mount type IC, in which bumps are arranged and formed on the bottom surface of an IC body.
【０００２】[0002]
【従来の技術】図６はこの種のＩＣ用のソケットとして
従来提案されている構成を示したものであり、図７はそ
の要部を拡大して示したものである。プリント配線基板
１１の一面には複数の接点電極１２が配列形成されてお
り、これら接点電極１２の配列ピッチは装着されるＩＣ
のバンプの配列ピッチと同一とされている。2. Description of the Related Art FIG. 6 shows a configuration conventionally proposed as a socket for this type of IC, and FIG. 7 shows an enlarged view of a main part thereof. A plurality of contact electrodes 12 are arranged and formed on one surface of the printed wiring board 11, and the arrangement pitch of these contact electrodes 12 is determined by the IC to be mounted.
Is the same as the arrangement pitch of the bumps.
【０００３】プリント配線基板１１の他面には各接点電
極１２とそれぞれ接続された端子電極１３が形成されて
いる。各端子電極１３はこの例では接点電極１２に対し
てピッチが拡大されており、スルーホールが形成されて
ピン端子１４が取り付けられたものとなっている。プリ
ント配線基板１１の接点電極１２が形成された面上には
ガイド板１５が異方導電性接合材を挟んで配置される。
異方導電性接合材は加圧・加熱により導電接着作用を有
するもので、この例では異方導電性接合材として異方導
電性接着シート１６が使用され、この異方導電性接着シ
ート１６により、ガイド板１５はプリント配線基板１１
に接着固定されている。[0005] On the other surface of the printed wiring board 11, terminal electrodes 13 connected to the respective contact electrodes 12 are formed. In this example, the pitch of each terminal electrode 13 is larger than that of the contact electrode 12, and a through hole is formed and a pin terminal 14 is attached. A guide plate 15 is disposed on the surface of the printed wiring board 11 on which the contact electrodes 12 are formed, with an anisotropic conductive bonding material interposed therebetween.
The anisotropic conductive bonding material has a conductive bonding action by pressurization and heating. In this example, an anisotropic conductive bonding sheet 16 is used as the anisotropic conductive bonding material. , The guide plate 15 is the printed wiring board 11
Adhesively fixed.
【０００４】ガイド板１５には複数のスルーホール１７
が設けられており、これらスルーホール１７は各接点電
極１２上に位置するように配列形成されている。各スル
ーホール１７の両端縁には図７に示したように電極（ス
ルーホール電極）１８、１９が形成されており、電極１
９は異方導電性接着シート１６を介して対向する接点電
極１２と導通される。The guide plate 15 has a plurality of through holes 17.
These through holes 17 are arranged and formed so as to be located on the respective contact electrodes 12. Electrodes (through-hole electrodes) 18 and 19 are formed at both ends of each through-hole 17 as shown in FIG.
9 is electrically connected to the opposite contact electrode 12 via the anisotropic conductive adhesive sheet 16.
【０００５】各スルーホール１７にはコイル状接点２１
が収容される。コイル状接点２１は一端がスルーホール
１７より突出され、他端は異方導電性接着シート１６上
に位置されて異方導電性接着シート１６に固定され、異
方導電性接着シート１６を介して対向する接点電極１２
と導通される。図７中、矢印２２はこれらコイル状接点
２１及び電極１９と接点電極１２との導通方向を示す。[0005] Each through hole 17 has a coil-shaped contact 21.
Is accommodated. One end of the coil-shaped contact 21 protrudes from the through hole 17, and the other end is located on the anisotropic conductive adhesive sheet 16 and is fixed to the anisotropic conductive adhesive sheet 16, and is fixed via the anisotropic conductive adhesive sheet 16. Opposing contact electrode 12
Is conducted. In FIG. 7, an arrow 22 indicates the conduction direction between the coil-shaped contact 21 and the electrode 19 and the contact electrode 12.
【０００６】なお、この例ではガイド板１５を収容する
フレーム２３がプリント配線基板１１上に取り付けられ
ており、フレーム２３に設けられた開口とガイド板１５
の板面とによって構成された凹部２４にＩＣが位置決め
収容されるものとなっている。フレーム２３の端縁に設
けられている軸受部２５は図には示していないが、カバ
ー取り付け用に使用されるもので、この軸受部２５を中
心としてカバーを回動自在に取り付けることができるも
のとなっている。また、フレーム２３の他方の端縁に形
成されている突起２６はカバーを引っかけてロックする
ために使用される。In this example, a frame 23 accommodating the guide plate 15 is mounted on the printed wiring board 11, and an opening provided in the frame 23 and the guide plate 15
The IC is positioned and accommodated in the concave portion 24 formed by the plate surface. The bearing 25 provided at the edge of the frame 23 is not shown in the figure, but is used for attaching the cover, and the cover can be attached rotatably around the bearing 25. It has become. Further, a projection 26 formed on the other end of the frame 23 is used for hooking and locking the cover.
【０００７】図８は上述したソケット２７にＩＣ２８が
装着された時のコイル状接点２１の様子を示したもので
あり、ＩＣ２８のバンプ２９によってコイル状接点２１
は押圧され、これによりコイル状接点２１はその弾性復
元力によりバンプ２９と良好に接触するものとなってい
る。また、この際、コイル状接点２１は押圧により湾曲
してスルーホール１７の内壁（導電膜）と接触するた
め、スルーホール１７もバンプ２９と接点電極１２との
間の接続導体として機能し、これによりバンプ２９及び
接点電極１２間の接続抵抗値（導体抵抗値）を低減でき
るものとなっている。FIG. 8 shows the state of the coiled contact 21 when the IC 28 is mounted on the socket 27 described above.
Is pressed, whereby the coil-shaped contact 21 comes into good contact with the bump 29 by its elastic restoring force. At this time, since the coil-shaped contact 21 is bent by pressing and comes into contact with the inner wall (conductive film) of the through-hole 17, the through-hole 17 also functions as a connection conductor between the bump 29 and the contact electrode 12. Thereby, the connection resistance value (conductor resistance value) between the bump 29 and the contact electrode 12 can be reduced.
【０００８】[0008]
【発明が解決しようとする課題】上述したように、図６
に示したソケット２７においてはコイル状接点２１をス
ルーホール１７に収容することにより、接続抵抗値を低
減できるものとなっているものの、コイル状接点２１と
スルーホール１７との接触位置は一定ではなく、例えば
バンプ２９の形状バラツキやコイル状接点２１の寸法バ
ラツキ、あるいは異方導電性接着シート１６へのコイル
状接点２１の固定され具合等の要因によって接触位置が
図８に例示したようにＰ1 部となったり、あるいはＰ2
部になったりというようにバラツいてしまうものとなっ
ているため、このバラツキに伴い、接続抵抗値にバラツ
キが生じ、よってこのようなソケット２７を使用したＩ
Ｃ検査においては、低電圧測定や高周波測定時に支障が
生じる恐れが有るものとなっていた。As described above, FIG.
In the socket 27 shown in (1), although the coil-shaped contact 21 is accommodated in the through-hole 17, the connection resistance can be reduced, but the contact position between the coil-shaped contact 21 and the through-hole 17 is not fixed. For example, as shown in FIG. 8, the contact position is P 1 due to a variation in the shape of the bumps 29, a variation in the dimensions of the coiled contacts 21, or a condition in which the coiled contacts 21 are fixed to the anisotropic conductive adhesive sheet 16. Part or P 2
The connection resistance value varies due to the variation, and therefore, the I using the socket 27 using such a socket 27 may vary.
In the C inspection, there is a possibility that trouble may occur during low voltage measurement or high frequency measurement.
【０００９】この発明の目的は上述した問題点に鑑み、
接続抵抗値（導体抵抗値）のバラツキを改善し、小さ
く、かつ安定した接続抵抗値が得られるようにしたＩＣ
用ソケットを提供することにある。In view of the above problems, an object of the present invention is to provide
An IC that improves the variation in connection resistance (conductor resistance) and enables a small and stable connection resistance to be obtained.
To provide sockets for
【００１０】[0010]
【課題を解決するための手段】請求項１の発明によれ
ば、ＩＣ用ソケットは一面にＩＣバンプの配列ピッチと
同一ピッチで複数の接点電極が配列形成され、他面にそ
れら接点電極とそれぞれ接続された複数の端子電極が形
成されたプリント配線基板と、そのプリント配線基板の
一面上に異方導電性接合材を挟んで配置され、複数の接
点電極上にそれぞれ位置する複数のスルーホールを有
し、それらスルーホールの両端縁に電極がそれぞれ形成
されてなるガイド板と、スルーホールにそれぞれ収容さ
れて、一端がそのスルーホールから突出され、他端が異
方導電性接合材に固定されたコイル状接点とを具備し、
コイル状接点がスルーホールより突出する突出部に、ス
ルーホールの内径より大径とされてスルーホール端縁の
上記電極と対向する大径部を有するものとされる。According to the first aspect of the present invention, in the IC socket, a plurality of contact electrodes are formed on one surface at the same pitch as the arrangement pitch of the IC bumps, and on the other surface, these contact electrodes are respectively formed. A printed wiring board on which a plurality of connected terminal electrodes are formed, and a plurality of through-holes arranged on one surface of the printed wiring board with an anisotropic conductive bonding material interposed therebetween and located on a plurality of contact electrodes, respectively. A guide plate in which electrodes are formed at both ends of the through holes, and the guide plates are housed in the through holes, one end protrudes from the through holes, and the other end is fixed to the anisotropic conductive bonding material. And coiled contacts,
The projecting portion where the coil-shaped contact protrudes from the through-hole has a large-diameter portion having a diameter larger than the inner diameter of the through-hole and facing the electrode at the edge of the through-hole.
【００１１】請求項２の発明では請求項１の発明におい
て、上記大径部が上記突出部の先端に設けられる。請求
項３の発明では請求項１の発明において、上記大径部が
上記突出部の中間に設けられる。According to a second aspect of the present invention, in the first aspect of the present invention, the large-diameter portion is provided at a tip of the projecting portion. According to a third aspect of the present invention, in the first aspect of the present invention, the large diameter portion is provided in the middle of the projecting portion.
【００１２】[0012]
【発明の実施の形態】この発明の実施の形態を図面を参
照して実施例により説明する。なお、図６〜８と対応す
る部分には同一符号を付し、その説明を省略する。図１
はこの発明の一実施例を示したものであり、図２はその
要部を拡大して示したものである。この例ではガイド板
１５の各スルーホール１７に配されるコイル状接点３１
は図２に示したような形状を有するものとされ、即ち大
径部３２と小径部３３とを有する異径状とされる。Embodiments of the present invention will be described with reference to the accompanying drawings. 6 to 8 are denoted by the same reference numerals, and description thereof will be omitted. FIG.
FIG. 1 shows an embodiment of the present invention, and FIG. 2 is an enlarged view of a main part thereof. In this example, a coil-shaped contact 31 arranged in each through hole 17 of the guide plate 15
Has a shape as shown in FIG. 2, that is, has a different diameter having a large diameter portion 32 and a small diameter portion 33.
【００１３】大径部３２はスルーホール１７より突出す
る突出部３４の先端に設けられており、この大径部３２
の径はスルーホール１７の内径より大とされてスルーホ
ール１７の端縁に形成されている電極１８と対向する大
きさとされる。なお、コイル状接点３１は従来と同様、
異方導電性接着シート１６上に位置されて、その基端が
固定されている。The large diameter portion 32 is provided at the tip of a protruding portion 34 protruding from the through hole 17.
Is larger than the inner diameter of the through hole 17 and faces the electrode 18 formed at the edge of the through hole 17. In addition, the coil-shaped contact 31 is similar to the conventional one.
The base end is fixed on the anisotropic conductive adhesive sheet 16.
【００１４】図３は上記のようなコイル状接点３１を備
えたソケット３５にＩＣ２８が装着された時のコイル状
接点３１の様子を示したものであり、コイル状接点３１
はバンプ２９によって押圧されて圧縮され、その大径部
３２が電極１８に圧接された状態となる。つまり、この
例によれば大径部３２が確実に電極１８に接触し、コイ
ル状接点３１とスルーホール１７との接触位置が常にＰ
3 部となるため、従来のような接触位置のバラツキに起
因するソケットの接続抵抗値（導体抵抗値）のバラツキ
は解消され、各接点において極めて安定した接続抵抗値
が得られるものとなる。FIG. 3 shows a state of the coiled contact 31 when the IC 28 is mounted on the socket 35 having the coiled contact 31 as described above.
Is pressed and compressed by the bump 29, and the large diameter portion 32 is pressed against the electrode 18. That is, according to this example, the large-diameter portion 32 reliably contacts the electrode 18, and the contact position between the coil-shaped contact 31 and the through hole 17 is always P
Since there are three parts, the variation in the connection resistance value (conductor resistance value) of the socket due to the variation in the contact position as in the related art is eliminated, and an extremely stable connection resistance value can be obtained at each contact.
【００１５】さらに、コイル状接点３１がＰ3 部でスル
ーホール１７と導通するため、スルーホール１７の全長
（全体）がバンプ２９及び接点電極１２間の接続導体と
して機能することになり、よって接続抵抗値の低減に対
し、スルーホール１７を最も効果的に機能させることが
でき、接続抵抗値が小さく、かつ安定した良好な電気的
特性を有するソケットを得ることができる。Furthermore, since the coil shaped contact 31 is electrically connected to the through hole 17 in the P 3 parts, will be the entire length of the through hole 17 (total) functions as a connection conductor between the bump 29 and contact electrodes 12, thus connecting The through hole 17 can function most effectively with respect to the reduction of the resistance value, and a socket having a small connection resistance value and stable and excellent electric characteristics can be obtained.
【００１６】なお、数値例の一例を示せば、図６に示し
た従来のソケット２７ではＩＣ検査時の接続抵抗値は
０．０５〜０．５Ωというようなバラツキがあったが、
この例によるソケット３５では接続抵抗値は０．０１〜
０．０５Ω程度となり、大幅に改善された。図４はスル
ーホール１７の電極１８と圧接する大径部３２を突出部
３４の先端ではなく、突出部３４の中間に設けるように
した例を示したものであり、このコイル状接点３６を具
備するソケットにＩＣ２８が装着された時の状態を図５
に示す。As an example of numerical values, the conventional socket 27 shown in FIG. 6 has a connection resistance value of 0.05 to 0.5 Ω at the time of IC inspection.
In the socket 35 according to this example, the connection resistance value is 0.01 to
It was about 0.05Ω, which was greatly improved. FIG. 4 shows an example in which the large-diameter portion 32 that is in pressure contact with the electrode 18 of the through hole 17 is provided not at the tip of the projection 34 but at the middle of the projection 34. FIG. 5 shows a state when the IC 28 is mounted on the socket to be mounted.
Shown in
【００１７】この例においても図５に示したように、大
径部３２がＰ3 部で電極１８と確実に接触するため、小
さくかつ安定した接続抵抗値を得ることができる。な
お、このように大径部３２を突出部３４の中間に位置さ
せることにより、例えば突出部３４の先端の小径部３
３’の径を対接するＩＣ２８のバンプ２９の大きさに対
応して最適な大きさに選定することが可能となる。[0017] As shown in FIG. 5 In this example, since the large-diameter portion 32 to reliably contact with the electrode 18 at the P 3 parts, it is possible to obtain a small and stable connection resistance value. By positioning the large-diameter portion 32 in the middle of the projection 34 in this manner, for example, the small-diameter portion 3 at the tip of the projection 34 is formed.
It is possible to select an optimum size corresponding to the size of the bump 29 of the IC 28 that contacts the diameter 3 '.
【００１８】[0018]
【発明の効果】以上説明したようにこの発明によればコ
イル状接点の、スルーホールより突出する突出部にスル
ーホールより大径の大径部を設けたことにより、使用時
（ＩＣ装着時）にこの大径部が確実にスルーホール端縁
の電極と接触するため、従来のようにコイル状接点とス
ルーホールとの接触位置がバラツくといった問題は発生
せず、よってコイル状接点と共にスルーホールを接続導
体として安定に、かつ全長に渡って機能させることがで
きるため、接続抵抗値が小さく、かつ安定した良好な電
気的特性を有するＩＣ用ソケットを得ることができる。As described above, according to the present invention, the projecting portion of the coil-shaped contact, which protrudes from the through-hole, is provided with a large-diameter portion having a diameter larger than that of the through-hole. Since the large diameter portion surely comes into contact with the electrode at the edge of the through hole, the problem that the contact position between the coil-shaped contact and the through-hole is not different from the conventional case does not occur. Can be functioned stably as a connection conductor over the entire length, so that an IC socket having a small connection resistance value and stable and excellent electric characteristics can be obtained.
【００１９】しかも、請求項３の発明では大径部を突出
部の中間に設けるようにしているため、ＩＣバンプの大
きさに応じてコイル状接点の先端の径を選定することが
可能となる。Further, in the third aspect of the present invention, since the large diameter portion is provided in the middle of the projecting portion, the diameter of the tip of the coil-shaped contact can be selected according to the size of the IC bump. .
【図１】請求項１の発明の実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the invention of claim 1;
【図２】図１の要部拡大図。FIG. 2 is an enlarged view of a main part of FIG.
【図３】図１のソケットの使用時の状態を説明するため
の図。FIG. 3 is a view for explaining a state when the socket of FIG. 1 is used.
【図４】請求項３の発明の実施例を説明するための図。FIG. 4 is a view for explaining an embodiment of the invention of claim 3;
【図５】図４のコイル状接点の使用時の状態を説明する
ための図。FIG. 5 is a view for explaining a state when the coil-shaped contact of FIG. 4 is used.
【図６】従来提案されているＩＣ用ソケットを示す断面
図。FIG. 6 is a sectional view showing a conventionally proposed IC socket.
【図７】図６の要部拡大図。FIG. 7 is an enlarged view of a main part of FIG. 6;
【図８】図６のソケットの使用時の状態を説明するため
の図。FIG. 8 is a view for explaining a state when the socket of FIG. 6 is used.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｒ 13/24 Ｈ０１Ｒ 13/24 Ｆターム(参考） 2G003 AA07 AG01 AG07 AG08 AG12 2G011 AA15 AB01 AB06 AB07 AC14 AE22 5E024 CA18 CB05 CB06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01R 13/24 H01R 13/24 F term (Reference) 2G003 AA07 AG01 AG07 AG08 AG12 2G011 AA15 AB01 AB06 AB07 AC14 AE22 5E024 CA18 CB05 CB06
Claims (3)
ッチで複数の接点電極が配列形成され、他面にそれら接
点電極とそれぞれ接続された複数の端子電極が形成され
たプリント配線基板と、 そのプリント配線基板の上記一面上に異方導電性接合材
を挟んで配置され、上記複数の接点電極上にそれぞれ位
置する複数のスルーホールを有し、それらスルーホール
の両端縁に電極がそれぞれ形成されてなるガイド板と、 上記スルーホールにそれぞれ収容されて、一端がそのス
ルーホールから突出され、他端が上記異方導電性接合材
に固定されたコイル状接点とを具備し、 上記コイル状接点は上記スルーホールより突出する突出
部に、上記スルーホールの内径より大径とされてスルー
ホール端縁の上記電極と対向する大径部を有することを
特徴とするＩＣ用ソケットA printed wiring board having a plurality of contact electrodes arranged on one surface at the same pitch as the arrangement pitch of IC bumps, and a plurality of terminal electrodes connected to the contact electrodes on the other surface. The printed wiring board has a plurality of through-holes arranged on the one surface of the printed wiring board with an anisotropic conductive bonding material interposed therebetween and positioned on the plurality of contact electrodes, and electrodes are formed at both end edges of the through-holes, respectively. And a coil-shaped contact housed in the through-hole, one end protruding from the through-hole, and the other end fixed to the anisotropic conductive bonding material. Is characterized in that the projecting portion projecting from the through-hole has a large-diameter portion having a diameter larger than the inner diameter of the through-hole and facing the electrode at the edge of the through-hole. IC socket
て、 上記大径部が上記突出部の先端に設けられていることを
特徴とするＩＣ用ソケット。2. The IC socket according to claim 1, wherein said large-diameter portion is provided at a tip of said projecting portion.
て、 上記大径部が上記突出部の中間に設けられていることを
特徴とするＩＣ用ソケット。3. The IC socket according to claim 1, wherein the large-diameter portion is provided in the middle of the projecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10421999A JP4156125B2 (en) | 1999-04-12 | 1999-04-12 | IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10421999A JP4156125B2 (en) | 1999-04-12 | 1999-04-12 | IC socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000294355A true JP2000294355A (en) | 2000-10-20 |
| JP4156125B2 JP4156125B2 (en) | 2008-09-24 |
Family
ID=14374858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10421999A Expired - Fee Related JP4156125B2 (en) | 1999-04-12 | 1999-04-12 | IC socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4156125B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100362707C (en) * | 2002-07-09 | 2008-01-16 | 山一电机株式会社 | Socket for semiconductor device |
| KR20200095113A (en) * | 2019-01-31 | 2020-08-10 | 주식회사 이노글로벌 | Test socket |
-
1999
- 1999-04-12 JP JP10421999A patent/JP4156125B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100362707C (en) * | 2002-07-09 | 2008-01-16 | 山一电机株式会社 | Socket for semiconductor device |
| KR20200095113A (en) * | 2019-01-31 | 2020-08-10 | 주식회사 이노글로벌 | Test socket |
| KR102147745B1 (en) * | 2019-01-31 | 2020-08-25 | 주식회사 이노글로벌 | Test socket |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4156125B2 (en) | 2008-09-24 |
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