JP2000293271A - Heat radiation hinge structure of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation hinge structure of an electronic device which does not rise in temperature at a specific position, facilitates the assembling operation, and prevents trouble such as the breakage of a heat pipe. SOLUTION: This structure is equipped with a heat radiation hinge member 7 made of a heat-conductive member arranged at a connection part between a couple of housings 1 and 2 which can mutually be opened and closed and a hinge part which is made of a member with low heat conductivity so as to fix the heat radiation hinge member 7 to at least one of the couple of housings 1 and 2. The heat radiation hinge member 7 is equipped with a heat radiation hinge main body which is arranged in one housing and receives the heat from heat generating parts and a hold part which is provided in the other housing and holds at least a part of the heat pipe rotatably by an elastic member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CPU accommodated in a housing, which is applied to an electronic device in which a pair of housings are openably and closably connected via a hinge mechanism, such as a notebook personal computer. The present invention relates to a heat dissipating hinge structure for dissipating heat of a heat-generating component such as the above.

[0002]

2. Description of the Related Art For example, Japanese Patent Laid-Open Publication No. Hei 10-187284 discloses a heat radiation hinge structure for an electronic device applied to a notebook personal computer (hereinafter abbreviated as "PC"). A structure (hereinafter, referred to as “prior art 1”) is disclosed. FIG. 12 shows an outline of a heat dissipation hinge structure of Prior Art 1. In Prior Art 1, the CPU side housing 112 of the personal computer is used.
The hinge mechanism for pivotally connecting the display-side housing 114 to the display-side housing 114 includes a hinge member composed of the condensing-side end 138b of the heat pipe 138 fixed to the CPU-side housing, and a hinge member 152 fixed to the display-side housing. It is configured. When the heat pipe 138 receives heat from the heat-generating component 124, the heat
8b and the heat are transmitted through the hinge member 152.
Then, the heat is further transmitted to the heat transfer block 168 of the display-side housing via the heat pipe 166 and the evaporation-side end 166b, and is radiated from the display-side housing to the surrounding environment.

That is, in the CPU side housing, C
The heat transfer block on the PU is connected to the evaporating end of the heat pipe, and the heat pipe protrudes into the display side housing through a circular hole 148 formed in the CPU side housing. A metal hinge member 152 is fixed in the display-side housing, and a condensing-side end 138 of the heat pipe is inserted in an insertion portion penetrating the hinge member.
b is inserted. A so-called slotting process is applied to the insertion portion of the hinge member, and the condensing side end of the heat pipe has an appropriate sliding resistance through a layer made of a friction material provided in the insertion portion of the hinge member. It is held rotatably.

[0004] Since the opening of the circular hole and the hinge member is provided so as to coincide with the opening and closing axis of the hinge mechanism on the other side, when the two housings are opened and closed, one of the hinge mechanisms is connected to the condensing side of the heat pipe. The opening and closing of the housing is guided by the rotation of the hinge member about the end.

[0005] The heat pipe is configured to transfer heat using the latent heat of vaporization of the working fluid enclosed therein. Therefore, the heat generated by the CPU in accordance with the operation of the personal computer is transmitted to the hinge member via the heat pipe, and is radiated from the hinge member to the display side housing having a relatively low temperature. In this personal computer, in order to obtain a higher heat radiation effect, consideration is given to heat transfer from the hinge member to the display side housing via another heat pipe.

[0006]

The above-described prior art heat dissipation hinge structure for a personal computer has the following problems. First, since the hinge member 152 is in close contact with the display-side housing 114, when the temperature of the heat generated by the CPU is high, the heat transferred by the heat pipe is transmitted through the heat-conductive hinge member 152, and The heat is transmitted to the contact portion with the contact 114, and the temperature of the portion becomes excessively high. Furthermore, the heat pipe is C
When it comes into direct contact with the circular hole 148 formed in the PU-side housing, the temperature in the vicinity of the circular hole in the CPU-side housing also becomes excessively high. Therefore, there is a problem that the design range of the material of the display side housing and the CPU side housing is narrowed.

Next, regarding the connection structure between the heat pipe and the hinge member, the condensing side end of the heat pipe is held in the insertion portion of the hinge member as described above. On the other hand, it is necessary to insert the end of the heat pipe on the condensation side along the opening / closing axis. At this time, since the heat pipe is already mounted on the CPU side housing and the hinge member is already mounted on the display side housing, there is a problem that the assembling work is very difficult.

Further, as to the strength of the heat-dissipating hinge structure, as described above, in one hinge mechanism, since the opening and closing of the housing is guided by a heat pipe of a hollow structure having insufficient strength, the heat pipe may be damaged. There is a problem that there is.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat radiation hinge for an electronic device in which the temperature of a specific portion is not excessively increased, the assembling work is simplified, and problems such as breakage of a heat pipe can be prevented. It is to provide a structure.

[0010]

Means for Solving the Problems The inventors have conducted intensive studies to solve the above-mentioned problems of the prior art. As a result, through the hinge portion made of a material having low thermal conductivity,
So that the heat dissipating hinge member does not come into close contact with the housing
By fixing the heat dissipation hinge member to the housing,
Alternatively, another heat pipe is installed on the heat generating component so that heat is not excessively concentrated on the heat dissipating hinge member, and the heat is dispersed in advance, thereby preventing the temperature of a specific portion of the housing from becoming excessively high. I realized that I can do it.

Further, the heat pipe hinge is resiliently fitted to the heat pipe hinge groove in which the heat pipe can be disposed, and the heat pipe is rotated into the heat pipe groove. By providing a heat pipe fixing member that holds the heat pipe as possible, the heat pipe is connected to the heat pipe fixing member by simply placing the heat pipe in the heat pipe receiving groove and fitting the heat pipe fixing member during assembly. I realized that I can do it.

Further, when a hinge mechanism for guiding the opening and closing of both housings is formed by connecting the heat-dissipating hinge member and the hinge portion, the opening and closing of both housings are guided by the hinge mechanism irrespective of the heat pipe. It has been found that since an unreasonable external force does not act on the pipe, it is possible to prevent the heat pipe from being damaged.

The present invention has been made based on the above-mentioned findings. A first aspect of the heat radiation hinge structure for an electronic device according to the present invention is a heat radiation hinge structure for an electronic device provided with the following members. . (1) A heat-dissipating hinge member formed of a heat-conductive member disposed at a connection portion of a pair of housings that can be opened and closed with each other, and the heat-dissipating hinge member receives heat from a heat-generating component disposed on one housing. A heat dissipating hinge body; and a holding portion rotatably holding at least a part of the heat pipe provided in the other housing by an elastic member. (2) The heat dissipating hinge member is provided at least in the pair of housings. A hinge portion made of a member having low thermal conductivity for fixing to one housing.

According to a second aspect of the heat radiation hinge structure of the electronic device of the present invention, the heat radiation hinge body further includes a connecting portion for connecting to a heat transfer plate for transmitting heat of the heat generating component. The holding portion is a heat pipe receiving groove for rotatably receiving a part of the heat pipe and a heat pipe made of an elastic member that presses a part of the heat pipe received in the heat pipe receiving groove. And a pipe fixing member.

According to a third aspect of the heat radiation hinge structure of the electronic device according to the present invention, the heat radiation hinge body is formed integrally with a heat transfer plate for transmitting heat of the heat generating component, and The part presses a part of the heat pipe accommodated in the heat pipe receiving groove and the heat pipe receiving groove that rotatably accommodates a part of the heat pipe, and a heat pipe fixing member made of an elastic member. It is characterized by having.

In a fourth aspect of the heat radiation hinge structure of the electronic device according to the present invention, the hinge portion is provided in a housing on which the heat generating component is not disposed, and the heat radiation hinge member is provided with the heat generating hinge member. The flexible component is fixed to the housing by the hinge portion without contacting the housing in which the flexible component is arranged.

In a fifth aspect of the heat radiation hinge structure of the electronic device according to the present invention, the hinge portion is provided in each of the pair of housings, and the heat radiation hinge member includes a heat generating component. It is characterized by being fixed to each of the pair of housings by the hinge portion without contacting the arranged housing.

In a sixth aspect of the heat radiation hinge structure of the electronic device according to the present invention, the heat radiation hinge member is fixed by the hinge portion without coming into contact with a housing in which the heat generating component is arranged. The heat transfer plate member connected to the connection portion of the heat dissipation hinge body is provided with another heat pipe for moving heat of the heat generating component to another predetermined position. .

In a seventh aspect of the heat radiation hinge structure of the electronic device according to the present invention, the heat radiation hinge member is fixed by the hinge portion without coming into contact with a housing in which the heat generating component is arranged. The heat transfer plate of the heat radiation hinge body is provided with another heat pipe for moving the heat of the heat generating component to another predetermined position.

Another aspect of the heat dissipating hinge structure for an electronic device according to the present invention is a heat dissipating hinge structure for an electronic device provided with the following members. (1) a first heat pipe that moves heat of a heat-generating component housed in one of a pair of housings that can be opened and closed to a predetermined position in the one housing;
(2) connecting the first heat pipe and transferring the heat transferred by the first heat pipe to a predetermined position in the other of the pair of housings;
(3) an end of the first heat pipe fixedly held at an end of the first heat pipe, which is disposed on a housing in which the exothermic component of the connection part of the housing is arranged, and an end of the second heat pipe; A heat dissipating hinge member made of a heat conductive member for rotatably holding the portion by an elastic member; and (4) low heat conductivity for fixing the heat dissipating hinge member to at least one of the pair of housings. Hinge part consisting of members.

In another aspect of the heat dissipation hinge structure of the electronic device according to the present invention, the heat dissipation hinge member includes a holding hole for fixing and holding an end of the first heat pipe, and an end of the second heat pipe. Heat pipe receiving groove for rotatably housing the second heat pipe and the second pipe housed in the heat pipe receiving groove.
And a heat pipe fixing member made of an elastic member for pressing an end of the heat pipe.

In another aspect of the heat radiation hinge structure of the electronic device according to the present invention, the hinge portion is provided in a housing in which the heat generating component is not disposed, and the heat radiation hinge member is provided with the heat generating hinge member. The component is fixed to the housing by the hinge without contacting the housing in which the component is arranged.

In another aspect of the heat dissipation hinge structure of the electronic device according to the present invention, the hinge portion is provided in each of the pair of housings, and the heat dissipation hinge member is provided with the heat generating component. The hinge portion is fixed to each of the pair of housings without contacting the housing.

In another aspect of the heat dissipation hinge structure of the electronic device according to the present invention, the heat dissipation hinge member is provided fixed to a housing in which the heat-generating component is disposed, and
It is characterized by including a third heat pipe that moves heat of the heat generating component to a predetermined position different from that of the first heat pipe.

In another aspect of the heat dissipation hinge structure of the electronic device according to the present invention, the heat dissipation hinge member is provided without being in contact with a housing in which the heat-generating component is disposed.
Further, a third heat pipe for moving heat of the heat generating component to a predetermined position different from that of the first heat pipe is provided.

Further, in another aspect of the heat radiation hinge structure of the electronic device according to the present invention, a heat radiation hinge member is provided at a connection point of a pair of housings that can be opened and closed with each other, and the heat radiation hinge member is provided with the two housings. A heat dissipating hinge mechanism for an electronic device that connects a heat pipe rotatably on an opening / closing axis and dissipates heat of a heat generating component provided on one housing to the other housing via the heat pipe and a heat dissipating hinge member. A heat pipe receiving groove in which the heat pipe can be disposed, and the heat radiation hinge member elastically fitted to the heat radiating hinge member, so that the heat pipe is rotatable in the heat pipe receiving groove. And a heat pipe fixing member to be held.

Further, another aspect of the heat dissipating hinge structure of the electronic device according to the present invention is that a curved pressing portion is formed on the heat pipe fixing member to press the heat pipe in the heat pipe receiving groove with elasticity. It is.

Further, in another aspect of the heat radiation hinge structure of the electronic device according to the present invention, a heat radiation hinge member is provided at a connection point of a pair of housings that can be opened and closed with each other, and the heat radiation hinge member is provided with the two housings. A heat dissipating hinge structure for an electronic device in which a heat pipe is connected so as to be rigidly movable on an opening / closing axis and heat of a heat generating component provided in one housing is dissipated to the other housing via the heat pipe and a heat dissipating hinge member. In the above, a hinge mechanism for guiding the opening and closing of the two housings is provided independently of the heat pipe, and the hinge mechanism is moved relative to the heat dissipating hinge member with the opening / closing axis aligned with the rotation center of the heat pipe. It is positioned and fixed.

In another aspect of the heat radiation hinge structure of the electronic device according to the present invention, a heat radiation hinge member is provided at a connection point of a pair of housings that can be opened and closed with each other. A heat dissipating hinge structure for an electronic device in which a heat pipe is rotatably connected on an opening / closing axis and heat of a heat generating component provided in one housing is dissipated to the other housing via the heat pipe and a heat dissipating hinge member. In the above, the heat dissipating hinge member and the hinge member are connected,
This is a hinge mechanism for guiding the opening and closing of both housings.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the heat dissipating hinge structure of the present invention provided in a notebook computer will be described below with reference to the drawings. As shown in the perspective view of the assembled state of FIG. 1 and the exploded perspective view of FIG. 2, in the personal computer of this embodiment, the CPU-side housing 1 and the display-side housing 2 have a pair of left and right hinge mechanisms 3 (the left side in the figure). Only the hinge mechanism is shown).
On the CPU side housing 1, a keyboard (not shown)
Liquid crystal displays are provided on the display side housing 2, respectively. The two housings 1 and 2 are opened and closed about the opening / closing axis L of the hinge mechanism 3, and the storage position when the keyboard and the liquid crystal display are individually enclosed and closed, and the use when the keyboard and the liquid crystal display are exposed and opened. Switching between positions can be performed.

The CPU-side housing 1 and the display-side housing 2 are formed by bending an aluminum plate, and are each formed of a thin box-shaped body having an opening on a surface on which a keyboard and a liquid crystal display are provided. . Double hinge mechanism 3
Have the same configuration that is symmetrical left and right, and are each composed of a fixed hinge 4 and a movable hinge 5.

Hereinafter, the left hinge mechanism 3 will be described as an example. The fixed hinge 4 is formed by bending a stainless steel plate into an L shape, and one side surface of the fixed hinge is fixed to the bottom surface in the CPU side housing 1 by screws 6a and nuts 6b. A support shaft 4a is fixed to the other side of the fixed hinge along the opening / closing axis L of the housings 1 and 2. The movable hinge 5 is made of a stainless steel plate, and its proximal end is fixed to the bottom surface in the display side housing 2 by screws 6a and nuts 6b, and its distal end is curved to form a cylindrical bearing 5a.
Has made. The support shaft 4a of the fixed hinge 4 is inserted into the bearing portion 5a of each movable hinge 5, and the CPU side housing 1 and the display side housing 2 are connected to the support shaft 4a (that is, the opening / closing axis L) as described above. Opens and closes.

Incidentally, the housings 1 and 2 may be manufactured by molding such as plastic or magnesium alloy. In this case, the nut 6b may be formed integrally with the housings 1 and 2. Further, the fixed hinge 4 and the movable hinge 5 may be elastic members, and may be made of, for example, phosphor bronze. PC is
The CPU side housing 1 is placed on a desk, and the display side housing 2 is used in a state where it is opened upward. Due to the elasticity of the bearing portion 5a, the bearing portion and the support shaft 4a therein are used.
The display side housing 2 can be fixed at an arbitrary angle because it is considered that an appropriate sliding resistance is generated between them.

As shown in the enlarged cross-sectional views of FIGS. 2 and 3, a heat dissipating hinge member 7 made of aluminum die-casting is disposed at the left position of the left hinge mechanism 3, and extends below the heat dissipating hinge member. The mounting surface 7a is fixed to the bottom surface in the CPU side housing 1 by screws 6a and nuts 6b. A positioning hole 8 is provided in the heat-dissipating hinge member 7 on the same axis as the support shaft 4a of the fixed hinge 4, and a holding hole 9 is provided below the positioning hole 8 in parallel therewith. The tip of the support shaft 4a of the fixed hinge 4 is rotatably fitted into the positioning hole 8 from the right side. Except for the fitted portion, the positioning hole 8 is opened upward and the heat pipe receiving groove 10 is opened. Is formed. On both sides of the heat pipe receiving groove 10, an extended guide portion 11 having an arc-shaped cross section is integrally formed, and a locking groove 12 is formed below the both extended guide portions 11. Note that the heat radiation hinge member 7
May be made of a material having good thermal conductivity such as an extruded aluminum material or copper.

On the other hand, a printed circuit board 1 on which electronic components for performing arithmetic processing are mounted in the CPU side housing 1.
5 is stored. In the embodiment shown in the drawing, heat dissipation measures are taken for the CPU 16 as a heat-generating component on the printed circuit board 15. A quadrangular heat transfer plate 17 of substantially the same size is disposed on the CPU 16 in close contact, and one side of the heat transfer plate 17 is formed into a cylindrical shape,
The evaporation-side end 18a of the first heat pipe 18 is fixed to the tubular portion by caulking. 1st heat pipe 18
Is bent at a right angle along the side wall of the CPU side housing 1, and the condensing side end 18 b at the other end is press-fitted and fixed in the holding hole 9 of the heat radiation hinge member 7, and Caulking is applied from the side to prevent detachment.

In the heat pipe receiving groove 10 of the heat radiating hinge member 7, the evaporation side end 19a of the second heat pipe 19 is provided.
And a heat pipe fixing bracket 20 bent from an elastic material such as a stainless steel plate or phosphor bronze is fitted from above. Hook portions 20a are formed at the lower end portions of both side surfaces of the heat pipe fixing member 20, and the heat pipe fixing member 20 locks the hanging portion 20a in the engaging groove 12 of the heat radiation hinge member 7 by its own elasticity. Thereby, it is fixed to the heat radiation hinge member 7. A pressing portion 20b that curves downward is formed on the upper surface of the heat pipe fixing bracket 20, and the pressing portion 20b elastically presses the evaporating end 19a of the second heat pipe 19 from above, and the heat pipe receiving groove 10b. The second heat pipe is rotatably held therein.

In this embodiment, the second heat pipe 19 functions as a heat pipe, and the heat pipe fixing bracket 20 functions as a heat pipe fixing member. The second heat pipe 19 is bent at a right angle, and the condensing-side end 19b is arranged along the side wall of the display-side housing 2, and the housing is formed by a fixed plate 21 bent substantially in an L shape by an aluminum plate. It is fixed to 2.

The space between the second heat pipe 19 and the heat pipe receiving groove 10 or the heat pipe fixing bracket 20 is designed to reduce external force and abrasion acting on the second heat pipe 19 when the housings 1 and 2 are opened and closed. Sliding resistance is reduced as much as possible by filling with thermal conductive grease. The heat conductive grease also has the advantage of eliminating the intervening air layer and improving the efficiency of heat transfer from the heat radiating hinge member 7 to the second heat pipe 19.

The first heat pipe 18 and the second heat pipe 19 perform heat transfer by utilizing the latent heat of vaporization of the working fluid enclosed therein. The operation principle will be briefly described. The heat pipes 18 and 19 are made of a metal material having good thermal conductivity such as copper and aluminum, and both ends thereof are closed to have a closed space therein. Heat pipe 1
Nickel plating is applied to the surfaces of the pipes 8 and 19, and a wick structure such as a groove is lined inside, and a hydraulic fluid suitable for the material of the heat pipes 18 and 19, for example, water, acetone, chlorofluorocarbon or the like is used. Is sealed in a predetermined amount, and is previously reduced to a predetermined pressure.

During the operation of the personal computer constructed as described above, the CPU 16 has a heat radiation effect as described below. When the CPU 16 generates heat with the operation of the personal computer, the heat is concentrated on the evaporation side end 18a of the first heat pipe 18 via the heat transfer plate 17 to evaporate the internal working fluid. By the evaporation at this time, the evaporation side end portion 18 is formed.
The internal pressure of a rises, and the generated steam flows to the lower-pressure condensing side end 18b, where it is cooled and condensed in the condensing side end 18b. This condensate flows back to the evaporating side end 18a through the wick structure due to the capillary phenomenon, and is returned to the CPU 16 again.
Evaporates with heat from

By repeating this cycle,
The latent heat of evaporation is transmitted from the CPU 16 side to the heat radiating hinge member 7 via the first heat pipe 18,
Is dissipated to the CPU side housing 1. Further, a part of the heat transmitted to the heat radiating hinge member 7 is transmitted to the display side housing 2 through a similar heat transmission cycle repeated in the second heat pipe 19. Since the display-side housing 2 has a relatively low temperature without storing electronic components therein, heat is radiated more efficiently than the CPU-side housing 1.

Here, as described above, the second heat pipe 1
Since the evaporating side end 19a of 9 is pressed by the pressing portion 20b of the heat pipe fixing bracket 20, it is always in close contact with the inner wall of the heat pipe receiving groove 10 of the heat radiation hinge member 7, and a sufficient contact area is secured. . Therefore, heat is reliably transmitted from the heat radiating hinge member 7 to the second heat pipe 19, and a large heat radiating effect can be obtained also in the display-side housing 2.

On the other hand, as is clear from the above description, in this embodiment, the right hinge mechanism (not shown) is of course, and the left hinge mechanism 3 is also connected to the heat pipe 1.
It is configured to function as a hinge independently of 8, 19 independently. In other words,
As described in JP-A-187284, since the heat pipes 18 and 19 are not used for opening and closing guidance, no unreasonable external force acts on the heat pipes 18 and 19, and damage to the heat pipes 18 and 19 can be prevented. . This kind of notebook-type personal computer receives unexpected handling such as being lifted while holding the display-side housing 2, for example, but can sufficiently withstand such handling.

Next, the procedure for assembling the heat-dissipating hinge structure of the personal computer constructed as described above, in particular, the second heat pipe 19
The connection procedure between the evaporating side end 19a and the heat radiation hinge member 7 will be described. When connecting the second heat pipe 19 and the heat radiating hinge member 7, the heat radiating hinge member 7 and the fixed hinge 4 are fixed to the CPU side housing 1 in advance, and the movable hinge 5 is fixed to the support shaft 4 a of the fixed hinge 4. The bearing part 5a is fitted. The condensing side end 18b of the first heat pipe 18 from the CPU 16 side is press-fitted into the holding hole 9 of the heat radiation hinge member 7. On the other hand, the second heat pipe 1
9 is fixed to the display side housing 2 by a fixing plate 21.

In this state, the left and right movable hinges 5 are screwed into the proper positions of the display side housing 2 with screws 6 a and nuts 6.
When fixed by b, the evaporating side end 19a of the second heat pipe 19 is naturally disposed from above in the heat pipe receiving groove 10 of the heat radiation hinge member 7. Next, when the heat pipe fixing member 20 is fitted into the heat dissipating hinge member 7 from above, the engaging portions 20a on both sides are guided by the extended guide portion 11 of the heat dissipating hinge member 7 as shown in FIG. After being temporarily separated while flexing the flexure 20, it is latched in the latching groove 12 of the heat radiation hinge member 7 as shown in FIG. As a result, the heat pipe fixing bracket 20 is fitted to the heat radiating hinge member 7, and is pressed by the pressing portion 20b thereof so as to be in the second position.
The evaporating side end 19 a of the heat pipe 19 is held in the heat pipe receiving groove 10.

Although the assembling can be performed by a procedure other than the above, even in such a case, the connection between the second heat pipe 19 and the radiating hinge member 7 is made in the same manner as described above. Thus, at the time of assembling, the second heat pipe 19 and the heat radiating hinge member 7 are provided.
In order to connect the heat pipes, it is only necessary to arrange the evaporation side end 19a of the second heat pipe 19 in the heat pipe receiving groove 10 and fit the heat pipe fixing bracket 20 from above. Therefore, assembling work is very easy and the personal computer assembling work can be simplified as compared with the conventional example described in the publication where the heat pipes 18 and 19 need to be inserted along the opening / closing axis L.

On the other hand, when the two housings 1 and 2 are opened and closed, the evaporation side end 19a of the second heat pipe 19 rotates in the heat pipe receiving groove 10 to absorb the change in the angle between the second heat pipe 19 and the heat radiation hinge member 7. are doing. Therefore, the evaporation side end 19a of the second heat pipe 19 needs to be located on the same axis (that is, on the opening / closing axis L) with respect to the support shaft 4a of the fixed hinge 4a which is the opening / closing center. If the center between the portion 19a and the support shaft 4a is displaced, the second heat pipe 19 bends each time it is opened and closed, possibly causing breakage. In this embodiment, the support shaft 4 a of the fixed hinge 4 is connected to the positioning hole 8 of the heat radiation hinge member 7.
, The evaporating side end 19a of the second heat pipe 19 can be easily and surely made to coincide with the support shaft 4a, thereby avoiding the above-described troubles such as breakage of the heat pipe 19 and the like. Also, it greatly contributes to simplifying the assembly work.

The embodiments of the present invention are not limited to the embodiments described above. For example, as shown in FIG.
The fixed hinge 4 fixed to the side housing 1 may be omitted, and only the support shaft 4a may be omitted, and the support shaft 4a may be press-fitted and fixed to the positioning hole 8 of the heat radiation hinge member 7. In this case, the function of the fixed hinge 4 is also performed by the heat dissipating hinge member 7, and the bearing 5 a of the movable hinge 5 rotates while sliding around the support shaft 4 a to guide the opening and closing of the housings 1 and 2. I do.
Since the number of parts is reduced by omitting the fixed hinge 4 and the effective space in the housings 1 and 2 can be enlarged by reducing the size of the hinge mechanism 3 in addition to the functions and effects described in the above embodiment. In addition, it is possible to obtain the effect of reducing the manufacturing cost and the effect of increasing the degree of freedom of the installation layout of the substrate and the like.

In the above-described embodiment, the heat of the CPU 16 stored in the CPU-side housing 1 is transmitted to the display-side housing 2 via the first heat pipe 18, the heat radiation hinge member 7, and the second heat pipe 19. The layout of each of these members can be changed to various modes. For example, similarly to the prior art described in the publication, the heat radiation hinge member 7 is fixed to the display side housing 2, and the condensation side end 18 b of the first heat pipe 18 from the CPU 16 side is connected to the heat radiation hinge member 7, The two heat pipes 19 may be omitted. Even with this configuration, the heat radiation hinge member 7
If the pipe receiving groove 10 is made coincident with the opening / closing axis L, the housings 1 and 2 can be opened and closed without any trouble.
The heat of U16 can be radiated to the display-side housing 2 via the first heat pipe 18 and the radiating hinge member 7. In addition, the heat-generating components such as the CPU 16 have an opening / closing axis.
In the case of the position close to L, the first heat pipe 18 may be omitted and the CPU 16 may be simply connected to the heat radiating hinge member 7 via a member having good thermal conductivity such as copper. Even in this case, the heat of the CPU 16 is sufficiently transmitted to the heat-radiating hinge member 7 side, and can be radiated to the display-side housing 2 through the second heat pipe 19.

Furthermore, in the above-described embodiment, the CPU housing 1 and the display housing 2 are made of an aluminum plate having good heat dissipation and used for heat dissipation of the CPU 16. However, when the housings 1 and 2 are made of plastic, Cannot expect such a high heat radiation effect, and therefore uses an existing aluminum electromagnetic shield plate provided in the housings 1 and 2 for heat radiation. Specifically, in the above-described embodiment, the condensing-side end 19b of the second heat pipe 19 is connected to an electromagnetic shield plate in the display-side housing 2, or the first heat pipe 18 extends from the CPU 16 to the opposite side. And connected to an electromagnetic shield plate below the keyboard. In the latter case, the CPU 16
The working fluid evaporates at the center of the first heat pipe 18 connected to the pipe, and the working fluid condenses at both ends of the pipe, thereby exerting a heat radiation effect.

On the other hand, in the above-described embodiment, heat radiation measures are taken with respect to the CPU 16. However, any heat-generating component that requires heat radiation is not particularly limited to the CPU 16, and may be used for heat radiation of, for example, a transformer or a power supply unit. Is also good.

FIGS. 6 to 9 show another embodiment of the present invention in which the temperature of a specific portion of the housing is not excessively increased. FIG. 6 is a view showing a heat-radiating hinge structure of the present invention in which another heat pipe is provided on a heat-generating component. As shown in FIG. 6, the third heat pipe 3 is placed on the heat transfer plate 17 in a direction orthogonal to the first heat pipe 18.
0 is provided. A heat radiating member 31 is provided at the other end of the heat pipe 30, and heat transferred from the heat transfer plate by the heat pipe 30 is radiated to the housing via the heat radiating member 31. The heat transmitted to the heat transfer plate by the third heat pipe provided in this way is dispersed and moved to the first heat pipe and the third heat pipe, so that the heat moved by the first heat pipe 18 is The temperature of the heat radiating hinge 7 is reduced even if the heat radiating hinge 7 is moved to the display side by the second heat pipe and the mounting surface 7a extending below the heat radiating hinge 7 is directly in contact with and fixed to the CPU side housing. It doesn't get too high. In FIG. 6, the fixed hinge 4 fixed to the CPU side housing 1 is omitted, and only the support shaft 4 a is provided. The support shaft 4 a is press-fitted and fixed in the positioning hole 8 of the heat radiation hinge member 7. Therefore, the bearing portion 5a of the movable hinge 5 rotates around the support shaft 4a while sliding, and guides the opening and closing of the housings 1 and 2.

FIG. 7 is a view showing a heat dissipating hinge structure according to the present invention, in which the heat dissipating hinge member does not directly contact the housing. As shown in FIG. 7, the fixed hinge 4 made of stainless steel has one side face formed by a screw 6a and a nut 6b.
A support shaft 4a is fixed to the bottom surface in the PU side housing 1 and is fixed to the other side along the opening / closing axis L of the housings 1 and 2. Furthermore, the movable hinge 5 made of stainless steel is
The base end is fixed to the bottom surface in the display side housing 2 by screws 6a and nuts 6b, and the tip end is curved to form a cylindrical bearing portion 5a. The support shaft 4a of the fixed hinge 4 is inserted into the bearing portion 5a of each movable hinge 5, and the CPU-side housing 1 and the display-side housing 2 open and close about the support shaft 4a (that is, the opening / closing axis L).

The heat radiating hinge 7 is disposed so as not to come into direct contact with any of the housings (that is, the mounting surface extending below the heat radiating hinge attached to the CPU side housing shown in FIG. 1 is removed). Is). Therefore, as described above, the heat dissipation hinge is supported by the stainless steel fixed hinge having low heat conductivity,
The heat transferred to the radiating hinge by the first heat pipe is transferred to the display-side housing further by the second heat pipe, even if the heat is high temperature.
High-temperature heat is not transmitted directly to the CPU side housing.

FIG. 8 is a view showing another embodiment of the heat dissipating hinge structure of the present invention in which the heat dissipating hinge member does not directly contact the housing. As shown in FIG. 8, the movable hinge 5 made of stainless steel has its base end fixed to the bottom surface in the display-side housing 2 by screws 6a and nuts 6b.
The distal end is curved to form a cylindrical bearing portion 5a. The fixed hinge 4 fixed to the CPU-side housing 1 is omitted, and only the support shaft 4a is omitted. The support shaft 4a is press-fitted and fixed in the positioning hole 8 of the heat radiation hinge member 7. The support shaft 4a of the fixed hinge 4 is inserted into the bearing portion 5a of each movable hinge 5.

Further, similarly to the embodiment shown in FIG. 7, the heat dissipating hinge is provided so as not to directly contact any housing. Accordingly, the bearing portion 5a of the movable hinge 5 rotates around the support shaft 4a while slidingly contacting with the housing 1,
Guide the opening and closing of 2. Therefore, since the heat dissipating hinge is supported by the stainless steel fixed hinge having low thermal conductivity, even if the heat transferred to the heat dissipating hinge by the first heat pipe is high-temperature heat, The heat pipe is further moved to the display-side housing, and high-temperature heat is not directly transmitted to the CPU-side housing.

FIG. 9 is a view showing a heat dissipating hinge structure according to the present invention, in which another heat pipe is provided on the heat generating component, and the heat dissipating hinge member does not directly contact the housing. As shown in FIG. 9, this embodiment is a combination of the heat dissipating hinge and the fixed hinge of the embodiment shown in FIG. 8, and another heat pipe further provided on the heat generating component of the embodiment shown in FIG. . As described in the embodiment shown in FIG. 6, the third heat pipe 30 is provided on the heat transfer plate 17 in a direction orthogonal to the first heat pipe 18.
A heat radiating member 31 is provided at the other end of the heat pipe 30, and heat transferred from the heat transfer plate by the heat pipe 30 is radiated to the housing via the heat radiating member 31.

The heat dissipating hinge member is disposed so as not to come into direct contact with any housing. Therefore, since the heat dissipating hinge portion is supported by the stainless steel fixed hinge having low thermal conductivity, the heat dissipated by the third heat pipe and transferred to the heat dissipating hinge by the first heat pipe is even higher. Even if the heat is at a temperature, the heat is further transferred to the display-side housing by the second heat pipe, and the high-temperature heat is not transmitted directly to the CPU-side housing.

Next, FIG. 10 and FIG. 11 show that the temperature of a specific portion of the housing provided with a heat-dissipating hinge body connected to a heat-transfer plate connected to the heat-generating component or integrally formed with the heat-transfer plate is reduced. Fig. 4 shows another aspect of the present invention without excessively high; FIG. 10 is a view showing a heat-dissipating hinge structure of the present invention including a heat-dissipating hinge body integrally formed with a heat-transfer plate material connected to a heat-generating component. As shown in FIG. 10, the heat dissipation hinge structure includes a heat dissipation hinge member and a hinge portion, and the heat dissipation hinge member includes a heat dissipation hinge body and a holding portion. As shown in the figure, the heat dissipating hinge main body has a lower portion 7 extending in the direction of the heat generating component 16 and is integrally formed with a heat transfer plate connected to the heat generating component 16. Through the hinge portion 5 made of a member having low thermal conductivity,
The heat dissipating hinge member is fixed to the display side housing. At this time, the heat radiating hinge 7 is disposed so as not to directly contact any of the housings.

The holding portion presses a part of the heat pipe received in the heat pipe receiving groove for rotatably receiving a part of the heat pipe 19 and a part of the heat pipe received in the heat pipe receiving groove.
And a heat pipe fixing member 20 made of an elastic member. The evaporating side end 19a of the heat pipe 19 is disposed in the heat pipe receiving groove 10 of the heat radiation hinge member 7 from above. Next, when the heat pipe fixing member 20 is fitted from above, the engaging portions 20a on both sides are guided by the extended guide portion 11 of the heat radiation hinge portion 7 as shown in FIG. After being once separated, it is latched in the latching groove 12 of the heat radiation hinge member 7 as shown in FIG. As a result, the heat pipe fixing bracket 20 is fitted on the heat radiating hinge member 7, and is pressed by the pressing portion 20 b so that the evaporation-side end 19 a of the heat pipe 19 is held in the heat pipe receiving groove 10.

The fixed hinge 4 fixed to the CPU housing 1 is omitted, and only the support shaft 4a is provided. The support shaft 4a is press-fitted and fixed to a positioning hole (not shown) of the heat radiation hinge member 7. Therefore, the bearing portion 5a of the movable hinge 5 rotates around the support shaft 4a while sliding, and guides the opening and closing of the housings 1 and 2. Another heat pipe 30 is used for the heat transfer plate.
Is provided. At the other end of the heat pipe 30, a heat radiating member 31 is provided.
Is transferred to the housing via the heat radiating member 31.

The heat dissipating hinge member is disposed so as not to directly contact any of the housings. Therefore, since the heat dissipating hinge member is supported by the fixed hinge having low thermal conductivity made of stainless steel, the heat dissipated by another heat pipe, and the heat transferred to the heat dissipating hinge member by the heat transfer plate member that is a part thereof is Even if the heat is at a high temperature, it is further moved to the display-side housing by the heat pipe, and the high-temperature heat is not directly transmitted to the CPU-side housing.

FIG. 11 is a view showing a heat-dissipating hinge structure of the present invention including a heat-dissipating hinge main body having a connection portion 7a connected to the heat transfer plate 41. As shown in FIG. 11, the heat dissipation hinge structure includes a heat dissipation hinge member and a hinge part, and the heat dissipation hinge member includes a heat dissipation hinge body and a holding part. As shown in the figure, the heat-dissipating hinge main body is provided with a connecting portion 7a at a lower portion 7 thereof, and is connected to a heat-transfer plate 41 connected to the heat-generating component 16. The heat dissipating hinge member is fixed to the display-side housing via the hinge portion 5 made of a member having low thermal conductivity. At this time, the heat radiation hinge member 7 is disposed so as not to directly contact any housing.

The holding portion presses a part of the heat pipe received in the heat pipe receiving groove for rotatably receiving a part of the heat pipe 19 and a part of the heat pipe received in the heat pipe receiving groove.
And a heat pipe fixing member 20 made of an elastic member. The evaporating side end 19a of the heat pipe 19 is disposed in the heat pipe receiving groove 10 of the heat radiation hinge member 7 from above. Next, when the heat pipe fixing member 20 is fitted from above, the engaging portions 20a on both sides are guided by the extended guide portion 11 of the heat radiation hinge member 7 as shown in FIG. Once separated,
As shown in FIG. 3, it is hooked on the hook groove 12 of the heat radiation hinge member 7. As a result, the heat pipe fixing bracket 20 is fitted on the heat radiating hinge member 7, and is pressed by the pressing portion 20 b so that the evaporation-side end 19 a of the heat pipe 19 is held in the heat pipe receiving groove 10.

The fixed hinge 4 fixed to the CPU side housing 1 is omitted, and only the support shaft 4a is provided. The support shaft 4a is press-fitted and fixed to a positioning hole (not shown) of the heat radiation hinge member 7. Therefore, the bearing portion 5a of the movable hinge 5 rotates around the support shaft 4a while sliding, and guides the opening and closing of the housings 1 and 2. The heat transfer plate 41 is provided with another heat pipe 30. At the other end of the heat pipe 30,
The heat dissipating member 31 is provided, and heat transferred from the heat transfer plate member by the heat pipe 30 is dissipated to the housing via the heat dissipating member 31.

The heat dissipating hinge member is disposed so as not to directly contact any of the housings. Therefore, since the heat dissipating hinge portion is supported by a stainless steel fixed hinge having low thermal conductivity, the heat dissipated by another heat pipe and transferred to the heat dissipating hinge portion by the heat transfer plate member 41 has a high temperature. Even if the heat is, it is further moved to the display side housing by the heat pipe,
High-temperature heat is not transmitted directly to the CPU side housing. In the embodiment shown in FIGS. 10 and 11, although another heat pipe is provided to disperse heat in another direction,
It is not necessary to provide another heat pipe.

[0067]

As described above, according to the heat dissipating hinge structure of the electronic device of the present invention, it is possible to prevent the temperature of a specific portion of the pair of housings from becoming excessively high, and to prevent the display side housing and the CPU side housing from being heated. The design range of the material can be widened.

Further, according to the heat dissipating hinge structure of the electronic device of the present invention, the heat pipe and the heat dissipating hinge member can be easily connected only by disposing the heat pipe in the pipe receiving groove and fitting the pipe fixing member. Thus, the assembling work of the electronic device can be greatly simplified.

Further, according to the heat radiation hinge structure of the electronic device of the present invention, since the heat pipe is elastically pressed by the pressing portion of the pipe fixing member, a sufficient contact area is provided between the heat radiation hinge member and the heat pipe. Is ensured, heat transfer is ensured, and a large heat dissipation effect can be obtained.

Further, according to the heat dissipating hinge structure of the electronic device of the present invention, the opening and closing of the housing is guided by the hinge mechanism irrespective of the heat pipe. Troubles can be prevented beforehand, and since the center of rotation of the pipe naturally coincides with the opening / closing axis of the hinge mechanism during assembly, the heat pipe can be more reliably prevented from being damaged, and the assembly work can be prevented. Simplification can be achieved.

Further, according to the heat dissipating hinge structure of the electronic device of the present invention, the opening and closing of the housing is guided by the hinge mechanism irrespective of the heat pipe. Troubles can be prevented beforehand, and the number of parts can be reduced because the heat-dissipating hinge member is used as one of the hinge mechanisms.

[Brief description of the drawings]

FIG. 1 is a partial perspective view showing an assembled state of one embodiment of a heat dissipation hinge structure of an electronic device of the present invention.

FIG. 2 is a partial perspective view showing an exploded state of the heat radiation hinge structure of the present invention.

FIG. 3 is an enlarged sectional view showing details of a heat-dissipating hinge member of the present invention.

FIG. 4 is an enlarged cross-sectional view when fitting the pipe fixing fitting of the present invention.

FIG. 5 is a partial perspective view showing an assembled state of another embodiment of the heat-dissipating hinge structure of the present invention in which the fixed hinge is omitted.

FIG. 6 is a view showing a heat-radiating hinge structure of the present invention in which another heat pipe is provided on a heat-generating component.

FIG. 7 is a view showing a heat-dissipating hinge structure of the present invention in a mode in which the heat-dissipating hinge member does not directly contact the housing.

FIG. 8 is a diagram showing another embodiment of the heat dissipating hinge structure of the present invention, in which the heat dissipating hinge member does not directly contact the housing.

FIG. 9 is a view showing a heat dissipating hinge structure according to the present invention, in which another heat pipe is provided on a heat generating component, and the heat dissipating hinge member does not directly contact the housing.

FIG. 10 is a diagram showing a heat-dissipating hinge structure of the present invention including a heat-dissipating hinge body integrally formed with a heat-transfer plate connected to a heat-generating component.

FIG. 11 is a view showing a heat-dissipating hinge structure of the present invention including a heat-dissipating hinge main body having a connection portion connected to a heat transfer plate for transmitting heat of a heat-generating component.

FIG. 12 illustrates a prior art hinge structure.

[Sharp sign]

 1. 1. CPU side housing Display side housing 3. Hinge mechanism 4. Fixed hinge 5. Movable hinge 7. 7. Heat radiation hinge member Positioning hole 9. Holding hole 10. Heat pipe receiving groove 11. Extended guide section 12. Hook part 16. CPU (heating component) 17. Heat transfer plate 18. Heat pipe 19. Heat pipe 20. Heat pipe fixing member 20b. Pressing part 30. Heat pipe 31. Heat dissipating member 41. Heat transfer plate material L. Opening / closing axis

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Isao Tsukada, Inventor 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Inside Furukawa Electric Co., Ltd. (72) Inventor Junji Soya 2-6-1, Marunouchi, Chiyoda-ku, Tokyo No. 1 F-term in Furukawa Electric Co., Ltd. (reference) 4E360 BB13 GA24 GA53 GB46 GC02 GC20

Claims (7)

[Claims] 1. A heat radiation hinge structure for an electronic device, comprising: (1) A heat-dissipating hinge member formed of a heat-conductive member disposed at a connection portion of a pair of housings that can be opened and closed with each other, and the heat-dissipating hinge member receives heat from a heat-generating component disposed on one housing. A heat dissipating hinge body; and a holding portion rotatably holding at least a part of the heat pipe provided in the other housing by an elastic member. (2) The heat dissipating hinge member is provided at least in the pair of housings. A hinge portion made of a member having low thermal conductivity for fixing to one housing. 2. The heat-dissipating hinge body further includes a connecting portion for connecting to a heat-transfer plate for transmitting heat of the heat-generating component, and the holding portion includes a part of the heat pipe. A heat pipe fixing member made of an elastic member, which presses a part of the heat pipe received in the heat pipe receiving groove rotatably accommodated and the heat pipe receiving groove, A heat dissipation hinge structure for the electronic device according to claim 1. 3. The heat-dissipating hinge body is formed integrally with a heat-transfer plate for transmitting heat of the heat-generating component, and the holding unit is capable of rotating a part of the heat pipe. The heat pipe receiving groove, comprising: a heat pipe receiving groove to be housed; and a heat pipe fixing member made of an elastic member for pressing a part of the heat pipe housed in the heat pipe receiving groove. A heat-dissipating hinge structure for the electronic device according to claim 1. 4. The hinge portion is provided on a housing on which the heat-generating component is not disposed, and the heat-dissipating hinge member does not contact the housing on which the heat-generating component is disposed. The heat dissipation hinge structure of an electronic device according to claim 2, wherein the hinge is fixed to the housing by the hinge portion. 5. The hinge portion is provided on each of the pair of housings, and the heat-dissipating hinge member does not contact the housing in which the heat-generating component is disposed, and the hinge portion does not contact the housing. The heat dissipating hinge structure of an electronic device according to claim 2, wherein the hinge is fixed to each of the pair of housings. 6. The heat-transfer plate member, wherein the heat-dissipating hinge member is fixed by the hinge portion without contacting a housing in which the heat-generating component is arranged, and is connected to the connection portion of the heat-dissipating hinge body. The heat dissipating hinge structure of an electronic device according to claim 2, further comprising another heat pipe for moving heat of the heat generating component to another predetermined position. 7. The heat-dissipating hinge member is fixed by the hinge portion without contacting a housing in which the heat-generating component is arranged, and the heat-transfer plate of the heat-dissipating hinge body has the heat-generating member. The heat dissipating hinge structure for an electronic device according to claim 3, further comprising another heat pipe that transfers heat of the component to another predetermined position.