JP2000292927A5 - - Google Patents

Download PDF

Info

Publication number
JP2000292927A5
JP2000292927A5 JP1999103712A JP10371299A JP2000292927A5 JP 2000292927 A5 JP2000292927 A5 JP 2000292927A5 JP 1999103712 A JP1999103712 A JP 1999103712A JP 10371299 A JP10371299 A JP 10371299A JP 2000292927 A5 JP2000292927 A5 JP 2000292927A5
Authority
JP
Japan
Prior art keywords
pattern
binder resin
average molecular
molecular weight
formation method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999103712A
Other languages
Japanese (ja)
Other versions
JP3903638B2 (en
JP2000292927A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP10371299A priority Critical patent/JP3903638B2/en
Priority claimed from JP10371299A external-priority patent/JP3903638B2/en
Publication of JP2000292927A publication Critical patent/JP2000292927A/en
Publication of JP2000292927A5 publication Critical patent/JP2000292927A5/ja
Application granted granted Critical
Publication of JP3903638B2 publication Critical patent/JP3903638B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の名称】パタン形成方法 [Title of the Invention] Pattern formation method

【0001】
【発明の属する技術分野】
本発明は半導体装置等の微細加工に用いられるパタン形成方法に係り、特にX線、電子線等の電離放射線のパタン露光によりパタン潜像形成部に酸を生成せしめ、この酸を触媒とする反応によって、照射部と未照射部のアルカリ水溶液に対する溶解性を変化させ、アルカリ水溶液を現像液とする現像工程によりパタンを現出させるパタン形成方法に関する。
[0001]
Field of the Invention
The present invention relates to a pattern forming method used for fine processing of a semiconductor device or the like, and in particular, an acid is generated in a pattern latent image forming portion by pattern exposure of ionizing radiation such as X-ray and electron beam, and this acid is used as a catalyst. by changing the solubility in an alkali aqueous solution of the irradiated portion and the unirradiated portion, about Rupa Tan forming method to appear a pattern by development step of the alkali aqueous solution and the developing solution.

【0006】
本発明の目的は、高感度で高解像度のレジストパタンを形成できるパタン形成方法を提供することにある。
[0006]
An object of the present invention is to provide a Rupa Tan forming method capable of forming a resist pattern of high resolution with high sensitivity.

【0052】
【発明の効果】
本発明によれば、紫外線、遠紫外線、電子線、X線、その他の活性放射線に対して高感度で高解像度に優れたレジストパタンを形成できる。
[0052]
【Effect of the invention】
According to the present invention, ultraviolet rays, far ultraviolet rays, electron beams, X-rays, Ru can form a resist pattern with excellent high resolution with high sensitivity to other actinic radiation.

Claims (7)

(a)カルボキシル基および/またはフェノール性水酸基を含有するバインダ樹脂を、1分子中に少なくとも2個以上のビニルエーテル基を含有する化合物と酸触媒付加反応させて得られる樹脂と、(b)放射線照射により酸を生じる化合物とを含むレジスト液を基板に塗布し、塗膜を形成する工程と、
放射線を用いて前記塗膜に所定のパタン潜像を形成する工程と、
アルカリ水溶液を現像液としてパタンを現出させる現像工程とを有することを特徴とするパタン形成方法。
(A) A resin obtained by acid-catalyzed addition reaction of a binder resin containing a carboxyl group and / or a phenolic hydroxyl group with a compound containing at least two vinyl ether groups in one molecule, and (b) radiation irradiation Applying a resist solution containing a compound capable of generating an acid by
Forming a predetermined pattern latent image on the coating film using radiation;
And a developing step of developing a pattern using an alkaline aqueous solution as a developing solution.
請求項1に記載のパタン形成方法において、上記成分(a)のバインダ樹脂の重量平均分子量(Mw)と数平均分子量(Mn)との比(Mw/Mn)が、1.0〜2.0の範囲にあることを特徴とするパタン形成方法In the pattern formation method according to claim 1, a ratio (Mw / Mn) of weight average molecular weight (Mw) to number average molecular weight (Mn) of the binder resin as the component (a) is 1.0 to 2.0. A pattern formation method characterized by being in the range of 請求項1または2に記載のパタン形成方法において、上記成分(a)のバインダ樹脂が、ベンゼン環を3つ以上、水酸基を3つ以上有し、かつ1つのベンゼン環に有する水酸基が2つ以下であるポリヒドロキシ化合物であることを特徴とするパタン形成方法The pattern forming method according to claim 1 or 2, wherein the binder resin of the component (a) has three or more benzene rings, three or more hydroxyl groups, and two or less hydroxyl groups in one benzene ring. It is a polyhydroxy compound which is the pattern formation method characterized by the above . 請求項1に記載のパタン形成方法において、上記成分(a)のビニルエーテル基を有する化合物が、少なくとも2個の水酸基を有する化合物の水酸基部分にビニルエーテル基が直接または連結基を介して結合している構造を有することを特徴とするパタン形成方法The method for forming a pattern according to claim 1, wherein the vinyl ether group-containing compound of component (a) has a vinyl ether group bonded directly or via a linking group to a hydroxyl group of a compound having at least two hydroxyl groups. A pattern formation method characterized by having a structure. アルカリ可溶性バインダ樹脂に含まれるカルボキシル基またはフェノール性水酸基と、ビニルエーテルとの付加により生じる架橋構造の樹脂を含む化学増幅系レジスト液を準備する工程と、Preparing a chemically amplified resist solution containing a resin of a crosslinked structure generated by addition of a carboxyl group or a phenolic hydroxyl group contained in an alkali-soluble binder resin and a vinyl ether;
前記レジスト液を基板上に塗布する工程と、その後、Applying the resist solution onto the substrate; and
前記基板に放射線を照射、アルカリ水溶液で現像することにより所望のレジストパタンを得ることを特徴とするパタン形成方法。A pattern formation method characterized in that a desired resist pattern is obtained by irradiating the substrate with radiation and developing it with an alkaline aqueous solution.
請求項5記載のパタン形成方法において、前記アルカリ可溶性バインダ樹脂は、重量平均分子量(Mw)が2000〜20000の範囲であることを特徴とするパタン形成方法。The pattern forming method according to claim 5, wherein the alkali-soluble binder resin has a weight average molecular weight (Mw) in the range of 2000 to 20,000. 請求項6記載のパタン形成方法において、前記アルカリ可溶性バインダ樹脂は、前記重量平均分子量に対する数平均分子量(Mn)の比(Mw/Mn)が1.0〜2.0の範囲であることを特徴とするパタン形成方法。The pattern forming method according to claim 6, wherein the alkali-soluble binder resin has a ratio (Mw / Mn) of a number average molecular weight (Mn) to the weight average molecular weight in a range of 1.0 to 2.0. How to form a pattern.
JP10371299A 1999-04-12 1999-04-12 Pattern formation method Expired - Fee Related JP3903638B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10371299A JP3903638B2 (en) 1999-04-12 1999-04-12 Pattern formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10371299A JP3903638B2 (en) 1999-04-12 1999-04-12 Pattern formation method

Publications (3)

Publication Number Publication Date
JP2000292927A JP2000292927A (en) 2000-10-20
JP2000292927A5 true JP2000292927A5 (en) 2004-10-07
JP3903638B2 JP3903638B2 (en) 2007-04-11

Family

ID=14361340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10371299A Expired - Fee Related JP3903638B2 (en) 1999-04-12 1999-04-12 Pattern formation method

Country Status (1)

Country Link
JP (1) JP3903638B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4554122B2 (en) * 2001-08-06 2010-09-29 東京応化工業株式会社 Resist composition for chemically amplified positive type liquid crystal device
US20070172755A1 (en) * 2003-11-21 2007-07-26 Masanori Nakamura Positive photoresist and method for producing structure
JP2005173369A (en) 2003-12-12 2005-06-30 Tokyo Ohka Kogyo Co Ltd Method for removing resist pattern
JP4893270B2 (en) 2006-11-29 2012-03-07 住友化学株式会社 Chemically amplified positive resist composition
WO2009093419A1 (en) * 2008-01-21 2009-07-30 Daicel Chemical Industries, Ltd. Resin for chemically amplified photoresist and method for producing the same
JP2015052694A (en) * 2013-09-06 2015-03-19 Jsr株式会社 Photosensitive resin composition, polymer, resin film and production method of the same, and electronic component

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06230574A (en) * 1993-02-05 1994-08-19 Fuji Photo Film Co Ltd Positive type photosensitive composition
JP3373056B2 (en) * 1994-08-17 2003-02-04 富士写真フイルム株式会社 Positive photosensitive composition
JP3360267B2 (en) * 1996-04-24 2002-12-24 信越化学工業株式会社 Chemically amplified positive resist material and pattern forming method
JP3656237B2 (en) * 1996-07-17 2005-06-08 Jsr株式会社 Radiation sensitive resin composition
JP3570477B2 (en) * 1997-01-24 2004-09-29 信越化学工業株式会社 High molecular compound and chemically amplified positive resist material
JPH10268508A (en) * 1997-01-27 1998-10-09 Shin Etsu Chem Co Ltd Partially hydrogenated polymer compound and chemically sensitized positive resist material
JPH10298236A (en) * 1997-02-28 1998-11-10 Shin Etsu Chem Co Ltd Novel polymeric compound, chemically amplified positive resist material and method for forming pattern
JPH1172928A (en) * 1997-06-26 1999-03-16 Shin Etsu Chem Co Ltd Pattern forming method
JP3818337B2 (en) * 1997-09-01 2006-09-06 信越化学工業株式会社 Chemically amplified positive resist material
US6284427B1 (en) * 1997-09-22 2001-09-04 Clariant Finance (Bvi) Limited Process for preparing resists

Similar Documents

Publication Publication Date Title
US7005227B2 (en) One component EUV photoresist
JP2004004557A5 (en)
US7989155B2 (en) Lithographic method
JP2000292927A5 (en)
JPH03152543A (en) Negative contrast photoresist developable by base
Tsubaki et al. Novel EUV resist materials design for 14nm half pitch and below
EP1295177B1 (en) Strongly water-soluble photoacid generator resist compositions
JP2002311588A (en) Pattern forming material and pattern forming method
JPH1172916A (en) Micropattern and method for forming the same
US7897324B2 (en) Lithographic method
JPH09134015A (en) Pattern forming material, pattern forming method and production of semiconductor device
JPH03253858A (en) Material and method for forming pattern
JPS592041A (en) Formation of pattern
JPH02108053A (en) Pattern forming material and pattern forming method
JPH08234434A (en) Chemical amplification type negative resist
JP2001305736A (en) Pattern forming material and pattern forming method
JPH05341529A (en) Negative pattern forming material and pattern forming method
JP2002311589A (en) Pattern forming material and pattern forming method
JP2003162062A (en) Pattern formation material and pattern formation method
JPH05136026A (en) Pattern forming method
JP2002090999A (en) Pattern forming material and pattern forming method
JPH07146557A (en) Pattern forming material
JP2004151184A (en) Chemical amplification type radiation sensitive resist composition and pattern forming method using the same
JPH04274244A (en) Negative type resist material
JPH05109697A (en) Formation of resist pattern