JP2000289183A - Cylinder for gravure printing and gravure printing plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To release a copper plating layer without damaging a substrate layer of a base or the like of a substrate copper plating layer or a cylinder by a simple method. SOLUTION: In the gravure printing plate 10A having a copper plating layer 16 formed by a Ballard process, grooves 11a cut out at a circumferential surface and a portion of a side face is formed at positions including corner edges of the surface and the side face of a base of a cylinder 11, and a block 41 is detachably engaged within the grooves 11a. When the layer 16 is released, the block 41 is erected to simply release the layer 16 without cutting the edge of the layer 16 and without damaging the layer 14 and the base of the cylinder 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gravure printing cylinder used for gravure printing, and a gravure printing plate in which a copper plating layer is formed on the gravure printing cylinder by a ballad plating method.

[0002]

2. Description of the Related Art FIG. 11 is an external perspective view showing an example of a conventional gravure printing plate in which a plating layer is formed on a cylinder, and FIGS. 12 (a) and 12 (b) show the gravure printing plate 10 of FIG. Side view and front view
It is. The cylinder 11 is formed in a hollow columnar shape, and has, on both side surfaces, support portions 12 for rotatably attaching to the device side. The cylinder 11 is formed from a metal material such as iron, steel or aluminum. FIG. 13 is a cross-sectional view showing a layer configuration such as a copper plating layer laminated on the cylinder 11 in detail. A nickel plating layer 13 is formed on the circumferential surface of the cylinder 11. The nickel plating layer 13 is for imparting corrosion resistance, and has a thickness of about 5 to 10 μm by electroplating.
Formed to the extent.

The underlying copper plating layer 14 on the nickel plating layer 13 adjusts the thickness of the entire layer, and is formed to a thickness of about 50 to 100 μm by electroplating. After the formation of the base copper plating layer 14, the surface is polished. Next, a release layer 15 is formed on the base copper plating layer 14. The peeling layer 15 is for facilitating interlayer separation between the upper layer and the lower layer, and is made of acelenic acid, silver, or the like. For example, a silver film is formed from a silver nitrate solution or a waste solution of a fixing solution by applying a metal substitution reaction. Then, a copper plating layer 16 having a thickness of about 100 to 200 μm is formed on the release layer 15.

As described above, the method of forming the underlayer plating layer 14 on the surface of the cylinder 11, polishing and finishing, forming the peeling layer 15, and forming the copper plating layer 16 thereon is ballad plating. This copper plating layer 1
6 is called a ballad copper plating layer. A predetermined image is formed on the copper plating layer 16 as a group of concave cells 16a by an electronic engraving method, that is, an engraving method using an engraving needle (diamond needle) or a laser beam by an electric signal.

After that, a chromium plating layer 17 having a thickness of about 5 μm is formed on the uppermost layer to impart a printing resistance to the surface. That is, the gravure printing plate 10 is rotated at a high speed, and the ink adhering to the surface is scraped off by a doctor, so that sufficient strength of the surface is required. Thus, the gravure printing plate 10 is formed.

After completion of the gravure printing, the copper plating layer 16 including the chromium plating layer 17 is peeled off in order to reuse the cylinder 11. FIG. 14 and FIG.
It is a figure which shows an example of the peeling method of. First, FIG.
As shown in FIG. 1, the copper plating layer 16 is torn by hitting the corner of the gravure printing plate 10 (a side corner on the circumferential surface) with a sharp tool 20 such as a flap or a chisel. As shown in (b), the copper plating layer 16 is lifted and the copper plating layer 16 is lifted.
And the base copper plating layer 14 are separated.

Subsequently, as shown in FIG. 15A, the end of the separated portion of the copper plating layer 16 is sandwiched between pliers or the like, and is pulled in the axial direction of the gravure printing plate 10 so that the copper plating layer 16 is drawn.
Is stripped. Next, the gravure printing plate 10 is rotated to pull the copper plating layer 16 in a direction perpendicular to the axial direction of the gravure printing plate 10 as shown in FIG. After that, the annular copper plating layer 16 remaining on the side surface of the gravure printing plate 10 is removed as shown in FIG. After that, the copper plating layer 16 and the cells 16a are formed again after the base copper plating layer 14 is adjusted by polishing or the like. Thereby, the cylinder 11 can be reused.

FIGS. 16A to 16D are cross-sectional views showing another example of a method of peeling the copper plating layer 16 in a conventional gravure printing plate. First, in the example (a) in the figure (Japanese Patent Publication No. 60-5777), a concave portion is provided at the center of the side surface of the cylinder 11, and a non-conductive member is filled in the concave portion to form the non-conductive portion 31 (see FIG. (Middle and shaded areas). Thus, the copper plating layer 16 is not formed on the non-conductive portion 31. After the gravure printing, a tool such as a chisel is inserted into the boundary between the copper plating layer 16 on the side surface and the non-conductive portion 31, and the copper plating layer 16 is peeled from this portion.

An example shown in FIG. 1B (Japanese Patent Publication No. 62-16 / 1987)
No. 189), a conductive tape 32 is attached to the side surface of the cylinder 11, a copper plating layer 16 is formed on the conductive tape 32, and after the gravure printing, the conductive tape 32 is peeled off to form a copper plating. Layer 16 can be peeled off. Furthermore, the example shown in FIG.
No. 88), a conductive (metal) tape 32 is attached to an end of the cylinder 11 on the circumferential surface side, and the conductive tape 3
A copper plating layer 16 is formed on 2. Conductive tape 32
Is attached so as to protrude outward from the outer end of the cylinder 11. After the gravure printing, the conductive tape 32
Is peeled off, the copper plating layer 16 can be peeled off.

Further, the example shown in FIG.
263754), a non-conductive member 33 is attached to the side surface of the cylinder 11. Thus, the copper plating layer 16 is not formed on the non-conductive member 33. After the gravure printing, a tool such as a chisel is inserted at the boundary between the copper plating layer 16 on the side surface and the non-conductive member 33, and the copper plating layer 16 is peeled off.

[0011]

However, FIG.
17, when the copper plating layer 16 is hit with a tool 20 such as a chisel, the cutting edge of the tool 20 reaches the underlying copper plating layer 14, and FIG.
As shown in (1), there is a problem that the base copper plating layer 14 and the base of the cylinder 11 may be damaged and the surface may become uneven. If the next copper plating layer 16 is formed while the irregularities remain, the doctor may separate from the surface during gravure printing to cause printing stains or damage the doctor. Further, when the damage reaches the base of the cylinder 11, the base (iron or the like) of the cylinder 11 is exposed.
There is a problem that the substrate is corroded during storage of the device.

[0012] However, in this stripping operation, it is difficult for even a skilled person to strip the copper plating layer 16 without damaging the underlying copper plating layer 14 at all. Therefore, after the copper plating layer 16 was peeled off, it was necessary to repair (re-plating, polishing, etc.) the underlying copper plating layer 14. For this reason, there has been a problem that the stripping operation is complicated, it takes time, and the cost is high.

On the other hand, (a), (b) and (d) of FIG.
In the method described above, the copper plating layer 16
Can be prevented from damaging the base copper plating layer 14 and the substrate on the circumferential surface of the cylinder 11, but if the copper plating layer 16 is to be peeled from the side surface of the cylinder 11, the side surface and the circumferential surface There was a problem that the copper plating layer 16 was broken and cut at the corners. This is the cylinder 11
This is because current concentration occurs at the edge of the electrode during the electroplating, so that the plating thickness increases and the copper plating layer 16 itself is hard and brittle. In the method shown in FIG. 16C, since the conductive tape 32 is attached to the circumferential surface side,
There is a problem that the copper plating layer 16 on the conductive tape 32 bulges up from other portions, causing trouble during gravure printing.

Therefore, an object of the present invention is to make it possible to peel off a copper plating layer by a simple method and without damaging an underlying copper plating layer or an underlayer such as a cylinder base.

[0015]

In order to solve the above-mentioned problems, an invention according to claim 1 is a gravure printing cylinder which is used as a gravure printing plate by forming a copper plating layer by a ballad plating method, Forming a groove in which a part of the circumferential surface and the side surface is cut off at a position including a corner between the circumferential surface and the side surface of the base, and a block removably fitted in the groove portion. I do.

According to a second aspect of the present invention, in the gravure printing cylinder according to the first aspect, when the block is fitted into the groove of the base, the block is located at the center of the side surface of the base. A gap for inserting a tool when removing the block is formed between the groove and the groove.

The third aspect of the present invention is the first or second aspect.
A gravure printing plate using the gravure printing cylinder according to the above, at the boundary between the substrate and the block of the gravure printing cylinder, the circumferential surface side of the substrate, and at least the side surface side A part of the circumferential surface side is filled with a conductive filler, and a peeling layer and a copper plating layer are sequentially laminated on the circumferential surface and a part of the circumferential surface side of the side surface of the base, and the copper plating layer is formed. A cell is stamped thereon, and a chromium plating layer is laminated on the copper plating layer on which the cells are formed.

According to a fourth aspect of the present invention, in the gravure printing plate according to the third aspect, the copper plating layer on the side surface of the base is formed in a substantially annular shape, and a boundary between the base and the block is formed. A notched region where the copper plating layer is not formed is provided in a region including the copper plating layer. According to a fifth aspect of the present invention, in the gravure printing plate of the fourth aspect, the not-formed region of the copper plating layer in which the notch is formed is formed by applying a non-conductive paint on the conductive filler. It is characterized by having been done.

[0019]

According to the first aspect of the present invention, since the block is fitted in the groove at the corner of the cylinder, if the copper plating layer is formed in a range including at least a part of the block, the block is taken out from the groove. Thereby, the copper plating layer can be peeled off. In the invention of claim 2, a tool is inserted into a gap between the block and the groove on the center side of the side surface of the base and the block is pushed up, so that when the copper plating layer is peeled, the block is easily removed from the groove of the cylinder. Can be taken out.

According to the third aspect of the present invention, since the boundary between the cylinder and the block is filled with the conductive filler to form the copper plating layer, the copper plating layer including the boundary between the cylinder and the block is formed uniformly. can do. Then, by taking out the block from within the groove of the cylinder, the copper plating layer can be peeled off. According to the fourth aspect of the present invention, a region where the copper plating layer is not formed is provided in a cutout shape in a partial region of the copper plating layer on the side surface of the base. Therefore, when the block is removed from the groove of the cylinder, the copper plating layer can be easily torn from the cutout portion. According to the fifth aspect of the present invention, since the region coated with the non-conductive paint is a cutout region where no copper plating layer is formed, the region of the copper plating layer and the copper plating layer are not formed. A notch-shaped region can be easily formed.

[0021]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a corner of a circumferential surface and a side surface in one embodiment of a gravure printing cylinder according to the present invention. FIG. 2 is a sectional side view showing a block 41 fixed to the cylinder 11. Further, FIG. 3 is a view showing the cylinder 11 of FIG. 1, and FIG. 3 (a) is a front sectional view (A-
A section) and (b) is a side view.

In FIG. 1, the outer shape of the cylinder 11 is the same as that shown in FIG. 11, and has a hollow cylindrical outer shape.
At a position (one side) including a corner between the circumferential surface and the side surface of the base, a groove 11a is formed by cutting a part of the base into a substantially quadrangular prism shape. The edge of the groove 11a is chamfered over the entire circumference. A block 41 is detachably fitted into the groove 11a. Block 41 is made of steel,
It is made of a metal or resin such as copper or aluminum. As shown in FIG. 2, when the material 41a is copper itself, it is unnecessary. Is given. When the block 41 is fitted into the groove 11a of the cylinder 11,
In FIG. 1, the blocks 41 are fitted without gaps except for the bottom side. Bottom side of block 41 and groove 11 of cylinder 11
and a gap S between which a spatula or the like can be inserted (FIG. 5B).
) Is formed.

At the lower side of block 41, block 4
A screw hole 41c for screwing the cylinder 1 to the cylinder 11 is formed therethrough.
When the female screw 11 is fitted into the groove 11a of the block 41, a position overlapping with the screw hole 41c of the block 41, that is, a surface that forms the groove 11a and is parallel to the side surface of the cylinder 11,
b (see FIG. 5B) is formed. This allows
After the block 41 is fitted in the groove 11 a of the cylinder 11, the block 41 is fixed to the cylinder 11 by screwing. At this time, the cylinder 11
And the upper surface of the block 41 are arranged on the same plane.

Next, a method of forming a gravure printing plate by forming a copper plating layer or the like on the cylinder 11 will be described.
The layer configuration such as a copper plating layer formed on the cylinder 11 is the same as that shown in FIG. FIGS. 4A and 4B are views showing a state in which the base copper plating layer 14 is formed on the cylinder 11, wherein FIG. 4A is a front view showing an end on the groove 11a side, and FIG.
Is a side view. 13A, a nickel plating layer 13 and a base copper plating layer 14 shown in FIG. 13 are formed by covering a sleeve 51 (two-dot chain line portion) on the support portion 12 of the cylinder 11. In FIG. 4B, the hatched area is
The region where the base copper plating layer 14 on the side surface is formed is shown.

Next, the block 41 is fitted into the groove 11a of the cylinder 11 and fixed by screws. In addition,
When the base copper plating layer 14 is formed in the groove 11 a of the cylinder 11, the block 41 is formed to have a size that fits into the groove 11 a without any gap. After the block 41 is fitted, a conductive filler 34 such as a silver paste is applied to a boundary between the groove 11a of the cylinder 11 and the block 41 (a portion including a chamfer of the outer edge of the groove 11a of the cylinder 11). 5A and 5B are views showing a state in which the conductive filler 34 is applied, wherein FIG. 5A is a plan view, FIG. 5B is a cross-sectional view of the groove 11a of the cylinder 11, and FIG. 5C is a side view. The conductive filler 34 is provided between the groove 11 a of the cylinder 11 and the block 41.
Is applied to the entire circumferential surface side of the cylinder 11, but only a part of the circumferential surface side may be applied to the side surface.

The conductive filler 34 prevents the plating solution or the like from entering from the boundary between the groove 11a of the cylinder 11 and the block 41, and also prevents the cylinder 11 and the block 4 from entering.
It has the role of eliminating the boundary between the two and making it even. After the conductive filler 34 is hardened, the circumferential surface of the conductive filler 34 is polished so that a step or the like does not occur at the boundary between the cylinder 11 and the block 41.

Subsequently, a release layer 15 and a (ballad) copper plating layer 16 are laminated on the underlying copper plating layer 14 in the same manner as shown in FIG. Thereby, a gravure printing plate is produced. FIGS. 6A and 6B are diagrams showing the gravure printing plate 10A manufactured as described above, wherein FIG. 6A is a cross-sectional view near the front block 41 and FIG. 6B is a side view. Further FIG.
(A), (b) is a figure which shows the block 41 vicinity of FIG. 6 (a), (b) in detail, respectively. The release layer 15 and the copper plating layer 16 are formed by covering the sleeve 51 in the same manner as the formation of the base copper plating layer 14.

Thereafter, the copper plating layer 16 is formed in the same manner as described above.
A cell 16a is formed thereon by electronic engraving, and a chromium plating layer 17 is formed thereon. At the time of gravure printing, since there is no step on the circumferential surface of the gravure printing plate 10A,
Improves the contact with the doctor and does not cause printing failure. After the gravure printing, the copper plating layer 16 is peeled off, and the cylinder 11 is reused. FIGS. 8A and 8B are diagrams illustrating a procedure for peeling the copper plating layer 16. First, the screw connecting the cylinder 11 and the block 41 is removed.
As shown in FIG. 3A, a gap S is formed between the groove 11a of the cylinder 11 and the bottom of the block 41 so that a spatula-shaped tool 52 such as a screwdriver can be inserted. The tool 52 is inserted into this gap S, and FIG.
In the middle and B directions.

As a result, as shown in FIG. 8B, the block 41 is separated from the groove 11a of the cylinder 11, and the portion of the copper plating layer 16 on the block 41 is separated from other portions. . Thereafter, the block 41 is gripped and the cylinder 11 is moved as shown in FIG.
By moving in the axial direction, the copper plating layer 16 can be separated into a strip shape. Further, the copper plating layer 16 can be separated from the cylinder 11 by the method shown in FIGS.

According to the above-described method, the copper plating layer 16 is not hit with the tool 20 such as a chisel as shown in the conventional example. Will not hurt. Further, by separating the block 41 from the cylinder 11, the copper plating layer 16 is kept in a state where the portion of the copper plating layer 16 at the corner between the circumferential surface and the side surface of the cylinder 11 is provided on the block 41. The copper plating layer 1
The copper plating layer 16 can be surely peeled off without being broken or broken at the corner between the circumferential surface and the side surface.

FIG. 9 is a view for explaining another embodiment of the present invention, and is a side view near the block 41. FIG. As shown in FIG. 5, after the block 41 is fixed to the groove 11 a of the cylinder 11, the conductive filler 34 is provided so as to fill the boundary between the cylinder 11 and the block 41. A non-conductive paint 35 is applied so as to overlap a part of the boundary between the cylinder 11 and the block 41 on the side surface of the conductive filler 34. This allows
Since the region where the non-conductive paint 35 is applied does not conduct during the electroplating, the copper plating layer 16 is not formed.

FIG. 10 shows the state of FIG.
FIG. 6 is a view showing a state in which is formed. The copper plating layer 16 is formed in a substantially annular shape on the side surface side, and its inner outer edge is formed so as to pass through the region of the non-conductive paint 35. As a result, an unformed region 16b of the copper plating layer 16 is provided in a notch shape at the boundary between the cylinder 11 and the block 41 on the inner outer edge of the copper plating layer 16 on the side surface of the cylinder 11. As a result, when the copper plating layer 16 is peeled, a crack is formed in the copper plating layer 16 from the notched unformed region 16b with the separation of the block 41 from the cylinder 11, so that the copper plating layer 16 may be peeled off. Become. Therefore, the copper plating layer 1 can be more easily formed without requiring excessive force.
6 can be peeled off.

[0033]

According to the first aspect of the invention, when a gravure printing plate is formed from a gravure printing cylinder, the copper plating layer can be separated by separating the block from the cylinder. Therefore, since the copper plating layer is not hit by the tool, it is possible to prevent the base copper plating layer below the copper plating layer and the base of the cylinder from being damaged. Thereby, the repair work of the base copper plating layer can be reduced, and the manufacturing cost can be reduced. further,
The copper plating layer can be easily peeled off without requiring skill. Also, when separating the block from the cylinder, the copper plating layer can be peeled off while the portion of the copper plating layer at the corner between the circumferential surface and the side surface of the cylinder is provided on the block, The copper plating layer does not break or break at the corner between the circumferential surface and the side surface, and the copper plating layer can be reliably peeled off.

According to the second aspect of the present invention, at the time of peeling the copper plating layer, the block can be easily taken out from the groove of the cylinder using a tool. According to the third aspect of the present invention, the copper plating layer can be formed uniformly including the boundary between the cylinder and the block.

According to the fourth aspect of the present invention, when the block is removed from the groove of the cylinder, the copper plating layer is easily torn from the region where the notched copper plating layer is not formed, so that an excessive force is not required. The copper plating layer can be easily peeled off. According to the fifth aspect of the present invention, a notch-shaped portion which is a region where the copper plating layer is not formed can be easily formed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a gravure printing cylinder according to the present invention, showing a corner between a circumferential surface and a side surface.

FIG. 2 is a side sectional view showing a block fixed to a cylinder.

3 is a view showing the cylinder of FIG. 1, (a) is a front sectional view, and (b) is a side view.

4A and 4B are diagrams showing a state in which a base copper plating layer is formed on a cylinder, wherein FIG. 4A is a front view showing a groove-side end portion, and FIG.
Is a side view.

FIG. 5 is a diagram showing a state where a conductive filler is applied,
(A) is a plan view, (b) is a sectional view of a groove portion of a cylinder,
(C) shows a side view.

6A and 6B are diagrams showing a gravure printing plate, wherein FIG. 6A is a cross-sectional view near the front block and FIG. 6B is a side view.

FIGS. 7 (a) and (b) are FIGS. 6 (a) and 6 (b), respectively.
It is a figure which shows the block vicinity of (b) in more detail.

FIGS. 8A and 8B are diagrams illustrating a procedure for peeling a copper plating layer.

FIG. 9 is a diagram illustrating another embodiment of the present invention, and is a side view near a block.

FIG. 10 is a view showing a state where a copper plating layer is formed from the state of FIG. 9;

FIG. 11 is an external perspective view showing an example of a conventional gravure printing plate in which a plating layer is formed on a cylinder.

12 (a) and (b) are a side view and a front view (partially including a cross section) of the gravure printing plate of FIG. 11;

FIG. 13 is a sectional view showing in detail a layer configuration such as a copper plating layer laminated on a cylinder.

14A and 14B are diagrams sequentially illustrating an example of a method of peeling a copper plating layer.

FIGS. 15 (a), (b), and (c) are diagrams sequentially illustrating an example of a method of peeling a copper plating layer.

FIGS. 16A to 16D are cross-sectional views showing another example of a method of removing a copper plating layer in a conventional gravure printing plate.

FIG. 17 shows that the base copper plating layer and the base of the cylinder are damaged,
It is sectional drawing which shows the state in which the surface became uneven.

[Explanation of symbols]

 Reference Signs List 10A Gravure printing plate 11 Cylinder 11a Groove 12 Support 13 Nickel plating layer 14 Underlayer copper plating layer 15 Peeling layer 16 (ballad) copper plating layer 16a Cell 16b Unformed area (of copper plating layer 16) 17 Chrome plating layer 34 Conductivity Filler 35 Non-conductive paint 41 Block 41b Copper plating 41c Screw hole 52 Tool S Clearance

Claims (5)

[Claims] 1. A gravure printing cylinder used as a gravure printing plate by forming a copper plating layer by a ballad plating method, wherein said circumferential surface is located at a position including a corner between a circumferential surface and a side surface of a base. A gravure printing cylinder, wherein a groove is formed by cutting out a part of the side surface, and a block is removably fitted in the groove. 2. The gravure printing cylinder according to claim 1, wherein, when the block is fitted into the groove of the base, the block and the groove at the center of the side surface of the base. A gravure printing cylinder, wherein a gap for inserting a tool when the block is removed is formed. 3. A gravure printing plate using the gravure printing cylinder according to claim 1 or 2, wherein the gravure printing plate is a boundary between the base and the block of the gravure printing cylinder and the gravure printing plate. A circumferential surface side, and at least a part of the circumferential surface side of the side surface side is filled with a conductive filler, a release layer and a part of the circumferential surface and the circumferential surface side of the side surface of the base body and A gravure printing plate, wherein a copper plating layer is sequentially laminated, a cell is imprinted on the copper plating layer, and a chromium plating layer is laminated on the copper plating layer on which the cells are formed. 4. The gravure printing plate according to claim 3, wherein the copper plating layer on a side surface of the base is formed in a substantially annular shape, and is cut out in a region including a boundary between the base and the block. A gravure printing plate, comprising a region where the copper plating layer is not formed. 5. The gravure printing plate according to claim 4, wherein the not-formed area of the notched copper plating layer is formed by applying a non-conductive paint on the conductive filler. A gravure printing plate, characterized in that: