JP2000286524A - Radial direction mountable component and substrate device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the positional accuracy of a part which is mounted in the radial direction. SOLUTION: Leads 12 of a momentary switch 10 are formed, in such a way that their parts 12a existing in the thickness D of a substrate 40 overlap with substrate holes 41, when the momentary switch 10 is mounted on the substrate 40. Accordingly, when the leads 12 are inserted into the substrate holes 41 when mounting the momentary switch 10, the sidewalls of the substrate holes 41 are pressed and deformed by the parts 12a of the leads 12. As a consequence, no more clearance exists between the parts 12a and the substrate holes 41. In this way, when the leads 12 are clinched by a prescribed clinching angle (folded), the switch 11 will not rotate for its position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radially mounted component used for, for example, audio equipment and the like, and a board device using the same. More specifically, at least two of the plurality of leads are formed so that a part or all of the leads existing in the thickness of the board at the time of mounting overlap with the board holes, so that the component body at the time of mounting is formed. The present invention relates to a component mounted in a radial direction in which the positional accuracy of the component is improved.

[0002]

2. Description of the Related Art Conventionally, there has been known a radially mounted component which is mounted in a standing state on a printed wiring board provided in audio equipment or the like. The radial mounting components include, for example, a tact switch, a fuse clamp, a transistor, and a chemical capacitor. When mounting such a radial mounting component on a board, a lead provided on the component body is inserted into a board hole formed on the board, and the leading end of the lead is partially cut and then clinched. Is done.

A case where the tact switch 30 as a radial mounting component is mounted on a substrate 40 will be described as an example.

First, as shown in FIG. 4A, two leads 32 provided on a switch body 31 of a tact switch 30 are connected to two substrate holes 4 formed in a substrate 40.
1, 41. Here, the lead 32 is processed using a mold, for example, and has a rectangular cross section. The substrate 40 is a mold hole substrate formed using paper phenol resin, or a TH hole substrate formed using glass epoxy resin.

[0005] Next, as shown in FIG.
After partially cutting the tip of 32, clinch it. FIG.
FIG. 4 is a diagram in which the state after clinching the leads 32 is observed from the bottom side of the substrate 40. In this case, the leads 32 are clinched (bent) while being twisted at a predetermined clinch angle θ, for example, 45 ° or 35 °. By providing the clinch angle θ in this manner, the dead space can be reduced, and the efficiency of component mounting on the substrate 40 can be increased. In addition, wiring patterns 42, 42 are formed on the bottom surface side of the substrate 40 corresponding to the substrate holes 41, 41. Then, although not shown, the leads 32, 32 are soldered to the wiring patterns 42, 42, respectively. Will be attached.

[0006]

As is apparent from the cross-sectional views taken along the line aa of FIGS. 4A and 6, the leads 32 of the tact switch 30 are connected to the substrate holes 4 of the substrate 40.
In the state inserted into the holes 1 and 41, a predetermined clearance exists between the leads 32 and 32 and the substrate holes 41 and 41.

For this reason, when the leads 32 are clinched with the clinch angle θ as described above, the switch body 31 of the tact switch 30 is turned on as shown by a broken line in FIG.
May be rotated and displaced from a normal position indicated by a dashed line in FIG. When the switch body 31 of the tact switch 30 is displaced from the proper position in this manner, for example, when a light guide or the like is mounted on the tact switch 30,
, So that the mounting is not easy.

The leads 32, 32 and the substrate holes 41, 4
Since there is a predetermined clearance between the switch main body 1 and the lead 1, the stress applied to the switch main body 31 when the leads 32, 32 are clinched is large, and the stress may cause the switch main body 31 to be broken.

The above-mentioned inconvenience occurs not only in the tact switch 30 but also in other radially mounted components such as a fuse clamp and a transistor similarly mounted on a substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a component mounted in a radial direction and the like in which the positional accuracy of a component body during mounting is improved.

[0011]

SUMMARY OF THE INVENTION A radial mounting component according to the present invention has a plurality of leads, and after inserting the plurality of leads into a board hole formed in a board, the leads are inserted into a predetermined hole. Clinching at a clinch angle is a radial mounting component mounted in the radial direction on the substrate, wherein at least two of the plurality of leads are present within the thickness of the substrate at the time of the mounting. Alternatively, all of them are formed so as to overlap with the substrate holes.

Further, a board device according to the present invention includes a board having a board hole formed therein, and a radial mounting component having a plurality of leads, wherein the radial mounting component is
A board device which is mounted on the board by inserting the plurality of leads into the board hole and then clinching the leads at a predetermined clinch angle. At least two of the leads are formed so that a part or all of the leads existing within the thickness of the substrate at the time of the mounting overlap the substrate holes.

In the present invention, the radially mounted component has a plurality of leads. When the radial mounting component is mounted on a board, a plurality of leads are inserted into a board hole formed on the board, and then the leads are clinched at a predetermined clinch angle. Here, at least two of the plurality of leads are formed so that part or all existing within the thickness of the board at the time of mounting overlaps the board hole.

Therefore, when a plurality of leads are inserted into the substrate hole formed in the substrate as described above, at least two of the leads are partially or entirely present within the thickness of the substrate. There is no clearance between the portion and the substrate hole. Therefore, as described above, when the lead is clinched at a predetermined clinch angle, the component main body is prevented from being displaced from the normal position, for example, the position of the component main body is rotated. This makes it possible to improve the positional accuracy of the component body at the time of mounting, and it is easy to incorporate the component in the assembly process. Further, by eliminating the clearance between the lead and the board hole, the stress applied to the component body when clinching the lead can be reduced, and the component body can be prevented from being broken by the stress.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a tact switch 10 as an embodiment. The tact switch 10 includes a switch body 11 and two leads 12 provided on the switch body 11.

The leads 12, 12 are each processed using a mold and have a rectangular cross section. Further, as shown in FIG.
Each of the portions 12a, 12a (the root portions of the leads 12, 12 in FIG. 1) existing within the thickness D of the substrate 40 at the time of mounting is formed so as to overlap with the substrate holes 41, 41. Length d of part 12a described above
Is, for example, 0.5 to 1.0 mm when D = 1.6 mm.
It is said. All of the leads 12, 12 existing within the thickness D of the board 40 at the time of mounting are
1 and 41 may be formed so as to overlap with each other.
When coming out on the bottom side of 1, 41, a large force is required when clinching.

FIG. 2 is a sectional view taken along the line bb of FIG. The lead 12 overlaps the substrate hole 41 by t. For example, when the diameter of the substrate hole 41 is about 1 mm, the overlap amount t is 0.05 to 0.1 mm when the substrate 40 is a mold hole substrate, and when the substrate 40 is a TH hole substrate. In some cases, it is 0 to 0.05 mm.

The tact switch 10 shown in FIG.
3A and 3B will be described.

First, as shown in FIG. 3A, two leads 12, 12 provided on a switch body 11 of the tact switch 10 are connected to two substrate holes 4 formed in a substrate 40.
1, 41. In this case, the portions 12a, 12a, which are the root portions of the leads 12, 12, are connected to the substrate holes 41, 41.
The side walls of the substrate holes 41, 41 are pressed and deformed by the portions 12a, 12a of the leads 12, 12, and the portions 12a, 12a and the substrate 12 are deformed. There is no clearance between the holes 41,41. Next, as shown in FIG. 3B, the leads 12 are clinched after partially cutting the tips. In this case, as in the conventional example, the lead 1
2 and 12 are clinched (bent) while being twisted at a predetermined clinch angle θ, for example, 45 ° or 35 ° (see FIG. 5). Although not shown, the lead 1
2 and 12 are soldered to a wiring pattern formed on the bottom surface side of the substrate 40.

As described above, the tact switch 10 according to the present embodiment is formed such that the roots 12a, 12a of the leads 12, 12 overlap the substrate holes 41, 41. I have. for that reason,
When the leads 12, 12 are inserted into the board holes 41, 41 formed in the board 40 during mounting, the leads 12, 12
No clearance exists between the portions 12a, 12a and the substrate holes 41, 41.

Therefore, when the leads 12, 12 are clinched at a predetermined clinch angle, the switch body 1
The position of the switch body 1 does not rotate.
1 is held in a regular position, and the positional accuracy of the switch body 11 at the time of mounting can be improved. For example, even when a light guide or the like is mounted on the tact switch 10, it can be performed smoothly.

Also, a part 12a, 1 of the lead 12,12
Since there is no clearance between 2a and the board holes 41, the stress applied to the switch body 11 when the leads 12, 12 are clinched can be reduced, and the switch body 11 can be prevented from being broken by the stress. .

In the above embodiment, an example of the tact switch 10 which is one of the radially mounted components has been described. However, the present invention is similarly applied to other radially mounted components such as a fuse clamp and a transistor. Applicable. Further, the number of leads is not limited to two. However, at least two of the plurality of leads need to be formed so that some or all of the leads existing within the thickness of the board at the time of mounting overlap the board holes. In the above-described embodiment, the lead 12 has a rectangular cross section. However, the present invention can be similarly applied to a lead having a circular cross section.

[0024]

According to the present invention, at least two of the plurality of leads of the radial mounting component are
A part or all existing within the thickness of the substrate at the time of mounting is formed so as to overlap with the substrate hole. Therefore, it is possible to improve the positional accuracy of the component main body when mounting the radial mounting component, and it is easy to incorporate the component in the assembly process. Further, by eliminating the clearance between the lead and the board hole, the stress applied to the component body when clinching the lead can be reduced, and the component body can be prevented from being broken by the stress.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a tact switch as an embodiment.

FIG. 2 is a sectional view taken along line bb of FIG. 1;

FIG. 3 is a diagram for explaining a mounting procedure of the tact switch according to the embodiment;

FIG. 4 is a diagram for explaining a mounting procedure of a conventional tact switch.

FIG. 5 is a diagram observed from the bottom side of the substrate.

FIG. 6 is a sectional view taken along line aa of FIG. 4;

FIG. 7 is a diagram in which the position rotation by clinch is observed from the bottom surface side of the substrate.

[Explanation of symbols]

 Reference Signs List 10 Tact switch 11 Switch body 12 Lead 40 Board 41 Board hole

Claims (5)

[Claims] A plurality of leads which are inserted into a substrate hole formed in the substrate and are then clinched at a predetermined clinch angle so as to be radially attached to the substrate. A radial mounting component to be mounted, wherein at least two of the plurality of leads are
A radial mounting component, wherein a part or all existing within the thickness of the substrate at the time of mounting is formed so as to overlap with the substrate hole. 2. The component according to claim 1, wherein the lead is processed by using a mold. 3. The component according to claim 1, wherein the substrate is a die-hole substrate formed using a paper phenol resin. 4. The substrate according to claim 1, wherein said substrate is a TH-hole substrate formed using a glass epoxy resin.
The radial mounting component described in 1. 5. A board having a board hole formed therein and a radial mounting component having a plurality of leads, wherein the radial mounting component is inserted into the board hole after the plurality of leads are inserted into the board hole. A board device mounted on the board by clinching a lead at a predetermined clinch angle, wherein the radial mounting component is such that at least two of the plurality of leads are mounted on the board at the time of mounting. A part or the whole existing within the thickness of the substrate is formed so as to overlap the substrate hole.