JP2000269168A - Tape releasing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reuse a frame by releasing a tape so that adhesives are not left behind in the frame. SOLUTION: A fastening processing, a gripping processing, and a separating processing are sequentially effected. In the fastening processing, upper and lower faces of a frame 2 are interposed by a frame fixing tool 1, and are held at a fixed position, and in the gripping processing, the upper and lower faces of a tape 4 ranging between parts 2a and 2b confronting each other in the frame 2 are interposed by a tape fixing metal fitting 6. In the separating processing, the tape fixing tool 6 for fixing the tape 4 is forcible relatively moved to a side in which the tape 4 is adhered to the frame 2, and the tape 2 after a semiconductor device is cut is forcibly released from the frame 2, including an adhesives coated face.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating a tape, and more particularly to a method for separating a tape remaining on a frame after cutting and removing a semiconductor element.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, semiconductor elements are aligned and mounted on a tape attached to a frame,
Next, there is a process of cutting the resin including a part of the tape and separating the individual semiconductor devices after performing a resin embedding and other processes. The frame is a frame, and the tape is attached to the frame of the frame with a thermoplastic adhesive.

[0003]

After each semiconductor device is cut from the tape attached to the frame of the frame, an unnecessary portion of the tape after cutting the semiconductor device remains in the frame. The frame to which the unnecessary portion of the tape is attached cannot be reused as it is, and therefore, the frame has been conventionally discarded.

[0004] The use of such a disposable frame is a waste of resources, requires extra energy for waste disposal, and rebounds to the product cost of the semiconductor device, thereby increasing the product cost. In addition, a thermoplastic adhesive is used as an adhesive for the tape, and a solvent is required to melt and reuse the thermoplastic adhesive, and the use of the solvent causes environmental problems.

An object of the present invention is to provide a tape peeling method in which a tape is peeled so that an adhesive does not remain on a frame and the frame can be reused.

[0006]

In order to achieve the above object, a tape peeling method according to the present invention comprises a tightening process, a gripping process, and a separating process, wherein a tape after cutting a semiconductor device is framed. It is a tape peeling method to peel off from the, the tightening process is a process of holding the frame in a fixed position when peeling the tape from the frame,
The gripping process is a process of clamping a tape to be peeled, and the separating process is performed on a frame held in a fixed position.
This is a process in which the clamped tape is forcibly displaced relative to each other, and the tape is forcibly peeled from the frame including the adhesive applied surface.

Further, the tightening process is a process of holding the upper and lower surfaces of the frame by using a frame fixing jig and holding the frame in a fixed position, and the gripping process is a process of clamping a part of the tape with a chuck. The separation process is a process of forcibly separating the tape from the frame while moving the chuck in parallel with the frame.

[0008] Further, there is an extraction process, and the extraction process includes
An air blow blown out from the nozzle at high pressure is blown to the end of the tape, and the end of the tape is peeled off from the frame by the blowout pressure.The gripping process is to chuck the tape portion peeled off by the tapping process with a chuck. This is a clamping process.

The tightening process is a process of holding the upper and lower surfaces of the frame with a frame fixing jig and holding the frame in a fixed position, and the gripping process is a process of holding a portion of the tape passed between both portions of the frame. The upper and lower surfaces are sandwiched between the tape fixing jigs. The separation process is to move the tape fixing jig fixing the tape relatively to the side where the tape is attached to the frame to forcibly peel the tape from the frame. Processing.

[0010] The tape holds the semiconductor device in an adhesive state, and is attached to the frame using a thermoplastic adhesive. After the polishing process of the semiconductor device, the semiconductor device is cut off from the tape, and the tape is left on the frame while being bonded by the thermoplastic adhesive.

According to the present invention, the tape is peeled from the frame by performing a tightening process, a gripping process, and a separating process.

The tightening process is a process of holding the frame at a fixed position when the tape is peeled from the frame. The tightening process does not necessarily have to be performed first, but at least in the separating process, free displacement of the frame must be prevented.

[0013] The gripping process is a process of clamping a tape to be peeled. The tape may be clamped on a part of the tape or on a wide range.

However, in order to clamp the tape, at least the portion of the tape to be clamped must be separated from the frame. The tape includes a tape in which a certain area is adhered to a part of the frame, and a tape which is attached across the facing portion of the frame.

When it is desired to clamp a portion of the tape adhered to the frame, a part of the tape adhered to the frame is peeled off from the frame as an extruding process, and then the peeled portion is clamped.

The separation process is a process in which the clamped tape is forcibly displaced relative to the frame held at a fixed position, and the tape is forcibly separated from the frame. By properly performing the separation process, the frame will not be damaged,
The frame can be reused.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) In FIG.
(B) As shown in FIG.
Hold the upper and lower surfaces of the frame 2 at a fixed position with the chuck 3 and clamp a part of the tape 4 with the chuck 3 as a gripping process. An example is shown in which the tape 4 is moved and the tape 4 is forcibly peeled off from the frame 2.

Further, in this example, in order to clamp the tape 4, a part of the tape 4 stuck on the frame 2 is peeled off from the frame 2, and an opening for peeling off a part of the tape 4 from the frame 2 is provided. An example in which air blow is used as the processing is shown.

That is, in FIG.
Then, an air blow jetted at a high pressure is blown to the end of the tape 4, the end portion of the tape 4 is peeled from the frame 2 by the jet pressure, and the portion of the tape 4 peeled off as a gripping process is clamped by the chuck 3. is there.

According to this embodiment, since the air blow is used for the opening process, the frame 2 is not damaged, and the separating process is performed by moving the chuck 3 clamping the tape 4 in parallel with the frame 2 while moving the chuck 3 in parallel with the frame 2. In order to forcibly peel off the tape 4,
Can be removed from the frame 2, and the tape 4 is partially peeled off from the frame 2 sequentially.
Therefore, when the tape 4 is separated, the frame 2 is not damaged.

(Embodiment 2) FIG. 2 shows an example in which the tape 4 is removed from between the facing portions 2a and 2b of the frame 2 of the frame. In this embodiment, as shown in FIG. 2A, the facing portion 2 of the frame 2 is used as a tightening process.
The upper and lower surfaces of a and 2b are held by a frame fixing jig 1 and held in a fixed position. As a gripping process, the upper portion of the tape 4 stretched between both portions 2a and 2b of the frame 2 is processed. As shown in FIG. 2B, the lower surface is sandwiched between the tape fixing jigs 6 and the tape fixing jig 6 to which the tape 4 is fixed is separated from the side where the tape 4 is attached to the frame 2 (the frame in this example). 2) and move the tape 4
From the frame 2.

According to this embodiment, at least the upper and lower surfaces of the frame-facing portions 2a and 2b of the frame 2 are firmly supported by the frame fixing jig 1, and between the facing portions 2a and 2b of the frame 2. Since most of the straddling tape 4 is supported by the tape fixing jig 6 and separated from the frame 2, the shearing force due to the relative displacement between the frame fixing jig 1 and the tape fixing jig 6 is applied to the adhesive surface of the tape 4. The tape can be easily released including the surface to which the adhesive g is applied without damaging the frame by concentrating on the surface.

[0023]

As described above, according to the present invention, the tape can be peeled off from the frame without damaging the frame, so that the frame can be reused, resources can be saved, and the product cost of the semiconductor device can be reduced. This has the effect of realizing the reduction of.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of the present invention, in which (a)
FIG. 4 is a diagram illustrating a procedure of a tapping process, and FIG. 4B is a diagram illustrating a procedure of a tightening process, a gripping process, and a separation process.

FIG. 2 shows a second embodiment of the present invention, in which (a)
FIG. 4B is a diagram illustrating a processing procedure of a tightening process and a gripping process, and FIG. 4B is a diagram illustrating a processing procedure of a separation process.

[Explanation of symbols]

 Reference Signs List 1 frame fixing jig 2 frame 2a, 2b frame facing portion 3 chuck 4 tape 5 nozzle 6 tape fixing jig g adhesive

Claims (4)

[Claims] 1. A tape peeling method comprising a tightening process, a gripping process, and a separating process, wherein the tape after cutting a semiconductor device is peeled from a frame, wherein the tightening process peels the tape from the frame. The holding process is a process of clamping the tape to be peeled, and the separating process is a process of forcibly applying the clamped tape to the frame held in the fixed position. A tape peeling method characterized by a process of forcibly peeling a tape including a surface coated with an adhesive from a frame by relative displacement. 2. The tightening process is a process of holding the upper and lower surfaces of the frame at a fixed position by using a frame fixing jig, and the gripping process is a process of clamping a part of the tape with a chuck. The method according to claim 1, wherein the separation process is a process of forcibly separating the tape from the frame while moving the chuck in parallel with the frame. 3. A squeezing process, wherein the squirting process is a process in which an air blow jetted at a high pressure from a nozzle is blown to the end of the tape, and the end portion of the tape is peeled off from the frame by the spout pressure. The tape peeling method according to claim 2, wherein the step (c) is a process of clamping, with a chuck, a portion of the tape that has been peeled off by the tapping process. 4. The tightening process is a process in which the upper and lower surfaces of a frame are sandwiched between frame fixing jigs and held at a fixed position. The gripping process is a process of holding a tape passed between facing portions of the frame. The upper and lower surfaces are sandwiched between the tape fixing jigs.The separation process is to move the tape fixing jig with the tape fixed to the side where the tape is attached to the frame, and forcibly peel the tape from the frame. The tape peeling method according to claim 2, wherein the tape is peeled off.