JP2000269096A - Chip capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent solder bonding terminals to a capacitor chip from re- melting and penetrating around to establish short circuit in a chip capacitor, in which a capacitor chip and terminals are embedded in a resin base from above. SOLUTION: The top of a resin base is depressed to form a capacitor receiving space 7, into which and by which a capacitor chip 2A is fitted in from above the base and is supported. A through-hole 9, through which the tip end side of a terminal 5 is passed, is formed at each of four corners of a top surface 15 of the base around a capacitor-receiving space 7, and a trench 8 in which an end portion 5A of the terminal 5 is fitted is formed at each corner of the top surface 15. Depressions or projections 13, preventing capillary action and regulating solder wicking between both electrodes 3, 4 of the chip capacitor 2, are formed on inside peripheral walls 12 of a capacitor receiving space 7 opposite to the capacitor chip 2A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip capacitor device, and more particularly, to a capacitor chip and a terminal integrated with the capacitor chip, which are inserted into a base from above, and each terminal is inserted into a terminal insertion hole of a board of an electric / electronic component. The present invention relates to a chip capacitor device that is configured to be inserted into a chip capacitor and soldered.

[0002]

2. Description of the Related Art FIG.
1A and 1B show a conventional chip capacitor device 1 of this type. As shown in FIG. 5 (A), a chip capacitor 2 of the chip capacitor device 1 has L-shaped terminals 5, 5 connected to electrodes 3, 4 (anode 3, cathode 4) of a rectangular capacitor chip 2A. , 5, 5 are soldered, the capacitor chip 2A is fitted into a resin base 6 and integrated, and then the terminals 5, 5, 5, 5 are soldered to form a board (see FIG. (Not shown) for each holder 6
Fixed. For this reason, each terminal 5 connected to the chip capacitor 2 is formed in advance in an L-shape in which the distal end is bent at substantially 90 ° with respect to the base end 5A, and the base 5A is made substantially horizontal. The terminals are soldered to the terminals 3 and 4, respectively, with the front end side vertically downward from the end.

[0005] A rectangular capacitor receiving chamber 7 into which the capacitor chip 2A is fitted from above is formed in the base 6 so as to be recessed, and the upper surface of the base 6 is centered on the capacitor receiving chamber 7. A groove 8 for supporting the base end 5A of each terminal 5 by fitting it from above into the four corners of the terminal 15 and a through hole 9 for vertically penetrating and inserting the front end side from the base end of the terminal 5 are formed. Have been.

In order to solder the electric and electronic components to the chip capacitor device 1, a dipping process is preferable. However, depending on the time required for the soldering and the temperature of the soldering, the base ends of the terminals 5, 5, 5, 5 may be used. The solder joining 5A and the electrodes 3 and 4 is melted, and at this time, the grooves 8, 8, 8, 8
.., And melts out into the capacitor accommodating chamber 7, and at this time, the electrodes 3 and 4 may be short-circuited due to the solder wraparound due to the capillary phenomenon.

Therefore, there arises a technical problem to be solved in order to prevent the short circuit by preventing the solder from wrapping around both electrodes, and an object of the present invention is to solve the problem.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been proposed to achieve the above-mentioned object, and has been proposed for each electrode of a rectangular capacitor chip having an anode at one end and a cathode at the other end. After soldering the base end of the terminal bent in an L shape substantially horizontally and making the tip side from the base end of each electrode substantially along the vertical direction, the capacitor chip and the terminal are made of resin from above. In the chip capacitor device, each terminal is inserted into a terminal insertion hole of the board of the electric / electronic component and soldered, and the upper surface of the base is depressed to remove the capacitor chip from above. Forming and forming a capacitor accommodating chamber to be fitted and supported, and forming a through hole for vertically penetrating and inserting the distal end side of the terminal into an outer portion of the base around the capacitor accommodating chamber, further comprising: Be A groove for supporting the base end of the terminal by being inserted from above is formed on the upper surface of the capacitor chip, and the capillarity is cut off on the corresponding surface between the peripheral wall of the capacitor accommodating chamber and the capacitor chip to prevent both ends of the capacitor chip. Providing a chip capacitor device formed by vertically extending a concave portion or a convex portion that regulates the wraparound of solder between electrodes,
Further, the present invention provides a chip capacitor device in which a concave portion or a convex portion is provided on an inner bottom surface of the capacitor accommodating chamber so as to block a capillary phenomenon between the capacitor chip and a lower surface thereof. The base end of the L-shaped terminal is soldered almost horizontally to each electrode of the rectangular capacitor chip having a cathode at the end, and the tip end side from the base end of each electrode is almost vertically extended. After being aligned, the capacitor chip and the terminal are fitted into a resin base from above, and each terminal is inserted into a terminal insertion hole of a board of an electric / electronic component and soldered. In the above, the upper surface of the base is depressed to form a capacitor accommodating chamber in which the capacitor chip is fitted and supported from above, and the capacitor accommodating chamber is centered on an outer portion of the base. A through hole is formed for vertically penetrating the distal end of the terminal, and a through-hole is formed in the upper surface of the base. A groove is formed in the upper surface of the base to support the base end of the terminal by being inserted from above. The present invention also provides a chip capacitor device provided with a concave portion or a convex portion on a surface corresponding to the above-mentioned capacitor chip for blocking a capillary phenomenon and restricting a solder from flowing between both electrodes of the capacitor chip.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to FIGS. The same components as those in the related art are denoted by the same reference numerals. (First Embodiment) FIG. 1A shows a chip capacitor device 1 in which a chip capacitor 2 is integrally mounted on a base 6.
1 is shown. As shown in the figure, a capacitor housing chamber 7 for fitting a rectangular capacitor chip 2A from above is formed on the upper surface of the base 2 by a recess whose upper part is opened. Through holes 9 are formed at the four corners to fit terminals 5, 5, 5, and 5 soldered to the electrodes 3 and 4 at both ends of the capacitor chip 2A from above, respectively, for attachment. Grooves 8 are formed along four corners of the upper surface of the base 6 in a diagonal direction, and the terminals 5, 5, 5, 5, 5, and 5 are respectively bent in the respective grooves 8.
Base ends 5A of 5, 5 are fitted from above.

In order to prevent the solder from wrapping around due to the capillary phenomenon and to prevent short-circuiting of the capacitor chip 2A, a straight line is formed on a pair of inner side walls 12 extending in both pole directions of the capacitor housing chamber 7. The recesses 13 and 13 extending in a shape are formed. The recesses 13, 13 extend above the inner bottom surface 14 of the capacitor housing chamber 7 and open to the upper surface 15 of the base 6. Therefore, when the capacitor chip 2 </ b> A is fitted into the capacitor accommodating chamber 7 and the terminals 5, 5, 5, 5 are inserted into the corresponding grooves 8 and the through holes 9, the capillarity still exists on both sides of the recesses 13, 13. Despite the presence of the gap, the capillary action is blocked by the recesses 13, 13, so that the molten solder
It does not flow into 3,13.

Therefore, short-circuiting due to solder wraparound during dip processing is prevented. Of course, a cross section orthogonal to the depth direction of the capacitor housing chamber 7 may be formed in a W shape as shown in FIG. 1B to provide for the inertia of the melted solder. The reliability may be further improved by providing two or more pairs at an interval in the bipolar direction with respect to the peripheral wall 12. Also, as shown in FIG. 1A, a concave portion 16 communicating the concave portions 13 with each other is formed on the inner bottom surface of the capacitor accommodating chamber 7, and the concave portion 16 allows the inner bottom surface 14 of the capacitor accommodating chamber 7 to be connected to the capacitor chip 2A. May be prevented from wrapping around the solder due to a capillary phenomenon with the inner bottom surface 14. (Second Embodiment) FIG. 2 shows a chip capacitor device 11A according to another embodiment.

In this example, first, the capacitor chip 2A
In order to cut off the capillary action between the lower surface 17 of the capacitor housing 7 and the inner bottom surface 14 of the capacitor housing 7,
A convex portion 18 is formed substantially at the center of the inner bottom surface of the chip capacitor 2, and the lower surface 1 of the chip capacitor 2 fitted into the capacitor accommodating chamber 7 is formed.
Spaces 19 and 19 are formed between the inner wall 7 and the inner bottom surface 14 of the condenser housing chamber 7 to block capillary action. For this reason, the melted solder does not flow into the space portions 19, 19, and short-circuiting due to the solder wraparound during the dipping process is prevented. Of course, the convex portion 18 is extended back and forth along a direction orthogonal to the bipolar direction, so that the
Is connected to the inner peripheral walls 12, 12, even if the melted solder enters the spaces 19, 19 due to the fluid inertia, the convex portions 18 serve as barriers, and short-circuits are reliably prevented.

Of course, as shown in FIG. 3, the capacitor chip 2
Even if at least one convex portion 18 is formed so as to be in contact with the outer surface of A, and spaces are formed on each of the left and right sides of each convex portion 18 for blocking the capillary action, thereby preventing solder from flowing in all directions. good.

As described above, in the first embodiment, the recess 13 is used.
Prevents the solder from wrapping around due to capillary action,
In the embodiment, the protrusion 18 prevents the solder from flowing around due to the capillary phenomenon.
The combination of 8 may prevent short circuit due to solder wraparound. In addition, 20 is a gas vent hole. (Embodiment) FIG. 4 shows a preferred embodiment of the chip capacitor device according to the present invention.

In this example, the rectangular capacitor housing chamber 7 having an open top is defined on the upper surface 15 of the base 6 and soldered to the chip capacitors 2 at the four corners of the upper surface 15 of the base 6, respectively. Terminals 5,5 attached
A through hole 9 is provided for inserting each of 5, 5 from above,
Further, at the four corners of the upper surface of the base 6, the upper end of each through hole 9 and the upper part of the capacitor accommodating chamber 7 are diagonally communicated with each other to form the groove 8, thereby preventing the solder from wrapping around due to the capillary phenomenon. In order to regulate, a concave portion 13 is formed at substantially the center of a pair of inner side walls 12 facing each other in a direction orthogonal to both pole directions of the capacitor housing chamber 7. The protruding portion 18 is formed in the portion to block the capillary action.

Then, with the chip capacitor 2 attached to the base 6, the terminals 5, 5, 5, 5 are inserted into corresponding terminal insertion holes of a board (not shown) of an electric / electronic component to perform a dipping process. Soldered.

The temperature of the solder during the dipping process is set higher than usual, and the processing time is set longer than usual, so that each of the terminals 5, 5, 5, 5 and both electrodes 3 of the chip capacitor 2,
4 was melted, and after a lapse of a predetermined time, a short-circuit test by energization was performed. After the dip treatment, no penetration of the solder into the recesses 13 and 13 was recognized, and no short circuit occurred in a subsequent energization test. After the test, the chip capacitor 2
Was removed, but no intrusion of solder into the space portions 19, 19 was observed. Therefore, the concave portions 13 and 13 and the convex portion 1
8 confirmed that the capillary action was effectively blocked.

The present invention can be variously modified without departing from the spirit of the present invention, and it goes without saying that the present invention extends to the modified ones.

[0017]

According to the first to third aspects of the present invention, as described in detail in the above-mentioned embodiment, the capillarity is cut off on the surface of the capacitor accommodating chamber corresponding to the capacitor chip, thereby preventing the capacitor chip from being damaged. Since a concave portion or a convex portion that regulates the wraparound of the solder between the two electrodes is provided, even if the solder between the capacitor chip and the terminal is re-melted due to heat such as a dipping process, the wraparound of the molten solder is prevented. Thus, the present invention has an extremely large effect, for example, it is possible to prevent a short circuit of the capacitor chip.

[Brief description of the drawings]

FIG. 1 is an explanatory perspective view showing a structure of a chip capacitor device according to a first embodiment of the present invention.

FIG. 2 is an explanatory perspective view showing a structure of a chip capacitor device according to a second embodiment of the present invention.

FIG. 3 is an explanatory perspective view showing the structure of another chip capacitor device according to another embodiment of the present invention.

FIG. 4 is an explanatory perspective view showing a preferred embodiment of a chip capacitor device according to the present invention.

FIG. 5 is an explanatory perspective view showing the structure of a conventional chip capacitor device.

[Explanation of symbols]

 2A capacitor chip 5 terminal of chip capacitor 5A base end 6 base 7 capacitor accommodating chamber 8 groove 9 through hole 15 upper surface of base 12 inner peripheral wall 13 concave portion 18 convex portion

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuo Iwasa Fukuoka Prefecture, Iizuka City, Odate Tateiwa character, 1049 Oda, Kyushu Mitsumi Co., Ltd. State Mitsumi Corporation

Claims (3)

[Claims] 1. A base end of an L-shaped terminal is soldered substantially horizontally to each electrode of a rectangular capacitor chip having an anode at one end and a cathode at the other end. After the tip side from the base end of the electrode is substantially aligned in the vertical direction, the capacitor chip and the terminal are fitted into the resin base from above, and each terminal is inserted into the terminal insertion hole of the board of the electric / electronic component. In a chip capacitor device configured to be inserted and soldered, the upper surface of the base is depressed to form a capacitor accommodating chamber for supporting the capacitor chip by being inserted from above, and the capacitor accommodating chamber is centered on the capacitor accommodating chamber. A through hole is formed in an outer portion of the base so as to vertically penetrate and insert the distal end of the terminal, and a groove for supporting the base end of the terminal by being inserted into the upper surface of the base from above is recessed. When set On the corresponding surface between the peripheral wall of the capacitor chamber and the capacitor chip, a concave portion or a convex portion for blocking the capillary phenomenon and restricting the solder from flowing between both electrodes of the capacitor chip is formed along the vertical direction. A chip capacitor device, characterized in that: 2. The chip capacitor device according to claim 1, wherein a concave portion or a convex portion is provided on an inner bottom surface of the capacitor accommodating chamber to block a capillary phenomenon between the capacitor chip and a lower surface of the capacitor chip. 3. A base end of a terminal bent in an L shape is soldered substantially horizontally to each electrode of a rectangular capacitor chip having an anode at one end and a cathode at the other end. After the tip side from the base end of the electrode is substantially aligned in the vertical direction, the capacitor chip and the terminal are fitted into the resin base from above, and each terminal is inserted into the terminal insertion hole of the board of the electric / electronic component. In a chip capacitor device configured to be inserted and soldered, the upper surface of the base is depressed to form a capacitor accommodating chamber for supporting the capacitor chip by being inserted from above, and the capacitor accommodating chamber is centered on the capacitor accommodating chamber. A through hole is formed in an outer portion of the base so as to vertically penetrate and insert the distal end of the terminal, and a groove for supporting the base end of the terminal by being inserted into the upper surface of the base from above is recessed. When set Wherein a concave portion or a convex portion is provided on a surface of the capacitor accommodating chamber corresponding to the capacitor chip so as to block a capillary phenomenon and to restrict a solder from flowing between both electrodes of the capacitor chip. .