JP2000263753A - Printing method, printing device, wiring board and manufacture thereof, semiconductor device and manufacture thereof, circuit board and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printing method by which the screen separation is con trolled in screen process printing, a printing device, a wiring board and a manu facturing method therefor, a semiconductor device and a manufacturing method therefor, a circuit board and electronic device. SOLUTION: This printing method comprises a first step to arrange a mask 12 which is flexible with an opening for printing formed and an object to be printed 30 by bringing the mask 12 into contact with the object 30, a second step to supply paste to the surface of the object 30 by filling the opening part of the mask 12 with the paste and a third step to peel the mask 12 from the object 30 while regulating the deflection of the mask 12 and print the paste on the object 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a printing method, a printing apparatus, a wiring board and a method of manufacturing the same, a semiconductor device and a method of manufacturing the same, a circuit board, and an electronic apparatus.

[0002]

BACKGROUND OF THE INVENTION Screen printing includes a squeezing step and a plate release step. In the squeegeeing step, the paste is rolled on the mask using a squeegee, the paste is filled into the openings of the mask, and the paste is brought into close contact with the print target. Subsequently, in the plate separation step, the mask is peeled off while transferring the paste filled in the openings of the mask to the printing target.

There are two types of screen printing: off-contact printing and contact printing. The former is a method of performing printing by providing a gap between a mask and an object to be printed, and is not suitable for fine printing. In many cases, the latter method was applied. In contact printing, it was necessary to reduce the plate separation speed in the plate separation step. Specifically, in order to reduce the force with which the paste tends to remain in the opening of the mask, it was necessary to slowly peel off the mask.

[0004] However, in the plate separation step of contact printing, the mask comes into close contact with the printing object, so that plate separation suddenly occurs at a certain point. Therefore, it has been difficult to perform plate separation control.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a printing method, a printing apparatus, a wiring board and a method of manufacturing the same, and a semiconductor device and a method of manufacturing the same, which can control separation of a plate in screen printing. A method, a circuit board, and an electronic device are provided.

[0006]

(1) In a printing method according to the present invention, a first step in which a flexible mask having a printing opening formed therein and a printing target are brought into contact with each other is arranged. Filling a paste into the opening of the mask, supplying the paste onto the printing target, and peeling the printing target and the mask while controlling the deflection of the mask. And printing the paste on the printing object.

According to the present invention, the contact between the mask and the object to be printed is made, so that the contact printing of the screen printing is performed. In the contact printing, when the paste is filled in the opening of the mask, the mask and the printing target are in close contact with each other, and it is difficult for the plate to separate. In the present invention, since the deflection of the mask is regulated in the third step, the mask and the printing object are not suddenly separated in the plate separating step. As a result, the separation speed can be controlled, and as a result, good printing can be performed.

(2) In this printing method, the mask is formed larger than the object to be printed, and in a third step, bending of a portion of the mask outside the object to be printed is prevented. The deflection of the entire mask may be restricted.

(3) In this printing method, in the third step, at least one of the printing object and the mask is moved in a direction substantially perpendicular to a contact surface of the mask with the printing object. You may peel off.

[0010] By peeling the print object and the mask in such a direction, the paste can be easily removed.

(4) In this printing method, in the third step, a surface of the mask that is in contact with the printing object may be supported.

By doing so, the deflection of the mask can be prevented.

(5) In this printing method, the object to be printed is a semiconductor wafer on which a plurality of electrodes are formed, the paste is a metal paste, and the metal paste may be printed on the electrodes. .

By doing so, the metal paste can be provided on the electrode of the semiconductor wafer.

(6) In this printing method, the mask may be provided inside the frame via an elastic member.

According to this, the mask is easily bent via the elastic member. Therefore, in the squeezing process, the mask easily follows the printing surface of the printing target, and the paste is easily supplied to the printing surface.

(7) In the method for manufacturing a wiring board according to the present invention, a flexible mask having an opening for printing formed thereon and a substrate on which a wiring pattern is formed are placed in contact with each other. A first step, a second step of filling the opening of the mask with a metal paste, and supplying the metal paste to at least a part of the wiring pattern, and controlling the bending of the mask while maintaining the substrate and the mask. And printing the metal paste on at least a part of the wiring pattern.

According to the present invention, since the mask and the substrate are in contact with each other, contact printing of screen printing is performed. In contact printing, when the metal paste is filled in the openings of the mask, the mask and the substrate are in close contact with each other and the plate is not easily separated. In the present invention, since the deflection of the mask is regulated in the third step, the mask and the substrate are not suddenly separated in the plate separation step. As a result, the separation speed can be controlled, and as a result, good printing can be performed.

(8) In this method of manufacturing a wiring board,
The mask may be formed larger than the substrate, and in a third step, the bending of the entire mask may be restricted by preventing a portion of the mask outside the substrate from being bent.

(9) In this method of manufacturing a wiring board,
In the third step, at least one of the substrate and the mask may be removed by moving the mask in a direction substantially perpendicular to a contact surface of the mask with the substrate.

By peeling the substrate and the mask in such a direction, the metal paste can be easily removed.

(10) In this method of manufacturing a wiring board, in the third step, a surface of the mask that is in contact with the substrate may be supported.

By doing so, the deflection of the mask can be prevented.

(11) In this method of manufacturing a wiring board, the mask may be provided inside the frame via an elastic member.

According to this, the mask is easily bent via the elastic member. Therefore, in the squeezing step, the mask easily follows the surface of the wiring pattern of the substrate, and the paste is easily supplied to the wiring pattern.

(12) A method of manufacturing a semiconductor device according to the present invention includes a step of mounting a semiconductor chip on a wiring board manufactured by the above method.

According to this, a semiconductor chip is mounted on the wiring board to form a semiconductor device.

(13) In the method of manufacturing a semiconductor device according to the present invention, a flexible mask having an opening for printing is formed, a plurality of integrated circuits are formed, and a plurality of integrated circuits are formed. A first step of contacting and arranging a semiconductor wafer on which an electrode is formed, a second step of filling a metal paste into the opening of the mask, and supplying the metal paste onto the electrode; A third step of peeling the semiconductor wafer and the mask and printing the metal paste on the electrodes while regulating the deflection of the mask, and a third step of heating the semiconductor wafer and solidifying or melting the metal paste. And a fifth step of cutting the semiconductor wafer into individual pieces for each integrated circuit.

According to the present invention, since the mask and the semiconductor wafer are in contact with each other, the contact printing of the screen printing is performed. In contact printing, when the metal paste is filled in the openings of the mask, the mask and the semiconductor wafer are in close contact with each other, and it is difficult to separate the plate. In particular, since the surface of the semiconductor wafer has high flatness, the adhesion is high. In the present invention, since the deflection of the mask is regulated in the third step, the mask and the semiconductor wafer are not suddenly separated in the plate separation step. As a result, the separation speed can be controlled, and as a result, good printing can be performed.

(14) In this method of manufacturing a semiconductor device, the mask is formed larger than the semiconductor wafer, and in a third step, bending of a portion of the mask outside the semiconductor wafer is prevented. The deflection of the entire mask may be restricted.

(15) In this method of manufacturing a semiconductor device, in the third step, at least one of the semiconductor wafer and the mask is moved in a direction substantially perpendicular to a contact surface of the mask with the semiconductor wafer. May be peeled off.

By peeling the substrate and the mask in such a direction, the metal paste can be easily removed.

(16) In this method of manufacturing a semiconductor device, in the third step, the surface of the mask on the side in contact with the semiconductor wafer may be supported.

This makes it possible to prevent the mask from bending.

(17) In this method of manufacturing a semiconductor device, the mask may be provided inside the frame via an elastic member.

(18) The wiring board according to the present invention is manufactured by the above method.

(19) The semiconductor device according to the present invention is manufactured by the above method.

(20) The circuit board according to the present invention uses the above wiring board.

(21) The semiconductor device is mounted on a circuit board according to the present invention.

(22) An electronic device according to the present invention includes the above wiring board.

(23) An electronic apparatus according to the present invention includes the above semiconductor device.

(24) A printing apparatus according to the present invention includes a mask having a flexible opening formed with a printing opening, a squeegee for filling the opening of the mask with a paste, and a mask. A support member that is arranged around a small printing target and supports the mask to regulate the bending,
including.

According to the present invention, screen printing can be performed using a mask and a squeegee. In contact printing of screen printing, the mask and the printing target come into contact with each other. Therefore, when the opening of the mask is filled with the paste, the mask and the printing target are in close contact with each other, and the plate is not easily separated. According to the present invention, since the deflection of the mask is regulated by the support member, the mask and the printing object are not suddenly separated from each other in the plate separating step. As a result, the separation speed can be controlled, and as a result, good printing can be performed.

(25) In this method of manufacturing a semiconductor device, the support member may restrict the deflection of the mask as a whole by preventing a portion of the mask outside the object to be printed. .

(26) In this printing apparatus, the mask is brought into contact with the printing object, the paste is filled in the opening, and the paste is supplied onto the printing object so that the printing object adheres to the printing object. A peeling unit for peeling the object and the mask may be included.

(27) In this printing apparatus, the peeling means moves at least one of the printing object and the mask in a direction substantially perpendicular to a contact surface of the mask with the printing object. You may peel off.

By peeling the printing object and the mask in such a direction, the paste can be easily removed.

(28) In this printing apparatus, the mask is supported at a predetermined position, and the peeling means holds the printing object substantially perpendicular to a contact surface of the mask with the printing object. You may move in the direction and peel.

(29) In this printing apparatus, the mask may be provided inside the frame via an elastic member.

According to this, the mask is easily bent via the elastic member. Therefore, in the squeezing process, the mask easily follows the printing surface of the printing target, and the paste is easily supplied to the printing surface.

[0051]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIGS. 1 to 6 are diagrams for explaining a printing method according to a first embodiment of the present invention. FIG. 1 is a plan view of a printing apparatus used in this printing method, and FIG. 2 is a sectional view taken along line II-II of FIG. The printing device 10 includes a mask 12, a squeegee 14 (see FIG. 3), and a support member 16. The printing device 10
Includes not only fully or partially automated devices, but also jigs that perform all operations manually.

The mask 12 can be formed of a steel plate or a resin, and preferably has flexibility so as to correspond to a printing surface of a printing object. The mask 12 made of metal is a metal part. The mask 12 is 100 mm ×
It can be formed in a size of about 100 mm to 1000 mm × 1000 mm. The mask 12 is 20 μm to 0.50 m
Preferably, the thickness is about m. The mask 12
A plurality of openings 18 are formed. Each opening 18
It can be formed by etching, laser, plating, or the like. Each opening 18 is filled with a paste used for printing. Here, the paste includes a metal paste such as a solder paste, a silver paste, a copper paste, and a nickel paste, in addition to the ink.

For example, QFP (Quad Flat Package)
When solder is applied to a wiring pattern of a circuit board on which a semiconductor device of a type is mounted by applying the present invention, the shape of the opening 18 is rectangular. Specifically, the shape of the opening 18 is a rectangle of 2 mm or less × 0.2 mm or less, and the plurality of openings 18 are arranged along the short side direction at an opening pitch of 0.4 mm or less. When the outer leads of the QFP type semiconductor device are provided on four sides, a plurality of openings 18 are formed along each of the four sides as shown in FIG. When the outer leads are provided on two sides, a plurality of openings 18 are formed along each of the two sides. Further, when corresponding to a plurality of semiconductor devices, a plurality of openings 18 are formed at a plurality of locations as shown in FIG.

The mask 12 is provided inside the frame 20 via the elastic member 18. The elastic member 18 is a suspension portion, and is formed of, for example, resin. The mask 12 is easily bent by the elastic member 18. The frame 20 is a mask frame, and is a rigid body made of aluminum, steel, or the like. The mask 12 is supported by the frame 20.

The mask 12 is supported at a predetermined position.
Specifically, the frame 20 that supports the mask 12 via the elastic member 18 is supported by the receiving member 24. The receiving member 24 is fixed by a member (not shown). The mask 12 is preferably located horizontally.

At a position facing one surface of the mask 12,
The print object 30 is arranged. For example, the print target 30 is arranged below the mask 12. The printing object 30 is arranged parallel to the mask 12. The printing target 30 is not particularly limited, and includes, for example, a substrate on which a wiring pattern is formed. This substrate may be a circuit board on which the semiconductor device is mounted, or a substrate (for example, a flexible substrate) forming a part of the semiconductor device. In this case, a metal paste can be provided on the wiring pattern to cover it, or solder can be provided.

The printing apparatus 10 may have means for automatically sending out the print object 30. For example, the transport target 26 automatically sends the print target 30 to a position facing the mask 12, and thereafter,
It may be sent to a position distant from. Specifically, the opening 18 of the mask 12, the print target area of the print target 30,
It is preferable that the print target 30 is sent out to a position where the print object 30 faces. Also, at a position facing the mask 12,
The position of the print target 30 may be adjusted. Conveying means 26
Transports the print target 30 at a position not in contact with the mask 12. The specific configuration of the transporting unit 26 may be a pair of belts as shown in FIG. The printing object 30 is stretched between the pair of belts. The printing target 30 moves by each belt being sent out at the same speed in the same direction.

The object 30 to be printed faces the mask 12 in a state of being in parallel and non-contact with the mask 12, and then comes into contact with the mask 12, and returns to the original state when the printing (contact printing) step is completed. Therefore, at least one of the printing target 30 and the mask 12 moves. For example, after the printing object 30 is arranged below the mask 12 in a parallel and non-contact state, the printing object 3 is
0 can be raised and lowered. The elevating means 28 is also used to peel off the printing object 30 that is in close contact with the mask 12.
Preferably, the mask 12 is supported in place and does not move. The lifting / lowering means (peeling means) 28
And lift it up and down. For example, lifting means (peeling means)
28 supports the surface of the printing object 30 opposite to the printing surface. The opening 18 of the mask 12 and the printing object 3
The print object 30 is located at a position where the print target area
It is preferable that the elevating means (peeling means) 28 elevate and lower the printing object 30 in a direction perpendicular to the printing surface without horizontal movement. In order to prevent the parallel movement of the printing object 30, that is, the displacement, it is preferable that the lifting / lowering means (peeling means) 28 is temporarily fixed by suctioning the printing object 30 or the like. Alternatively, the lifting / lowering means (peeling means) 28 may move the printing object 30 in parallel to adjust its position.

The support member 16 temporarily prevents the mask 12 from bending only when necessary. For example, when the print target 30 is smaller than the mask 12, the support member 16
Contacts the mask 12 around the printing object 30 to prevent the bending thereof. Specifically, the support member 16 contacts a surface of the mask 12 that contacts the printing surface of the print target 30. Further, when allowing the deflection of the mask 12,
The support member 16 is in a non-contact state with the mask 12. As described above, the support member 16 can be in contact with and not in contact with the mask 12. To that end, the support member 16 may be connected to a driving means. Support member 1
6 is preferably as close as possible to the printing object 30 in order to prevent bending. The shape of the support member 16 is not particularly limited, and may be a shape surrounding the printing object 30 or may be a shape contacting a plurality of portions of the mask 12 around the printing object 30. Further, the support member 16 may support not only the mask 12 but also the elastic member 20.

The squeegee 14 is provided at the opening 18 of the mask 12.
And a paste 32 (see FIG. 4), and a known paste can be used. The squeegee 14 may be automatically operated by driving means (not shown) or may be used manually.

The printing apparatus 10 according to the present embodiment is configured as described above, and a printing method (a method of manufacturing a wiring board or a semiconductor device) using the printing apparatus 10 will be described below. This printing method is contact printing in screen printing.

As shown in FIGS. 1 and 2, the printing object 30 is arranged at a position facing the mask 12. For example,
The printing object 30 is transported by the transport unit 26 of the printing apparatus 10. Further, the position may be adjusted so that the opening 18 of the mask 12 and the print target area of the print target 30 face each other. When the print target 30 is located below the mask 12, the print target area of the print target 30 is positioned immediately below the opening 18.

(First Step) As shown in FIG. 3, at least one of the printing object 30 and the mask 12 is moved,
Contact both. For example, the position of the mask 12 is fixed, and the printing target 30 is brought into contact with the mask 12 via the elevating means (peeling means) 28.

(Second Step) As shown in FIG. 4, a paste 32 is applied to the opening 18 of the mask 12 with a squeegee 14.
Fill. This step is a squeezing step. For example, when the printing object 30 is a substrate on which the wiring pattern 34 is formed, the paste 32 is
Supply on top. In this case, the paste 32 is a metal paste such as a solder paste. The paste 32 may be supplied on the entire surface of the wiring pattern 34 (excluding the side end surfaces), or may be supplied on a part thereof, for example, on a land portion. In this step, if the mask 12 is easily bent, the mask 12 can easily conform to the surface shape of the printing target 30.

When the paste 32 is filled in the opening 18 and supplied onto the printing object 30 in this manner, the mask 12 and the printing object 30 come into close contact with each other due to the viscosity of the paste 32 and the like.

(Third Step) Next, the mask 12 and the printing object 30 are peeled off while preventing the mask 12 from bending. This step is a plate separation step. For example, as shown in FIG. 5, the support member 16 is brought into contact with the contact surface of the mask 12 with the print target 30, and the print target 30 and the mask 12 are separated as shown in FIG.

More specifically, the mask 12 is formed to be larger than the printing object 30, and the support member 16 supports the mask 12 around the printing object 30. When the mask 12 and the printing object 30 are separated from each other, they are in close contact with each other by the paste 32.
Is prevented from bending. Then, as shown in FIG. 6, the position of the mask 12 is fixed, and the printing target 30 is moved in a direction away from the mask 12, so that the two can be separated. Since the movement of the printing object 30 is performed by the elevating unit 28, the elevating unit 28 serves as a peeling unit. It is preferable that the elevating means 28 holds the printing object 30 by suction or the like. Alternatively, the print object 3
The position of 0 may be fixed, and the mask 12 and the support member 16 may be moved.

It is preferable that at least one of the mask 12 and the printing object 30 move in a direction substantially perpendicular to the mask 12. By doing so, the plate removal property of the paste 32 filled in the opening 18 of the mask 12 is improved.

According to the present embodiment, since the mask 12 and the printing object 30 are separated while the bending of the mask 12 is prevented, both are not suddenly separated. Therefore, speed control of plate separation can be performed.

Through the above steps, printing on the printing object 30 can be performed. When the printing target 30 is a substrate on which the wiring pattern 34 is formed, and the paste 32 is a metal paste such as a solder paste, the wiring pattern 34 can be provided with a metal. A wiring board having the wiring pattern 34 covered with the metal can be manufactured. Alternatively, according to the present embodiment, solder for mounting electronic components such as a semiconductor device can be provided by printing.

FIG. 7 is a diagram showing a wiring board manufactured by a method to which the present invention is applied. The wiring substrate shown in FIG.
Are formed, and the wiring pattern 34 has a paste 32
Is provided. As the paste 32, a metal paste such as a solder paste is used. An electronic component such as a semiconductor device is mounted on the wiring pattern 34 on which the paste 32 is provided, and the metal paste is melted in a reflow process.
Electronic components can be mounted.

Alternatively, a semiconductor device can be manufactured using a wiring board manufactured by applying the present invention as an interposer. More specifically, a semiconductor device can be manufactured by manufacturing a wiring board by the above-described method and joining an electrode of a semiconductor chip to a wiring pattern provided with a metal paste.

FIG. 8 shows a circuit board on which a semiconductor device manufactured by applying the present invention is mounted. The semiconductor device 40 has a plurality of external terminals 42.
2 is joined to the wiring pattern 52 of the circuit board 50. Note that, as the circuit board 50, a wiring board manufactured by applying the present invention may be used. Generally, an organic substrate such as a glass epoxy substrate is used as the circuit board 50.

(Second Embodiment) FIG. 9 is a view showing a mask according to a second embodiment of the present invention.
A plurality of circular openings 62 are formed in the mask 60 shown in FIG. Other configurations are the same as those of the mask 12 according to the first embodiment.

The opening 62 has a diameter of 50 μm to 0.3 mm.
And an opening pitch of about 70 μm to 0.8 mm. With such a circular opening 62,
Circular printing can be performed. For example, CSP (Chip
Scale / Size Package or BGA (Ball Grid A)
In the process of manufacturing a wiring board (circuit board) for mounting a (ray) type semiconductor device, the mask 60 according to the present embodiment can be used when a metal paste is provided on a wiring pattern. Alternatively, the mask 60 according to the present embodiment can be used when a metal paste is provided on a wiring pattern in a process of manufacturing a wiring board as an interposer forming a part of a CSP type or BGA type semiconductor device. Alternatively, by applying the present invention, solder may be provided on the land portion of the wiring pattern and melted in a reflow process to form a solder ball as an external terminal. The external terminal 42 shown in FIG. 8 can be formed by this method.

(Third Embodiment) FIG. 10 is a diagram illustrating a method of manufacturing a semiconductor device according to a third embodiment of the present invention. In the present embodiment, a semiconductor wafer 80 in which a plurality of integrated circuits are formed and a plurality of electrodes 82 are formed for each integrated circuit is prepared. Then, a metal paste is provided on the electrodes 82 of the semiconductor wafer 80 by screen printing. For example, a solder paste is provided on the electrode 82, and this is used as a solder ball. Thereafter, the semiconductor wafer 80 is cut to manufacture a semiconductor device.

(First Step) As shown in FIG. 10, a mask 70 is brought into contact with the surface of the semiconductor wafer 80 on which the electrodes 82 are formed. A plurality of openings 72 corresponding to the electrodes 82 are formed in the mask 70, and other configurations are the same as those of the mask 12 of the first embodiment. The opening 72 of the mask 70 and the electrode 72 are aligned.

(Second Step) In the opening 72 of the mask 70,
A metal paste such as solder is filled, and the metal paste is supplied onto the electrode 82. The details may be the same as the steps shown in FIG.

(Third Step) The semiconductor wafer 80 and the mask 70 are peeled off while preventing the mask 70 from bending.
The details may be the same as the steps shown in FIGS. Thus, the metal paste can be provided on the electrode 82.

(Fourth Step) The semiconductor wafer 80 is heated to solidify or melt the metal paste. When a solder paste is used as the metal paste, it may be formed into a solder ball through a reflow process.

(Fifth Step) The semiconductor wafer 80 is cut into individual pieces for each integrated circuit. Thus, a plurality of semiconductor devices can be manufactured. Note that, before this cutting step, a step of packaging each semiconductor device may be included.

FIG. 11 shows a notebook personal computer as an electronic apparatus 100 having a semiconductor device to which the present invention is applied.

It should be noted that the constituent element "semiconductor chip" of the present invention is replaced with "electronic element", and an electronic element (whether active or passive) is mounted on a substrate in the same manner as a semiconductor chip. Parts can also be manufactured. Electronic components manufactured using such electronic elements include, for example, resistors, capacitors, coils, oscillators, filters, temperature sensors, thermistors, varistors, volumes, or fuses.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a printing apparatus according to a first embodiment to which the present invention has been applied.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a diagram illustrating a printing method according to a first embodiment to which the present invention is applied.

FIG. 4 is a diagram illustrating a printing method according to the first embodiment to which the present invention is applied.

FIG. 5 is a diagram illustrating a printing method according to the first embodiment to which the present invention is applied.

FIG. 6 is a diagram illustrating a printing method according to the first embodiment to which the present invention is applied.

FIG. 7 is a diagram showing a wiring board according to the embodiment of the present invention.

FIG. 8 is a diagram showing a circuit board on which the semiconductor device according to the embodiment of the present invention is mounted;

FIG. 9 is a diagram showing a mask according to a second embodiment to which the present invention is applied.

FIG. 10 is a diagram showing a mask according to a third embodiment to which the present invention is applied.

FIG. 11 is a diagram showing an electronic apparatus including a semiconductor device manufactured by applying the method according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Printing apparatus 12 Mask 14 Squeegee 16 Support member 18 Opening 20 Elastic member 22 Frame 28 Elevating means (peeling means) 30 Printed object 32 Paste 34 Wiring pattern 40 Semiconductor device 50 Circuit board

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C035 AA06 FA30 FC04 FC07 FD01 FF17 FF18 FF22 FF26 2H113 AA01 AA02 AA05 BA10 BA13 BB22 BC12 CA17 DA04 FA10 FA54

Claims (29)

[Claims] A first opening for forming a flexible mask and an object to be printed which are arranged in contact with each other;
A step of filling the opening of the mask with a paste and supplying the paste onto the object to be printed; and peeling the object to be printed from the mask while controlling the deflection of the mask. And printing the paste on the printing target. 2. The printing method according to claim 1, wherein the mask is formed larger than the object to be printed, and in a third step, bending of a portion of the mask outside the object to be printed is prevented. A printing method for restricting deflection of the entire mask. 3. The printing method according to claim 1, wherein in the third step, at least one of the printing target and the mask is substantially moved with respect to a contact surface of the mask with the printing target. A printing method that moves in a vertical direction and peels off. 4. The printing method according to claim 1, wherein, in the third step, a surface of the mask on a side in contact with the printing target is supported. 5. The printing method according to claim 1, wherein the object to be printed is a semiconductor wafer on which a plurality of electrodes are formed, the paste is a metal paste, A printing method for printing a metal paste on the electrode. 6. The printing method according to claim 1, wherein the mask is provided inside a frame via an elastic member. 7. A first step in which a flexible mask having an opening for printing formed thereon and a substrate on which a wiring pattern is formed are brought into contact with each other, and a metal is provided in the opening of the mask. A second step of filling the paste and supplying the metal paste to at least a part of the wiring pattern; and peeling off the substrate and the mask while restricting bending of the mask, thereby forming the wiring on the metal paste. And a third step of printing on at least a part of the pattern. 8. The method of manufacturing a wiring board according to claim 7, wherein the mask is formed to be larger than the substrate, and in a third step, bending of a portion of the mask outside the substrate is prevented. And a method of manufacturing a wiring board for restricting deflection of the entire mask. 9. The method for manufacturing a wiring board according to claim 7, wherein in the third step, at least one of the substrate and the mask is substantially perpendicular to a contact surface of the mask with the substrate. A method of manufacturing a wiring board which is moved in a desired direction and peeled off. 10. The method of manufacturing a wiring board according to claim 7, wherein in the third step, a surface of the mask on a side in contact with the substrate is supported. 11. The method for manufacturing a wiring board according to claim 7, wherein the mask is provided inside a frame via an elastic member. 12. A method of manufacturing a semiconductor device, comprising a step of mounting a semiconductor chip on a wiring board manufactured by the method according to claim 7. Description: 13. A flexible mask having an opening for printing formed thereon and a semiconductor wafer on which a plurality of integrated circuits are formed and a plurality of electrodes are formed for each integrated circuit. A second step of filling the opening of the mask with a metal paste and supplying the metal paste onto the electrodes; and a step of controlling the deflection of the mask while maintaining the bending of the mask. A third step of removing the mask and printing the metal paste on the electrodes, a fourth step of heating the semiconductor wafer and solidifying or melting the metal paste, and integrating the semiconductor wafers respectively. And a fifth step of cutting into individual pieces for each circuit. 14. The method for manufacturing a semiconductor device according to claim 13, wherein the mask is formed larger than the semiconductor wafer, and in a third step, bending of a portion of the mask outside the semiconductor wafer is prevented. A method of manufacturing a semiconductor device that restricts deflection of the entire mask. 15. The method for manufacturing a semiconductor device according to claim 13, wherein in the third step, at least one of the semiconductor wafer and the mask is brought into contact with a contact surface of the mask with the semiconductor wafer. A method for manufacturing a semiconductor device in which the semiconductor device is separated by being moved in a substantially vertical direction. 16. The method of manufacturing a semiconductor device according to claim 13, wherein in the third step, a surface of the mask on a side in contact with the semiconductor wafer is supported. . 17. The method of manufacturing a semiconductor device according to claim 13, wherein the mask is provided inside a frame via an elastic member. 18. A wiring board manufactured by the method according to claim 7. Description: 19. A semiconductor device manufactured by the method according to claim 12. Description: 20. A circuit board using the wiring board according to claim 18. 21. A circuit board on which the semiconductor device according to claim 19 is mounted. 22. An electronic device comprising the wiring board according to claim 18. 23. Electronic equipment comprising the semiconductor device according to claim 19. 24. A mask having an opening for printing and having flexibility, a squeegee for filling the opening of the mask with a paste, and being disposed around a printing target smaller than the mask. And a support member configured to support the mask and restrict deflection. 25. The method for manufacturing a semiconductor device according to claim 24, wherein the support member prevents the portion of the mask outside the print target from bending, thereby restricting the entire mask from bending. A method for manufacturing a semiconductor device. 26. The printing apparatus according to claim 24, wherein the mask is brought into contact with the print target, the paste is filled in the opening, and the paste is supplied onto the print target. A printing apparatus including a peeling unit for peeling off the printing object and the mask that have come into close contact with each other. 27. The printing apparatus according to claim 26, wherein the peeling unit moves at least one of the printing target and the mask in a direction substantially perpendicular to a contact surface of the mask with the printing target. A printing device that moves and separates. 28. The printing apparatus according to claim 26, wherein the mask is supported at a predetermined position, and the peeling unit moves the print target with respect to a contact surface of the mask with the print target. A printing device that moves in a substantially vertical direction and peels off. 29. The printing apparatus according to claim 24, wherein the mask is provided inside the frame via an elastic member.