JP2000260626A - Multiple chip inductor and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a multiple chip inductor which can possess a high performance as an inductor, facilitate its handling, and easily cope with its miniaturization, and a method for manufacturing the inductor. SOLUTION: The inductor has inductor elements 30 in which a spiral conductor pattern 18 is formed on a surface of an insulating base material 12 made of ceramics or magnetic material having at least its insulating surface, and electrodes 20 and 22 connected to the conductor pattern 12 are provided at both end of the base material 12. The inductor elements 30 are integrally coupled each other between the spiral conductor patterns 18 by molded bodies 32 of insulating resin or resin containing insulating magnetic material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple chip inductor in which a plurality of chip inductors each having a coil pattern formed of a conductive film formed on the surface of an insulating substrate are connected, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, chip inductors are disclosed in
As shown in JP-A-2020841 and FIG. 5, a rectangular base material 1 made of an insulating magnetic material or other material having at least a surface made of an insulating material.
The conductor film 3 was formed on the surface of the substrate, and the coil portion 5 was formed by forming the conductor film 3. The electrodes 4 are provided at both ends of the coil portion 5 and are formed on the surface of the circuit board so as to be surface mountable.

[0003]

In the case of the above-mentioned conventional technology, if the chip shape is reduced due to the demand for miniaturization and thinning of the electronic equipment, the mounting operation on the circuit board and the management of parts become troublesome, and the inductance value also decreases. There was a problem of becoming smaller. Although thin-film inductors are effective in reducing the thickness, performance such as inductance is inferior.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and provides a multiple chip inductor which has high performance as an inductor, is easy to handle, and can easily cope with miniaturization, and a method of manufacturing the same. The purpose is to provide.

[0005]

According to the present invention, a helical conductor pattern is formed on the surface of an insulating substrate such as ceramics or a magnetic material having at least an insulating surface, and the above-mentioned two ends are formed on both ends of the substrate. A multiple chip inductor includes an inductor element having an electrode connected to a conductor pattern, and a plurality of the inductor elements are connected.

[0006] In the inductor element, the spiral conductive patterns are integrally connected to each other by a resin molded product in which an insulating resin or a magnetic material is blended. Also,
The conductor pattern is covered with a resin containing an insulating resin or a magnetic material.

Further, according to the present invention, a conductive film is formed on the surface of an insulating base material such as ceramics or a magnetic material having at least an insulating surface, and spiral grooves are formed in the conductive film by laser trimming, etching or the like. The present invention provides a method of manufacturing a multi-chip inductor in which an inductor element having a conductor pattern formed by the above-mentioned spiral conductor film partitioned by the groove is provided, and a plurality of the inductor elements are integrally connected by a resin material. .

Further, according to a method of manufacturing a multiple chip inductor of the present invention, an insulating base material such as ceramics or a magnetic material having at least a surface insulated is provided, and openings are formed in the base material at predetermined intervals. A conductive film is formed on the surface of the base material including the side wall of the opening, and a spiral groove is formed in the conductive film on the surface of the base material by laser trimming, etching, or the like. A plurality of inductor elements having a conductor pattern of the conductor film are provided, a resin material is formed in openings of the base material, and the respective inductor elements are connected to each other, and thereafter, an excess portion of the base material is cut. do it,
A multiple chip inductor in which a plurality of inductor elements are integrally connected is manufactured.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 show a multiple chip inductor 10 according to a first embodiment of the present invention, in which an insulating film is applied to the surface of an insulating magnetic material or other magnetic material such as ceramic or ferrite. Lumber 1
2 On the four side surfaces of the base material 12, conductor films 14 of a metal thin film formed by copper plating or the like are provided. The conductor film 14 is formed with a groove 16 having a depth that reaches the base material 12.
They are separated from each other. The groove 16 is formed in a spiral shape from one end to the other end of the substrate 12, and a conductor pattern 18 is formed on the surface of the substrate 12 by the conductor film 14 partitioned by the groove 16. Is formed.

A coil portion 18 formed by a groove 16 in the base material 12
, Electrodes 20 and 22 are formed at both ends.
The conductor pattern 18 between the electrodes 20 and 22 is covered with a protective coating 24 made of an insulating resin or a resin containing a magnetic material. A plurality of inductor elements 30 each composed of an inductor using the conductor pattern 18 are integrally formed of a resin 32 containing an insulating resin or a magnetic material, and are connected to each other.

In the method of manufacturing a multiple chip inductor according to this embodiment, first, a ceramic material or the like is formed and fired,
A substrate 12 having a desired shape is formed. Then, the conductive film 14 is formed on the entire surface of the base material 12 by plating, vapor deposition, sputtering, or the like.
To form Next, a spiral groove 16 reaching the base material 12 is formed in the conductor film 14. The groove 16 is the groove 16
The conductor films 14 are insulated from each other and separated. As a result, the spiral coil-shaped conductor pattern 1 is provided between the electrodes 20 and 22.
8 are formed. The grooves 16 can be formed by etching, a cutter, a grindstone disk, or the like, in addition to laser light.
Further, the electrodes 20 and 22 at both ends of the base material 12 are subjected to solder plating or the like so as to cover the conductor film 16.

Next, a plurality of the inductor elements 30 are juxtaposed by, for example, three jigs, and a portion therebetween is formed of a resin 32. At the time of molding, it is integrally molded by a mold.
At this time, the protective coating 24 covering the surface of each conductor pattern 18 may be integrally formed. Further, the protective coating 24 may be applied in the state of the inductor element 30 or may be applied to the surface in a state where the multiple chip inductor 10 is formed. The protective coating 24 may be a resin containing a powder of a magnetic material.

The multiple chip inductor 10 of this embodiment
According to the above, the small inductor element 30 is a film type,
Since it can be easily formed into a small size by using a laser or the like, and a plurality of these are connected, the performance as an inductor can be adjusted in a circuit as appropriate. Furthermore, by using a multiple chip inductor, the size is increased to a certain extent, and handling and mounting are facilitated. In addition, by forming the protective coating 24 with the magnetic material-containing resin, the characteristics of the inductor are improved.

Next, a second embodiment of a multiple chip inductor and a method of manufacturing the same of the present invention will be described with reference to FIG. Here, the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. In the multiple chip inductor 40 of this embodiment, as shown in FIG. 3A, an insulating plate-shaped base material 42 such as ceramics or a magnetic material having at least a surface made insulating is provided. Openings 44 are formed at predetermined intervals, and the base material 4 including side walls of the openings 44 is formed.
The conductor film 46 is formed on the surface of the second substrate. A spiral groove 4 is formed in the conductive film 46 between the openings 44 of the base material 42.
8 is formed by a laser.

As a result, a spiral conductive film 46 partitioned by the groove 48 is formed, and a conductive pattern 50 of the conductive film 46 is provided. An inductor element 52 is formed by each conductor pattern 50, and the inductor element 5
2 are continuously provided.

Then, as shown in FIG.
The resin 54 is molded and filled in the central portion of the opening 44 of FIG.
This connects the respective inductor elements 52, and thereafter,
An excess portion of the base material 42 is cut to manufacture a multiple chip inductor 40 in which a plurality of inductor elements 52 are integrally connected as shown in FIG. At this time, an appropriate number of inductor elements 52 can be cut into a connected state. At this time, the protective coating 55 may be formed of a resin containing a magnetic material or the like or other resin except for the pair of electrodes 56 and 58. Alternatively, a resin containing a magnetic material may be directly used as the resin 54 at the center.

The multiple chip inductor 40 of this embodiment
According to this, the formation of the inductor element 52 can be performed continuously, and the number of the multiple elements can be adjusted by appropriately cutting the base material 42. Can be formed. In addition, the base material 4
2 is not limited to the one in which the inductor elements are formed in a line, and may be one in which the inductor elements can be formed vertically and horizontally.

Next, a third embodiment of a multiple chip inductor and a method of manufacturing the same of the present invention will be described with reference to FIGS. Here, the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. As shown in FIGS. 5 and 6, the multiple chip inductor 60 according to this embodiment is made of an insulating plate-shaped base material 62 such as ceramics or a magnetic material having at least a surface insulated. A plurality of openings 64 are formed at predetermined intervals, and a conductor film 66 is formed on the surface of the base 62. And, this base material 62
A spiral groove 68 is formed in the conductive film 66 between each of the openings 64.
Are formed by a laser.

As shown in FIG. 4, the base material 62 between the openings 64 has a hexagonal cross section, and a spiral groove 68 is formed in the hexagonal conductor. As a result, a spiral conductor film 66 partitioned by the groove 68 is formed, and a conductor pattern 70 is formed by the conductor film 66. Then, an inductor element 72 is formed by each conductor pattern 70, and a plurality of the inductor elements 72 are provided continuously.

In this case, as shown in FIG. 6, a resin 74 is molded and filled in the opening 64 of the base material 62. As a result, the respective inductor elements 72 are connected to each other, and thereafter, a surplus portion of the base material 72 is cut to manufacture the multiple chip inductor 60 in which the plurality of inductor elements 72 are integrally connected. At this time, an appropriate number of inductor elements 72 can be cut into a connected state. The inductor element 72 includes a protective film 80 made of a resin except for the pair of electrodes 56 and 58,
Further, the protective coating 82 is formed of a resin containing a magnetic material such as ferrite or the like or another resin.

The multiple chip inductor 60 of this embodiment
According to this, since the side surface of the inductor element 72 is inclined, the groove 82 can be formed from the front and back surfaces by laser. Therefore, the portion where the groove 82 of the inductor element 72 is formed may be a pentagonal cross section or a triangular cross section other than the hexagonal cross section. good. That is, it is only necessary that there is no side surface parallel to the laser irradiation direction.

Note that the present invention is not limited to the above embodiment, and the method of forming the inductor element can be appropriately selected, and the conductor pattern may be such that the inductance can be adjusted after the formation.

[0023]

According to the multiple chip inductor and the method of manufacturing the same of the present invention, since a plurality of inductor elements are connected, even if the inductor elements are downsized, the handling is easy and the mounting work is also easy.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a multiple chip inductor according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a connected state of the inductor element according to the first embodiment of the present invention.

FIG. 3 is a plan view showing a manufacturing process of a multiple chip inductor according to a second embodiment of the present invention.

FIG. 4 is a perspective view of a multiple chip inductor element according to a third embodiment of the present invention.

FIG. 5 is a longitudinal sectional view of a multiple chip inductor according to a third embodiment of the present invention.

FIG. 6 is a plan view showing a step of manufacturing the multiple chip inductor according to the third embodiment of the present invention.

FIG. 7 is a perspective view showing a conventional chip inductor.

[Explanation of symbols]

 10, 40, 60 Multiple chip inductor 12, 42, 62 Base material 14, 46, 66 Conductor film 16, 48, 68 Groove 18, 50, 70 Conductor pattern 20, 22, 56, 58 Electrode 24, 60, 80, 82 Protective coating 30, 52, 72 Inductor element 32, 54, 74 Resin

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yozo Ohara 3158 Shimo-Okubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture Inside Hokuriku Electric Industry Co., Ltd. F term in the company (reference) 5E070 AA01 AB02 BA07 CB01 CB12 CC01 CC03 DA15 EA01

Claims (5)

[Claims] A spiral conductive pattern is formed on the surface of an insulating base material, and an inductor element having electrodes connected to the conductive pattern at both ends of the base material is provided. Multiple chip inductors. 2. The inductor element according to claim 1, wherein the helical conductor patterns are integrally connected to each other by a molded resin material containing an insulating resin or a magnetic material.
A multiple chip inductor as described. 3. The multiple chip inductor according to claim 1, wherein the conductor pattern is covered with a resin containing a magnetic material. 4. A conductive film is formed on an insulating base material surface,
A spiral groove is formed in the conductor film, an inductor element having a conductor pattern formed by the spiral conductor film divided by the groove is provided, and a plurality of the inductor elements are integrally connected by a resin material. Manufacturing method for multiple chip inductors. 5. An insulating base material is provided, openings are formed at predetermined intervals in the base material, and a conductor film is formed on the base material surface including the side walls of the opening. A spiral groove is formed in the conductor film, a plurality of inductor elements having a conductor pattern formed by the spiral conductor film divided by the groove are provided, and a resin material is formed in the opening of the base material. A method of manufacturing a multiple chip inductor in which the inductor elements are connected to each other by cutting, and thereafter, a surplus portion of the base material is cut to integrally connect a plurality of inductor elements.