JP2000252659A - Solid state relay - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a high capacity socket mounting solid state relay SSR having enhanced compatibility with electromagnetic relay by employing a heat dissipation structure in the SSR. SOLUTION: A heat dissipation window 13 is made in a synthetic resin case 11 encasing a semiconductor power element 12, a control circuit, and the like, and a heat dissipation plate 40 is fixed to the semiconductor power element 12 through thermal coupling. The heat dissipation plate 40 is disposed to face the outside through the window 13 of the case 11 thus dissipating heat in the case 11 to the outside. Heat dissipation effect is enhanced by thermally coupling the heat dissipation plate 40 with a heat sink 50. Heat dissipation effect is enhanced furthermore by providing a spring member in the case 11 thereby bringing the heat dissipation plate 40 forcibly into contact with the heat sink 50 on the outer side face of the case 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket-mounted solid-state relay in which a semiconductor power element is housed in a synthetic resin case, and more particularly to a solid-state relay capable of increasing the heat radiation effect and increasing the capacity. Regarding state relay.

[0002]

2. Description of the Related Art Usually, a solid state relay (hereinafter referred to as S
SR) is mainly composed of a photocoupler and a semiconductor switch, and is used for on / off control of a load.
Its features are that the input and output are electrically separated by a photocoupler, so it is resistant to noise, and because there are no moving parts and there is no wear, it is quiet without noise and has high reliability, long life, Although it has various advantages such as being able to open and close frequently, it has the disadvantage that it is made of semiconductor, so that it consumes a large amount of power corresponding to the on-resistance of the relay contacts, and that it generates considerable heat and requires heat radiation. .

Accordingly, conventionally, as shown in FIG.
The SSR case 1 containing a semiconductor power element, a control circuit, and the like is provided with a DIN rail via a heat sink 2 made of a high heat conductive metal such as copper or aluminum in order to prevent damage due to heat and extend the life of components. 4 is generally mounted. In the figure, 3 is a DIN rail 4
This is a mounting member for directly mounting on a bottom surface or the like of the control panel without going through.

[0004] Recently, there has been a demand for a socket-mounted SSR as a substitute for a normal electromagnetic relay. As shown in FIG. 17, this socket-mounted SSR has a D
The resin case 1 that houses the SSR can be detachably attached to the resin socket 5 attached to the IN rail 4 via a plug pin (not shown).

[0005]

In the existing control panel, since the standard of the socket and peripheral space is standardized, as shown in FIG. 16, the SSR case 1 and the DIN rail 4 are used.
A structure that promotes the heat radiation effect by interposing the heat sink 2 between them cannot be adopted. Therefore, the socket mounting type SS accommodated in the resin case 1 shown in FIG.
In the case of R, since there is no escape place of heat, it is difficult to realize it unless it is about several amperes.

SUMMARY OF THE INVENTION An object of the present invention is to provide a socket-mounted SSR in which a semiconductor power element is housed in a synthetic resin case.
The goal is to achieve higher capacity and to increase compatibility with existing electromagnetic relays.

[0007]

In order to achieve the above object, an invention according to claim 1 of the present application is directed to a socket mounted solid state relay in which a semiconductor power element is housed in a synthetic resin case. A window is provided in the synthetic resin case, and a radiating portion thermally coupled to the semiconductor power element inside the case is exposed from the window.

Here, the “thermal coupling” is to reduce the thermal resistance at each joint of the heat generating material, the heat conductive material, and the heat radiating material,
By joining so that heat can be transferred efficiently, joining with an adhesive with good thermal conductivity, or using a flexible joint surface so that heat loss such as air gap does not occur at the joint Heat is transferred smoothly by sandwiching an interface material with good thermal conductivity, and is used for the purpose of enhancing the heat radiation effect. For example, as the interface material, an insulator, a gap filler, a heat conductive double-sided tape, a heat conductive compound, or the like can be considered.

Therefore, according to the first aspect of the present invention,
Since the heat radiating portion thermally coupled to the semiconductor power element communicates with the outside air through the window of the case, heat is radiated to the outside through the heat radiating portion without storing heat inside the case.

The invention according to claim 2 of the present application is characterized in that the heat radiating portion is a heat radiating plate made of a high heat conductive material having a heat radiating surface parallel to the window surface.

[0011] Examples of the high thermal conductive material include copper, aluminum, and alloys thereof.

Therefore, according to the second aspect of the present invention,
The heat in the case can be effectively radiated to the outside by utilizing the heat conduction characteristics of the heat sink.

[0013] The invention according to claim 3 of the present application is characterized in that the heat sink is thermally coupled to a heat sink provided outside the case.

Therefore, according to the third aspect of the present invention,
Since the heat radiating plate is thermally coupled to the heat sink, an even greater heat radiating effect can be obtained, the heat radiating characteristics of the SSR can be enhanced, and a high-capacity SSR can be used.

The invention described in claim 4 of the present application is characterized in that the heat radiating plate is biased so as to elastically protrude outside the case.

In the invention described in claim 5 of the present application, the window is provided on one or both of the opposite side plates of the case, and a heat sink having a U-shaped cross section is fitted on the outside of both side plates. The heat sink and the heat sink are thermally coupled.

Therefore, according to the fourth and fifth aspects of the present invention, the radiator plate thermally coupled to the semiconductor power element is elastically pressed against the heat sink attached to the outside of the case, and the radiator plate and the heat sink Are thermally coupled to each other, and the heat stored in the semiconductor power element is effectively radiated to the outside via the heat sink and the heat sink.

The invention described in claim 6 of the present application is characterized in that the heat radiating portion is a heat radiating plate made of a high heat conductive material having a pair of heat radiating surfaces perpendicular to the window surface and facing each other.

The invention according to claim 7 of the present application is characterized in that the pair of heat radiating surfaces of the heat radiating plate are elastically urged in directions approaching each other.

According to the invention described in claim 8 of the present application, the window is provided on the top plate of the case, a heat sink is arranged outside the top plate, and the heat receiving base of the heat sink is inserted into the case from the window. And is sandwiched by a pair of heat dissipation surfaces.

Therefore, according to the invention described in claim 8,
A heat receiving base of a heat sink inserted into the case is sandwiched between a pair of heat radiating surfaces, and heat stored in the semiconductor power element by heat conduction between the heat radiating surface and the heat receiving base is passed through the heat radiating surface. In addition, the heat is efficiently transmitted, and efficient heat radiation is performed, and the heat radiation surface can also have a heat sink supporting function.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the SSR according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 show a first embodiment of the SSR according to the present invention. FIG. 1 is a perspective view showing a state where the SSR is mounted, and FIG. It is a fragmentary sectional view.

In FIG. 1, the SSR 10 has a semiconductor power element 12 and a control circuit (not shown) incorporated in a synthetic resin case 11 and is detachably mounted on a socket 20, which is provided on the back surface. It is mounted on the rail 30 by a mounting bracket (not shown).

More specifically, as the rail 30, a DIN rail whose shape and dimensions are standardized according to the standard is used, and the rail 30 is fixed to a wall surface of a control panel or the like by tightening screws 31 at intervals in the longitudinal direction. , Socket 20
Is provided with a plurality of screw terminals 21 on the upper and lower sides, and an electric wire (not shown) is connected to the screw terminals 21.

Incidentally, the SSR 10 in this embodiment is
A rectangular window 13 is opened at the center of the top plate 11a of the synthetic resin case 11 and the synthetic resin case 1
A radiator plate 40 having excellent heat conduction characteristics, such as an aluminum alloy, is thermally coupled to the semiconductor power device 12 housed in the housing 1 and the semiconductor power device 12. 13 outside.
Reference numeral 121 denotes a terminal pin of the semiconductor power element 12.

Here, the heat sink 40 and the semiconductor power element 1
2 may be fixed with an epoxy-based adhesive, but it is preferable to interpose an interface material 41 in which particles such as aluminum oxide are filled in a silicone base material as shown in FIG. . Further, other thermal coupling means, for example, a method of fixing the thermal conductive pad with clips or screws or the like, or a method of using a heat conductive double-sided tape may be adopted.

As described above, according to the first embodiment, since the radiator plate 40 thermally coupled to the semiconductor power element 12 faces outside through the window 13 of the case 11, the radiator plate 4
By radiating heat from zero, the service life of the components of the SSR 10 can be prolonged and the SSR 10 can be prevented from being damaged.

Therefore, the SSR 10 can be used as a substitute for the electromagnetic relay by using the existing rail 30 and socket 20, and a window 13 is provided in the case 11 to take measures against heat generation, which is a unique defect of the SSR. By exposing the heat radiating plate 40 thermally coupled to the semiconductor power element 12 to the outside through the window 13, excellent heat radiating action can be obtained, and compatibility with the electromagnetic relay can be achieved.

The interior of the synthetic resin case 11 may be sealed with a resin or may have a hollow structure.
The semiconductor power element 12 is supported and fixed in the case 11 by a support mechanism (not shown).

Next, FIGS. 3 to 5 show a second embodiment of the present invention. FIG. 3 is an overall view showing the inside of a case showing an SSR mounted on a socket, and FIG. And FIG. 5 is a cross-sectional view showing a configuration of a heat radiating portion of the case in which the SSR with the increased SSR is attached to the socket.

First, the SSR 10 shown in FIG. 3 has windows 13 opened on both side plates 11 b of a synthetic resin case 11, and a radiator plate 40 thermally coupled to the semiconductor power element 12 corresponding to both windows 13. Is configured to face the outside through the window 13.

Therefore, in the first embodiment, the window 13 is opened in the top plate 11a of the synthetic resin case 11, but in the second embodiment, the synthetic resin case 1 is opened.
By opening the window 13 on both side plates 11b and increasing the heat radiation area of the heat radiation plate 40, a more excellent heat radiation effect can be expected, and the SS having a larger capacity than that of the first embodiment.
Applicable to R10. Note that the same configuration as in the first embodiment described above can be used for the internal configuration of the synthetic resin case 11, the mounting structure for the rail 30 and the socket 20, and the thermal coupling means, and thus detailed description is omitted.

Next, FIGS. 4 and 5 show the SSR according to the present invention.
10 shows a modified example of the second embodiment of FIG.
It is characterized in that a heat sink 50 is thermally coupled to the outer surface of the heat sink 0 to achieve a more efficient heat radiation action.

That is, as shown in FIGS. 4 and 5, a radiator plate 40 made of an aluminum alloy or the like is thermally coupled to the semiconductor power element 12 via an interface member 41 and provided on the side plate 11b of the synthetic resin case 11. The heat radiating plate 40 faces the outside from the window 13 which is the same as the embodiment shown in FIG.
Is formed as a large window 13 larger than the outer shape of the heat radiating plate 40, and a heat sink 50 is fixed to the outside of the side plate 11b of the synthetic resin case 11 by bonding or screwing. The heat sink base 51 and the heat sink 40 are thermally coupled.

In this embodiment, the heat sink 40 and the heat sink base 51 of the heat sink 50 are thermally coupled via the interface material 42 in which aluminum oxide is filled in a silicone base material having excellent thermal conductivity. The heat sink 50 is made of an aluminum alloy material and is formed by integrally molding a thick heat sink base portion 51 and a plurality of radiating fins 52 by extrusion, forging, or the like. Reference numeral 53 in FIG. Indicates a screw.

Therefore, according to this embodiment, the heat generated by the power loss and the like of the semiconductor power element 12 is efficiently transmitted to the radiator plate 40 and further transmitted to the heat sink 50 thermally coupled to the radiator plate 40. Therefore, the heat radiation according to the envelope volume of the heat radiation fins 52 of the heat sink 50 can be promoted, and the heat radiation of the SSR 10 can be more effectively achieved. In particular, the present invention can be applied to the large-capacity SSR 10 of 5 amps or more. It is possible.

FIGS. 6 to 10 show a third embodiment of the SSR according to the present invention. FIG. 6 is a front view showing a state where the SSR is mounted on the socket, and FIG. FIG. 8 is an explanatory view showing the internal configuration of the SSR, FIG. 9 is a side view of the case before attaching the heat sink, and FIG. 10 is an explanatory view showing the shape of the heat sink and the state in which the heat sink is attached to the case. .

In the third embodiment, in the SSR 10 of the socket mounted type, the heat radiation action of the large capacity type SSR 10 is further promoted, and the SSR 10 is mounted on the rail 30 as shown in FIGS. The SSR 10 is detachably attached to the socket 20 which is
Is characterized in that a U-shaped heat sink 50 is provided along the three surfaces of the top plate 11a and the side plate 11b of the synthetic resin case 11 so as to be thermally coupled to the heat generating portion in the case 11. Specifically, first, the case 11 has windows 13 opened in the side plates 11b, and the locking grooves 14 for engaging the heat sink 50 are formed on the top plate 11a of the case 11 and the three end plates 11b. It is formed in an elongated shape at the location.

In FIG. 9, reference numeral 15 denotes a plurality of plug pins, and reference numeral 16 denotes a center column for positioning.

The case 11 has a hollow structure, is not sealed with a resin, and has a top plate 11 of the case 11.
a, A spring material 60 having excellent thermal conductivity is accommodated along the inner surface of the side plate 11b (see FIG. 8). This spring material 60
Although an aluminum alloy having excellent thermal conductivity is also preferable, the material is not particularly limited as long as it has spring properties and high thermal conductivity. The spring material 60 is a portion corresponding to the window 13 of the case 11. Projections 61 are provided on the left and right sides so as to protrude to the outside, and a radiator plate 40 thermally coupled to the semiconductor power element 12 is also fixed to the inner surface side of the projection 61 by thermal coupling.

Further, since the spring member 60 is spring-biased in the direction of the arrow shown in FIG. 8, the portion where the heat radiating plate 40 attached to the semiconductor power element 12 is installed (the protrusion 6).
1) is always urged in a direction to protrude outward.

Next, the heat sink 50 fitted to the top plate 11a and the side plate 11b of the case 11 is shown in FIG.
(A) and (b), as shown in FIG.
1 has a U-shaped cross section and surrounds three surfaces of the case 11, and the heat sink base portion 51 is provided with radiating fins 52 projecting from the heat sink base 51 so as to secure a desired envelope volume. A ridge 54 is provided at a position corresponding to the locking groove 14 provided on the plate 11a and the side plate 11b. This heat sink 50 is also formed into a required shape by extrusion, forging, or the like. In this embodiment, as shown in FIG. 10C, the heat sink 50 is surrounded by the top plate 11a and the side plate 11b of the case 11. If attached, the protrusions 54 provided at three places of the heat sink 50 can be fitted into the locking grooves 14 of the case 11 and attached with one touch.

When the heat sink 50 is attached to the outer surface of the case 11, the protrusions 61 of the spring material 60 pass through the window 13 of the case 11 and
Of the heat sink 50 and the spring member 60, and the spring pressure of the spring member 60 is applied.
1 is in a strong contact state, and the heat generated by the heat generated by the semiconductor power element 12 is transmitted to the heat radiating plate 40 and the spring member 60, and then is effectively transmitted to the heat sink 50. A large heat dissipation effect can be expected depending on the volume.

Therefore, according to this embodiment, although a little heat sink space is required to secure the envelope volume of the heat sink 50, the heat generated by the SSR 10 can be effectively radiated to the outside, and the heat sink 50 can be attached. The practical value is that it can be done with just one touch. If the contact surface is coated with a heat conductive paint or the like so that the connection surface between the spring member 60 and the heat sink 50 is thermally coupled, heat radiation can be more efficiently promoted.

Next, FIG. 11 to FIG. 15 show S according to the present invention.
FIG. 11 shows a fourth embodiment of SR10, and FIG.
FIG. 12 is a side view of the SSR mounted on the socket, FIG. 13 is a perspective view showing the internal configuration of the SSR, FIG. 14 (a) is a front view of the case, FIG.
FIG. 15B is a side view of the case, and FIG. 15 is an explanatory view showing a state where a heat sink is mounted on the case.

In the fourth embodiment, FIG.
As shown in FIG. 12, after the SSR 10 is mounted on the socket 20 mounted on the rail 13, the heat sink 50 is mounted on the top plate 11 a of the case 11 of the SSR 10.

First, the structure of the case 11 is shown in FIG.
Referring to FIG. 14, an elongated window 13 is opened substantially vertically in the center of the top plate 11 a of the case 11, and the top plate 11 a and the side plate 11 b of the case 11 are provided inside the case 11. A spring member 60 is provided along the inner wall surface of the bottom plate 11c. A heat sink 40 attached to the semiconductor power element 12 is thermally coupled to the inner surface of the spring member 60, A pair of plate-shaped support portions 62 having an interval equal to the width of the window 13 are bent inward to correspond to the window 13 of the case 11. The spring member 60 is characterized in that it is spring-biased in a direction in which the pair of support portions 62 approach each other, as shown by the arrow direction in FIG.

On the other hand, in the heat sink 50 attached to the case 11, a thick insertion plate portion 55 is integrally formed substantially at the center of the heat sink base portion 51 having a plurality of heat radiation fins 52 on the side opposite to the heat radiation fins. The heat sink 50 may be formed by either extrusion molding or forging.

When the insertion plate portion 55 is inserted into the window 13 provided on the top plate 11a of the case 11, both sides of the thick insertion plate portion 55 are sandwiched by the support portions 62 of the spring material 60. The insertion plate portion 55 of the heat sink 50 functions as a heat receiving base piece and a spring material 60.
Support portion 62 functions as a heat radiating portion.

As a result, the heat of the semiconductor power element 12 in the case 11 is applied to the radiator plate 40 and the spring member 60, and the heat sink 5 in strong contact with the support portion 62 of the spring member 60.
The heat is transmitted to the zero insertion plate portion 56 and is effectively radiated to the outside through the heat sink 50, so that efficient heat radiation can be performed. In this embodiment, if the contact surface between the insertion plate portion 55 and the support portion 62 is coated with a coating material having excellent heat conductivity,
The heat coupling can further improve the heat radiation effect.

Therefore, according to the fourth embodiment, there is an advantage that the space for the heat sink 50 can be reduced and the mounting structure of the heat sink 50 can be simplified.

[0053]

As is apparent from the above description, in a socket-mounted SSR in which a semiconductor power element is housed in a synthetic resin case, a heat dissipation window is provided in the case.
A radiating structure was adopted in which the radiating part thermally coupled with the semiconductor power element was exposed to the outside from the window to provide a radiating function, and a heat sink that was thermally coupled with this radiating part to further enhance the radiation effect was thermally coupled. This has the effect that the capacity of the socket-mounted SSR can be increased and the compatibility with the electromagnetic relay can be increased.

[Brief description of the drawings]

FIG. 1 is an overall view showing a first embodiment of an SSR according to the present invention.

FIG. 2 is a partial cross-sectional view illustrating a configuration of a heat radiating unit in the SSR in FIG.

FIG. 3 is an overall perspective view of the inside of a case showing a second embodiment of the SSR according to the present invention.

FIG. 4 is an overall perspective view of the inside of a case showing a modification of the SSR shown in FIG. 3;

FIG. 5 is a partial cross-sectional view showing a structure of a heat radiating portion in the SSR shown in FIG.

FIG. 6 is a front view of the third embodiment of the SSR according to the present invention, showing a state where the SSR is mounted on a socket.

FIG. 7 is a side view showing a state where the SSR shown in FIG. 6 is mounted on a socket.

FIG. 8 is an explanatory diagram showing a state in which the inside of a case in the SSR shown in FIG. 6 is seen through;

FIG. 9 is a side view showing the SSR shown in FIG. 6;

10A is a front view of a heat sink attached to the SSR shown in FIG. 6, FIG. 10B is a plan view of the heat sink,
(C) It is explanatory drawing which shows the state which attaches the heat sink to SSR.

FIG. 11 is a front view of a fourth embodiment of the SSR according to the present invention, showing a state where the SSR is mounted on a socket.

FIG. 12 is a side view showing a state where the SSR shown in FIG. 11 is attached to a socket.

FIG. 13 is an explanatory diagram showing a state in which the inside of the case of the SSR shown in FIG. 11 is seen through;

14A is a front view of the SSR shown in FIG. 11,
(B) is a side view.

FIG. 15 is a side view showing a state where a heat sink is attached to the SSR shown in FIG. 11;

FIG. 16 is a perspective view showing a conventional SSR.

FIG. 17 is a perspective view showing a conventional socket-mounted SSR.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 SSR 11 Synthetic resin case 12 Semiconductor power element 13 Window 14 Locking groove 20 Socket 21 Threaded terminal 30 Rail 31 Screw 40 Heat radiating plate 41, 42 Interface material 50 Heat sink 51 Heat sink base part 52 Heat radiating fin 55 Insert plate part 60 Spring material 61 Projection 62 Support

Claims (8)

[Claims] 1. A socket-mounted solid state relay in which a semiconductor power element is accommodated in a synthetic resin case, wherein a window is provided in the synthetic resin case, and the window is thermally coupled to the semiconductor power element inside the case. A solid state relay that features a radiating section. 2. The solid state relay according to claim 1, wherein the heat radiating portion is a heat radiating plate having a heat radiating surface parallel to the window surface and made of a high heat conductive material. 3. The heat radiating plate is thermally coupled to a heat sink provided outside the case.
Solid-state relay described in. 4. The solid state relay according to claim 2, wherein the heat radiating plate is biased so as to elastically protrude outside the case. 5. A window is provided on one or both of the opposite side plates of the case, and a heat sink having a U-shaped cross section is fitted to the outside of the both side plates, and the heat sink and the heat sink are thermally coupled. The solid state relay according to claim 4, wherein: 6. The solid state relay according to claim 1, wherein the heat radiating portion is a heat radiating plate made of a high heat conductive material having a pair of heat radiating surfaces perpendicular to the window surface and facing each other. 7. The solid state relay according to claim 6, wherein a pair of heat radiating surfaces of the heat radiating plate are elastically urged in directions approaching each other. 8. A window is provided on a top plate of the case, a heat sink is arranged outside the top plate, and a heat receiving base of the heat sink is inserted into the case from the window and is sandwiched by a pair of heat radiation surfaces. The solid state relay according to claim 1, wherein: