JP2000246692A - Punching device for tape-form object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately judge a punched pattern and a burr shape pattern in a board area even if the number of holes set within the board area of a tape-form object is increased to make the holes minute. SOLUTION: A punching part 2 comprising punching units 2a-2d is provided between a delivery mechanism 5 for a tape-form object (a) and a tape winding mechanism 6 for the tape-form object (a). The punching part 2 is constituted to be controllable to move in both X-Y axis directions. An upper image pickup part 3 for picking up images from above every base area of the tape-form object (a) while controlling to move the punching part 2 in both X-Y axis directions is provided downstream of the punching part 2, and an image processing part is provided to analyze the image picked up by the upper image pickup part 3 to judge the quality of punched pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punching device for setting a large number of substrate areas such as chip size packages on a TAB tape or the like, and for punching small holes in each of these substrate areas. The present invention relates to a perforation apparatus that recognizes a perforation pattern perforated in an area and determines the quality of the perforation pattern.

[0002]

2. Description of the Related Art In a conventional punching apparatus, an appropriate number of substrate areas are set in a TAB tape or the like (35 mm width or 70 mm width) in a state of being arranged vertically and horizontally and include a plurality of punching units. Some of the perforated portions perforate a large number of holes of a predetermined shape at predetermined positions in the substrate area. Further, some conventional punching devices include an imaging unit that captures an image of the tape-like material from above, and captures the tape-like material in which each substrate area is set, over the entire tape width, on the downstream side of the above-described punching unit. Some are provided. Then, by performing image analysis on the image of the tape-shaped object imaged by the imaging unit, the perforation pattern of each substrate area perforated by the perforation unit is recognized over the entire tape-shaped object, and the perforation pattern of the perforated pattern is recognized. In some cases, the function of judging the quality of the drilling pattern is provided by comparing the quality of the drilling pattern with a previously registered drilling pattern.

[0003]

By the way, in the current substrate area of a chip size package or the like, since the work is getting smaller, the number of holes to be drilled in the substrate area becomes very large. For example, it is required to drill about 1000 holes of 80 μm to 125 μm in a substrate area of 10 mm. However,
The conventional punching apparatus as described above recognizes a punching pattern of holes punched in a plurality of substrate areas set in each substrate area while capturing and analyzing an image of the entire tape width of the tape-shaped object. Therefore, the range of imaging that is inevitably recognized is widened, and as a result, the magnification of imaging is low. Therefore, as described above, when the perforation pattern of each substrate area is very fine and the number of holes is large, it is difficult to recognize the perforation pattern accurately, and the substrate on which the holes of the above order (about 1000 holes) are perforated. It has never been possible to accurately recognize the perforation pattern in the area and determine the quality of the perforation pattern.

Further, in a conventional tape-shaped material punching apparatus, the state of setting of a punch and a die of a punching machine constituting a punching section is determined by a method similar to the above-described method of determining the quality of a punching pattern. Then, pattern matching of the shape of the burrs protruding from the back surface of the substrate area of the tape-like material was performed and confirmed. However, as mentioned above,
When the number of holes drilled in the substrate area is large and fine, it is difficult to recognize the shape of the burr projecting to the back surface at the time of drilling, and at the same time, it is difficult to determine the state of the punch and the die.

An object of the present invention is to provide an apparatus for punching a tape-like object as described above, and even if the number of holes set in the substrate area of the tape-like object increases and becomes finer, the number of holes in the substrate area increases. It is an object of the present invention to rationally provide a function capable of accurately judging a perforation pattern and a shape pattern of a burr projecting from the back surface of the substrate area.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a tape-shaped object punching device according to the present invention is provided in a substrate area of a chip-size package or the like which is set vertically and horizontally on the surface of the tape-shaped object. A tape-shaped material punching device for punching a large number of fine holes, comprising a plurality of tape feeding mechanisms for feeding a roll-shaped tape-shaped material and a tape winding mechanism for winding the fed tape-shaped material. A punching unit comprising a punching unit is provided.
An upper imaging unit which is configured to be controllably movable in both Y-axis directions, and which captures an image of each substrate area of the tape-like material from above while controlling and moving in both X and Y-axis directions downstream of the perforated portion; Provided, image analysis of the image captured by the upper imaging unit, recognize the perforation pattern performed in the perforation unit,
An image processing unit for judging the quality of the perforation pattern is provided.

According to the above-described means, the tape-shaped material wound in a roll is fed out by a feeding mechanism, and after a predetermined punching process is performed by a punching portion, the tape is wound again in a roll by a tape winding mechanism. Taken. Between the above-mentioned tape feeding mechanism and the tape winding mechanism, there is provided a perforated portion constituted by a plurality of punching units each having a punch having a predetermined cross-sectional shape and a die corresponding thereto. . The perforated portion is configured to be controllably movable so as to move by a predetermined distance in both the X and Y axes. Therefore, by operating each punching unit while controlling and moving the perforated portion in both the X and Y axes directions, fine holes are formed in a predetermined pattern within a range of each substrate area set on the tape-like material. Can be perforated.

Further, on the downstream side of the perforated portion, each substrate area of the tape-shaped material perforated in a predetermined perforation pattern as described above is moved from above in a controlled manner in both X and Y axes. An upper imaging unit for imaging is provided. The image processing unit analyzes and recognizes the image of the drilling pattern for each substrate area captured by the upper imaging unit, and individually determines the quality of the drilling pattern in each substrate area.

According to a second aspect of the present invention, there is provided an apparatus for punching a tape-shaped object, wherein the tape-shaped object is controlled by moving in the X- and Y-axis directions downstream of the perforated portion. A lower imaging unit for imaging from an obliquely lower side of the object, the lower imaging unit being connected to the image processing unit, and a shape of a burr protruding on the back side of each substrate area imaged by the lower imaging unit. The configuration is such that a pattern is recognized and the quality of the shape pattern is determined.

In this case, a lower imaging section is provided on the downstream side of the punching section provided in the tape-shaped punching apparatus. The lower imaging unit controls each of the substrate areas of the tape-shaped object perforated in the predetermined perforation pattern as described above while controlling and moving a predetermined distance in both the X and Y axis directions. Take an image. The lower imaging unit is in communication with the image processing unit. Then, based on the image picked up by the lower image pickup unit, the shape pattern of the burr projecting to the back side for each substrate area is recognized, and the quality of the shape pattern is individually judged.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show a tape-shaped material punching device according to the present invention. The drilling device,
This is a tape-shaped punching device for punching a large number of fine holes in a substrate area a0 of a chip size package or the like set in a state aligned with the surface of a TAB tape a.

As shown in FIGS. 1 and 2, a punching device according to the present invention comprises a tape feeding mechanism 5 (5a, 5b) for feeding the tape a from a roll a1, and a tape winding mechanism for winding the fed tape a. A mechanism 6 (6a, 6b);
A perforated portion 2 formed by combining a plurality of punching units 2a to 2d, an XY moving mechanism 20 for supporting the perforated portion 2 so as to be controllably movable in both X and Y axes,
An upper imaging unit 3 for individually imaging each substrate area a0 from above, an XY moving mechanism 30 for supporting the upper imaging unit 3 so as to be controllably movable in both X and Y axes, and an upper imaging unit 3
The image processing unit 7 analyzes an image captured by the above-described method, recognizes a drilling pattern performed in the drilling unit 2, and determines whether the drilling pattern is good or not.

The tape a is wound on a reel 51 installed on the left side of the apparatus when viewed from the front in a form superimposed on the reinforcing tape a3, and is driven by a drive mechanism 5a for feeding that is connected to the axis of the reel 51. , And the tape a and the reinforcing tape a3 are fed out by a predetermined length. The tape a fed from the reel 51 is wound around a sprocket wheel 5b via a roll 53, and is horizontally pulled out between the clamps 1a and 1b installed on the downstream side. After being wound around a take-up sprocket wheel 6b and a roller 63 provided on the downstream side of the clamp 1b, the take-up reel 61 is wound around the take-up reel 61. On the other hand, the tape a
The reinforcing tape a3 peeled off from the reel passes through the feed roller 54 and the take-up roller 64, and is wound on a reel 61 installed on the right side of the apparatus together with the tape a that has been punched.

The drive mechanism 5a of the reel 51 and the sprocket wheel 5b are connected to each other and rotationally driven.
The tape a is intermittently fed out from the reel 51 by a predetermined length, that is, the tape a for the perforated width of the perforated portion 2.
On the other hand, the drive mechanism 6a of the reel 61 on the take-up side and the sprocket wheel 6b are connected to each other and are rotationally driven in the same manner as in the case of the above-mentioned tape a pay-out side, and have the same length as that of the reel 61. The tape a is intermittently wound up.

As described above, the drive mechanism 5a of the reel 51 serving as the feeding mechanism 5 and the tape a fed from the sprocket wheel 5b are moved between the pair of clamps 1a and 1b installed on the base 8 of the apparatus at intervals. And hold it through. Punching units 2a to 2d constituting the perforated portion 2 are provided in the intermediate portion between the clamps 1a and 1b.
Are arranged side by side in the feed direction of the tape a (FIG. 1).

The clamps 1a and 1b are provided with punching units 2a to 2
d, in order to perform accurate punching on the tape a,
A proper tension is applied to the tape a stretched horizontally between the two sprocket wheels 5b and 6b. As shown in FIGS. 3 and 4, a pair of clamps 1a, 1b
Comprises a movable clamp 1a installed on the upstream side and a fixed clamp 1b installed on the downstream side.

The movable clamp 1a is provided with a holding slit 11 through which the tape a is inserted horizontally, and compressed air is supplied from one of the air supply pipes 12 so that the distance between the holding slits 11 is reduced. The tape a inserted through the slit 11 is configured to be clamped.
Further, the clamp 1a is configured such that by supplying compressed air from the other supply air supply pipe, the clamp body 1a 'slides forward and reverse on the base 13 in the direction of feeding the film a. It is. On the other hand, the fixed type clamp 1b is provided with a sandwiching slit 15 for horizontally inserting the tape a, and is fixed on the base 8 like the movable type clamp 1a. The compressed air is supplied from the air supply pipe 14 so that the holding slit 15
Is narrowed so that the tape a inserted through the slit 15 is clamped.

That is, both clamps 1 constructed as described above
a and 1b simultaneously hold the tape a stretched between the two sprocket wheels 5b and 6b, and slightly slide the moving clamp 1a, which has been slid downstream, to the upstream, so that both clamps 1a, Appropriate tension is applied to the tape a between 1b. After the perforating process is completed on the tape a by the perforating portion 2, the clamps 1a, 1
By releasing the compressed air supplied from the air supply intervals 12 and 14 of b, the tension applied to the tape a between the clamps 1a and 1b is released, and the tape a can be fed. .

The two clamps 1a, 1 on the base 8
In the middle part of b, a perforated part 2 for perforating the tape a stretched between the clamps 1a and 1b in an arbitrary perforation pattern is provided. As shown in FIGS. 1 and 5, the perforating section 2 includes a required number of punching units, in this case, four punching units 2 a to 2 d, and these are XY.
And an XY movement mechanism 20 for moving in both axial directions.

Each of the punching units 2a to 2d is formed in a substantially U-shape when viewed from the side, and each concave portion serves as an insertion portion 2d for the tape a. The punching units 2a to 2d are detachably mounted on the support 21 in the Y-axis direction (tape width direction), and these units 2a to 2d are mounted in the X direction (tape length direction). It has been juxtaposed. Each of the punching units 2a to 2d has a punch (not shown) having a different cross-sectional shape on each upper piece, and a die d1 corresponding to each of the punches on a lower piece.
d4 is attached to each. Each of the above-mentioned punches is vertically driven down by a corresponding one of the dies d1 to d4 by the operation of the driving means 2e. After punching out the tape a, it rises again to the original position.

The support table 21 on which the punching units 2a to 2d configured as described above are mounted and supported is installed on an XY moving mechanism 20.
It is movably supported in both Y-axis directions. The XY moving mechanism 20 includes two guide rails 22X installed in parallel on the base 8. The guide rail 22X is formed to have a substantially convex cross section, and is installed on the base 8 so as to extend in the X-axis direction. A flat moving plate 23 is placed on the guide rail 22X in a horizontal state, and the recesses of the two slide bodies 24X are provided in parallel along both edges of the lower surface of the moving plate 23. The movable plate 23 is configured to slide along the guide rail 22X in the X-axis direction by slidably engaging with the guide rail 22X.

Along the left and right side edges of the upper surface of the moving plate 23, two guide rails 25y each having a substantially convex cross section are provided.
Are installed in parallel in the axial direction. The support plate 21 on which the punching units 2a to 2d are installed as described above is placed on the guide rail 25y, and the support plate 21 has a concave cross section provided along the left and right side edges on the lower surface side of the support plate 21. By fitting the slide portion 21a, the support plate 21 and the punching units 2a to 2d are supported so as to slide along the guide rail 25y and move in the Y-axis direction.

On the base 8, both guide rails 2
A feed screw 26a extending along the central portion between 2X is provided, and a female screw member 26b through which the feed screw 26a is screwed and inserted is fixedly attached to the lower central portion of the moving plate 23. Further, an actuator (servo motor) 26c is connected to one end of the feed screw 26a,
The movable plate 23 and each of the punching units 2a to 2d mounted thereon are finely movable in the X direction by the rotation of the feed screw 26a driven by the actuator (servo motor) 26c.

On the other hand, a feed screw 27a is provided on the upper surface of the movable plate 23 along the center between the two guide rails 25y, and the feed screw 27a is screwed into the lower center of the support plate 21. A female screw body 27b to be inserted through is inserted and fixed. An actuator (servo motor) is provided at one end of the feed screw 27a as in the case of the X-axis.
27c and the actuator (servo motor) 2
7c, the feed screw 27a is rotated, and the support plate 21 and each of the punching units 2a installed thereon are rotated.
2d are configured to be finely movable in the Y direction.

That is, the punching unit 2 provided with the XY moving mechanism 20 configured as described above, drives the actuators (servo motors) 26c and 27c to put the punching units 2a to 2d in the form of sandwiching the tape a from above and below. The punching operation can be performed while the punching units 2a to 2d used for punching are sequentially moved to predetermined positions within the substrate area a0 of the tape a by moving the punching units 2a to 2d at an arbitrary distance in the axis and Y-axis directions.

The tape a that has been perforated in the perforating section 2 moves downstream, and the upper image pickup section 3 picks up an image of the perforated pattern formed in each substrate area a0 of the tape a. The upper imaging unit 3 includes a camera 3a composed of a small CCD camera or the like, and an XY moving mechanism 30 for finely moving in both XY axes. The imaging range of the camera 3a is large enough to image one substrate area a0 set on the tape a without any excess or shortage. In addition, the camera 3a
Is equipped with an illuminating lamp (not shown) used at the time of photographing, and is held by two holding plates 3b and a pivot 3c.
To be rotatably mounted. Note that the camera 3a is normally fixed in a state of facing directly downward (FIG. 6).

The camera 3a is provided with the X
An XY moving mechanism 30 configured in the same manner as the Y moving mechanism 20 is attached and supported so as to be movable in both XY axes in a suspended state. The XY moving mechanism 30 is installed so as to be hung on the lower surface of a hanger plate 30a that projects horizontally from the front of the punching device. The XY moving mechanism 30 is basically configured in the same manner as the XY moving mechanism 20 of the perforated portion 2 described above. However, since the mechanism 30 is operated to be suspended on the lower surface of the suspension plate 31, the guide rail 3
2X and a slide body 34X to be engaged therewith are respectively formed to have a substantially L-shaped cross section, and these two members 32X, 34X are engaged so as to be suspended. Further, the slide portion 3 of the suspension plate 31 on which the guide rail 35y and the camera 3a are installed in an inverted state.
1a also has the above-described guide rail 32X and slide body 34X.
And the same structure as the engagement structure.

That is, the upper imaging unit 3 having the XY moving mechanism 30 configured as described above moves the imaging range of the camera 3a in both XY directions by driving the actuators (servo motors) 36c and 37c. Tape a
Are sequentially imaged from above by the camera 3a. Note that, as described above, the camera 3a of the upper imaging unit 3 is in electrical communication with an image processing unit 7 described later, and transfers data of an image of the board area a0 captured by the camera 3a to the image processing unit 7. It is configured in.

After the upper imaging unit side 3 images the perforation pattern formed in each substrate area a0 of the tape a, the lower imaging unit 4 installed below the upper imaging unit 3 with the film a interposed therebetween. Thus, an image of a burr-shaped pattern protruding from the back surface of the tape a is captured for each substrate area a0. The lower imaging unit 4 is similar to the upper imaging unit 3 described above.
It comprises a camera 4a composed of a small CCD camera or the like, and an XY moving mechanism 40 for finely moving in both XY axis directions. The imaging range of the camera 4a is set so that one substrate area a0 set on the tape a can be imaged without excess and deficiency. Note that the camera 4a includes an illumination lamp (not shown) used for photographing.

As shown in FIG. 7, the camera 4a
It is installed on the upper surface of the base 8 by the XY moving mechanism 40, and X
It can be moved in both Y-axis directions. The XY moving mechanism 40 is configured in the same manner as the XY moving mechanism 20 of the perforated portion 2 shown in FIG. 5, and the above-described camera 4a is mounted on the support table 41 by using two holding plates 4b. It is mounted and supported in a state where it is inclined at an angle (FIG. 7).

That is, the lower imaging unit 4 having the XY moving mechanism 40 configured as described above holds the back surface of the tape a in an obliquely downward image by driving the actuators (servo motors) 46c and 47c. Camera 4a
Is moved by an arbitrary distance in the X-axis and Y-axis directions, and the shape pattern of the burrs protruding on the back surface side of the tape a is sequentially imaged for each substrate area a0. As described above, the camera 4a of the lower imaging unit 4 is electrically connected to an image processing unit 7, which will be described later, similarly to the above-described upper imaging unit 3, and the burr shape of each substrate area a0 captured by the camera 4a. The image data of the pattern is configured to be transferred to the image processing unit 7.

The camera 3a of the upper imaging section 3 and the camera 4a of the lower imaging section 4 are electrically connected to the image processing section 7. The image processing unit 7 is configured by a computer including an input unit including a display unit and keys. The image processing section 7 reads the image data of each substrate area a0 of the tape a sent from the camera 3a of the above-mentioned upper image section 3 and recognizes it as a punching pattern.
Then, the quality of the perforation pattern in the substrate area a0 is determined after comparing this perforation pattern with the data of many perforation patterns already registered in the image processing unit 7. Further, the image processing unit 7 performs the above-described process of determining the quality of the perforation pattern for each perforation pattern a0 sent from the upper image unit 3.

The image processing section 7 reads the image data of each substrate area a0 on the back surface of the tape a sent from the camera 4a of the lower image section 4 and recognizes it as a projecting burr shape pattern. Then, the burr shape pattern is compared with data of many burr shape patterns already registered in the image processing unit 7 to determine the quality of the burr shape pattern in the substrate area a0. The image processing unit 7 performs the above-described step of determining the quality of the burr-shaped pattern for each perforation pattern a0 sent from the lower image unit 4.

Next, the operation of the main part of the above-described punching device will be described. The tape-shaped material punching device configured as described above sequentially feeds out the tape a by the operation of the feeding device 5, and punches the punching units 2 a-2 of the punching unit 2.
A predetermined punching process is sequentially performed in each substrate area a0 by the 2d hitting operation, and a target drilling pattern is completed for each substrate area a0. The tape a that has been punched by the punch 2 moves to the downstream side and temporarily stops between the upper imaging unit 3 and the lower imaging unit 4. At this time, the upper imaging unit 3 images the perforation pattern in each substrate area a0 set on the tape a while finely moving the camera 3a by a predetermined amount in the XY biaxial directions by the XY moving mechanism 30, and the data thereof are obtained. It is sent to the image processing unit 7. Then, the image processing unit 7
Determines the quality of the drilling pattern as described above.
In addition, the position of the substrate area a0, which has become defective due to the determination of the perforation pattern, is checked on the tape a, and is removed as a defective product during processing.

On the other hand, on the back side of the tape a, the lower imaging section 4 moves the camera 4a to the XY
While finely moving by a predetermined amount in both axial directions, an image of a burr shape pattern protruding from the back surface of the tape a is captured for each substrate area a0, and the data is sent to the image processing unit 7. Image processing unit 7
Determines the quality of the burr-shaped pattern as described above. If the above-mentioned burr-shaped pattern is determined to be defective, it is determined that any one of the punches or dies of the punching units 2a to 2d that have made the holes is depressed, and the problematic punching units 2a to 2d are punched.
2d is displayed and a warning is issued.

[0036]

As described above, the tape-shaped object punching apparatus of the present invention is capable of punching a tape-shaped object for punching a large number of fine holes in a substrate area such as a chip size package set in the tape-shaped object. An apparatus comprising a punching unit comprising a plurality of punching units between a tape feeding mechanism for feeding a tape-shaped material and a tape winding mechanism for winding the tape-shaped material fed, wherein the punching unit is formed of XY. It is configured to be controllably movable in both axial directions, and provided on the downstream side of the perforated portion, while performing control movement in both the X and Y axial directions, an upper imaging unit for imaging each substrate area of the tape-like material from above, An image processing unit is provided that analyzes an image captured by the upper imaging unit, recognizes a drilling pattern performed in the punching unit, and determines whether the drilling pattern is good or not.

That is, the tape-shaped punching apparatus according to the present invention individually images a large number of substrate areas set on the tape-shaped object by the upper imaging section, and separates the image of the punching pattern captured for each of these substrate areas separately. This is for image analysis. Therefore, as in the conventional case, a large number of substrate areas set on the tape-shaped object are imaged over the entire width of the tape-shaped object, and the perforation patterns of all the substrate areas imaged in the wide image range are analyzed. This makes it possible to enlarge and image the perforation pattern of each substrate area for each substrate area, as compared with a method for determining the quality of the perforation pattern for each substrate area. As a result, it is possible to perform image analysis in a state where the image of each substrate area is greatly enlarged, whereby the accuracy of recognizing the perforation pattern in the substrate area can be significantly improved. As a result, it is possible to accurately determine the quality of a finer drilling pattern than before.

In the tape-piercing device according to a second aspect of the present invention, each of the substrate areas of the tape-shaped object is controlled to move in the X- and Y-axis directions downstream of the perforated portion. A lower-side imaging unit for capturing an image from an obliquely lower side of an object is provided, the lower-side imaging unit is connected to the image processing unit, and a burr-shaped pattern protruding to the back side of each substrate area captured by the lower-side imaging unit. Is recognized, and the quality of the shape pattern is determined.

That is, in the above-mentioned tape-shaped object punching device, a lower imaging section similar to the upper imaging section is provided on the downstream side of the punching section, and the back side of a large number of substrate areas set in the tape-shaped object is set as described above. Since the lower imaging unit individually captures images from obliquely below, and the images of the burr shape patterns captured for each of these substrate areas are separately recognized and analyzed by the image processing unit, the upper imaging unit and Similarly, it becomes possible to capture an image of a burr-shaped pattern projecting on the back surface side of each substrate area set on the tape-shaped object in an enlarged state for each substrate area by the lower imaging section. Therefore, it is possible to perform image analysis in a state where an image captured for each substrate area is greatly enlarged, and the accuracy of recognizing a burr pattern in the substrate area can be significantly improved. Furthermore, by accurately recognizing a finer burr shape than before and analyzing the image by the image processing unit, it is possible to accurately predict the state of the set of the punch and the die.

[Brief description of the drawings]

FIG. 1 is a front view showing a tape-shaped punching device according to the present invention.

FIG. 2 is a simplified diagram of the punching device.

FIG. 3 is a perspective view showing a movable clamp provided in the perforation apparatus with a part cut away.

FIG. 4 is a perspective view showing a fixed type clamp provided in the perforation device with a part cut away.

FIG. 5 is a perspective view showing a part of the perforation part of the perforation device with a cutout.

FIG. 6 is a perspective view showing an upper imaging unit of the punching device.

FIG. 7 is a perspective view showing the lower imaging unit of the punching device with a part cut away.

[Explanation of symbols]

 a: Tape a0: Substrate area 2: Perforated portion 2a to 2d: Punching unit 3: Upper imaging unit 4: Lower imaging unit 5 (5a, 5b): Extending Mechanism 6 (6a, 6b): Winding mechanism 7: Image processing unit 30: XY moving mechanism (upper imaging unit) 40: XY moving mechanism (lower imaging unit)

Claims (2)

[Claims] 1. A tape-shaped punching device for punching a large number of fine holes in a substrate area of a chip size package or the like in which the length and width of the tape-shaped object are set on the surface of the tape-shaped object. A tape feeding mechanism for feeding,
A punching unit comprising a plurality of punching units each having a punch having a predetermined cross-sectional shape and a die corresponding thereto, between the tape winding mechanism for winding the unwound tape-like material; Is configured to be controllably movable in both X and Y axes directions, and is configured to be capable of controlling and moving in both X and Y axes directions on the downstream side of the perforated portion while capturing an image of each substrate area of the tape-like material from above. A tape-shaped object provided with an imaging unit, and an image processing unit that analyzes an image captured by the upper imaging unit, recognizes a perforation pattern performed by the perforation unit, and determines whether or not the perforation pattern is good; Perforator. 2. A lower imaging section is provided downstream of the perforation section for taking an image of each substrate area of the tape-shaped object from obliquely below the tape-shaped object while controlling and moving in both X and Y axes directions. ,
The lower imaging unit is communicated with the image processing unit, and the shape pattern of the burr projecting to the back surface side of each substrate area imaged by the lower imaging unit is recognized, and the quality of the shape pattern is determined. The tape-shaped object punching device according to claim 1, wherein