JP2000239577A - Coating film structure and electronic equipment housing using the same - Google Patents

Coating film structure and electronic equipment housing using the same

Info

Publication number
JP2000239577A
JP2000239577A JP3825599A JP3825599A JP2000239577A JP 2000239577 A JP2000239577 A JP 2000239577A JP 3825599 A JP3825599 A JP 3825599A JP 3825599 A JP3825599 A JP 3825599A JP 2000239577 A JP2000239577 A JP 2000239577A
Authority
JP
Japan
Prior art keywords
coating film
coating
hollow beads
electronic equipment
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3825599A
Other languages
Japanese (ja)
Inventor
Masaru Ogawa
勝 小川
Shigemi Asai
重美 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP3825599A priority Critical patent/JP2000239577A/en
Publication of JP2000239577A publication Critical patent/JP2000239577A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a coating film structure capable of reducing the average heat conductivity of a coating film and reducing the effective temperature and useful for an electronic equipment housing, etc., by dispersing nonporous hollow beads in the coating film except the topmost layer coating film in the coating films formed in many layers. SOLUTION: This structure is obtained by dispersing nonporous hollow beads 1 formed of a nonporous material such as glass having, e.g. average 30 μm diameter in at least one coating film except the topmost layer coating film in the coating films 2 and 3 formed in many layers. The content of the hollow beads 1 is preferably <=20 wt.% and an electronic equipment housing is preferably produced by forming the coating having the coating film structure on a metal substrate 4. Furthermore, the viscosity of the coating material forming the coating films is preferably about 55×10-3 Pa.s.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、発熱部品を含む機
器の筐体の体感温度を低減できる塗膜構造および、その
塗膜構造を用いた電子機器筐体に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating film structure capable of reducing the temperature of a housing of a device including a heat-generating component, and an electronic device housing using the coating film structure.

【0002】[0002]

【従来の技術】各種コンピュータ、オーディオ機器、通
信機器などに代表される電子機器は、小型化、軽量化さ
れ、携帯性も良好になっている。そして、これらの電子
機器では更なる小型化、軽量化が求められている。
2. Description of the Related Art Electronic devices such as various computers, audio devices, and communication devices have been reduced in size and weight, and have improved portability. Further, these electronic devices are required to be further reduced in size and weight.

【0003】しかし、更なる小型化が進むにつれ、発熱
部品を内蔵する電子機器等において、熱に対する対策を
考える必要がでてきた。筐体表面の断熱、耐熱構造に関
する従来技術としては下記のようなものがある。
However, with further miniaturization, it has become necessary to consider measures against heat in electronic devices and the like having a built-in heat-generating component. Conventional techniques relating to heat insulation and heat-resistant structure of the housing surface include the following.

【0004】まず、特開平9−12938号公報に開示
された従来例を図3に示す。ここでは、金属基板31の
表面に中空で多孔性のマイクロカプセル32を添加した
塗膜(層)33を示しており、湯沸かし器の加熱容器の
内面のコーティング材として用いている。
First, FIG. 3 shows a conventional example disclosed in Japanese Patent Application Laid-Open No. 9-12938. Here, a coating film (layer) 33 in which a hollow porous microcapsule 32 is added to the surface of a metal substrate 31 is shown, and is used as a coating material for the inner surface of a heating vessel of a water heater.

【0005】次に、特開平10−151410号公報に
開示された従来例を図4に示す。ここでは、マグネシウ
ムもしくはマグネシウム合金の成形体41よりなる筐体
40の表面に銅層42、ニッケル層43、硬質透明ガラ
ス保護層44、シリカ層45を順次形成している。
Next, FIG. 4 shows a conventional example disclosed in Japanese Patent Application Laid-Open No. Hei 10-151410. Here, a copper layer 42, a nickel layer 43, a hard transparent glass protective layer 44, and a silica layer 45 are sequentially formed on the surface of a housing 40 formed of a magnesium or magnesium alloy molded body 41.

【0006】[0006]

【発明が解決しようとする課題】上記の従来技術を、発
熱部品を内蔵する電子機器等の筐体の表面に適用する場
合、以下の課題が生ずる。
When the above prior art is applied to the surface of a housing of an electronic device or the like having a built-in heat generating component, the following problems occur.

【0007】特開平9−12938号公報の構成では、
マイクロカプセル32は炭酸カルシウム、珪酸カルシウ
ム、珪酸マグネシウム等のアルカリ土類金属塩、シリ
カ、アルミナ、酸化チタン等の金属酸化物などの多孔性
材料で形成されている。これらの材料には極性があり、
塗膜形成要素の極性基となじみやすく濡れ性がよいた
め、マイクロカプセル32内へ塗膜形成要素が滲透しや
すく、マイクロカプセル32内の空気部分が減少あるい
は消滅してしまう。
In the configuration of Japanese Patent Application Laid-Open No. 9-12938,
The microcapsules 32 are formed of a porous material such as an alkaline earth metal salt such as calcium carbonate, calcium silicate, and magnesium silicate, and a metal oxide such as silica, alumina, and titanium oxide. These materials are polar,
Since the film-forming element easily conforms to the polar group of the film-forming element and has good wettability, the film-forming element easily permeates into the microcapsule 32, and the air portion in the microcapsule 32 decreases or disappears.

【0008】上記材料の熱伝導率(概ね10〜20W/
m/K)は一般的な塗膜の熱伝導率(概ね0.2W/m
/K)より大きいため、空気部分が減少あるいは消滅す
ることによって、塗膜の平均的な熱伝導率はマイクロカ
プセル32を含有しない場合と略同等かむしろ大きくな
ってしまう。したがって発熱部品の熱により高温にさら
された筐体表面に触れた場合の体感温度の低減効果が少
なくなる。
The thermal conductivity of the above material (generally 10 to 20 W /
m / K) is the thermal conductivity of a general coating film (approximately 0.2 W / m).
/ K), the average thermal conductivity of the coating film is substantially equal to or larger than the case where the microcapsules 32 are not contained due to the decrease or disappearance of the air portion. Therefore, the effect of reducing the perceived temperature when the surface of the housing exposed to the high temperature by the heat of the heat-generating component is touched is reduced.

【0009】また、特開平10−151410号公報の
構成では、筐体40の表面に形成した銅層42、ニッケ
ル層43、硬質透明ガラス保護層44、シリカ層45の
熱伝導率が塗膜の熱伝導率より大きいため、筐体40内
部の発熱を外部へ伝導しやすく体感温度の低減が困難で
ある。
In the structure disclosed in Japanese Patent Application Laid-Open No. H10-151410, the thermal conductivity of the copper layer 42, the nickel layer 43, the hard transparent glass protective layer 44, and the silica layer 45 formed on the surface of Since the heat conductivity is larger than the heat conductivity, heat generated inside the housing 40 is easily transmitted to the outside, and it is difficult to reduce the sensible temperature.

【0010】[0010]

【課題を解決するための手段】本発明は上記課題の解決
を目的としてなされたものであって、請求項1記載の発
明は、多層形成された塗膜のうち、最上層塗膜を除く少
なくとも1つの塗膜に無孔質の中空ビーズを分散させた
ことを特徴とする塗膜構造である。
SUMMARY OF THE INVENTION The present invention has been made for the purpose of solving the above-mentioned problems, and the invention according to claim 1 has at least a multi-layered coating film excluding the uppermost coating film. It is a coating film structure characterized by dispersing non-porous hollow beads in one coating film.

【0011】また、請求項2記載の発明は、前記中空ビ
ーズの含有量が20重量%以下であることを特徴とする
請求項1記載の塗膜構造である。
Further, the invention according to claim 2 is the coating film structure according to claim 1, wherein the content of the hollow beads is 20% by weight or less.

【0012】また、請求項3記載の発明は、前記請求項
1または2記載の塗膜構造を有する塗装を金属基板上に
形成したことを特徴とする電子機器筐体である。
According to a third aspect of the present invention, there is provided an electronic device housing wherein a coating having the coating structure according to the first or second aspect is formed on a metal substrate.

【0013】[0013]

【発明の実施の形態】本発明について図および表を用い
て詳細に説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the drawings and tables.

【0014】図1に本発明の塗膜構造の概略構成図を示
す。
FIG. 1 shows a schematic configuration diagram of the coating film structure of the present invention.

【0015】図1に示すように、本発明の塗膜構造は、
金属板4の表面に、無孔質の中空ビーズ1を分散させた
下塗り塗膜2を形成し、その上部に上塗り塗膜3を有す
る2層構造である。ここで、下塗り塗膜2は下地の金属
板4との密着性を向上するための塗膜(プライマとも言
う)であり、上塗り塗膜3は顔料、染料等を含む外観用
塗膜である。ここでは、2層の塗膜構造について記載し
ているが、3層あるいは4層などの多層膜構造であって
も構わない。
As shown in FIG. 1, the coating structure of the present invention
An undercoating film 2 in which non-porous hollow beads 1 are dispersed is formed on the surface of a metal plate 4, and has a two-layer structure having an overcoating film 3 thereon. Here, the undercoating film 2 is a coating film (also referred to as a primer) for improving the adhesion to the underlying metal plate 4, and the overcoating film 3 is a coating film for appearance containing a pigment, a dye, and the like. Here, a two-layer coating structure is described, but a multi-layer structure of three or four layers may be used.

【0016】上記塗膜構造の作製方法を以下に述べる。A method for producing the above-mentioned coating film structure will be described below.

【0017】まず、オリジンプライマー:E-03(オリジ
ン電気社製)の下塗り塗膜2と住友3M社製の中空ビー
ズ1を混合し、金属板4上にスプレーガンにより50μ
m塗布する。その後、70℃で30分間焼成し、次に、
下塗り塗膜2上に上塗り塗膜3を自動塗布機により20
μm塗布し、150℃で20分間焼成する。このような
方法で作製し、多層形成塗膜を得る。
First, an undercoating film 2 of origin primer: E-03 (manufactured by Origin Electric Co.) is mixed with hollow beads 1 manufactured by Sumitomo 3M Co., Ltd.
m. After that, it is baked at 70 ° C. for 30 minutes.
The top coat 3 is coated on the undercoat 2 by an automatic coater.
It is applied in a thickness of μm and baked at 150 ° C. for 20 minutes. It is produced by such a method to obtain a multilayer-formed coating film.

【0018】上記下塗り塗膜2に混合した中空ビーズ1
は例えば直径は平均30μmのものであり、ガラス等の
無孔質材料で形成されている。無孔質であるため中空ビ
ーズ1の内部に塗料中の塗膜形成要素が滲透することが
なく、ビーズ内部に空気を介在させたまま下塗り塗膜2
中に分散される。
Hollow beads 1 mixed with undercoat 2
Has an average diameter of 30 μm, for example, and is formed of a nonporous material such as glass. Since it is non-porous, the coating film forming element in the coating material does not permeate into the hollow beads 1 and the undercoating film 2 with air intervening inside the beads.
Dispersed inside.

【0019】ビーズ等を含有しない通常の塗膜の熱伝導
率は、概ね0.2W/m/Kで、空気の熱伝導率は2.
6×10-2W/m/Kであることから、内部に空気が介
在することで、塗膜の平均的な熱伝導率がビーズを含有
しない場合より小さくなる。
The thermal conductivity of an ordinary coating film containing no beads or the like is approximately 0.2 W / m / K, and the thermal conductivity of air is 2.
Since it is 6 × 10 −2 W / m / K, the average thermal conductivity of the coating film becomes smaller than that in the case where no beads are contained due to the presence of air inside.

【0020】したがって、金属板4が高温になった場合
でも、塗膜表面への熱の移動が抑制されるようになり、
塗膜表面に使用者が手を触れた場合等の体感温度が低減
することができる。
Therefore, even when the temperature of the metal plate 4 becomes high, the transfer of heat to the surface of the coating film is suppressed.
The sensible temperature when the user touches the surface of the coating film can be reduced.

【0021】次に、上記作製方法を用い、マグネシウム
合金板表面に無孔質の中空ビーズを所定の割合で分散さ
せた下塗り塗膜と、無充填の上塗り塗膜を順次形成し、
前記合金板裏面を高温にした時の塗膜表面の体感温度を
調べた。
Next, using the above-mentioned manufacturing method, an undercoating film in which nonporous hollow beads are dispersed at a predetermined ratio on the surface of the magnesium alloy plate and an unfilled topcoating film are sequentially formed.
The sensible temperature of the coating film surface when the back surface of the alloy plate was heated to a high temperature was examined.

【0022】ここで、無孔質の中空ビーズの含有量をそ
れぞれ2、5、10、20、0、30重量%(実施例1
〜4、比較例1、2)とした場合について実施した。ま
た、体感温度の指標として、塗膜表面を指で触れている
ことの可能な時間(以下、接触可能時間)と、手を触れ
た瞬間に感じる熱さ(以下、体感)を用いた。上記に示
した実験結果を表1に示す。
Here, the content of the nonporous hollow beads was set to 2, 5, 10, 20, 0, and 30% by weight, respectively (Example 1).
4 and Comparative Examples 1 and 2). In addition, as an index of the sensible temperature, a time during which the surface of the coating film can be touched with a finger (hereinafter, a contactable time) and a heat felt at the moment when the hand is touched (hereinafter, a sensation) are used. Table 1 shows the experimental results described above.

【0023】[0023]

【表1】 [Table 1]

【0024】ここで実験結果として体感温度を用いた理
由について説明する。
Here, the reason why the sensory temperature is used as an experimental result will be described.

【0025】上記実験による表面温度を非接触温度計で
測定を試みたが、上記表1のどの実験結果においても温
度的には数℃の差しか見られなかった。しかし、体感温
度は接触する表面積に対する単位時間あたりの熱量に比
例するため、上記のような指標を用いた。ここに用いた
体感温度は10人のサンプルの平均値で示している。
An attempt was made to measure the surface temperature in the above experiment with a non-contact thermometer, but none of the experimental results in Table 1 showed a temperature difference of several degrees Celsius. However, since the sensible temperature is proportional to the amount of heat per unit time with respect to the contact surface area, the above-mentioned index was used. The sensible temperature used here is shown as an average value of 10 samples.

【0026】上記表1の結果から明らかであるように、
実施例1〜実施例4すなわち無孔質の中空ビーズを2、
5、10、20重量%含有する塗膜構造が体感温度の軽
減効果があり、特に10、20重量%含有の場合効果が
大きい。
As is clear from the results in Table 1 above,
Example 1 to Example 4, ie, nonporous hollow beads,
A coating structure containing 5, 10, or 20% by weight has an effect of reducing the sensible temperature, and the effect is particularly great when it is contained at 10, 20% by weight.

【0027】比較例1すなわち中空ビーズを下塗り塗膜
に混入しない場合(従来の方法)は、体感温度は非常に
熱く、長時間ふれていられない結果となった。また、比
較例2である30重量%の場合は体感温度の軽減効果は
大きいが、中空ビーズが完全に混ざり切らずに、塗膜表
面に粉状に露出するため、良好な下塗り塗膜が得られ
ず、また上塗り塗膜の密着性を阻害することがわかっ
た。
Comparative Example 1, that is, when the hollow beads were not mixed in the undercoating film (conventional method), the sensible temperature was very hot, and the result was that the touch panel could not be touched for a long time. Further, in the case of Comparative Example 2, when the content is 30% by weight, the effect of reducing the perceived temperature is great, but since the hollow beads are not completely mixed and are exposed in powder form on the surface of the coating film, a good undercoat coating film is obtained. It was also found that the adhesiveness of the top coat was hindered.

【0028】ここで用いた無孔質中空ビーズの直径は平
均30μmであり、塗膜を形成する塗料の粘度は55×
10-3Pa・s(岩田式粘度:20sec.)である。
なお、塗料の粘度範囲の下限はビーズが塗膜から露出し
ない粘度であり、概ね35×10-3Pa・s、粘度範囲
の上限はスプレーガンから吐出できる粘度であり、概ね
80×10-3Pa・sである。
The diameter of the non-porous hollow beads used here was 30 μm on average, and the viscosity of the paint forming the coating film was 55 ×
10 −3 Pa · s (Iwata viscosity: 20 sec.).
The lower limit of the viscosity range of the paint is the viscosity at which the beads are not exposed from the coating film, and is approximately 35 × 10 −3 Pa · s. The upper limit of the viscosity range is the viscosity that can be discharged from the spray gun, and is approximately 80 × 10 −3. Pa · s.

【0029】次に、無孔質の中空ビーズを下塗り塗膜に
分散させた場合(実施例5)と、上塗り塗膜に分散させ
た場合(比較例3)との表面粗さ、鉛筆硬度、爪で擦っ
た場合の割れや剥がれの特性、接触可能時間について調
べた。ここで作製方法は上記で示したものと同様であ
り、無孔質の中空ビーズの含有量は10重量%とした。
その結果を表2に示す。
Next, the surface roughness, the pencil hardness and the hardness of the case where the non-porous hollow beads were dispersed in the undercoat film (Example 5) and the case where they were dispersed in the overcoat film (Comparative Example 3) were as follows. The characteristics of cracking and peeling when rubbing with a nail and the possible contact time were examined. Here, the production method was the same as that described above, and the content of nonporous hollow beads was 10% by weight.
Table 2 shows the results.

【0030】[0030]

【表2】 [Table 2]

【0031】この結果から明らかであるように、実施例
5と比較例3で接触可能時間は同じであるが、実施例5
の方が表面粗さが小さく、鉛筆硬度が硬く、爪で擦った
場合の割れ・剥がれの発生がない結果となっている。
As is clear from the results, the contactable time is the same in Example 5 and Comparative Example 3;
Has smaller surface roughness, higher pencil hardness, and no cracking or peeling when rubbed with a nail.

【0032】ゆえに、下塗り塗膜に分散させる塗膜構造
が、筐体の表面に塗装する場合等の使用に適していると
考えられる。
Therefore, it is considered that the coating structure dispersed in the undercoat coating film is suitable for use in the case of painting on the surface of a housing.

【0033】次に、図1のような塗膜構造の筐体につい
て説明する。
Next, a case having a coating film structure as shown in FIG. 1 will be described.

【0034】図2(a)は、CPU16等の発熱部品を
搭載するノート型パソコン10の一例における筐体11
部分の略断面図を示し、図2(b)は塗膜構造の拡大図
を示している。
FIG. 2A shows a case 11 in an example of a notebook personal computer 10 on which a heat-generating component such as a CPU 16 is mounted.
FIG. 2B is a schematic sectional view of a portion, and FIG. 2B is an enlarged view of a coating film structure.

【0035】図2(a)に示すように、筐体11はマグ
ネシウム合金で形成されており、外面12には図2
(b)で示す2層の塗膜構造すなわち、下塗り塗膜22
に無孔質の中空ビーズ21を分散させ、その次に上塗り
塗膜23を施している。これらの塗膜の作製方法は上記
で示した方法と同様である。筐体11内部には基板13
にCPU16が取付けられ熱伝導ラバー14を介して、
筐体の内面15に放熱する構成となっている。基板上の
他の電子部品は省略した。
As shown in FIG. 2A, the casing 11 is formed of a magnesium alloy, and the outer
The two-layer coating structure shown in FIG.
, Non-porous hollow beads 21 are dispersed therein, and then a top coat 23 is applied. The method for producing these coating films is the same as the method described above. A board 13 is provided inside the housing 11.
CPU 16 is attached to the heat conductive rubber 14,
Heat is dissipated to the inner surface 15 of the housing. Other electronic components on the substrate are omitted.

【0036】ノート型パソコン10の動作時はCPU1
6の発熱により、内面15は50〜60℃に温度上昇す
る場合がある。このような場合でも図2(b)で示す塗
膜構造により外面12に伝えられる熱量が抑制され、筐
体に触れた場合の体感温度が低減する。ここで図2
(b)で示す塗膜構造は、筐体の内面15に塗装しても
構わない。
When the notebook personal computer 10 is operating, the CPU 1
Due to the heat generated in 6, the temperature of the inner surface 15 may rise to 50 to 60 ° C. Even in such a case, the amount of heat transmitted to the outer surface 12 is suppressed by the coating structure shown in FIG. 2B, and the sensible temperature when touching the housing is reduced. Here, FIG.
The coating structure shown in (b) may be applied to the inner surface 15 of the housing.

【0037】なお、無孔質の中空ビーズは、極性を有す
る固体材料(例えば炭酸カルシウム・珪酸カルシウム・
珪酸マグネシウムなどのアルカリ土類金属塩、およびシ
リカ・アルミナ・酸化チタンなどの金属酸化物)で構成
されても良く、この場合、塗料中の塗膜形成要素の極性
基と親和することで、塗料中で分散しやすくなる。
The non-porous hollow beads are made of a solid material having polarity (for example, calcium carbonate, calcium silicate,
Alkaline earth metal salts such as magnesium silicate, and metal oxides such as silica, alumina, and titanium oxide). It is easy to disperse in the inside.

【0038】[0038]

【発明の効果】上述のように、請求項1記載の発明で
は、多層形成された塗膜のうち、最上層塗膜を除く少な
くとも1つの塗膜に無孔質の中空ビーズを分散させるこ
とにより、中空ビーズ内部に塗料中の塗膜形成要素が滲
透することがなく、ビーズ内部に空気を介在させたまま
下塗り塗膜中に分散することができる。よって、塗膜の
平均的な熱伝導率がビーズを分散しない場合より小さく
なり体感温度が低減できる効果がある。
As described above, according to the first aspect of the present invention, non-porous hollow beads are dispersed in at least one coating film other than the uppermost coating film among multilayer coating films. The coating film forming element in the coating material does not permeate into the hollow beads, and can be dispersed in the undercoating film with air interposed in the beads. Therefore, the average thermal conductivity of the coating film is smaller than that in the case where the beads are not dispersed, and there is an effect that the sensible temperature can be reduced.

【0039】また、請求項2記載の発明では、中空ビー
ズの含有量が20重量%以下であることにより、体感温
度の低減効果が得られる。
According to the second aspect of the present invention, the effect of reducing the perceived temperature can be obtained by setting the content of the hollow beads to 20% by weight or less.

【0040】また、請求項3記載の発明では、請求項1
または2記載の塗膜構造を有する塗装を金属基板上に形
成した電子機器筐体であることにより、前記の塗膜構造
により筐体表面に伝えられる熱量が抑制され、触れた場
合の体感温度が低減できる効果がある。
Further, according to the third aspect of the present invention, the first aspect is provided.
Or the electronic device housing in which the coating having the coating structure according to 2 is formed on a metal substrate, the amount of heat transmitted to the housing surface by the coating structure is suppressed, and the sensible temperature when touched is reduced. There is an effect that can be reduced.

【0041】特に、ノート型パソコン等の携帯性のある
電子機器は、膝の上に置いて使用する場合等が考えられ
るが、このような場合に膝が感じる熱さを和らげる効果
がある。
Particularly, a portable electronic device such as a notebook personal computer may be used by placing it on the knee. In such a case, there is an effect of reducing the heat felt by the knee.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の塗膜構造の概略構成図である。FIG. 1 is a schematic configuration diagram of a coating film structure of the present invention.

【図2】本発明の筐体の概略断面図である。FIG. 2 is a schematic sectional view of a housing of the present invention.

【図3】従来技術の塗膜構造の概略断面図である。FIG. 3 is a schematic sectional view of a prior art coating structure.

【図4】従来技術の他の塗膜構造の概略断面図である。FIG. 4 is a schematic cross-sectional view of another conventional coating film structure.

【符号の説明】[Explanation of symbols]

1、21 無孔質中空ビーズ 2、22 下塗り塗膜 3、23 上塗り塗膜 4 金属板 10 ノート型パソコン 11 筐体 12 外面 13 基板 14 熱伝導ラバー 15 内面 16 CPU 20 塗膜構造 1,21 Non-porous hollow beads 2,22 Undercoat 3,23 Top coat 4 Metal plate 10 Laptop computer 11 Housing 12 Outer surface 13 Substrate 14 Thermal rubber 15 Inner surface 16 CPU 20 Coating structure

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4D075 CA17 DA06 DB01 DC21 EC24 EC54 4J038 EA011 HA216 HA286 HA446 HA456 HA486 KA21 PA07 PB09 PC02  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4D075 CA17 DA06 DB01 DC21 EC24 EC54 4J038 EA011 HA216 HA286 HA446 HA456 HA486 KA21 PA07 PB09 PC02

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 多層形成された塗膜のうち、最上層塗膜
を除く少なくとも1つの塗膜に無孔質の中空ビーズを分
散させたことを特徴とする塗膜構造。
1. A coating structure wherein non-porous hollow beads are dispersed in at least one coating film excluding the uppermost coating film among multilayer coating films.
【請求項2】 前記中空ビーズの含有量が20重量%以
下であることを特徴とする請求項1記載の塗膜構造。
2. The coating structure according to claim 1, wherein the content of the hollow beads is 20% by weight or less.
【請求項3】 前記請求項1または2記載の塗膜構造を
有する塗装を金属基板上に形成したことを特徴とする電
子機器筐体。
3. An electronic device housing, wherein a coating having the coating structure according to claim 1 or 2 is formed on a metal substrate.
JP3825599A 1999-02-17 1999-02-17 Coating film structure and electronic equipment housing using the same Pending JP2000239577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3825599A JP2000239577A (en) 1999-02-17 1999-02-17 Coating film structure and electronic equipment housing using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3825599A JP2000239577A (en) 1999-02-17 1999-02-17 Coating film structure and electronic equipment housing using the same

Publications (1)

Publication Number Publication Date
JP2000239577A true JP2000239577A (en) 2000-09-05

Family

ID=12520218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3825599A Pending JP2000239577A (en) 1999-02-17 1999-02-17 Coating film structure and electronic equipment housing using the same

Country Status (1)

Country Link
JP (1) JP2000239577A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202511A (en) * 2008-02-29 2009-09-10 Kobe Steel Ltd Resin-coated metal sheet
JP2010228223A (en) * 2009-03-26 2010-10-14 Kobe Steel Ltd Resin-coated metal plate
JP2012210723A (en) * 2011-03-30 2012-11-01 Kobe Steel Ltd Coated steel sheet
WO2015065134A1 (en) * 2013-11-04 2015-05-07 조승래 Multi-layer coating system using voids for heat shielding system and method for manufacturing same
JP2015175285A (en) * 2014-03-14 2015-10-05 マツダ株式会社 Method of forming heat insulating layer
US9835929B2 (en) 2013-11-04 2017-12-05 Materials Vision Co., Ltd. Multi-layer coating system using voids for heat blocking system and method for manufacturing same
JP2018123251A (en) * 2017-02-02 2018-08-09 大日本塗料株式会社 Coating composition and multilayer coating film

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202511A (en) * 2008-02-29 2009-09-10 Kobe Steel Ltd Resin-coated metal sheet
JP2010228223A (en) * 2009-03-26 2010-10-14 Kobe Steel Ltd Resin-coated metal plate
JP2012210723A (en) * 2011-03-30 2012-11-01 Kobe Steel Ltd Coated steel sheet
WO2015065134A1 (en) * 2013-11-04 2015-05-07 조승래 Multi-layer coating system using voids for heat shielding system and method for manufacturing same
US9835929B2 (en) 2013-11-04 2017-12-05 Materials Vision Co., Ltd. Multi-layer coating system using voids for heat blocking system and method for manufacturing same
JP2015175285A (en) * 2014-03-14 2015-10-05 マツダ株式会社 Method of forming heat insulating layer
JP2018123251A (en) * 2017-02-02 2018-08-09 大日本塗料株式会社 Coating composition and multilayer coating film
JP7025841B2 (en) 2017-02-02 2022-02-25 大日本塗料株式会社 Paint composition and multi-layer coating

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