JP2000236004A - Inclination-adjusting device and bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inclination-adjusting device and a bonding device which is suitable for an automatic process and has a simple structure and high rigidity. SOLUTION: A base plate 46 to be adjusted in a slanting state is joined with a stationary support member 48, using a stationary-side spherical joint 41 and joined with a leaf spring 43 which is easily deformed in the Z-direction using a shifting-side spherical joint 42. When the leaf spring 43 is driven by an XY-table 44, inclination of the base plate 46 can be changed. Even when reactive force is received from applying a load, the reaction force can be received by the spherical joint 41, and rigidity can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tilt adjusting device for adjusting a tilt of a predetermined member and a bonding device for bonding a semiconductor chip.

[0002]

2. Description of the Related Art Conventionally, in a bonding apparatus for bonding a semiconductor element or the like to a wiring board, as a means for adjusting the parallelism between the head and the stage, there are a case where the head is inclined and a case where the stage is inclined. For the former, for example, in Japanese Patent Application Laid-Open No. 9-129677, as shown in FIG. 9, the head portion is tilted and parallelized by adjusting screws 6 arranged at four corners between the holder upper plate 5 and the holder lower plate 17 of the bonding tool. Adjust the degree. 9A is a perspective view showing the entirety, and FIG. 9B is a side view showing the holder.

There is also a mechanism using a micrometer head as shown in FIG. 10 that tilts the head. FIG.
In the example shown in FIG. 0, the inclination of the intermediate plate 33 that rotates about the bearing 37 with respect to the base 31 is adjusted by the micrometer head 32, and the tool holder 35 that rotates about the bearing 34 with respect to the intermediate plate 33 is adjusted. The parallelism is adjusted by adjusting the inclination with the micrometer head 38.

The latter is disclosed, for example, in Japanese Patent Laid-Open No. 9-1
In Japanese Patent No. 29677, the inclination is adjusted by independently changing the height of three points by three independent actuators 25 vertically moving a base lower mechanism 24 disposed below the base upper plate 20 of the stage as shown in FIG. I do.

[0005]

With the conventional means for manually tilting the head using an adjusting screw, the amount of movement at the time of adjustment is not quantitative, so that the adjustment of the parallelism requires a sensuous or skilled work. Become. In the bonding apparatus, parts attached to the head part are exchanged with the type change during the manufacturing process, and a long working time is required for adjusting the parallelism between the head and the stage during the type change. Alternatively, in a mechanism using a micrometer head, mechanical rigidity is low due to the structure via a bearing, and when considering automation of parallelism adjustment, it is difficult to arrange an actuator, that is, the head part is complicated and large. It can be called a structure.

On the other hand, in the means for inclining the stage, a mechanical component such as a bearing, a guide and a cam follower is used at the lower part of the stage, so that the rigidity is liable to be reduced. When a large bonding load is applied from the head, the stage is displaced. There is a risk that it will. Further, since the heights of the three points are independently adjusted by the three actuators, the calculation of the adjustment amount becomes complicated.

The present invention has been made to solve the above problems, and has a simple structure, high rigidity,
An object is to obtain a tilt adjustment device and a bonding device suitable for automation.

[0008]

According to a first aspect of the present invention, there is provided a tilt adjusting device comprising a fixed support member, a base member, an elastic structural member which is easily deformed in a certain direction and hardly deformed in a direction perpendicular thereto.
One first spherical joint connecting the fixed support member and one end of the base member, two or more second spherical joints connecting the other end of the base member and the end of the elastic structural member, and a constant The direction is composed of driving means for driving the elastic structural member in a direction perpendicular to the direction, and the driving means displaces the second spherical joint via the elastic structural member to adjust the inclination of the base member.

According to a second aspect of the present invention, there is provided a tilt adjusting device.
In the described structure, the elastic structural member is elastically deformed and attached in advance to apply a preload to the first and second spherical joints. According to a third aspect of the present invention, in the tilt adjusting device according to the first or second aspect, the elastic structural member is a leaf spring.

According to a fourth aspect of the present invention, a head device is slidably attached to the tilt adjusting device according to any one of the first to third aspects. According to a fifth aspect of the present invention, there is provided a bonding apparatus in which a stage is attached to the tilt adjusting device according to any one of the first to third aspects.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing an inclination adjusting device and a bonding device according to Embodiment 1 of the present invention, and FIG. 2 is a side view thereof. In these figures, reference numeral 48 denotes a fixed support member, which is fixed by means not shown. Reference numeral 46 denotes a base plate as a base member whose inclination is to be adjusted, and reference numeral 43 denotes a leaf spring as an elastic structural member.
Since it has a plate shape in a plane direction, it is arranged so that it is hardly deformed in the X and Y directions and easily deformed in the vertical direction, that is, the Z direction in the figure. Reference numeral 44 denotes an XY table as driving means for driving the leaf spring 43 in the X and Y directions. The base 43 a of the leaf spring 43 is attached to the XY table 44.

Reference numeral 41 denotes a fixed spherical joint as a first spherical joint for connecting the fixed support member 48 and one end of the base plate 46, and reference numeral 42 denotes a second spherical joint for connecting the base plate 46 and the leaf spring 43. And the other end of the base plate 46, that is, the end opposite to the position where the fixed-side spherical joint 41 is provided, and the end 43b extending from the base 43a of the leaf spring 43.
And the two moving-side spherical joints 42
Are provided apart from each other. The base plate 46 is supported by the fixed and movable spherical joints 41 and 42. The leaf spring 43 is mounted so as to bend in advance in a direction perpendicular to the moving direction of the XY table 44, that is, in the Z direction, thereby applying a preload to the fixed-side spherical joint 41 and the movable-side spherical joint 42 to eliminate a gap. I have.

Reference numeral 49 denotes a head portion, and 47 denotes a guide provided on the base plate 46. The head portion 49 is slidably attached to the base plate 46 via the guide 47. 50
Is a tool attached to the lower end of the head unit 49, which sucks and heats a semiconductor chip (not shown). Reference numeral 51 denotes a stage for fixing an object to which the semiconductor chip is bonded,
It is arranged below the tool 50. Reference numeral 52 denotes a Z-axis external drive unit that drives the head unit 49 in the Z direction from the outside. The head unit 49 driven by the Z-axis external drive unit 52 is guided by the guide 47 and linearly moves in that direction.

Next, the operation of adjusting the inclination of the base plate 46, that is, the operation of adjusting the parallelism between the tool 50 and the stage 51 will be described with reference to FIG. FIG. 3A shows XY
FIG. 3B shows a state before the table 44 is moved, and FIG. 3B shows a state after the table 44 is moved. The XY table 44 is changed from the state of FIG.
By moving in the Y direction, the leaf spring 43 and the moving-side spherical joint 42 connected to the XY table 44 are displaced in the XY direction with respect to the fixed-side spherical joint 41. As a result, the fixed-side spherical joint 41 is rotated around the fixed-side spherical joint 41. The base plate 46 is tilted. The head 49, which is regulated by the guide 47 attached to the base plate 46 to move linearly, is tilted as shown in FIG. 3B with the tilt of the base plate 46. As a result, the tool 50 and the stage The degree of parallelism 51 can be adjusted.

The movement amount of the table 44 is obtained, for example, as follows. In FIG. 4, the fixed side joint 41
The distance between the center point of the moving joint 42 and the center point 42a of the moving joint 42 is L. By measuring the surface of the tool 50 and the surface of the stage 51 with a laser displacement meter or the like, a normal vector Pt representing the direction of the surface of the tool 50 and a normal vector Ps representing the direction of the surface of the stage 51 are both obtained. The size L is obtained. The difference PΔ between the normal vector Ps and the normal vector Pt is obtained from PΔ = Ps−Pt. This PΔ
May be used as the amount of movement of the table 4 in the X and Y directions. Thereby, the parallelism between the head and the stage can be easily adjusted, and high-precision bonding can be performed.

When a load is applied by the Z-axis external driving means 52 as in this embodiment, the reaction force of the bonding load is hardly applied to the base plate 46 and the fixed-side and movable-side spherical joints 41, 42. 1. A configuration in which the weight of the head portion 49 is supported by the fixed-side spherical joint 41 as shown in FIG. In the above description, two moving-side spherical joints 42 are used. However, three or more moving-side spherical joints 42 may be provided. For example, three end portions 43b of the leaf spring 43 may be provided in a three-forked shape.

Embodiment 2 FIG. FIG. 5 is a side view showing an inclination adjusting device and a bonding device according to Embodiment 2 of the present invention. In this embodiment, a case is described in which a load is applied by the Z-axis internal drive unit 53 incorporated in the head unit 49. That is, in FIG. 5, a bonding load is applied to the tool 50 via the head portion 49 by the Z-axis internal driving means 53, and a positive Z-axis (upward) force applied to the base plate 46 as a reaction force is applied to the fixed spherical surface. It can be received at the joint 41. The other parts are the same as those in the first embodiment, and a description thereof will be omitted.

Embodiment 3 FIG. 6 is a side view showing an inclination adjusting device and a bonding device according to Embodiment 3 of the present invention. In this embodiment, an example in which the inclination adjusting device is applied to a bonding stage will be described. That is, the bonding stage shown in FIG. 6 is configured such that the base plate 46 on which the stage portion 51 is mounted is fixedly supported by the moving-side spherical joint 42 connected to the XY table 44 that moves in the XY directions via the leaf spring 43. It is configured to be supported by the fixed-side spherical joint 41 connected to the member 48. The XY table 44 moves the moving-side spherical joint 42 relative to the fixed-side spherical joint 41, and tilts the base plate 46 to tilt the stage 51,
The adjustment of the parallelism with the tool 50 is performed. The other parts are the same as those in the first embodiment, and a description thereof will be omitted.

Embodiment 4 FIG. 7 is a perspective view showing an inclination adjusting device and a bonding device according to Embodiment 4 of the present invention. The elastic structural member does not need to be connected to one XY table, and may have a structure as shown in this embodiment. That is, the XY table 44 is composed of two Y-axis tables 44a and 44b and one X-axis table 44c, and the two movable-side spherical joints 42 are separated from each other by two separate leaf springs 43 as elastic structural members. It is connected to tables 44a and 44b.
In this case, in addition to the parallelism adjustment by the above-described tilting operation, the respective Y-axis tables 44a and 44b can be rotated in the illustrated θ-axis direction by relatively moving. The other parts are the same as those in the first embodiment, and a description thereof will be omitted.

Embodiment 5 FIG. 8 is a perspective view showing an elastic structure member of the tilt adjusting device according to Embodiment 5 of the present invention. The elastic structural member does not need to be a leaf spring, and may be configured using, for example, a coil spring 54 and a linear guide 55 as shown in this embodiment. In FIG. 8, the movable-side spherical joint 42 and the rigid arm 56 are connected via a linear motion guide 55. Holding part 55 of linear guide 55
b is fixed to the rigid arm 56, and the shaft 55a of the linear guide 55 is connected to the movable spherical joint 42. The moving direction of the movable-side spherical joint 42 is regulated by a linear motion guide 55, and is further pressed against the base plate 46 by the spring force of the coil spring 54. The shaft 55a of the linear motion guide 55 is mounted so that it can move in the Z direction perpendicular to the direction of movement of the XY table (not shown). Then, the rigid arm 56 is moved by the XY table.
Are driven in the XY directions. With this structure, the linear motion guide 55 makes it difficult for the XY table to move in the moving direction of the XY table, and easily deforms in the vertical direction.
Further, it is possible to form an elastic structural member capable of applying a preload to the spherical joint. The other parts are the same as those in the first embodiment, and a description thereof will be omitted.

[0021]

As described above, according to the first aspect of the present invention,
According to the tilt adjusting device according to the above, it is possible to realize an inexpensive device suitable for automation with a simple structure. Further, even when a reaction force is received when a load is applied, the first spherical joint can receive the reaction force, so that the rigidity can be increased. According to the tilt adjusting device of the second aspect, since the preload is given by elastically deforming and attaching the elastic structural member in advance, it is possible to eliminate the gap between the first and second spherical joints, Therefore, a highly accurate device can be realized. According to the inclination adjusting device of the third aspect, the number of components can be reduced and the structure can be simplified by using a leaf spring as the elastic structural member.

Further, according to the bonding apparatus according to the fourth and fifth aspects, since the tilt adjusting apparatus according to any one of the first to third aspects is used, the parallelism adjustment between the head section and the stage section is automatically performed. A bonding device for performing the bonding process can be configured, and the time required for the adjustment work accompanying the type change in the bonding process is shortened, thereby improving the productivity.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an inclination adjusting device and a bonding device according to a first embodiment of the present invention.

FIG. 2 is a side view of the inclination adjusting device and the bonding device of FIG. 1;

FIG. 3 is a perspective view for explaining the operation of the tilt adjusting device of FIG. 1;

FIG. 4 is a perspective view for explaining the operation of the tilt adjusting device of FIG. 1;

FIG. 5 is a side view of an inclination adjusting device and a bonding device according to a second embodiment of the present invention.

FIG. 6 is a side view of a tilt adjusting device and a bonding device according to a third embodiment of the present invention.

FIG. 7 is a perspective view of a tilt adjusting device and a bonding device according to Embodiment 4 of the present invention.

FIG. 8 is a perspective view of an elastic structural member of a tilt adjusting device according to Embodiment 5 of the present invention.

FIG. 9 is a perspective view of a conventional tilt adjusting device and a bonding device.

FIG. 10 is a perspective view of another conventional tilt adjusting device and a bonding device.

[Explanation of symbols]

41 fixed spherical joint, 42 moving spherical joint, 43 leaf spring, 43b end, 44 XY table, 46 base plate, 47 guide, 48 fixed support member, 49 head, 50 tool, 51 stage, 54 coil spring , 55 Linear guide.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroaki Hase 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Inside Mitsubishi Electric Corporation (72) Inventor Toshinobu Kishi 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Rishi Electric Co., Ltd. (72) Inventor Kiyoharu Nagai 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F-term (reference) 5F044 BB01 BB20 5F047 FA07 FA14

Claims (5)

[Claims] 1. A fixed support member, a base member, an elastic structural member which is easily deformed in a certain direction and hardly deformed in a direction perpendicular thereto, and one connecting member for connecting the fixed support member and one end of the base member. A first spherical joint, two or more second spherical joints connecting the other end of the base member and an end of the elastic structural member, and the elastic structural member in a direction perpendicular to the predetermined direction. An inclination adjusting device comprising driving means for driving, wherein the driving means displaces the second spherical joint via the elastic structural member to adjust the inclination of the base member. 2. The tilt adjusting device according to claim 1, wherein the elastic structural member is elastically deformed and attached in advance, and a preload is applied to the first and second spherical joints. 3. The tilt adjusting device according to claim 1, wherein the elastic structural member is a leaf spring. 4. A tilting device according to claim 1, further comprising a head unit and a stage unit, wherein the semiconductor chip sucked by the head unit is bonded on the stage unit. A bonding apparatus, wherein the head section is slidably mounted. 5. A tilting device according to claim 1, further comprising a head portion and a stage portion, wherein the semiconductor chip sucked by the head portion is bonded on the stage portion. A bonding apparatus comprising the stage.