JP2000234043A - Resin paste composition and semiconductor device prepared by using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a paste composition which improves the reflow resistance when used as a die bonding material for a semiconductor device using a support member chiefly made from an organic material by compounding a (meth)acrylic ester compound with a specified-functional-group-containing butadiene (co)polymer, a radical initiator, and a filler. SOLUTION: The functional groups of the specified-functional-group-containing butadiene (co)polymer (B) are at least one type of groups selected from epoxy groups, carboxyl groups, acid anhydride groups, and radically polymerizable groups. It is desirable that a homopolymer of the (meth)acrylic ester compound (A) has a glass transition temperature of 100 deg.C or below, and component B has a glass transition temperature of 20 deg.C or below and is contained in an amount of 50-400 pts.wt. per 100 pts.wt. component A. It is desirable that component B has a number-average molecular weight of 800-5,000 and 1-6 functional groups in the molecule. The filler used is desirably platy aluminum oxide.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is suitable for bonding a semiconductor element such as an IC or an LSI to a support member mainly composed of an organic material such as glass / epoxy resin, glass / bismaleimide / triazine resin, and polyimide. The present invention relates to a resin paste composition and a semiconductor device using the same.

[0002]

2. Description of the Related Art The mounting method of semiconductor devices has shifted from the conventional pin insertion method to the surface mounting method in view of high-density mounting. Further, the structure of the package has been changed to an area terminal type element represented by a name such as BGA (ball grid array) or CSP (chip scale package) due to an increase in the number of pins accompanying high integration. In the surface mounting method, reflow soldering, which heats the entire board with infrared light or the like, is used for mounting on the board, and the package is heated to a high temperature of 200 ° C or more, so the inside of the package, especially in the adhesive layer or in the sealing material There has been a problem that package cracks occur due to rapid vaporization / expansion of moisture contained therein, and the reliability of the semiconductor device is reduced.

In the area terminal type element, a structure in which a semiconductor element is bonded to a support member mainly composed of an organic material and only one side is sealed is most commonly used. However, one side of the support member is exposed. Further, since the base material is made of an organic material having high hygroscopicity and moisture permeability, the die bond layer easily absorbs moisture, and the problem of package cracking due to reflow soldering is particularly serious. In particular, in the area terminal type element using a polyimide film having a thickness of 20 to 100 μm as a base material due to a demand for a thinner package, moisture absorption is more likely to occur, while the base material is easily deformed, so that it is easily expanded due to the expansion of moisture. There was a problem that peeling occurred and package cracks were extremely likely to occur.

As a method for solving this problem, a technique has been used in which the elasticity of the die bonding material is increased to make it difficult to deform, thereby suppressing the deformation of the supporting member and suppressing the separation. However, on the other hand, in the area terminal type element based on a polyimide film, when the elastic modulus of the die bonding material is high, the stress on the solder ball due to the temperature cycle after mounting on the wiring board is increased, and the connection reliability is reduced. There was a problem. Furthermore, in the area terminal type element, the wiring density is high, and insulation properties are required for the die bonding material due to structural problems such as the proximity of the wire bond pad and the die bonding pad or wiring to the die bond part, and conventionally silica powder is used. I have been. However, the conventional paste composition using silica powder has a problem that the adhesive strength after the moisture absorption treatment is largely reduced and the reflow resistance is inferior.

[0005]

SUMMARY OF THE INVENTION The present invention improves the peel strength of a resin paste composition for a support member mainly composed of an organic material, particularly the peel strength after moisture absorption,
In addition, by suppressing the moisture absorption rate, the reflow resistance of the semiconductor device assembled using the same is improved, and the connection reliability to the temperature cycle after mounting is improved by lowering the elasticity of the resin paste composition. The present invention provides a resin paste composition which can be used and a semiconductor device using the same.

[0006]

The present invention relates to the following. (1) (A) an acrylate compound or a methacrylate compound, (B) a butadiene polymer or copolymer having a specific functional group, (C) a radical initiator and (D) a filler are uniformly dispersed. Wherein the functional group of the butadiene polymer or copolymer of the component (B) is at least one of an epoxy group, a carboxyl group, an acid anhydride group and a radical polymerizable group. (2) The homopolymer of the component (A) has a glass transition temperature of 10
0 ° C. or lower, the glass transition temperature of the butadiene polymer or copolymer as the component (B) is 20 ° C. or lower, and the amount thereof is 50 to 4 with respect to 100 parts by weight of the component (A).
The resin paste composition according to (1), wherein the amount is 00 parts by weight.

(3) The resin paste composition according to (1), wherein the butadiene polymer or copolymer as the component (B) has a number average molecular weight of 800 to 5000 and 1 to 6 functional groups in the molecule. . (4) The resin paste composition according to any one of (1) to (3), wherein the filler component of the component (D) is aluminum oxide having a plate shape.

(5) A semiconductor element is bonded to a supporting member mainly composed of an organic material using the resin paste composition according to any one of (1) to (4), and then sealed. Semiconductor device. (6) The supporting member for bonding the semiconductor element is 20 to 100 μm.
The semiconductor device according to (5), wherein a member constituted by using a polyimide film having a thickness of m as a base material is used.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The acrylate compound or methacrylate compound of the component (A) used in the present invention is a compound having one or more acryl (methacryl) groups in one molecule. Formula (I)

Embedded image [Wherein, R ¹ represents hydrogen or a methyl group, and R ² has 1 carbon atom.
-100, preferably an aliphatic hydrocarbon group having a divalent aliphatic or cyclic structure having 1 to 36 carbon atoms], a compound represented by the general formula (II)

Embedded image [Wherein R ¹ and R ² each represent the same as above], a compound represented by the general formula (III):

Embedded image [Wherein, R ¹ represents the same as above, R ³ represents hydrogen, a methyl group or a phenoxydimethyl group, R ⁴ represents hydrogen, and has 1 carbon atom.
Represents an alkyl group, a dicyclopentenyl group, a phenyl group or a benzoyl group, and n represents an integer of 1 to 50]
A compound represented by the general formula (IV)

Embedded image [Wherein, R ¹ represents the same as above, R ⁵ represents a phenyl group, a nitrile group, —Si (OR ⁶ ) ₃ (R ⁶ represents an alkyl group having 1 to ⁶ carbon atoms), and a group represented by the following formula:

Embedded image Wherein R ⁷ , R ⁸ and R ⁹ each independently represent an alkyl group having 1 to 6 carbon atoms, and m represents a number of 1, 2 or 3.], a compound represented by the general formula (V)

Embedded image [Wherein R ¹ and R ² each represent the same as defined above], a compound represented by the general formula (VI):

Embedded image [Wherein, R ¹ , R ³ and n each represent the above]
A compound represented by the general formula (VII)

Embedded image [Wherein, R ¹ represents the same as described above, and R ¹⁰ and R ¹¹ each independently represent hydrogen or a methyl group], a compound represented by the general formula (VIII)

Embedded image [Wherein, R ¹ , R ¹⁰ and R ¹¹ each represent the same as above, and p and q each independently represent an integer of 1 to 20]
A compound represented by the general formula (IX)

Embedded image [Wherein, R ¹ represents the same as above, R ¹² , R ¹³ , R ¹⁴ and R ¹⁵ each independently represent hydrogen or a methyl group, and x represents an integer of 1 to 20]. Is mentioned.

As the acrylate compound or methacrylate compound of the component (A), the above compounds can be used alone or in combination of two or more.

The acrylate compound or methacrylate compound as the component (A) is used to reduce the elastic modulus of the cured product and improve the connection reliability after mounting.
The glass transition temperature of the homopolymer of the component is preferably 100 ° C. or less.

The functional group contained in the butadiene polymer or copolymer as the component (B) may be, for example, a radical such as an epoxy group, a carboxyl group, an acid anhydride group, an acryl group, a methacryl group, or a maleimide group in a molecule or in a side chain. Those having at least one kind of polymerizable group can be used.

The butadiene polymer or copolymer of the component (B) may have a double bond derived from butadiene in the molecule. Those having hydroxyl groups in an amount of less than 200 g / mol may be used.

The butadiene polymer or copolymer as the component (B) preferably has a glass transition temperature of 20 ° C. or lower in order to reduce the elastic modulus of the cured product and improve the connection reliability after mounting.

The butadiene polymer or copolymer having an epoxy group may be an epoxidized polybutadiene, an epoxidized butadiene nitrile copolymer or an epoxidized butadiene nitrile styrene obtained by oxidizing a double bond of butadiene with peracetic acid or air to epoxidize it. Glycidyl acrylate having a polymer or an epoxy group,
A butadiene copolymer obtained by copolymerizing a monomer such as glycidyl methacrylate, a butadiene polymer having a carboxyl group or an acid anhydride group, or a reaction product of an epoxy resin and the like can be used.

As the butadiene polymer or copolymer having a carboxyl group, a carboxy-terminated butadiene nitrile copolymer (CTBN) or a reaction product of the above-mentioned butadiene polymer or copolymer having an epoxy group with a dibasic acid or For example, a reaction product obtained by reacting a butadiene polymer or copolymer to which maleic anhydride has been added with an acrylate compound or a methacrylate compound having a hydroxyl group in the molecule can be used.

As the butadiene polymer or copolymer having an acid anhydride group, a butadiene polymer or copolymer to which maleic anhydride has been added can be used.

The butadiene polymer or copolymer having a radical polymerizable group may be a vinyl-terminated butadiene nitrile copolymer (VTBN) or a butadiene polymer or copolymer to which maleic anhydride is added, and a hydroxyl group in the molecule. And a reaction product such as a reaction product obtained by reacting an acrylate compound or a methacrylate compound.

The reaction product obtained by reacting the butadiene polymer or copolymer to which maleic anhydride has been added with an acrylate compound or a methacrylate compound having a hydroxyl group in the molecule is an intramolecular molecule. Β-hydroxypropyl acrylate, β-hydroxyethyl methacrylate, polyethylene glycol acrylate, 2-hydroxy-3 as an acrylate compound or a methacrylate compound having a hydroxyl group
An acrylate compound or a methacrylate compound 0.1 to 1 mol of maleic anhydride group in polybutadiene using phenoxypropyl acrylate or the like;
It is obtained by reacting in a range of 1.2 mol. In order to control the polymerization of the acrylate compound or the methacrylate compound, the reaction is carried out at 40 ° C to 15 ° C.
It is preferably carried out in a temperature range of 0 ° C., and an optional polymerization inhibitor can be added as needed. An optional reactive diluent and a solvent can be added as necessary to make the reaction more uniform.

The butadiene polymer or copolymer having such a functional group has a number average molecular weight (standard polystyrene conversion value by gel permeation chromatography, the same applies hereinafter) of 800 to 5,000 and an average molecular weight per molecule. It is preferable that the total number of epoxy groups, carboxyl groups, acid anhydride groups, and radically polymerizable groups is 1 to 6. If the number average molecular weight is less than 800, the crosslinked density of the cured product tends to decrease, the adhesive strength of the base composition decreases, and if it exceeds 5,000, the viscosity increases and the workability of the resin paste composition decreases. Tend. In addition, when the average number of epoxy groups and other functional groups in one molecule is less than 1, the crosslink density of the cured product decreases, and the adhesive strength of the base composition decreases. The workability of the resin paste composition tends to decrease, the elasticity of the cured product increases, and the reliability with respect to the temperature cycle tends to decrease.

The butadiene polymer or copolymer as the component (B) is used in an amount of from 20 to 10 based on 100 parts by weight of the component (A).
It is preferable to use 00 parts by weight, and it is more preferable to use 50 to 400 parts by weight. When the amount is less than 20 parts by weight, the adhesive strength to the organic base material is reduced and the reflow resistance is reduced. When the amount exceeds 400 parts by weight, the viscosity increases and the workability of the resin paste composition tends to decrease. There is.

The radical initiator (C) used in the present invention is not particularly limited, but is preferably a peroxide in terms of voids and the like, and in view of the curability and viscosity stability of the resin paste composition. The decomposition temperature of peroxide is 70-
170 ° C. is preferred.

As specific examples, dicumyl peroxide, t-butyl perbenzoate, 1,1-bis (t-
Butylperoxy) cyclohexane, methyl ethyl ketone peroxide, methylcyclohexane peroxide, methyl acetoacetate peroxide, acetylacetone peroxide, 1,1-bis (t-hexylperoxy) 3,3,5-trimethylcyclohexane,
1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) 3,3,5
-Trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) cyclododecane, 2,2-bis (t-
(Butylperoxy) butane, n-butyl-4,4-bis (t-butylperoxy) valerate, p-menthane hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide , T-hexyl hydroperoxide, t-
Butyl hydroperoxide, α, α-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-bis (t-
(Butylperoxy) hexane, t-butylcumyl peroxide, di-t-butylperoxide, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexyne-3,2,4-dichlorobenzoylper oxide,
Succinic acid peroxide, m-toluoylbenzoyl peroxide, benzoyl peroxide, bis (4-t-butylcyclohexyl) peroxydicarbonate, 1,1,3,3-tetramethylbutylperoxy neodecanoate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate,
2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-
Methyl ethyl peroxy-2-ethylhexanoate,
t-hexylperoxy-2-ethylhexanoate,
t-butylperoxy-2-ethylhexanoate, t
-Butylperoxyisobutyrate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2
-Ethylhexyl monocarbonate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-bis (benzoylperoxy) hexane, t-butylperoxyacetate, t-butylperoxy-m-toluoylbenzoate, t -Butyl peroxybenzoate,
Bis (t-butylperoxy) isophthalate, t-butylperoxyallyl monocarbonate, 3,3 ′,
4,4'-tetra (t-butylperoxycarbonyl)
Benzophenone, 2,3-dimethyl-2,3-diphenylbutane and the like.

The amount of component (C) is preferably from 0.1 to 10 parts by weight, particularly preferably from 0.5 to 5 parts by weight, per 100 parts by weight of the total of components (A) and (B).

The filler (D) used in the present invention is not particularly limited, and various fillers may be used. For example, metal powders such as gold, silver, copper, nickel, iron, aluminum, stainless steel, etc. Silicon oxide, boron nitride,
Insulating inorganic powders such as aluminum borate, aluminum oxide and the like are included.

By using aluminum oxide having a plate-like shape as an insulating inorganic powder, good workability is imparted to the resin paste composition, and the resin paste is mixed with the resin composition comprising the above components as a filler. In this case, it is possible to provide a resin paste composition having a very small decrease in adhesion even after moisture absorption and having high adhesion.

The amount of the filler is not particularly limited, but is preferably 20 to 85 parts by weight based on 100 parts by weight of the total amount of the resin paste composition.
% By weight is preferred. If the amount is less than 20 parts by weight, the adhesive strength when heated tends to decrease, and if it exceeds 85 parts by weight, the viscosity increases and the workability of the resin paste composition tends to decrease.

The resin paste composition according to the present invention may further contain, if necessary, a toughness improving material such as acrylonitrile butadiene rubber, styrene butadiene rubber, urethane acrylate, a moisture absorbent such as calcium oxide and magnesium oxide, and a silane coupling agent. , Titanium coupling agents, adhesion enhancers such as acid anhydrides, nonionic surfactants, wetting improvers such as fluorine surfactants, defoamers such as silicone oils, ion trapping agents such as inorganic ion exchangers Etc. can be appropriately added.

To produce the resin paste composition of the present invention, (A) an acrylate compound or a methacrylate compound, (B) a butadiene polymer or copolymer having a specific functional group, (C) ) Radical initiator and (D) filler, together with various additives used as required, together or separately with a stirrer, raiser,
This roll, a dispersing / dissolving device such as a planetary mixer may be appropriately combined, and if necessary, heated, mixed, dissolved, disintegrated and kneaded or dispersed to form a uniform paste.

In the present invention, a semiconductor device can be obtained by bonding a semiconductor element and a supporting member using the resin paste composition produced as described above, and then sealing the semiconductor element and the supporting member.

In order to adhere a semiconductor element to a support member such as a polyimide film wiring board using the resin paste composition of the present invention, first, the resin paste composition is dispensed on the support member, screen printing, stamping, and the like. After application by a method or the like, the semiconductor element can be pressed and then cured by heating using a heating device such as an oven or a heat block. Further, after a wire bonding step, the semiconductor device is sealed by a usual method, whereby a completed semiconductor device can be obtained.

[0032]

Next, the present invention will be described in detail with reference to examples, but the present invention is not limited thereto.

The epoxy resin and curing agent used in the following examples were prepared as follows. Preparation of epoxy resin 7.5 parts by weight of YDF-170 (trade name of Toto Kasei Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent = 170) and YL-980 (trade name of Yuka Shell Epoxy Co., Ltd.)
Bisphenol A type epoxy resin, epoxy equivalent = 18
5) 7.5 parts by weight was heated to 80 ° C., and stirring was continued for 1 hour to obtain a uniform epoxy resin solution. Preparation of Phenol Resin Solution 1.0 part by weight of H-1 (trade name of Meiwa Kasei Co., Ltd., phenol novolak resin, OH equivalent: 106) and PP-101 as a diluent (trade name of Toto Kasei Co., Ltd., alkylphenylglycidyl) 2.0 parts by weight of ether and epoxy equivalent = 230) were heated to 100 ° C. and stirred for 1 hour to obtain a uniform phenol resin solution.

Curing agent 2P4MHZ (Shikoku Chemicals Co., Ltd., imidazole-based curing agent) Diluent PP-101 (Toto Kasei Co., Ltd., alkylphenylglycidyl ether) Epoxy resin composition Epoxy resin, phenolic resin The solution, the curing agent and the diluent were uniformly mixed in a weight ratio of 20: 5: 2: 10 using a mortar.

(1) Acrylic acid ester compound or methacrylic acid ester compound 2-hydroxy-3-phenoxypropyl acrylate (Tg: 17 ° C.) Isobornyl acrylate (Tg: 180 ° C.) Nonanediol diacrylate

(2) Butadiene polymer or copolymer Epoxidized polybutadiene (number-average molecular weight: 1,000, number of functional groups: 4, Tg; <0 ° C.) (E-1000-6.5: trade name of Nippon Petrochemical Co., Ltd.) Carboxy-terminated butadiene acrylonitrile copolymer (molecular weight 3500, functional group 2.3, Tg; <0 ° C.)
(HaycarCTBN1300 × 9: trade name of Ube Industries, Ltd.) Methacrylated polybutadiene (maleic acid-added polybutadiene alkyloxy methacrylate, number average molecular weight 1)
000, number of functional groups 2.3, Tg; <0 ° C.) (MM-1000-80: trade name of Nippon Petrochemical Co., Ltd.)

(3) Radical initiator dicumyl peroxide (4) Filler silver powder; TCG-1, trade name of Tokurika Chemical Laboratory Co., Ltd., plate-like aluminum oxide; (YFA-O0610, trade name of YKK Corp., spherical) Silicon oxide; S-COX30, Micron Corporation

Each material was mixed at the compounding ratio shown in Table 1, and 3
After kneading using this roll, defoaming treatment was performed at 5 Torr (Torr) or less for 10 minutes to obtain a resin paste composition.
The characteristics (viscosity, peel strength) of this resin paste composition were examined by the following methods. Table 2 shows the results.

(1) Viscosity: The viscosity (Pa · s) at 25 ° C. was measured at an rpm of 0.5 rpm using an EHD type rotational viscometer (manufactured by Tokyo Keiki Co., Ltd.). (2) Workability: A 24G nozzle manufactured by Musashi Engineering was used to dispense the paste onto the substrate, and the stringiness and scattering of the paste, the flow after application and the spreadability of the paste were evaluated and comprehensively judged. In addition, × indicates a state in which die bonding is substantially impossible, Δ indicates a state in which there is a problem with a plurality of properties or has a serious problem and is difficult to use, ○ indicates a state in which there is a problem in one of the properties but is usable, ◎ indicates that any of the characteristics was good.

(3) -1 Peel strength The resin paste composition was treated with a salter resist (PSR-40).
00-AUS5, Taiyo Ink Co., Ltd.) coated and cured glass / epoxy substrate (E-679, Hitachi Chemical Co., Ltd.)
Co., Ltd.), and an 8 mm × 8 mm Si chip (0.4 mm thick) was pressed thereon, and further heated in an oven at 150 ° C.
And then cured at 150 ° C. for 1 hour. This is placed in a thermo-hygrostat set at 85 ° C. and 85% for 4 hours.
After 8 hours of moisture absorption, an automatic adhesive device (Hitachi Chemical Industries, Ltd.)
Manufactured in-house) was used to measure the peel strength (kg / chip) at 240 ° C.

(3) -2 Peel strength A polyimide wiring board (manufactured by Hitachi Chemical Co., Ltd.) is cut into a strip having a width of 5 mm, and a resin paste composition is applied thereto.
An 8 mm × 10 mm Si chip (0.4 mm thick) was pressed onto this, and the temperature was raised to 150 ° C. in an oven for 30 minutes and cured at 150 ° C. for 1 hour. This was absorbed in a constant temperature and humidity chamber set at 85 ° C. and 85% for 48 hours, and then the chip side was placed and fixed on a heat block, and the end of the film was fixed to the end of the spring and pulled up. The peel strength (g / 5 mm width) at ° C was measured.

(4) -1 Reflow Resistance A glass / epoxy substrate coated and cured with a salter resist (PSR-4000-AUS5 manufactured by Taiyo Ink Co., Ltd.) using the resin paste compositions obtained in Examples and Comparative Examples. (E-679, manufactured by Hitachi Chemical Co., Ltd.) and the Si chip were cured and bonded under the following curing conditions. Thereafter, the package was sealed with an epoxy sealing material (CEL-9200, manufactured by Hitachi Chemical Co., Ltd.) to obtain a package for a solder reflow test. The package was allowed to absorb moisture for 168 hours in a thermo-hygrostat set at a temperature and humidity of 85 ° C. and 85%, respectively.
Thereafter, solder reflow was performed, and the number of occurrences of external cracks in the package was observed with an ultrasonic microscope. The number of cracked samples is shown for five samples. Chip size: 10mm x 10mm Package: 24mm x 24mm Curing conditions: Heat up to 150 ° C in 30 minutes, cure at 150 ° C for 1 hour

(4) -2 Reflow Resistance Using the resin paste compositions obtained in Examples and Comparative Examples, a polyimide wiring board (manufactured by Hitachi Chemical Co., Ltd.) and Si
The chip was cured and adhered under the following curing conditions. Thereafter, an epoxy encapsulant manufactured by Hitachi Chemical (CEL-920)
0) to obtain a package for a solder reflow test. The temperature and humidity of the package are 85 ° C, respectively.
Moisture was absorbed for 48 hours in a thermo-hygrostat set at 85%. Thereafter, solder reflow was performed, and the number of occurrences of external cracks in the package was observed with an ultrasonic microscope. The number of cracked samples is shown for five samples. Chip size: 10mm x 10mm Package: 24mm x 24mm Curing conditions: Heat up to 150 ° C in 30 minutes, cure at 150 ° C for 1 hour

(5) Connection Reliability to Temperature Cycle The package using the polyimide wiring board prepared in the above (4) -2 is mounted on a 0.6 mmt wiring board, and is -25 ° C.
The connection resistance was measured every 100 cycles at / 125 ° C, and the number of cycles at which the failure rate exceeded 50% was determined to evaluate the temperature cycle resistance.

[0045]

[Table 1]

[0046]

[Table 2]

From the results shown in Table 2, the resin paste compositions of the present invention (Examples 1 to 6) are more likely to absorb moisture than the conventional resin paste compositions using an epoxy resin (Comparative Example 3). The peel strength was high and the reflow resistance was excellent. Further, when a paste composition using a specific composition is used (Examples 1 to 5), not only the reflow resistance is improved but also the die bond layer is made to have a low elastic modulus in a package using a polyimide substrate. It can be seen that the mounting reliability has been improved up to about three times.

[0048] In Table 2, the workability of Examples 2 to
In No. 4, there was a tendency for stringing to occur slightly during dispensing, and in Comparative Example 1, the splattering of the paste occurred.
In each case, the usable range was within the range of the above-mentioned apparatus and conditions.

[0049]

The resin paste composition of the present invention reduces the occurrence of reflow cracks during solder reflow when used as a die bonding material for a semiconductor device using a supporting member mainly composed of an organic material. The connection reliability after mounting can be improved, and the reliability as a semiconductor device can be improved.

Continued on the front page (51) Int.Cl. ⁷ Identification FI Theme Court II (Reference) H01L 21/52 H01L 21/52 E (72) Inventor Koichi Sawabe 4-3-1-1, Higashicho, Hitachi City, Ibaraki Prefecture Hitachi Chemical (72) Inventor Yoji Katayama 4-1-1, Higashicho, Hitachi, Ibaraki Prefecture F-term (reference) 4Y002 BG04W BG05W BL01X DE147 EK036 EK046 EK056 EK086 FA117 FD017 GJ00 GQ05 4J011 PA07 PA30 PA34 PA76 4J027 AA03 AJ01 BA07 CA14 CA36 CB03 CC02 CD09 5F047 AA17 BA23 BA34 BA53 BB11 BB16 FA22 FA52

Claims (6)

[Claims] 1. Uniform dispersion of (A) an acrylate compound or a methacrylate compound, (B) a butadiene polymer or copolymer having a specific functional group, (C) a radical initiator and (D) a filler. (B)
A resin paste composition in which the functional group of the butadiene polymer or copolymer as a component is at least one of an epoxy group, a carboxyl group, an acid anhydride group, and a radically polymerizable group. 2. The glass transition temperature of the homopolymer of the component (A) is 100 ° C. or lower, and the glass transition temperature of the butadiene polymer or copolymer of the component (B) is 20 ° C. or lower. The amount is 5 per 100 parts by weight of the component (A).
The resin paste composition according to claim 1, wherein the amount is from 0 to 400 parts by weight. 3. The resin paste composition according to claim 1, wherein the butadiene polymer or copolymer as the component (B) has a number average molecular weight of 800 to 5000 and 1 to 6 functional groups in the molecule. 4. The resin paste composition according to claim 1, wherein the filler component (D) is a plate-like aluminum oxide. 5. A semiconductor device obtained by bonding a semiconductor element to a support member mainly composed of an organic material using the resin paste composition according to claim 1, and sealing the semiconductor element. 6. A support member for adhering a semiconductor element, comprising 20 to
The semiconductor device according to claim 5, wherein a member configured using a polyimide film having a thickness of 100 μm as a base material is used.