JP2000232281A - Molded circuit board and component holding tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a reliable holding of a component, the prevention of vibration of the component and the easy removal of the component by a method wherein the component held in a space for holding the component is engagingly held by engaging pieces, which project in the space and are respectively positioned at component engaging positions, to prevent the component from popping out from the space. SOLUTION: When a component 5 is engagingly held between a pair of component holding parts 6 by a pair of link pieces 7, which are respectively positioned at non- engaging positions A, the component 5 is inserted within a space 8 for component holding formed between the component holding parts 6 and at the same time, each lead 4 of the component 5 is inserted in each fitting hole 3 formed in a molded circuit board 3. After that, one or two tabular component engaging parts in the vicinity of a self-hinge part on the center part of each link piece 7 press the component 5 by an energizing force stronger than a constant energizing force from the outside of each component holding part 6 toward the inside of the component holding part 6 to contrive to make a jump buckling cause to the component 5. Thereby, the prevention of vibration of the component at the time of traveling of a vehicle or the like is achieved and the component 5 can be easily removed from the space 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molded circuit board for a power source such as an air conditioner, an inverter of a refrigerator, an electromagnetic induction of a rice cooker, and the like. The present invention relates to a molded circuit board and a component holder suitable for mounting.

[0002]

2. Description of the Related Art Conventionally, a molded circuit board is disclosed in
What is described in 329876 is known.
FIG. 15 shows the structure of this conventional molded circuit board.
After inserting the lead of the component 922 into a predetermined hole of the molded circuit board 921 in which the lead frame 920 is insert-molded, the component 922 is held by the pair of component holding portions 923. When the component 922 is inserted, the pair of component holding portions 923 and 923 are pushed right and left in FIG.
Of the component holding portions 923 and 923 by the elastic force of
The component 922 is pressed into contact with the side surface of the
It is pressed and held between 3,923.

Another conventional component holder is disclosed in Japanese Utility Model Laid-Open Publication No. 59-169055. FIG. 16 shows the structure of this conventional component holder. The component holder 924 includes holding portions 926 a and 926 b for holding the light emitting diode 925 and a flange 927 of the light emitting diode.
Claw 928 for locking the guide hole 932 for facilitating the insertion of the lead wire 929 into the through hole 931 of the printed circuit board 930, a guide 933 which is an inclined surface provided at the entrance of the guide hole, and positioning on the printed circuit board 930. And a plurality of pins 934. Light emitting diode 9
25 is inserted into the component holder 924, one of the holding portions 9
26a is elastically deformed, and the collar 927 of the light emitting diode 925 is formed.
Is locked by the locking claw 928 of the one holding portion 926a.

[0004]

However, the above-mentioned 2)
In the molded circuit boards disclosed in the two publications, the holding force is reduced due to the creep of the component holding portion itself, and when a strong force is applied to the component or the like, the component is easily pulled out from between the component holding portions and cannot be securely held. There is a problem. Further, the component holder disclosed in the above-mentioned publication has a problem that it is difficult to make an elastic bending allowance of the holding portion 926a for a short component.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a molded circuit board and a component holder which can achieve reliable holding, vibration prevention, and easy removal in order to solve the above problems. is there.

[0006]

In order to achieve the above object, the present invention is configured as follows. According to the first aspect of the present invention, there is provided a molded circuit board in which a lead frame is molded with a synthetic resin, a component holding space for holding components, a component engagement position protruding into the space, and retreating from the space. A component holding portion having an engaging piece that is stable at each of the disengaged positions and is movable between the two positions with a biasing force equal to or more than a predetermined value, and the component member protruding into the component holding space. A molded circuit board, characterized in that the component held in the component holding space is engaged and held by the engagement piece located at the mating position to prevent the component from jumping out of the space. provide.

According to a second aspect of the present invention, there is provided the molded circuit board according to the first aspect, wherein the component holding portion is formed integrally with a synthetic resin for molding the lead frame.

According to the third aspect of the present invention, the side wall of the component holding portion and both ends of the engaging piece are connected via the self-hinge portion which can be bent only by the predetermined or more urging force,
The molded circuit board according to the first or second aspect, in which the engagement piece is moved to the component engagement position protruding into the space and the non-engagement position retracted from the space by bending at the self-hinge portion. I will provide a.

According to the fourth aspect of the present invention, the side wall of the component holding portion and the end of the engaging piece on the side wall side are formed by the first self-hinge portion which can be bent only by the predetermined or more urging force. At the same time, the first engagement piece includes two plate-shaped component engagement portions that are connected to the side wall via the first self-hinge portion, and the two plate-shaped component engagement portions include the two plate-shaped component engagement portions. It is configured to be connected to each other via a second self-hinge portion that can bend only with a certain urging force, and the engagement piece is bent in the space by bending at the first and second self-hinge portions. The molded circuit board according to the first or second aspect, wherein the molded circuit board is moved to the part engaging position protruding from the space and the non-engaging position retracted from the space.

[0010] According to the fifth aspect of the present invention, the side wall of the component holding portion and the end portion on the side wall side of the engagement piece are formed by the first self-hinge portion which can be bent only by the predetermined or more urging force. At the same time, the first engagement piece includes two plate-shaped component engagement portions that are connected to the side wall via the first self-hinge portion, and the two plate-shaped component engagement portions include the two plate-shaped component engagement portions. A second self-hinge part that can bend only with a certain urging force or more, and is configured with an engagement part that can be engaged with the component, and is bent at the first and second self-hinge parts. The molded circuit board according to the first or second aspect, wherein the engagement portion of the engagement piece is moved to the component engagement position protruding into the space and the non-engagement position retracted from the space by the above. I do.

According to a sixth aspect of the present invention, the surface of the engagement piece engaging with the component is inclined in a direction to press the component toward the board when the engagement piece is at the component engagement position. The molded circuit board according to any one of the first to fifth aspects, comprising:

According to a seventh aspect of the present invention, there is provided a component holder attached to a board for engaging and holding a component with the board, the component holding space holding the component on the board. An engaging piece which is movable between the two positions with a certain or more urging force at a part engaging position and a non-engaging position where the part protrudes, and protrudes into the part holding space. A component holder, wherein the component held in the component holding space is engaged and held by an engagement piece to prevent the component from jumping out of the space.

According to an eighth aspect of the present invention, there is provided the component holder according to the seventh aspect, further comprising an engagement claw removably engaging the engagement hole of the substrate.

According to a ninth aspect of the present invention, the side wall forming the space and both ends of the engagement piece are connected via a self-hinge portion that can be bent only by the predetermined or more urging force, The component holder according to the seventh or eighth aspect, wherein the engagement piece is moved to the component engagement position protruding into the space and the non-engagement position retracted from the space by bending at the self hinge portion. I will provide a.

According to the tenth aspect of the present invention, the side wall constituting the space and the side end of the engaging piece on the side wall side are formed by the first self-hinge portion which can be bent only by the predetermined or more urging force. At the same time, the first engagement piece includes two plate-shaped component engagement portions that are connected to the side wall via the first self-hinge portion, and the two plate-shaped component engagement portions include the two plate-shaped component engagement portions. It is configured to be connected to each other via a second self-hinge portion that can bend only with a certain urging force, and the engagement piece is bent in the space by bending at the first and second self-hinge portions. The component holder according to the seventh or eighth aspect, wherein the component holder is moved to the component engagement position protruding from the space and the non-engagement position retracted from the space.

According to an eleventh aspect of the present invention, the first self-hinge portion capable of bending the side wall of the space and the end portion on the side wall side of the engagement piece only by the predetermined or more urging force. And the first engagement piece includes two plate-shaped component engagement portions connected to the side wall via the first self-hinge portion, and the two plate-shaped component engagement portions. The first and second self-hinge portions are connected by a second self-hinge portion that can be bent only by the predetermined biasing force or more and are configured to engage with the component. The component holder according to the seventh or eighth aspect, wherein the engagement portion of the engagement piece is moved by bending to the component engagement position protruding into the space and the non-engagement position retracted from the space. provide.

According to a twelfth aspect of the present invention, the surface of the engagement piece that engages with the component is inclined in a direction to press the component toward the board when the engagement piece is at the component engagement position. The component holder according to any one of the seventh to eleventh aspects, wherein the component holder has a tilted inclined surface.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. According to various embodiments of the present invention, the molded circuit board or the substrate to which the component holder is assembled is an air conditioner, an inverter of a refrigerator, a molded circuit board such as a molded circuit board for power supply such as electromagnetic induction of a rice cooker. A desired component (including a sub-board) can be attached and detached by a component holder integrally formed on the molded circuit board itself or by the component holder detachably attached to the molded circuit board. Is mounted on the substrate.

(First Embodiment) FIGS. 1 and 2 are a plan view and a sectional view, respectively, showing a state where components are held on a molded circuit board according to a first embodiment of the present invention. In FIG. 1, the above-mentioned molded circuit board 3 is substantially constituted by a lead frame 1 made of, for example, a copper plate and a covering portion 2 obtained by molding the lead frame 1 with a synthetic resin having a high insulating property. A pair of corners facing each other when a substantially rectangular parallelepiped component 5 having a plurality of leads 4 to be inserted into the plurality of fitting holes 3a of the molded circuit board 3 are viewed from above in a plan view. The component holding portion 6 having a rectangular wall shape, which is opposed to the component and bent in an L-shape in plan view, is provided integrally with the covering portion 2 of the molded circuit board 3 using synthetic resin. A substantially rectangular link piece 7 bent in an L-shape as an example of an engagement piece is formed in the upper central portion of each component holding portion 6. That is, a gap 6g extending in the lateral direction is formed between the side walls 6a at both upper end portions of each component holding portion 6, and the link piece 7 bent in an L shape is positioned above the gap 6g via the gap 6g. are doing. The L-shaped bent link piece 7 forms a self-hinge part 9 which is formed thinner than other parts and can be repeatedly bent near each end of the upper part of the component holding part 6. 9, each end of the link piece 7 in the longitudinal direction is connected to each side wall 6 a of the component holding portion 6. Each link piece 7 has two plate-shaped component engaging portions 7b, 7b each having an outer end connected to the self-hinge portion 9, 9, and the two plate-shaped component engaging portions 7b, 7b. 7b are connected to each other by a self-hinge part 7a that can be repeatedly bent. Therefore, the link piece 7 can bend with respect to the side walls 6a, 6a on both sides of the component holding part 6 via the pair of self-hinge parts 9, 9, and the link piece 2 can be bent through the self-hinge part 7a.
The two plate-shaped component engaging portions 7b, 7b can be bent in an L-shape in two opposite directions. That is, each link piece 7 can operate as follows. When the link pieces 7 do not engage with the component 5, the link pieces 7 are in the non-engagement position A where the link pieces 7 do not engage with the component 5.
It is stably located at the position shown in the lower left of. That is, along the L-shaped part holding part 6, the non-engagement that is bent at substantially 90 degrees to form an L-shape only at the self-hinge part 7a that is formed thinner than other parts and can be repeatedly bent. The link piece 7 is stably located at the position A. on the other hand,
When the link piece 7 engages with the component 5, it is stably positioned at the position shown in the upper right of FIG. That is, the link piece 7 bends at the self-hinge portion 7a in the direction opposite to the non-engagement position A and also bends at the two self-hinge portions 9, 9, thereby forming the component engagement portion 7b of the link piece 7 , 7b are protruded into the L-shaped part holding portion 6 so as to be bent in an L shape, and the lower surfaces of the component engaging portions 7b, 7b engage with the upper surface of the component 5, and 5 can be engaged and held by the component holding portion 6.

When the link piece 7 moves to the retracted position, that is, the position protruding from the non-engagement position A, that is, to the engagement position B, the lower inner side surface of the link piece 7 contacts the side surface of the component 5. As a result, it may not be possible to move to the upper surface of the component 5 and engage with the engagement position B. In order to avoid this effectively, as shown in FIG. 2, as shown in FIG. 2, the lower part of each part engaging portion 7 b of each link piece 7 is closer to the molded circuit board from the inner side closer to the part side to the outer side away from the part side. Inclined surface 10 that gradually inclines
When the link piece 7 moves from the non-engagement position A to the engagement position B, even if the inclined surface 10 of the link piece 7 comes into contact with the corner between the upper surface and the side surface of the component 5, By guiding the corners relatively downward, the link pieces 7 can be reliably engaged with the upper surface of the component 5.

In the above configuration, when the component 5 is engaged and held between the pair of component holding portions 6 and 6 by the pair of link pieces 7 and 7 respectively located at the non-engaging position A, the component 5 is first removed. After being inserted into the component holding space 8 formed between the pair of component holding portions 6 and 6 and each lead 4 being inserted into each fitting hole 3 a of the molded circuit board 3,
One or two plate-like component engaging portions 7b near the self-hinge portion 7a at the center of each link piece 7 located at the non-engaging position A are directed from the outside to the inside of each component holding portion 6. Pushing with a certain force or more causes jumping buckling.
For example, in the upper right component holding unit 6 in FIG.
One or two plate-shaped component engaging portions 7b in the vicinity of the self hinge portion 7a at the center of the link piece 7 are pushed obliquely downward and leftward with a certain urging force to cause jumping and buckling. In the lower left component holding portion 6 in FIG. 1, one or two plate-shaped component engaging portions 7b near the self-hinge portion 7a at the center of the link piece 7 at the non-engaging position A are inclined obliquely to the upper right. With a certain amount of biasing force. Thereby, each link piece 7 jumps up and causes buckling, and is bent inside the component holding portion 6 like the upper right link piece 7 in FIG. 1, and the lower surfaces of the component engaging portions 7b, 7b of the link piece 7 are changed. The component 5 can be engaged with the upper surface of the component 5 so that the component 5 can be engaged and held, and the vibration of the component 5 can be prevented.

According to the first embodiment, the link pieces 7, 7 of the component holding portions 6, 6 are not pressed into contact with the side surfaces of the component 5 by elastic force, and the link pieces 7, 7 in the component holding space 8 By simply engaging the upper surface of the component 5, it is possible to prevent the component 5 from jumping out and more reliably hold the component 5, and to mount the substrate on a vehicle-mounted electronic device mounted on an automobile or the like. In such a case, it is possible to prevent vibration of the component 5 when the vehicle is running. Further, the side wall 6a of the component holder 6 and the link piece 7
Are connected via the self-hinge portions 9, 9 so that the link piece 7 can be stabilized at two positions, the engaged position and the disengaged position. That is, the self-hinge portions 9, 9 are connected via the self-hinge portions 9, 9,
9 has a thickness of, for example, 0.2 to 0.3 mm, which is thinner than other portions, so that the stress does not increase even if it is bent. Because it is longer than the shortest distance between 9, 9 (in other words,
The total distance of the distance between the center of one self-hinge part 9 and the center of the self-hinge part 7a and the distance between the center of the other self-hinge part 9 and the center of the self-hinge part 7a is better than the distance between the self-hinge parts 9 , 9 are longer than the shortest distance between them), the link piece 7 is compressed and deformed and becomes unstable, and the link piece 7 is bent. Become stable. Also, since the inclined surface 10 is provided on the lower surface of each component engaging portion 7b of each link piece 7, when each link piece 7 moves from the non-engaging position A to the engaging position B, the inclined surface 10 10, the corner between the upper surface and the side surface of the component 5 can be smoothly guided downward, so that the link piece 7 can be smoothly engaged with the upper surface of the component 5, and the component 5 is securely engaged. Can be held together. In addition, in order to engage and hold one corner of the rectangular parallelepiped component 5 in a state where the link piece 7 is bent in an L shape, a direction intersecting with each of two adjacent side surfaces of the component 5, for example, along the orthogonal direction. Since the link piece 7 is engaged and held, the side face of the component 5 is stably engaged and held on any side face. Also,
The component holders 6 and 6 are disposed so as to oppose a pair of corners of the rectangular parallelepiped component 5, respectively.
Each of the link pieces 7 is moved so as to cross over the corner of the component 5 facing the component 6 so that the component can be engaged and held, so that the side portion of the component 5 is damaged by abrasion or pressing force. Therefore, the component 5 can be more stably engaged and held at the pair of opposing corners of the component 5, and the component 5
Vibration can be prevented. Therefore, conventionally, FIG.
When inserting and holding a component, the component is damaged by the component holding part, and the elastic force from the component holding part continues to act on the component while holding the component. Although there is such a problem, in this embodiment, since the elastic force is not continuously applied to the component from the component holding portion, stress is not applied to the component, and damage to the component can be reliably prevented. .

When the circuit is used, each lead 4 of the component 5 is electrically connected to the lead frame 1 by the solder 711 in a state of being inserted into each fitting hole 3a of the molded circuit board 3. When replacing the component 5 due to a failure or separating the component 5 from the molded board 3 at the time of disposal, the solder 711 is removed, and the two non-engaged members 7 and 7 are retracted from the engagement positions B. After returning to the position A with a certain urging force or more, the component 5 is extracted from between the component holding portions 6 and 6,
The component 5 can be easily removed from between the component holding portions 6 and 6. In addition, since the component holding portions 6 and 6 are formed integrally with the synthetic resin covering portion 2 of the molded circuit board 3 using the same synthetic resin, the component holding portions 6 and 6 are simultaneously formed when the synthetic resin covering portion 2 is molded. The component holders 6 and 6 can be efficiently formed, and the component holders 6 and 6 are
Therefore, at the time of disposal or recycling, it can be handled in exactly the same manner as the synthetic resin covering portion 2, and it is possible to consider environmental conservation and recycling.

In the first embodiment, the component holding unit 6
However, as a modified example of the first embodiment, the component holding portion 6 is provided as an example of a component holding member that is a separate member from the coating portion 2. After the manufacture, it may be assembled to the covering portion 2.

In the first embodiment, one component 5 is engaged and held by the pair of component holding portions 6 and 6, but FIG. 3 shows another modification of the first embodiment. In addition, one of the component holding portions is simply a fixed wall 11 bent in an L shape, and the other
May be engaged and held.

(Second Embodiment) A molded circuit board 13 according to a second embodiment of the present invention is formed integrally with the covering portion 2 in place of the component holding portion 6 bent in an L shape in the first embodiment. And a cylindrical component holding portion 16 which is made of synthetic resin and has a cylindrical component holding space 18 inside.

That is, FIG. 4 is a perspective view of a molded circuit board 13 according to a second embodiment of the present invention, in which a pair of curved pieces 12 as an example of an engagement piece of a component holding portion 16 are disengaged. This shows a state of being retracted to the position C. FIG. 5 shows a state in which the pair of curved pieces 12, 12 of the component holding portion 16 project to the engagement position D on the molded circuit board 13 according to the second embodiment. In FIG. 4, the component holding portion 16 is fixedly provided on a molded circuit board 13 so as to protrude in a cylindrical shape. The difference from the first embodiment is that instead of the link piece 7 acting as an example of the engagement piece, a curved piece 12 of a rectangular plate shape that is curved is formed thinner at each end in the longitudinal direction than other portions. That is, it is connected to the upper part of a pair of opposed side walls 16a, 16a on the upper part of the component holding part 16 via the self-hinge parts 19, 19 which can be bent repeatedly. A gap 16 g is formed between the lower surface of each curved piece 12 and the component holding section 16, and each curved piece 12 is connected to the component holding section 16 via a pair of self hinge portions 19, 19.
Can be repeatedly bent outward and inward with respect to the side walls 16a, 16a.

In the above configuration, the part 5 inserted and held in the cylindrical part holding space 18 is connected to the pair of curved pieces 12,
12 when engaging and holding the pair of curved pieces 12,
In FIG. 4 in a state where each of the components 12 is located at the disengagement position C, after the component 5 is inserted into the cylindrical component holding space 18 formed in the cylindrical component holding portion 16, The vicinity of the center of each curved piece 12 at the position C is pushed from the outside to the inside of the component holding portion 16 with a certain or more urging force. As a result, each curved piece 12 jumps up and causes buckling, and is bent inside the component holding portion 6 as shown in FIG. 5, and the lower surface of each curved piece 12 engages with the upper surface of the component 5 to hold the component 5. Engagement and holding can be performed, and vibration of the component 5 can be prevented.

Conversely, when the component 5 is removed from the component holding space 18, the two curved pieces 12, 12 are returned to the respective non-engagement positions C retracted from the respective engagement positions D with a certain or more urging force. After that, the component 5 can be easily removed from the component holding space 18 by extracting the component 5 from the component holding space 18 of the component holding unit 16.

According to the second embodiment, the same effect as that of the first embodiment can be obtained, and the curved pieces 12, 12 are each constituted by one curved plate which acts as an example of the engagement piece. Accordingly, the configuration of the above-described engagement piece, which is an example, is simplified as compared with the link piece 7 in which the two plate-shaped component engagement portions 7b, 7b are connected by the self hinge portion 7a as in the first embodiment. Can be changed.

In the second embodiment, the component holding unit 1
6 is provided integrally with the covering portion 2 by a synthetic resin. As a modified example of the second embodiment, the covering portion 2 is provided.
After the component holder 16 is manufactured as a component holder as a separate member from the above, the component holder 16 may be assembled to the cover 2.

(Third Embodiment) FIG. 6 is a perspective view of a molded circuit board 23 according to a third embodiment of the present invention.

In FIG. 6, a substantially plate-shaped component holding portion 26 having a pair of flat side walls 26a and link pieces 27, and a substantially plate-shaped component holding portion 26 are formed on the molded circuit board 23. A pair of L-shaped fixed walls 26c, 26c arranged so as to form the component holding space 28 are integrally formed with the synthetic resin covering portion of the molded circuit board 23.
Preferably, it is provided with the same synthetic resin as the synthetic resin covering portion.

A link piece 27 as an example of an engagement piece is connected to each side wall 26a of the component holding part 26 via a self-hinge part 29 which can be repeatedly bent. Link piece 27
And a pair of horizontally long rectangular plate-shaped component engagement portions 27b, 27b each having one end connected to the self-hinge portions 29, 29 via a gap 26g, and a pair of component engagement portions. The lower part of the rectangular plate-shaped lower part of the part 25 of a rectangular plate-like two-tiered shape formed like the part 25 is formed with the self-hinge parts 27d, 27d that can be repeatedly bent between the opposite ends of the parts 27b, 27b. Rectangular plate-shaped engaging portion 27 that engages with a rectangular upper small portion 25a on the portion 25b
c. The rectangular plate-like engaging portion 27c extends in a direction crossing the pair of component engaging portions 27b.
The distal end of the plate-like engaging portion 27c has an inclined surface 10a (an inclined surface corresponding to the inclined surface 10 of the first embodiment) which is inclined so as to gradually approach the molded circuit board side from the distal end to the base. When the engaging portion 27c moves from the non-engaging position to the engaging position, the inclined surface 10 of the link piece 27 is provided.
Even if a touches the corner between the upper surface and the side surface of the component 25, by guiding the corner relatively downward, the link piece 27 can be securely engaged with the upper surface of the component 25. I have. When the engagement portion 27c is located at the non-engagement position, the link piece 27 bends in the self-hinge portions 29, 29 and the self-hinge portions 27d, 27d in a direction opposite to the engagement state, so that the component holding portion 27c. Similarly to the lower part of 26, the central part is in a state along a horizontally long bent plate slightly bent to the opposite side to the part holding space 28 in which the part 25 is held and stored.

The lower surface of the component holding portion 26 is integrally fixed to the synthetic resin covering portion of the molded circuit board 23, and the central portion thereof has a component holding space 28 for holding and storing the component 25. Is formed in a horizontally long bent plate shape slightly bent to the opposite side, and the side walls 26a, 26a at both ends fixed to the synthetic resin covering portion of the molded circuit board 23 are formed of the component 25 held in the component holding space. The fixed walls 26c, 26c are arranged so as to be in contact with one side surface and to surround the corners at both ends of the other side surface facing the one side surface of the lower portion 25b of the component 25, respectively. Thus, the pair of side walls 26a, 26a and the pair of fixed walls 26c, 26c form a component holding space 28.

Therefore, in the above configuration, when the component 25 is engaged and held, the component 25 is inserted into the component holding space 28 so that the lower plate-like portion 25b of the component 25 is paired with the pair of side walls 26a, 26a. Are fixed along the surface of the molded circuit board 23 with the fixing walls 26c, 26c, and then the link piece 27 is pressed toward the component 25 by a certain or more urging force to cause jumping buckling, thereby causing self-buckling. The hinge portions 29, 29 and the self-hinge portions 27d, 27d are bent in the opposite direction to move the plate-like engagement portion 27c from the non-engagement position to the engagement position, and the component is formed by the lower surface of the plate-like engagement portion 27c. The upper surface of the plate-like upper portion 25a of the 25 can be engaged and held, and vibration of the component 25 can be prevented. At this time, since the height of the plate-shaped lower portion 25b of the component 25 is lower than the height of the link piece 27, the movement of the link piece 27 is
Is not obstructed by the lower plate-like portion 25b.

On the other hand, when the component 25 is to be removed, the link piece 27 is returned to the non-engagement position retracted from the engagement position by jumping and buckling with a certain urging force, and then the component holding portion 26 is moved. By extracting the component 25 from the component holding space 28, the component 25 can be easily removed from the component holding space 28.

According to the third embodiment, the same functions and effects as those of the first embodiment can be obtained.

In the third embodiment, the component holder 2
6 is provided integrally with the covering portion 2 by a synthetic resin. As a modification of the third embodiment, a component holding member 426 is provided separately from the covering portion so as to be assembled later. You may. That is, as shown in FIG. 7, outwardly bent locking claws 26i, 26i are integrally formed below the pair of flat plate-like side walls 26h (portions corresponding to the side walls 26a in FIG. 6), respectively. The engagement holes (for example, the engagement holes 203e in FIG. 10) of the molded circuit board 23 while slightly deforming the locking claws 26i, 26i in a direction approaching each other.
May be returned to the original state by an elastic force and engaged and fixed to the molded circuit board 23 so as to exhibit the same function as that of FIG. In such a modification of the structure, the component holder 526 can be made of a different material from the covering portion of the molded circuit board 23.
As a result, it is possible to select a material most suitable for a required engagement holding force. When the component holder 526 is unnecessary in the molded circuit board 23, the locking claws 26i, 26i
Can be easily removed by pulling them out of the holes of the molded circuit board 23 while slightly elastically deforming them in a direction approaching each other, or by changing the position of the component holder 526 by pulling out and attaching it to another position again. Easy to do. Further, in the above-described modification, the plate-shaped engagement portion 2
As shown in FIG. 8B, the inclined surface 1
An elastically deformable hook 27f having 0a may be provided. When the hook 27f is formed in this manner, as shown in FIG. 8A, the component 25 can be pressed against the molded circuit board 23 using the elastic deformation force of the hook 27f, and the vibration of the component 25 can be achieved. Prevention can be achieved more effectively. In the component holder 526 shown in FIG. 7, parts having the same functions as those of the component holder 26 shown in FIG.

FIGS. 9A and 9B respectively show a disengaged state and a part relation of a component holder 126 for a molded circuit board according to still another modification of the third embodiment. It is a perspective view in a combined state.

In this modification, the component holder 2 shown in FIGS.
6 and the component holder 526, the structure of the plate-like engaging portion 27c of the link piece 27 is different from that of the pair of component engaging portions 27b, 2
7b, rather than extending in a direction intersecting with each other, a single rectangular plate 127c is sandwiched between the pair of component engaging portions 27b, 27b via a hinge, and a component holder is provided. The lower part of 126 is the center of the part 12
This is not a horizontally bent plate slightly bent to the side opposite to the component holding space 28 in which the 5 is held and stored, but a simpler rectangular plate as a simpler structure.

That is, a pair of flat side walls 26h, 26h of the component holder 526 shown in FIG.
i, self hinge portions 29, 29, a pair of component engaging portions 27
b, 27b, the self-hinge portions 27d, 27d, and the link piece 27 are the component holder 1 of FIGS. 9A and 9B, respectively.
26, a pair of flat side walls 126h, 126h, locking claws 126e, 126e, self-hinge portions 129, 129 that can be repeatedly bent, and a pair of component engaging portions 127b, 127.
b, Self-hinge portions 127d and 12 that can be repeatedly bent
7d, corresponding to the link piece 127, the plate-shaped engaging portion 27 of FIG.
c corresponds to the horizontally long rectangular plate 127c in FIGS. 9A and 9B.

Therefore, in the above configuration, when the three parts 125 arranged in parallel are engaged and held at a time as shown in FIG.
26, the link piece 127 is pressed toward the three components 125 with a certain biasing force or more to cause jumping buckling, and the self hinge portion 129,1
29 and the self-hinge portions 127d, 127d are bent in the opposite direction to move the plate-like engagement portion 127c from the non-engagement position to the engagement position, and the lower surface of the plate-like engagement portion 127c
The upper surfaces of the three components 125 can be engaged and held at one time, and the vibration of the three components 125 can be prevented at a time. At this time, since the height of the three parts 125 is lower than the height of the movement of the link piece 127, the movement of the link piece 127 is three parts 1
It is not hindered by 25.

On the other hand, when three or less parts 125 are to be removed, on the other hand, the link piece 127 is jumped to the non-engagement position retracted from the engagement position by a certain or more urging force to cause buckling. After raising and returning, the desired component 125 is taken out from the vicinity of the lower part of the component holder 126, so that the component 125 can be easily removed.

According to the modification of FIG. 9, in addition to the operation and effect of the third embodiment, vibration can be prevented while a plurality of components 125 are engaged and held by one link piece 127 at a time. , Can be easily removed.

FIGS. 10A and 10B show a disengaged state and a part engaged state of the molded circuit board component holder 226 according to still another modification of the third embodiment. It is a perspective view in a state.

In the modification shown in FIG. 10, as another example of a component to be engaged and held, a sub-board 225 is
While the terminals are fitted in the predetermined holes, the molded circuit board 203
The case of attaching to the device will be described. The basic structure of the component holder 226 according to the modification of FIG. 10 is substantially the same as that of the component holder 126 of FIG. 9, and a pair of flat plates of the component holder 126 of FIGS. 9A and 9B are used. Side walls 126h, 126
h, locking claws 126i, 126i, self-hinge part 12
9, 129, the pair of component engaging portions 127b, 127b, the self hinge portions 127d, 127d, the link piece 127, and the horizontally long rectangular plate 127c are respectively shown in FIG.
A pair of flat side walls 226 of the component holder 226 of FIG.
h, 226h, locking claws 226e, 226e, self-hinge portions 229, 229 that can be repeatedly bent, a pair of component engaging portions 227b, 227b, self-hinge portions 227d, 227d that can be repeatedly bent, a link piece 227, and a rectangular plate 2.
27c. 9A and 9B is different from the component holder 126 of FIGS. 9A and 9B in that the entire component holder is vertically elongated corresponding to the sub-board 225. Further, an engagement groove 227h for engaging with one end of the sub-board 225 is formed in the rectangular plate 227c so as to face upward from the lower surface.

Therefore, in the above configuration, FIG.
As shown in FIG. 7, when the sub-board 225 is engaged and held, the sub-board 225 is arranged near the component holder 226 so as to extend in a direction substantially orthogonal to or crossing the plate surface of the component holder 226, and then the link piece 227 is pressed against one end of the sub-substrate 225 with a certain urging force or more to cause jump buckling, and the self-hinge portions 229, 229 and the self-hinge portions 227d, 227d are bent in opposite directions to form a plate-like engagement. The joint portion 227c is moved from the non-engagement position to the engagement position, and the engagement groove 227h of the plate-like engagement portion 227c is engaged with one end of the sub-board 225 to engage and hold the sub-board 225. And vibration of the sub-substrate 225 can be prevented. At this time, the link piece 22
7, since the height of one end of the sub-board 225 is lower than the uppermost end of the engagement groove 227h.
7 is not hindered by one end of the sub-substrate 225.

On the other hand, when the sub-substrate 225 is to be removed, the link piece 227 is returned to the non-engagement position retracted from the engagement position by jumping buckling with a predetermined force or more while holding the parts. By taking out the sub-board 225 from the vicinity of the lower part of the tool 226, the sub-board 225 can be easily removed.

According to the modification of FIG. 10, in addition to the functions and effects of the third embodiment, the sub-substrate 225 is handled in the same manner as the components 5 and 25 shown in FIGS. Vibration can be prevented while engaging and holding the substrate 203, and detachment can be easily performed. Note that, in FIG. 10, for easy understanding, the locking claws 226 e, 226 e
Although it is illustrated in a state where it is removed from the molded circuit board 203,
After the locking claws 226e and 226e are locked to the components e and 203e, and the component holder 226 is fixedly connected to the molded circuit board 203, the engagement holding and the disengaging of the sub-board 225 are performed.

(Fourth Embodiment) FIGS. 11A and 11B are perspective views of a component holder according to a fourth embodiment of the present invention.

The component holder 41 according to the fourth embodiment
4 is a rectangular cylindrical component holder 414 having a rectangular parallelepiped component holding space inside instead of the cylindrical component holding portion 16 according to the second embodiment, and is separable from the molded circuit board. It is configured to be assembled.

That is, in FIGS. 11 (A) and 11 (B), a link piece 427 bent in a substantially L-shape is provided at the upper end of each of a pair of opposing corners of the quadrangular cylindrical component holder 414. I have. Each link piece 427 includes two plate-shaped component engaging portions 415 and 415 each having an outer end connected to a repeatedly bendable self-hinge portion 419 provided on a side wall 416 of the component holder 414. The two plate-shaped component engaging portions 415 and 415 are connected to each other by a self-hinge portion 420 that can be repeatedly bent.

Therefore, the link piece 427 is
When engaging with a component inserted and held in the rectangular component holding space 418 inside the link piece 414, the link piece 427
With the urging force of a certain level or more, it is pushed toward the component holding space side to cause jumping buckling, to bend in the opposite direction at the self-hinge part 420 and to form two self-hinge parts 419, 4
Even at 19, the inner part of the component holder 414 as shown in FIG. 11B from the non-engagement position E along the other part of the component holder 414 as shown in FIG. The engagement position F enters the holding space 418. At this engagement position F, the component engaging portions 415 and 415 of the link piece 427 bend and protrude inside the corners of the component holder 414, and the lower surfaces of the component engaging portions 415 and 415 become the component holding space 418. It engages with the upper surface of the component held therein so that it can be engaged and held. On the other hand, the space 418 for holding parts
When taking out parts from inside, each link piece 427
The component holding space 418 is pushed outward by a certain or more urging force to cause jump buckling, and returns from the inwardly bent engagement position F to the non-engagement position E in the L-shape.
14 is bent at approximately 90 degrees only at the self-hinge portion 420 which is formed thinner than the other portions and can be repeatedly bent, and is not bent at the two self-hinge portions 419, 419.
The two plate-shaped component engaging portions 415 and 415 are attached to the component holder 4.
14 along with other parts. Below the component holder 414, the component holder itself is molded on a circuit board.
(Not shown), and a locking claw 26
i or locking claw 41 similar to locking claw 126e, 226e
8 are provided.

According to the fourth embodiment, the same operation and effect as those of the first embodiment can be obtained. Further, in order to engage and hold one corner of the rectangular parallelepiped part in a state where the link piece 427 is bent in an L shape, the link is provided along a direction intersecting with each of two adjacent side surfaces of the part, for example, along an orthogonal direction. Piece 4
Since it is engaged and held at 27, it is stably engaged and held on any side surface of the component.

FIGS. 12 and 13 show lower cross sections of a component holder 414 according to various modifications.

In FIG. 12, a guide hole 441 having a conical tapered guide 440 is inserted into the guide hole 441 by correcting the bending of the lead of the component by the taper guide 440 when inserting a component with a lead. This is preferable because it is regulated as follows.

As shown in FIG. 13, a component holder 414 having no bottom as shown by an arrow 445 is suitable for a component having no lead.

On the other hand, FIG. 14 shows a component holder 444 according to still another modification, which is the component holder 41 shown in FIG.
The difference from 4 is that a link piece for engaging and holding the part can be selected and used according to the height of the part.

That is, for example, one of the component holders 444
Three link pieces of a first upper link piece 427A, a first intermediate link piece 427B, and a lower link piece 427C are provided at one corner, and a second upper link piece 427E at the opposite corner is provided. A second intermediate link piece 427D is provided at a corner different from the section. Each link piece 427A-4
The structure of 27E is the same as that of the link piece 427 in FIG. The component engaging portion 41 of the first upper link piece 427A is used.
The lower surfaces of the component engaging portions 415 and 415 of the second upper link piece 427E are positioned lower than the lower surfaces of the component engaging portions 415 and 415 of the second upper link piece 427E. Are the lower surfaces of the component engaging portions 415 and 415 of the first intermediate link piece 427B and the lower end link pieces 427.
It should be located in the middle between the lower surfaces of the component engaging portions 415 and 415 of C.

According to the structure shown in FIG. 14, the first upper link piece 427 is moved from a higher one to a lower one in accordance with the height of the components stored in the component holding space 418.
A, first intermediate link piece 427B, lower end link piece 427
C, second upper link piece 427D, second intermediate link piece 42
By selecting a link piece located at an optimum position from 7E, the part can be locked and held. Therefore,
With one component holder 444, components having different heights can be accommodated, and versatility can be enhanced.
In the component holder 444 shown in FIG. 14, parts having the same functions as those of the component holder 414 shown in FIG.

It should be noted that the present invention is not limited to the above embodiment, but can be implemented in various other modes. For example, in the component holder and the component holder except the component holder or the component holder provided with the inclined surface 10 or 10a, a surface of the link piece as an example of the engagement piece that engages with the component is provided. An inclined surface, such as the inclined surface 10 or 10a, which is inclined in a direction to press the component toward the substrate when the link piece is in the component engagement position may be provided. Further, the embodiments may be appropriately combined as needed.

[0064]

As described above, according to the present invention, in the molded circuit board and the component holder, the component holding member or the component holder can be engaged without pressing the component holding member against the side surface of the component by elastic force. The mating piece can be disengaged from the upper surface of the component in the component holding space so that it can be disengaged, and only by engaging the engaging piece with a force equal to or greater than a certain urging force can prevent the component from jumping out. In addition to being able to engage and hold, when the above-mentioned component holding portion or component holding device is applied to a board incorporated in an in-vehicle electronic device mounted on an automobile or the like, vibration is prevented when the vehicle is running. be able to. Further, the component can be easily removed from the component holding space only by returning the engagement piece from the engagement position to the non-engagement position with a force equal to or greater than a predetermined urging force.

Further, when the component can be held without directly contacting the component, it is possible to prevent the component from being damaged by abrasion or pressing force. In other words, in the related art as shown in FIG. 15, when the component is inserted and held, the component is damaged by the component holding portion, and further, the elastic force from the component holding portion continues to act on the component during the component holding. Therefore, there was a problem that stress was applied to the part, but if the part could be held without directly contacting it, the elastic force would not continue to act on the part from the engagement piece, so the part would be stressed. Therefore, damage to components can be reliably prevented.

In the case where the side wall of the component holder or the side wall forming the space in the component holder and both ends of the engagement piece are connected via the self-hinge part, the engagement piece is moved to the engagement position. It is possible to stabilize each of the two positions with the non-engagement position. That is, since the self-hinge part is connected through a pair of self-hinge parts, the stress does not increase even if the self-hinge part is made thinner than the other parts and bent, and the engagement pieces are geometrically aligned on a straight line. When the length is longer than the shortest distance between the self-hinge portions, the engagement piece is compressed and deformed, so that the engagement piece becomes unstable, and the engagement piece is bent. It becomes stable with the non-engagement position.

Also, the surface of the engaging piece which engages with the above-mentioned component is
When the engaging piece is provided with an inclined surface that is inclined in a direction of pressing the component toward the board when the engaging piece is at the component engaging position, the engaging piece moves from the non-engaging position to the engaging position. At this time, the inclined surface can act to smoothly guide the corner between the upper surface and the side surface of the component downward, and the engaging piece can smoothly engage with the upper surface of the component, thereby securely securing the component. Can be engaged and held.

In using the circuit, each lead of the component is electrically connected to the lead frame by solder in a state of being inserted into each fitting hole of the molded circuit board. Also, when separating the component from the molded board at the time of disposal, the solder is removed, the engaging piece is returned from the engaged position to the non-engaged position with a certain force or more, and then the component is removed from the component holding space. By extracting the component, the component can be easily removed from the space.

In the case where the component holding portion is formed integrally with the synthetic resin covering portion of the molded circuit board by the same synthetic resin, the efficiency is improved simultaneously with the molding of the synthetic resin covering portion. The component holding part can be molded well, and the component holding part is made of the same material as the synthetic resin covering part, so it can be handled exactly the same as the synthetic resin covering part at the time of disposal or recycling. In consideration of environmental protection, recycling can be considered.

In the case where the component holder is provided with an engagement claw that is removably engaged with the engagement hole of the substrate, the engagement claw is fitted to the engagement hole of the substrate. When engaged, the component holder can be easily fixed to the board, while when unnecessary, the component claw can be removed by pulling out the engagement claw from the engagement hole of the board. It can be easily removed from the board.

[Brief description of the drawings]

FIG. 1 is a plan view of a molded circuit board according to a first embodiment of the present invention in a partially engaged state.

FIG. 2 is a cross-sectional view of the molded circuit board according to the first embodiment of the present invention, taken along line II-II of FIG.

FIG. 3 is a plan view of a molded circuit board according to a modification of the first embodiment of the present invention in a state where components are engaged.

FIG. 4 is a perspective view showing a disengaged state in which a link piece of a molded circuit board according to a second embodiment of the present invention is retracted.

FIG. 5 is a perspective view showing an engagement state in which link pieces of the molded circuit board of FIG. 4 are projected.

FIG. 6 is a perspective view of a molded circuit board according to a third embodiment of the present invention in a state where components are engaged.

FIG. 7 is a perspective view of a component holder at an engagement position for a molded circuit board according to a modification of the third embodiment of the present invention.

FIGS. 8A and 8B are cross-sectional views taken along line VIII-VIII of the component holder for the molded circuit board in FIG. 7 in a component engagement holding state and a non-engagement holding state, respectively.

9A and 9B are perspective views of a component holder for a molded circuit board according to another modification of the third embodiment of the present invention in a non-engaged state and a component engaged state, respectively. is there.

FIGS. 10A and 10B are perspective views of a component holder for a molded circuit board in a non-engaged state and a component engaged state, respectively, according to still another modification of the third embodiment of the present invention. It is.

FIGS. 11A and 11B are a perspective view of a component holder according to a fourth embodiment of the present invention in a non-engaged state and a partially enlarged perspective view in a component engaged state, respectively.

FIG. 12 is a lower sectional view according to a modification of the component holder shown in FIG. 11;

FIG. 13 is a lower sectional view according to another modification of the component holder shown in FIG. 11;

FIG. 14A is a perspective view of a component holder according to still another modified example of the fourth embodiment of the present invention in a non-engaged state.

FIG. 15 is a cross-sectional view of a conventional molded circuit board in a component engagement state.

FIG. 16 is a sectional view of a conventional component holder in a component engaged state.

[Explanation of symbols]

1: Lead frame, 2: Synthetic resin coating, 3, 1
3, 23, 203: molded circuit board, 3a: fitting hole, 4:
Leads, 5, 25, 125 parts, 6, 16, 26 parts holding parts, 6a, 16a, 26a, 26h, 126h,
226h, 416: side wall, 6g, 26g: gap, 7, 2
7,127,227,427,427A, 427B, 4
27C, 427D, 427E ... link pieces, 7a, 9, 1
9, 27d, 29, 127d, 129, 227d, 22
9, 419, 420: Self-hinge part, 7b, 15, 2
7b, 127b, 227b, 415...
18, 28, 418: space for holding parts, 10, 10a ...
Inclined surface, 11, 26c: fixed wall, 12: curved piece, 14,
126, 226, 414, 444, 526 ... part holder, 25a ... upper part, 25b ... lower part, 26i, 1
26e, 226e, 418: locking claw, 27c: rectangular plate-shaped engaging portion, 27f: hook, 127c, 227c: rectangular plate, 203e: engaging hole, 225: sub-substrate, 227h ...
Engaging groove, 440: tapered guide, 441: guide hole, 4
45: arrow, 711: solder, A, C, E: non-engagement position, B, D, F: engagement position.

Continued on the front page (72) Inventor Takaaki Higashida 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Person Hiroyuki Uchiyama 1006 Kazuma Kadoma, Kadoma City, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Inventor Yuichi Nakajima 1006 Kadoma Kadoma, Kadoma City, Osaka Pref. F-term in Matsushita Electric Industrial Co., Ltd. CC13 CC32 CC36 DD02 DD05 DR02 DR24 DR29 DR36 DR49 EE01 EE03 GG10 GG13 GG21 5E336 AA01 AA08 AA16 BB05 BB15 BC04 BC26 DD22 DD26 DD28 DD38 EE01 EE15 EE17 GG15 GG23

Claims (12)

[Claims] 1. A molded circuit board in which a lead frame (1) is molded with a synthetic resin, and a component holding space (8, 1) for holding a component (5, 25).
8, 28), and the component engagement positions (B, D) protruding into the space and the non-engagement positions (A, C) retracted from the space are respectively stable and have a certain or more urging force. A component holder (6, 6) having an engagement piece (7, 12, 27) movable between two positions;
16, 26), wherein the component held in the component holding space is engaged and held by the engaging piece located at the component engaging position protruding into the component holding space, and A molded circuit board, wherein the component is prevented from jumping out. 2. The molded circuit board according to claim 1, wherein the component holding portion is formed integrally with a synthetic resin for molding the lead frame. 3. A side wall (6a, 16a,
26a) and a self-hinge portion (9, 19, 27) that can bend only the both ends of the engagement piece with the above-mentioned predetermined urging force.
d, 29) to move the engagement piece to the part engagement position protruding into the space and the non-engagement position retracted from the space by bending at the self hinge portion. The molded circuit board according to claim 1. 4. A side wall (6a) of the component holding portion and an end on the side wall side of the engagement piece are connected by a first self-hinge portion (9) which can be bent only by the predetermined or more urging force. At the same time, the first engagement piece is provided with two plate-shaped component engagement portions (7) connected to the side wall via the first self hinge portion.
b), and the two plate-shaped component engaging portions are connected to each other via a second self-hinge portion (7a) that can be bent only by the predetermined biasing force or more. 3. The bending of the first and second self-hinge portions moves the engagement piece to the part engagement position protruding into the space and the non-engagement position retracted from the space. 4.
A molded circuit board according to item 1. 5. A side wall (26a) of the component holding portion and an end of the side wall side of the engaging piece are connected by a first self-hinge portion (29) which can be bent only by the predetermined or more urging force. In addition, the first engagement piece includes two plate-shaped component engagement portions (27b) connected to the side wall via the first self-hinge portion, and the two plate-shaped component engagement portions. The second self-hinge part (2
7d) and an engaging portion (27c) which can be engaged with the component, and which is bent by the first and second self-hinge portions. 3. The molded circuit board according to claim 1, wherein the molded circuit board is moved between the part engaging position protruding into the space and the non-engaging position retracted from the space. 6. A surface of the engaging piece that engages with the component,
The molded circuit board according to any one of claims 1 to 5, further comprising an inclined surface (10) inclined in a direction to press the component toward the board when the engagement piece is at the component engagement position. 7. A component holder attached to a substrate (3, 23, 203) for engaging and holding a component (5, 125, 225) with the substrate, wherein the component is mounted on the substrate. Parts holding space (2
8, 418) and the retracted disengagement positions (A, C, E) are stable at the part engagement positions (B, D, F) and the retracted non-engagement positions (A, C, E). Movable engagement pieces (27, 127, 227, 427, 427A, 42
7B, 427C, 427D, 427E), and the components held in the component holding space are engaged and held by the engaging pieces protruding into the component holding space so that the components protrude from the space. A component holder characterized by being prevented. 8. An engaging claw (26i, 126e, 2) removably engaging with an engaging hole (203e) of the substrate.
The component holder according to claim 7, further comprising (26e, 418). 9. A side wall (26h, 12h) constituting said space.
6h, 226h, 416) and both end portions of the engaging piece can be bent only by the above-mentioned predetermined urging force (127d, 129, 227d, 229, 419, 42).
0) to move the engagement piece to the part engagement position protruding into the space and the non-engagement position retracted from the space by bending at the self-hinge part. The component holder according to 7 or 8. 10. A side wall (416) constituting the space and an end on the side wall side of the engagement piece are connected by a first self-hinge part (419) which can be bent only by the predetermined or more urging force. In addition, the first engagement piece includes two plate-shaped component engagement portions (415) connected to the side wall via the first self-hinge portion, and the two plate-shaped component engagement portions. The engagement piece is configured to be connected to each other via a second self-hinge part (420) that can be bent only by the above-mentioned predetermined urging force, and is bent by the first and second self-hinge parts. 9. The component holder according to claim 7, wherein the component is moved between the component engagement position protruding into the space and the non-engagement position retracted from the space. 10. 11. The side wall (26h, 26h,
126h, 226h) and the side end of the engagement piece on the side wall side are connected by a first self-hinge part (29, 129, 229) that can be bent only by the above-mentioned predetermined urging force, and The joint piece is connected to the two plate-shaped component engaging portions (27) connected to the side wall via the first self hinge portion.
b, 127b, 227b) and the two plate-shaped component engaging portions are connected via second self-hinge portions (27d, 127d, 227d) that can be bent only by the above-mentioned predetermined biasing force, and Engaging portions (27c, 12
7c, 227c).
The bending part of the self-hinge part moves the engagement part of the engagement piece to the part engagement position protruding into the space and the non-engagement position retracted from the space. Parts holder. 12. A surface (10) of a surface of the engagement piece that engages with the component has an inclined surface that is inclined in a direction to press the component toward the substrate when the engagement piece is in the component engagement position. The component holder according to claim 7.