JP2000213071A - Mildewproof building material - Google Patents
Mildewproof building materialInfo
- Publication number
- JP2000213071A JP2000213071A JP11054489A JP5448999A JP2000213071A JP 2000213071 A JP2000213071 A JP 2000213071A JP 11054489 A JP11054489 A JP 11054489A JP 5448999 A JP5448999 A JP 5448999A JP 2000213071 A JP2000213071 A JP 2000213071A
- Authority
- JP
- Japan
- Prior art keywords
- resin emulsion
- building
- building plate
- synthetic resin
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は建造物の屋根下地
材、内壁材、床材等に使用する防黴建材に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antifungal building material used for a roof base material, an inner wall material, a floor material and the like of a building.
【0002】[0002]
【従来の技術】従来建造物の屋根下地材、内壁材、床材
等に使用する建築板材に合板、ファイバーボード、パー
ティクルボード、石膏ボード、ロックウール板、木毛セ
メント板、珪カル板などがあった。2. Description of the Related Art Plywood, fiber board, particle board, gypsum board, rock wool board, wood wool cement board, silica board, etc. are used as building board materials used for roof base materials, interior wall materials, floor materials, etc. of conventional buildings. there were.
【0003】このような建築板材は多孔質であり、高断
熱高気密の建物に使用した場合建築板材の内部及び表面
に黴が発生する。特に合板、ファイバーボード、パーテ
ィクルボードなどはホルムアルデヒドが発生し、社会問
題となっいる。[0003] Such a building board is porous, and when used in a highly heat-insulated and airtight building, mold is generated inside and on the surface of the building board. In particular, plywood, fiber board, particle board and the like generate formaldehyde, which is a social problem.
【0004】防黴塗料で表面を塗装しても、塗装できな
い建築板材の内部や裏面には多くの黴が発生し健康上は
なはだ問題となっいたのである。[0004] Even if the front surface is painted with an antifungal paint, many molds are generated inside and on the back surface of the building board material that cannot be painted, which has become a serious health problem.
【0005】[0005]
【発明が解決しようとする課題】本発明はかかる事情に
鑑みなされたもので、建築板材の表面及び内部に発生す
る黴及びホルムアルデヒドを完全に防止することであ
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to completely prevent mold and formaldehyde generated on the surface and inside of a building board.
【0006】[0006]
【課題を解決するための手段】建造物の屋根下地材、内
壁材、床材等に使用する建築板材を加熱して防黴剤を混
入した合成樹脂エマルジョン型塗膜防水材を用いて建築
板材の内部に含浸浸透させると共に全面を被覆する。Means for Solving the Problems Architectural board materials using a synthetic resin emulsion type coating waterproofing material mixed with a fungicide by heating a building board material used for a roof base material, an inner wall material, a floor material, etc. of a building. Impregnated and penetrated into the inside of the substrate and cover the entire surface.
【0007】[0007]
【発明の実施の形態】建造物の屋根下地材、内壁材、床
材、この他天井、壁下地材、間仕切壁材などに、合板、
ファイバーボード、パーティクルボード、石膏ボード、
ロックウール板、木毛セメント板、珪カル板、繊維補強
系ボードなどが使用されている。BEST MODE FOR CARRYING OUT THE INVENTION Plywood, roofing material, interior wall material, flooring material, ceiling, wall material, partition wall material, etc.
Fiber board, particle board, gypsum board,
Rock wool boards, wood wool cement boards, silical boards, fiber reinforced boards and the like are used.
【0008】これら建築板材が建造物の各部位に使用さ
れた場合、使用箇所、使用条件によって主に次のような
黴が発生する。発生頻度の高い黴はグラドスポリウム、
ペニシリウム、ウロクラディウム、アルタナリア、アク
レモニウム、アスペルギルス、トリコデルマ、ホーマな
どである。[0008] When these building boards are used in various parts of a building, the following molds are mainly generated depending on the place of use and conditions of use. Gradosporium, a mold that frequently occurs,
Penicillium, Ulocladium, Alternaria, Acremonium, Aspergillus, Trichoderma and Houma.
【0009】前記建築板材のうち、合板、パーティクル
ボードは建築内装仕上材として大量に使用されているも
のであるが、ホルムアルデヒドを発生するということが
大きな欠点とされている。[0009] Of the building board materials, plywood and particle board are used in large quantities as building interior finishing materials, but they have a major drawback in that they generate formaldehyde.
【0010】このように黴の発生を防止するために、防
黴剤を各種塗料に入れた防黴塗料が一般に使用され、防
黴塗料を建築板材に塗布している。しかし塗装は建築施
工後におこなわれることが多く、建築板材の表面だけで
ある。又建築板材の状態で塗装又はどぶ浸けすることも
あるが建築板材の内部に迄浸透せず内部から発生してく
る黴に対しては防止することができなかった。[0010] In order to prevent the occurrence of mold as described above, an antifungal paint containing a fungicide in various paints is generally used, and the antifungal paint is applied to a building board. However, painting is often done after building construction, only on the surface of the building boards. Further, the building plate material may be painted or soaked in the state, but it cannot penetrate into the interior of the building plate material and cannot prevent mold generated from the inside.
【0011】建築板材を70〜100℃の加熱状態にし
て建築板材内部の空気を膨張させ、防黴入り合成樹脂エ
マルジョン型塗膜防水材を塗布又は浸漬させると建築板
材の内部に迄容易に含浸浸透させることができる。特に
端部からの浸透は、加熱しない場合に比較して大幅に向
上する。When the building board is heated to 70 to 100 ° C. to expand the air inside the building board and apply or immerse a synthetic resin emulsion-type coating film waterproofing material containing antifungal, the inside of the building board is easily impregnated. Can be infiltrated. In particular, permeation from the end is greatly improved as compared with the case without heating.
【0012】建築板材を加熱する方法は、一般に使用さ
れている電熱又は温風式の乾燥器を使用する。建築板材
を金属製コンベアで連続式乾燥器に入れ70〜100℃
に加熱した建築板材の端部を防黴入り合成樹脂エマルジ
ョン防水塗材でまず塗布又は浸漬し次に建築板材の表裏
面を塗布する。As a method for heating the building board, a commonly used electric or hot air dryer is used. Put the building board in a continuous dryer on a metal conveyor and put it at 70-100 ° C.
First, the end of the heated building board material is applied or dipped with a synthetic resin emulsion waterproof coating material containing fungicide, and then the front and back surfaces of the building board material are applied.
【0013】本発明に使用する合成樹脂エマルジョン型
塗膜防水材の合成樹脂エマルジョンとしてはアクリル系
樹脂エマルジョン、酢酸ビニル系エマルジョン、塩化ビ
ニル系樹脂エマルジョン、塩化ビニリデン系樹脂エマル
ジョン、スチレン・ブタジエン系樹脂エマルジョン、エ
ポキシ系樹脂エマルジョンおよびアクリル酸エステル、
スチレン、エチレン、ビニルエステル、酢酸ビニル、合
成ゴム等の共重合したものなどである。The synthetic resin emulsion of the synthetic resin emulsion type coating film waterproofing material used in the present invention includes acrylic resin emulsion, vinyl acetate emulsion, vinyl chloride resin emulsion, vinylidene chloride resin emulsion, styrene / butadiene resin emulsion. , Epoxy resin emulsion and acrylic acid ester,
Examples thereof include copolymers of styrene, ethylene, vinyl ester, vinyl acetate, synthetic rubber, and the like.
【0014】例えばこれら共重合したものとしてはアク
リル/酢酸ビニル共重合体、塩化ビニリデン/ブチルア
クリレート共重合体、エチレン/酢酸ビニル共重合体等
があげられる。For example, these copolymers include acryl / vinyl acetate copolymer, vinylidene chloride / butyl acrylate copolymer, ethylene / vinyl acetate copolymer and the like.
【0015】又必要に応じて合成樹脂エマルジョンから
なる防水材の性状を向上させるため、分散剤として各種
の界面活性剤、エマルジョンを安定化させる乳化剤、エ
マルジョンのあわ立て防止剤、増粘剤、たるみ防止剤、
沈降防止剤、凍結防止剤などを添加しても良い。さらに
性能を向上させる目的でたわみ性を与える可塑剤、熱、
光による劣化防止を図る安定剤剤等を添加しても良い。In order to improve the properties of the waterproofing material comprising a synthetic resin emulsion, if necessary, various surfactants as a dispersant, an emulsifier for stabilizing the emulsion, an anti-wrinkling agent for the emulsion, a thickener, a sag. Inhibitor,
An anti-settling agent, an anti-freezing agent and the like may be added. Plasticizer that gives flexibility for the purpose of further improving performance, heat,
A stabilizer for preventing deterioration due to light may be added.
【0016】合成樹脂エマルジョン型塗膜防水材に添加
する防黴剤は塗材に混入する際に変質、劣化することな
く、塗布後一定の耐久性を有し発生する全ての黴に対し
て抗力を有するものでなくてはならない。防黴剤として
は、有機スズ系化合物、有機リン系化合物、抗菌性ゼオ
ライト、ベンズイミダゾール系化合物、テトラクロロイ
ソフタロニトリル系化合物などがあり、例えば市販のテ
トラクロロイソフタロニトリル、チアベンタゾールなど
が使用できる。The antifungal agent to be added to the synthetic resin emulsion type coating film waterproof material does not deteriorate or deteriorate when mixed into the coating material, has a certain durability after application and has a resistance to all molds generated. It must have Examples of the fungicide include organotin compounds, organophosphorus compounds, antibacterial zeolites, benzimidazole compounds, tetrachloroisophthalonitrile compounds, and the like, for example, commercially available tetrachloroisophthalonitrile, thiabentazole and the like. Can be used.
【0017】[0017]
【実施例】以下本発明の実施例について説明する。Embodiments of the present invention will be described below.
【0018】実施例 基材同等不燃エマルジョン型アク
リル系塗膜防水材(商品名「リボールマイティ」(株)
リボール製)100重量部に対して防黴剤テトラクロロ
イソフタロニトリルを5重量部添加混合した。この防水
塗材に80℃に加熱した200×200mm、厚さ12
mmのパーティクルボードおよび合板の端部を浸漬さ
せ、次にこの防水塗材で表裏面を塗布した。Example A non-combustible emulsion-type acrylic coating film waterproofing material equivalent to a base material (trade name "Roll Mighty" Co., Ltd.)
5 parts by weight of a fungicide, tetrachloroisophthalonitrile, was added and mixed with 100 parts by weight of Ribor. 200 × 200 mm, thickness 12 heated to 80 ° C.
The ends of the particle board and the plywood having a thickness of 2 mm were immersed, and then the front and back surfaces were coated with the waterproof coating material.
【0019】比較例1 加熱しないパーティクルボード
及び合板を防水塗材に1分間浸漬させた。Comparative Example 1 Unheated particle board and plywood were immersed in a waterproof coating material for 1 minute.
【0020】比較例2 パーティクルボード及び合板に
何も被覆しないもの。Comparative Example 2 Particle board and plywood were not covered with anything.
【0021】防黴効果の結果を表1に示す。Table 1 shows the results of the antifungal effect.
【0022】[0022]
【表1】 [Table 1]
【0023】防黴効果を確認する為、密閉された発泡ス
チロール箱に試料を入れグラドスポリウム、アスペルギ
ルス・ニゲル、アルタナリア、ペニシリウム・フニクロ
スム、ウロクラディウム、フザリウム、ノリゾプス・オ
リゼ、グリオクラジウム・ヴィレンス、ケトミウム・グ
ロボスムなど供試菌の混合胞子懸濁液を定期的にまきか
け湿度85〜95%、温度10〜30℃に保持して2ヵ
月間観察を行なった。In order to confirm the fungicidal effect, a sample was placed in a closed Styrofoam box, and gladosporium, Aspergillus niger, Alternaria, Penicillium funiculosum, urocldium, fusarium, Norizops oryzae, Gliocladium virens, ketomium. A mixed spore suspension of a test bacterium such as globosum was periodically sprinkled and maintained at a humidity of 85 to 95% and a temperature of 10 to 30 ° C., and observed for 2 months.
【0024】[0024]
【発明の効果】建築板材の防黴を完全に行なうためには
建築板材の表裏面のみでなく、建築板材の内部迄防黴剤
が充分含浸浸透していることが必要であり、建築板材を
加熱して防黴剤入り合成樹脂エマルジョン型防水材を塗
布、浸漬することによってその効果があることが確認さ
れた。さらに合板、パーティクルボードから発生するホ
ルムアルデヒドを完全に防止することができた。According to the present invention, in order to completely prevent the mold from building boards, it is necessary that not only the front and back surfaces of the building boards but also the inside of the building boards be sufficiently impregnated with the fungicide. The effect was confirmed by heating and applying and dipping a synthetic resin emulsion type waterproof material containing a fungicide. Furthermore, formaldehyde generated from plywood and particle board was completely prevented.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2B230 AA01 AA03 BA01 BA04 BA19 CB25 CC30 DA02 EA11 EB02 EB03 EB05 2E001 DH12 FA03 FA10 FA11 FA14 FA16 HA01 HA03 HA05 HA32 HC02 HC04 HD00 HF00 4D075 AB03 BB23X BB33X BB36X CA45 DA25 DB22 DB25 DC02 EA13 EB15 EB22 EC31 EC35 EC60 4F100 AK01B AK25 AP01A AP02A AP03A BA02 BA07 CA30B EH46 EJ82 GB07 JC00 JC00B ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2B230 AA01 AA03 BA01 BA04 BA19 CB25 CC30 DA02 EA11 EB02 EB03 EB05 2E001 DH12 FA03 FA10 FA11 FA14 FA16 HA01 HA03 HA05 HA32 HC02 HC04 HD00 HF00 4D075 AB03 BB23X BB33 DB25 DB22 EA13 EB15 EB22 EC31 EC35 EC60 4F100 AK01B AK25 AP01A AP02A AP03A BA02 BA07 CA30B EH46 EJ82 GB07 JC00 JC00B
Claims (1)
た合成樹脂エマルジョン型塗膜防水材を用いて塗布又は
浸漬し建築板材を被覆することを特徴とする防黴建材。1. A fungicidal building material characterized by heating a building board material and coating or dipping it with a synthetic resin emulsion-type coating waterproofing material mixed with a fungicide to coat the building board material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11054489A JP2000213071A (en) | 1999-01-26 | 1999-01-26 | Mildewproof building material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11054489A JP2000213071A (en) | 1999-01-26 | 1999-01-26 | Mildewproof building material |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000213071A true JP2000213071A (en) | 2000-08-02 |
Family
ID=12972069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11054489A Pending JP2000213071A (en) | 1999-01-26 | 1999-01-26 | Mildewproof building material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000213071A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009143814A (en) * | 2007-12-11 | 2009-07-02 | Japan Enviro Chemicals Ltd | Mildewproofing composition |
JP2013032375A (en) * | 2012-10-05 | 2013-02-14 | Japan Enviro Chemicals Ltd | Antifungal composition |
-
1999
- 1999-01-26 JP JP11054489A patent/JP2000213071A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009143814A (en) * | 2007-12-11 | 2009-07-02 | Japan Enviro Chemicals Ltd | Mildewproofing composition |
JP2013032375A (en) * | 2012-10-05 | 2013-02-14 | Japan Enviro Chemicals Ltd | Antifungal composition |
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