JP2000212434A5 - - Google Patents
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- JP2000212434A5 JP2000212434A5 JP1999013383A JP1338399A JP2000212434A5 JP 2000212434 A5 JP2000212434 A5 JP 2000212434A5 JP 1999013383 A JP1999013383 A JP 1999013383A JP 1338399 A JP1338399 A JP 1338399A JP 2000212434 A5 JP2000212434 A5 JP 2000212434A5
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- acid
- diamine
- dicarboxylic
- beta
- alpha
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- -1 aliphatic dicarboxylic acids Chemical class 0.000 description 7
- 150000001991 dicarboxylic acids Chemical group 0.000 description 5
- 150000004985 diamines Chemical group 0.000 description 4
- LVHBHZANLOWSRM-UHFFFAOYSA-N Itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 239000011528 polyamide (building material) Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N Adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N Glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N Glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Chemical compound C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N Sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N Suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N fumaric acid Chemical compound OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N 1,2-Diaminopropane Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N 1,2-ethanediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 1
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N 2,6-Naphthalenedicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- JZUMVFMLJGSMRF-UHFFFAOYSA-N 2-Methyladipic acid Chemical compound OC(=O)C(C)CCCC(O)=O JZUMVFMLJGSMRF-UHFFFAOYSA-N 0.000 description 1
- ZVMAGJJPTALGQB-UHFFFAOYSA-N 2-[3-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=CC(OCC(O)=O)=C1 ZVMAGJJPTALGQB-UHFFFAOYSA-N 0.000 description 1
- DNXOCFKTVLHUMU-UHFFFAOYSA-N 2-[4-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=C(OCC(O)=O)C=C1 DNXOCFKTVLHUMU-UHFFFAOYSA-N 0.000 description 1
- NWYDEWXSKCTWMJ-UHFFFAOYSA-N 2-methylcyclohexane-1,1-diamine Chemical compound CC1CCCCC1(N)N NWYDEWXSKCTWMJ-UHFFFAOYSA-N 0.000 description 1
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical group NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- FJSUFIIJYXMJQO-UHFFFAOYSA-N 3-methylpentane-1,5-diamine Chemical compound NCCC(C)CCN FJSUFIIJYXMJQO-UHFFFAOYSA-N 0.000 description 1
- HSSYVKMJJLDTKZ-UHFFFAOYSA-N 3-phenylphthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C=CC=CC=2)=C1C(O)=O HSSYVKMJJLDTKZ-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-Methylenedianiline Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4,4'-Oxydianiline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- SQJQLYOMPSJVQS-UHFFFAOYSA-N 4-(4-carboxyphenyl)sulfonylbenzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C=C1 SQJQLYOMPSJVQS-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Azelaic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Di(p-aminophenyl)sulphone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N Dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N Hexamethylenediamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N Isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- 229940018564 M-PHENYLENEDIAMINE Drugs 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N M-Phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N Maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N P-Phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N Phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- KIDHWZJUCRJVML-UHFFFAOYSA-N Putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 1
- QMKYBPDZANOJGF-UHFFFAOYSA-N Trimesic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N cyclohexane-1,4-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- LNGJOYPCXLOTKL-UHFFFAOYSA-N cyclopentane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C1 LNGJOYPCXLOTKL-UHFFFAOYSA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical group NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
Description
テレフタル酸単位以外の他のジカルボン酸単位(a) としては、マロン酸、ジメチルマロン酸、コハク酸、グルタル酸、アジピン酸、2−メチルアジピン酸、トリメチルアジピン酸、ピメリン酸、2,2−ジメチルグルタル酸、2,2−ジエチルコハク酸、アゼライン酸、セバシン酸、スベリン酸等の脂肪族ジカルボン酸;1,3−シクロペンタンジカルボン酸、1,4−シクロヘキサンジカルボン酸等の脂環式ジカルボン酸;イソフタル酸、2,6−ナフタレンジカルボン酸、2,7−ナフタレンジカルボン酸、1,4−ナフタレンジカルボン酸、1,4−フェニレンジオキシジ酢酸、1,3−フェニレンジオキシジ酢酸、ジフェン酸、ジフェニルメタン−4,4’−ジカルボン酸、ジフェニルスルホン−4,4’−ジカルボン酸、4,4’−ビフェニルジカルボン酸等の芳香族ジカルボン酸から誘導される単位が挙げられる。これらの単位を1種もしくは2種以上含んでもよい。上記単位の中でも、芳香族ジカルボン酸から誘導される単位が好ましい。さらに、トリメリット酸、トリメシン酸、ピロメリット酸等の多価カルボン酸から誘導される単位を、溶融成形が可能な範囲内で含んでいてもよい。 Examples of the dicarboxylic acid unit (a) other than the terephthalic acid unit include malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, trimethyladiponic acid, pimeric acid, 2,2-dimethyl - glutaric acid, 2, 2-diethyl succinate, azelaic acid, sebacic acid, aliphatic dicarboxylic acids such as suberic acid; 1,3-cyclopentane dicarboxylic acid, alicyclic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid; Isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid, diphenylmethane-4,4 '- dicarboxylic acid, diphenylsulfone-4,4' - dicarboxylic acid, 4,4 '- include units derived from aromatic dicarboxylic acids such as biphenyl dicarboxylic acid. These units may be contained alone or in combination of two or more. Among the above units, a unit derived from an aromatic dicarboxylic acid is preferable. Further, units derived from polyvalent carboxylic acids such as trimellitic acid, trimesic acid and pyromellitic acid may be contained within a range that allows melt molding.
1,9−ノナンジアミン単位および2−メチル−1,8−オクタンジアミン単位以外の他のジアミン単位(b) としては、エチレンジアミン、プロピレンジアミン、1,4−ブタンジアミン、1,6−ヘキサンジアミン、1,8−オクタンジアミン、1,10−デカンジアミン、1,12−ドデカンジアミン、3−メチル−1,5−ペンタンジアミン、2,2,4−トリメチル−1,6−ヘキサンジアミン、2,4,4−トリメチル−1,6−ヘキサンジアミン、5−メチル−1,9−ノナンジアミン等の脂肪族ジアミン;シクロヘキサンジアミン、メチルシクロヘキサンジアミン、イソホロンジアミン等の脂環式ジアミン;p−フェニレンジアミン、m−フェニレンジアミン、キシレンジアミン、4,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルスルホン、4,4’−ジアミノジフェニルエーテル等の芳香族ジアミンから誘導される単位が挙げられる。これらの単位を1種もしくは2種以上含んでもよい。 Other diamine units (b) other than 1,9-nonanediamine unit and 2-methyl-1,8-octanediamine unit include ethylenediamine, propylenediamine, 1,4-butanediamine, 1,6-hexanediamine, and 1 , 8-octane diamine, 1,10-decane diamine, 1,12-dodecane diamine, 3-methyl-1,5-pentane diamine, 2,2,4-trimethyl-1,6-hexanediamine, 2,4 Aliper diamines such as 4-trimethyl-1,6-hexanediamine, 5-methyl-1,9-nonanediamine; alicyclic diamines such as cyclohexanediamine, methylcyclohexanediamine, isophoronediamine; p-phenylenediamine, m-phenylene diamine, xylene diamine, 4,4 '- diaminodiphenylmethane, 4,4' - diaminodiphenyl sulfone, 4,4 '- include units derived from aromatic diamines such as diaminodiphenyl ether. These units may be contained alone or in combination of two or more.
ポリアミド系樹脂(I) の製造には、結晶性ポリアミドを製造する方法として知られている任意の方法を用いて製造することができる。例えば、酸クロライドとジアミンを原料とする溶液重合法あるいは界面重合法、ジカルボン酸とジアミンを原料とする溶融重合法、固相重合法、溶融押出重合法等の方法により重合可能である。以下に、本発明者らの研究による好適なポリアミド系樹脂の製造方法を示す。 The polyamide-based resin (I) can be produced by using any method known as a method for producing a crystalline polyamide. For example, a solution polymerization method or interfacial polymerization method for the acid chloride and a diamine as raw materials, melt polymerization method using a dicarboxylic acid and a diamine as raw materials, solid-phase polymerization method, a polymerizable by a method such as melt pressing Dekasane legal. The following shows a suitable method for producing a polyamide resin according to the research conducted by the present inventors.
スチレン系重合体(III) におけるα,β−不飽和カルボン酸および/またはその誘導体単位(d) としては、特に制限はないが、熱可塑性樹脂組成物の機械的特性が優れたものになる点から、カルボキシル基、酸無水物基(−CO−O−CO−)およびエポキシ基からなる群より選ばれる少なくとも1種の官能基を有するα,β−不飽和カルボン酸および/またはその誘導体単位であることが好ましく、例えば、アクリル酸、メタクリル酸等のα,β−不飽和モノカルボン酸;マレイン酸、イタコン酸、フタル酸等のα,β−不飽和ジカルボン酸;グリシジルアクリレート、グリシジルメタクリレート等のα,β−不飽和モノカルボン酸エステル;無水マレイン酸、無水イタコン酸、無水フタル酸等のα,β−不飽和ジカルボン酸無水物等から誘導される単位が挙げられ、中でも無水マレイン酸、無水イタコン酸、無水フタル酸等のα,β−不飽和ジカルボン酸無水物、およびグリシジルアクリレート、グリシジルメタクリレート等のα,β−不飽和ジカルボンエステルから誘導される単位が好ましい。 The α, β-unsaturated carboxylic acid and / or its derivative unit (d) in the styrene polymer (III) is not particularly limited, but the mechanical properties of the thermoplastic resin composition are excellent. In α, β-unsaturated carboxylic acid and / or a derivative unit thereof having at least one functional group selected from the group consisting of a carboxyl group, an acid anhydride group (-CO-O-CO-) and an epoxy group. preferably there, such as acrylic acid, such as methacrylic acid alpha, beta-unsaturated monocarboxylic acid; maleic acid, Lee itaconic acid, alpha, such as phthalic acid, beta-unsaturated dicarboxylic acid; glycidyl acrylate, glycidyl methacrylate of alpha, beta-unsaturated monocarboxylic acid ester; maleic acid, anhydrous itaconic acid, alpha, such as phthalic anhydride, include units derived from beta-unsaturated dicarboxylic acid anhydride and the like, among others maleic anhydride , anhydrous itaconic acid, alpha, such as phthalic anhydride, beta-unsaturated dicarboxylic acid anhydride, and glycidyl acrylate, alpha, such as glycidyl methacrylate, units derived from beta-unsaturated dicarboxylic esters are preferred.
Priority Applications (1)
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JP11013383A JP2000212434A (en) | 1999-01-21 | 1999-01-21 | Thermoplastic resin composition and molded article made therefrom |
Applications Claiming Priority (1)
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JP11013383A JP2000212434A (en) | 1999-01-21 | 1999-01-21 | Thermoplastic resin composition and molded article made therefrom |
Publications (2)
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JP2000212434A JP2000212434A (en) | 2000-08-02 |
JP2000212434A5 true JP2000212434A5 (en) | 2005-09-15 |
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JP11013383A Pending JP2000212434A (en) | 1999-01-21 | 1999-01-21 | Thermoplastic resin composition and molded article made therefrom |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US7132063B2 (en) * | 2003-08-16 | 2006-11-07 | General Electric Company | Poly(arylene ether)/polyamide composition |
US7182886B2 (en) * | 2003-08-16 | 2007-02-27 | General Electric Company | Poly (arylene ether)/polyamide composition |
CN101305051B (en) * | 2005-11-10 | 2013-01-02 | 旭化成化学株式会社 | Resin composition having excellent flame retardance |
US8263697B2 (en) | 2005-11-15 | 2012-09-11 | Asahi Kasei Chemicals Corporation | Heat-resistant resin composition |
JP2007154110A (en) * | 2005-12-07 | 2007-06-21 | Asahi Kasei Chemicals Corp | Resin composition exhibiting excellent heat resistance |
CN101679744B (en) | 2007-06-04 | 2013-09-25 | 旭化成化学株式会社 | Polyamide-polyphenylene ether resin composition and film |
US20090146109A1 (en) | 2007-12-06 | 2009-06-11 | Sabic Innovative Plastics Ip Bv | Thermoplastic poly(arylene ether)/polyamide blends and method of making |
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1999
- 1999-01-21 JP JP11013383A patent/JP2000212434A/en active Pending
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