JP2000212255A - Epoxy resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in resistance to soldering heat, reliability of moisture resistance, fluidity, and mechanical properties by incorporating an epoxy resin containing a biphenyl epoxy compound as the essential ingredient, a curing agent containing a phenol-alkylbenzene-aldehyde resin as the essential ingredient, and a filler into the same. SOLUTION: The epoxy resin contains an epoxy compound of formula I as the essential ingredient. The curing agent contains, as the essential ingredient, a phenol-alkylbenzene-aldehyde resin which is prepared by reacting an alkylbenzene of formula III with an aldehyde of the formula: R3-CHO in the presence of an acid catalyst and reacting the resultant resin (P) with a phenol (Z) of formula IV in a wt. ratio satisfying 1<=Z/P<=20 in the presence of an acid catalyst and then with an aromatic aldehyde (Y) in a molar ratio satisfying 0.1<=Y/Z<=1. In the formulas, OG is a group of formula II; R1 is H or the like; R2 is a 1-8C alkyl or the like: (m) is 1-4; R3 is H or the like; R4 is H or the like; (n) is 1-3: and R5 is H or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition excellent in fluidity, mechanical properties and solder heat resistance and suitable for semiconductor encapsulation.

[0002]

2. Description of the Related Art Epoxy resins are excellent in heat resistance, moisture resistance, mechanical properties, electrical properties, adhesiveness and the like, and are therefore used as various industrial materials such as paints, adhesives, and electrical insulating materials. Above all, demand in the field of electric and electronic materials has increased significantly in recent years, and the required properties in terms of physical properties have become more and more severe. 2. Description of the Related Art Conventionally, various sealing techniques have been implemented or studied to protect semiconductor elements such as diodes, transistors, integrated circuits (ICs), and large-scale integrated circuits (LSIs) from an external atmosphere and mechanical shock. As such a sealing technique, a hermetic seal made of metal or ceramic has been used for a long time, but recently, a resin sealing method has become mainstream, and among these, a resin made of epoxy resin has been used in view of economical efficiency, mass productivity, and various characteristics. Sealing is central.

In recent years, the method of mounting components on a printed circuit board has been changed from a conventional insertion method of inserting lead pins into a board hole to a surface mounting method of soldering a component to a board surface, and a semiconductor package is also of an insertion type dual type. There is a shift from in-line packages (DIP) to small and thin flat packages suitable for surface mounting and small outline packages. With the shift to such surface mounting, a new soldering process has become a major problem. That is, in the conventional pin insertion method, the lead portion is only partially heated in the soldering process, but in the surface mounting method, the entire package is immersed in a heating medium and heated. At that time, the package itself is heated to a high temperature of 200 ° C. or more, and therefore, peeling may occur between the semiconductor chip and the sealing resin or between the lead frame and the sealing resin. Cracks occur, and the reliability of the semiconductor device is greatly reduced. In order to solve the above problems, the sealing resin is required to have further improved solder heat resistance, lower stress and improved moisture resistance.

As a study of improving the sealing resin, for example, in the improvement of the epoxy resin, the glass transition temperature has been improved by increasing the molecular weight and the epoxy equivalent has been reduced, and the breaking strength at high temperatures has been improved. Is not yet reached. In addition, studies have been made to improve the heat resistance by using a low OH equivalent phenol compound such as tris (hydroxyphenyl) methane or a polyhydric phenol instead of the phenol novolak resin used as a curing agent (Japanese Patent Laid-Open No. Hei 3 (1991) -32). 292322). However, although the glass transition temperature and the breaking strength at high temperatures are improved as a molding material, almost no improvement is observed in the adhesion after surface mounting, the solder cracking property, and the reliability as a semiconductor device.

[0005] As a method of reducing the stress, various methods have conventionally been used for lowering the elastic modulus. That is, there are many methods of adding a flexible resin, particularly, a method of modifying with a silicone resin. However, the addition of the silicon resin alone is incompatible with the epoxy resin, so that phase separation occurs in the sealing resin, and there is a problem that cracks easily occur after mounting. Therefore, studies have been made to reduce the elastic modulus by adding a silicone resin as a prepolymer reacted with an epoxy resin in advance. This method is also applied to a phenol resin as a curing agent, and its effect of reducing stress has been recognized. However, although such a low stress can be realized by the silicone resin, on the other hand, there is a problem that the glass transition temperature is lowered and the solder cracking property is not improved.

[0006] In addition, a method of lowering the viscosity by combining a novolak type epoxy resin with a low melt viscosity with a phenol novolak resin to increase the content of a filler and improving moisture resistance and solder heat resistance has been studied and improved. ing. In addition, a method has been proposed to solve the above problem by lowering the viscosity by using a biphenyl type epoxy resin and a phenol aralkyl resin to enable higher filling. However, even if such a method is used, cracking occurs in the resin portion where the soldering conditions become more severe, the semiconductor element becomes larger, and the semiconductor package becomes thinner. In fact, it has not yet reached a satisfactory level.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide an epoxy resin composition which solves the above-mentioned problems, is excellent in solder heat resistance and humidity resistance, and is preferably used for semiconductor encapsulation. .

[0008]

The present invention provides an epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and a filler (C), wherein the epoxy resin (A) has the general formula An epoxy resin represented by (1) is contained as an essential component, and the curing agent (B) is an acid catalyst comprising an alkylbenzene represented by the general formula (2) and an aldehyde represented by the general formula (3). An alkyl benzene aldehyde resin (P) reacted in the presence of a phenol (Z) represented by the general formula (4) is reacted with an acid catalyst at a weight ratio of 1 ≦ (Z) / (P) ≦ 20. After the reaction in the presence, the aromatic aldehyde (Y) represented by the general formula (5) is reacted with the phenol (Z) at a molar ratio of 0.1 ≦ (Y) / (Z) <1. Phenol, alkylbenzene and aldehyde resins Relates epoxy resin composition characterized.

[0009]

Embedded image

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin composition of the present invention will be described below in detail. The epoxy resin (A) used in the present invention is characterized by containing the epoxy resin represented by the general formula (1) as an essential component. As a specific example, 4,4′-bis (2,3-epoxypropoxy)
Biphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy)-
3,3 ′, 5,5′-tetraethylbiphenyl, 4,
4'-bis (2,3-epoxypropoxy) -3,
3 ', 5,5'-tetrabutylbiphenyl, 4,4'-
Bis (2,3-epoxypropoxy) -3,3 ', 5
5'-tetramethyl-2-chlorobiphenyl, 4,4 '
-Bis (2,3-epoxypropoxy) -3,3 ',
5,5'-tetramethyl-2-bromobiphenyl and the like, among which 4,4'-bis (2,3-epoxypropoxy) biphenyl and 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-Tetramethylbiphenyl is particularly preferred.

The epoxy resin (A) of the present invention can be used in combination with the above-mentioned epoxy resin and other epoxy resins as long as the desired properties are not impaired. As other epoxy resins, for example, ortho-cresol novolak type epoxy resin, phenol novolak type epoxy resin, brominated phenol novolak type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, tetrabromobisphenol A type epoxy resin, etc. But are not limited to these. The proportion of the epoxy resin represented by the general formula (1) in the epoxy resin (A) is not particularly limited, and other epoxy resins can be used in combination within a range that does not impair the desired properties, but a sufficient effect is obtained. For this purpose, the epoxy resin represented by the general formula (1) should be at least 60% by weight, more preferably at least 80% by weight in the total epoxy resin.

The curing agent (B) used in the present invention comprises an alkylbenzene represented by the general formula (2) and a general formula (3)
An alkylbenzene-aldehyde resin (P) obtained by reacting an aldehyde represented by the following formula in the presence of an acid catalyst and a phenol (Z) represented by the general formula (4) in a weight ratio of 1 ≦
After reacting in the presence of an acid catalyst at (Z) / (P) ≦ 20,
The molar ratio of the aromatic aldehyde (Y) represented by the general formula (5) to the phenol (Z) is 0.1 ≦ (Y) / (Z).
<1 Phenol, alkylbenzene,
It is important to contain an aldehyde resin as an essential component, otherwise, sufficient solder heat resistance and moisture resistance reliability cannot be obtained.

Examples of the alkylbenzenes used in the present invention include toluene, xylene, mesitylene, cumene and the like, and m-xylene having high reactivity with aldehydes is particularly preferred. Aldehydes are hydrocarbons having one aldehyde group, having 0 to 7 carbon atoms other than the aldehyde group, and preferably include formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isobutyraldehyde, isovaleraldehyde, and the like. Particular preference is given to formaldehyde, which has a high reactivity with the class. If the number of carbon atoms other than the aldehyde group is 8 or more, steric hindrance is large, which inhibits the curing reaction between the epoxy group and the hydroxyl group, and reduces the curability of the epoxy resin composition or the glass transition temperature of the cured product, which is not preferable. . Examples of phenols include phenol, cresol, t-butylphenol, t-octylphenol, allylphenol, and the like. Phenol that gives a resin having a good balance between the hydroxyl equivalent, the softening point, and the solution viscosity is particularly preferable. Preferred aromatic aldehydes include benzaldehyde, tolualdehyde, ethylbenzaldehyde, isopropylbenzaldehyde, salicylaldehyde, p-hydroxybenzaldehyde, among which benzaldehyde and salicylaldehyde are industrially produced and are inexpensive and easy. Available at The alkylbenzenes, aldehydes, phenols, and aromatic aldehydes described above are merely examples, and the present invention is not limited thereto. These may be used alone or as a mixture during the reaction.

The alkylbenzene-aldehyde resin in the present invention can be easily obtained by reacting an alkylbenzene (a) with an aldehyde (b) in the presence of an acid catalyst such as sulfuric acid. As an example, m-xylene
Formaldehyde resin and the like are commercially available from Mitsubishi Gas Chemical Company under the trade name "Nicanol" and can be easily obtained.

The phenol / alkylbenzene of the present invention
Aldehyde resins are obtained by reacting alkylbenzenes (a) with aldehydes (b) in the presence of an acid catalyst, and polycondensing phenols in the presence of an acid catalyst. It can be obtained by reacting. As an example, m-xylene obtained by reacting m-xylene with formaldehyde in the presence of an acid catalyst is used.
The general structure of a resin obtained by polycondensing a xylene-formaldehyde resin with phenol in the presence of an acid catalyst and then reacting with benzaldehyde is shown in general formula (7). However, the present invention is not limited to this exemplified structure.

[0016]

Embedded image (Where k is an integer of 0 to 10)

In the present invention, the weight ratio of the alkylbenzene-aldehyde resin (P) to the phenol (Z) is 1 ≦ (Z)
If / (P) ≦ 20, the desired characteristics can be obtained.
More preferably, 2 ≦ (Z) / (P) ≦ 8.0. When (Z) / (P) <1, the ratio of phenols in the phenol / alkylbenzene / aldehyde resin is reduced, and the curability and moldability of the epoxy resin composition are significantly reduced. When (Z) / (P)> 20, alkylbenzene / phenol in alkylphenol / aldehyde resin
The ratio of the aldehyde resin is reduced, and the effects of the alkylbenzene aldehyde resin such as low elastic modulus in the rubber area of the epoxy resin composition, low water absorption, and high adhesion to metals such as lead frames and silicon chips are fully exhibited. Can not. The molar ratio of the phenols (Z) and the aromatic aldehydes (Y) is 0.1 ≦ (Y) /
(Z) <1 is preferable, and particularly 0.1 ≦
More preferably, (Y) / (Z) ≦ 0.8.
When (Y) / (Z) ≧ 1, the weight average molecular weight and the softening point are increased, and it is difficult to obtain desired characteristics. Also (Y)
If /(Z)<0.1, the effect of reacting the aromatic aldehydes is small, the weight average molecular weight and softening point of the product are too small, and the heat resistance of the cured product when used as an epoxy resin curing agent is too small. Is undesirably reduced.

The phenol / alkylbenzene / aldehyde resin, which is an essential component of the curing agent (B) used in the present invention, preferably has a hydroxyl equivalent of 100 to 200 g / eq, more preferably 120 to 150 g / eq. If the hydroxyl group equivalent is less than 100 g / eq, the softening point and solution viscosity are low, and the composition is liquid or semi-solid at room temperature, which may cause problems in workability and a decrease in room temperature storage property of the epoxy resin composition using the same. . If it exceeds 200 g / eq, the distance between the crosslinking points between the epoxy group and the phenolic hydroxyl group will increase, and the curability of the resin composition may decrease, or the glass transition temperature of the cured product may decrease.

The softening point of the phenol / alkylbenzene / aldehyde resin used in the present invention is preferably from 60 to 110 ° C, more preferably from 75 to 95 ° C. Softening point is 6
If the temperature is lower than 0 ° C., the composition is liquid or semi-solid at room temperature, and there is a possibility that the workability is reduced, the curability of the resin composition is reduced, or the glass transition temperature of the cured product is lowered. If the temperature exceeds 110 ° C., the resin does not melt sufficiently when mixed with the epoxy resin and cannot be uniformly dispersed, so that the curability and the moldability are reduced and the molded article becomes more nonuniform.

The solution viscosity of the phenol / alkylbenzene / aldehyde resin used in the present invention is 20 to 90 μm ^2.
/ S, preferably 30 to 60 μm ² / s. If the solution viscosity is less than 20 μm ² / s, there are many low molecular components not involved in the curing reaction in the resin, and the curability of the resin composition may be reduced, or the glass transition temperature of the cured product may be lowered. If it exceeds 90 μm ² / s, the melt viscosity is high and the fluidity is reduced, and poor moldability such as poor filling occurs.

The weight average molecular weight of the phenol / alkylbenzene / aldehyde resin used in the present invention is 400 to 3
000 is preferable, and 600 to 1500 is more preferable. When the weight-average molecular weight is less than 400, the composition is liquid or semi-solid at room temperature, and there is a possibility that the workability may be reduced, the curability of the resin composition may be reduced, or the glass transition temperature of the cured product may be lowered. If it exceeds 3,000, the melt viscosity is high and the fluidity is reduced, and poor moldability such as poor filling occurs.

The curing agent (B) in the present invention is used together with the above-mentioned phenol / alkylbenzene / aldehyde resin,
Other curing agents can be used in combination as long as the desired properties are not impaired. Other curing agents include, for example, phenol,
Cresol, resorcinol, xylenol, a novolak resin obtained by a condensation reaction of a phenol compound such as bisphenol A with formaldehyde, maleic anhydride,
Acid anhydrides such as nadic anhydride, methylnadic anhydride, phthalic anhydride, and pyromellitic anhydride; and aromatic amines such as metaphenylenediamine, paraphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and diaminodiphenylether. . Among these, a novolak resin, particularly a phenol novolak resin, is preferable for use as a sealing material. The ratio of the phenol / alkylbenzene / aldehyde resin contained in the curing agent (B) is not particularly limited, but is preferably 50% by weight or more, more preferably 70% by weight or more. Regarding the ratio of the curing agent (B) to the epoxy resin (A), the equivalent ratio is 0.8 to 1.2, particularly 0.95 to 1.05.
Is preferably within the range.

In the present invention, a curing accelerator can be used, if necessary, to accelerate the curing reaction between the epoxy resin (A) and the curing agent (B). Examples of the curing accelerator include 1,8-diazabicyclo (5,4,0) undecene-7, triethylenediamine, benzyldiamine, α
Tertiary amines such as -methylbenzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol, triethanolamine and diethylaminoethanol; 2-methylimidazole; Imidazoles such as -dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methylimidazole; organic phosphine compounds such as triphenylphosphine, trimethylphosphine, triethylphosphine and tributylphosphine; tetraphenylphosphonium・ Tetra-substituted phosphonium such as tetraphenyl borate, tetraphenyl phosphonium, ethyl triphenyl borate, tetrabutyl phosphonium, tetrabutyl borate, etc. Borate, 2-ethyl-4-methylimidazole, tetramethyl borate, there is tetraphenyl boron salts such as N- methylmorpholine tetraphenylborate. Two or more of these curing accelerators may be used in combination, and the addition amount thereof is preferably in the range of 0.01 to 1 part by weight based on 100 parts by weight of the epoxy resin (A).

The filler (C) in the present invention is blended for reducing moisture absorption, improving thermal conductivity, and reducing linear expansion coefficient.
Fused silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, calcium silicate, silicon nitride, titanium oxide, antimony oxide, asbestos, glass, and the like. preferable. The shape of the filler (C) is not particularly limited, but is preferably spherical from the viewpoint of fluidity during molding and mold abrasion resistance. The compounding ratio of the filler (C) is preferably in the range of 80 to 95% by weight of the entire epoxy resin composition. In the present invention, the filler can be surface-treated in advance with a coupling agent. As the coupling agent, a silane coupling agent such as epoxy silane, amino silane, mercapto silane and the like is suitably used. The epoxy resin composition of the present invention includes a halogenated epoxy resin, a flame retardant such as a phosphorus compound, a flame retardant auxiliary such as antimony trioxide, an elastomer such as silicone rubber, nitrile rubber, modified polybutadiene, a higher fatty acid, and a metal of a higher fatty acid. The epoxy resin composition of the present invention, to which a release agent such as a salt or a higher fatty acid ester can be added as required, can be obtained by sufficiently mixing the components (A) to (C) and other additives with a mixer or the like. It is preferable to uniformly mix and further melt-knead, and it is manufactured using a known kneading method such as a Banbury mixer, a kneader, a roll, a single-screw or twin-screw extruder and a co-kneader.

[0024]

The present invention will be described below with reference to examples. The present invention is not limited by these examples,
"Parts" and "%" described in Examples and Comparative Examples
Represents "parts by weight" and "% by weight".

The characteristic values of the phenol / alkylbenzene / aldehyde resin used in the present invention were measured according to the following methods. Hydroxyl equivalent: A sample was acetylated with pyridine and an excess amount of acetic anhydride, and acetic acid generated from acetic anhydride consumed by the sample was determined by titration with an aqueous sodium hydroxide solution. 1. Softening point: Determined by the ring and ball method described in JIS K 7234. 2. Solution viscosity: Measured at 25 ° C. by a method described in JIS Z 8803 using a solution (weight ratio) of sample / ethanol = 5/5. 3. Weight average molecular weight: Tosoh GPC column (G100
0HXL: 1 piece, (G2000HXL: 2 pieces, G300
0HXL: 1), GPC measurement was performed using a differential refractometer as a detector under the analysis conditions of a flow rate of 1.0 ml / min, an elution solvent of tetrahydrofuran, and a column temperature of 40 ° C., and the values were converted by standard polystyrene.

Production Example 1 P1: A mixture of 100 parts of xylene-formaldehyde resin (Nicanol G, manufactured by Mitsubishi Chemical Corporation), 200 parts of phenol and 0.2 parts of paratoluenesulfonic acid was gradually heated and reacted at 100 ° C. for 2 hours. Thereafter, 85 parts of benzaldehyde was further added, and the mixture was heated to 140 ° C. and reacted for 2 hours. To this was added 100 parts of methyl isobutyl ketone to obtain a homogeneous solution. Next, 200 parts of ion-exchanged water was added, and
After stirring for minutes, the mixture was allowed to stand, separated into an organic layer and an aqueous layer, and the aqueous layer containing ionic impurities was removed. In the subsequent distillation step, 260 parts of a phenol / alkylbenzene / aldehyde resin having a hydroxyl equivalent of 165 g / eq, a softening point of 95 ° C., a solution viscosity of 31 μm ² / s and a weight average molecular weight of 2100 are obtained by removing condensed water, unreacted phenol and the like. I got

Production Examples 2 to 4 The desired resin P was prepared in the same manner as in Production Example 1 with the composition shown in Table 1.
2 to P4 were obtained.

[0028]

[Table 1]

Production Example 5 P5: 188 parts of phenol, 37% formalin 121
And a mixture of 0.9 parts of oxalic acid were reacted at 100 ° C. for 2 hours, and then distilled under reduced pressure until the internal temperature reached 170 ° C. to remove water and unreacted phenol, and the hydroxyl group equivalent was 104 g.
/ Eq, a softening point of 110 ° C., a solution viscosity of 88 μm ² / s, and 190 parts of a phenol resin having a weight average molecular weight of 2910 were obtained.

Examples 1 to 5 and Comparative Examples 1 to 4 The components shown below were mixed in the mixing ratio (% by weight) shown in Table 2, mixed with a mixer, heated and kneaded with a biaxial kneader, and cooled. And pulverized to prepare an epoxy resin composition.

[0031]

[Table 2]

The following two types of epoxy resins (A) were used. (E1) 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl ( (E2) ortho-cresol novolak type epoxy resin (melting point: 65 ° C., epoxy equivalent: 216 g / eq) The phenolic resins of Production Examples 1 to 5 were used as the curing agent (B). As the filler (C), (C1) the average particle size is 7 μm
And spherical fused silica (C2) having an average particle diameter of 10 μm. Other additives include 1,8-diazabicyclo (5,4,0) as a curing accelerator.
Undecene-7 (DBU), 2-methylimidazole (2-MZ), triphenylphosphine (TPP), carnauba wax as a release agent, brominated bisphenol A type epoxy resin as a flame retardant (epoxy equivalent 400),
Antimony trioxide was used as a flame retardant aid, carbon black was used as a colorant, and γ-glycidoxypropyltrimethoxysilane was used as a silane coupling agent.

The obtained epoxy resin composition was measured for gel time, curability, spiral flow, glass transition point (Tg), flexural modulus, water absorption, and solder heat resistance according to the following methods. Table 3 shows the results.

[0034]

[Table 3]

1. Gelation time: After melting the composition on a hot plate at 175 ° C., the time until the composition was cured by a spatula method was measured. 2. Curability: mold temperature 175 ° C, injection pressure 6.9M
The resin was cured in Pa for 2 minutes, and the Shore D hardness was measured 10 seconds after release from the mold. 3. Spiral flow: based on EMMI-I-66,
It was measured at 180 ° C., 6.9 MPa, and curing time was 2 minutes. 4. Glass transition point: Thermomechanical analyzer (Seiko Electronics Co., Ltd.)
It was measured at a temperature rising rate of 5 ° C./min using a test piece having a shape of 19 mm × 4 mm × 4 mm according to TMA-100 (trade name). 5. Flexural modulus: Tensilon (Toyo Baldwin Co., Ltd.)
By a three-point support type bending test based on JIS K6911. 6. Water absorption: A disc-shaped molded product having a diameter of 50 mm and a thickness of 3 mm is subjected to a moisture absorption treatment at 120 ° C. and 100% RH for 80 hours.
It was calculated from the weight change before and after that. 7. Solder heat resistance: 80 equipped with a simulated element (7.5 mm × 7.5 mm) whose surface is coated with polyimide
A pin QFP (quad flood package, package size: 14 mm × 20 mm × 2.0 mm, die pad size: 9 mm × 9 mm copper lead frame) is formed by transfer molding under the conditions of 175 ° C. × 2 minutes, and 175
Post-curing was performed at 8 ° C. for 8 hours. Then 85 ℃, 85
Perform humidification treatment for 24 hours and 72 hours under the condition of% RH,
Subsequently, heat treatment was performed in an IR reflow furnace at a maximum temperature of 240 ° C., and the number of external cracks was visually observed, and the number of internal cracks generated was measured by an ultrasonic flaw detector.

[0036]

The epoxy resin composition according to the present invention is excellent in heat resistance and has a considerably small value of flexural modulus and water absorption without a decrease in flexural strength, and is excellent in low stress and moisture resistance. It turns out to be something. Accordingly, in the field of electronic components, particularly in semiconductor devices, thinner and smaller devices have been developed, and the elements themselves have been increased in size. Therefore, a sealing material having better heat resistance has been demanded. The resin composition is expected to sufficiently satisfy such demands.

Claims (3)

[Claims] An epoxy compound (A), a curing agent (B),
An epoxy resin composition comprising a filler (C), wherein the epoxy compound (A) contains an epoxy compound represented by the general formula (1) as an essential component, and a curing agent (B)
Is an alkylbenzene-aldehyde resin (P) obtained by reacting an alkylbenzene represented by the general formula (2) with an aldehyde represented by the general formula (3) in the presence of an acid catalyst;
The phenols (Z) represented by the general formula (4) are reacted in the presence of an acid catalyst at a weight ratio of 1 ≦ (Z) / (P) ≦ 20, and then represented by the general formula (5). The molar ratio of the aromatic aldehyde (Y) to the phenol (Z) is 0.1 ≦
An epoxy resin composition comprising, as an essential component, a phenol / alkylbenzene / aldehyde resin obtained by reacting (Y) / (Z) <1. Embedded image 2. The epoxy resin composition according to claim 1, wherein the epoxy compound (A) contains an epoxy compound having a structure represented by the general formula (6) as an essential component. Embedded image 3. In the phenol / alkylbenzene / aldehyde resin which is an essential component of the curing agent (B), the alkylbenzenes represented by the general formula (2) are m-xylene and represented by the general formula (3). 3. The epoxy resin composition according to claim 1, wherein the aldehyde is formaldehyde, and the aromatic aldehyde represented by the general formula (5) is benzaldehyde and / or salicylaldehyde.