JP2000208421A - Solid-state device manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to determine a necessary treatment after a power failure even when the power failure occurs. SOLUTION: An inner temperature in a reactive furnace 21 is detected by a temperature sensor 24. Inner pressure in the reactive furnace 21 is detected by a pressure sensor 25. Power failure and power restoration of a power supply for a heater is detected by a power-failure/power-restoration detecting circuit 31. Power failure and power restoration of a power supply for a vacuum pump is detected by a power-failure/power-restoration detecting circuit 32. When a power failure of the power supply for the heater or the vacuum pump is detected by the power-failure/power-restoration detecting circuit 31 or 32, a difference in inner-furnace temperatures and a difference in inner-furnace pressure between the power failure time and the power restoration time are detected by a controller 27 on the basis of the detected output of the temperature sensor and the pressure sensor. In addition, a treatment after the power failure is determined by the controller 27 automatically on the basis of the detected data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solid-state device manufacturing apparatus used in a solid-state device manufacturing process, and more particularly to a solid-state device manufacturing apparatus for performing a predetermined process on an object to be processed in a closed processing space.

[0002]

2. Description of the Related Art Generally, in a solid-state device manufacturing apparatus used in a manufacturing process of a solid-state device such as a semiconductor device or a liquid crystal display device, it is necessary to prevent the operation of the device from being stopped when a power failure occurs as much as possible. is there.

For this reason, such a solid-state device manufacturing apparatus is usually provided with a backup power supply in addition to a main power supply.
When a power failure occurs in the main power supply, the device is backed up by a backup power supply.

However, CVD (Chemical Vapor Deposit)
In a solid-state device manufacturing apparatus such as an ion) apparatus, not only a load with a small power consumption such as a controller but also a load with a large power consumption such as a heater or a vacuum pump exists.
Here, when backing up a load with large power consumption, a large amount of equipment is required. For this reason, a solid-state device manufacturing apparatus having a large power consumption load usually backs up a low power consumption load and does not back up a large power consumption load.

FIG. 15 is a block diagram showing the configuration of a conventional CVD apparatus having such a power supply backup function. The illustrated apparatus has a reaction furnace 11, a heater 12, a vacuum pump 13, a controller 14, and an uninterruptible power supply (hereinafter, referred to as "UPS") 15. When a power failure occurs in the controller power supply, the UPS 15 The controller 14 is thereby backed up.

According to such a configuration, the controller 1
4 can execute a predetermined process without being affected by the power failure even if a power failure occurs in the controller power supply.

However, in such a configuration, if a power failure occurs in the heater power supply or the vacuum pump power supply, the heater 12 and the vacuum pump 13 cannot be backed up. Thereby, even if the controller 14 can continue the process, it is impossible to control the temperature and the pressure inside the reaction furnace 11.

For this reason, in a solid-state device manufacturing apparatus such as a CVD apparatus, conventionally, when a power failure occurs in a power supply for a heater or a power supply for a vacuum pump, an operator recognizes the power failure and if the power failure time is within the allowable power failure time. , After the power outage is restored,
An operator performs an automatic return operation and continues processing of the object to be processed. On the other hand, if the power outage time is outside the power outage permissible time, the operator visually checks the state of the apparatus when the power outage is restored, and determines whether to continue the processing of the object to be processed or to interrupt the processing. Had become.

[0009]

However, in such a configuration, if the operator does not notice that a power failure has occurred, or if the operator notices that the action is delayed, or if a decision error occurs, However, there is a problem that a defect occurs in the solid-state device.

Accordingly, the present invention provides a method for
It is an object of the present invention to provide a solid-state device manufacturing apparatus capable of automatically determining processing after power restoration.

[0011]

According to a first aspect of the present invention, there is provided a solid-state device manufacturing apparatus used in a solid-state device manufacturing process, wherein a predetermined process is performed on an object to be processed in a closed processing space. In the apparatus to be applied, a temperature detecting means for detecting a temperature of the processing space, a pressure detecting means for detecting a pressure of the processing space, and when a power failure occurs, at least one of a detection output of the temperature detecting means and a detection output of the pressure detecting means. And a process determining means for automatically determining a process to be executed after the restoration of the power failure.

In the apparatus according to the first aspect, the temperature of the processing space is detected by the temperature detecting means, and the pressure of the processing space is detected by the pressure detecting means. Then, when a power failure occurs, the processing after power recovery is automatically determined by the processing determining means based on at least one of these two detection outputs. Thereby, even when the operator does not notice that the power failure has occurred, it is possible to prevent the solid-state device from being defective. Further, the processing after power recovery can be determined based on parameters that define the execution conditions of the processing of the processing target, such as temperature and pressure. Thereby, a highly reliable decision can be made.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings.

[1] One Embodiment [1-1] Configuration FIG. 1 is a block diagram showing a configuration of one embodiment of the present invention. In the following description, the present invention is applied to a vertical CVD.
A case where the present invention is applied to an apparatus will be described as a representative.

The illustrated CVD apparatus comprises a reaction furnace 21 for forming a closed reaction space for forming a predetermined thin film on the surface of a substrate, and a substrate accommodated in the reaction furnace 21 (reaction space). It has a heater 22 for heating and a vacuum pump 23 for exhausting the atmosphere inside the reaction furnace 21.

This apparatus has a temperature sensor 24 for detecting the temperature inside the reactor 21, a pressure sensor 25 for detecting the pressure inside the reactor 21, and sends data and instructions to the apparatus. An input / output unit 26 for inputting and outputting data or the like indicating the state of the apparatus; a controller 27 for controlling the operation of the apparatus; a memory 28 for storing various programs and various tables; And a timer 29 for measuring time.

Further, this apparatus includes a UPS 30 for backing up the controller 24 when a power failure occurs in the controller power supply, a power failure / recovery detection circuit 31 for detecting power failure and power recovery of the heater power supply, And a power failure / recovery detection circuit 32 for detecting a power failure and a power recovery of the pump power supply. These power failure / recovery detection circuits 31, 32
Is constituted by, for example, a relay connected to a power supply line of the heater 22 and the vacuum pump 23.

As the power supply for the controller, the power supply for the heater, and the power supply for the vacuum pump, for example, different power supplies are used. In this case, as the controller power supply, for example, an AC 100 volt or 115 volt power supply is used, and as the heater power supply or the pump power supply,
For example, a 200 volt or 208 volt power supply is used.

[1-2] Operation The operation of the above configuration will be described.

When forming a predetermined thin film on a substrate, first,
A substrate charging process is performed. Thereby, a plurality of substrates accommodated in a cassette (not shown) are transferred to a boat (not shown). When the substrate charging process is completed, a boat loading process is performed. Thereby, the boat is carried into the reaction furnace 21. As a result, the plurality of substrates accommodated in the boat are heated by the heater 22.

When the boat loading process is completed, a film forming process is performed. Thereby, a reaction gas or the like is supplied into the reaction furnace 21. As a result, a predetermined thin film is formed on the substrate surface. At this time, the atmosphere inside the reaction furnace 21 is exhausted by the vacuum pump 23.
Thereby, reaction products and the like are discharged.

When the film forming process is completed, a boat unloading process is performed. Thereby, the boat is carried out of the reaction furnace 21. When the boat unloading process ends, a substrate discharge process is performed. As a result, a plurality of substrates subjected to the film forming process are transferred from the boat to the cassette. Hereinafter, similarly, each time one film forming process is completed, the above-described process is executed.

In this film forming process, the power supply voltage of the controller 27 is supplied from the controller power supply. Similarly, the power supply voltage of the heater 22 is supplied from a heater power supply, and the power supply voltage of the vacuum pump 23 is supplied from a pump power supply.

In this state, when a power failure occurs in the controller power supply, the power failure is detected by the UPS 30. When detecting the power failure, the UPS 30 supplies a power supply voltage to the controller 27. Thus, when a power failure occurs in the controller power supply, the controller 27
Backed up by PS30. In this state, when the power failure of the controller power is restored, the controller 2
7 is returned to the controller power supply.

When a power failure occurs in the heater power supply,
This power failure is detected by the power failure / recovery detection circuit 31. When detecting the power failure, the power failure / recovery detection circuit 31 supplies a power failure detection signal to the controller 27. In this state, when the power failure of the heater power supply is restored, the power recovery is detected by the power failure / power recovery detection circuit 31. When detecting the power recovery, the power failure / recovery detection circuit 31 supplies a power recovery detection signal to the controller 27. Controller 2
7 receives the power failure detection signal from the power failure / power recovery detection circuit 31, executes the power failure processing, and determines the processing after the power recovery when the power recovery detection signal is received.

Similarly, when a power failure occurs in the pump power supply, a power failure detection signal is supplied from the power failure / recovery detection circuit 32 to the controller 27, and when the power failure is restored, a power recovery detection signal is supplied. The controller 27 executes a power failure process when receiving a power failure detection signal from the power failure / power recovery detection circuit 32, and determines a process after the power recovery when receiving the power failure detection signal.

FIGS. 2 and 3 are flowcharts showing the power failure process by the controller 27. It should be noted that a program for executing the power failure process is stored in the memory 28.

As shown, when the controller 27 receives a power failure detection signal from the power failure / restoration detection circuit 31 or 32, the controller 27 determines the time when the power failure occurred, the furnace temperature, and the furnace pressure when the power failure occurred. Writing to the control state table (step S11). Here, the power failure occurrence control state table is a table for writing the control state of the device at the time of power failure occurrence. The time when the power failure occurs is measured by a timer 29, the furnace temperature is detected by a temperature sensor 24, and the furnace pressure is detected by a pressure sensor 25.

FIG. 4 is a diagram showing an example of the configuration of the control state table when a power failure occurs. In the illustrated power failure occurrence control state table, the time A1, the furnace temperature A2, the furnace pressure A3, and the like at the time of the occurrence of the power failure are written. This table is stored in the memory 28 of FIG.

When the writing process is completed, the controller 27 writes the furnace temperature and the furnace pressure at the time of the power failure into the maximum / minimum value table (step S12). Here, the maximum / minimum value table is a table for writing the maximum value and the minimum value of the furnace temperature and the maximum value and the minimum value of the furnace pressure during the power failure occurrence period.

FIG. 5 is a diagram showing an example of the configuration of the maximum / minimum value table. The maximum / minimum value table shown
The maximum value B1 and the minimum value B2 of the furnace temperature, the maximum value B3 and the minimum value B4 of the furnace pressure, and the like are written. In this case, the furnace temperature at the time of the occurrence of the power failure is written as the maximum value B1 and the minimum value B2 of the furnace temperature. The furnace pressure at the time of the occurrence of the power failure is written as a maximum value B3 and a minimum value B4 of the furnace pressure.

When the writing process is completed, the controller 27 determines whether or not a predetermined time has elapsed (step S13). When the predetermined time has elapsed, the controller 27 executes a process of updating the maximum value or the minimum value of the furnace temperature (step S13). S14). This updating process is performed by comparing the current furnace temperature with the maximum value B1 and the minimum value B2 of the furnace temperature written in the maximum / minimum value table.
This is done by comparing

That is, as a result of the comparison, if the current furnace temperature is higher than the maximum value B1 of the furnace temperature written in the maximum / minimum value table, the maximum value B1 is rewritten to the current furnace temperature. . On the other hand, if the current furnace temperature is lower than the minimum furnace temperature B2 written in the maximum / minimum value table, the minimum value B2 is rewritten to the current furnace temperature. If the current furnace temperature is not less than the minimum value B2 and not more than the maximum value B1, this rewriting is not performed.

When the updating process is completed, the controller 27 executes an updating process of the maximum value B3 and the minimum value B4 of the furnace pressure (step S15). This update process also
The process is performed in the same manner as the process of updating the maximum value B1 and the minimum value B2 of the furnace temperature.

When the updating process is completed, the controller 27 determines whether a power recovery detection signal has been received from the power failure / recovery detection circuit 31 or 32 (step S16).
If not received, the process returns to step S13, and when the predetermined time has elapsed, the updating process is executed again. On the other hand, when the power recovery detection signal is received, the time at the time of power recovery and
The temperature in the furnace and the pressure in the furnace are written in the power recovery control state table (step S17). Here, the power recovery control state table is a table for writing the control state of the device when the power for the heater or the power for the vacuum pump is restored.

FIG. 6 is a diagram showing an example of the configuration of the power recovery control state table. In the illustrated power recovery control state table, a time C1, a furnace temperature C2, a furnace pressure C3, and the like at the time of power recovery are written.

When the writing process is completed, the controller 27 sets the maximum value B1 and the minimum value B2 of the furnace temperature,
The process of updating the furnace pressure with the maximum value B3 and the minimum value B4 is executed (steps S18, S19). Thereby, the maximum value B1 and the minimum value B2 of the furnace temperature and the maximum value B3 and the minimum value B4 of the furnace pressure are determined.

When the updating process is completed, the controller 27 determines whether to perform the time determining process or the temperature difference determining process as the determining process for determining the process after the power recovery (step S20). . Here, the time determination process is a determination process defined by the power outage time. The temperature difference etc. determination process is a determination process defined by a furnace temperature difference and a furnace pressure difference between when a power failure occurs and when power is restored.

FIG. 7 shows a time determination process (step S in FIG. 3).
It is a flowchart which shows 21). As illustrated, in this time determination process, the controller 27 first calculates a power outage time (step S31). This calculation is based on the power recovery time written in the power recovery control state table (see FIG. 6) and the power failure occurrence control state table (FIG. 4).
It is obtained by subtracting the power failure occurrence time written in (see Reference).

When the calculation process is completed, the controller 24 determines a process after power recovery based on the calculated power outage time and executes the process (steps S32 to S36).
The determination of the processing after the power recovery is performed using the time determination processing table.

FIG. 8 is a diagram showing an example of the configuration of the time determination processing table. In the illustrated time determination processing table, a power failure allowable time D1, a processing command E1, a power failure allowable time D2, a processing command E2, and a processing command E3 are written. Here, the power failure allowable time D2 is set to be longer than the power failure allowable time D1. Processing commands E1, E2, E3
For example, the processing designated by the following includes a transition processing to a safe state, an interruption processing of a film formation process, a buzzer sounding processing, a pause processing, a processing of skipping or jumping the processing, a power recovery processing, and the like. The transition process to the safe state is a transition process to the reset mode in which the furnace temperature, the furnace pressure, and the gas flow rate are returned to the initial state to secure the safety of the device. The power restoration process is a process executed at the time of power restoration, and is a process defined in advance by a sub-recipe or the like.

The above-described flowchart of FIG. 7 shows a case where the time determination processing table of FIG. 8 is used as the time determination processing table. In this case, the controller 27 determines whether or not the calculated power outage time is within the power outage allowable time D1 (step S32).
The processing command E1 is executed (Step S33). On the other hand, if it is longer than the allowable power failure time D1, it is determined whether or not it is within the allowable power failure time D2 (step S34). If it is within the allowable power failure time D2, the processing command E2 is executed (step S35). On the other hand, the power failure allowable time D2
If it is larger, the processing command E3 is executed (step S36), and then the fact that it is longer than the power failure allowable time D2 is written in the error table (step S37).

FIG. 9 shows the above-described allowable power failure times D1 and D2.
FIG. 6 is a diagram showing a relationship between the processing commands E1, E2, and E3. As shown in the figure, when the power failure time is within the power failure allowable time D1, the processing command E1 is executed, and the power failure time D
If it is less than 2, the processing command E2 is executed, and if it is longer than the allowable power failure time D3, the processing command E3 is executed.

FIGS. 10 and 11 are flowcharts showing the temperature difference etc. determination processing (step S22 in FIG. 3). As shown in the figure, in this temperature difference etc. determination process,
First, the controller 27 calculates the difference between the furnace temperature at the time of power recovery and the furnace temperature at the time of the occurrence of a power failure (step S41).
This calculation is based on the temperature inside the furnace at the time of power recovery written in the control state table at the time of power recovery (see FIG. 6). It is determined by subtracting the temperature.

When the calculation process is completed, the controller 27 determines whether or not the calculated furnace temperature difference is within the allowable temperature difference. If the calculated temperature difference is within the allowable temperature difference, the controller 27 sets an allowable temperature difference error flag to 0. If the difference is larger than the allowable temperature difference, the error flag is set to 1 (steps S42 to S47).

Thereafter, the controller 27 first calculates the difference between the furnace pressure at the time of power recovery and the furnace pressure at the time of the occurrence of a power failure (step S48). This calculation is based on the pressure inside the furnace at the time of power recovery written in the control state table at power recovery (see FIG. 6) and the inside of the furnace at the time of power failure occurrence written in the control state table at the time of power failure (see FIG. 4). Determined by subtracting pressure.

When this calculation process is completed, the controller 27 determines whether or not the calculated furnace pressure difference is within the allowable pressure difference. If the calculated pressure difference is within the allowable pressure difference, the controller 27 sets the allowable pressure difference error flag to 0, If it is larger than the allowable pressure difference, the error flag is set to 1 (steps 49 to S58).

Thereafter, the controller 27 determines a process after power recovery based on the error flag, and executes the process (steps S55 to S58). The processing after power recovery is determined using a temperature difference etc. determination processing table.

FIG. 12 is a diagram showing an example of the configuration of the temperature difference etc. determination table. In the illustrated table for temperature difference determination processing, a negative allowable temperature difference F1 and a positive allowable temperature difference F2 are written as allowable temperature differences. Similarly, a negative allowable pressure difference G1 and a positive allowable pressure difference F2 are written as the allowable pressure differences. The processing command H1
In this case, the processing command H1 executed when both the furnace temperature difference and the furnace pressure difference are within the allowable values and the processing command H2 executed when at least one of them is outside the allowable values are written. It has become. This processing command H1, H
2 has the same contents as the processing commands E1, E2, and E3 described above.

The flowcharts of FIGS. 10 and 11 described above show a case where the temperature difference determination processing table of FIG. 12 is used as the temperature difference determination processing table. In this case, the controller 27 determines whether or not the calculated furnace temperature difference is within the minus allowable temperature difference F1 (step S42), and if it is within the minus allowable temperature difference F1, sets the minus allowable temperature difference error flag to 0. Then, it is determined whether or not the furnace temperature difference is within the plus allowable temperature difference F2 (step S45). On the other hand, if the difference is not within the minus allowable temperature difference F1, the error flag for minus allowable temperature difference is set to 1 (step S44), and then the furnace pressure difference is calculated (step S48).

If the furnace temperature difference is within the plus allowable temperature difference F2, the plus allowable temperature difference error flag is set to 0 (step S46), and then the furnace pressure difference is calculated (step S48). On the other hand, if it is not within the plus allowable temperature difference F2, the plus allowable temperature difference error flag is set to 1 (step S47), and then the furnace pressure difference is calculated (step S48).

Thereafter, the controller 27 executes the same processing as the processing for the furnace temperature difference with respect to the calculated furnace pressure difference (steps S49 to S54). When this process ends, the controller 27 determines whether or not all the error flags are 0 (step S55). If the error flag is 0, the controller 27 executes the processing command H1 (step S5).
6) If there is at least one, after executing the processing command H2 (step S57), it writes which error flag was 1 in the error table (step S58).

FIG. 13 is a characteristic diagram showing an example of a change in furnace temperature after a power failure occurs. In the figure, the horizontal axis indicates time, the vertical axis indicates furnace temperature, and J indicates the change characteristic of furnace temperature. The figure shows a case where the furnace temperature gradually decreases from the time of the occurrence of the power failure. Now, it is assumed that the power failure has been restored at time K1. In this case, the furnace temperature difference does not reach the minus allowable temperature difference F1. Thus, in this case, the processing command H1 is executed. On the other hand, the power failure
It shall be restored to 2. In this case, the furnace temperature difference reaches the minus allowable temperature difference F1. Thus, in this case, the processing command H2 is executed.

Whether to execute the time determining process or the temperature difference etc. determining process is specified for each step of the recipe. This will be described with reference to FIG. FIG. 14 is a diagram conceptually illustrating an example of a film forming recipe.

As shown in the drawing, the film forming recipe includes a processing command Nn, a control parameter Pn, and determination processing designation data Q for each step Mn (n = 1, 2, 3,...).
1 or Q2 is described. Here, step M
, M2, M3,... Are, for example, the above-described substrate charging process, boat loading process, film forming process,
Are the steps for executing... The processing commands N1, N2, N3,... Are commands for instructing the corresponding processing. Further, the control parameters P1, P2, P3,... Are parameters for specifying execution conditions of the corresponding processes. The parameters Pn include, for example, temperature, pressure, processing time, and the like. The determination process designation data Q1 is data designating a time determination process, and the decision process designation data Q2 is data designating a temperature difference etc. determination process.

In such a configuration, when a power failure occurs in the heater power supply or the pump power supply during execution of a certain step Mn, the controller 27 performs time determination processing based on the determination processing designation data in step Mn. Is executed or the temperature difference determination process is executed (see FIG. 3).
Step S20). Accordingly, in the case of the example of FIG. 14, for example, if a power failure occurs in the heater power supply or the pump power supply during the execution of the film forming process step A3, the temperature difference determination process is performed.

It is up to the user to specify which of the time determination processing and the temperature difference determination processing is specified.
For example, the following designation method can be considered. That is, as a case where the time determination process is designated, for example, it is conceivable that experience has confirmed, by experience, how long a power outage would hinder the film forming process. On the other hand, when specifying the temperature difference etc. determination process,
It is possible that there is no such experience.

It should be noted that the power failure occurrence control state table (FIG. 4)
Information), a maximum / minimum value table (see FIG. 5), a power recovery control state table (see FIG. 6), and an error table are recorded as alarm information of the controller 27. Thereby, the operator can later confirm the state of the automatic processing after the occurrence of the power failure.

[1-3] Effects According to the present embodiment described in detail above, the following effects can be obtained.

(1) First, according to the present embodiment, when a power failure occurs, the furnace temperature and the furnace pressure are detected, and processing after power recovery is automatically determined based on the detected output. It has become. Thereby, even when the operator does not notice that the power failure has occurred, it is possible to prevent the solid-state device from being defective.

(2) Further, according to the present embodiment, the parameters defining the execution conditions of substrate processing (substrate charging processing, boat loading processing, film forming processing, etc.) such as furnace temperature and furnace pressure. , The processing after power recovery is determined. Thereby, a highly reliable decision can be made.

(3) Further, according to the present embodiment, the processing after power recovery is determined based on not one of the furnace temperature and the furnace pressure but both of them. Thereby, the reliability of the determination can be made higher than in the case where the processing after the power recovery is determined based on either one.

(4) Further, according to the present embodiment, the difference between the furnace temperature and the furnace pressure between the occurrence of a power failure and the recovery of the power is used as the information for determining the processing after the power recovery. It has become. Thereby, when determining the process after power recovery, it is possible to make a determination in consideration of changes in the furnace temperature and the furnace pressure during a power failure. As a result, the reliability of the determination can be improved as compared with the case where the temperature and pressure in the furnace at a certain point during the power failure are used as the information for determining the processing after the power recovery.

(5) Further, according to the present embodiment, as the information for determining the processing after power recovery, a power failure time can be specified instead of the furnace temperature and the furnace pressure.
Thereby, a highly flexible device can be provided.

(6) Further, according to the present embodiment, it is possible to specify information for determining the process after power recovery for each step of the film forming recipe. Thereby, a highly flexible device can be provided.

[2] Other Embodiments While one embodiment of the present invention has been described in detail, the present invention is not limited to the above-described embodiment.

(1) For example, in the above-described embodiment, a case will be described in which a furnace temperature difference and a furnace pressure difference between when a power failure occurs and when the power is restored are used as information for determining processing after power restoration. did. However, the present invention may use either one of these. Further, in the present invention, instead of the furnace temperature difference and the furnace pressure difference, the furnace temperature and the furnace pressure at a certain point during the occurrence of a power failure may be used.

(2) In the above-described embodiment, the case where one table is used as the temperature difference etc. determination processing table has been described. However, in the present invention, a plurality of tables may be provided, and these may be selectively used. This is the same for the time determination processing table.

(3) Further, in the above embodiment, the case where the furnace temperature, the furnace pressure, and the power failure time are used as the information for determining the processing after the power recovery has been described. However, the present invention may use only the furnace temperature and the furnace pressure. In this case, when a plurality of tables are provided as the temperature difference etc. determination processing table, for example, this table may be designated for each step.

(4) In addition, it goes without saying that the present invention can be variously modified and implemented without departing from the scope of the invention.

[0071]

As described above in detail, according to the solid-state device manufacturing apparatus of the first aspect, when a power failure occurs, the processing after power recovery is automatically performed based on at least one of the furnace temperature and the furnace pressure. It is decided to be decided. This allows
Even when the operator does not notice that a power failure has occurred, it is possible to prevent the solid-state device from being defective. Further, the processing after power recovery can be determined based on parameters that define the execution conditions of the processing of the processing target. Thereby, a highly reliable decision can be made.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an embodiment of the present invention.

FIG. 2 is a flowchart showing a power failure process according to one embodiment of the present invention.

FIG. 3 is a flowchart showing a power failure process according to one embodiment of the present invention.

FIG. 4 is a diagram showing a configuration of a power failure occurrence control state table according to an embodiment of the present invention.

FIG. 5 is a diagram showing a configuration of a maximum value / minimum value table according to an embodiment of the present invention.

FIG. 6 is a diagram showing a configuration of a power recovery control state table according to the embodiment of the present invention.

FIG. 7 is a flowchart illustrating a time determination process according to an embodiment of the present invention.

FIG. 8 is a diagram showing a table for time determination processing according to an embodiment of the present invention.

FIG. 9 is a diagram showing a time determination process in one embodiment of the present invention.

FIG. 10 is a flowchart illustrating a temperature difference etc. determination process according to the embodiment of the present invention.

FIG. 11 is a flowchart showing a process for determining a temperature difference and the like in one embodiment of the present invention.

FIG. 12 is a diagram showing a temperature difference etc. determination table according to an embodiment of the present invention.

FIG. 13 is a diagram illustrating an example of a temperature difference equal time determination process according to an embodiment of the present invention.

FIG. 14 is a diagram showing a configuration of a film forming recipe in one embodiment of the present invention.

FIG. 15 is a block diagram illustrating a configuration of a conventional solid-state device manufacturing apparatus.

[Explanation of symbols]

21: reaction furnace, 22: heater, 23: vacuum pump, 24
... temperature sensor, 25 ... pressure sensor, 26 ... input / output unit, 2
7 ... controller, 28 ... memory, 29 ... timer, 30
... UPS, 31, 32 ... power failure / recovery detection circuit.

Claims (1)

[Claims] 1. A solid-state device manufacturing apparatus that is used in a solid-state device manufacturing process and performs a predetermined process on an object to be processed in a closed processing space, wherein a temperature detection unit that detects a temperature of the processing space; Pressure detection means for detecting the pressure of the space, when a power failure occurs, based on at least one of the detection output of the temperature detection means and the detection output of the pressure detection means,
A solid-state device manufacturing apparatus comprising: a process determining unit that automatically determines a process to be performed after the power failure is restored.