JP2000206666A - Device and method for forming pattern image, image- formed substrate and method for forming image on the substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for forming a pattern image, a substrate on which an image is formed and a method for forming the image on the substrate capable of realizing the shortening of processing time and the reduction of production cost without using a photomask in lithographic technique or etching technique. SOLUTION: This device is constituted of the substrate 8 on which computer image information is formed, a substrate holding means 7 holding the substrate 8, a jetting head 11 arranged at a position facing to the substrate 8 and jetting liquid substance, an information input means 18 inputting the computer image information in the head 11, and a pattern image forming control means controlling so that the liquid substance may be jetted from the head 11 to draw the pattern image of the substance on the substrate 8 based on the inputted computer image information.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern image forming apparatus and method for forming a pattern image on a substrate using lithography and etching techniques, a substrate on which an image is formed, and a method for forming an image on the substrate. .

[0002]

2. Description of the Related Art Conventionally, so-called photolithography and etching techniques have been used in semiconductor manufacturing processes, printed circuit board manufacturing, shadow mask manufacturing for TV cathode-ray tubes, and the like. Established. These technologies apply so-called photoengraving technology, in which a photosensitive photoresist is applied to a substrate, irradiated with ultraviolet light through a photomask, and then developed to form a photomask pattern. An equivalent photoresist pattern can be formed or thereafter etched to form a pattern equivalent to the photoresist on the substrate.

Therefore, an example of a lithography technique in a semiconductor manufacturing process will now be described with reference to FIGS. FIGS. 8A to 8I show a process flow in a so-called wafer process (resist process and etching process). FIGS. 9A to 9E show a pattern cross-sectional shape when a negative resist (positive resist has an exposure step opposite to that of a positive resist) formed by the process flow is used. Here, an example in which an opening of SiO2 is provided on a silicon wafer will be described below.

First, [wafer pre-processing step] shown in FIG.
Then, a substrate 1 (silicon wafer) having a thermal oxide film (SiO 2) 2 formed on its surface at about 1 μm is cleaned and cleaned. Next, in [resist coating step] of FIG. 8B, a photoresist 3 is applied on the substrate 1 by 0.5 to 1.0 μm by spin coating (or roll coating).
m. In this case, in order to improve the adhesion between the substrate 1 and the photoresist 3, an adhesion enhancer (OA, not shown)
P etc.) are applied on the substrate 1 in advance. Next, FIG.
(C) In the [prebaking step], the solvent is evaporated at 80 to 90 ° C. to evaporate the solvent component in the applied photoresist.
In a baking oven for 10-20 minutes. Next, FIG.
(D) In the [mask alignment step] of FIG. 9A, the photomask 4 is aligned with the surface of the substrate 1 on which the photoresist 3 has been applied. The photomask 4 used here is formed by polishing a glass which is hardly affected by thermal expansion such as quartz glass or low expansion glass with high precision, and forming a desired pattern of a chromium vapor deposition film on the surface thereof. Things. Thus, the region where the chromium vapor deposition film is formed does not transmit light, and the region where the chromium vapor deposition film is not formed transmits light. Next, in [exposure step] of FIGS. 8E and 9B, after mask alignment is completed, exposure is performed by UV irradiation. Thus, irradiation or non-irradiation is performed in a region where the chromium vapor deposition film is formed and a region where chromium is not formed, so that a latent image corresponding to the chromium mask pattern is formed in the photoresist. Next, FIG.
(F) In the [development step] of FIG. 9 (c), in order to visualize the latent image in the negative resist, U
The portion of the photoresist 3 not irradiated with the V light is dissolved (however, in the case of a positive resist, the portion irradiated with the UV light is dissolved on the contrary). Thereby, the substrate 1
A photoresist pattern 5 is formed thereon. next,
In (post-bake step) of FIG. 8 (g), the photoresist pattern 5 after development is heated in a baking furnace at 130 to 150 ° C. for 30 to 60 minutes so as to withstand the etching solution in the next etching step. And cure. Next, in the [etching step] of FIGS. 8 (h) and 9 (d), the substrate 1 is immersed in a buffer etching solution of hydrofluoric acid and ammonium fluoride, and thermal oxidation of a region exposed by the photoresist pattern 5 is performed. The film 2 is removed by etching. Next, in [resist removing step] of FIGS. 8 (i) and 9 (e), the unnecessary photoresist 3 is removed, so that a heat resist having the same shape as the photoresist pattern 5 is formed on the substrate 1. A pattern 6 made of the oxide film 2 is formed. Therefore, this pattern 6 is a desired pattern.

[0005]

In the lithography technology of the conventional semiconductor manufacturing process as described above,
8A to 8G, and FIG.
(H) and (i) etching process steps. In particular, the former steps such as resist coating, exposure, and development have a problem that the process time is long. Further, the photomask 4 used in such a technique has a pattern formed on a glass substrate or a transparent film, and is very expensive.

[0006]

According to the first aspect of the present invention,
A substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head arranged at a position facing the substrate to eject a liquid substance, and information input for inputting computer image information to the ejection head Means,
Pattern image forming control means for ejecting the liquid substance from the ejection head based on the input computer image information and drawing a pattern image of the substance on the substrate.

Therefore, a pattern image of a substance can be directly formed on a substrate without performing photolithography as in the related art, and the process can be shortened.
A substrate on which a pattern image is formed can be manufactured at low cost.

According to a second aspect of the present invention, there is provided a substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head arranged at a position opposed to the substrate for ejecting a liquid material, Information input means for inputting computer image information to the ejection head; pattern image formation control means for ejecting the liquid material from the ejection head based on the input computer image information to draw a pattern image of the substance on the substrate; Means for curing a pattern image of the substance formed on the substrate.

Accordingly, a pattern image of a substance can be directly formed on a substrate without performing photolithography as in the prior art, so that the process can be shortened and a series of processes can be performed in the same forming apparatus. Therefore, a substrate on which a pattern image is formed can be manufactured at low cost.

According to a third aspect of the present invention, there is provided a substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head disposed at a position opposed to the substrate for ejecting a liquid material, Information input means for inputting computer image information to the ejection head; pattern image formation control means for ejecting the liquid material from the ejection head based on the input computer image information to draw a pattern image of the substance on the substrate; An uncovered area corroding means for immersing a substrate on which a pattern image of the substance is formed in an etching solution to corrode an uncoated area of the substance; and a cleaning means for removing the unnecessary substance.

Therefore, a lithography pattern can be formed directly on a substrate without performing a conventional photolithography process using a photomask, and the process can be shortened and cost can be reduced.

According to a fourth aspect of the present invention, there is provided a substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head arranged at a position opposed to the substrate for ejecting a liquid material, Information input means for inputting computer image information to the ejection head; pattern image formation control means for ejecting the liquid material from the ejection head based on the input computer image information to draw a pattern image of the substance on the substrate; A dry etching means for performing dry etching on the pattern forming surface of the substrate on which the pattern image of the substance is formed; and a cleaning means for removing the unnecessary substance.

Therefore, a lithography pattern can be formed directly on a substrate without performing a conventional photolithography process such as using a photomask, so that the process can be shortened and the cost can be reduced. Lithography patterns can be formed.

According to a fifth aspect of the present invention, there is provided an image characterized in that droplets of a liquid substance are ejected onto a substrate in accordance with computer image information by the principle of ink jet, and the liquid substance droplets are adhered and cured. It is a formed substrate.

Therefore, an image can be formed with high accuracy and can be suitably used for a printing plate.

According to a sixth aspect of the present invention, a droplet of a liquid material is ejected onto a substrate by the principle of ink jet according to computer image information, and the computer image is formed by the liquid material. An image-formed substrate characterized in that irregularities are formed on the surface of the substrate.

Accordingly, since a highly accurate image is formed and irregularities are formed directly on the substrate surface, the durability is high when used for a printing plate.

According to a seventh aspect of the present invention, a droplet of a liquid material is ejected onto a substrate according to computer image information by the principle of ink jet, and the droplet of the liquid material is attached and cured. This is an image forming method.

Therefore, a lithography pattern can be formed directly on a substrate without performing a conventional photolithography process such as using a photomask, so that the process can be shortened and cost can be reduced. This makes it possible to form an image which is suitable for a printing plate.

According to the present invention, a droplet of a liquid substance is ejected onto a substrate according to the computer image information by the principle of ink jet, and the computer image is formed by the liquid substance. While forming irregularities on the surface of the substrate by etching,
An image forming method for a substrate, characterized by cleaning and removing unnecessary substances.

Therefore, a concavo-convex pattern can be formed directly on the substrate surface without performing a conventional photolithography process such as using a photomask, so that the process can be shortened and the cost can be reduced. Since it is possible to form an image with high accuracy and directly form the unevenness, a product having high durability when used for a printing plate can be obtained.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. First, the overall configuration of the pattern image forming apparatus will be described with reference to FIG. A substrate 8 on which a pattern image is formed is provided on a substrate holding table 7 as substrate holding means. Also, the arm 9 on the substrate holding table 7
The carriage 10 is attached to the
Is fixed to the ejection head 11. Carriage 10
Can be moved in the X and Y directions by an X direction scan motor 12 and a Y direction scan motor 13. An ejection head system control box 14 is arranged below the substrate holder 7. The ejection head system control box 14 includes pattern image forming control means for ejecting a liquid resin 23 as a liquid substance from the ejection head 11 based on the input pattern image information and drawing a resin pattern image on the substrate 8. I have. A liquid resin supply tube 15 and a signal supply cable 16 are connected between the ejection head system control box 14 and the ejection head 11.
Further, the injection head system control box 14
Is connected via a control box 17 to a computer 18 as information input means.

FIG. 2 shows the configuration of the ejection head 11. The ejection head 11 has a nozzle 19 as an ejection port and a liquid chamber 2 as a flow path communicating with the nozzle 19.
0, an energy acting part 21 formed in a part of the liquid chamber 20 to change the internal volume, and a tank 24 as a liquid resin supply means for supplying a liquid resin 23 to the liquid chamber 20 via a resin supply path 22. It consists of The energy application section 21 includes a metal diaphragm 21a formed on the rear surface of the liquid chamber 20, and a piezoelectric element (piezoelectric crystal) 21b bonded to the metal diaphragm 21a. As a material of the liquid resin 23, a photosensitive resist is used.

When an appropriate voltage impulse is applied by using such an ejection head 11, the piezoelectric element 21b is driven and a bending moment acts on the metal diaphragm 21a to be deformed, so that the volume in the liquid chamber 20 is reduced. The pressure in the room rises, whereby the liquid resin 23 blows out from the nozzle 19 to the outside. In this case, the speed of the liquid resin 23 in the liquid chamber 20 is about 10 m / s, and it is preferable that the applied voltage impulse decrease to zero relatively slowly. Although the diameter of the nozzle 19 depends on the fineness of the pattern to be formed, a diameter of about φ10 to 100 μm is usually used. The viscosity of the photosensitive resist used for the liquid resin 23 is several cp, which is set to be lower than the viscosity in general spin coating.

Using the pattern image forming apparatus configured as described above, an image pattern is formed on the substrate 8 according to, for example, a process described below. First, a desired image pattern is designed using the computer 18 and making full use of computer graphics. Second, the substrate 8 is pre-processed (washed) and dried, and then set on the substrate holding table 7. Third, the ejection head 11 is activated, and the ejection head 11 is moved in the X and Y directions while ejecting the liquid resin 23 onto the substrate 8 according to the pattern of the computer graphics to form a resist pattern. Fourth, post baking is performed. Fifth, an etching process on the substrate 8 is performed. Sixth, a resist process is performed (the etching process and the resist process will be described in detail later). By such a series of processes, a lithography of a pattern designed by computer graphics on the substrate 8 is completed.

Further, the ejection head system control box 14 in the present apparatus is provided with dot ejection control means in addition to the above-described pattern image formation control means. The dot-imprinting control means forms a pattern image drawn on the substrate 8 by dots, and prints dots so as to overlap with each other so as not to form an image area between these vertically, horizontally, and diagonally adjacent dots. Operation processing. Therefore, a specific operation example of the dot ejection control means will now be described with reference to FIGS. First, when forming the pattern area 25 of a rectangular resin as shown in (a), if the method of forming the dot pattern 26 as shown in (b) is performed, an uncovered area is formed in an oblique direction. There is a problem that the region is etched away in a later etching step. For this reason, as shown in (c), the dot pattern 27 is formed so that the dots in the vertical, horizontal, and oblique directions overlap.
You need to type By performing such processing, the pattern region 25 is completely covered with the resin,
It can sufficiently fulfill the function as an etching resistant mask.

Next, another configuration example of the above-described ejection head 11 will be described with reference to FIG. Injection head 11 here
Is known as an ink-jet apparatus called a charge control type or a continuous flow type.
3 can be used to form a desired resin pattern. That is, as shown in FIG. 4, the liquid resin 23 injected by the vibration of the electrostrictive vibrator 28 passes through the charging electrode 29, is deflected by the deflection electrode 30, and is irradiated on the surface of the substrate 8. Is done. Further, the liquid resin 23 is collected in the liquid resin tank 31 and the pressure pump 32
Is sent again to the ejection head 11 and circulated. Although the liquid resin 23 is a charged particle, specifically, conductivity can be imparted by adding 5 to 10% of polyaniline. In this case, the difference from the ejection head 11 shown in FIG. 2 is that since ejection is performed using a pressure pump, the frequency of drop formation is high and high-speed pattern formation can be performed. In addition, the flying speed of the jet drop is high (1
5 to 20 m / s), stable drop injection can be performed.

The liquid resin 23 is not limited to a photosensitive resist, but may be any other material that is cured by light or heat, for example, a UV-curable epoxy adhesive,
A material having a low viscosity of several cp of a methacrylic acid resin containing a V-curing reaction initiator or a material made of a polymer acrylic solution which is heated by injection and cured after pattern formation, or the like can be used. In this case, when the liquid resin 23 reacts to light, the resin supply path 22 needs to block light from the outside. Therefore, the resin supply path 2
2 is made of an opaque material, a yellow transparent tube that is not exposed to photoresist or the like, or the entire injection system is installed in a yellow room for safety light that is not exposed.

Next, another embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the process of actually forming an image pattern using the above-described pattern image forming apparatus of FIG. 1 has been described. That is, first, the liquid resin 23 is sprayed onto the substrate 8 in a pattern image forming step to form a desired pattern image, the formed pattern image is cured in a pattern image curing step, and the cured pattern image is cured in an uncoated area corrosion step. The substrate 8 having the formed pattern image is immersed in an etching solution to erode an area that is not covered with the liquid resin 23 by an uncovered area corroding means, and remove the unnecessary liquid resin 23 in the liquid resin removing step by a cleaning means. I did it. Further, in addition to such a series of steps, various series of steps described below were provided.

The liquid resin 23 is sprayed onto the substrate 8 in a pattern image forming step to form a desired pattern image, the formed pattern image is cured in a pattern image curing step, and the cured pattern is dried in a dry etching step. The pattern forming surface of the substrate 8 having an image is dry-etched by dry etching means to remove the unnecessary liquid resin 23 in the liquid resin removing step.

In the pattern image forming step, a desired pattern is formed by spraying the liquid resin 23 on one side of the thin substrate 8.
The formed pattern image is cured by the pattern image curing step, a protective film is formed on the back surface of the substrate 8 by the protective film forming step, and the substrate 8 having the protective film and the pattern image is etched by the uncoated area corrosion step. And the area not covered with the liquid resin 23 is corroded to the bottom surface of the substrate, and the liquid resin 23 and the protective film which are no longer required in the liquid resin protective film removing step are removed.

In the mirror image pattern image forming step, the liquid resin 23 is sprayed on both the front and back surfaces of the thin substrate 8 to form a mirror image pattern image on the front and back surfaces, and the formed pattern image is cured in the pattern image curing step. A substrate 8 having a pattern image hardened on its front and back surfaces by a double-sided uncoated area corrosion penetration step is immersed in an etching solution, and the front and back surfaces of the substrate 8 are corroded to penetrate between both surfaces;
The liquid resin 23 that has become unnecessary in the liquid resin removing step is removed.

The liquid resin 23 is sprayed onto the substrate 8 in the pattern image forming step to form a desired pattern image, and the formed pattern image is cured in the pattern image curing step, and the cured pattern is formed in the thin film forming step. A thin film was formed on the surface on which the image was formed, and the thin film on the pattern image was removed by a thin film removing step.

The liquid resin 23 is sprayed onto the substrate 8 in a pattern image forming step to form a desired pattern image, the formed pattern image is cured in a pattern image curing step, and the substrate 8 is used as a cathode in a metal deposition step. The metal was selectively deposited on the substrate 8 by plating depending on whether or not the pattern image was covered, and the film-like precipitate deposited by plating in the film-like precipitate separation step was separated from the substrate 8.

Therefore, a description will be given below of an example of a characteristic process in the image pattern forming process based on a series of various processes as described above. First, as a first specific example, an etching method after forming a resin pattern is shown in FIG.
This will be described based on (a) to (c). (A), after forming the resin pattern 33 on the substrate 8, baking is performed,
The step of curing the resin pattern 33 is shown.
Note that a protective film 34 is provided on the back surface of the substrate 8 to prevent erosion by etching performed later. As this protective film 34, the same resin as that used for pattern formation can be used. Next, (b)
Is to etch the substrate 8 having the resin pattern 33 with the etching solution 3
5 shows a step of immersing the substrate in the substrate and performing etching. The etching solution 35 varies depending on the material to be removed by etching. For example, a buffer etching solution of hydrofluoric acid and ammonium fluoride is used to remove SiO ₂ , and phosphoric acid is used to remove Al. When the substrate 8 is made of copper or a wiring pattern of a printed circuit board is formed (copper pattern), an aqueous ferric chloride solution or the like is used. Here, an example of wet chemical etching is shown as the etching, but plasma dry etching can also be used effectively depending on the material to be removed. As an example, Ta ₂ N, Ta, or the like, which is formed as a thin film on a Si wafer by sputtering or the like, has no undercut by plasma dry etching with high accuracy and for a short time (several tens of seconds to several minutes).
, And the pattern is formed. Next, (c) shows a step in which the etching is completed, the unnecessary resin pattern 33 and the protective film 34 are removed, and the lithography is completed. As a result, it is possible to form a concavo-convex pattern on the substrate 8 according to the pattern produced by computer graphics.

In this specific example, the case where the amount of etching removal is reduced and a pattern of irregularities is formed on the surface of the substrate 8 has been described. By proceeding, the region without the resin pattern 33 penetrates to the bottom, and a method called chemical blanking (chemical blanking) can be provided. When the present embodiment is applied to the chemical blanking, a pattern having a desired shape is formed by computer graphics, a resin pattern 33 is drawn on the substrate 8, and thereafter, a component having a complicated shape is easily formed by etching. Can be easily manufactured without using a photomask. Further, since it is manufactured not by a mechanical method but by a chemical corrosion method, processing, distortion, deformation of the part does not occur, and a high-precision part can be manufactured at low cost.

Next, as a second specific example, the above-described chemical blanking, that is, a resin pattern 33 is formed on both the front and back surfaces of the substrate 8 so as to have a mirror image relationship with each other, and etching is performed simultaneously from both surfaces. Method 6
A description will be given based on (a) to (c). First, (a)
The figure shows a process in which a resin pattern 33 is formed on both the front and back surfaces of the substrate 8 and then baking is performed to cure the resin pattern 33. Next, (b) shows a process in which an etching solution 38 is sprayed from both surfaces of the substrate 8 on which the resin pattern 33 is formed from a spray nozzle 37 of a spray etching device 36 to perform etching. next,
(C) shows the resin removing agent 39 after the etching is completed.
(For example, when a photoresist is used as a resin material, there is a dedicated stripper.) This shows a process in which unnecessary resin is removed and component fabrication is completed. In this way, the method of performing chemical blanking by etching from both sides of the substrate 8 can produce a component with higher precision than the method of performing etching from one side, and uses a relatively thick substrate 8. Therefore, it is possible to manufacture a component having high strength.

Next, as a third specific example, a method of forming a pattern by forming a resin pattern 33 on the substrate 8 and then depositing a metal on the substrate 8 by plating is shown in FIG.
A description will be given based on (a) to (c). First, (a)
A step of baking after forming the resin pattern 33 on the substrate 8 and curing the resin pattern 33 is shown. Next, (b) shows the case where the substrate 8 is used as a cathode and the Ni plate 4
1 as an anode in a Ni plating solution 40,
The step of depositing Ni plating (precipitated metal) 42 in a region where the resin pattern 33 does not exist is shown. In this case, as the plating solution, sulfamic acid, a nickel bath, or the like can be used. After the Ni plating 42 is thus deposited, the resin pattern 33 is removed with a removing agent, whereby a desired pattern by Ni plating can be formed on the substrate 8. As another method, as shown in (c), after the Ni plating 42 is deposited,
It is also possible to peel off the deposited Ni plating 42 from the substrate 8 to produce a desired component.

The above (a) to (c) are methods for forming a pattern using Ni plating 42. As another example, a resin pattern 33 is formed using a Si wafer as the substrate 8 and cured. After that, Al is deposited by sputtering or vapor deposition, and thereafter, by removing only the resin pattern 33, a desired A is formed on the Si wafer.
1 pattern can be formed. Such a patterning method can be applied to form a good electrode pattern.

As described above, the liquid resin 23 is directly formed on the substrate 8 based on the image information of the computer graphics.
Spraying and pattern formation, it is possible to shorten the process and reduce the production cost compared to the so-called photolithography in which exposure and development are performed using an expensive photomask as before. it can. Further, since the ejection head 11 ejects the liquid resin 23 in a non-contact state with respect to the substrate 8 to form a pattern, a highly accurate pattern can be easily formed. As a material of the liquid resin 23, a photosensitive resist widely used in the field of a printed circuit board or the like is used, so that the liquid resin 23 can be easily obtained at a low cost. further,
Curing after pattern formation by spraying can also be easily cured by irradiation with UV light or the like.

Since the present etching method is a novel lithography technique and a chemical blanking method that does not use a photomask, the process for forming a desired lithography pattern on the substrate 8 can be shortened and the production cost can be reduced. And a highly accurate pattern can be formed.

[0042]

According to the first aspect of the present invention, there is provided a substrate on which computer image information is formed, substrate holding means for holding the substrate, and an ejection head which is disposed at a position opposed to the substrate and ejects a liquid material. Information input means for inputting computer image information to the ejection head, and pattern image forming control for ejecting the liquid material from the ejection head based on the input computer image information and drawing a pattern image of the material on the substrate Therefore, the pattern image of the substance can be directly formed on the substrate without performing photoengraving as in the related art, the process can be shortened, and the pattern image is formed at low cost. This has the effect that a substrate can be manufactured.

According to a second aspect of the present invention, there is provided a substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head disposed at a position opposed to the substrate for ejecting a liquid material, Information input means for inputting computer image information to the ejection head; pattern image formation control means for ejecting the liquid material from the ejection head based on the input computer image information to draw a pattern image of the substance on the substrate; Means for curing a pattern image of the substance formed on the substrate, so that a pattern image of the substance can be directly formed on the substrate without performing a conventional photoengraving process, thereby shortening the process. Since time can be reduced and a series of processes can be performed in the same forming apparatus, pattern images can be formed at low cost. It has the effect that the substrate can be manufactured.

According to a third aspect of the present invention, there is provided a substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head disposed at a position opposed to the substrate for ejecting a liquid material, Information input means for inputting computer image information to the ejection head; pattern image formation control means for ejecting the liquid material from the ejection head based on the input computer image information to draw a pattern image of the substance on the substrate; An uncoated area corrosion means for immersing a substrate on which a pattern image of the substance is formed in an etching solution to corrode an uncoated area of the substance, and a cleaning means for removing the unnecessary substance, Lithography directly on the substrate without the traditional photoengraving process that uses a photomask Pattern can be formed, short of the process, has the effect of cost reduction can be achieved.

According to a fourth aspect of the present invention, there is provided a substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head disposed at a position opposed to the substrate for ejecting a liquid material, Information input means for inputting computer image information to the ejection head; pattern image formation control means for ejecting the liquid material from the ejection head based on the input computer image information to draw a pattern image of the substance on the substrate; A dry etching means for performing dry etching on a pattern forming surface of a substrate on which a pattern image of the substance is formed, and a cleaning means for removing the unnecessary substance. A lithography pattern can be formed directly on a substrate without photolithography Short of the process, together with the cost reduction can be achieved, has the effect that it is possible to form a high-precision lithography pattern.

According to a fifth aspect of the present invention, there is provided an image characterized in that droplets of a liquid substance are ejected onto a substrate according to computer image information by the principle of ink jet, and the droplets of the liquid substance are adhered and cured. Since it is a formed substrate,
This has the effect that high-precision image formation can be performed and a product that can be suitably used for a printing plate is obtained.

According to a sixth aspect of the present invention, a droplet of a liquid material is ejected onto a substrate by the principle of ink jet according to computer image information, and the computer image is formed by the liquid material. Since it is an image-formed substrate characterized by having irregularities formed on the surface of the substrate, a highly accurate image is formed and irregularities are directly formed on the substrate surface. In this case, there is an effect that the durability is high.

The invention according to claim 7 is characterized in that droplets of a liquid substance are ejected onto a substrate according to computer image information by the principle of ink jet, and the droplets of the liquid substance are attached and cured. Because it is an image forming method, it is possible to directly form a lithographic pattern on a substrate without performing a conventional photoengraving process such as using a photomask, thereby shortening the process and reducing cost. This has the effect that high-precision image formation can be performed and a product that can be suitably used for a printing plate is obtained.

According to the eighth aspect of the present invention, a droplet of a liquid material is ejected onto a substrate by the principle of ink-jet according to computer image information, and the computer image is formed by the liquid material. While forming irregularities on the surface of the substrate by etching,
Since this is a method of forming an image on a substrate characterized by cleaning and removing unnecessary substances, a concavo-convex pattern can be formed directly on the substrate surface without performing a conventional photoengraving process such as using a photomask. The process can be shortened and the cost can be reduced, and very high-precision image formation can be performed. Furthermore, since the unevenness is directly formed, a product with high durability when used for a printing plate is obtained. It has the effect that it can be done.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an overall configuration of a pattern image forming apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a structure of an ejection head.

FIG. 3 is a schematic view illustrating a method for forming a resin pattern.

FIG. 4 is an exploded perspective view showing another structural example of the ejection head.

FIG. 5 is a process diagram showing a first specific example of performing an etching process after forming a resin pattern according to another embodiment of the present invention.

FIG. 6 is a process diagram showing a second specific example of performing an etching process after forming a resin pattern.

FIG. 7 is a process chart showing a third specific example of performing an etching process after forming a resin pattern.

FIG. 8 is a process diagram showing a state of a conventional etching process.

FIG. 9 is a process diagram showing an etching process for a negative resist.

[Explanation of symbols]

 7 Substrate holding means 8 Substrate 11 Jet head 18 Information input means 23 Liquid substance

Claims (8)

[Claims] 1. A substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head disposed at a position facing the substrate to eject a liquid material, and computer image information provided on the ejection head. And information input means for inputting the computer image information, and pattern image formation control means for injecting the liquid material from the ejection head based on the input computer image information and drawing a pattern image of the material on the substrate. Pattern image forming apparatus. 2. A substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head disposed at a position opposite to the substrate for ejecting a liquid material, and computer image information provided on the ejection head. Information input means for inputting the image data, pattern image formation control means for drawing the pattern image of the substance on the substrate by ejecting the liquid substance from the ejection head based on the inputted computer image information, and forming on the substrate A pattern image forming apparatus for curing a patterned image of the substance. 3. A substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head arranged at a position opposite to the substrate for ejecting a liquid material, and computer image information on the ejection head. Information input means for inputting a pattern image; a pattern image forming control means for jetting the liquid material from the jet head based on the input computer image information to draw a pattern image of the substance on the substrate; and a pattern image of the substance. Pattern image forming, comprising: an uncoated area corrosion means for immersing a substrate on which is formed an etchant in an etchant to corrode an area not covered with the substance; and a cleaning means for removing the unnecessary substance. apparatus. 4. A substrate on which computer image information is formed, substrate holding means for holding the substrate, an ejection head disposed at a position opposite to the substrate for ejecting a liquid substance, and computer image information provided on the ejection head. Information input means for inputting a pattern image; a pattern image forming control means for jetting the liquid material from the jet head based on the input computer image information to draw a pattern image of the substance on the substrate; and a pattern image of the substance. A pattern image forming apparatus, comprising: dry etching means for performing dry etching on a pattern forming surface of a substrate on which a pattern is formed; and cleaning means for removing unnecessary substances. 5. An image-formed substrate, wherein droplets of a liquid substance are ejected onto a substrate in accordance with computer image information by the principle of ink jet, and the liquid substance droplets are adhered and cured. 6. A droplet of a liquid material is ejected on the substrate according to computer image information according to the principle of ink-jet, and the computer image is formed by the liquid material, and then irregularities corresponding to the computer image are formed on the surface of the substrate. An image-formed substrate formed on a substrate. 7. A method of forming an image on a substrate, wherein droplets of a liquid substance are ejected onto a substrate according to computer image information according to the principle of ink jet, and the droplets of the liquid substance are adhered and cured. 8. A method for ejecting droplets of a liquid material on a substrate according to computer image information according to the principle of ink-jet, forming the computer image by the liquid material, and forming irregularities according to the computer image on the surface of the substrate. A method for forming an image on a substrate, comprising: forming a substrate by etching; and removing unnecessary substances by cleaning.