JP2000206557A - Liquid crystal display device and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make possible peeling and regeneration of mounting failure without producing defects in an interlayer insulating film in the production of a liquid crystal display device having a larger opening rate in which pixel electrodes are disposed in the uppermost layer of an active element array substrate through the interlayer insulating film. SOLUTION: Panel mounted electrodes 6a connected to active elements are formed in a mounting part, and an interlayer insulating film 7 is formed. The interlayer insulating film 7 on the panel mounted electrodes 6a and on the drain electrodes is opened by patterning. Then a protective film 8b is formed to cover the edge region 7b of the interlayer insulating film and the panel mounted electrodes 6a by patterning. Then terminals mounted on circuits with circuit mounted electrodes formed are connected by using a connecting film having anisotropic conductivity. By this method, the connecting film can be peeled without producing defects in the interlayer insulating film edge 7b in a remounting process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device used as a display device of an information processing terminal or a video device and a method of manufacturing the same. The present invention relates to a technique for improving a connection method between a panel mounting electrode and a circuit mounting electrode in a liquid crystal panel having a structure in which pixel electrodes are arranged to increase an aperture ratio.

[0002]

2. Description of the Related Art Hitherto, in order to increase the aperture ratio of an active element array substrate, a liquid crystal display device in which a pixel electrode is formed in the uppermost layer via an interlayer insulating film and a method of manufacturing the same have been disclosed. As an example, Shinjo, “A high-aperture 11.3 inch SVGA TFT-LCD fabricated by a shortened process method”, 19
96th International Conference on Active Matrix LCDs (AM
-LCD 96) Proceedings, pages 201 to 204 are known. (M. Sinjou et al., AHigh Aperture Ratio 11.3 in
ch-diagonal SVGA TFT-LCDs Fabricated by Reduced Pr
ocess Method, Digest of Technical Papers 1996 Inte
rnational Workshop on Active-Matrix Liquid Crystal
Displays (AM-LCD 96), pp. 201-204

FIG. 9 is a sectional view of an active element showing a conventional liquid crystal display device and a method of manufacturing the same. In FIG. 9, an active element array substrate includes a substrate 1 made of glass, a thin film transistor (hereinafter, referred to as a TFT) 4 having a source electrode 2 and a drain electrode 3, a gate electrode wiring 5, a gate electrode 5a, a source wiring 6, an interlayer. It is configured to include the insulating film 7, the pixel electrode 8, and the contact hole 7 a of the interlayer insulating film 7 formed for connecting the drain electrode 3 and the pixel electrode 8.

In order to manufacture an active element array substrate having such a structure, first, a substrate 1 made of glass is
Indium Tin Oxide (hereinafter ITO)
) Is formed. Next, a-Si and SiN are used as a channel layer and a gate insulating film, respectively, to form a gate electrode 5a. Thus, a TFT 4 having the source electrode 2, the drain electrode 3, and the gate electrode 5a is formed. Next, a source line 6 is formed on the source electrode 2 and a gate electrode line 5 is formed on the gate electrode 5a.
To form The gate electrode 5a and the gate electrode wiring 5 are formed by substantially the same process.

Next, a photosensitive and low dielectric constant (relative dielectric constant = 3.5) insulating film material is spin-coated on the entire surface, and exposed and developed (patterned) to form a 1.5 μm thick interlayer having a contact hole 7a. An insulating film 7 is formed. Next, after ITO is again formed on the entire surface of the interlayer insulating film 7, the pixel electrode 8 is formed by an exposure and development process. Here, the pixel electrode 8 is connected to the drain electrode 3 via the contact hole 7a, and partially overlaps the gate electrode wiring 5 and the source wiring 6 with the interlayer insulating film 7 interposed therebetween.

The presence of such an interlayer insulating film 7 allows the pixel electrode 8 in the uppermost layer to be formed so as to extend over the gate electrode wiring 5 and the source wiring 6, and the effective area of the pixel electrode 8 can be further increased. Further, by forming the interlayer insulating film 7 thick by spin coating, the pixel electrode 8 and the gate electrode wiring 5 are formed.
And the parasitic capacitance between the source wiring 6 and the source wiring 6 can be reduced. Therefore, the occurrence of crosstalk can be suppressed, and a liquid crystal display device having a large aperture ratio can be obtained.

[0007]

However, as shown in such a liquid crystal display device and its manufacturing method,
In the case of an active element array substrate having a structure having an interlayer insulating film on a wiring, if a connection failure (hereinafter, referred to as a mounting failure) occurs in a mounting process with a drive circuit, it must be remounted. At this time, when the circuit mounting electrode portion is peeled from the panel mounting electrode portion of the active element array substrate,
The interlayer insulating film near the mounting part was often damaged. In this case, the reliability of the liquid crystal display device may be impaired.

Referring to FIGS. 9 and 10 to 12, the structure of the active element array substrate in the vicinity of the mounting portion will be described.
A method for connecting to the circuit mounting electrode unit will be described in detail.
10A and 10B are structural views of a mounting portion of an active element array substrate in a conventional liquid crystal display device, where FIG. 10A is a partially transparent plan view, and FIG. 10B is a structural cross section cut along line AB in FIG. FIG. 11A and 11B are structural views of a mounting portion after a mounting step in a conventional liquid crystal display device, in which FIG. 11A is a partially transparent plan view, and FIG. 11B is a structural cross-sectional view taken along line AB in FIG. is there. 12A and 12B are structural views of a mounting portion of an active element array substrate after a connection film is removed due to a mounting defect in a mounting process in a conventional liquid crystal display device, where FIG. 12A is a partially transparent plan view, and FIG. FIG. 3A is a structural cross-sectional view taken along line AB in FIG.

In FIGS. 10 to 12, a panel mounting electrode 6a is an extraction electrode for supplying power to the source wiring 6 in FIG.
It is formed simultaneously with the source wiring 6. End 7b of interlayer insulating film
Is an end portion of the interlayer insulating film 7 formed for exposing the panel mounting electrode 6a, and is formed by removing the interlayer insulating film 7 by patterning at a predetermined distance from an end of the substrate 1. . Circuit mounting terminal 9 is FPC or TC
This is the end of P, and the circuit mounting electrode 10 is formed by patterning.

The connection film 11 shown in FIG. 11B is a conductive connection film for mounting and connecting the circuit mounting terminal 9 to the panel mounting electrode 6a. The connection film 11 is also called an anisotropic conductive film (ACF), and is composed of conductive particles and an adhesive. The connection principle is basically pressure welding, and the conductive particles have a function of maintaining electrical connection, and the adhesive has a function of maintaining pressure contact. Therefore, electrical connection can be made only to the electrodes existing in the pressure contact direction. The interlayer insulating film defective portion 7c shown in FIG. 12 is a portion where the interlayer insulating film end 7b is defective when the connection film 11 is removed for reproducing the mounting portion. Since other configurations are the same as those shown in FIG. 9, the same components are denoted by the same reference numerals and detailed description is omitted.

First, an interlayer insulating film 7 is formed in a mounting portion of an active element array substrate before forming a pixel electrode. A contact hole 7a as shown in FIG. 9 is formed in the interlayer insulating film 7 by patterning. Then, as shown in FIG. 10, an end portion 7b of the interlayer insulating film is formed such that the panel mounting electrode 6a for supplying power to the TFT 4 is exposed.

In a subsequent mounting step, the circuit mounting terminals 9 having the circuit mounting electrodes 10 are pressed onto the panel mounting electrodes 6a with the connection film 11 interposed therebetween, and the connection film 11 is heated to cure the adhesive. Thus, the connection between the active element array substrate and the FPC or TCP is completed. Since the thickness of the connection film 11 is kept substantially equal to the diameter of the conductive particles, the plurality of conductive particles contact the panel mounting electrode 6a and the circuit mounting electrode 10. On the other hand, since the arrangement pitch of the panel mounting electrodes 6a or the circuit mounting electrodes 10 is sufficiently larger than the diameter of the conductive particles, the adjacent panel mounting electrodes 6a or the circuit mounting electrodes 10 are in an insulated state. Thus, conductivity is ensured only in the direction of the panel mounting electrode 6a and the circuit mounting electrode 10.

After this mounting step, a connection test is performed. By the inspection at this time, the circuit mounting electrode 10 and the panel mounting electrode 6
a is determined to be incomplete, the connection film 1
1 is peeled off, and the mounting process is performed again to reproduce the panel mounting electrode 6a and the circuit mounting electrode 10. In this peeling step, a part of the interlayer insulating film end 7b that has been in contact with the connection film 11 is broken as shown in FIGS. 12A and 12B, and an interlayer insulating film defective portion 7c is generated.

It is assumed that this is because the adhesion between the connection film 11 and the end 7b of the interlayer insulating film is stronger than the adhesion between the end 7b of the interlayer insulating film and the lower layer. If the active element array substrate is mounted again with such an interlayer insulating film defective portion 7c, the reliability of the liquid crystal display device is reduced. The main cause of the decrease in reliability is that impurities such as moisture enter the interface with the panel mounting electrode 6a,
The function of the active element is degraded. In order to solve this problem, it is conceivable to form the end 7b of the interlayer insulating film so as not to be in contact with the connection film 11, but the wiring from the active element to the panel mounting electrode 6a becomes longer, and the parasitic resistance increases. Not lead to results.

The present invention has been made in view of such conventional problems, and when a mounting failure of an active element array substrate occurs, an increase in parasitic resistance in a mounting portion and a defect in an interlayer insulating film defective portion occur. It is an object of the present invention to realize a liquid crystal display device capable of reconnecting an active element array substrate and a circuit mounting electrode without generating the same and a method of manufacturing the same.

[0016]

In order to solve the above-mentioned problems, an invention according to claim 1 of the present application is directed to an active element portion having an active element for driving a liquid crystal cell of each pixel, and a circuit mounting electrode. A liquid crystal display device provided with an active element array substrate having a mounting section for providing a drive signal of a liquid crystal cell to the active element via the active element array substrate, wherein a plurality of strips are provided at predetermined intervals in the mounting section of the active element array substrate. A panel mounting electrode for connecting a control electrode of the active element and the circuit mounting electrode via a conductive film, and an insulating film material for an upper surface of the active element portion and a part of an upper surface of the mounting portion. The insulating film material is opened as a contact hole toward the control electrode of the active element, and the upper part of the panel mounting electrode is connected. A connection between the active element array substrate and a pixel electrode formed on the interlayer insulating film for each pixel by using a transparent conductor, and connected to the active element through the contact hole; A protective film formed by using the same conductor as the pixel electrode with respect to the interlayer insulating film and the panel mounting electrode in the vicinity of the portion, and forming the panel mounting electrode and the circuit mounting electrode with the protective film. And a connection film having anisotropic conductivity and adhesiveness.

According to a second aspect of the present invention, in the liquid crystal display device of the first aspect, the active element is a thin film transistor, and the connection with the pixel electrode is made via a drain electrode of the thin film transistor. It is assumed that.

According to a third aspect of the present invention, in the liquid crystal display device of the first aspect, the interlayer insulating film is an organic film,
The connection film is characterized in that conductive particles are dispersed and mixed in an adhesive.

According to a fourth aspect of the present invention, in the liquid crystal display device of the first aspect, the pixel electrode and the protective film are made of indium tin oxide.

According to a fifth aspect of the present invention, an active element for driving a liquid crystal cell is formed on a transparent substrate, and a panel mounting electrode connected to a control terminal of the active element is formed on an edge of the transparent substrate. A first step of forming; a second step of applying an interlayer insulating film material on each of the upper part of the active element and the upper part of the panel mounting electrode; and a contact hole pattern communicating with a control terminal of the active element and the panel. A third step of exposing and developing the interlayer insulating film material to form a patterned interlayer insulating film using a photomask having an opening pattern for opening a mounting electrode; and forming the interlayer insulating film. Later, a pixel electrode material of a transparent conductor is formed, and etching is performed using a mask having a pixel electrode pattern and a panel mounting electrode pattern to form a contact. A fourth step of forming a pixel electrode connected to the active element through the panel mounting electrode, and covering the interlayer insulating film near the panel mounting electrode and a protective film over the panel mounting electrode; and And a circuit mounting electrode connected to the driving circuit by using an anisotropically conductive connection film.

According to a sixth aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the fifth aspect, the active element comprises:
A thin film transistor, wherein connection to the pixel electrode is performed via a drain electrode of the thin film transistor.

According to a seventh aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the fifth aspect, the interlayer insulating film is an organic film, and the connection film has conductive particles dispersed and mixed in an adhesive. It is characterized by the following.

According to an eighth aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the fifth aspect, the pixel electrode and the protective film are made of indium tin oxide.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a liquid crystal display device and a method of manufacturing the same according to each embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1) First, a liquid crystal display device and a manufacturing method thereof according to Embodiment 1 of the present invention will be described.
This will be described with reference to FIGS. Note that the same reference numerals are used for the same parts as those in the conventional example, and detailed description is omitted. FIG.
FIG. 4 is a partially transparent plan view showing a structure of a mounting portion during a manufacturing process of the liquid crystal display device according to the present embodiment. FIG. 2 is a sectional structural view showing each manufacturing step of the active element array substrate in the liquid crystal display device according to the present embodiment. FIG.
FIG. 4 is a plan view showing a structure of a mounting portion in a manufacturing process (1) of an active element array substrate in a liquid crystal display device. FIG. 4A is a plan view showing the structure of the mounting portion in the manufacturing process (No. 2), and FIGS. 4B and 4C are cross sections showing the structure of the mounting portion in the manufacturing process (No. 2). FIG.

1 to 4, the active element array substrate has an active element section and a mounting section. FIG.
As shown in FIG. 2, a mounting portion is formed at the edge of the active element array substrate, and as shown in FIG. 2, a TFT 4 is formed as an active element portion in each pixel portion of the active element array substrate. As shown in FIG. 2A, in the TFT 4,
A gate electrode 5a, a gate insulating film 21, a channel layer 22, a channel protective film 23, and a contact layer 2 are formed on the upper surface of the substrate 1.
4, the source electrode 2 and the drain electrode 3 are formed in this order. Also, as shown in FIGS. 2B and 2C, T
An interlayer insulating film 7 is formed on the upper portion of the FT 4 and on the upper surface of the gate insulating film 21 where the TFT 4 is not formed.
Then, a part of the interlayer insulating film 7 located above the TFT 4 is opened to the part of the drain electrode 3 to form a contact hole 7a. Then, an ITO film is formed by patterning on the surface of the interlayer insulating film 7 in the pixel portion including the contact hole 7a, thereby forming a pixel electrode 8.

As shown in FIGS. 1 and 3A and 3B, when the TFT 4 is formed, the same conductive film as the source electrode 2 and the drain electrode 3 is used for panel mounting on the mounting portion of the active element array substrate. The electrode 6a is formed in a band shape.
The protection film 8b shown in FIG. 1, FIG. 3 (c) and FIG. 4 is used to prevent the end 7b of the interlayer insulating film on the panel mounting electrode 6a from directly contacting the connection film 11 applied at the time of mounting. It is a membrane. The circuit mounting electrode 10 of the circuit mounting terminal 9 is connected to the drive circuit, and the protective film 8 b
It is a feature of the present embodiment that it is connected to panel mounting electrode 6a via a.

A method for manufacturing an active element array substrate of a liquid crystal display having such a structure will be described below. First, an AlZr alloy (Zr: 1 at%) is formed on a glass substrate 1 by a sputtering method.
Etching is performed using the gate pattern to form the gate electrode wiring 5 and the gate electrode 5a. Next, a first SiNx film is formed by a plasma chemical vapor deposition method (hereinafter, referred to as a p-CVD method), and a gate insulating film 21 is formed. Then, a channel layer 22 is formed by forming amorphous Si, a second SiNx is further formed, and a channel protective film 23 is formed by patterning.

Next, an n-type amorphous Si which is made n-type by adding P impurities by a p-CVD method and a Ti film are formed on the entire surface by a sputtering method using an Ar gas. next,
By etching amorphous Si, n-type amorphous Si and Ti into a predetermined shape, the channel layer 22, the contact layer 24, the source electrode 2, the drain electrode 3, and the channel layer 22 having the cross-sectional shape shown in FIG. Are simultaneously formed. At this time, FIG.
As shown in (a), a panel mounting electrode 6a formed of Ti is also formed at the same time.

Next, as shown in FIG. 2B and FIG. 3B, a photosensitive organic material (PC-30 manufactured by Nippon Synthetic Rubber Co., Ltd.)
2) Spin coating (100)
(0 rpm, 15 sec), and a contact hole 7a and an end portion 7b of the interlayer insulating film are formed by exposure and development. Thus, the interlayer insulating film 7 in the mounting portion is removed, and the panel mounting electrode 6a is removed.
Is exposed.

Next, as shown in FIGS. 2 (c) and 3 (c), ITO as a pixel electrode material is formed by sputtering.
Is formed on the entire surface with a thickness of about 100 nm. Then, the pixel electrode 8 connected to the drain electrode 3 through the contact hole 7a is formed by wet etching using the resist pattern as a mask, and at the same time, the protective film 8b is formed on the mounting portion.
To form 4B is a partial cross-sectional view taken along a line AB in FIG. 4A, and FIG. 4C is a partial cross-sectional view taken along a line CD in FIG. 4A. As shown in FIGS. 4B and 4C, the protective film 8b covers the panel mounting electrode 6a and the edge 7b of the interlayer insulating film. Here, the interval between the protection films 8b along the CD direction is about 20 μm on the interlayer insulating film end 7b in consideration of adjacent short-circuit due to a defect in the resist pattern and the parasitic capacitance between the adjacent protection films 8b. did.

Next, as shown in FIGS. 4A and 4B, in the mounting step of the active element array substrate, the mounting circuit terminals 9 connected to the driving circuit are connected to the panel mounting electrodes 6a using the connection films 11. Connect by mounting. As described above, the connection film 11 is obtained by dispersing and mixing conductive particles in an adhesive.
Each conductive particle is composed of the panel mounting electrode 6a and the circuit mounting electrode 1
The two electrodes are electrically connected to each other by being sandwiched between zero. This connection state is maintained by the adhesiveness of the adhesive.

When the mounting failure occurs, mounting and reproduction are performed. However, when the connection film 11 is peeled off, the interlayer insulating film no longer suffers a defect at the interlayer insulating film end 7b under the protective film 8b. The reason for this improvement is presumed to be that the adhesion of the connection film 11 was reduced due to the presence of the protection film 8b, and separation occurred at the interface between the protection film 8b and the connection film 11. It is to be noted that between the protective films 8b, the end portions 7b of the interlayer insulating film and the connection films 11 are formed.
Although a slight loss of the edge of the interlayer insulating film was observed in the portion where the substrate was in direct contact with the substrate, the defect was not on the panel mounting electrode 6a. There was no negative effect on the situation.

(Embodiment 2) Next, a liquid crystal display device and a method of manufacturing the same according to Embodiment 2 of the present invention will be described.
This will be described with reference to FIGS. The same parts as those in the conventional example and the first embodiment are denoted by the same reference numerals, and detailed description is omitted. FIG. 5 is a plan view showing a structure of a mounting portion in each manufacturing process of the active element array substrate in the liquid crystal display device of the present embodiment. 6A and 6B show a cross-sectional structure of a mounting portion of an active element array substrate in a liquid crystal display device. FIG. 6A is a cross-sectional view taken along a line AB in FIG.
FIG. 5B is a cross-sectional view along the line CD in FIG.

The entire process of the active element portion and the process of forming the interlayer insulating film 7 in the mounting portion are the same as those shown in FIGS. 2 and 3A. Therefore, here, the interlayer insulating film 7
The steps after the formation of are described. Note that FIG. 2 is used as the active element portion, and FIGS. 5 and 6 are used as the mounting portion.

First, as a step of forming the interlayer insulating film 7, an insulating interlayer material made of a photosensitive organic material (manufactured by Nippon Synthetic Rubber Co .; PC-302) is spin-coated (1000 rpm) on the entire surface.
m, 15 sec), and a contact hole 7a and an interlayer insulating film end 7b are formed by exposure and development. In this case,
As shown in FIGS. 2B, 5A, and 6B, the interlayer insulating film 7 is opened in a strip shape, and only the panel mounting electrode 6a is exposed.

Next, as shown in FIGS. 2C and 5B, ITO was used as a pixel electrode material by sputtering.
Is formed on the entire surface to a thickness of about 100 nm. Thereafter, wet etching is performed using the resist pattern as a mask to form a pixel electrode 8 connected to the drain electrode 3 through the contact hole 7a. At the same time, the protective film 8b covers the panel mounting electrode 6a and the end 7b of the interlayer insulating film. Here, the interval between the protective films 8b is determined by an adjacent short-circuit due to a defect of the resist pattern or the like, and an adjacent protective film 8b.
Considering the parasitic capacitance between b, it was set to about 50 μm.

Next, as shown in FIGS. 5C and 6, in the mounting step of the active element array substrate, the mounting circuit terminal 9 having the circuit mounting electrode 10 is similar to the first embodiment.
Is mounted and connected on the panel mounting electrode 6 a using the connection film 11.

When the mounting failure occurs, mounting and reproduction are performed. When the connection film 11 is peeled off, the interlayer insulating film no longer suffers a defect at the interlayer insulating film end 7b under the protective film 8b. The reason for this improvement is that the adhesion of the connection film 11 is reduced by the protection film 8b, and the protection film 8b and the connection film 11
It is presumed that peeling occurred at the interface with. Further, even in a portion between the protective films 8b where the interlayer insulating film 7 and the connection film 11 are in direct contact, no defect of the interlayer insulating film 7 was observed. This is presumably because the end of the interlayer insulating film 7 was covered with the protective film 8b.

(Embodiment 3) Next, a liquid crystal display device and a method of manufacturing the same according to Embodiment 3 of the present invention will be described.
This will be described with reference to FIGS. The same parts as those in the conventional example and the first and second embodiments are denoted by the same reference numerals, and detailed description is omitted. FIG. 7 is a plan view showing a structure of a mounting portion in each manufacturing process of the active element array substrate in the liquid crystal display device of the present embodiment. 8A and 8B show a cross-sectional structure of a mounting portion of the active element array substrate in the liquid crystal display device. FIG. 8A is a cross-sectional view taken along a line AB in FIG. 7C, and FIG. It is sectional drawing along CD of FIG.

The entire process of the active element portion and the process up to the formation of the interlayer insulating film 7 in the mounting portion are shown in FIGS.
(A) is the same as that described in the first embodiment.
Therefore, steps after the formation of the interlayer insulating film 7 will be described here. Note that FIG. 2 is used as the active element portion, and FIGS. 7 and 8 are used as the mounting portion.

First, as shown in FIGS. 2B and 7A, as a step of forming the interlayer insulating film 7, an interlayer insulating film made of a photosensitive organic material (manufactured by Nippon Synthetic Rubber Co .; PC-302) is used. Spin coating of material over the entire surface (1000 rpm, 15 sec)
Then, a contact hole 7a and an end 7b of the interlayer insulating film are formed by exposure and development. At the end 7b of the interlayer insulating film,
The interlayer insulating film 7 is opened in a strip shape with respect to the panel mounting electrode 6a and the gate insulating film 21 around the panel mounting electrode 6a.

Next, as shown in FIGS. 2 (c) and 7 (b), a sputtering method is used, and an IT
O is deposited over the entire surface to a thickness of about 100 nm. Then, wet etching is performed using the resist pattern as a mask to form a pixel electrode 8 connected to the drain electrode 3 through the contact hole 7a. At the same time, a protective film 8b is formed to cover the panel mounting electrode 6a, the gate insulating film 21 around the panel mounting electrode 6a, and the edge 7b of the interlayer insulating film. Here, the interval between the protective films 8b is set to about 40 μ in consideration of an adjacent short due to a defect in the resist pattern or the like and a parasitic capacitance between the adjacent protective films 8b.

Next, as shown in FIG. 7C, in the mounting step of the active element array substrate, the mounting circuit terminals 9 having the circuit mounting electrodes 10 are mounted on the panel using the connection films 11 as in the first embodiment. It is mounted and connected on the electrode 6a.

When mounting failure occurs, mounting and reproduction are performed. However, when the connection film 11 is peeled off, the interlayer insulating film no longer loses at the interlayer insulating film end 7b under the protective film 8b. The reason for this improvement is that the adhesion of the connection film 11 is reduced by the protection film 8b, and the protection film 8b and the connection film 11
It is presumed that peeling occurred at the interface with. Also, the protective film 8
No defect in the interlayer insulating film 7 was observed even between the points b and the portion where the interlayer insulating film 7 and the connection film 11 were in direct contact. This is presumably because the end of the interlayer insulating film 7 was covered with the protective film 8b.

In the above description, it is assumed that the protective film 8b is made of ITO of the same material as the pixel electrode 8, and the protective film 8b
The manufacturing process of b was also common. However, the protective film 8b prevents the contact between the end portion 7b of the interlayer insulating film on the panel mounting electrode 6a and the connection film 11, and if the protective film 8b does not affect the underlying layer in forming the protective film 8b, Other materials may be used. For example, the same effect was obtained with SiN formed at a low temperature. Further, the active element is made of a TFT, but may be a non-linear two-terminal element such as a MIM.

[0047]

As described above, according to the present invention, since the edge of the interlayer insulating film on the panel mounting electrode is covered with the protective film, the reproduction for the defective mounting can be performed without causing the edge of the interlayer insulating film to be damaged. As a process, the connection film can be easily removed. Therefore, an advantageous effect that the production yield of the liquid crystal display device is improved can be obtained.

In particular, according to the first aspect of the present invention, the effect of suppressing the occurrence of a defective portion in the interlayer insulating film can be obtained in peeling and removing the connection film.

In particular, according to the second aspect of the present invention, since the active element is a thin film transistor, a liquid crystal display device with further reduced crosstalk can be obtained.

In particular, according to the third aspect of the invention, the aperture ratio can be increased by increasing the thickness of the interlayer insulating film. Further, the connection of the mounting portion can be easily performed by pressing and heating the connection film.

According to the present invention, since the pixel electrode and the protective film are made of indium tin oxide, the protective film and the pixel electrode can be formed in the same step.

According to the fifth aspect of the present invention, an interlayer insulating film can be formed thicker than an active element, and a liquid crystal display device having a high aperture ratio can be manufactured. Further, when the connection film is peeled and removed due to a mounting failure, the loss of the interlayer insulating film can be eliminated.

In particular, according to the invention described in claim 6, a liquid crystal display device with further reduced crosstalk can be manufactured.

In particular, according to the seventh aspect of the present invention, in the processing step of the interlayer insulating film material, it is possible to share the apparatus with a normal photo etching step apparatus. In addition, by using a connection film having anisotropic conductive properties, connection of the mounting portion can be easily performed by pressing and heating the connection film.

In particular, according to the invention of claim 8, a pixel electrode having low resistance and high transmittance can be formed without damaging the active element and the interlayer insulating film. Further, the protective film and the pixel electrode can be formed in the same step.

[Brief description of the drawings]

FIG. 1 is a partial perspective plan view showing a structure of a mounting portion in a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of each step showing a method for manufacturing an active element array substrate (active element section) in the liquid crystal display device according to the first embodiment.

FIG. 3 is a partial plan view of each step showing a method (part 1) for manufacturing an active element array substrate (mounting part) in the liquid crystal display device according to the first embodiment.

FIGS. 4A and 4B are explanatory diagrams showing a manufacturing method (part 2) of the active element array substrate (mounting portion) in the liquid crystal display device according to the first embodiment, where FIG. 4A is a partial plan view and FIG.
FIG. 3A is a cross-sectional view taken along the line AB in FIG.
It is sectional drawing which followed -D.

FIG. 5 is a partial plan view of each step showing a method (part 1) for manufacturing an active element array substrate (mounting part) in the liquid crystal display device according to the second embodiment of the present invention.

FIGS. 6A and 6B are explanatory diagrams showing a method (No. 2) for manufacturing an active element array substrate (mounting part) in the liquid crystal display device according to the second embodiment, and FIG.
5B is a cross-sectional view taken along a line CD in FIG. 5C.

FIG. 7 is a partial plan view of each step showing a method (part 1) for manufacturing an active element array substrate (mounting part) in the liquid crystal display device according to the third embodiment of the present invention.

FIGS. 8A and 8B are explanatory diagrams showing a method (No. 2) for manufacturing an active element array substrate (mounting part) in the liquid crystal display device according to the third embodiment, and FIG. 8A is a diagram AB in FIG.
7 (b) is a cross-sectional view along the line CD in FIG. 7 (c).

FIG. 9 is a cross-sectional view showing a structure of an active element in a conventional liquid crystal display device and a method of manufacturing the same.

10A is a perspective plan view showing a structure of a mounting part of an active element array substrate in a conventional liquid crystal display device and a method of manufacturing the same, and FIG. 10B is a perspective view of FIG. It is sectional drawing which shows a partial structure.

11A is a perspective plan view showing a state in which a circuit mounting terminal is connected to a mounting portion in a conventional liquid crystal display device and a method of manufacturing the same, and FIG. 11B is a perspective view of AB in FIG. It is sectional drawing which shows the partial structure in.

12A and 12B are explanatory views showing a state after a peeling step when a mounting defect occurs in a conventional liquid crystal display device and a method of manufacturing the same, where FIG. 12A is a partially transparent plan view of a mounting portion, and FIG.
FIG. 3A is a cross-sectional view showing a partial structure taken along a line AB in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Source electrode 3 Drain electrode 4 TFT 5 Gate electrode wiring 5a Gate electrode 6 Source wiring 6a Panel mounting electrode 7 Interlayer insulating film 7a Contact hole 7b Interlayer insulating film edge 7c Interlayer insulating film defect part 8 Pixel electrode 8b Protective film 9 Circuit mounting terminal 10 Circuit mounting electrode 11 Connecting film 21 Gate insulating film 22 Channel layer 23 Channel protective film 24 Contact layer

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tatsuya Wakimoto 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 2H092 GA43 GA44 GA49 JA26 JA36 JA44 JA46 JB01 JB56 JB71 KA05 KA07 KA12 KA18 KA24 KB25 MA05 MA07 MA10 MA13 MA17 MA46 NA17 NA28 5C094 AA09 AA10 AA42 AA43 BA03 BA43 CA19 DA13 DA15 DB03 EA04 EA05 EA10 EB02 FA01 FA02 FB01 FB02 FB12 FB15 GB10

Claims (8)

[Claims] 1. An active element array substrate having an active element section on which an active element for driving a liquid crystal cell of each pixel is formed, and a mounting section for providing a drive signal for the liquid crystal cell to the active element via a circuit mounting electrode. A liquid crystal display device, wherein a plurality of strips are provided at predetermined intervals in a mounting portion of the active element array substrate, and a control electrode of the active element and the circuit mounting electrode are connected via a conductive film. A panel mounting electrode, and an upper surface of the active element portion and a part of an upper surface of the mounting portion are formed using an insulating film material, and the insulating film material is contact holed toward a control electrode of the active element. An interlayer insulating film that is opened as a hole and an upper part of the panel mounting electrode is opened as a connection portion; and the interlayer insulating film for each pixel using a transparent conductor. A pixel electrode formed on a film and connected to the active element through the contact hole; and the interlayer electrode and the panel mounting electrode near a connection portion of the active element array substrate. A protective film formed using the same conductor as the above, a connection film having anisotropic conductivity and adhesiveness, connecting the panel mounting electrode and the circuit mounting electrode via the protective film,
A liquid crystal display device comprising: 2. The liquid crystal display device according to claim 1, wherein said active element is a thin film transistor, and connection with said pixel electrode is made via a drain electrode of said thin film transistor. 3. The liquid crystal display device according to claim 1, wherein the interlayer insulating film is an organic film, and the connection film is made of conductive particles dispersed and mixed in an adhesive. 4. The liquid crystal display device according to claim 1, wherein the pixel electrode and the protective film are made of indium tin oxide. 5. A first step of forming an active element for driving a liquid crystal cell on a transparent substrate, and forming a panel mounting electrode connected to a control terminal of the active element on an edge of the transparent substrate. A second step of applying an interlayer insulating film material on the upper part of the active element and the upper part of the panel mounting electrode, respectively; and for opening a contact hole pattern communicating with a control terminal of the active element and the panel mounting electrode. A third step of exposing and developing the interlayer insulating film material to form a patterned interlayer insulating film using a photomask having an opening pattern of: a transparent conductive pixel electrode after the formation of the interlayer insulating film; A material is formed, and etching is performed using a mask having a pixel electrode pattern and a panel mounting electrode pattern. Forming a pixel electrode connected to the active element and covering the interlayer insulating film near the panel mounting electrode and a protective film over the panel mounting electrode; and 5th connection and mounting of the circuit mounting electrode connected to the substrate using an anisotropic conductive connection film.
A method for manufacturing a liquid crystal display device, comprising the steps of: 6. The method according to claim 5, wherein the active element is a thin film transistor, and the connection with the pixel electrode is made via a drain electrode of the thin film transistor. 7. The method according to claim 5, wherein the interlayer insulating film is an organic film, and the connection film is formed by dispersing and mixing conductive particles in an adhesive. 8. The method according to claim 5, wherein the pixel electrode and the protective film are made of indium tin oxide.