JP2000203878A - Glass ceramic composition - Google Patents
Glass ceramic compositionInfo
- Publication number
- JP2000203878A JP2000203878A JP11006705A JP670599A JP2000203878A JP 2000203878 A JP2000203878 A JP 2000203878A JP 11006705 A JP11006705 A JP 11006705A JP 670599 A JP670599 A JP 670599A JP 2000203878 A JP2000203878 A JP 2000203878A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- ceramic composition
- weight
- filler
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ガラスセラミック
ス組成物に関し、さらに詳しくは樹脂基板上に層を形成
するために用いられるガラスセラミックスパッケージ材
料、例えば、多層回路絶縁層用、クロスオーバー絶縁層
用、あるいはオーバーコート用として好適なガラスセラ
ミックス組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass ceramic composition, and more particularly to a glass ceramic package material used for forming a layer on a resin substrate, for example, for a multilayer circuit insulating layer and a crossover insulating layer. Or a glass-ceramic composition suitable for overcoating.
【０００２】[0002]
【従来の技術】近年、電子部品の高密度実装化に伴い、
樹脂基板とガラスセラミックス多層基板との複合化技術
の検討が進められている。ところが、樹脂基板とガラス
セラミックス多層基板の熱膨張係数が合致せず、異なる
熱膨張係数による両者の接合部の破壊による信頼性劣化
が問題となっていた。即ち、ガラスセラミックス材料の
熱膨張係数が樹脂基板のそれよりも著しく小さいため、
両者の接合部に大きな残留応力が発生し、ヒートサイク
ルに耐え得ないという問題が生じていた。また、従来の
ガラスセラミックス材料には、鉛を含有しているものが
多いが、近年、鉛を含有しないものが求められている。2. Description of the Related Art In recent years, with the high-density mounting of electronic components,
Investigation of a composite technology of a resin substrate and a glass-ceramic multilayer substrate has been advanced. However, the thermal expansion coefficients of the resin substrate and the glass-ceramic multilayer substrate do not match, and there has been a problem of deterioration in reliability due to the destruction of the joint between the two due to different thermal expansion coefficients. That is, since the thermal expansion coefficient of the glass ceramic material is significantly smaller than that of the resin substrate,
A large residual stress is generated at the joint between the two, and there has been a problem that the joint cannot withstand a heat cycle. Further, many of the conventional glass ceramic materials contain lead, but in recent years, those containing no lead have been required.
【０００３】[0003]
【発明が解決しようとしている課題】本発明は、従来の
ガラスセラミックス材料が有していた上記問題を解決
し、かつ鉛を含まないガラスセラミックス組成物を提供
することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the conventional glass-ceramic materials and to provide a lead-free glass-ceramic composition.
【０００４】[0004]
【課題を解決するための手段】本発明は、重量％表示で
実質的に、 ＳｉＯ2＝２０〜４０、 Ｂ2Ｏ3＝２〜１５、 ＭｇＯ＝５〜３０、 ＣａＯ＝１０〜２０、 ＢａＯ＝１０〜３５、 ＳｒＯ＝０〜１０、 Ａｌ2Ｏ3＝３〜１７、 ＺｎＯ＝０〜１０、 ＴｉＯ2＝０〜１０、 ＺｒＯ2＝０〜１０、 ＳｎＯ2＝０〜５、 Ｌｉ2Ｏ＝０〜１０、 Ｎａ2Ｏ＝０〜１０、 Ｋ2Ｏ＝０〜１０および Ｐ2Ｏ5＝０〜１０ からなるガラス３０重量％〜９５重量％と、フィラー５
重量％〜７０重量％とを含有することを特徴とするガラ
スセラミックス組成物を提供する。According to the present invention, SiO 2 = 20 to 40, B 2 O 3 = 2 to 15, MgO = 5 to 30, CaO = 10 to 20, BaO = 10~35, SrO = 0~10, Al 2 O 3 = 3~17, ZnO = 0~10, TiO 2 = 0~10, ZrO 2 = 0~10, SnO 2 = 0~5, Li 2 O = 0~10, Na 2 O = 0~10 , glass 30% to 95% by weight consisting of K 2 O = 0 and P 2 O 5 = 0~10, filler 5
The present invention provides a glass-ceramic composition characterized in that the composition contains about 70% by weight to about 70% by weight.
【０００５】[0005]
【発明の実施の形態】次に好ましい実施の形態を挙げて
本発明をさらに具体的に説明する。本発明のガラスセラ
ミックス組成物は、ガラスとフィラーとを基本成分とす
る。本発明のガラスセラミックス組成物は焼成されて焼
結し、焼結体となる。以下の説明における組成について
の「％」はすべて「重量％」を意味する。先ず、前記ガ
ラスの各成分について説明する。Next, the present invention will be described more specifically with reference to preferred embodiments. The glass-ceramic composition of the present invention contains glass and a filler as basic components. The glass ceramic composition of the present invention is fired and sintered to form a sintered body. In the following description, “%” for the composition means “% by weight”. First, each component of the glass will be described.
【０００６】ＳｉＯ2は、ネットワークフォーマーであ
り、含有量が２０％より少ないと失透する恐れがある。
好ましくは２２％以上、より好ましくは２４％以上であ
る。一方、含有量が４０％より多いと軟化点が高くなり
過ぎて焼結不足となる、または、焼結体の熱膨張係数が
小さくなり過ぎ、樹脂基板の熱膨張係数とのマッチング
が取れない、という問題が生じる。好ましくは３８％以
下、より好ましくは３３％以下、特に好ましくは３１％
以下である。[0006] SiO 2 is a network former, and if its content is less than 20%, there is a risk of devitrification.
It is preferably at least 22%, more preferably at least 24%. On the other hand, if the content is more than 40%, the softening point becomes too high and sintering becomes insufficient, or the coefficient of thermal expansion of the sintered body becomes too small to match the coefficient of thermal expansion of the resin substrate, The problem arises. Preferably not more than 38%, more preferably not more than 33%, particularly preferably 31%
It is as follows.
【０００７】Ｂ2Ｏ3は、フラックス剤として必須であ
る。含有量が２％より少ないと軟化点が高くなり過ぎ、
焼結不足となる。好ましくは４％以上、より好ましくは
６％以上である。一方、含有量が１５％より多いと化学
的耐久性、特に耐酸性が低下するという問題が生じる。
好ましくは１３％以下、より好ましくは１２％以下であ
る。[0007] B 2 O 3 is essential as a fluxing agent. If the content is less than 2%, the softening point becomes too high,
Sintering is insufficient. It is preferably at least 4%, more preferably at least 6%. On the other hand, if the content is more than 15%, there arises a problem that the chemical durability, particularly the acid resistance, decreases.
It is preferably at most 13%, more preferably at most 12%.
【０００８】ＭｇＯは、熱膨張係数を大きくするために
必須である。含有量が５％より少ないと熱膨張係数を大
きくする効果は小さい。好ましくは７％以上、より好ま
しくは９％以上である。一方、含有量が３０％より多い
と失透する恐れがある。好ましくは２８％以下である。[0008] MgO is essential for increasing the coefficient of thermal expansion. If the content is less than 5%, the effect of increasing the coefficient of thermal expansion is small. It is preferably at least 7%, more preferably at least 9%. On the other hand, if the content is more than 30%, there is a risk of devitrification. Preferably it is 28% or less.
【０００９】ＣａＯはＭｇＯと同じ目的で含有される必
須成分である。含有量が１０％より少ないと熱膨張係数
を大きくする効果は小さい。好ましくは１２％以上であ
る。一方、含有量が２０％より多いと失透する恐れがあ
る。好ましくは１８％以下である。CaO is an essential component contained for the same purpose as MgO. If the content is less than 10%, the effect of increasing the coefficient of thermal expansion is small. It is preferably at least 12%. On the other hand, if the content is more than 20%, devitrification may occur. Preferably it is 18% or less.
【００１０】ＢａＯは、熱膨張係数を大きくするととも
にガラス化領域の拡大に効果があり必須である。含有量
が１０％より少ないと前記効果は小さく、好ましくは１
２％以上である。一方、含有量が３５％より多いと焼成
時に結晶化しやすくなり流動性低下を生じ、焼結不足と
なる恐れがある。好ましくは３３％以下、より好ましく
は２３％以下である。[0010] BaO is essential because it has an effect of increasing the coefficient of thermal expansion and expanding the vitrified region. If the content is less than 10%, the effect is small, and preferably 1%.
2% or more. On the other hand, if the content is more than 35%, it tends to crystallize at the time of firing, causing a decrease in fluidity and possibly causing insufficient sintering. It is preferably at most 33%, more preferably at most 23%.
【００１１】ＳｒＯは必ずしも必要でないが、１０％ま
で含有しても特に問題はない。含有量が１０％を超える
と焼成時に結晶化しやすくなり、焼結不足の恐れが生じ
る。好ましくは８％以下、より好ましくは６％以下、特
に好ましくは４％以下である。Although SrO is not always necessary, there is no particular problem if it is contained up to 10%. If the content exceeds 10%, it tends to crystallize at the time of firing, which may result in insufficient sintering. It is preferably at most 8%, more preferably at most 6%, particularly preferably at most 4%.
【００１２】ＭｇＯ、ＣａＯ、ＢａＯおよびＳｒＯの合
量は、好ましくは４０％〜６０％である。４０％より少
ないと、熱膨張係数が小さくなり過ぎ、樹脂基板の熱膨
張係数との整合性をとることが困難になる恐れがある。
好ましくは４２％以上である。６０％より多いと、焼成
時に結晶化しやすくなり、焼結不足になる恐れがある。
好ましくは５８％以下である。The total amount of MgO, CaO, BaO and SrO is preferably 40% to 60%. If it is less than 40%, the coefficient of thermal expansion becomes too small, and it may be difficult to obtain consistency with the coefficient of thermal expansion of the resin substrate.
It is preferably at least 42%. If it is more than 60%, it tends to be crystallized at the time of firing, which may result in insufficient sintering.
Preferably it is 58% or less.
【００１３】Ａｌ2Ｏ3は、焼成時の結晶化特性を制御す
る目的並びに耐酸性向上の目的で必須である。含有量が
３％より少ないと効果が小さい。好ましくは４％以上、
より好ましくは５％以上である。一方、含有量が１７％
より多いと失透する恐れがある。好ましくは１５％以
下、より好ましくは１３％以下である。[0013] Al 2 O 3 is indispensable for the purpose of controlling the crystallization characteristics during firing and for the purpose of improving acid resistance. If the content is less than 3%, the effect is small. Preferably at least 4%,
It is more preferably at least 5%. On the other hand, the content is 17%
If there is more, there is a risk of devitrification. Preferably it is 15% or less, more preferably 13% or less.
【００１４】ＴｉＯ2およびＺｒＯ2は必須成分ではない
が、焼成時の結晶化特性の制御または耐酸性向上の目的
で導入しても差し支えない。但し、含有量が１０％を越
えると、焼成時に結晶化しやすくなり、焼結不足となる
恐れがある。好ましくは７％以下、より好ましくは５％
以下、特に好ましくは３％以下である。ＳｎＯ2も必須
成分ではないが、耐水性向上の目的で導入しても差し支
えないが、含有量が５％を越えると失透する恐れが生ず
る。好ましくは３％以下、より好ましくは１％以下であ
る。Although TiO 2 and ZrO 2 are not essential components, they may be introduced for the purpose of controlling crystallization characteristics during firing or improving acid resistance. However, if the content exceeds 10%, crystallization tends to occur during firing, and sintering may be insufficient. Preferably 7% or less, more preferably 5%
Or less, particularly preferably 3% or less. SnO 2 is not an essential component, but may be introduced for the purpose of improving water resistance. However, if the content exceeds 5%, there is a risk of devitrification. It is preferably at most 3%, more preferably at most 1%.
【００１５】ＺｎＯは必須成分ではないが、フラックス
剤および結晶化特性制御剤として使用して差し支えな
い。但し、含有量が１０％を越えると耐酸性が低下する
恐れがある。好ましくは８％以下である。Ｌｉ2Ｏ、Ｎ
ａ2Ｏ、Ｋ2ＯおよびＰ2Ｏ5は必須成分ではないが、各々
１０％以内の範囲であれば、熱膨張係数の制御および耐
酸性向上を目的に導入しても差し支えない。好ましくは
各々８％以下、より好ましくは各々６％以下である。本
発明におけるガラスは実質的に上記成分からなるが、上
記以外の成分の含有量は、合量で５％以下である。な
お、特に、ＰｂＯ、Ｂｉ2Ｏ3およびＣｄＯの含有量は、
各々０．５％以下である。Although ZnO is not an essential component, it may be used as a fluxing agent and a crystallization property controlling agent. However, if the content exceeds 10%, the acid resistance may decrease. Preferably it is 8% or less. Li 2 O, N
Although a 2 O, K 2 O and P 2 O 5 are not essential components, they may be introduced for the purpose of controlling the thermal expansion coefficient and improving acid resistance as long as each is within the range of 10%. Preferably each is 8% or less, more preferably each is 6% or less. Although the glass in the present invention substantially consists of the above components, the content of components other than the above is 5% or less in total. In particular, the contents of PbO, Bi 2 O 3 and CdO are:
Each is 0.5% or less.
【００１６】本発明のガラスセラミックス組成物は、上
記ガラス３０％〜９５％とフィラー５％〜７０％とを必
須成分とする。ガラスが９５％超、またはフィラーが５
％未満であるとフィラーの機能が十分発揮されず、所望
の効果が小さい。フィラーは好ましくは１０％以上、よ
り好ましくは１５％以上である。一方、ガラスが３０％
未満、またはフィラーが７０％超であると焼結不足が生
じるので問題となる。フィラーは好ましくは６５％以下
である。The glass-ceramic composition of the present invention contains 30% to 95% of the above glass and 5% to 70% of a filler as essential components. More than 95% glass or 5 filler
%, The function of the filler is not sufficiently exhibited, and the desired effect is small. The filler is preferably at least 10%, more preferably at least 15%. On the other hand, glass is 30%
If the content is less than 70% or the content of the filler is more than 70%, insufficient sintering occurs, which is a problem. The filler is preferably not more than 65%.
【００１７】上記フィラーは、特に限定されず、市場で
入手可能な酸化物を使用できるが、α−アルミナ、α−
石英、トリジマイト、クリストバライト、コーディエラ
イト、安定化ジルコニア、マグネシア、フォルステライ
トおよびステアタイトから選ばれる少なくとも１種の酸
化物を含むことが好ましい。ここでいう安定化ジルコニ
アは、ＺｒＯ2に、ＭｇＯ、ＣａＯ、Ｙ2Ｏ3などの安定
化剤を添加し、低温まで安定な立方晶の固溶体としたも
のである。The filler is not particularly limited, and commercially available oxides can be used.
It is preferable to contain at least one oxide selected from quartz, tridymite, cristobalite, cordierite, stabilized zirconia, magnesia, forsterite and steatite. The stabilized zirconia referred to here is obtained by adding a stabilizer such as MgO, CaO, and Y 2 O 3 to ZrO 2 to form a cubic solid solution that is stable up to low temperatures.
【００１８】また、本発明においては、上記本発明のガ
ラスセラミックス組成物に、着色剤を添加して着色ガラ
スセラミックス組成物とすることができる。着色剤の含
有量は、ガラスセラミックス組成物全体に対して、好ま
しくは５％以下である。５％を越えると組成物が焼結不
足となる恐れがある。より好ましくは２％以下である。
好ましい着色剤は、鉛、ビスマスまたはカドミウム成分
を含まない耐熱性顔料である。より好ましくは、黒、
緑、青、紫またはそれらの混合色の耐熱性顔料であり、
Ｆｅ−Ｃｕ−Ｃｒ複合酸化物黒色顔料が例示される。Further, in the present invention, a colored glass ceramic composition can be obtained by adding a coloring agent to the glass ceramic composition of the present invention. The content of the coloring agent is preferably 5% or less based on the entire glass ceramic composition. If it exceeds 5%, the composition may be insufficiently sintered. It is more preferably at most 2%.
Preferred colorants are heat-resistant pigments that contain no lead, bismuth or cadmium components. More preferably, black,
It is a heat-resistant pigment of green, blue, purple or a mixture thereof,
Examples are Fe-Cu-Cr composite oxide black pigments.
【００１９】本発明のガラスセラミックス組成物を焼成
して得られる焼結体の５０℃〜３５０℃の平均線熱膨張
係数（以下、単に膨張係数という。）は９０×１０-7／
℃〜１３０×１０-7／℃であることが好ましい。より好
ましくは９０×１０-7／℃〜１２０×１０-7／℃、特に
好ましくは９５×１０-7／℃〜１２０×１０-7／℃であ
る。また、９００℃〜１０００℃で焼成することにより
結晶化することが好ましい。The sintered body obtained by firing the glass-ceramic composition of the present invention has an average coefficient of linear thermal expansion at 50 ° C. to 350 ° C. (hereinafter simply referred to as expansion coefficient) of 90 × 10 −7 /.
The temperature is preferably from 130C to 130 x 10-7 / C. It is more preferably 90 × 10 −7 / ° C. to 120 × 10 −7 / ° C., and particularly preferably 95 × 10 −7 / ° C. to 120 × 10 −7 / ° C. Further, it is preferable to crystallize by firing at 900 ° C. to 1000 ° C.
【００２０】本発明のガラスセラミックス組成物の使用
形態は、前記構成の材料を粉末化し、それをスクリーン
印刷用にペーストとして用いてよく、またはスラリー化
した後、グリーンシート化して多層化または積層化する
方法のいずれでも問題ない。The use form of the glass-ceramic composition of the present invention is as follows. The material of the above composition may be powdered and used as a paste for screen printing, or it may be slurried and then formed into a green sheet to form a multilayer or lamination. No matter which way you do.
【００２１】本発明のガラスセラミックス組成物は、樹
脂基板と熱膨張係数が適合した焼結体を得られるガラス
セラミックス組成物である。樹脂基板と前記焼結体の接
合強度の信頼性は高い。本発明のガラスセラミックス組
成物の使用対象となる樹脂基板の材質としては、例え
ば、プリント配線基板として使用されるものとして、Ｐ
ＰＳ（ポリフェニールサルファイド）、ＰＩ（ポリイミ
ド）等が挙げられる。これらの樹脂基板の熱膨張係数は
約１３０×１０-7／℃である。The glass-ceramic composition of the present invention is a glass-ceramic composition from which a sintered body having a coefficient of thermal expansion compatible with that of a resin substrate can be obtained. The reliability of the bonding strength between the resin substrate and the sintered body is high. The material of the resin substrate to which the glass-ceramic composition of the present invention is used is, for example, P as a material used as a printed wiring board.
PS (polyphenyl sulfide), PI (polyimide) and the like. The thermal expansion coefficients of these resin substrates are about 130 × 10 −7 / ° C.
【００２２】[0022]
【実施例】次に実施例を挙げて本発明をさらに具体的に
説明する。表１−１に重量％表示で示した目標組成とな
るよう各原料を調合し、これを白金坩堝などの容器に入
れ、１４００〜１５５０℃で２〜３時間溶解してガラス
とした。次いでこれを水砕またはフレーク状とし、さら
に粉砕装置により平均粒径が２〜６μｍになるように粉
砕した。次いで、得られた粉末状ガラスに、フィラーお
よび必要に応じて着色剤を表１−２に重量％表示で示す
配合比となるよう混合し、ガラスセラミックス組成物を
作製した。また、ここで使用した着色剤は、Ｆｅ−Ｃｕ
−Ｃｒ複合酸化物顔料である。なお、例１〜例９は実施
例、例１０〜例１１は比較例である。例１０は、ガラス
−フィラー配合比が本発明の範囲外であり、例１１のガ
ラスはＰｂＯを含有する。Next, the present invention will be described more specifically with reference to examples. Each raw material was prepared so as to have the target composition shown in Table 1-1 in terms of% by weight, placed in a container such as a platinum crucible, and melted at 1400 to 1550 ° C for 2 to 3 hours to obtain glass. Next, this was granulated or flaked, and further pulverized by a pulverizer so that the average particle size became 2 to 6 μm. Next, the obtained powdery glass was mixed with a filler and, if necessary, a colorant so as to have a compounding ratio shown in Table 1-2 by weight% to prepare a glass ceramic composition. The coloring agent used here was Fe-Cu.
-Cr composite oxide pigment. Examples 1 to 9 are working examples, and examples 10 to 11 are comparative examples. In Example 10, the glass-filler compounding ratio is out of the range of the present invention, and the glass of Example 11 contains PbO.
【００２３】上記ガラスセラミックス組成物の特性は次
のように測定した。結果を表１−３に示す。なお、例１
０については焼結不足のため焼結体が得られず、以下の
（１）、（３）および（４）については測定できなかっ
た。The properties of the above glass ceramic composition were measured as follows. The results are shown in Table 1-3. Example 1
For 0, a sintered body was not obtained due to insufficient sintering, and the following (1), (3) and (4) could not be measured.
【００２４】（１）膨張係数（単位：１０-7／℃）：作
製した粉末状のガラスセラミックス組成物を９００℃で
３０分間焼成し、その後、研磨加工して測定サンプルを
得た。次いでそのサンプルを熱膨張計にて測定し、５０
〜３５０℃の平均熱膨張係数を算出した。膨張係数は、
９０×１０-7／℃〜１３０×１０-7／℃の範囲に入るこ
とを目標とした。 （２）結晶化ピーク温度（単位：℃）：粉末状のガラス
セラミックス組成物を示差熱分析装置により１０℃／ｍ
ｉｎ．の速度で昇温し、結晶化の発熱ピークの温度を測
定した。この結晶化ピーク温度は８３０℃〜９３０℃の
範囲であることを目標とした。 （３）焼結性：９００℃で３０分間焼成した焼結体を、
赤インク中に５分間程度浸漬し、その後、流水にて１分
間赤インクを除去する。良否の判断は、赤インクの浸透
が全くないものを良（○印）とし、少量であっても赤イ
ンクが表面に残留するものは否（×印）とした。 （４）耐酸性：９００℃で３０分間焼成して得られた焼
結体を、５規定の塩酸溶液中に２〜３時間浸漬し、浸漬
前後の重量から重量減少率を求めた。重量減少率が０．
１％以下であれば良（○印）とした。(1) Expansion coefficient (unit: 10 −7 / ° C.): The produced powdery glass-ceramic composition was fired at 900 ° C. for 30 minutes, and then polished to obtain a measurement sample. Next, the sample was measured with a thermal dilatometer, and 50
The average coefficient of thermal expansion at ３５０350 ° C. was calculated. The expansion coefficient is
The target was to enter the range of 90 × 10 −7 / ° C. to 130 × 10 −7 / ° C. (2) Crystallization peak temperature (unit: ° C.): The powdery glass ceramic composition was measured at 10 ° C./m by a differential thermal analyzer.
in. And the temperature of the exothermic peak of crystallization was measured. The target of the crystallization peak temperature was 830 ° C to 930 ° C. (3) Sinterability: A sintered body fired at 900 ° C. for 30 minutes
Immerse in the red ink for about 5 minutes, and then remove the red ink with running water for 1 minute. The pass / fail judgment was made when there was no permeation of red ink (good), and when the red ink remained on the surface even in a small amount was bad (good). (4) Acid resistance: The sintered body obtained by firing at 900 ° C. for 30 minutes was immersed in a 5N hydrochloric acid solution for 2 to 3 hours, and the weight loss rate was determined from the weight before and after immersion. Weight loss rate is 0.
If it was 1% or less, it was determined to be good (marked with ○).
【００２５】表１−１：ガラス組成 Table 1-1: Glass composition
【００２６】表１−２：ガラス−フィラー配合比 注） ＊１：マグネシア、＊２：ジルコニア、＊３：α−石
英、＊４：コーディエライト、＊５：α−アルミナ、＊
６：フォルストライト、＊７：ステアタイトTable 1-2: Glass-filler compounding ratio Note) * 1: Magnesia, * 2: Zirconia, * 3: α-quartz, * 4: Cordierite, * 5: α-alumina, *
6: Forst light, * 7: Steatite
【００２７】表１−３：特性 註） Ａ：膨張係数 Ｂ：結晶化ピーク温度 Ｃ：焼結性 Ｄ：耐酸性Table 1-3: Characteristics Note) A: Expansion coefficient B: Crystallization peak temperature C: Sinterability D: Acid resistance
【００２８】[0028]
【発明の効果】以上説明したように、本発明のガラスセ
ラミックス組成物は、樹脂基板との接合強度の信頼性に
優れ、特に多層回路基板用、クロスオーバー絶縁用、表
面保護用などの分野に適している。As described above, the glass-ceramic composition of the present invention has excellent reliability in bonding strength with a resin substrate, and is particularly useful in fields such as multilayer circuit boards, crossover insulation, and surface protection. Are suitable.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4G062 AA08 AA09 AA11 AA15 BB01 BB05 DA04 DA05 DB03 DB04 DC03 DC04 DD01 DD02 DD03 DE01 DE02 DE03 DF01 EA01 EA02 EA03 EB01 EB02 EB03 EC01 EC02 EC03 ED03 ED04 EE04 EF01 EF02 EF03 EG04 EG05 FA01 FA10 FB01 FB02 FB03 FC01 FC02 FC03 FD01 FE01 FE02 FE03 FF01 FG01 FH01 FJ01 FK01 FL01 GA01 GA10 GB01 GC01 GD01 GE01 HH01 HH03 HH05 HH07 HH09 HH11 HH13 HH15 HH17 HH20 JJ01 JJ03 JJ05 JJ07 JJ10 KK01 KK03 KK05 KK07 KK10 MM28 NN30 PP01 PP02 PP03 PP05 PP09 QQ15 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4G062 AA08 AA09 AA11 AA15 BB01 BB05 DA04 DA05 DB03 DB04 DC03 DC04 DD01 DD02 DD03 DE01 DE02 DE03 DF01 EA01 EA02 EA03 EB01 EB02 EB03 EC01 EC02 EC03 ED03 ED04 EF04 EF04 EF04 EF04 EF04 EF04 EF04 EF04 EF04 EF04 EF04 EF04 EF04 EF04 FA10 FB01 FB02 FB03 FC01 FC02 FC03 FD01 FE01 FE02 FE03 FF01 FG01 FH01 FJ01 FK01 FL01 GA01 GA10 GB01 GC01 GD01 GE01 HH01 HH03 HH05 HH07 HH09 HH11 HH13 HH15 HH17 HH20 NN01 KK03 KK01 KK01 JJ01 KK03 KK QQ15
Claims (6)
重量％〜７０重量％とを含有することを特徴とするガラ
スセラミックス組成物。1. Substantially in terms of% by weight, SiO 2 = 20 to 40, B 2 O 3 = 2 to 15, MgO = 5 to 30, CaO = 10 to 20, BaO = 10 to 35, SrO = 0. ~10, Al 2 O 3 = 3~17 , ZnO = 0~10, TiO 2 = 0~10, ZrO 2 = 0~10, SnO 2 = 0~5, Li 2 O = 0~10, Na 2 O = 0, and the glass 30% to 95% by weight consisting of K 2 O = 0 and P 2 O 5 = 0, the filler 5
A glass-ceramic composition characterized by containing 70% by weight to 70% by weight.
トリジマイト、クリストバライト、コーディエライト、
安定化ジルコニア、マグネシア、フォルステライトおよ
びステアタイトから選ばれる少なくとも１種の酸化物を
含む請求項１に記載のガラスセラミックス組成物。2. The method according to claim 1, wherein the filler is α-alumina, α-quartz,
Tridymite, cristobalite, cordierite,
The glass-ceramic composition according to claim 1, comprising at least one oxide selected from stabilized zirconia, magnesia, forsterite, and steatite.
有する請求項１または２に記載のガラスセラミックス組
成物。3. The glass-ceramic composition according to claim 1, further comprising 0 to 5% by weight of a coloring agent.
ムのいずれも含まない耐熱性顔料である請求項３に記載
のガラスセラミックス組成物。4. The glass-ceramic composition according to claim 3, wherein the colorant is a heat-resistant pigment containing no lead, bismuth or cadmium.
が、９０×１０-7／℃〜１３０×１０-7／℃の範囲にあ
る請求項１〜４のいずれか１項に記載のガラスセラミッ
クス組成物。5. The method according to claim 1, wherein the average linear thermal expansion coefficient at 50 ° C. to 350 ° C. is in a range of 90 × 10 −7 / ° C. to 130 × 10 −7 / ° C. Glass ceramic composition.
れる請求項１〜５のいずれか１項に記載のガラスセラミ
ックス組成物。6. The glass-ceramic composition according to claim 1, which is used for forming a layer on a resin substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11006705A JP2000203878A (en) | 1999-01-13 | 1999-01-13 | Glass ceramic composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11006705A JP2000203878A (en) | 1999-01-13 | 1999-01-13 | Glass ceramic composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000203878A true JP2000203878A (en) | 2000-07-25 |
Family
ID=11645734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11006705A Pending JP2000203878A (en) | 1999-01-13 | 1999-01-13 | Glass ceramic composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000203878A (en) |
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| EP1369397A1 (en) * | 2002-06-04 | 2003-12-10 | E.I. Dupont De Nemours And Company | High thermal expansion glass and tape composition |
| JP2005306714A (en) * | 2004-03-22 | 2005-11-04 | Kyocera Corp | Glass ceramic composition, glass ceramic sintered body and manufacturing method for the same, and circuit board and thin film circuit board both using the same |
| JP2008085034A (en) * | 2006-09-27 | 2008-04-10 | Kyocera Corp | Wiring substrate |
| KR100828892B1 (en) * | 2005-12-02 | 2008-05-09 | 소에이 가가쿠 고교 가부시키가이샤 | Overcoat glass paste and thick film resistor element |
| WO2008066282A1 (en) * | 2006-11-30 | 2008-06-05 | Korea Institute Of Ceramic Engineering & Technology | Glass-free microwave dielectric ceramics and the manufacturing method thereof |
| US7682998B2 (en) * | 2007-02-06 | 2010-03-23 | Mitsubishi Electric Corporation | Ceramic powder for a green sheet and multilayer ceramic substrate |
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| US20100320425A1 (en) * | 2008-03-31 | 2010-12-23 | Mitsubishi Electric Corporation | Low temperature co-fired ceramic circuit board |
| CN103395993A (en) * | 2013-07-25 | 2013-11-20 | 中国计量学院 | Aluminium-nitride-based glass ceramic and preparation method thereof |
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1999
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1332902C (en) * | 2002-06-04 | 2007-08-22 | E.I.内穆尔杜邦公司 | High thermal expansion glass and belt composition |
| EP1369397A1 (en) * | 2002-06-04 | 2003-12-10 | E.I. Dupont De Nemours And Company | High thermal expansion glass and tape composition |
| JP2010241685A (en) * | 2004-03-22 | 2010-10-28 | Kyocera Corp | Glass ceramic sintered compact, and wiring board and thin film wiring board using the compact |
| JP2005306714A (en) * | 2004-03-22 | 2005-11-04 | Kyocera Corp | Glass ceramic composition, glass ceramic sintered body and manufacturing method for the same, and circuit board and thin film circuit board both using the same |
| KR100828892B1 (en) * | 2005-12-02 | 2008-05-09 | 소에이 가가쿠 고교 가부시키가이샤 | Overcoat glass paste and thick film resistor element |
| JP2008085034A (en) * | 2006-09-27 | 2008-04-10 | Kyocera Corp | Wiring substrate |
| US8101536B2 (en) | 2006-11-30 | 2012-01-24 | Korea Institute Of Ceramic Engineering & Technology | Glass-free microwave dielectric ceramics and the manufacturing method thereof |
| WO2008066282A1 (en) * | 2006-11-30 | 2008-06-05 | Korea Institute Of Ceramic Engineering & Technology | Glass-free microwave dielectric ceramics and the manufacturing method thereof |
| US7682998B2 (en) * | 2007-02-06 | 2010-03-23 | Mitsubishi Electric Corporation | Ceramic powder for a green sheet and multilayer ceramic substrate |
| US20100320425A1 (en) * | 2008-03-31 | 2010-12-23 | Mitsubishi Electric Corporation | Low temperature co-fired ceramic circuit board |
| US8298448B2 (en) * | 2008-03-31 | 2012-10-30 | Mitsubishi Electric Corporation | Low temperature co-fired ceramic circuit board |
| CN103395993A (en) * | 2013-07-25 | 2013-11-20 | 中国计量学院 | Aluminium-nitride-based glass ceramic and preparation method thereof |
| CN103395993B (en) * | 2013-07-25 | 2015-08-19 | 中国计量学院 | A kind of aluminum-nitride-based glass-ceramic and preparation method thereof |
| WO2016129543A1 (en) * | 2015-02-09 | 2016-08-18 | 日本山村硝子株式会社 | Glass composition for sealing |
| JPWO2016129543A1 (en) * | 2015-02-09 | 2017-12-28 | 日本山村硝子株式会社 | Glass composition for sealing |
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