JP2000200539A - Fuse element and its manufacture - Google Patents

Fuse element and its manufacture

Info

Publication number
JP2000200539A
JP2000200539A JP11001341A JP134199A JP2000200539A JP 2000200539 A JP2000200539 A JP 2000200539A JP 11001341 A JP11001341 A JP 11001341A JP 134199 A JP134199 A JP 134199A JP 2000200539 A JP2000200539 A JP 2000200539A
Authority
JP
Japan
Prior art keywords
fuse
conductor
fuse element
substrate
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11001341A
Other languages
Japanese (ja)
Inventor
Ichiro Ishiyama
一郎 石山
Mikizo Motoki
幹三 本木
Morikatsu Yamazaki
盛勝 山崎
Yutaka Nomura
豊 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuriku Electric Industry Co Ltd
Original Assignee
Hokuriku Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Industry Co Ltd filed Critical Hokuriku Electric Industry Co Ltd
Priority to JP11001341A priority Critical patent/JP2000200539A/en
Publication of JP2000200539A publication Critical patent/JP2000200539A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable fuse element in which breaking caused by an excessive current occurs surely on a fuse part, and its manufacturing method. SOLUTION: This fuse element has a fuse part 14 formed on an insulating substrate 12 and composed of a low melting-point metal film or the like melting at a prescribed temperature, and conductor parts 16, 18 connected to the fuse part 14. The fuse element is equipped with electrodes 22 connected to the conductor parts 16, 18 and formed on the end face of the substrate 12, and auxiliary conductor films 24 laminated on the corner part contacting with the electrodes 22 on the substrate 12 end edge parts of the conductor parts 16, 18. The auxiliary conductor films 24 are laminated on the lower layer of the conductor parts 16, 18 on the periphery of the corner parts contacting with the electrodes 22.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、電子部品や電気
製品等の使用中に生じる過電流や加熱による破損から回
路やその他重要な部品を保護するヒューズ素子とその製
造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fuse element for protecting circuits and other important parts from damage caused by overcurrent or heating during use of electronic parts and electric products, and a method of manufacturing the same.

【0002】[0002]

【従来の技術】従来、ヒューズ素子は所定の温度で溶断
するヒューズのように、主として過電流の発生により動
作する過電流保護機能を備えたものや、あるいはPTC
素子やバイメタルスイッチのように加熱により作動する
加熱保護機能を有したものがあった。
2. Description of the Related Art Conventionally, a fuse element such as a fuse that blows at a predetermined temperature is provided with an overcurrent protection function that operates mainly by generating an overcurrent, or a PTC.
Some devices, such as elements and bimetal switches, have a heating protection function that operates by heating.

【0003】またこのヒューズ素子のうち、過大電流に
より溶断して回路を遮断するヒューズ素子は、図3の断
面図に示すように、絶縁性の基板2表面の一対の導体部
4及びこの導体部4間にヒューズ金属膜6が設けられた
ものがあった。このヒューズ素子の電極は、図3に示す
ように分割前の基板2に形成したスルーホールによる凹
部8に電極10を形成したものであった。
As shown in the cross-sectional view of FIG. 3, a fuse element, which is blown by an excessive current to cut off a circuit, includes a pair of conductors 4 on the surface of an insulating substrate 2 and a pair of conductors 4. In some cases, a fuse metal film 6 was provided between the four. The electrode of this fuse element had an electrode 10 formed in a recess 8 formed by a through hole formed in the substrate 2 before division as shown in FIG.

【0004】[0004]

【発明が解決しようとする課題】上記従来の技術の場
合、ヒューズ素子は一対の電極10間の抵抗値は、スル
ーホールの電極10の抵抗、導体部2の抵抗、及びヒュ
ーズ金属膜6の抵抗からなる。この各部の抵抗値のう
ち、製造時のばらつき等によりヒューズ金属膜6より抵
抗値が高い部分があると、その部分で過大電流による破
壊が生じる場合があった。特に電極10と導体部4との
間の基板2の角部2aの導体部の厚さが薄く、この部分
の抵抗値が他の部分より高い値となり、過大電流により
この近傍で破断する場合があった。
In the prior art, the resistance of the fuse element between the pair of electrodes 10 is determined by the resistance of the through-hole electrode 10, the resistance of the conductor 2, and the resistance of the fuse metal film 6. Consists of If there is a portion of the resistance value of each portion having a higher resistance value than the fuse metal film 6 due to a variation at the time of manufacturing or the like, the portion may be damaged by an excessive current. In particular, the thickness of the conductor portion at the corner 2a of the substrate 2 between the electrode 10 and the conductor portion 4 is thin, and the resistance value of this portion becomes higher than that of the other portions. there were.

【0005】この発明は上記従来の技術の問題点に鑑み
てなされたものであり、ヒューズ部で確実に過大電流に
よる破断が生じ、信頼性が高いヒューズ素子とその製造
方法を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a highly reliable fuse element which is reliably broken by an excessive current in a fuse portion, and a method of manufacturing the same. And

【0006】[0006]

【課題を解決するための手段】この発明のヒューズ素子
は、絶縁性の基板上に形成され所定温度で溶融する低融
点の金属膜等からなるヒューズ部と、このヒューズ部に
接続した導体部と、この導体部に接続し上記基板の端面
に形成された電極と、この導体部の上記基板端縁部の上
記電極と接する角部に積層された補助導体膜とを備えた
ものである。この補助導体膜は、上記電極に接する角部
周辺の上記導体部の下層に積層されている。そして、上
記電極、導体部の抵抗値は上記ヒューズ部の抵抗値より
も低いものである。
According to the present invention, there is provided a fuse element formed of a low melting point metal film formed on an insulating substrate and melted at a predetermined temperature, and a conductor connected to the fuse. An electrode connected to the conductor and formed on the end face of the substrate; and an auxiliary conductor film laminated on a corner of the conductor at the edge of the substrate and in contact with the electrode. The auxiliary conductor film is laminated below the conductor portion around a corner in contact with the electrode. The resistance of the electrode and the conductor is lower than the resistance of the fuse.

【0007】またこの発明のヒューズ素子の製造方法
は、絶縁性の基板にスルーホールを形成し、このスルー
ホールの周縁部に補助導体膜及び所定長さの導体部を形
成し、上記一対の導体部に接するようにヒューズ部を設
け、上記スルーホールに沿って上記基板を分割するるも
のである。
Further, in the method of manufacturing a fuse element according to the present invention, a through hole is formed in an insulating substrate, and an auxiliary conductor film and a conductor portion having a predetermined length are formed around the periphery of the through hole. A fuse portion is provided so as to be in contact with the portion, and the substrate is divided along the through hole.

【0008】この発明のヒューズ素子は、ヒューズ部に
過電流が流れた際にヒューズ部で回路が遮断される。こ
のとき上記電極と導体部の間の基板角部は、補助導体膜
により、電極と導体部間の抵抗値がヒューズ部よりも低
く設定され、ヒューズ部が確実に溶断する。
In the fuse element according to the present invention, when an overcurrent flows through the fuse section, the circuit is cut off at the fuse section. At this time, at the corner of the substrate between the electrode and the conductor, the resistance between the electrode and the conductor is set lower than that of the fuse by the auxiliary conductor film, so that the fuse is reliably blown.

【0009】[0009]

【発明の実施の形態】以下、この発明の実施形態につい
て図面に基づいて説明する。図1、図2はこの発明の一
実施形態のヒューズ素子を示すもので、このヒューズ素
子は、セラミックス等のチップ状の基板12と、この基
板12上に形成されたヒューズ金属膜のヒューズ部14
とを有する。ヒューズ部14の両端部は、各々導体部1
6,18に接続している。
Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 show a fuse element according to an embodiment of the present invention. The fuse element includes a chip-shaped substrate 12 made of ceramics or the like and a fuse portion 14 of a fuse metal film formed on the substrate 12.
And Both ends of the fuse portion 14 are connected to the conductor portion 1 respectively.
6 and 18.

【0010】この導体部16,18は、各々基板12の
端面に形成された一対の凹部20の角部に各々接続し、
凹部20には、電極22が形成されている。また、導体
部16,18の下部の凹部20の角部20aの近傍に
は、補助導体膜24,26が形成されている。
The conductors 16 and 18 are respectively connected to the corners of a pair of recesses 20 formed on the end face of the substrate 12,
An electrode 22 is formed in the recess 20. Auxiliary conductor films 24 and 26 are formed near the corners 20a of the recess 20 below the conductors 16 and 18.

【0011】ヒューズ部14は、低融点金属であるPb
や、共晶はんだのPb−Sn系、Pb−Sb系、Sn−
Sb系などのはんだ金属等からなり、できるだけ抵抗値
の低いものである。また、導体部16、18は、銀ペー
ストを印刷焼成した厚膜導体材料である。補助導体膜2
4,26も、Pb等のはんだ材料からなる。なお、ヒュ
ーズ部14の表面には2カ所程度、溶断を確実にするは
んだフラックス28が塗布されている。ここで、導体部
16,18及び電極22は、ヒューズ部14より抵抗値
が小さくなるように形成されている。
The fuse portion 14 is made of a low melting point metal such as Pb.
And Pb-Sn, Pb-Sb, Sn-
It is made of an Sb-based solder metal or the like and has as low a resistance value as possible. The conductor portions 16 and 18 are a thick film conductor material obtained by printing and firing silver paste. Auxiliary conductor film 2
4 and 26 are also made of a solder material such as Pb. The surface of the fuse portion 14 is coated with a solder flux 28 for ensuring melting at about two places. Here, the conductor portions 16 and 18 and the electrode 22 are formed such that the resistance value is smaller than that of the fuse portion 14.

【0012】次に、このヒューズ素子の製造方法を説明
する。先ず分割前の大型の基板12上に、凹部20とな
る複数のスルーホールを形成する。このスルーホール内
に、電極22を形成するはんだクリームを塗布し、この
スルーホール部周辺にも補助導体膜24,26を形成す
る導体材料となるはんだクリームを塗布する。この後、
はんだクリームを溶融させて、各々はんだ材料による導
体層を形成する。
Next, a method of manufacturing the fuse element will be described. First, a plurality of through holes serving as the concave portions 20 are formed on the large substrate 12 before the division. A solder cream forming the electrode 22 is applied to the inside of the through-hole, and a solder cream serving as a conductor material for forming the auxiliary conductive films 24 and 26 is also applied around the through-hole. After this,
The solder cream is melted to form conductor layers each made of a solder material.

【0013】また、導体部16,18の形成は、銀ペー
ストをスルーホール部から所定長さにわたって印刷形成
する。この後、導体部16,18を硬化させ、その導体
部16,18間にヒューズ部14を形成する。
The conductors 16 and 18 are formed by printing silver paste over a predetermined length from the through hole. After that, the conductor portions 16 and 18 are cured, and the fuse portion 14 is formed between the conductor portions 16 and 18.

【0014】ヒューズ部14の形成は、導体部16,1
8間にヒューズ部14を形成する低融点金属材料のペー
ストを塗布し、溶融固化させて導体部16,18に接続
した状態に形成する。さらに、ヒューズ部14の表面に
は、ヒューズ部14の溶断を確実にするフラックス28
を塗布する。
The formation of the fuse portion 14 is performed by the conductor portions 16 and 1
A paste of a low-melting metal material for forming the fuse portion 14 between the portions 8 is applied, melted and solidified to form a state connected to the conductor portions 16 and 18. Further, on the surface of the fuse portion 14, a flux 28 for ensuring the melting of the fuse portion 14 is provided.
Is applied.

【0015】この実施形態のヒューズ素子は、導体部1
6,18とこれに接続した各電極22との間の基板12
の、角部20aに接する導体膜16,18の下層に、補
助導体膜24が形成されている。したがって、角部20
aの導体部分が厚く電気抵抗が小さく形成されている。
また、導体部16,18の抵抗値及び電極22の抵抗値
をヒューズ部14と比べて低くなるように形成されてい
ることにより、確実に過大電流でヒューズ部14が溶断
する。
The fuse element of this embodiment has a conductor 1
Substrate 12 between 6, 18 and each electrode 22 connected thereto
An auxiliary conductor film 24 is formed below the conductor films 16 and 18 in contact with the corners 20a. Therefore, the corner 20
The conductor portion a is formed thick and has low electric resistance.
Further, since the resistance of the conductors 16 and 18 and the resistance of the electrode 22 are formed to be lower than those of the fuse 14, the fuse 14 is reliably blown by an excessive current.

【0016】なお、この発明のヒューズ素子を形成する
部材は、上述の例に限らず、ヒューズ部の抵抗値が、電
極やその他の導体部よりも高くなるように設定されてい
ればよく、その材料や幅、厚さ等は適宜選択できるもの
である。たとえば、電極部分は、導電体ペーストをスル
ーホールに塗布して形成したものでもよく、補助導体膜
も導電体ペーストを塗布してものでもよい。また、保持
導体膜は、導体部の表面側に形成してもよい。
The member forming the fuse element of the present invention is not limited to the above-described example, but may be any member as long as the resistance value of the fuse portion is set to be higher than that of the electrode or other conductor portion. The material, width, thickness and the like can be appropriately selected. For example, the electrode portion may be formed by applying a conductive paste to the through hole, and the auxiliary conductive film may be formed by applying the conductive paste. Further, the holding conductor film may be formed on the surface side of the conductor portion.

【0017】[0017]

【発明の効果】この発明のヒューズ素子は、過大電流が
生じた場合、すみやかにヒューズ部が溶断し通電状態を
遮断し、電子機器の回路を保護する機能を有する。ま
た、この時、ヒューズ部位外の部分で破断が生じること
がなく、所定の条件で確実にヒューズ部が溶断する。さ
らに、この発明のヒューズ素子は、構造が簡単であり製
造工程を簡略化することができ、コストダウンも可能と
なる。
The fuse element according to the present invention has a function of protecting the circuit of an electronic device by immediately fusing the fuse portion when an excessive current is generated, cutting off a current supply state. Further, at this time, no break occurs at a portion outside the fuse portion, and the fuse portion is reliably blown under a predetermined condition. Furthermore, the fuse element of the present invention has a simple structure, can simplify the manufacturing process, and can reduce the cost.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の一実施形態のヒューズ素子を示す斜
視図である。
FIG. 1 is a perspective view showing a fuse element according to an embodiment of the present invention.

【図2】この実施形態のヒューズ素子の縦断面図であ
る。
FIG. 2 is a longitudinal sectional view of the fuse element of the embodiment.

【図3】従来のヒューズ素子を示す縦断面図である。FIG. 3 is a longitudinal sectional view showing a conventional fuse element.

【符号の説明】[Explanation of symbols]

12 基板 14 ヒューズ部 16,18 導体部 20 凹部 22 電極 24 補助導体膜 12 Substrate 14 Fuse part 16, 18 Conductor part 20 Depression 22 Electrode 24 Auxiliary conductor film

フロントページの続き (72)発明者 山崎 盛勝 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 (72)発明者 野村 豊 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 Fターム(参考) 5G502 AA01 BA08 BB13 BC01 BD02 JJ01 Continuing from the front page (72) Inventor Morikatsu Yamazaki 3158, Shimo-Okubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture (72) Inventor Yutaka Nomura 3158, Shimo-Okubo, Osawano-cho, Kamishinkawa-gun, Toyama Hokuriku Electric Industry Co., Ltd. F-term (reference) 5G502 AA01 BA08 BB13 BC01 BD02 JJ01

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 絶縁性の基板上に形成され所定温度で溶
融するヒューズ部と、このヒューズ部に接続した導体部
と、この導体部に接続し上記基板の端面に形成された電
極と、この導体部の上記基板端縁部の上記電極と接する
角部に積層された補助導体膜とを備えたヒューズ素子。
A fuse formed on an insulating substrate and melting at a predetermined temperature; a conductor connected to the fuse; an electrode connected to the conductor and formed on an end surface of the substrate; A fuse element comprising an auxiliary conductor film laminated on a corner portion of the conductor portion which is in contact with the electrode at an edge of the substrate.
【請求項2】 上記補助導体膜は、上記電極に接する角
部周辺の上記導体部の下層に積層されている請求項1記
載のヒューズ素子。
2. The fuse element according to claim 1, wherein the auxiliary conductor film is laminated below the conductor portion around a corner in contact with the electrode.
【請求項3】 絶縁性の基板に複数のスルーホールを形
成し、このスルーホールの周縁部に各々補助導体膜及び
所定長さの導体部を形成し、各々一対の上記導体部に接
するようにヒューズ部を設け、この後上記スルーホール
に沿って上記基板を分割するヒューズ素子の製造方法。
3. A plurality of through-holes are formed in an insulating substrate, and an auxiliary conductor film and a conductor having a predetermined length are formed on the periphery of the through-holes, respectively, so as to be in contact with a pair of the conductors. A method for manufacturing a fuse element, comprising: providing a fuse portion; and thereafter dividing the substrate along the through hole.
JP11001341A 1999-01-06 1999-01-06 Fuse element and its manufacture Pending JP2000200539A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11001341A JP2000200539A (en) 1999-01-06 1999-01-06 Fuse element and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11001341A JP2000200539A (en) 1999-01-06 1999-01-06 Fuse element and its manufacture

Publications (1)

Publication Number Publication Date
JP2000200539A true JP2000200539A (en) 2000-07-18

Family

ID=11498805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11001341A Pending JP2000200539A (en) 1999-01-06 1999-01-06 Fuse element and its manufacture

Country Status (1)

Country Link
JP (1) JP2000200539A (en)

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