JP2000190192A - Polishing method and device for surface of cathode-ray tube - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the polishing efficiency by establishing a high speed rotation of a polishing head, increasing the pressure to the surface of a cathode-ray tube, and supplying a sufficient quantity of polishing liquid to between the head and the surface of cathode-ray tube. SOLUTION: A polishing head 21 is furnished with a polishing element 58 to polish the surface of a cathode-ray tube, and a torque given by a driving means is transmitted to the head 21 through a transmitting means 62. The transmitting means 62 is embodied on the gear coupling system to admit a high speed rotation and a high pressure and admit an inclination of polishing head 21 as tracing the surface configuration of the cathode-ray tube. Polishing liquid is supplied from the center of the polishing element 58.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cathode-ray tube surface polishing method for polishing a cathode-ray tube surface and an apparatus therefor.

[0002]

2. Description of the Related Art Conventionally, in a cathode ray tube manufacturing process, prior to a film coating process on the surface of the cathode ray tube, dirt or the like on the surface of the cathode ray tube is removed, or a film coated on the surface of the collected cathode ray tube is removed. To peel off,
There is a step of polishing the surface of the cathode ray tube.

An apparatus for polishing the surface of a cathode ray tube used in this polishing step includes a polishing head having a buff for polishing the surface of the cathode ray tube, and supports the polishing head via a universal joint. The rotating force from the motor is transmitted to rotate the polishing head, and the polishing head is allowed to tilt according to the surface shape of the cathode ray tube.

[0004] A rotating force from a motor is transmitted to the polishing head via a universal joint, and while the polishing head is rotating, the polishing head is pressed against the surface of the cathode ray tube via the universal joint with a predetermined pressing force. The polishing head is moved along the surface of the cathode ray tube to polish the entire surface of the cathode ray tube. During this polishing, the polishing liquid is intermittently supplied from outside the buff of the polishing head.

[0005]

However, conventionally, since a universal joint is used, the rotational speed of the polishing head is, for example, about 250 rpm, and the pressing force for pressing the polishing head against the surface of the cathode ray tube is, for example, about 20 kg. However, it is difficult to raise the height higher than that, because of the structure of the universal joint, and the polishing liquid is intermittently supplied from outside the buff of the polishing head, so that the polishing liquid is sufficiently supplied between the buff and the surface of the cathode ray tube. It cannot be supplied, and therefore has a problem of low polishing efficiency.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method and an apparatus for polishing the surface of a cathode ray tube which can improve the polishing efficiency.

[0007]

According to a method of polishing the surface of a cathode ray tube according to the present invention, a rotating force is transmitted to a polishing head having a polishing body for polishing the surface of the cathode ray tube by a gear coupling method to rotate the polishing head. Allows the inclination of the polishing head according to the surface shape of the cathode ray tube, and the adoption of a gear coupling system makes it possible to easily rotate the polishing head at high speed and increase the pressure applied to the surface of the cathode ray tube. The polishing efficiency is improved.

[0008] By supporting the polishing head with the spherical portion so as to be tiltable, the polishing head is easily tilted in accordance with the surface shape of the cathode ray tube, and the copying with respect to the surface shape of the cathode ray tube is improved.

By allowing the polishing head to move in the axial direction and biasing the polishing head in the axial direction toward the cathode ray tube,
The pressure applied to the surface of the cathode ray tube of the polishing head is stabilized, and the vibration is absorbed.

By supplying the polishing liquid from the center of the polishing body of the polishing head, the polishing liquid can be sufficiently supplied between the polishing body and the surface of the cathode ray tube, and the polishing efficiency is improved.

A CRT surface polishing apparatus according to the present invention includes a polishing head having a polishing body for polishing the surface of a CRT, a rotation output gear provided on the polishing head, and a rotation input gear meshed with the rotation output gear. Transmission means of a gear coupling system having a side gear, allowing the rotation of the polishing head to follow the surface shape of the cathode ray tube while keeping the rotation output side gear and the rotation input side gear engaged with each other; Drive means for inputting a rotational force to the rotation input side gear of the means. The transmission means of the gear coupling system makes it possible to easily rotate the polishing head at a high speed and increase the pressure applied to the surface of the cathode ray tube, thereby improving the polishing efficiency.

By providing a head support having a spherical portion and tiltably supporting the polishing head through the spherical portion, the polishing head is easily tilted according to the surface shape of the cathode ray tube, and the surface of the cathode ray tube is The profiling of the shape is improved.

The transmission means permits the polishing head to move in the axial direction while the rotation output side gear and the rotation input side gear are kept in mesh with each other, and urges the polishing head in the axial direction toward the cathode ray tube. By providing the urging means, the pressure applied to the surface of the cathode ray tube of the polishing head is stabilized, and the vibration is absorbed.

The provision of the polishing liquid supply means for supplying the polishing liquid from the center of the polishing body of the polishing head makes it possible to sufficiently supply the polishing liquid between the polishing body and the surface of the cathode ray tube, thereby improving the polishing efficiency. I do.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a front view of a cathode-ray tube surface polishing apparatus. This cathode-ray tube surface polishing apparatus is intended to polish a surface directed downward of the cathode-ray tube B, that is, a panel surface P. Reference numeral 11 denotes a rectangular frame-shaped member. At the bottom of the machine base 11, a plurality of wheels 13 for traveling movement that can be engaged with a guide frame 12 laid on the floor surface are attached.

A pair of right and left rails 14 are mounted on the machine base 11 in parallel along the front-rear direction, and a first moving unit is provided via a slide body 15 slidably engaged along each of the rails 14. The frame 16 is mounted so as to be movable in the front-rear direction. A pair of front and rear rails 17 are mounted on the first moving frame 16 along the left-right direction, and a second moving frame is provided via a slide body 18 slidably engaged along each of the rails 17. 19 is mounted movably in the left and right direction. On the second moving frame 19, a rotating body 20 having a rotation axis in the vertical direction is supported so as to be movable in the vertical direction and rotatable about the rotation axis.
A polishing head 21 for polishing the panel surface P of the cathode ray tube B is attached to the upper end of the tube 20.

A traveling motor (not shown) is attached to the machine base 11, and the first moving frame 16 is moved in the front-rear direction by driving the traveling motor. A traveling motor 22 is attached to the first moving frame 16, and the driving of the traveling motor 22 causes the second moving frame 19 to move in the left-right direction. Therefore, the moving frames 16, 19, the respective motors 22 and the like constitute a moving means for moving the polishing head 21 with respect to the entire area of the panel surface P of the cathode ray tube B.

A pulley 23 is attached to the lower part of the rotating body 21, a head rotating motor 24 as a driving means is attached to the second moving frame 19, and a pulley 26 is attached to a driving shaft 25 of the head rotating motor 24. A transmission belt (not shown) is stretched between the pulleys 23 and 26, and the polishing head 21 is driven by a head rotation motor 24.
Is driven to rotate.

A head pressurizing cylinder 27 is attached to the lower part of the second moving frame 19.
By the operation of 27, the polishing head 21 is moved up and down together with the rotating body 20, and the polishing head 21 is pressed against the panel surface P of the cathode ray tube B with a predetermined pressure during the polishing process.

A cover 28 for covering the periphery of the traveling movement area of the polishing head 21 is provided on the machine base 11 so as to be able to move up and down by an elevating mechanism 29. It is configured to cover the periphery to receive the scattered polishing liquid. Below the cover 28, a polishing liquid recovery frame 30 for recovering the polishing liquid at the time of the polishing process is provided.
The second moving frame 19 is positioned below the cover 28 even when the second moving frame 19 moves in the left-right direction, and is formed to have a size capable of receiving the polishing liquid. The polishing liquid collected in the polishing liquid recovery frame 30 is sent to a polishing liquid supply device (not shown) and circulated.

FIG. 1 is a cross-sectional view of a polishing head of a CRT surface polishing apparatus.
A connecting body 32 is attached to an upper part of the main body 31. A cylindrical body 33 is attached to an upper part of the connecting body 32. An internal as a rotation input side gear is provided at an upper part of the cylindrical body 33. A gear (internal gear) 34 is attached. On the inner periphery of the internal gear 34, internal teeth 34a parallel to the axial direction of the rotating body 20 are formed. On the upper surface of the internal gear 34, a locking body 36 having a hole 35 whose diameter is smaller than the inner diameter of the internal gear 34 is attached.

A hose 37 constituting a part of the polishing liquid supply means is provided at the center of the cylindrical body 33, and the lower end of the hose 37 is screwed into a through hole 38 formed at the center of the connecting body 32. The upper end of the hose 37 is projected upward through the hole 35 of the locking body 36.

Inside the cylinder 33, a compression spring 40 is disposed around the hose 37 as urging means for urging the polishing head 21 toward the cathode ray tube B, that is, upward. The lower part of the compression spring 40 is engaged with a lower spring receiver 41 disposed on the connecting body 32, and the upper part is engaged with an upper spring receiver. The upper spring support 42 has a substantially disk shape, and has an engagement hole 43 in the center thereof which is vertically engaged with the hose 37.
Is formed on the lower surface, and a projection that engages inside the compression spring 40 is formed on the lower surface.
A concave portion 45 is formed on the upper surface, and an engaging rib 46 is formed in the concave portion 45 so as to protrude upward from a peripheral portion of the engaging hole 43.

The concave portion 45 of the upper spring receiver 42 has the polishing head 21
A head support 47 for tiltably supporting is mounted. The head support 47 is formed in a substantially spherical shape, and an insertion hole 48 through which the hose 37 is inserted is formed at the center, and a lower side of the insertion hole 48 is engaged around the engagement rib 46 so that an upper spring is formed. It is mounted in the recess 45 of the receiver 42. Head support
On the surface of 47, a spherical portion 49 is formed.

The polishing head 21 has a disk-shaped buff support 51. An insertion hole 52 through which the hose 37 is inserted is formed in the center of the buff support 51, and the polishing head 21 has a protrusion on the upper surface periphery. An edge 53 is formed. A peripheral edge of a thin and elastic buff mounting plate 54 is mounted on the convex edge 53 of the buff support 51, and a through hole 55 through which the hose 37 is inserted is formed in the center of the buff mounting plate 54. At the same time, a guide body 57 that is vertically movably engaged with the hose 37 via a packing 56 is attached to the through hole 55 via a packing 56.

A buff 58 as a polishing body is mounted on the buff mounting plate 54 by a plurality of mounting members 59. Buff 58
Is a substantially disk-shaped, artificial leather (polyester + PVA),
A material such as wool felt is used, and an opening 60 through which the hose 37 is inserted is formed in the center.

On the lower surface of the buff support 51, a spur gear 61 is mounted as a rotation output side gear. This spur gear 61
On the outer periphery of the outer teeth 61a are formed external teeth 61a (parallel to the axial direction of the rotating body 20) meshing with the internal teeth 34a of the internal gear 34. The tooth width of the external teeth 61a is equal to the tooth width of the internal teeth 34a. It is formed smaller. And internal gear 34 and spur gear 61
Thus, a transmission means 62 of a gear coupling system which allows the polishing head 21 to move in the axial direction while maintaining the meshing state and allows the polishing head 21 to follow the surface shape of the panel surface P of the cathode ray tube B. Is configured.

The spur gear 61 has a protrusion 63 formed at the center of the upper surface thereof and attached to the buff support 51 through the hole 35 of the locking member 36, and formed on the lower surface of the locking member 36 on the periphery of the upper surface. An engaging step 64 to be engaged is formed, and an insertion hole 65 through which the hose 37 is inserted is formed in the center, and a conical shape that expands downward below the insertion hole 65 is formed below the insertion hole 65. An engagement surface 66 is formed. Since the engaging surface 66 is supported in contact with the spherical portion 49 of the head support 47, the polishing head 21
It is supported by 47 so that it can be easily tilted.

A polishing liquid is supplied from a polishing liquid supply device (not shown) to a hose 37 via a rotary joint (not shown).
To the lower side of the hose 37
A polishing liquid is supplied to the center of 58. For example, cerium oxide is used as the polishing liquid.

When the panel surface P of the cathode ray tube B is polished, the rotating body 20 and the polishing head 21 are rotated by driving the head rotating motor 24, and the rotating body 20 and the polishing head are rotated by operating the head pressing cylinder 27. The head 21 is raised, and the polishing head 21 is pressed against the panel surface P of the cathode ray tube B with a predetermined pressure. At this time, since the transmission means 62 of the gear coupling system is used for the polishing head 21,
The rotation speed of the polishing head 21 is, for example, 800 rpm (maximum 12
00 rpm), and the pressing force is, for example, 30 kg (maximum 50 k).
g).

The polishing head 21 is moved to the panel surface P of the cathode ray tube B.
When pressed against the grinding head, the grinding head is
21 is slightly pushed down against the rotating body 20, and the polishing head follows the surface shape of the panel surface P of the cathode ray tube B.
21 leans. Thus, even if the polishing head 21 is pushed down or inclined, the meshing state of the internal gear 34 and the spur gear 61 is maintained.

At this time, since the polishing head 21 is supported via the spherical portion 49 of the head support 47, the polishing head 21 is easily inclined according to the surface shape of the panel surface P of the cathode ray tube B, The copying of the panel surface P with respect to the surface shape can be improved, and the buff 58 can be prevented from hitting one side.

Further, since the polishing head 21 is urged toward the cathode ray tube B by the compression spring 40, the pressing force of the polishing head 21 against the surface of the panel surface P of the cathode ray tube B is stabilized and vibration can be absorbed.

A polishing liquid is continuously supplied from a polishing liquid supply device (not shown) to the center of the buff 58 through the hose 37. Therefore, the polishing liquid can be sufficiently supplied between the buff 58 and the panel surface P of the cathode ray tube B, the polishing force can be maintained, the heat generation can be prevented, and the panel surface P of the cathode ray tube B can be prevented from being damaged. The polishing liquid used in the polishing process is collected in a polishing liquid recovery frame 30, sent to a polishing liquid supply device (not shown), and circulated.

Accordingly, the panel surface P of the cathode ray tube B is polished by the buff 58 which is rotated and pressed with a sufficient polishing liquid to the panel surface P of the cathode ray tube B.

Then, the polishing head 21 is moved by driving each of the traveling motors 22 of the moving frames 16 and 19,
The polishing head 21 polishes the entire surface area of the panel surface P of the cathode ray tube B. The traveling speed at this time is, for example, 200 mm
/ S.

As described above, the rotating force is transmitted to the polishing head 21 for polishing the panel surface P of the cathode ray tube B by the gear coupling method, and the polishing head 21 is moved to the panel surface P of the cathode ray tube B.
, And the inclination of the polishing head 21 is allowed according to the surface shape of the cathode ray tube B.
21 can be easily rotated at a high speed, and the pressure applied to the panel surface P of the cathode ray tube B can be easily increased.
By supplying the polishing liquid from the center, the polishing liquid can be sufficiently supplied between the buff 58 and the panel surface P of the cathode ray tube B, so that the polishing efficiency can be improved.

The transmission means 62 of the gear coupling system
Is not limited to the combination of the internal gear 34 and the spur gear 62.For example, a pair of spur gears arranged and meshed in parallel with each other as a rotation output side gear and a rotation input side gear, and one of the rotation output side The spur gear as a gear may be configured to be movable in the axial direction and to allow the polishing head 21 to follow the surface shape of the cathode ray tube B, and the same operation and effect can be obtained.

[0040]

According to the present invention, a rotational force is transmitted to a polishing head for polishing the surface of a cathode ray tube by a gear coupling method to rotate the polishing head and to adjust the inclination of the polishing head according to the surface shape of the cathode ray tube. Since the polishing is allowed, the polishing head can be rotated at high speed and the pressure applied to the surface of the cathode ray tube can be easily increased, so that the polishing efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a polishing head portion of a cathode-ray tube surface polishing apparatus according to an embodiment of the present invention.

FIG. 2 is an overall front view of the cathode-ray tube surface polishing apparatus.

[Explanation of symbols]

 21 Polishing head 24 Head rotation motor as driving means 34 Internal gear as rotation input side gear 37 Hose constituting a part of polishing liquid supply means 40 Compression spring as urging means 47 Head support 49 Spherical part 58 Buff as abrasive body 61 Spur gear as rotation output side gear 62 Transmission means B CRT

Claims (8)

[Claims] 1. A method of transmitting a rotational force to a polishing head having a polishing body for polishing the surface of a cathode ray tube by a gear coupling method to rotate the polishing head and to allow the inclination of the polishing head according to the surface shape of the cathode ray tube. A method for polishing a surface of a cathode ray tube, characterized by comprising: 2. The method for polishing a surface of a cathode ray tube according to claim 1, wherein the polishing head is supported by a spherical portion so as to be tiltable. 3. The method for polishing a surface of a cathode ray tube according to claim 1, wherein the polishing head is allowed to move in the axial direction and is urged in the axial direction toward the cathode ray tube. 4. The method according to claim 1, wherein the polishing liquid is supplied from the center of the polishing body of the polishing head. 5. A polishing head having a polishing body for polishing the surface of a cathode ray tube, a rotation output side gear provided on the polishing head, and a rotation input side gear meshed with the rotation output side gear, and A transmission means of a gear coupling system which allows the polishing head to follow the surface shape of the cathode ray tube while maintaining the meshing state between the output side gear and the rotation input side gear; A cathode-ray tube surface polishing apparatus, comprising: driving means for inputting a force. 6. The apparatus for polishing a surface of a cathode ray tube according to claim 5, further comprising a head support having a spherical portion and supporting the polishing head so as to be tiltable through the spherical portion. 7. A transmission means allows the polishing head to move in the axial direction while the rotation output side gear and the rotation input side gear maintain the meshing state, and attaches the polishing head to the cathode ray tube in the axial direction. The apparatus for polishing a surface of a cathode ray tube according to claim 5 or 6, further comprising a biasing means for biasing. 8. The cathode-ray tube surface polishing apparatus according to claim 5, further comprising a polishing liquid supply means for supplying a polishing liquid from the center of the polishing body of the polishing head.