JP2000188232A - Surface mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect a surface mounted component in an electronic apparatus against solder crack due to vibration by making recesses for filling a conductive joint member at positions symmetric to the center of an electrode. SOLUTION: Electrodes 12 having U-shaped cross-section are provided at the opposite ends of a rectangular prism body part 11, e.g. a resistor or a capacitor. V-shaped groove 13 are made in the end faces 12a symmetrically to the center 14 of the body part 11. Since surface area of the electrode increases when a component surface mounted on a printed board, or the like, bonding area of a conductive adhesive member, e.g. solder, is increased to ensure rigid soldering. Furthermore, since it is symmetrical to the center 14 of the body part 11, mounting position is not shifted when the component is welded through the conductive adhesive member, e.g. solder, even if the surface mounting component can be guided with tension of the conductive adhesive member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component used for electronic equipment and the like.

[0002]

2. Description of the Related Art A conventional surface mount component will be described below.

As shown in FIG. 9, a conventional surface mount component has electrodes 2 provided at both ends of a main body 1 having a substantially rectangular parallelepiped shape, and solder is attached to the electrodes 2.

[0004]

However, in such a conventional configuration, when used in an electronic device or the like having a large vibration, a solder crack may occur in a surface mount component mounted inside the electronic device due to the vibration. it was thought.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a surface mount component which is resistant to vibration.

[0006]

In order to achieve this object, a surface mount component according to the present invention is provided with a concave portion that can be filled with a conductive bonding member at a position symmetrical from the center of an electrode.

[0007] With this configuration, the surface mounting component is resistant to vibration.

[0008]

DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention is directed to a rectangular parallelepiped surface-mounted component having electrodes at both ends, wherein the conductive bonding member can be filled in a symmetrical position from the center of the electrode. Is provided, and since such a concave portion is provided, the bonding area of the electrode is increased. Therefore, the area of soldering becomes large, and it becomes strong against vibration. Further, since the concave portion is provided at a symmetrical position from the center, the mounting position of the surface mount component does not shift when heat is applied to weld a conductive adhesive member such as solder.

According to a second aspect of the present invention, the concave portion is a surface-mounted component according to the first aspect, wherein the concave portion is a V-shaped groove.
Since the groove is formed, the adhesion area of the conductive adhesive member such as solder on the electrode increases, and the bonding strength increases.

According to a third aspect of the present invention, there is provided the surface mounting component according to the first aspect, wherein a plurality of V-shaped grooves are provided in parallel with each other. This causes more adhesion, and further increases the bonding strength.

According to a fourth aspect of the present invention, the concave portion is the surface-mounted component according to the first aspect, wherein the V-shaped grooves are provided at right angles to each other. It can be mounted either horizontally or in any orientation.

According to a fifth aspect of the present invention, the concave portion is a surface-mounted component according to the first aspect, wherein the concave portion is a U-shaped groove.
Since the groove is formed, the adhesion area of the conductive adhesive member such as solder on the electrode increases, and the bonding strength increases.

According to a sixth aspect of the present invention, there is provided the surface mounting component according to the fifth aspect, wherein a plurality of U-shaped grooves are provided in parallel with each other. More adhesion will result, and the bonding strength will be further increased.

According to a seventh aspect of the present invention, there is provided the surface mounting component according to the fifth aspect, wherein the concave portion is provided with U-shaped grooves at right angles to each other. It can be mounted in either orientation, either horizontal or horizontal.

The invention according to claim 8 is the surface mount component according to claim 1, wherein a concave portion is provided on an end surface of the electrode, and the concave portion is filled with a conductive adhesive member, so that a bonding area is provided. And the bonding strength increases.

According to a ninth aspect of the present invention, there is provided the surface mounting component according to any one of the first to eighth aspects, wherein the concave portion is filled with a conductive adhesive member. When the surface mounting component is mounted on a printed circuit board or the like, a step of applying a conductive adhesive member is not required because the component is filled.

According to a tenth aspect of the present invention, there is provided a cylindrical surface mount component having electrodes at both ends, wherein a concave portion capable of being filled with a conductive bonding member is provided at an end surface of the electrode. Even in a cylindrical surface mount component, since this recess is filled with a conductive adhesive member,
The joining area increases, and the joining strength increases.

[0018] The eleventh aspect of the present invention is the surface mount component according to the tenth aspect, in which the concave portion is filled with a conductive adhesive member. When the surface mount component is mounted on a printed circuit board or the like, a step of applying a conductive adhesive member is not required.

According to a twelfth aspect of the present invention, there is provided a cylindrical surface mount component having electrodes at both ends, wherein a plurality of grooves intersecting an end face of the electrode are provided. Are provided, the bonding area between the conductive adhesive member and the electrode increases, and the bonding strength increases.

According to a thirteenth aspect of the present invention, there is provided the surface mount component according to the twelfth aspect, wherein the groove is filled with a conductive adhesive member. When this surface mount component is mounted on a printed circuit board or the like, a step of applying a conductive adhesive member is not required.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1A is a perspective view of a surface mount component according to Embodiment 1, and FIG. 1B is a plan view thereof.

In FIG. 1A, reference numeral 11 denotes a main body, in which a resistor is formed in the case of a resistor, and a capacitor is formed in the case of a capacitor. Reference numerals 12 denote electrodes provided at both ends of the main body 11 having a rectangular parallelepiped shape, and have a U-shaped cross section. A V-shaped groove 13 is formed on the end face 12a.
Is provided. The groove 13 is symmetrical with respect to the center 14 of the main body 11 as shown in FIG. This increases the surface area of the electrodes when mounted on a printed circuit board or the like, so that the bonding area of a conductive adhesive member such as solder is increased, enabling firm soldering and being symmetrical with respect to the center 14 of the main body 11. Because of the shape, when the surface is mounted on a conductive adhesive member such as solder by applying heat and the surface mount component can be guided by the tension of the conductive adhesive member, the mounting position does not shift.

(Embodiment 2) In Embodiment 2, electrodes 1 are provided at both ends of a rectangular parallelepiped main body 15 as shown in FIG.
6, but in this case, the electrode 16 on one side is provided.
Are provided with three V-shaped grooves 17. What is important is that one V-shaped groove 17a is provided at the center of the main body 15 to make it symmetrical.

(Embodiment 3) In Embodiment 3, electrodes 19 are provided at both ends of a main body 18 as shown in FIG. A mold groove 20 and a V-shaped groove 21 provided in the vertical direction are provided. By providing the V-shaped grooves at right angles to each other, it is possible to cope with both vertical and horizontal mounting of the surface mount component.

(Embodiment 4) In Embodiment 4, electrodes 2 are provided at both ends of a rectangular parallelepiped main body 22 as shown in FIG.
In this case, the shape of the groove 24 of the concave portion is U-shaped. The effect at this time is the same as that of the first embodiment.

(Embodiment 5) In Embodiment 5, electrodes 2 are provided at both ends of a rectangular parallelepiped main body 25 as shown in FIG.
6, a circular concave portion 2 is provided at the center of the end of the electrode 26.
7 are provided. By doing so, the concave portion 27 can be filled with the conductive bonding member, so that the bonding area between the electrode 26 and the conductive bonding member is increased. Further, this bonding state is shown in the sectional view of FIG.
In this state, the main body 25 is firmly held by the claw shape 29a formed by the conductive bonding member 29, and strong bonding is possible. The recess 27 does not need to be circular, and may be elliptical or polygonal.

Further, by filling the recesses described in the first to fifth embodiments with the conductive bonding member, the step of applying the conductive bonding member when mounting on the printed circuit board can be omitted.

(Embodiment 6) In Embodiment 6, electrodes 31 are provided at both ends of a cylindrical main body 30 as shown in FIG.
And a concave portion 32 is provided at the center of the end face of the electrode 31. By providing the concave portion 32 on the end face in this way, the concave portion 32 can be filled with the conductive bonding member, so that the area of the bonding portion between the electrode 31 and the conductive bonding member becomes large. As shown, the main body 30 is firmly held by the claw shape formed by the conductive bonding member, and strong bonding is possible. Further, if the recess 32 is filled with a conductive bonding member, the step of applying the conductive bonding member when mounting the printed circuit board can be omitted.

(Embodiment 7) In Embodiment 7, electrodes 34 are provided at both ends of a main body 33 having a cylindrical shape as shown in FIG.
And grooves 35 intersecting with each other are formed at the ends of the electrodes 34.
Is provided. By doing so, the surface area of the end portion of the electrode 34 is increased, the joint area between the electrode 34 and the conductive joining member is increased, and strong soldering can be performed. In addition, if the groove 35 is filled with the conductive joining member. In addition, a step of applying a conductive bonding member when mounting on a printed circuit board can be omitted.

[0030]

As described above, the surface mounting component of the present invention has a structure in which the conductive bonding member can be filled with a concave portion at a position symmetrical from the center of the electrode. The bonding area with the member increases, and the bonding strength increases. Therefore, a surface-mounted component that is resistant to vibration can be realized. In addition, since the concave portion is provided at a symmetrical position from the center of the electrode, even when the surface mounting component can be guided by the tension of the conductive bonding member when applying heat and welding with a conductive adhesive member such as solder, it is mounted. There is no displacement.

[Brief description of the drawings]

FIG. 1A is a perspective view of a surface mount component according to a first embodiment of the present invention; FIG. 1B is a plan view of the surface mount component according to the first embodiment of the present invention;

FIG. 2 is a perspective view of a surface mount component according to a second embodiment of the present invention.

FIG. 3 is a perspective view of a surface mount component according to a third embodiment of the present invention.

FIG. 4 is a perspective view of a surface mount component according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view of a surface mount component according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view of a surface mount component according to a fifth embodiment of the present invention.

FIG. 7 is a perspective view of a surface mount component according to a sixth embodiment of the present invention.

FIG. 8 is a perspective view of a surface mount component according to a seventh embodiment of the present invention.

FIG. 9 is a perspective view of a conventional surface mount component.

[Explanation of symbols]

 11 body part 12 electrode 13 groove

Claims (13)

[Claims] 1. A surface mounting component having a rectangular parallelepiped shape having electrodes at both ends, wherein a concave portion capable of being filled with a conductive bonding member is provided at a position symmetrical from the center of the electrode. 2. The surface mount component according to claim 1, wherein the recess is a V-shaped groove. 3. The surface mount component according to claim 1, wherein the recess has a plurality of V-shaped grooves provided in parallel with each other. 4. The surface mount component according to claim 1, wherein V-shaped grooves are provided in the recess at right angles to each other. 5. The surface mount component according to claim 1, wherein the recess is a U-shaped groove. 6. The surface mount component according to claim 1, wherein the recess has a plurality of U-shaped grooves provided in parallel with each other. 7. The surface-mounted component according to claim 1, wherein U-shaped grooves are provided in the recess at right angles to each other. 8. The surface mount component according to claim 1, wherein a concave portion is provided on an end face of the electrode. 9. The surface mount component according to claim 1, wherein the concave portion is filled with a conductive adhesive member. 10. A surface-mounted component having a cylindrical shape having electrodes at both ends, wherein a concave portion capable of being filled with a conductive bonding member is provided on an end face of the electrode. 11. The surface mount component according to claim 10, wherein the concave portion is filled with a conductive adhesive member. 12. A surface mount component having a cylindrical shape having electrodes at both ends, wherein a plurality of grooves intersecting an end face of the electrode are provided. 13. The surface-mounted component according to claim 12, wherein the groove is filled with a conductive adhesive member.