JP2000186202A - Polyamide resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polyamide resin compsn. which is excellent in impact strength, weld characteristics, heat resistance, low water absorption, hot water resistance, chemical resistance, etc., and a molded article therefrom. SOLUTION: This is a polyamide resin compsn, comprising a polyamide resin (I) contg. a dicarboxylic acid unit (a) having 60-100 mol% of terephthalic acid unit, and a diamine unit (b) having 60-100 mol% of 1,9-nonanediamine unit and/or 2-methyl-1,8-octanediamine unit, the compsn. also comprising a polyolefin resin (II) having an epoxy group in the molecule, wherein the wt. ratio of the polyamide resin (I) to polyolefin resin (II) is in the range of 99:1-50:50. Molded articles are obtd. from the polyamide resin compsn.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a polyamide resin composition comprising a specific polyamide resin and a specific polyolefin resin, and to a molded article comprising the same. The polyamide resin composition of the present invention has excellent properties such as impact resistance, weld properties, heat resistance, low water absorption, hot water resistance, and chemical resistance.
It can be used very effectively in electrical and electronic components, household goods, and a wide variety of other applications.

[0002]

2. Description of the Related Art General-purpose polyamides such as nylon 6 and nylon 66 have excellent properties such as heat resistance, chemical resistance, rigidity, abrasion resistance, and moldability, so that they are widely used as engineering plastics. Has been used for These polyamides are tough resins as engineering plastics, and have extremely high toughness especially in a moisture absorbing state. On the other hand, demands for heat resistance and low water absorption are increasing year by year in applications such as automobiles and electric / electronic parts, and conventional polyamides are no longer able to cope with them. At the same time, further improvements in performance such as mechanical properties and chemical resistance are desired.

In response to such demands in the world, various semi-aromatic polyamides (hereinafter abbreviated as 6T-based polyamides) containing terephthalic acid and 1,6-hexanediamine as main components have been proposed, and some of them have been put into practical use. Have been. However, since 6T-based polyamide has a melting point near 370 ° C., which is higher than the decomposition temperature of the polymer, it is difficult to melt-polymerize and melt-mold, and it is not practically usable. Actually, adipic acid and isophthalic acid It is used in a composition where the melting point is lowered to a practically usable temperature range, that is, about 280 to 320 ° C. by copolymerizing a dicarboxylic acid component or an aliphatic polyamide such as nylon 6 in an amount of 30 to 40 mol%. It is the current situation. Although copolymerization of such a large amount of the third component (or the fourth component in some cases) is certainly effective in lowering the melting point of the polymer, it is accompanied by a decrease in the crystallization speed and the ultimate crystallinity. As a result, not only physical properties such as rigidity at high temperature, chemical resistance and dimensional stability are reduced, but also productivity is reduced due to extension of the molding cycle. Also, fluctuations in various physical properties such as dimensional stability due to water absorption have been improved to some extent compared to conventional aliphatic polyamides by the introduction of aromatic groups, but have reached the level of substantial problem solving. Not.

Therefore, in order to improve the balance between toughness and rigidity, impact resistance, heat resistance, water resistance and deformation resistance, semi-aromatic polyamides are added to α, β-unsaturated carboxylic acids and their anhydrides. It has been proposed to incorporate a modified polyolefin graft-modified with a product or a derivative thereof (see JP-A-3-285951).

[0005]

However, the semi-aromatic polyamide actually used in the examples of the above-mentioned JP-A-3-285951 has a terephthalic acid unit and 1,
It is only a 6T polyamide obtained by copolymerizing adipic acid or isophthalic acid with a polyamide composed of 6-hexanediamine units. According to the study of the present inventors, when using such a polyamide, Properties such as impact resistance, weld properties, heat resistance, low water absorption, hot water resistance, and chemical resistance are inferior, and it cannot be said that they have sufficient practical performance. JP-A-3-285951 discloses that an α, β-unsaturated carboxylic acid, which is a polyolefin modifier, having an epoxy group can be used. What is actually used in the examples is only those having no epoxy group, and thus, when using one having no epoxy group, the polyamide resin composition of the present invention is used. Thus, a material having excellent weld properties cannot be obtained.

An object of the present invention is to provide a polyamide resin composition having excellent properties such as impact resistance, weld properties, heat resistance, low water absorption, hot water resistance, and chemical resistance, and a molded article comprising the same.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, a polyolefin resin having an epoxy group in a molecule has been added to a polyamide resin having a specific diamine unit at a specific ratio. By blending with, impact resistance, weld physical properties, heat resistance, low water absorption,
They have found that a polyamide resin composition having excellent properties such as hot water resistance and chemical resistance can be obtained, and have completed the present invention.

That is, the present invention relates to a dicarboxylic acid unit (a) containing 60 to 100 mol% of a terephthalic acid unit.
And a polyamide resin (I) comprising a diamine unit (b) containing 60 to 100 mol% of 1,9-nonanediamine unit and / or 2-methyl-1,8-octanediamine unit, and an epoxy group in the molecule. A polyamide resin composition comprising a polyolefin resin (II) having a polyamide resin (I) and a polyolefin resin (I).
The present invention relates to a polyamide resin composition, wherein the weight ratio of I) is from 99: 1 to 50:50. Further, the present invention relates to a molded article comprising the polyamide resin composition.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The dicarboxylic acid unit (a) constituting the polyamide resin (I) used in the present invention needs to contain terephthalic acid unit in an amount of 60 to 100 mol%, and contains 75 to 100 mol%. Preferably,
More preferably, the content is 90 to 100 mol%.
When the content of the terephthalic acid unit is less than 60 mol%, the heat resistance of the obtained polyamide resin composition is undesirably reduced.

The dicarboxylic acid unit other than the terephthalic acid unit includes malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid,
Aliphatic dicarboxylic acids such as trimethyladipic acid, pimelic acid, 2,2-dimethylglutaric acid, 3,3-diethylsuccinic acid, azelaic acid, sebacic acid, suberic acid; 1,3-cyclopentanedicarboxylic acid, 1,4 Alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid;
Isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,
7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3
-Phenylenedioxydiacetic acid, diphenic acid, dibenzoic acid, 4,4-oxydibenzoic acid, diphenylmethane-
4,4-dicarboxylic acid, diphenylsulfone-4,4-
Examples include units derived from an aromatic dicarboxylic acid such as dicarboxylic acid and 4,4-biphenyldicarboxylic acid, and one or more of these units may be included. Among these, it is preferable to include a unit derived from an aromatic dicarboxylic acid. Further, a unit derived from a polycarboxylic acid such as trimellitic acid, trimesic acid, and pyromellitic acid can be included in a range where melt molding is possible.

The polyamide resin (I) used in the present invention
It is necessary that the diamine unit (b) constituting the component (b) contains 1,9-nonanediamine unit and / or 2-methyl-1,8-octanediamine unit in an amount of 60 to 100 mol%, and 75 to 100 mol% It is preferably contained, and more preferably 90 to 100 mol%. 1,9-nonanediamine unit and 2-methyl-
When 1,8-octanediamine unit is used in combination,
The molar ratio of 1,9-nonanediamine unit: 2-methyl-1,8-octanediamine unit is 99: 1 to 20:80.
The ratio is preferably 99: 1 to 60:40, and more preferably 99: 1 to 80:20. When a polyamide resin containing 1,9-nonanediamine unit and / or 2-methyl-1,8-octanediamine unit in the above ratio is used, a polyamide resin excellent in heat resistance, moldability, low water absorption and light weight is used. A composition is obtained.

Other diamine units other than the 1,9-nonanediamine unit and the 2-methyl-1,8-octanediamine unit include ethylenediamine, propylenediamine, 1,4-butanediamine, 1,6-hexanediamine, , 8-octanediamine, 1,10-decanediamine, 1,12-dodecanediamine, 3-methyl-1,
5-pentanediamine, 2,2,4-trimethyl-1,
6-hexanediamine, 2,4,4-trimethyl-1,
Aliphatic diamines such as 6-hexanediamine and 5-methyl-1,9-nonanediamine; alicyclic diamines such as cyclohexanediamine, methylcyclohexanediamine and isophoronediamine; p-phenylenediamine, m
-A unit derived from an aromatic diamine such as phenylenediamine, xylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylsulfone, and 4,4-diaminodiphenylether; Two or more can be included.

The polyamide resin (I) used in the present invention
Preferably, 10% or more, more preferably 40% or more, and even more preferably 60% or more of the terminal groups of the molecular chain are sealed with a terminal blocking agent. Terminal blocking rate is 1
It is preferable to use 0% or more of a polyamide resin because a polyamide resin composition having more excellent properties such as melt stability and hot water resistance can be obtained.

The terminal capping rate of the polyamide resin (I) is determined by measuring the number of carboxyl group terminals, amino group terminals and the number of terminals capped by the terminal capping agent in the polyamide resin, respectively, and the following formula: It can be obtained by (1). The number of each terminal group is preferably determined from the integrated value of the characteristic signal corresponding to each terminal group by ¹ H-NMR from the viewpoint of accuracy and simplicity.

[0015] Terminal blocking ratio (%) = [(AB) ÷ A] × 100 (1) [wherein A is the total number of molecular chain terminal groups (this is usually equal to twice the number of polyamide molecules) ), And B represents the total number of carboxyl group terminals and amino group terminals. ]

The terminal blocking agent is not particularly limited as long as it is a monofunctional compound having reactivity with the amino group or carboxyl group at the polyamide terminal, but from the viewpoints of reactivity and stability of the blocked terminal. , A monocarboxylic acid or a monoamine is preferred, and a monocarboxylic acid is more preferred from the viewpoint of easy handling. In addition, acid anhydrides such as phthalic anhydride, monoisocyanates, monoacid halides, monoesters, and monoalcohols can also be used.

The monocarboxylic acid used as the terminal blocking agent is not particularly limited as long as it has reactivity with an amino group. Examples thereof include acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, Aliphatic monocarboxylic acids such as caprylic acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, pivalic acid and isobutyric acid; alicyclic monocarboxylic acids such as cyclohexanecarboxylic acid; benzoic acid, toluic acid, α -Naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, aromatic monocarboxylic acids such as phenylacetic acid,
Alternatively, an arbitrary mixture thereof can be mentioned.
Among them, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearin Acids and benzoic acid are particularly preferred.

The monoamine used as the terminal blocking agent is not particularly limited as long as it has reactivity with a carboxyl group. Examples thereof include methylamine, ethylamine, propylamine, butylamine, hexylamine and octylamine. Aliphatic monoamines such as decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine and dibutylamine; cycloaliphatic monoamines such as cyclohexylamine and dicyclohexylamine; aniline, toluidine, diphenylamine,
An aromatic monoamine such as naphthylamine, or an arbitrary mixture thereof can be mentioned. Among these, butylamine, hexylamine, octylamine, decylamine, stearylamine, cyclohexylamine, and aniline are particularly preferred from the viewpoints of reactivity, high boiling point, stability of the sealed terminal, and price.

The polyamide resin (I) used in the present invention
Can be produced using any method known as a method for producing a crystalline polyamide. For example,
Polymerization can be carried out by a solution polymerization method or an interfacial polymerization method using acid chloride and diamine as raw materials, a melt polymerization method using dicarboxylic acid and diamine as raw materials, a solid phase polymerization method, a melt extruder polymerization method, or the like.

As a method for producing the polyamide resin (I), for example, a diamine and a dicarboxylic acid, a catalyst and, if necessary, a terminal blocking agent are added all at once, and a nylon salt is produced. To a prepolymer having an intrinsic viscosity [η] of 0.1 to 0.6 dl / g at 30 ° C. in concentrated sulfuric acid, and further performing solid-phase polymerization or polymerization using a melt extruder. A method of producing a polyamide resin by performing the method can be given. The intrinsic viscosity [η] of the prepolymer is 0.1 to
When it is within the range of 0.6 dl / g, a polyamide having a small difference in molar balance between a carboxyl group and an amino group and a small decrease in the polymerization rate in the post-polymerization stage, a small molecular weight distribution, and excellent in various physical properties and moldability. A resin is obtained. When the final stage of the polymerization is carried out by solid-phase polymerization, it is preferably carried out under reduced pressure or under a flow of an inert gas.
A temperature within the range of 0 to 280 ° C. is preferable because the polymerization rate is high, the productivity is excellent, and coloring and gelation can be effectively suppressed. When the final stage of the polymerization is carried out by a melt extruder, it is preferable that the polymerization temperature is 370 ° C. or lower, since the polyamide resin hardly decomposes and a polyamide without deterioration is obtained.

In producing the polyamide resin (I), in addition to the terminal blocking agent, for example, as a catalyst, phosphoric acid, phosphorous acid, hypophosphorous acid or a salt or ester thereof, specifically, Potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten, germanium, titanium, antimony and other metal salts and ammonium salts, ethyl esters,
Isopropyl ester, butyl ester, hexyl ester, isodecyl ester, octadecyl ester, decyl ester, stearyl ester, phenyl ester and the like can be added.

The polyamide resin (I) used in the present invention
Is the intrinsic viscosity [η] measured in concentrated sulfuric acid at 30 ° C.
Is preferably 0.6 to 2.0 dl / g.
It is more preferably 7 to 1.9 dl / g, and 0.8 to dl / g.
More preferably, it is 1.8 dl / g. When the intrinsic viscosity is less than 0.6 dl / g, the mechanical properties of the obtained polyamide resin composition are impaired, and when the intrinsic viscosity is more than 2.0 dl / g, the fluidity of the obtained polyamide resin composition is reduced and the moldability is deteriorated. Therefore, it is not preferable.

The polyolefin resin (II) used in the present invention is not particularly limited as long as it is a polyolefin resin having at least one epoxy group in its molecule. For example, a monomer having an epoxy group in the polyolefin resin may be used. Can be used, or a polyolefin resin having an epoxy group introduced into the molecule can be used by, for example, a method of copolymerizing a polyolefin resin or a method of radically adding a monomer having an epoxy group to the polyolefin resin.

Examples of the polyolefin resin constituting the polyolefin resin (II) used in the present invention include ethylene, propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene and 1-octene. , 1-decene, 1-dodecene or the like having 2 to 20 carbon atoms
And a copolymer composed of two or more α-olefin components. Further, for example, 1,4-
Non-conjugated diene components such as hexadiene, dicyclopentadiene, 5-ethylidene-2-norbornene, and 2,5-norbornadiene; conjugated diene components such as butadiene, isoprene and piperylene; vinyl acetate, acrylic acid, methacrylic acid, and acrylic acid ester; Methacrylic acid esters,
It is also possible to use one obtained by copolymerizing a polar vinyl monomer component such as a metal salt of acrylic acid and a metal salt of methacrylic acid with one kind or a combination of two or more kinds. Among the above-mentioned polyolefin resins, polyethylene and polypropylene, ethylene / propylene copolymers, ethylene / 1-butene copolymers, and ethylene / 1-octene copolymers are used in view of excellent impact resistance of the obtained polyamide resin composition. It is preferable to use an ethylene / α-olefin copolymer such as a coalescence.

Examples of monomers used for introducing an epoxy group into the above-mentioned polyolefin resin include glycidyl acrylate, glycidyl methacrylate, glycidyl itaconate, allyl glycidyl ether, 2-methylallyl glycidyl ether and styrene-
p-glycidyl ether, 3,4-epoxybutene,
3,4-epoxy-3-methyl-1-butene, 3,4-
Epoxy-3-methyl-1-pentene, 5,6-epoxy-1-hexene, vinylcyclohexene monoxide, p-glycidylstyrene, and the like,
One or more of these can be used. Among these, glycidyl acrylate and glycidyl methacrylate are preferably used.

The content ratio of the monomer having an epoxy group in the polyolefin resin (II) is from 0.1 to 5 from the viewpoint that the obtained polyamide resin composition has excellent weld properties.
0% by weight, preferably 1 to 25% by weight.
Is more preferably within the range. Further, in addition to the epoxy group, for example, a functional group such as a carboxyl group, an amino group, and an isocyanate group may be simultaneously contained within a range that does not impair the effects of the present invention.

In the polyamide resin composition of the present invention, the weight ratio of the polyamide resin (I) to the polyolefin resin (II) needs to be 99: 1 to 50:50.
7: 3 to 60:40, preferably 95: 5 to 7
More preferably, it is 0:30. When the content of the polyolefin resin (II) is less than 1% by weight based on the total content of the polyamide resin (I) and the polyolefin resin (II), the impact resistance of the obtained polyamide resin composition is improved. And the physical properties of the weld also decrease. On the other hand, when the content of the polyolefin resin (II) exceeds 50% by weight, the heat resistance of the polyamide resin composition decreases.

The polyamide resin composition of the present invention may contain, if necessary, a fibrous filler such as glass fiber, carbon fiber, boron fiber, aramid fiber, or liquid crystal polyester fiber; silica, silica alumina, alumina, talc, graphite. , A powdered filler such as titanium dioxide, molybdenum disulfide, and polytetrafluoroethylene.
These fillers are used in the polyamide resin composition 10 of the present invention.
It is preferable to add the polyamide resin composition in an amount of 1 to 100 parts by weight with respect to 0 parts by weight because a polyamide resin composition having a better balance between mechanical properties and moldability is obtained.

Further, in addition to the above additives, the polyamide resin composition of the present invention may further comprise, if necessary, a conventionally known copper stabilizer, hindered phenol antioxidant, or hindered amine antioxidant. , Phosphorus-based antioxidants, thio-based antioxidants, colorants, ultraviolet absorbers, light stabilizers, antistatic agents, plasticizers, lubricants, crystal nucleating agents, flame retardants or other types of polymers. it can.

The method for preparing the polyamide resin composition of the present invention is not particularly limited, and any method may be used as long as it can uniformly mix the polyamide resin (I) and the polyolefin resin (II). Can be produced by melt-kneading the above resin together with other components as necessary. Melt kneading can be performed using a kneader such as a single-screw extruder, a twin-screw extruder, a kneader, and a Banbury mixer, and the type of equipment and melt-kneading conditions used at that time are not particularly limited, About 300-35
The polyamide resin composition of the present invention can be obtained by kneading at a temperature in the range of 0 ° C. for 1 to 30 minutes.

When a molded article is produced by using the polyamide resin composition of the present invention, the type and purpose of the intended molded article,
Depending on the shape and the like, various molding methods and molding apparatuses generally used for thermoplastic resin compositions can be used. For example, a molded article can be produced by any molding method such as injection molding, extrusion molding, press molding, blow molding, calendar molding, cast molding, and the like, and can also be molded by combining these molding techniques.
Further, it can be formed into a composite with another polymer.

The polyamide resin composition of the present invention can be used for automobile parts, industrial materials, industrial materials, electric / electronic parts, machine parts, office equipment parts, household goods, sheets, films, fibers, and other arbitrary shapes and uses. It is useful as a raw material for producing various molded articles.

[0033]

The present invention will be described below in more detail with reference to examples, but the present invention is not limited thereto. In the following Examples and Comparative Examples, preparation of test pieces and evaluation of impact resistance, weld strength, heat resistance, equilibrium water absorption, hot water resistance, and chemical resistance were performed by the following methods.

Preparation of test piece : Using an 80-ton injection molding machine manufactured by Nissei Plastic Industry Co., Ltd., cylinder temperature 320
C. and a mold temperature of 150.degree. C., a test piece for evaluating impact resistance (64 mm.times.12.7 mm.times.3.2 mm), a JIS No. 1 dumbbell-type test piece for evaluating weld strength (weld portion at center) ), A test piece for heat resistance evaluation (1
28 mm × 12.7 mm × 6.2 mm), JIS No. 1 dumbbell-type test pieces for evaluating hot water resistance and chemical resistance were prepared. Further, using a compression molding machine manufactured by Shinto Metal Industry Co., Ltd., a temperature of 320 ° C. and a pressing pressure of 100 k
Under the condition of g / cm ² , a press sheet (50 mm × 50 mm × 0.2 mm) for evaluating the equilibrium water absorption was prepared.

Impact resistance : The notched Izod impact value was measured using the test piece prepared by the above method and using an Izod impact tester (manufactured by Toyo Seiki Seisaku-sho, Ltd.) in accordance with JIS K7110. .

Weld strength : Weld strength was measured by using an autograph (manufactured by Shimadzu Corporation) according to JIS K7113, using the test piece prepared by the above method.

Heat resistance : Using a test piece prepared by the above method, using a weighted strain temperature measuring device (manufactured by Toyo Seiki Seisaku-sho, Ltd.) in accordance with JIS K7207.
The load strain temperature (DTUL) was measured under a load of 6 kgf and used as an index of heat resistance.

Equilibrium water absorption : The test piece prepared by the above method was dried under reduced pressure for 5 days, weighed, immersed in water at 23 ° C. for 10 days, weighed, and immersed in the increased amount. The equilibrium water absorption was measured in proportion to the weight before.

Hot water resistance : A test piece prepared by the above method was placed in a small pressure vessel (manufactured by Tabai Espec Corp.)
After a steam treatment was performed at 20 ° C. and 2 atm for 120 hours, vacuum drying was performed at 120 ° C. for 120 hours. Using the test piece after the treatment, the tensile yield strength was measured using an autograph (manufactured by Shimadzu Corporation), and the retention of the test piece before the treatment with respect to the tensile yield strength was determined.

Chemical resistance : The test specimen prepared by the above method was immersed in methyl alcohol at 23 ° C. for 7 days, and then the tensile yield strength was measured using an autograph (manufactured by Shimadzu Corporation). The retention of the test piece before immersion with respect to the tensile yield strength was determined.

In the following Examples and Comparative Examples, the following polyamide resins and polyolefin resins were used.

[Polyamide resin] PA9T : composed of terephthalic acid units and 1,9-nonanediamine units, having a melting point of 317 ° C., an intrinsic viscosity [η] of 1.30 dl / g, and a terminal sealing rate of 90%. Polyamide resin.

PA9MT : terephthalic acid unit and 1,9
-Nonanediamine unit and 2-methyl-1,8-octanediamine unit (1,9-nonanediamine unit: 2-
When the molar ratio of methyl-1,8-octanediamine unit is 9
0:10), having a melting point of 308 ° C., an intrinsic viscosity [η] of 1.30 dl / g, and a terminal sealing rate of 90%.

PA6IT : terephthalic acid unit and isophthalic acid unit (the molar ratio of terephthalic acid unit: isophthalic acid unit is 70:30) and 1,6-hexanediamine unit, melting point is 310 ° C., intrinsic viscosity [η] Is 1.3
A polyamide resin having 0 dl / g and a terminal sealing rate of 90%.

[Polyolefin resin] PO-1 : glycidyl methacrylate-modified polyethylene (glycidyl methacrylate content: 10% by weight)

PO-2 : Acrylic acid-modified polyethylene (Acrylic acid content: 7% by weight, “Yukaron A201K” manufactured by Mitsubishi Yuka Co., Ltd.)

Examples 1 to 6 The polyamide resin and the polyolefin resin shown in Table 1 below were premixed in the proportions shown in Table 1 below, and then mixed in a twin-screw extruder (“TEX44C” manufactured by Nippon Steel Works Ltd.). The mixture was supplied, melt-kneaded under the condition of a cylinder temperature of 320 ° C., extruded, cooled and cut to produce pellets. A test piece was prepared using the obtained polyamide resin composition in the manner described above, and the results of impact resistance, weld strength, heat resistance, equilibrium water absorption, hot water resistance and chemical resistance were evaluated by the above-described methods. It is shown in Table 1 below.

[0048]

[Table 1]

COMPARATIVE EXAMPLES 1 TO 4 The polyamide resin and polyolefin resin shown in Table 2 below were used in the proportions shown in Table 2 below.
A polyamide resin composition was produced in the same manner as in Example 1. A test piece was prepared using the obtained polyamide resin composition in the manner described above, and the results of impact resistance, weld strength, heat resistance, equilibrium water absorption, hot water resistance and chemical resistance were evaluated by the above-described methods. It is shown in Table 2 below.

[0050]

[Table 2]

[0051]

The polyamide resin composition of the present invention is excellent in properties such as impact resistance, weld properties, heat resistance, low water absorption, hot water resistance, and chemical resistance.

 ──────────────────────────────────────────────────の Continued on the front page F term (reference) 4F071 AA04X AA14 AA14X AA22X AA30X AA33X AA55 AA78 AA88 AF01 AF02 AF04 AF23 AF45 AH07 AH12 AH17 BB02 BB03 BB04 BB05 BB06 BC01 BC17 4J002 BB0400G BB142 BB0400G

Claims (4)

[Claims] 1. A terephthalic acid unit having a content of 60 to 100 mol%
A polyamide resin (I) comprising a dicarboxylic acid unit (a) contained therein and a diamine unit (b) containing 60 to 100 mol% of 1,9-nonanediamine unit and / or 2-methyl-1,8-octanediamine unit. And a polyolefin resin (II) having an epoxy group in the molecule, wherein the weight ratio of the polyamide resin (I) to the polyolefin resin (II) is 99:
A polyamide resin composition, wherein the ratio is 1 to 50:50. 2. The polyamide resin composition according to claim 1, wherein the polyolefin resin (II) is a polyolefin resin modified with glycidyl acrylate and / or glycidyl methacrylate. 3. The intrinsic viscosity of the polyamide resin (I) is as follows:
The polyamide resin composition according to claim 1, wherein the composition is 0.6 to 2.0 dl / g. 4. A molded article comprising the polyamide resin composition according to claim 1.