JP2007211090A - Molding resin composition and molding obtained therefrom - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding resin composition which is a resin composition for forming a molding as an electronic component or a mechanical part and is capable of forming a molding having heat resistance high enough to withstand reflow in the case where a lead-free solder is used and having high rigidity and high impact resistance and to provide a molding formed from the resin composition, having excellent heat resistance, high rigidity, and high impact resistance, and used as electronic components or mechanical parts. <P>SOLUTION: Provided are a resin composition comprising 100 pts.wt. polyamide resin based on an aromatic polyamide resin, 0.02 to 20 pts.wt. functional-group-containing polyolefin resin, and 0.1 to 10 pts.wt. functional-group-containing crosslinking agent and a molding produced by molding the resin composition and crosslinking the obtained product by heating or by irradiation with an actinic radiation. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is a curable (crosslinkable) resin composition that forms a high-rigidity molded body used for insulating molded parts and mechanical parts used for electronic parts, etc., and has high heat resistance, rigidity, and impact resistance. The present invention relates to a resin composition for molded articles having properties. The present invention also relates to a molded article formed from this resin composition and used for electronic parts, mechanism parts, and the like.

  Along with the downsizing, thinning, and high functionality of electronic devices, the level of demand for electronic components such as semiconductor elements such as LSI and IC, resistors, capacitors, inductor bobbins, connectors, etc., has increased. For example, molding materials used for surface-mount type terminal connectors require high heat resistance (reflow heat resistance) that can withstand solder reflow temperatures for component mounting, and high rigidity to guarantee insertion and removal as a connector. In addition, high impact resistance is also required. Furthermore, in recent years, due to environmental problems, the use of lead-free solder instead of lead-based solder has been demanded, and the required level of reflow heat resistance has become increasingly sophisticated.

  In order to satisfy these requirements, for example, in JP-A-5-51529 (Patent Document 1), an amorphous polyamide resin is added to nylon 4 and 6, and a functional group-containing olefin polymer is further used as a compatibilizing agent. A blended resin composition has been proposed. However, the amorphous polyamide resin and the functional group-containing olefin polymer are components having a lower rigidity than nylon 4 and 6, and simply adding them reduces the rigidity of the molded product, resulting in poor heat resistance. It is enough. In addition, when trying to increase the rigidity by adding only the cross-linking agent, it is necessary to add a large amount of cross-linking agent in order to obtain heat resistance that can withstand the reflow conditions of lead-free solder. This is not practical because it causes a decrease in the temperature and the crosslinking of the crosslinking agent becomes impossible due to thermal crosslinking.

Further, in JP-A-11-21446 (Patent Document 2) and JP-A-11-21448 (Patent Document 3), it is proposed to improve impact resistance by blending a polyolefin elastomer with a metallocene catalyst into polyamide. Has been. However, the polyolefin elastomer is a component having a lower rigidity than that of the polyamide, so that the rigidity of the molded body is also lowered and the heat resistance is also lowered.
JP-A-5-51529 Japanese Patent Laid-Open No. 11-21446 Japanese Patent Laid-Open No. 11-21448

  The present invention is a curable resin composition (molding material) for forming an insulating molded body used for electronic parts and the like, a high-rigidity molded body used for mechanical parts, and the like, and is reflowed using lead-free solder. A resin composition for molded bodies that can form a molded body having high rigidity and high impact resistance as well as excellent heat resistance that can withstand, and excellent heat resistance formed by the resin composition, It is an object of the present invention to provide a molded body having high rigidity and high impact resistance, for example, an insulating molded body for electronic parts and a high-rigidity molded body for mechanical parts.

  As a result of diligent research, the present inventor is composed of a polyamide resin mainly composed of an aromatic polyamide, a functional group-containing polyolefin resin, a functional group-containing crosslinking agent, and an inorganic filler, and the composition of the resin composition is within a predetermined range. By forming a molded body from the product and then crosslinking between the components in this resin composition, it was found that a molded body having excellent heat resistance and high rigidity and high impact resistance can be obtained, The present invention has been completed.

  That is, the present invention comprises 0.02 to 20 parts by weight of a functional group-containing polyolefin resin and 0.1 to 10 parts by weight of a functional group-containing crosslinking agent with respect to 100 parts by weight of a polyamide resin mainly composed of an aromatic polyamide resin. A resin composition characterized by being blended is provided (claim 1).

  Here, “mainly composed of an aromatic polyamide resin” means that the content of the aromatic polyamide resin is the largest. Therefore, other polyamide resins may be contained in the range where the content of the aromatic polyamide resin is the largest.

  Examples of the aromatic polyamide resin include polyamide 6T, polyamide 9T, MXD and the like. Furthermore, an aramid known by a registered trademark such as Kevlar is also included in the aromatic polyamide resin referred to herein. Examples of the other polyamide resins include aliphatic polyamide resins known by registered trademarks, trade names and common names such as polyamide 6 and polyamide 66, n-nylon and n, m-nylon.

  Aromatic polyamide resin itself has high heat resistance and is a promising material as a lead-free reflow material. By using an aromatic polyamide resin, excellent heat resistance that can sufficiently withstand the reflow conditions of lead-free solder can be easily obtained.

  On the other hand, since the aromatic polyamide resin has the property of stabilizing radicals generated during crosslinking, it was difficult to obtain high crosslinkability, but the resin composition having the constitution of the present invention As a result, high crosslinkability can be obtained. That is, the present inventor has found that by adopting the configuration of the present invention, a molded body that fully utilizes the characteristics of the aromatic polyamide-based resin can be obtained, and as a result, higher heat resistance and more Excellent rigidity and impact resistance can be obtained.

  The functional group-containing polyolefin resin which is a constituent component of the resin composition of the present invention is a copolymer having a functional group that reacts with an olefin unit and an amino group and / or a carboxyl group (such as at a terminal) of a polyamide resin. This functional group-containing polyolefin resin further contains, for example, a vinyl compound in the main chain, and can also be graft polymerized as a side chain.

  Examples of the olefin constituting the functional group-containing polyolefin resin include ethylene, propylene, butene, pentene, hexene, heptene, methylbutene, and methylpentene, and ethylene and propylene are preferable.

  Examples of the functional group that this functional group-containing polyolefin resin contains and reacts with the amino group and / or carboxyl group of the polyamide resin include an acid anhydride group, an epoxy group, a carboxyl group, an oxazoline group, and an amino group. Claim 2 corresponds to an embodiment having at least one functional group selected from the exemplified functional groups. Among these, an acid anhydride group and an epoxy group are preferable.

  Among the compounds having a functional group constituting this functional group-containing polyolefin resin, typical examples of the carboxyl group-containing compound include acrylic acid, methacrylic acid, maleic acid, etc. Specific examples include maleic anhydride and itaconic anhydride, and representative examples of the epoxy group-containing compound include glycidyl methacrylate and allyl glycidyl ether.

  The functional group-containing polyolefin resin chemically reacts with an amino group or a carboxyl group at a polyamide resin terminal or the like. By blending a functional group-containing polyolefin resin, it is possible to obtain a crosslinked state through the polyolefin resin chemically bonded to the polyamide resin, which is difficult to crosslink, and the rigidity, impact resistance, and heat resistance at high temperatures can be obtained. The sex becomes higher.

  The compounding quantity of functional group containing polyolefin resin is 0.02-20 weight part with respect to 100 weight part of polyamide resins. If the blending amount is less than 0.02 parts by weight, the crosslinking is not sufficient and the heat resistance is inferior. If it exceeds 20 parts by weight, the rigidity decreases from room temperature to high temperature, which is not preferable.

  The functional group-containing crosslinking agent that is a constituent of the resin composition of the present invention is a compound having a functional group that reacts with an amino group and / or a carboxyl group of a polyamide resin.

  Examples of such functional group-containing crosslinking agents include methacrylates such as ethylene dimethacrylate, polyethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, hexamethylene diallyl nadiimide, monoallyl diglycidyl isocyanurate, diallyl itaconate, diallyl phthalate, Allyl compounds such as diallyl isophthalate, diallyl monoglycidyl isocyanurate, triallyl cyanurate, triallyl isocyanurate, N, N′-m-phenylene bismaleimide, N, N ′-(4,4′-methylenediphenylene ) Maleimide compounds such as dimaleimide. These may be used alone or in combination.

  Examples of the functional group containing this functional group-containing crosslinking agent and reacting with the amino group and / or carboxyl group of the polyamide resin include an acid anhydride group, an epoxy group, a carboxyl group, an oxazoline group, and an amino group. Claim 3 corresponds to an embodiment having at least one functional group selected from these exemplified functional groups. Among these, an acid anhydride group and an epoxy group are preferable.

  The compounding quantity of a functional group containing crosslinking agent is 0.1-10 weight part with respect to 100 weight part of polyamide resins. If the blending amount is less than 0.1 parts by weight, the crosslinking is not sufficient and the heat resistance is inferior. If it exceeds 10 parts by weight, the rigidity decreases from room temperature to high temperature, which is not preferable.

  The resin composition of the present invention preferably further contains 1 to 200 parts by weight of an inorganic filler with respect to 100 parts by weight of the polyamide resin.

  This inorganic filler acts to increase the rigidity of the molded body, such as glass fiber, carbon fiber, graphite fiber, calcium carbonate, talc, catalbo, wollastonite, silica, alumina, silica alumina, diatomaceous earth, clay. , Calcined clay, kaolin, mica (fine mica), granular glass, glass flake, glass balloon (hollow glass), gypsum, bengara, metal fiber, titanium dioxide, potassium titanate whisker, magnesium oxide, calcium silicate, aluminate Examples thereof include sodium, calcium aluminate, aluminum, aluminum oxide, aluminum hydroxide, copper, stainless steel, zinc oxide, and metal whisker. Examples of the shape include, but are not particularly limited to, a fiber shape, a powder shape, a granular shape, a plate shape, a needle shape, a cloth shape, and a mat shape. Only one type of inorganic filler may be used, but two or more types may be used in combination.

  If the added amount of the inorganic filler is less than 1 part by weight relative to 100 parts by weight of the polyamide resin, the rigidity at high temperature is inferior, and if it exceeds 200 parts by weight, there is a problem in workability, particularly extrusion moldability and injection moldability. .

  When an inorganic filler that has been surface-treated with a surface treatment agent having a functional group that reacts with an amino group and / or a carboxyl group of the polyamide resin is used, each of the functional groups causes the polyamide resin, polyolefin resin, Since it is chemically bonded to the agent, more crosslinking points can be formed, and heat resistance, rigidity and impact resistance during reflow can be further improved, which is preferable. Claim 5 corresponds to this preferable mode.

  Examples of the functional group containing a surface treatment agent and reacting with the amino group and / or carboxyl group of the polyamide resin include an acid anhydride group, an epoxy group, a carboxyl group, and an amino group.

  In the resin composition of the present invention, other components such as pigments, dyes, colorants, organic reinforcing agents, heat resistance agents, stabilizers typified by copper compounds and hindered phenol compounds, etc. are used as long as the effects are not impaired. Antioxidants, photoprotective agents, weathering agents, light stabilizers, crystal nucleating agents, lubricants, mold release agents, plasticizers, antistatic agents and the like can be added and introduced.

  The present invention further provides a molded article produced by molding the resin composition, followed by heating or irradiation with high energy rays to crosslink the resin composition (Claim 6). .

  In the production of the molded body, the resin composition is molded before crosslinking. Since it is before cross-linking, molding is easy. As the molding method, injection molding, extrusion molding or the like can be employed.

  After molding, crosslinking between the components of the resin composition is performed. That is, the functional group-containing polyolefin resin or the functional group of the functional group-containing crosslinking agent, and further the inorganic filler is subjected to a surface treatment with a surface treatment agent having a functional group that reacts with the amino group and / or carboxyl group of the polyamide resin. If it is, the functional group reacts with the amino group and / or carboxyl group of the polyamide resin, and the rigidity, heat resistance, and impact resistance are further improved.

  Crosslinking is performed by heating the molded body or irradiating the molded body with high energy rays. The resin composition of the present invention has high crosslinkability and is easily crosslinked by irradiation with heat or high energy rays. Examples of the high energy rays include radiation such as electron beams, γ rays, and ultraviolet rays. Irradiation with high energy rays is preferable because it is easy to control the degree of crosslinking.

  By setting the resin composition to the configuration of the present invention, the crosslinkability is enhanced. As a result, molding with this resin composition, followed by cross-linking the molded body, has excellent heat resistance, high rigidity, and high impact resistance that can withstand reflow using lead-free solder For example, an insulating molded body suitable for electronic parts can be obtained. In addition, since this molded body has high rigidity, impact resistance, and excellent heat resistance that can be substituted for metals used in gears, bushes, etc., a high rigidity molded body suitable for mechanical parts can be obtained. Can do.

  Next, the best mode for carrying out the present invention will be described with reference to examples. In addition, this invention is not limited to the Example described here, As long as the meaning of this invention is not impaired, the change to another form is also possible.

  Based on the formulation shown in Tables 1 to 3 using the materials shown below, resin compositions were obtained. The compounding amounts in Tables 1 to 3 are all parts by weight.

[Polyamide resin]
Polyamide 9T: Product name “Genesta G2330” manufactured by Kuraray Co., Ltd., PA9T in the table.
MXD: Product name “Lenny 1032” manufactured by Mitsubishi Engineering Plastics Co., Ltd., MXD in the table.
Semi-aromatic polyamide containing 60% by weight of glass fiber: Product name “Grivory GV-6H” manufactured by EMS Co., Ltd.

[Functional group-containing polyolefin resin]
Ethylene / acrylic acid ester / maleic anhydride terpolymer: manufactured by Sumika Atfina Co., Ltd., trade name “Bondaine AX8390”, which is Bondine in the table.
Glycidyl group-containing polyolefin: product name “LOTADER3410” manufactured by Atofina, and LOTADER in the table.
Carboxyl group-containing polyolefin: Made by Mitsui DuPont Polychemical Co., Ltd., trade name “Nucrel 0903HC”, in the table, “Nucrel”.

[Functional group-containing crosslinking agent]
Diallyl monoglycidyl isocyanurate: manufactured by Shikoku Kasei Kogyo Co., Ltd.
Monoallyl diglycidyl isocyanurate: Shikoku Kasei Kogyo Co., Ltd.

[Inorganic filler]
Amino-treated glass fiber: manufactured by Central Glass Co., Ltd., trade name “ECS03T-289 / PL”, and 289 / PL in the table.
Glycidyltrimethoxysilane-treated glass fiber: manufactured by Central Glass Co., Ltd., trade name “ECS03 / KBE-403”, and in the table, KBE-403.
Amino-treated glass fiber: manufactured by Central Glass Co., Ltd., trade name “ECS03T-187 / PL”, and 187 / PL in the table.

  After molding, irradiation was performed with an electron beam having an irradiation amount shown in Tables 1 to 3 to perform crosslinking. Thereafter, storage elastic modulus (30 ° C., 350 ° C.), reflow heat resistance, rigidity, and impact resistance were measured by the following methods. The results are shown in Tables 1 to 3.

[Measurement method]
Storage elastic modulus: A value measured at a rate of temperature increase of 10 ° C./min using a viscoelasticity measuring device (DVA-200 manufactured by IT Measurement Control Co., Ltd.).
Reflow heat resistance: Heat treatment at 270 ° C. for 10 minutes, and measurement of abnormalities such as deformation and foaming. Evaluated as “○” when no abnormality was observed, and “X” when abnormality was observed.
Rigidity: A value obtained by measuring a flexural modulus in accordance with ASTM D-790.
Impact resistance: A value obtained by measuring an Izod impact test (notched) in accordance with ASTM D-256.

From the results of Tables 1 and 2, the molded articles of the examples produced by molding the resin composition of the present invention and then crosslinking the resin composition show a high storage elastic modulus over 30 to 350 ° C., and exhibit rigidity and impact resistance. It has been shown to be excellent. On the other hand, it is clear from the results in Table 3 that the molded products of Comparative Examples 1 to 4 in which the amount of the polyolefin resin and the amount of the crosslinking agent are smaller than the range of the present invention have insufficient reflow heat resistance. Further, the molded articles of Comparative Examples 5 and 6 in which the amount of polyolefin resin and the amount of crosslinking agent exceed the range of the present invention have a low storage elastic modulus. Moreover, the impact resistance of Comparative Example 5 is greatly reduced compared to Example 4 and the like. Also in Comparative Example 7 in which the inorganic filler was added excessively, the impact resistance was significantly reduced.

Claims (6)

  0.02 to 20 parts by weight of a functional group-containing polyolefin resin and 0.1 to 10 parts by weight of a functional group-containing crosslinking agent are blended with 100 parts by weight of a polyamide resin mainly composed of an aromatic polyamide resin. A resin composition characterized by the above.   The functional group-containing polyolefin resin has one or a plurality of functional groups selected from an acid anhydride group, an epoxy group, a carboxyl group, an oxazoline group, and an amino group. Resin composition.   The functional group-containing crosslinking agent has one or more functional groups selected from an acid anhydride group, an epoxy group, a carboxyl group, an oxazoline group, and an amino group. 2. The resin composition according to 2.   Furthermore, 1-200 weight part of inorganic fillers are mix | blended, The resin composition in any one of the Claims 1 thru | or 3 characterized by the above-mentioned.   The inorganic filler is subjected to a surface treatment with a surface treatment agent having a functional group that reacts with an amino group and / or a carboxyl group of a polyamide resin. The resin composition as described. A molded article produced by molding the resin composition according to any one of claims 1 to 5 and then crosslinking the resin composition by heating or irradiation with high energy rays.