JP2000183036A - Method and device for removing resist - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for removing a resist, wherein a resist pattern on an article is surely peeled and removed using an adhesive tape. SOLUTION: By etching in a pre-etching process, a least-adhesive layer having poor affinity with respect to the adhesive agent of an adhesive tape is formed uniformly on the surface of a resist pattern on a wafer W. A transfer unit 15 carries the wafer W out of a cassette C1 with a robot arm 14 and inserts it in a pre-process unit 3. In the pre-process unit 3, the wafer W is irradiated with ultraviolet rays for decomposition and modification of the least adhesive layer on the surface of resist pattern, enhancing the affinity to adhesive agent of the adhesive tape. The wafer W is carried to a resist removal part 2 by the transfer unit 15. At the resist removal part 2, the adhesive tape is pasted/ peeled from the wafer W, so that a resist pattern on the wafer W is surely peeled and removed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for removing resist by using an adhesive tape to remove a resist pattern of an etched article in the production of microfabricated articles such as semiconductor wafers, various printed boards and various masks. About.

[0002]

2. Description of the Related Art In recent years, when patterning an oxide film (SiO ₂ ) or a nitride film (Si ₃ N ₄ ) formed on a semiconductor wafer, for example, a predetermined resist pattern is formed on the wafer. Later, a method is employed in which an oxide film or a nitride film exposed from the resist pattern is etched with a reactive gas such as C ₂ F ₆ or CF ₄ . After the etching, the resist pattern formed on the semiconductor wafer becomes unnecessary. Therefore, in order to remove the resist pattern, plasma ashing is performed with a reactive gas such as O ₂ .

[0003] However, the above-described resist pattern removal processing by plasma ashing requires a long time, and the impurities contained in the resist are injected into the semiconductor wafer during the processing. .
Therefore, in order to solve this problem, a resist removal method of peeling and removing the resist pattern from the semiconductor wafer by attaching the adhesive tape to the surface of the resist pattern on the semiconductor wafer and then peeling the adhesive tape from the semiconductor wafer. Has been implemented.

[0004]

However, the prior art having such a structure has the following problems. At the time of etching, which is a pre-process, a component containing F such as F (fluorine) or CF (fluorocarbon) of a reactive gas enters the surface of the resist pattern on the semiconductor wafer, so that the surface of the resist tape has an adhesive tape. The hardly adherent layer having poor affinity with the adhesive is formed unevenly.
When a pressure-sensitive adhesive tape is stuck on the surface of the resist pattern in which the hardly-adhesive layer is unevenly formed, in the stuck surface,
Unevenness occurs in the adhesive strength between the adhesive tape and the resist pattern. In this state, when the adhesive tape is peeled off and the resist pattern on the semiconductor wafer is peeled off, there is a problem that the resist pattern of the adhesive strength portion with the adhesive tape remains without being peeled off from the semiconductor wafer. is there.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resist removing method and a resist removing method capable of reliably removing and removing a resist pattern on an article by using an adhesive tape. And

[0006]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is a method for removing a resist pattern on an article after etching with an adhesive tape, wherein the resist pattern is formed on the surface of the resist pattern on the article by a reactive gas at the time of etching. Modifying and decomposing the hard adhesive layer, and increasing the affinity of the adhesive tape with the adhesive, and applying the adhesive tape to the surface of the resist pattern on the article where the hard adhesive layer has been modified and decomposed. The method further comprises a step of attaching, and a step of peeling off the adhered adhesive tape from the article and peeling and removing the resist pattern from the article.

According to a second aspect of the present invention, in the method for removing a resist according to the first aspect, the hard-adhesive layer is a fluorine-based depot layer, and the step of modifying and decomposing the hard-adhesive layer includes the step of: This is a step of irradiating the surface of the resist pattern on the etched article on which the fluorine-based deposit layer is formed with ultraviolet rays.

According to a third aspect of the present invention, in the method for removing a resist according to the first aspect, the hard-adhesive layer is a fluorine-based depot layer, and the step of modifying and decomposing the hard-adhesive layer includes the step of: This is a process of humidifying the surface of the resist pattern on the etched article on which the fluorodeposit layer has been formed.

According to a fourth aspect of the present invention, there is provided a resist removing apparatus for removing a resist pattern on an article after etching with an adhesive tape, wherein the resist pattern is formed on a surface of the resist pattern on the article by a reaction gas at the time of etching. A modifying / decomposing means for modifying / decomposing the hard-adhesive layer, thereby enhancing the affinity of the pressure-sensitive adhesive tape with the pressure-sensitive adhesive; and a surface of a resist pattern on the article on which the hard-adhesive layer has been modified / decomposed. And a tape peeling means for peeling off the pressure-sensitive adhesive tape from the article and peeling and removing the resist pattern from the article.

According to a fifth aspect of the present invention, in the resist stripping apparatus according to the fourth aspect, the hard-adhesive layer is a fluorine-based deposit layer, and the modifying / decomposing means is provided on the article after the etching. UV irradiation means for irradiating the surface of the resist pattern with UV light.

According to a sixth aspect of the present invention, in the resist stripping apparatus according to the fourth aspect, the hard-adhesive layer is a fluorine-based depot layer, and the means for modifying / decomposing the hard-adhesive layer is provided after the etching. Humidifying means for humidifying the surface of the resist pattern on the article.

[0012]

The operation of the first aspect of the invention is as follows. By the etching in the previous step, a hard-to-adhere layer having poor affinity with the adhesive of the adhesive tape is formed on the surface of the resist pattern on the article. The formed adhesive layer is modified and decomposed to increase the affinity of the adhesive tape with the adhesive. An adhesive tape is attached to the surface of the resist pattern in which the hard adhesive layer has been modified and decomposed. The pressure-sensitive adhesive tape and the resist pattern adhered in this manner ensure substantially uniform adhesive strength in the surface to which the adhesive tape is adhered. When the adhered adhesive tape is peeled off from the article, the resist pattern on the article is reliably peeled off together with the adhesive tape to be peeled off.

According to the second aspect of the present invention, the surface of the resist pattern on the article after the etching is irradiated with ultraviolet rays. By the irradiation of the ultraviolet rays, the fluorine-based depo layer formed on the surface of the resist pattern is modified and decomposed by the reaction gas at the time of etching, and the adhesive of the pressure-sensitive adhesive tape is formed at the portion where the fluorine-based depo layer was formed. Affinity increases. As a result, the resist pattern on the article is reliably removed and removed by the adhesive tape.

According to the third aspect of the present invention, the surface of the resist pattern on the article after the etching is humidified. This humidification modifies and decomposes the fluorine-based deposit layer formed on the surface of the resist pattern by the reaction gas during etching, and the affinity of the adhesive tape with the adhesive of the adhesive tape at the portion where the fluorine-based deposit layer was formed. The nature increases. As a result, the resist pattern on the article is reliably removed and removed by the adhesive tape.

The operation of the invention described in claim 4 is as follows. By the etching in the previous step, a hard-to-adhere layer having poor affinity with the adhesive of the adhesive tape is formed on the surface of the resist pattern on the article. The reforming / decomposing means modifies and decomposes the hard adhesive layer to increase the affinity of the adhesive tape with the adhesive. Since the tape sticking means sticks the adhesive tape to the surface of the resist pattern in which the hardly-adhesive layer has been modified and decomposed, it can be stuck on the sticking surface with substantially uniform adhesive strength. The tape peeling means peels off the adhesive tape from the article. By this peeling, the resist pattern is reliably peeled off from the article.

According to the fifth aspect of the present invention, the ultraviolet irradiation means irradiates the surface of the ragged pattern on the article after etching with ultraviolet light. Thereby, the fluorine-based deposition layer formed on the surface of the resist pattern is modified and decomposed by the reaction gas at the time of etching, and the affinity of the pressure-sensitive adhesive tape with the pressure-sensitive adhesive is increased.

According to the invention described in claim 6, the humidifying means humidifies the surface of the ragged pattern on the article after the etching. Thereby, the fluorine-based deposition layer formed on the surface of the resist pattern is modified and decomposed by the reaction gas at the time of etching, and the affinity of the pressure-sensitive adhesive tape with the pressure-sensitive adhesive is increased.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. An overall configuration of an apparatus according to an embodiment will be described with reference to FIGS. FIG. 1 is an overall plan view schematically showing the apparatus, and FIG. 2 is an overall front view thereof. FIG. 2 shows a base wall 19 to be described later in a see-through manner for convenience of explanation.

In order to facilitate the following understanding, a resist removing apparatus and a wafer W according to the present embodiment will be briefly described. The resist removing apparatus according to the present embodiment uses a semiconductor wafer W (hereinafter simply referred to as “wafer W”) with an adhesive tape.
This is an apparatus for peeling off and removing the resist pattern formed thereon. The wafer W from which the resist pattern is peeled and removed by the resist removing apparatus has a hard-adhesion layer, which is a by-product of etching in the previous step, formed on the surface of the resist pattern. Specifically, a resist pattern is formed on the surface of the wafer W in order to pattern the oxide film (SiO ₂ ), the nitride film (Si ₃ N ₄ ), and the like formed on the wafer W. Further, an oxide film or the like on the wafer W is etched by a reaction gas (for example, CF ₄ , C ₂ F ₆ or the like). At this time, a component containing a reactive gas component for etching, such as F (fluorine) or CF (fluorocarbon), enters the surface of the resist pattern on the wafer W, so that the affinity for the adhesive of the adhesive tape with the adhesive is obtained. A poorly-adhesive layer having poor properties, for example, a fluorine-based deposition layer is formed unevenly. Here, the fluorine-based deposition layer refers to a layer containing the element symbol “F”, for example,
Fluorocarbons such as “CF” are also included. In order to reliably remove and remove the resist pattern on which the fluorine-based deposit layer has been formed from the wafer W, the resist removing apparatus of the present embodiment is configured.

As shown in FIG. 1, the resist removing apparatus according to the present embodiment transports a wafer W after etching, which is covered with a resist pattern, and a wafer W after the resist pattern is peeled off. Or a transfer / pre-processing unit 1 for performing pre-processing on a wafer W covered with a resist pattern including a fluorine-based deposit layer, and attaching / detaching an adhesive tape to / from the wafer W to form a wafer W A resist removing section 2 for peeling and removing the resist pattern is provided. The transport / pre-processing section 1 and the resist removing section 2 are elongated holes 19a (see FIG. 2) which enable the transfer of the wafer W to each other.
Are provided on the base 10 across the base wall 19 provided with the base. The resist removing unit 2 corresponds to a tape attaching unit and a tape removing unit according to the present invention.

Hereinafter, the structure of the transport / pre-processing unit 1 will be described, and then the structure of the resist removing unit 2 will be described.

The transfer / pre-processing unit 1 is a first storage unit in which the etched wafers W covered with the resist pattern are stacked and stored.
First cassette stage 11 on which cassette C1 is loaded
A pre-processing unit 3 for performing pre-processing on the wafers W unloaded from the first cassette C1, an alignment stage 12 for positioning the wafers W before being loaded into the resist removing unit 2, and a resist removing unit 2 A second cassette stage 13 in which a second cassette C2 for stacking and storing wafers W from which patterns have been removed is loaded, and a transfer unit 15 having a robot arm 14 for transferring the wafer W by bending and stretching. I have.

As shown in FIG. 1, the first cassette stage 11 is installed on the right side in front of the base 10 of the transport / pre-processing unit 1. The first cassette stage 11 includes a turntable 16 rotatably installed, and a first cassette C1 for stacking and storing wafers W in a horizontal posture with the surface covered with the resist pattern facing upward is mounted on the turntable 16. Removably attached. After the first cassette C1 is loaded on the turntable 16, the turntable 16 is rotated so that the wafer carry-out port C1a faces the transfer unit 15.

The second cassette stage 13 constructed in the same manner as the first cassette stage 11 is installed on the left side in front of the base 10, and the second
When the cassette C2 is loaded, its wafer loading port C2a
The turntable 17 is rotated such that the.

The pre-processing unit 3 is installed on the back side of the second cassette stage 13 and modifies the fluorine-based deposition layer formed on the surface of the resist pattern on the wafer W unloaded from the first cassette C1. The process of disassembling and increasing the affinity of the pressure-sensitive adhesive tape for use in the resist removing section 2 described later with the pressure-sensitive adhesive. The pre-processing unit 3 will be described in detail with reference to FIG.

As shown in FIG. 3, the pre-processing unit 3
A housing 33 that forms a substantially closed space, a shutter 34 that opens and closes an opening surface of the housing 33, and an air cylinder 36 that moves the shutter 34 up and down through a rod 35
And a chuck 37 for sucking and holding the wafer W carried into the housing 33, a rotating mechanism 38 for rotating the chuck 37 around the axis, and a reforming / irradiating apparatus for irradiating the wafer W held by the chuck 37 with ultraviolet rays. And an ultraviolet irradiation unit 39 for decomposition. The reforming / decomposing ultraviolet irradiation unit 39 corresponds to the ultraviolet irradiation means in the present invention.

The shutter 34 is connected to a rod 35 provided on the air cylinder 36. Shutter 34
When the rod 35 is driven to expand and contract by the air cylinder 36, the rod 35 moves up and down with the expansion and contraction. With this elevating operation, the opening surface provided in the housing 33 is opened and closed.

The chuck 37 is connected to a vacuum evacuation line (not shown), and holds the wafer W mounted on the chuck 37 by suction.

The rotating mechanism 38 includes a rotating shaft 38a connected and connected to the chuck 37, a pulley 38b fixed to the rotating shaft 38a, an electric motor 38e, and a pulley 38d fixed to the shaft of the electric motor 38e. And an endless belt 38c that wraps the pulley 38b and the pulley 38d in an interlockable manner. The rotating mechanism 38 controls the electric motor 38e when irradiating ultraviolet rays from a reforming / decomposing ultraviolet irradiation unit 39 described later. The pulley 38 is driven by rotation.
The chuck 37 is rotated by rotating d and transmitting the torque to the pulley 38b via the endless belt 38c.

The reforming / decomposing ultraviolet irradiation unit 39 includes:
It is mounted on the ceiling of the housing 33 and has an ultraviolet lamp 39a inside. The UV lamp 39a
Is emitted from the ceiling surface of the housing 33 into the inside thereof through an infrared cut filter 39b provided on the lower surface of the reforming / decomposing ultraviolet irradiation unit 39. The infrared cut filter 39b removes infrared wavelength components contained in ultraviolet light from the ultraviolet lamp 39a. This prevents the wafer W sucked and held by the chuck 37 from being heated by the ultraviolet light incident into the housing 33.

The alignment stage 12 is disposed on the back side of the first cassette stage 11 and, before the wafer W is transferred from the transfer / pre-processing unit 1 to the resist removing section 2, an orientation flat or notch of the wafer W is provided. Is optically detected to align the position of the wafer W.

The transport unit 15 is located substantially at the center of the base 10 and is constructed by mounting a robot arm 14 that can be bent and rotated on an arm base 18a that is driven up and down by a lifting mechanism 18 (see FIG. 2). ing. The robot arm 14 is connected to the first cassette C1 of the first cassette stage 11.
In order to support and take out the wafers W stacked and housed therein from the lower surface thereof, the tips are formed in a thin plate shape.
The transfer unit 15 transfers the wafer W in the transfer / pre-processing unit 1. Specifically, the transport unit 15 transports the wafer W taken out of the first cassette C1 to the pre-processing unit 3, from the pre-processing unit 3 to the alignment stage 12, from the alignment stage 12 to the resist removing unit 2, and further, Resist remover 2
The wafer W from which the resist pattern has been stripped and removed from the second cassette C2 of the second cassette stage 13
Laminate and store in order.

Hereinafter, the configuration of the resist removing section 2 will be described. The resist removing unit 2 includes a tape supply unit 4 that supplies an adhesive tape T wound around a tape roll 20, an attaching table 30 that holds the wafer W when the adhesive tape T is attached to the wafer W, and a wafer W. A sticking / peeling table unit 5 for integrally moving a peeling table 31 holding the wafer W when the adhesive tape T is peeled;
A tape sticking unit 60 for sticking the adhesive tape T on the surface of the wafer W held on the sticking table 30 and a tape peeling unit 61 for peeling the adhesive tape T from the surface of the wafer W held on the peeling table 31 The apparatus includes a tape attaching / peeling unit 6 that is moved independently, and a tape collecting unit 7 that collects the adhesive tape T peeled off from the surface of the wafer W.

As shown in FIG. 2, the tape supply section 4 is located on the right back side of the base wall 19, and is a tape roll formed by laminating an ultraviolet-curable adhesive tape T on a strip-shaped separator S and winding it. 20 is configured by being inserted into a rotating shaft 21 that is horizontally installed rotatably on the base wall 19. Below the tape roll 20, a fixed roller 22 and a sandwiching roller 23 oscillated and biased by the fixed roller 22 are arranged side by side. On the left side of these rollers 22, 23, a peeling roller 24 for peeling the separator S from the adhesive tape T is cantilevered at the tip of an arm 25 swinging around a point a on the horizontal axis. By the swing of the peeling roller 24, the adhesive tape T is sent out while always keeping the tension of the adhesive tape T drawn out of the tape roll 20 and bypassing the sandwiching roller 23 constant, and the tape sticking unit 6 described later.
0. Tape roll 20
A separator collecting roll 26 that winds up the separator S that has been sharply folded by the peeling roller 23 and peeled off is inserted into a rotary shaft 27 that is horizontally installed on the base wall 19. The rotating shaft 27 is connected to a motor (not shown) in an interlocking manner, and feeds the adhesive tape T by winding and driving the separator S, and supplies the adhesive tape T to the tape attaching unit 60. In addition, separator collection roll 2
A fixed roller 28 for guiding and supporting the separator S between the peeling roller 23 and the separator collecting roll 26 is provided in front of the left side of 6.

Further, the structure of the sticking / peeling table section 5 will be described with reference to FIG. FIG. 4 is a front view of the sticking / peeling table section 5. The sticking / peeling table section 5
A pasting table 30, a peeling table 31, a pasting table elevating drive mechanism 40 for moving the pasting table 30 up and down between a pasting / peeling processing position A and a standby position B, and a pasting / peeling processing position A A peeling table elevating drive mechanism 41 that moves up and down between the standby position B and a sticking / peeling table that horizontally moves the sticking table 30 and the peeling table 31 integrally between the first processing position C and the second processing position D A horizontal drive mechanism 50 is provided. The sticking / peeling processing position A is set at the sticking table 30.
And the release table 31 are connected to air cylinders 42, 4 described later.
3 is a position raised by the extension operation. Standby position B
Is a position where the attaching table 30 and the peeling table 31 are lowered by the contraction operation of the air cylinders 42 and 43. The first processing position C is a position of the sticking table 30 shown in FIG. The second processing position D is a position of the peeling table 31 indicated by a solid line in FIG.

The sticking / peeling table horizontal drive mechanism 50 includes:
A screw shaft 54 laid horizontally on a base plate 53 juxtaposed behind the base wall 19, a motor 55 connected to the screw shaft 54 to rotate the screw shaft 54, and a screw shaft 54. It is composed of a pair of front and rear slide rails 56 and a pair of left and right movable members 57 and 58 slidable along the slide rails 56 and threaded through the screw shaft 54.

The movable members 57 and 58 are provided with air cylinders 42 and 43, respectively.
The sticking table 30 is horizontally fixed to the rod end of the second rod, and the peeling table 31 is horizontally fixed to the rod end of the air cylinder 43. The part including the air cylinder 42 corresponds to the above-described sticking table elevating drive mechanism 40, and the part including the air cylinder 43 corresponds to the above-described peeling table elevating drive mechanism 41. Also, there is a slide space on the left side of the second processing position D, so that the application table 30 reciprocates between the first processing position C and the second processing position D by the motor 55. The table 31 is horizontally driven integrally.

At the center of the attaching table 30, a suction pad 44 for moving the wafer W up and down is provided.
A suction pad 45 for moving the wafer W up and down is buried in the central portion of the device 1 via an air cylinder (not shown). Further, a heater (not shown) is built in the sticking table 30, and is usually heated to about 80 to 150 ° C. The adhesive tape T stuck on the wafer W sucked and held on the sticking table 30 by the heating of the heater
Is softened, the pressure-sensitive adhesive flows into the unevenness of the resist pattern, and the adhesion area between the resist pattern and the pressure-sensitive adhesive is increased.

Above the peeling table 31, there are an ultraviolet generating device 47 including an ultraviolet lamp 46 and the like, and a hood 48 which moves down on the peeling table 31 and prevents the ultraviolet rays from leaking outside the peeling table 31. A curing ultraviolet irradiation unit 49 is provided on the base wall 19 (see FIG. 2). By irradiating the wafer W with ultraviolet rays, the adhesive of the ultraviolet-curable adhesive tape T is cured, and the adhesion strength to the resist pattern is increased.

The structure of the tape attaching / peeling unit 6 will be described with reference to FIGS. 1, 2 and 5. FIG. 5 is a front view of the tape attaching / peeling unit 6. The tape application / peeling unit 6 is a tape application unit 60 for applying the adhesive tape T to the wafer W on the application table 30.
When the resist pattern together with the adhesive tape T from the wafer W on the separation table 31 is horizontally moved between the tape peeling unit 61 to the joining start position p ₁ and the sticking end position p ₂ to separate and remove, and tape peeling unit 61 a tape sticking unit horizontal driving mechanism 70 for horizontally moving between the peeling start position h ₁ and a release end position h _2, and a tape sticking unit horizontal drive mechanism 70 and similarly configured tape peeling unit horizontal drive mechanism 71 Have. The sticking start position p ₁ is a position where the sticking roller 80 is located at the left end of the sticking table 30, and the sticking end position p ₂ is a position where the sticking roller 80 is located at the right end of the sticking table 31.
Further, the peeling start position h ₁ is a position where the peel roller 91 located on the left end of the separator table 31, the peeling end position h
Reference numeral ₂ denotes a position where the peeling roller 91 is located at the right end of the peeling table 31.

The tape attaching unit horizontal drive mechanism 70 and the tape peeling unit horizontal drive mechanism 71
Screw shafts 64, 65 laid on a base plate 63 juxtaposed behind the base plate 53 of the peeling table unit 5 and divided into two parts at the center of the base plate 63, and are respectively connected to the screw shafts 64, 65. And motors 66 and 67 for rotating this,
A pair of front and rear slide rails 68 arranged side by side on the screw shafts 64 and 65, and slidable along the slide rails 68;
Movable members 72, 7 screwed through screw shafts 64, 65, respectively.
And 3. Then, the movable member 72,
The tape attaching unit 60 is attached to the 73 vertical walls 72a and 73a.
And a tape peeling unit 61 are provided to extend horizontally forward.

As shown in FIG. 1, the tape attaching unit 60 includes a vertical wall 72a of the movable member 72 and a vertical wall 72a.
There are provided two support rods 76 and 77 supported and fixed between the support wall 75 and a support wall 75 at the front position facing the support rod 75. A pair of front and rear swing members 78 and 79 whose base ends are rotatably supported at the both ends of the support rod 76 are provided, and a sticking roller 8 is provided between the free ends of the swing members 78 and 79.
0 is rotatably supported. Further, an air cylinder 8 provided on the back surface of the vertical wall 72a and the front surface of the support wall 75 is provided.
The rods 1 and 82 are connected to the free ends of the swing members 78 and 79, respectively, and the sticking roller 80 moves up and down around the support rod 76 via the swing walls 78 and 79 by the expansion and contraction of the air cylinders 81 and 82. It is configured to swing.

The tape peeling unit 61 has a pair of left and right support rods 84 and 85 supported and fixed between a vertical wall 73a of the movable member 73 and a support wall 83 at a front position facing the vertical wall 73a. Is provided. A pair of front and rear swing members 86 and 87 whose base ends are rotatably supported at the both ends of the support rod 84 are provided, and a holding roller 88 is provided between the free ends of the swing members 86 and 87. Are rotatably supported. Further, a pair of front and rear support members 89 and 90 whose base ends are pivotally fixed to the support rod 84 are provided inside the swing members 86 and 87, and are separated between the free ends of the support members 89 and 90. A roller 91 is rotatably supported. The back of the vertical wall 73a and the support wall 83
The rods of the air cylinders 92 and 93 installed on the front surface of the swinging members 86 and 87 are connected to the free ends of the swinging members 86 and 87, respectively.
The pinching roller 88 is swung up and down around the support rod 84 via the pins 6 and 87 to pinch or release the adhesive tape T between the peeling roller 91 and the pinching roller 88. . A holding roller 88 is connected to a motor 94 provided on the back surface of the swinging member 86 in an interlocking manner, and is configured to feed out the adhesive tape T held between the holding roller 88 and the peeling roller 91.

A sliding member (not shown) installed on the support wall 75 of the tape applying unit 60 and the support wall 83 of the tape peeling unit 61 is engaged with a horizontal rail 19b provided on the back surface of the base wall 19 to apply the tape. The unit 60 is configured to move horizontally on the attaching table 30 and the tape peeling unit 61 is moved horizontally on the peeling table 31 in a stable posture.

As shown in FIG. 5, the adhesive tape T sent from the tape supply unit 4 passes through the lower surface of the attaching roller 80 of the tape attaching unit 60 and passes through the peeling roller 91 and the nipping roller 88 of the tape peeling unit 61. And sent to a tape collecting unit 7 described later.

As shown in FIG. 1, at the position near the left side of the long hole 19a on the front surface of the base wall 19, the wafer W is temporarily held when the wafer W on the sticking table 30 is transferred to the separation table 31. A wafer holding arm 100 on a thin plate is provided, and its base end is connected to a rotary actuator (not shown). The free end of the wafer holding arm 100 is horizontally swung by the operation of the rotary actuator,
The wafer W is supported from its lower surface at the position of the peeling table 31 which passes through the elongated hole 19a and is indicated by a virtual line in FIG.

As shown in FIG. 2, the tape collecting section 7 is located on the left rear side of the base wall 19, and is provided with a tape collecting roll 110 for winding and collecting the adhesive tape T with the resist pattern adhered thereto. Rotary shaft 11 horizontally installed on the back
1. The rotation shaft 111 is linked to a motor (not shown) and drives the tape collection roll 110 to rotate. In the vicinity of the tape collecting roll 110, a bypass roller 112 for reliably guiding the adhesive tape T to the tape collecting roll 110 is provided.
Are cantilevered by a swingable arm 113. A fixing roller 114 is horizontally installed below the fixing roller 114, and a pinching roller 115 for oscillatingly urging the adhesive tape to the fixing roller 114 is arranged in parallel via an arm 116. Then, the adhesive tape T sent from the tape peeling unit 61 passes through the fixing roller 114, the nipping roller 115, and the bypass roller 112, and the tape collecting roller 11.
It is rolled up to 0 and collected.

An operation panel 120 of the apparatus is provided on the upper right side of the front surface of the base wall 19.

Hereinafter, the processing performed by the resist removing apparatus according to this embodiment will be described. First, the first cassette C1 in which the wafers W that have been etched in the previous process are stored.
Is mounted on the first cassette stage 11, the first cassette stage 11 rotates so that the wafer carry-out port C <b> 1 a faces the transfer unit 15. Further, when an empty second cassette C2 is placed on the second cassette stage 13, the second cassette stage 11
The second wafer transfer port C2a is rotated so as to face the transfer unit 15 side.

The transfer unit 15 includes an arm base 18a
Is moved up and down to move the robot arm 14 to a position corresponding to the wafer W1 to be unloaded. Subsequently, after the robot arm 14 is extended and enters just below the wafer W1 in the first cassette C1, the arm base 18a is slightly raised, so that the wafer W1 is
4 is passed over the tip. Then robot arm 14
Is contracted, the first wafer W1 is unloaded from the wafer unloading port 14a of the first cassette C1 while its lower surface is supported. The wafer W1 is placed in the pre-processing unit 3
Is conveyed to the front of the shutter 34.

When the wafer W1 is transported to the front of the shutter 34 of the preprocessing unit 3, the preprocessing unit 3 lowers the shutter 34 by the air cylinder 36 to open the opening surface of the housing 33. Transport unit 15
When the housing 33 is opened, the wafer W1 is placed on the chuck 37 provided in the housing 33, and then the robot arm 14 is temporarily moved to a predetermined position. The pre-processing unit 3 holds the wafer W1
And the shutter 34 is raised to close the opening surface of the housing 33.

Further, the pre-processing unit 3 includes a rotating mechanism 3
8 is rotated to drive the chuck 37
At the same time, the wafer W1 is rotated. At the same time, the reforming / decomposing UV irradiation unit 39
UV light is applied to the inside of the housing 33 from a. At this time,
The reforming / decomposing ultraviolet irradiation unit 39 has a main wavelength region of 200 nm or less with respect to the rotating wafer W1.
Irradiate with UV light of 400 nm at ² J / cm ² or more. Therefore, the surface of the resist pattern on the wafer W1 is uniformly irradiated with ultraviolet rays, and the fluorine-based deposition layer, which is a hardly adherent layer formed unevenly on the surface of the resist pattern, is modified and decomposed. As a result, the affinity of the entire surface of the resist pattern with the adhesive of the adhesive tape T can be made substantially uniform.

When the irradiation of the ultraviolet light on the wafer W1 is completed, the preprocessing unit 3 opens the opening surface of the housing 33. The transport unit 15 is a housing 33 of the preprocessing unit 3.
The wafer W1 is taken out from the inside, and the wafer W1 is transferred to the alignment stage 12. The alignment stage 12 detects the orientation flat (or notch) of the wafer W1 and aligns the wafer W.
The transfer unit 15 holds the wafer W whose alignment has been completed.
Is again removed by the robot arm 14 to remove the resist.
It is transported to the sticking table 30 prepared for.

Hereinafter, the sticking / peeling processing of the adhesive tape T to the wafer W1 will be described with reference to FIGS. FIG. 6A shows the attaching table 30, the peeling table 31, and the tape attaching unit 6 in the initial state.
0, the positional relationship of the tape peeling unit 61 is shown. The sticking table 30 is at the standby position B of the first processing position C, the peeling table 31 is at the standby position B of the second processing position D, and the tape bonding unit 60 is the bonding start position p of the bonding / peeling processing position A.
_{1. In} the tape peeling unit 61, the sticking / peeling processing position A
Of the release end position h _2, it is deployed, respectively.

The wafer W1 taken out first is suction-held on the suction pad 44 of the sticking table 30 at the standby position B with the surface of the resist pattern facing upward. Usually, the suction pads 44 and 45 of the sticking table 30 and the peeling table 31 at the standby position B move the robot arm 1 of the transfer unit 15 when loading or unloading the wafer W1.
4 or the wafer W1 with the tip of the wafer holding arm 100 held by the suction pads 44 and 45,
It is set to be slightly protruded from the upper surfaces of the sticking table 30 and the peeling table 31 so as to be able to enter the gap between the sticking table 30 and the peeling table 31. At this time, the air cylinders 81 and 82 of the tape sticking unit 60 at the sticking / peeling processing position A above the sticking table 30 are contracted at this time, and the sticking roller 80 is in a posture slightly lifted upward.

Then, as shown in FIG. 6B, the sticking table 30 holding the wafer W1 is moved upward to the sticking / peeling processing position A by the extension operation of the air cylinder 42 of the sticking table lifting drive mechanism 40. Then, the suction pad 44 is immersed in the sticking table 30, and the wafer W1 is sucked and held by the sticking table 30. At this time, the sticking roller 80 of the tape sticking unit 60 is
1 and 82, the sticking roller 80 and the peeling roller 9 of the tape peeling unit 61 swing slightly downward.
1, the adhesive tape T wound around is deformed into a substantially horizontal posture. When the joining roller 80 at the joining start position p ₁ of the patch / release processing position A and the sticking table 30 abuts, the motor 66 of the tape sticking unit horizontal drive mechanism 70 is operated, tape application including application roller 80 while horizontally moving (to the right indicated by the phantom line in the figure) direction of the unit 60 is attached ending position p _2, go pasted adhesive tape T to the wafer W1 surface.

Further, from the time when the wafer W1 is held on the sticking table 30, the wafer W1 is subjected to heat treatment by heating the heater provided on the sticking table 30, and the adhesive of the adhesive tape T stuck to the wafer W1 is removed. It softens and flows into the unevenness of the resist pattern on the surface of the wafer W1, the contact area between the adhesive and the resist pattern increases, and the adhesion between the two increases.

When the sticking of the adhesive tape T to the wafer W1 is completed, the tape sticking unit 60 moves to the sticking end position p _2.
(The position indicated by the phantom line in FIG. 6B), and the tape peeling unit 61 remains in the initial state, and the peeling end position h ₂
In this state, the adhesive tape T interposed between the attaching roller 80 and the peeling roller 91 is attached to the surface of the wafer W1. While maintaining this posture, as shown in FIG. 6C, the motor 55 of the attaching / peeling table horizontal drive mechanism 50, the motor 66 of the tape attaching unit horizontal drive mechanism 70, and the tape peeling unit horizontal drive mechanism 71 The motor 67 is operated so that the sticking table 30 at the first processing position C comes to the second processing position D.
0, peeling table 31 and tape sticking unit 60,
The tape peeling unit 61 moves horizontally.

Then, as shown in FIG. 6D, the suction pad 44 of the sticking table 30 is extended to hold the wafer W1, and the air cylinder 42 of the sticking table lifting drive mechanism 40 is contracted. Then, the attachment table 30 moves down to the standby position B. Thereafter, the tip of the wafer holding arm 100 horizontally swings by the operation of the rotary actuator, and enters just below the wafer W1 held by the suction pad 44 of the attaching table 30.
Next, as shown in FIG. 7E, the suction pad 44 of the attaching table 30 is lowered, and the wafer W1 is once supported by the tip of the wafer holding arm 100.

Then, the wafer W1 is moved to the next peeling table 3
In this state, the motor 55 of the pasting / peeling table horizontal drive mechanism 50 operates to move the pasting table 30 and the peeling table 31 horizontally. That is, as shown in FIG. 7F, only the attaching table 30 and the peeling table 31 are horizontally moved to the initial state so that the attaching table 30 at the second processing position D returns to the first processing position C again. . Therefore, the upper surface is adhered to the adhesive tape T between the tape affixing unit 60 and the tape peeling unit 61, and the lower surface is located at a lower position (second processing position D) of the wafer W1 supported by the wafer holding arm 100 at the lower surface. 31 are moved, and the tape separation unit 61 is displaced relative to the peeling start position h _1. Further, the joining roller 8 in the sticking end position p ₂ of the sticking table 30 at this time
0 joining start position p tape sticking unit 60 to come to ₁ slightly moves horizontally.

Next, as shown in FIG. 7 (g), the suction pad 45 of the peeling table 31 rises and comes into contact with the lower surface of the wafer W1. At this time, the sticking table 30 includes
The next wafer W2 is transferred by the robot arm 14. Then, as shown in FIG. 8 (h), the air cylinder 43 of the peeling table elevating drive mechanism 41 is extended, and
The wafer W1 moves up to the sticking / peeling processing position A together with the peeling table 31.

Thereafter, as shown in FIG. 8 (i), the hood 48 of the curing ultraviolet irradiation unit 49 waiting above the peeling table 31 is lowered onto the peeling table 31,
After preparations are made to prevent leakage of ultraviolet rays to the outside of the peeling table 31, the ultraviolet lamp 46 of the ultraviolet ray generator 47 is turned on, and the wafer W1 is irradiated with ultraviolet rays. By this UV irradiation, the pressure-sensitive adhesive of the UV-curable pressure-sensitive adhesive tape T adhered to the surface of the wafer W1 is cured, and the adhesive strength with the resist pattern is further increased. At this time, the next wafer W2 is moved up to the sticking / peeling processing position A together with the sticking table 30.

When the ultraviolet irradiation on the wafer W1 is completed,
As shown in FIG. 8 (j), the hood 48 moves up and down.
You. Next, the mode of the tape peeling unit horizontal drive mechanism 71 is set.
The tape peeling unit including the peeling roller 91 is actuated by the
The knit 61 is at the peeling end position h _TwoDirection (shown by a solid line in the figure)
Horizontally (to the right), the peeling table 3
1 together with the adhesive tape T from the surface of the wafer W1
The strike pattern is peeled and removed. At about the same time,
Motor 66 of tape drive unit horizontal drive mechanism 70
To move the tape application unit 60 to the application end position p._TwoWater
By moving horizontally, the next wafer on the sticking table 30 is moved.
The adhesive tape T is stuck on the surface of C2. this
As shown in FIG.
Process, the processing efficiency of the equipment (throughput)
G) can be improved. Also, at this time,
The substrate T has a substantially uniform surface on the resist pattern of the wafer W.
As it sticks with adhesive force, with the peeling of the adhesive tape T,
For surely removing and removing the resist pattern on the wafer W
Can be.

Thereafter, the peeling table 30 is lowered to the standby position B, and the wafer W1 on the peeling table 31 from which the resist pattern has been removed is moved by bending and rotating the robot arm 14 of the transfer unit 15.
And is stacked and stored in the second cassette C2 of the second cassette stage 13. In addition, if necessary, the processed wafer W1 may be stored in the second cassette C2 after being positioned by the alignment stage 12. Then, the wafer W2 on the pasting table 30 on which the pasting process has been performed is similarly repeated from the operation shown in FIG. The portion of the adhesive tape T from which the resist pattern of the wafer W1 has been removed is wound up by the tape collecting roll 110 of the tape collecting section 7 by repeating the same operation later.

The present invention can be modified as follows. (1) In the resist removal apparatus of the above-described embodiment, the configuration in which the wafer W is irradiated with ultraviolet rays is described as the pretreatment unit 3 corresponding to the modifying / decomposing means according to the present invention. By doing so, the fluorine-based deposition layer on the surface of the resist pattern of the wafer W is modified and
It can be configured to be disassembled. Hereinafter, this modified example will be described with reference to FIG. Note that the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 3, the pretreatment unit 3 according to this modification has a humidification unit 95 for humidifying the inside of the housing 33 in a substantially closed state. The humidifying unit 95 corresponds to a humidifying unit in the present invention. The humidification unit 95, for example, moves the inside of the housing 33 to 25 degrees
It is a unit that humidifies to about% RH, and is disposed on the upper surface of the housing 33. A drain port 97 for draining water droplets generated by humidification of the humidification unit 95 is provided in the housing 33.
Are provided on the floor surface 98. The floor surface 98 is inclined toward the drain port 97 so that water droplets are easily drained. In the housing 33, a mounting table 96 on which the wafer W is mounted is provided. The mounting table 96 is connected to a vacuum evacuation line (not shown) in order to suck and hold the mounted wafer W. The humidification unit 95
Can be configured to humidify while raising the temperature inside the housing 33.

The wafer W transferred by the transfer unit 15 is mounted on the mounting table 96 in the housing 33. The mounting table 96 holds the wafer W by suction. The air cylinder 36 raises the shutter 34 to close the housing 33. The humidification unit 95 humidifies the inside of the housing 33 when the housing 33 is closed and closed. Due to this humidification, the fluorine-based deposition layer formed on the surface of the resist pattern of the wafer W in the housing 33 is modified and decomposed, and the affinity with the adhesive of the adhesive tape T is increased. When the modification / decomposition of the fluorine-based deposition layer by humidification is completed, the housing 3
3, the wafer W is carried out by the transfer unit 15, and the processing in the pre-processing unit 3 ends.

According to the pretreatment unit 3 according to the above-described modification, since the surface of the resist pattern of the wafer W is humidified to modify and decompose the fluorine-based deposition layer on the surface of the resist pattern, When an ultraviolet curing adhesive is used for the tape T, the resist pattern can be more reliably peeled off from the wafer W without curing the adhesive.

Although the humidifying unit 95 for humidifying the inside of the housing 33 is provided in the pretreatment unit 3 in the resist removing apparatus of the above-described modified example, for example, a cooling unit for cooling the surface of the resist pattern of the wafer W Can be replaced by Specifically, the cooling unit cools wafer W with a cooling medium such as liquid nitrogen. Thereafter, the ambient atmosphere of the cooled wafer W is changed to a room temperature atmosphere to condense moisture in the air on the wafer W, thereby modifying the fluorine-based deposition layer on the surface of the resist pattern.
Decompose. According to this modified example, it is possible to realize, with a simpler configuration, a resist removing device that can modify and decompose the hard-to-adhere layer on the surface of the resist pattern.

(2) In the above embodiment, the semiconductor wafer is described as an article in the present invention. However, the present invention is not limited to this. For example, a glass substrate for a liquid crystal display, etching, or the like may be used. The present invention can be applied to any article in which a difficult-to-adhesive layer is formed on the surface of a subsequent resist pattern.

(3) In the above-described embodiment, the pretreatment unit 3 for modifying and decomposing the hardly adherent layer formed on the surface of the resist pattern is integrally formed with the resist removing device. 3 and the resist removing device may be provided separately and independently.

(4) In the above embodiment, the fluorine-based deposition layer was described as an example of the hardly-adhesive layer. However, this embodiment is not limited to this. A layer formed by a liquid or the like is also included in the hardly adherent layer in the present invention. For example, when etching is performed using a Cl (chlorine) -based gas, a Cl-based deposition layer is formed on the surface of the resist pattern. Also in this case, similarly to the above-described embodiment, the Cl-based deposition layer can be modified and decomposed to increase the affinity of the pressure-sensitive adhesive tape with the pressure-sensitive adhesive.

[0073]

As is apparent from the above description, according to the first aspect of the present invention, before attaching the adhesive tape,
Modifies the hard-to-adhere layer with poor affinity with the adhesive of the adhesive tape.
Since it disassembles and increases the affinity with the adhesive of the adhesive tape, it is possible to reliably remove and remove the resist pattern from the article by peeling the adhesive tape attached to the surface of the resist pattern on the article. it can.

According to the second aspect of the present invention, the fluorine-based deposition layer formed on the surface of the resist pattern is modified by irradiating the surface of the resist pattern with ultraviolet rays.
Since the resist pattern is decomposed to increase the affinity with the adhesive, the resist pattern can be more reliably and easily peeled off from the article.

According to the third aspect of the present invention, by humidifying the surface of the resist pattern, the fluorine-based deposit layer formed on the surface of the resist pattern is modified and decomposed to have an affinity for the adhesive. Therefore, the resist pattern can be more reliably and easily peeled off from the article.

According to the fourth aspect of the present invention, the first aspect is provided.
Can be suitably implemented.

According to the invention set forth in claim 5, according to claim 2,
Can be suitably implemented.

According to the invention described in claim 6, according to claim 3,
Can be suitably implemented.

[Brief description of the drawings]

FIG. 1 is an overall plan view showing a schematic configuration of a resist removing apparatus according to an embodiment.

FIG. 2 is an overall front view of the embodiment device.

FIG. 3 is a longitudinal sectional view illustrating a schematic configuration of a pretreatment unit.

FIG. 4 is a front view of a sticking / peeling table unit.

FIG. 5 is a front view of a tape attaching / peeling unit.

FIG. 6 is an explanatory diagram showing an operation of applying / peeling off an adhesive tape.

FIG. 7 is an explanatory view showing an operation of applying / peeling off an adhesive tape.

FIG. 8 is an explanatory view showing an operation of applying / peeling off an adhesive tape.

FIG. 9 is a longitudinal sectional view illustrating a schematic configuration of a pretreatment unit according to a modification.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Conveying / pre-processing part 2 ... Resist removal part 3 ... Pre-processing unit 4 ... Tape supply part 5 ... Sticking / peeling table part 6 ... Tape sticking / peeling unit part 7 ... Tape collection part 11 ... 1st cassette stage 12 ... Alignment stage 13 ... Second cassette stage 15 ... Transport unit 30 ... Sticking table 31 ... Peeling table 39 ... Modification / decomposition ultraviolet irradiation unit 40 ... Sticking table elevating drive mechanism 41 ... Peeling table elevating drive mechanism 50 ... Sticking / peeling table Horizontal drive mechanism 60 Tape attaching unit 61 Tape peeling unit 95 Humidifying unit C1 First cassette C2 Second cassette W Wafer T Adhesive tape

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Eiji Toyoda 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation F-term (reference) 2H096 AA25 AA26 HA23 LA01 5F004 BD01 BD07 FA08 5F046 MA18 MA19

Claims (6)

[Claims] 1. A method for removing a resist pattern on an article after etching by using an adhesive tape, wherein the resist pattern formed on the surface of the resist pattern on the article is modified by a reaction gas at the time of etching. Quality / decomposition to increase the affinity of the pressure-sensitive adhesive tape with the pressure-sensitive adhesive, and applying the pressure-sensitive adhesive tape to the surface of a resist pattern on an article in which the hard-to-adhesive layer has been modified / decomposed; Peel the applied adhesive tape from the article,
Removing the resist pattern from the article. 2. The resist stripping method according to claim 1, wherein the hard-adhesive layer is a fluorine-based depot layer, and the step of modifying and decomposing the hard-adhesive layer includes forming the fluorine-based depot layer. A method of removing resist, which comprises irradiating the surface of the resist pattern on the article after etching with ultraviolet rays. 3. The method for removing a resist according to claim 1, wherein the hard-adhesive layer is a fluorine-based depot layer, and the step of modifying and decomposing the hard-adhesive layer includes forming the fluorodeposit layer. A resist removing method in which the surface of the resist pattern on the article after etching is humidified. 4. A resist removing apparatus for peeling off a resist pattern on an article after etching by using an adhesive tape, wherein the resist gas on the surface of the resist pattern on the article is modified by a reaction gas at the time of etching. Quality / decomposition to improve the affinity of the adhesive tape with the adhesive.
Decomposing means, a tape attaching means for attaching the adhesive tape to the surface of the resist pattern on the article in which the hard-adhesive layer has been modified / decomposed, and peeling the attached adhesive tape from the article,
A resist stripping device for stripping and removing a resist pattern from an article. 5. The resist stripping device according to claim 4, wherein the hard-adhesive layer is a fluorine-based depot layer, and the modifying / decomposing means includes an ultraviolet ray on a surface of the resist pattern on the article after the etching. A resist removing device which is an ultraviolet irradiation means for irradiating the resist. 6. The resist stripping device according to claim 4, wherein the hard-adhesive layer is a fluorine-based depot layer, and the hard-adhesive layer modifying / decomposing means is configured to form a resist pattern on the article after the etching. A resist removing device that is a humidifying unit that humidifies the surface.