JP2000182514A - Manufacture of back surface board for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of processes, to improve the strength of a barrier rib forming part, to provide the excellent dimensional accuracy with the excellent workability and a low energy by hardening the barrier rib forming part formed into the predetermined shape at the predetermined position of a substrate, and thereafter, forming a multi color pattern including the phosphor and the organic material on the barrier rib forming part at the predetermined position. SOLUTION: A hardened barrier rib forming part 2a is obtained by a process for embedding the barrier rib material in a clearance between a relief pattern and a relief pattern provided on a substrate at the predetermined positions, a process for hardening the barrier rib material and a process for eliminating the relief patterns. The barrier rib material includes the inorganic material and the organic material, which includes the high molecular binder having ethylene unsaturated group, as essential ingredient. As the phosphor and the organic material to be used at the time of forming a multi color pattern, the photosensitive resin composition including each phosphor for emitting the red, green and blue light is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a back plate for a plasma display panel and a barrier rib material.

[0002]

2. Description of the Related Art Conventionally, as one of flat panel displays, a plasma display panel (hereinafter, referred to as a PDP) capable of performing multicolor display by providing a phosphor which emits light by plasma discharge has been known. In the PDP, a flat front plate and a rear plate made of glass are disposed in parallel and opposed to each other, and both are held at a fixed interval by a fired barrier rib provided therebetween. , And discharges in a space surrounded by the back plate and the fired barrier ribs. In such a space, a phosphor for display is applied, and the phosphor is caused to emit light by ultraviolet rays generated from the sealing gas by discharge, so that the light can be visually recognized by an observer.

Conventionally, a back plate for PDP is formed by forming a barrier rib before curing by a printing method using a paste of a barrier rib material (a mixture of an inorganic material and a resin) on a flat plate on which a plurality of electrodes are arranged and arranged. After forming the barrier ribs before curing by a method of forming barrier ribs before curing by using a photosensitive film, and curing the resin component in the barrier ribs as necessary,
By heating the barrier rib by heating to 0 to 650 ° C., the organic binder and the like are scattered and removed, and after the substrate is cooled, a multicolored organic binder or the like is placed at a desired position using an organic binder or the like containing a phosphor. After forming the pattern,
It has been manufactured by baking the substrate at a temperature of about 650 ° C., scattering and removing an organic binder and the like, and forming a phosphor pattern.

[0004] As a method of forming a barrier rib before curing, a thick film printing method using a printing screen and a glass powder paste has been generally performed, and a position is determined by using a photosensitive material. A method of accurately forming a barrier rib before curing (JP-A-2-165538, JP-A-2-165540, JP-A-7-192626, etc.) has also been proposed. After forming the barrier rib material at a desired position in any method,
By firing at around 00 ° C., a fired barrier rib is obtained.

As a method of forming a phosphor pattern using a substrate on which barrier ribs have been formed after firing, a method of applying a slurry liquid or paste in which phosphors of each color are dispersed by a printing method such as screen printing. (Japanese Unexamined Patent Publication No.
JP-A-115027, JP-A-1-124929, JP-A-1-124930, JP-A-2-155
No. 142) has been proposed, and as a method of forming a phosphor pattern with high positional accuracy, a method using a photosensitive element (photosensitive film) containing a phosphor (Japanese Patent Laid-Open No. 6-273925). Etc.) have been proposed.

A conventional back panel for a PDP is formed by forming a barrier rib before curing or a barrier rib after curing on a flat plate, baking it at 400 to 650 ° C., cooling it, and then using a printing method such as screen printing or a phosphor. After forming a multicolor pattern by a method of disposing a multicolor pattern at a desired position using a pattern mask, using a photosensitive film containing, the substrate is again heated to about 400 ° C. to 650 ° C. It was manufactured by heating to scatter and remove the organic binder and the like to form a phosphor pattern. However, the substrate shrinks due to heating at the time of firing the barrier rib before curing or the barrier rib after curing. In the case of a substrate having a size of about 50 cm square, the size is reduced by several tens to several hundreds of microns). Pattern mask, will not match, it was very difficult to perform satisfactory patterning. In addition, this problem is a very serious problem in manufacturing a large-screen PDP because the error increases as the display area of the PDP increases.

On the other hand, a pattern mask or a screen mask for a phosphor pattern is used in accordance with the reduction ratio of the substrate.
There is a case where the barrier ribs before curing or the barrier ribs after curing are slightly reduced in size from the molded size to correspond to each other, but the reduction width of the substrate during firing is not necessarily constant,
Since the reduction width is partially different, the yield of products is poor, and it is very difficult to manufacture a large-screen PDP with dimensional accuracy.

[0008]

According to the first aspect of the present invention, the number of steps is reduced, the strength of the barrier rib forming part is improved, the workability, low energy, and dimensional accuracy are excellent. An object of the present invention is to provide a method of manufacturing a back plate for a plasma display panel, which can produce a face plate with a high yield. The invention according to claim 2 provides a method of manufacturing a back plate for a plasma display panel in which the barrier rib forming portion has excellent peeling liquid resistance when removing a relief pattern, in addition to the effect of the invention according to claim 1. It is.

[0009]

According to the present invention, a barrier rib material containing (A) an inorganic material and (a) an organic material containing a polymer binder having an ethylenically unsaturated group is formed on a substrate. After curing the barrier rib forming portion formed in the position and the shape of the above, a multicolor pattern including a phosphor and an organic material is formed at a predetermined position on the cured barrier rib forming portion by a photolithographic method, and firing in this state And a method of manufacturing a back plate for a plasma display panel.

In the present invention, the cured barrier rib forming portion may further comprise: (Ia) embedding a barrier rib material in a gap between the relief patterns provided at predetermined positions on the substrate; The present invention relates to a method of manufacturing the back plate for a plasma display panel obtained by the steps of :) curing the barrier rib material and (Ic) removing the relief pattern.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The method of manufacturing a back plate for a plasma display panel (hereinafter referred to as PDP) of the present invention comprises the steps of (A)
Using a barrier rib material including an inorganic material and (a) an organic material containing a polymer binder having an ethylenically unsaturated group, a barrier rib forming portion formed at a predetermined position and shape on a substrate is cured. A multicolor pattern containing a phosphor and an organic material is formed at a predetermined position on the cured barrier rib forming portion by a photolithographic method, and firing is performed in this state.

In the present invention, the method of curing the barrier rib forming portion formed at a predetermined position and shape on the substrate is not particularly limited, and for example, the following [first method] to [fifth method] And the like.

As a first method, (Ia) a step of embedding a barrier rib material in a gap between relief patterns provided at predetermined positions on a substrate, and (Ib) a step of (Ab) And (Ic) a step of removing the relief pattern. This [first method] is defined as a photo embedding method.

[Second method] includes (Ia) a step of printing (A) a barrier rib material at a predetermined position on a substrate via a screen plate, and (Ib) a step of (A) curing the barrier rib material. This is a method obtained by performing each of the steps. This [second method] is defined as a screen printing method.

[Third method] includes (Ia) laminating (A) a barrier rib material layer on a substrate, (A) providing a predetermined pattern mask on the barrier rib material layer, and sand blasting; And (A) a step of curing the barrier rib material and (Ic) a step of removing the pattern mask.
This [third method] is defined as a sandblast method.

[Fourth method] is as follows. (Ia) Laminate a (A) barrier rib material layer on a substrate, and transfer (A) a mold having irregularities of a predetermined shape onto the (A) barrier rib material layer. This is a method obtained by performing each step of the step and (Ib) (A) the step of curing the barrier rib material. This [fourth method] is defined as a template method.

[Fifth method] includes (Ia) a step of laminating (A) a barrier rib material layer on a substrate;
(A) a step of imagewise irradiating the barrier rib material layer with actinic light; and (Ic) a step of forming a pattern by selectively removing the barrier rib material layer imagewise irradiated with actinic light by development. This is a method obtained by performing each step. This [fifth method] is defined as a photolithographic method. Details of these [first method] to [fifth method] will be described later.

The (A) barrier rib material in the present invention comprises:
It contains an inorganic material and (a) an organic material containing a polymer binder having an ethylenically unsaturated group as essential components. (A) Examples of the inorganic material in the barrier rib material include an inorganic pigment and an inorganic binder. As inorganic pigments,
For example, inorganic materials such as titanium oxide, alumina, magnesia, zinc oxide, iron oxide, chromium oxide, and copper oxide may be used, and these may be used alone or in combination of two or more. Examples of the inorganic binder include known glass frit materials such as low melting point glass.

Examples of (A) the polymer binder having an ethylenically unsaturated group contained in the organic material in the barrier rib material include a carboxyl group, a hydroxyl group, an amino group, an isocyanate group, an oxirane ring, and an acid anhydride. A vinyl copolymer having a functional group such as at least one ethylenically unsaturated group, an oxirane ring, an isocyanate group,
Radical polymerizable copolymers having an ethylenically unsaturated group in the side chain obtained by subjecting a compound having one functional group such as a hydroxyl group and a carboxyl group to an addition reaction are exemplified.

The carboxyl group, hydroxyl group, amino group,
Oxirane ring, as an essential vinyl monomer used for producing a vinyl copolymer having a functional group such as an acid anhydride,
For example, acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, cinnamic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, ethyl isocyanate methacrylate, glycidyl acrylate, glycidyl methacrylate And vinyl monomers having a functional group such as a carboxyl group such as maleic anhydride, a hydroxyl group, an amino group, an oxirane ring, and an acid anhydride. These are used alone or in combination of two or more.

Other vinyl monomers used as needed in the production of the vinyl copolymer include, for example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-acrylic acid. Propyl, n-propyl methacrylate, iso-propyl acrylate, iso-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, sec-butyl acrylate , Sec-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, pentyl acrylate,
Pentyl methacrylate, hexyl acrylate, hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, methacrylic acid 2
-Ethylhexyl, octyl acrylate, octyl methacrylate, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate Octadecyl acrylate, octadecyl methacrylate, eicosyl acrylate, eicosyl methacrylate, docosyl acrylate, docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate,
Cyclohexyl methacrylate, cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, methoxyethyl acrylate, methoxyethyl methacrylate, methoxyethyl methacrylate, methoxydiethylene glycol methacrylate, Methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, diethylaminoethyl acrylate, diethylaminoethyl methacrylate, Dimethylaminopropyl acrylate, dimethylamino methacrylate Propyl, 2-chloroethyl, 2-chloroethyl methacrylate acrylate, 2
Fluoroethyl, 2-fluoroethyl methacrylate, 2-cyanoethyl acrylate, 2-cyanoethyl methacrylate, styrene, α-methylstyrene, vinyltoluene, vinyl chloride, vinyl acetate, N-vinylpyrrolidone,
Examples include fusadienes, isoprene, chloroprene, acrylonitrile, methacrylonitrile and the like. They are,
Used alone or in combination of two or more.

As a compound having at least one ethylenically unsaturated group to be subjected to an addition reaction to a vinyl copolymer and one functional group such as an oxirane ring, an isocyanate group, a hydroxyl group, a carboxyl group, an amino group, and an acid anhydride. Are, for example, glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, α-ethyl acryl glycidyl, crotonyl glycidyl ether, glycidyl crotonate, glycidyl isocrotonic acid, ethyl isocyanate methacrylate, 2-hydroxyethyl acrylate, 2-hydroxymethacrylate Ethyl, acrylic acid,
Examples include methacrylic acid, maleic acid, fumaric acid, itaconic acid, cinnamic acid, acrylamide, methacrylamide, and maleic anhydride. These are used alone or in combination of two or more.

Examples of (a) a polymer binder having an ethylenically unsaturated group are listed below, but the invention is not limited thereto. (1) A vinyl copolymer obtained by polymerizing methacrylic acid as an essential component is dissolved in an inert solvent, and a catalyst such as triethylamine, triethyldiamine, benzyltriethylammonium chloride and a polymerization inhibitor such as hydroquinone are added. And a polymer binder obtained by subjecting glycidyl methacrylate to an addition reaction with a carboxyl group derived from methacrylic acid of a vinyl copolymer. (2) A vinyl copolymer obtained by polymerizing isocyanate ethyl methacrylate as an essential component is dissolved in an inert solvent, and a catalyst such as dibutyltin dilaurate, dibutyltin onside, triethylamine, triethyldiamine, benzyltriethylammonium chloride, etc. And a polymer binder obtained by adding a polymerization inhibitor such as hydroquinone and the like, and adding 2-hydroxyethyl methacrylate to an isocyanate group derived from isocyanateethyl methacrylate of the vinyl copolymer.

(3) A vinyl polymer obtained by polymerizing 2-hydroxyethyl methacrylate as an essential component is dissolved in an inert solvent, and dibutyltin dilaurate, dibutyltin oxide, triethylamine, triethyldiamine, benzyltriethyl chloride are dissolved. A polymer binder obtained by adding a catalyst such as ammonium and a polymerization inhibitor such as hydroquinone to cause an addition reaction of isocyanateethyl methacrylate to a hydroxyl group derived from 2-hydroxyethyl methacrylate of a vinyl copolymer. (4) A vinyl copolymer obtained by copolymerizing maleic anhydride as an essential component is dissolved in an inert solvent, and a catalyst such as triethylamine, triethyldiamine, benzyltriethylammonium chloride and a polymerization inhibitor such as hydroquinone are added. A polymer binder obtained by adding 2-hydroxyethyl acrylate to an acid anhydride.

(5) A vinyl copolymer obtained by copolymerizing 2-hydroxyethyl methacrylate as an essential component is dissolved in an inert solvent, and a catalyst such as triethylamine, triethyldiamine, benzyltriethylammonium chloride and hydroquinone are used. A polymer binder obtained by adding a polymerization inhibitor of the formula (1) to cause an addition reaction of maleic anhydride to a hydroxyl group derived from 2-hydroxyethyl methacrylate of a vinyl copolymer. (6) A vinyl copolymer obtained by copolymerizing methacrylic acid as an essential component is dissolved in an inert solvent, and a catalyst such as triethylamine, triethyldiamine, benzyltriethylammonium chloride and a polymerization inhibitor such as hydroquinone are added. A polymer binder obtained by subjecting a glycidyl methacrylate to an addition reaction with a carboxyl group derived from methacrylic acid of a vinyl copolymer, and further adding a maleic anhydride to a generated hydroxyl group. Among these (a) polymer binders having an ethylenically unsaturated group, the polymer binder of (1) is preferable because of its good thermal decomposability at the time of firing.

The weight-average molecular weight (a value measured by gel permeation chromatography and converted into standard polystyrene) of (a) the polymer binder having an ethylenically unsaturated group in the present invention is 1,000 to 300,000. And more preferably 5,000 to 150,000. This weight average molecular weight is 1,000
If it is less than 300,000 or more, the formability of the barrier rib forming portion tends to decrease.

In the present invention, the (a) ethylenically unsaturated group concentration of the polymer binder having an ethylenically unsaturated group is as follows:
Is preferably set to 3.0 × 10 ^-4 ~5.8 × 10 ^-3 mol / g, more preferably to 6.0 × 10 ^-4 ~5.5 × 10 ^-3 mol / g, 9 × 10 ^{-4 to} 5.0 × 10 ^-3
It is particularly preferred to be mol / g. If the ethylenically unsaturated group concentration is less than 3.0 × 10 ⁻⁴ mol / g, the strength of the barrier rib forming portion tends to decrease, and 5.8 × 10 4
If it exceeds ^-3 mol / g, gelation tends to occur when producing (a) a polymer binder having an ethylenically unsaturated group.

The carboxyl group content (defined by the acid value (mgKOH / g)) of the polymer binder (a) having an ethylenically unsaturated group in the present invention can be appropriately adjusted as required. When using the photo embedding method as the [first method] as a method for curing the barrier rib forming portion, the acid value should be 0 to 80 when an alkaline aqueous solution is used as a stripping solution when removing the relief pattern. Is preferably, and more preferably 0 to 50, and particularly preferably 0 to 30. If the acid value in this case exceeds 80, the peeling liquid resistance of the barrier rib forming portion when the relief pattern is removed tends to decrease.

In the case of using the photolithography method (fifth method) as a method for curing the barrier rib forming portion, (A) a material obtained by imparting photosensitivity to a barrier rib material is used. The acid value can be specified so that development is possible with a developer. For example, when developing with an aqueous alkali solution such as sodium carbonate or potassium carbonate, the acid value is preferably from 70 to 260. If the acid value is less than 70, development tends to be difficult, and if it exceeds 260, the developer resistance (the property that a portion that is not removed by development and remains as a pattern and is not attacked by the developer) decreases. Tend to. When developing using an aqueous developing solution comprising water or an alkaline aqueous solution and one or more organic solvents, the acid value is preferably from 16 to 260. If the acid value is less than 16, development tends to be difficult, and
If it exceeds 0, the developer resistance tends to decrease.

The component (a) in the present invention can be used in combination with a known polymer binder (component (a ')) having no ethylenically unsaturated group. The preferred ranges of the weight average molecular weight and the carboxyl group content of the component (a ') are the same as those of the component (a) described above. When the component (a ′) is used in combination, the amount used is
The total amount of the component (a) and the component (a ') is 100 parts by weight, preferably 1 to 60 parts by weight, more preferably 2 to 50 parts by weight, and more preferably 5 to 40 parts by weight. Particularly preferred is 10 to 30 parts by weight. When the component (a ′) is used in combination, the concentration of the ethylenically unsaturated group is determined by comparing the component (a) with the component (a ′).
It is preferable that the sum of the components is in a range that is preferable when the component (a) is used alone.

As the (A) barrier rib material in the present invention, (b) a radical polymerizable unsaturated compound having an ethylenically unsaturated group can be used for the purpose of improving the strength of the barrier rib forming portion. (B) As the radically polymerizable unsaturated compound having an ethylenically unsaturated group, any of those conventionally known as radically polymerizable monomers can be used.

For example, ester monomers of acrylic acid or methacrylic acid (methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, iso-propyl acrylate, methacrylic Iso-propyl acid, n-butyl acrylate, n-butyl methacrylate, acrylic acid
iso-butyl, iso-butyl methacrylate, se acrylate
c-butyl, sec-butyl methacrylate, tert-acrylate
-Butyl, tert-butyl methacrylate, pentyl acrylate, pentyl methacrylate, hexyl acrylate, hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, octyl acrylate, methacryl Octyl acrylate, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, octadecyl acrylate, octadecyl methacrylate , Eicosyl acrylate, eicosyl methacrylate, docosyl acrylate,
Docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, phenyl methacrylate , Methoxyethyl methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, dimethylaminopropyl acrylate, dimethylaminopropyl methacrylate, 2-chloroethyl acrylate, 2-chloroethyl methacrylate, 2-fluoroethyl acrylate, methacryl 2-fluoroethyl acrylate, 2-cyanoethyl acrylate, 2-cyanoethyl methacrylate, methoxydiethylene acrylate Coal, methoxydiethylene glycol methacrylate, methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, etc., styrene monomers (styrene, α-methylstyrene, p- t
-Butylstyrene, etc.), polyolefin monomers (butadiene, isoprene, chloroprene, etc.), vinyl monomers (vinyl chloride, vinyl acetate, etc.), nitrile monomers (acrylonitrile, methacrylonitrile, etc.), 1-
(Methacryloyloxyethoxycarbonyl) -2-
(3'-chloro-2'-hydroxypropoxycarbonyl) benzene, ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate , Tetraethylene glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, hexapropylene glycol diacrylate, hexapropylene glycol dimethacrylate, polypropylene glycol diacrylate, polypropylene glycol dimethacrylate, butylene glycol diacrylate, butylene glycol Dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, 1,3-butanediol diacrylate,
1,3-butanediol dimethacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,5-pentanediol diacrylate, 1,5-pentanediol dimethacrylate,
1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol diacrylate, pentaerythritol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, bisphenol A
Diacrylate, bisphenol A dimethacrylate,
2,2-bis (4-acryloxyethoxyphenyl) propane, 2,2-bis (4-methacryloxyethoxyphenyl) propane, 2,2-bis (4-acryloxydiethoxyphenyl) propane, 2,2- Bis (4-methacryloxydiethoxyphenyl) propane, 2,2-bis (4-acryloxypolyethoxyphenyl) propane, 2,2-bis (4-methacryloxypolyethoxyphenyl) propane, bisphenol A diglycidyl ether di Acrylate, bisphenol A diglycidyl ether dimethacrylate, urethane diacrylate compound, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, ethyl Oxide-modified trimethylolpropane triacrylate, ethylene oxide-modified trimethylolpropane trimethacrylate, trimethylolpropane triglycidyl ether triacrylate, trimethylolpropane triglycidyl ether trimethacrylate, tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, pentaerythritol tetraacrylate Pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, and the like. These are used alone or in combination of two or more.

When the radically polymerizable unsaturated compound having an ethylenically unsaturated group (b) is used, the amount thereof is preferably from 0 to 100 parts by weight based on 100 parts by weight of the component (a). , 0 to 50 parts by weight. If the amount exceeds 100 parts by weight, the formability of the barrier rib forming portion tends to decrease.

As the (A) barrier rib material in the present invention, (c) a photopolymerization initiator which generates free radicals upon irradiation with active light can be used for the purpose of improving the strength of the barrier rib forming portion. In the case of using the photolithography method as the [fifth method] as a method for curing the barrier rib forming portion, (A) it is necessary to impart photosensitivity to the barrier rib material, and (c) irradiation with active light is performed. The photopolymerization initiator that generates free radicals is an essential component.

(C) Examples of photopolymerization initiators that generate free radicals upon irradiation with actinic light include aromatic ketones (benzophenone, N, N'-tetramethyl-4,4 '
-Diaminobenzophenone (Michler's ketone), N,
N'-tetraethyl-4,4'-diaminobenzophenone, 4-mesoxy-4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2- Dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone-1,2,4- Diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone, etc.), benzoin ether (benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, etc.), benzoin (methyl benzoin, ethyl benzoin, etc.), benzyl derivative (benzyl dimethyl ketal, etc.), 2 , 4,5 Triaryl imide tetrazole dimer (2-(o-chlorophenyl) -4,5-diphenyl imidazole dimer, 2-(o-chlorophenyl) -
4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl)-
4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer, -(2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer and the like, and acridine derivatives (9-phenylacridine,
1,7-bis (9,9'-acridinyl) heptane and the like
And the like. These are used alone or in combination of two or more.

(C) When a photopolymerization initiator which generates free radicals upon irradiation with actinic light is used, the amount of the photoinitiator is 0.0 to 100 parts by weight of the total amount of the component (a).
The amount is preferably 1 to 30 parts by weight, more preferably 0.1 to 20 parts by weight. If the amount is 0.0
If the amount is less than 1 part by weight, the photocuring of the (A) barrier rib material tends to be insufficient, and if it exceeds 30 parts by weight, the (A)
The absorption of active light on the exposed surface of the barrier rib material tends to increase, and the internal light curing tends to be insufficient.

In the barrier rib material (A) of the present invention, in the step (Id) (A) of curing the barrier rib material to be described later, curing can be promoted and the strength of the barrier rib forming portion can be improved, so that free radicals are generated by heating. The resulting thermal polymerization initiator can be used.

Examples of the thermal polymerization initiator that generates free radicals upon heating include acetyl peroxide, cumyl peroxide, tert-butyl peroxide, propionyl peroxide, benzoyl peroxide, 2-chlorobenzoyl peroxide, and 2-chlorobenzoyl peroxide. 3-
Chlorobenzoyl, 4-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, 4-bromomethylbenzoyl peroxide, lauroyl peroxide, potassium persulfate, diisopropyl peroxycarbonate, tetralin hydroperoxide, 1-phenyl-2-methyl Propyl-1-hydroperoxide, tert-butyl pertriphenylacetate,
tert-butyl hydroperoxide, tert-butyl formate, tert-butyl peracetate, tert-butyl perbenzoate, tert-butyl perphenylacetate, tert-butyl per-4-methoxyacetate
Peroxides such as butyl, tert-butyl per-N- (3-toluyl) carbamate, 2,2′-azobispropane,
2'-dichloro-2,2'-azobispropane, 1,
1'-azo (methylethyl) diacetate, 2,2'-
Azobis (2-amidinopropane) hydrochloride, 2,2'-
Azobis (2-amidinopropane) nitrate, 2,2'-
Azobisisobutane, 2,2'-azobisisobutyramide, 2,2'-azobisisobutyronitrile, 2,
Methyl 2'-azobis-2-methylpropionate, 2,
2'-dichloro-2,2'-azobisbutane, 2,2 '
-Azobis-2-methylbutyronitrile, dimethyl 2,2'-azobisisobutyrate, 1,1'-azobis (sodium 1-methylbutyronitrile-3-sulfonate),
-(4-methylphenylazo) -2-methylmalonodinitrile, 4,4'-azobis-4-cyanovaleric acid, 3,
5-dihydroxymethylphenylazo-2-methylmalonodinitrile, 2- (4-bromophenylazo) -2-
Allylmalonodinitrile, 2,2'-azobis-2-methylvaleronitrile, dimethyl 4,4'-azobis-4-cyanovalerate, 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1 '-Azobiscyclohexanenitrile, 2,2'-azobis-2-propylbutyronitrile, 1,1'-azobis-1-chlorophenylethane, 1,1'-azobis-1-cyclohexanecarbonitrile, 1,1' Azobis-1-cycloheptanenitrile, 1,1′-azobis-1-phenylethane, 1,
Ethyl 1'-azobiscumene-4-nitrophenylazobenzylcyanoacetate, phenylazodiphenylmethane,
Phenylazotriphenylmethane, 4-nitrophenylazotriphenylmethane, 1,1'-azobis-1,2
Diphenylethane, poly (bisphenol A-4,
Azo compounds such as 4'-azobis-4-cyanopentanoate), poly (tetraethylene glycol-2,2'-azobisisobutyrate), 1,4-bis (pentamethylene) -2-tetrazene, 1,4-dimethoxycarbonyl-1,4-diphenyl-2-tetrazen, benzenesulfonyl azide and the like can be mentioned. These are used alone or in combination of two or more.

When a thermal polymerization initiator which generates free radicals by heating is used, the amount is preferably 0 to 20 parts by weight based on 100 parts by weight of the component (a).
More preferably, it is 0.1 to 10 parts by weight.

As the barrier rib material (A) in the present invention, an organic solvent can be used, if necessary, in view of the formability of the barrier rib forming portion. Examples of the organic solvent include diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, 2,2,4-trimethyl-1,3-pentadiol monoisobutyrate, isophorone, butyl carbitol, 3-methoxybutyl acetate, and butyl. Carbitol acetate, methylnaphthalene, terpineol and the like. These are used alone or in combination of two or more.

When an organic solvent is used, the amount of the organic solvent is from 0 to 50 parts by weight based on 100 parts by weight of the total amount of the inorganic material and (a) the organic material containing the polymer binder having an ethylenically unsaturated group. It is preferable to use parts by weight,
More preferably, it is 30 parts by weight. This compounding amount is 5
When the amount exceeds 0 parts by weight, the formability when forming the shape of the barrier rib forming portion tends to be poor.

In the barrier rib material (A) of the present invention, the amount of the organic material containing (a) the polymer binder having an ethylenically unsaturated group is 1 to 100 parts by weight with respect to 100 parts by weight of the inorganic material. Part, preferably 2
It is more preferable to be 90 parts by weight, more preferably 3 to 70 parts by weight, more preferably 4 to 60 parts by weight, particularly preferably 5 to 50 parts by weight, and 5 to 30 parts by weight. It is extremely preferred to use parts by weight.
When the amount is less than 1 part by weight, the strength of the barrier rib forming portion tends to decrease, and when the amount exceeds 100 parts by weight, the volume of the barrier rib after firing tends to increase, and the barrier rib formed on the substrate tends to increase. Tend to peel off. It is preferable that the difference between the volume of the barrier rib forming portion before firing and the volume of the barrier rib forming portion after firing is smaller.

The multicolor pattern in the present invention is formed of a pattern containing a phosphor and an organic material. As a material containing a phosphor and an organic material used for forming a multicolor pattern, for example, a phosphor (B) containing one color each of phosphors emitting red, green and blue light is included. And a photosensitive resin composition.

The photosensitive resin composition containing the phosphor (B) used in forming a multicolor pattern is not particularly limited as long as the photosensitive resin composition contains the phosphor as an essential component. For example, (d) a film imparting polymer,
It is preferable to use (d) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, (f) a photoinitiator that generates free radicals upon irradiation with active light, and (g) a phosphor. ) Component, (e) component, (f) component and (g)
As the components, for example, JP-A-9-265906, JP-A-9-288973, and JP-A-10-92
No. 312, JP-A-10-92313, JP-A-10-228103 and the like. Further, the blending amounts thereof and the additives can be used in accordance with the above-mentioned publication.

The method of manufacturing the back plate for a plasma display panel according to the present invention includes, for example, (I) a step of forming a cured rib forming portion at a predetermined position and shape on a substrate, and (II) a cured rib. A method of performing each step of a step of forming a multicolor pattern at a predetermined position on a forming portion and a step of baking (III) is exemplified.

The substrate according to the present invention may be any substrate on which electrodes are formed and whose surface is insulative or insulated, and which has heat resistance or is subjected to heat treatment. There is no particular limitation, for example, glass (soda glass, high strain point glass, etc.), alumina, enamel, and the like. These substrates may be subjected to a surface treatment for adhesion. The thickness of these substrates is usually
0.5 to 10 mm.

Examples of the material of the electrode formed on the substrate in the present invention include Ag, Al, ITO (indium tin oxide), Cr—Cu—Cr, and the like.
In order to form an electrode using these materials, for example, a method such as a screen printing method, a sputtering method, or a photolithographic method can be used. The width of the electrode formed in a stripe shape is usually 50 to 150 μm.
And its thickness is usually 1 to 20 μm.

Hereinafter, a method for manufacturing the back plate for a plasma display panel according to the present invention will be described in detail with reference to FIG. FIG. 1 is a schematic view showing an example of each step of the method for manufacturing a back plate for a plasma display panel according to the present invention, and FIG.
1 shows a state in which a cured barrier rib forming portion 2a is formed on the substrate 1, and FIG. 1 (II) shows a multi-color pattern (first color patterns 3a, 2a) on the cured barrier rib forming portion 2a.
FIG. 1 (III) shows a state in which baking is performed in the state of FIG. 1 (II), and a fired barrier rib 2b and a multi-color pattern 3b are formed on the substrate 1. Phosphor patterns (first color phosphor patterns 4a, 2a)
The phosphor pattern 4b of the third color and the phosphor pattern 4 of the third color
The state where c) was formed was shown. Hereinafter, each step will be described.

[(I) Step of Forming Cured Barrier Rib Forming Portion at Predetermined Position and Shape on Substrate] FIG.
(I). As a method of performing the step (I),
For example, the above-mentioned [first method] to [fifth method] are exemplified. Hereinafter, the [first method] to [fifth method] will be sequentially described.

In the photo embedding method of the first method, (Ia) a step of embedding a barrier rib material in a gap between relief patterns provided at predetermined positions on a substrate, and (Ib) (Ib) This is a method obtained by performing each step of A) a step of curing a barrier rib material and (Ic) a step of removing a relief pattern.

[(Ia) Step of Embedding (A) Barrier Rib Material in the Space Between Relief Patterns Provided at Predetermined Positions on Substrate] If the relief pattern in this step can be removed later, Although various materials can be used without any particular limitation, the relief pattern is preferably formed by a photolithographic method using a photosensitive resin composition, since a relief pattern having a fine structure can be easily obtained.

As the photosensitive resin composition, known ones can be used without particular limitation, and examples thereof include a negative photosensitive resin composition and a positive photosensitive resin composition.
As the positive photosensitive resin composition, known ones can be used without any particular limitation. For example, a soluble-base-light-generating composition using a 1,2-naphthoquinonediazide compound, an o-nitrobenzyl compound, or the like can be used. And an acid-decomposable / acid-decomposable composition using an onium salt or the like. As the negative photosensitive resin composition, known ones can be used without particular limitation. For example, (h) an ethylenically unsaturated compound,
(I) a carboxyl group-containing film-imparting polymer and (j) a photopolymerization initiator as essential components, and if necessary, (k) a dye or pigment, (l) other additives,
(M) A photopolymerizable composition containing an organic solvent is exemplified.

In a photolithographic method using a photosensitive resin composition, as a method of providing a photosensitive resin composition layer composed of a photosensitive resin composition on a substrate, the photosensitive resin composition is directly applied to the substrate, There is a method of drying if necessary, but from the viewpoint of environmental hygiene and the point that the thickness (height) of the relief pattern can be increased, a photosensitive film is used.
A method in which a photosensitive resin composition layer of a photosensitive film is transferred onto a substrate by a laminator to provide the photosensitive resin composition layer on the substrate is preferable. The thickness of the photosensitive resin composition layer provided on the substrate requires the height of a barrier rib to be formed later, and is usually 50 to 250 μm.

The photosensitive resin composition layer provided on the substrate is exposed imagewise by irradiating actinic rays through a negative mask having a predetermined pattern corresponding to the width of a barrier rib to be formed later, and then exposed by development. The relief pattern can be formed by selectively removing the conductive resin composition layer. Actinic rays include carbon arc lamps, ultra-high pressure mercury lamps, high pressure mercury lamps,
What effectively radiates ultraviolet rays, such as a xenon lamp, is used. The developing method is not particularly limited, and examples thereof include wet development and dry development. In the case of wet development, a developer corresponding to the photosensitive resin composition is used. Examples of the developing solution include a weakly alkaline diluted aqueous solution such as sodium carbonate and potassium carbonate.
Dip method, spray method and the like can be mentioned.

In the present invention, since the barrier rib material (A) is buried in the gap between the relief patterns later, it is preferable that the relief pattern has the property of being hardly affected by the barrier rib material (A).
In order to achieve this, it is preferable that the pattern of the photosensitive resin composition layer after development is drained and dried if necessary, and then exposed and / or heated. Usually, this exposure is between 0.1 and 5
The irradiation can be carried out by irradiating an actinic ray of J / cm ² , and heating is performed at 80 to 170 ° C. for 10 to 180 minutes.
This makes it possible to sufficiently cure the entire portion of the relief pattern provided on the substrate, and to impart chemical resistance and solvent resistance to the relief pattern. The thickness (height) of the relief pattern obtained in this way is
Usually, the width is 50 to 250 μm, and if it is a stripe type or rectangular type relief pattern, the width is 50 to 25 μm.
0 μm.

As a method for embedding the barrier rib material (A) in the gap between the thus obtained relief patterns, a known coating method can be used, for example, a screen printing method, a knife coating method, a roll coating method, and the like. Examples include a coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method, a dispenser method, and an ink jet method.

In this step, it is preferable to defoam the (A) barrier rib material under reduced pressure after embedding the (A) barrier rib material. As a method of defoaming the (A) barrier rib material under reduced pressure, for example, there is a method of embedding the (A) barrier rib material and then degassing under reduced pressure at 0.5 to 50 Torr for 10 seconds to 10 minutes within 60 minutes. No. After the deaeration, if necessary, within 40 to 40 to 18
It is preferable to dry at 0 ° C. for 3 minutes to 3 hours.

The (A) step of drying the barrier rib material in this step may be performed in the same step as the step (Ib) of curing the (A) barrier rib material described later.

[(Ib) (A) Step of Curing the Barrier Rib Material] In the curing of the present invention, the strength of the barrier rib forming portion 2a after curing is determined by (II) a predetermined position on the cured barrier rib forming portion described later. In the step of forming a multicolor pattern, the strength is set to withstand without being deformed or destroyed. The curing method in the present invention includes, for example, heat curing, light curing, electron beam curing, ultrasonic curing, high frequency curing, and the like. From the viewpoint of workability, ease of material selection, etc., thermal curing is used. Is preferred.
Further, these curing methods can be performed alone or in combination of two or more.

The heating temperature in the case of performing thermosetting is 50 to
The temperature is preferably 300 ° C., more preferably 60 to 250 ° C., particularly preferably 70 to 220 ° C., and particularly preferably 80 to 200 ° C. If the heating temperature is lower than 50 ° C., curing tends to be insufficient, and in the step (II) described later, the cured barrier rib forming portion 2a tends to be deformed or broken. If the temperature exceeds 300 ° C., (A)
The organic material in the barrier rib material tends to decompose, and the substrate 1 tends to shrink.

The heating time when performing thermosetting is preferably from 5 minutes to 8 hours, more preferably from 1 to 4 hours. If the heating time is less than 5 minutes, the curing tends to be insufficient, and in the step (II) described later, the cured barrier rib forming portion 2a tends to be deformed or broken. If the time exceeds 8 hours, the organic material in the (A) barrier rib material tends to decompose during the curing reaction, and the substrate 1 tends to shrink.

In order to facilitate the step (Ic) of removing the relief pattern, which will be described later, after the curing of this step is performed, before the removal of the relief pattern, an excess amount of the hardened resin adhering to the relief pattern is removed. (A) It is preferable to remove the barrier rib material. As the removal method,
For example, there is a method in which the excessively hardened (A) barrier rib material adhered on the relief pattern is wet-polished using sandpaper. It is preferable to use sandpaper # 100 to # 2000 at this time, but it is preferable to use sandpaper # 400 to # 1000 in consideration of not roughening the rib surface and increasing the polishing rate. More preferred.

The step (Ib) of curing the (A) barrier rib material may be performed after the step (Ic) of removing the relief pattern described later.

[(Ic) Step of Removing Relief Pattern] In this step, the method of removing the relief pattern is not particularly limited, but usually includes a method of removing with a stripper. The stripping solution used is
For example, a 1 to 10% by weight aqueous solution of sodium hydroxide, potassium hydroxide, or monoethanolamine may be used. If the concentration of the stripping liquid is less than 1% by weight, the stripping effect tends to be too long due to the small effect of stripping, and if it exceeds 10% by weight, the barrier rib forming portion tends to be attacked.
There is no particular limitation on the temperature of the stripping solution, and it is desirable to set conditions for suitably stripping the relief pattern and to adapt as needed. As the peeling method, any of the immersion method and the spray method is suitable, and a method using both the immersion method and the spray method is also preferable.

The thickness (height) of the cured barrier rib forming portion 2a obtained by removing the relief pattern in this manner is usually 50 to 250 μm, and if it is a stripe type or lattice type barrier rib. , Its width is 20 ~
120 μm and the height / width is 0.42 to 12.5.

The screen printing method, which is the second method, comprises (Ia) a step of printing (A) a barrier rib material at a predetermined position on a substrate through a screen plate, and (Ib)
And (A) a method obtained by performing each step of the step of curing the barrier rib material.

[(Ia) Step of Printing (A) Barrier Rib Material at Predetermined Position on Substrate via Screen Plate] The screen plate in this step has a structure capable of forming a barrier rib forming portion at a predetermined position. There is no particular limitation as long as it is provided, and a known screen plate can be used.
The printing method is not particularly limited, and the (A) barrier rib material can be printed using a known method. Further, in this screen printing method, in order to obtain the height of the barrier rib forming portion, the (A) barrier rib material can be printed a plurality of times. The height of the barrier rib forming portion is usually 50 to 250 μm.

[(Ib) (A) Step of Curing Barrier Rib Material] The first method can be carried out in accordance with the step of curing the (Ib) (A) barrier rib material in the photo embedding method.

The thickness (height) of the cured barrier rib forming portion 2a obtained by the screen printing method as described above.
Is usually 50 to 250 μm as in the photo embedding method.
m, if it is a stripe type or lattice type barrier rib, the width is 20 to 120 μm, and the height / width is
0.42 to 12.5.

In the sand blast method as the third method, (Ia) a step of laminating a (A) barrier rib material layer on a substrate, providing a predetermined pattern mask on the (A) barrier rib material layer, and performing sand blasting , (Ib)
This is a method obtained by performing each step of (A) a step of curing a barrier rib material and (Ic) a step of removing a pattern mask.

[(Ia) Step of laminating (A) barrier rib material layer on substrate, (A) providing predetermined pattern mask on barrier rib material layer, and sandblasting] In this step, (A) As a method of laminating the barrier rib material layer, a known method can be used, and examples thereof include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method and the like. (A) The thickness of the barrier rib material layer needs to be the height of the barrier rib forming portion to be formed later. In order to obtain the thickness, the barrier rib material layer can be stacked a plurality of times. The thickness of the barrier rib material layer (A) thus obtained is usually 50 to 250 μm.

Next, a pattern mask having sandblast resistance is provided on the barrier rib material layer (A). As a method for providing the pattern mask, a known method can be used, and for example, a relief pattern forming method in the photo embedding method which is the [first method] can be employed. The thickness of the obtained pattern mask is not particularly limited, and is usually 5 to 70 μm.

Next, from the top of the pattern mask, (A)
Unnecessary portions (portions other than barrier rib forming portions) on the barrier rib material layer are sandblasted. The method of sandblasting is not particularly limited, and examples thereof include a method of injecting an ejected material composed of inorganic powder, compressed air, and the like.

[(Ib) (A) Step of Curing Barrier Rib Material] The first method can be performed according to the step of (Ib) (A) curing the barrier rib material in the photo embedding method. The curing in this step is
(A) Before laminating the barrier rib material layer, it may be performed before or after the step of removing the pattern mask (Ic), which will be described later, before providing the pattern mask or before sandblasting.

[(Ic) Step of Removing Pattern Mask] It can be performed in accordance with the (Ic) step of removing the relief pattern in the photo embedding method which is the [first method].

The thickness (height) of the cured barrier rib forming portion 2a obtained by the sandblasting method in this way
Is usually 50 to 250 μm as in the photo embedding method.
m, if it is a stripe type or lattice type barrier rib, the width is 20 to 120 μm, and the height / width is
0.42 to 12.5.

The template method of the [fourth method] is (Ia
A) a step of laminating (A) a barrier rib material layer on a substrate and transferring (A) a mold having irregularities of a predetermined shape onto the barrier rib material layer or (Ia ') a mold having irregularities of a predetermined shape (A) a step of filling a barrier rib material layer into the concave portion and transferring it onto a substrate, and (Ib)
And (A) a method obtained by performing each step of the step of curing the barrier rib material.

[(Ia) Step of laminating (A) a barrier rib material layer on a substrate and transferring (A) a mold having irregularities of a predetermined shape onto the barrier rib material layer] The method of laminating the (A) barrier rib material layer can be performed according to the method of (A) laminating the barrier rib material layer in the sand blast method of [third method]. Next, the concave and convex portions of the mold having the concave portions formed into the barrier rib forming portions and the convex portions formed into the discharge spaces are transferred.

[(Ia ') Step of filling (A) barrier rib material layer into concave portion of mold having irregularities of predetermined shape and transferring it to substrate] In this step, mold having irregularities of predetermined shape (A) The method of filling the barrier rib material layer into the recesses is as follows: (Ia) In the (Ia) photo embedding method, (Ia) a gap between a relief pattern provided at a predetermined position on a substrate and (A) ) It can be performed according to the step of embedding the barrier rib material. Next, after the (A) barrier rib material filled in the recess is brought into close contact with the substrate, only the mold is removed and the (A) barrier rib material having a predetermined shape is transferred onto the substrate.

The material of the mold having such irregularities is as follows:
(A) There is no particular limitation as long as it does not adhere to the barrier rib material layer, and examples thereof include known metals, ceramics, and plastics.

[(Ib) (A) Step of Curing Barrier Rib Material] The first method can be carried out in accordance with the (Ib) (A) step of curing the barrier rib material in the photo embedding method.

The thickness (height) of the cured barrier rib forming portion 2a obtained by the mold method in this manner is usually 50 to 250 μm, similar to the photo embedding method, and is a stripe type or lattice type barrier rib. , The width is 20 to 120 μm and the height / width is 0.42 to 1
2.5.

The photolithography method (fifth method) comprises (Ia) a step of laminating a (A) barrier rib material layer on a substrate, and (Ib) an imagewise irradiation of the (A) barrier rib material layer with actinic rays. And (Ic) a step of forming a pattern by selectively removing the barrier rib material layer imagewise irradiated with actinic rays by development (Ac). The (A) barrier rib material used in this photolithography method contains, as an essential component, (c) a photopolymerization initiator that generates free radicals upon irradiation with active light, as described above.

[(Ia) Step of Laminating (A) Barrier Rib Material Layer on Substrate] In this step, the method of laminating (A) the barrier rib material layer on the (Ia) substrate is described in [Third Embodiment]
The method (A) of laminating barrier rib material layers in the sandblasting method.

[(Ib) (A) Step of irradiating (A) barrier rib material layer imagewise with actinic light] Then, (A) actinic light is applied onto the barrier rib material layer via a photomask such as a negative film or a positive film. Irradiate imagewise. It is necessary that the photomask used at this time has a shape in which active light is irradiated to a position to be a barrier rib forming portion. Thereby, the active light is irradiated to the barrier rib forming portion of the (A) barrier rib material layer, and the barrier rib forming portion is light-cured. As the actinic ray in this step, a known actinic light source can be used, and examples thereof include light generated from a carbon arc, a mercury vapor arc, a xenon arc, and the like. Since the sensitivity of the photoinitiator is usually maximal in the ultraviolet region, the active light source in that case should be one that effectively emits ultraviolet light. When the photoinitiator is sensitive to visible light, for example, 9,10-phenanthrenequinone or the like, visible light is used as the active light, and the light source is other than those described above. Photo flood light bulbs, solar lamps and the like can also be used.

The actinic rays in this step include:
Examples include parallel rays and scattered rays. Either parallel rays or scattered rays may be used, or both may be used in one step, or both may be used separately in two stages. If both are used separately in two stages,
Either may be performed first. The irradiation amount of the actinic ray in this step is not particularly limited, but is preferably 5 to 10,000 mJ / cm ² from the viewpoint of photocurability and the like, and is preferably 7 to 10 mJ / cm ^2.
5000 mJ / cm ² is more preferable, and 10 to 10
It is particularly preferred to be 00 mJ / cm ² .

In this step, the curing of the barrier rib forming portion is performed by photo-curing.
The method according to the method of curing in [Fourth method]
For example, they can be used together after the step (Ic) described later.

[(Ic) Step of Forming a Pattern by Selectively Removing the Barrier Rib Material Layer Irradiated with Active Rays by Image Development by Development] In this step, the active rays were imagewise irradiated by development. (A) As a method of forming a pattern by selectively removing a barrier rib material layer, for example, spraying, rocking immersion, brushing, and the like are performed using a known developing solution such as an alkaline aqueous solution, an aqueous developing solution, or an organic solvent.
A method in which development is performed by a known method such as scraping to remove unnecessary portions, and the like can be given.

The thickness (height) of the cured barrier rib forming portion 2a obtained by the photolithographic method in this manner
Is usually 50 to 250 μm as in the photo embedding method.
m, if it is a stripe type or lattice type barrier rib, the width is 20 to 120 μm, and the height / width is
0.42 to 12.5.

By the above-mentioned methods and the like, (I) the step of forming the cured rib portion at the predetermined position and shape on the substrate can be performed.

[(II) Step of Forming Multicolor Pattern at Predetermined Position on Barrier Rib Formed Part after Curing] The state of forming a multicolor pattern at a predetermined position in the present invention is, for example, the state after curing. And a state in which a multicolor pattern is periodically formed on the inner surface of the concave portion formed by the barrier rib forming portion and the substrate. FIG. 1 shows a state in which a multicolor pattern is periodically formed on the barrier rib forming portion 2a after curing.
(II). In FIG. 1 (II), 3a is 1
3b is a second color pattern, and 3c is a third color pattern.

As a method of forming a multicolor pattern at a predetermined position on the barrier rib forming portion after curing, for example,
Using each of the photosensitive resin compositions (negative type) containing a phosphor emitting red, green and blue one color at a time, a layer of the photosensitive resin composition containing the phosphor (B) is formed. By laminating the barrier rib forming portion after curing and the inner surface of the concave portion formed by the substrate, irradiating the active light imagewise and removing unnecessary portions by development, by repeating for each color, A method of forming a multicolor pattern including a phosphor emitting red, green, and blue and an organic material may be used. Further, the same procedure can be performed by using a photosensitive resin composition (positive type) instead of the photosensitive resin composition (negative type).

(B) The method of laminating the layer of the photosensitive resin composition containing the phosphor so as to follow the barrier rib forming portion after curing and the inner surface of the concave portion formed by the substrate includes, for example, A method of directly applying, drying and laminating on the substrate 1 on which the barrier rib forming portion 2a is formed,
(B) A method of laminating a photosensitive resin composition containing a phosphor as a photosensitive element by a known method is exemplified.

After the layer of the photosensitive resin composition containing the phosphor (B) is uniformly laminated on the inner surface of the concave portion on the substrate 1 on which the barrier rib forming portion 2a after curing is formed, the pattern is formed. After irradiating the actinic ray imagewise through a photomask having the same transmission width as the opening width of the concave portion to be formed, using a known developing solution, spraying, rocking immersion, brushing, scraping, etc. Development is performed by a known method, and unnecessary portions are removed.

The above-described steps from lamination to development are repeated for each color to produce red, green and blue (B).
A multicolor pattern composed of a layer of a photosensitive resin composition containing a phosphor can be formed. In addition, when forming a multicolor pattern, the layer of the photosensitive resin composition containing the phosphor (B), which contains each phosphor that emits red, blue, and green independently, is red, blue, and green. Can be performed in any order.

[(III) Firing Step] Firing is performed in the state shown in FIG. 1 (II), and the fired barrier ribs 2 are placed on the substrate 1.
b, a state in which a multicolor phosphor pattern is formed is shown in FIG.
I). In FIG. 1 (III), 4a is a first color phosphor pattern, 4b is a second color phosphor pattern, and 4c is a third color phosphor pattern.

The firing method is not particularly limited, and a known firing method can be used. In this firing step, the organic material in the barrier rib forming portion 2a after curing and the multicolor containing the phosphor and the organic material are used. The organic components other than the phosphor and the binder in the pattern (1) are removed by batch firing, and the substrate 1
A fired barrier rib 2b and a multicolor phosphor pattern can be formed thereon.

The firing temperature during firing is preferably from 350 to 800 ° C., more preferably from 400 to 600 ° C. If the firing temperature is lower than 350 ° C., the organic material in the barrier rib forming portion 2a after curing and the organic components other than the phosphor and the binder in the multicolor pattern including the phosphor and the organic material tend not to be removed. , 800 ° C., the phosphor (g) in the multicolor pattern tends to deteriorate, and the substrate 1 tends to deform.

The firing time during firing is preferably 15 minutes to 28 hours, more preferably 1 to 15 hours, and particularly preferably 3 to 10 hours. If the baking time is shorter than 15 minutes, the organic material in the barrier rib forming portion 2a after curing and the organic components other than the phosphor and the binder in the multicolor pattern including the phosphor and the organic material tend not to be removed. , 28 hours, the phosphors in the multicolor pattern tend to deteriorate, and the substrate 1 tends to deform.

The rate of temperature rise during firing is preferably 0.5 to 50 ° C./min, more preferably 1 to 45 ° C./min. The firing time at the highest temperature is 3-12.
The time is preferably 0 minutes, more preferably 5 to 90 minutes. Also, before reaching the maximum firing temperature, 3
It is preferable to provide a step of maintaining the temperature between 00 and 450 ° C., and the holding time is preferably 5 to 100 minutes.

In this step, if necessary,
The firing can be performed while blowing air or nitrogen gas. When calcination is performed while blowing air or nitrogen gas, the flow rate of air or nitrogen gas is preferably 0 to 300 liter / minute, and more preferably 0 to 200 liter / minute. Further, the flow rate and type of air or nitrogen gas can be appropriately selected according to the temperature at the time of firing.

[0102]

The present invention will be described below with reference to examples. Production Example 1 [(a) Polymer binder having an ethylenically unsaturated group (a
Preparation of -1)] A flask equipped with a stirrer, a reflux condenser, an inert gas inlet, and a thermometer was charged with (1) shown in Table 1, and heated to 80 ° C. in a nitrogen gas atmosphere to carry out a reaction. While maintaining the temperature at 80 ° C. ± 2 ° C., (2) shown in Table 1 was dropped uniformly over 4 hours. After dropping (2), 80 ℃ ± 2 ℃
After stirring for 6 hours, (3) shown in Table 1 was added. After adding (3), the reaction system was heated to 100 ° C.
(4) shown in Table 1 was added dropwise over 5 hours. After the dropwise addition of (4), stirring was continued at 100 ° C. for 20 hours, and the mixture was cooled to room temperature, and had a weight average molecular weight of 60,000 and an acid value of 0.5 KO.
A photopolymerizable polymer binder (a-1) having an ethylenically unsaturated group in a side chain of Hmg / g was obtained.

[0103]

[Table 1]

Production Example 2 [Preparation of Thermoplastic Polymer (a-2)] In a flask equipped with a stirrer, a reflux condenser, an inert gas inlet and a thermometer,
(1) shown in Table 2 was charged, and 80 ° C. in a nitrogen gas atmosphere.
Temperature and keeping the reaction temperature at 80 ° C. ± 2 ° C.
(2) shown in the above was dropped uniformly over 4 hours. After the dropwise addition of (2), stirring was continued at 80 ° C. ± 2 ° C. for 6 hours to obtain a thermoplastic polymer (a-2) having a weight average molecular weight of 80,000 and an acid value of 0 mgKOH / g.

[0105]

[Table 2]

Production Example 3 [(A) Preparation of Barrier Rib Material (A-1)] The inorganic materials and organic materials shown in Table 3 were mixed at room temperature to obtain (A) a barrier rib material (A-1).

[0107]

[Table 3]

Production Example 4 [(A) Preparation of Barrier Rib Material (A-2)] The inorganic materials and organic materials shown in Table 4 were mixed at room temperature to obtain (A) a barrier rib material (A-2).

[0109]

[Table 4]

Production Example 5 [(A) Preparation of Barrier Rib Material (A-3)] The inorganic material and the organic material shown in Table 5 were mixed at room temperature to obtain (A) a barrier rib material (A-3).

[0111]

[Table 5]

Production Example 6 [(A) Production of Barrier Rib Material (A-4)] Table 6
(A) mixing an inorganic material and an organic material shown in
A barrier rib material (A-4) was obtained.

[0113]

[Table 6]

Production Example 7 [(d) Production of film-imparting polymer (d-1)] A flask equipped with a stirrer, a reflux condenser, an inert gas inlet and a thermometer is shown in Table 7 (1) Was heated to 80 ° C. in a nitrogen gas atmosphere, and (2) shown in Table 7 was uniformly dropped over 4 hours while maintaining the reaction temperature at 80 ° C. ± 2 ° C. After the dropwise addition, stirring was continued at 80 ° C. ± 2 ° C. for 6 hours to obtain a polymer (d-1) having a weight average molecular weight of 80,000 and an acid value of 130 mgKOH / g (d).

[0115]

[Table 7]

Production Example 8 [(B) Production of photosensitive element (B-1) having layer of photosensitive resin composition containing phosphor] The materials shown in Table 8 were mixed for 15 minutes using a Raikai machine. And red (B)
A solution of a photosensitive resin composition containing a phosphor was prepared.

[0117]

[Table 8]

The obtained solution was uniformly coated on a polyethylene terephthalate film having a thickness of 20 μm.
The solvent was removed by drying with a hot air convection dryer at 〜110 ° C. for 10 minutes to form a layer of the photosensitive resin composition containing the red (B) phosphor. The thickness of the obtained layer of the photosensitive resin composition containing the red (B) phosphor is 50 μm after drying.
m. Next, a polyethylene film having a thickness of 25 μm is laminated as a cover film on the layer of the photosensitive resin composition containing the red (B) phosphor,
A photosensitive element (B-1) having a layer of a photosensitive resin composition containing a red (B) phosphor was obtained.

Production Example 9 [(B) Production of photosensitive element (B-2) having layer of photosensitive resin composition containing phosphor] Materials shown in Table 9 were mixed for 15 minutes using a Raikai machine. And green (B)
A solution of a photosensitive resin composition containing a phosphor was prepared.

[0120]

[Table 9]

Thereafter, in the same manner as in Production Example 8, a layer of the photosensitive resin composition containing the green (B) phosphor was formed, and the layer of the photosensitive resin composition containing the green (B) phosphor was formed. A photosensitive element (B-2) having a layer was obtained. The thickness of the obtained layer of the photosensitive resin composition containing the green phosphor (B) after drying was 50 μm.

Production Example 10 [(B) Production of photosensitive element (B-3) having layer of photosensitive resin composition containing phosphor] Materials shown in Table 10 were mixed for 15 minutes using a raikai machine. Then, a solution of a photosensitive resin composition containing a blue (B) phosphor was prepared.

[0123]

[Table 10]

Thereafter, in the same manner as in Production Example 8, a layer of the photosensitive resin composition containing the blue (B) phosphor was formed, and the photosensitive resin composition containing the blue (B) phosphor was formed. A photosensitive element (B-3) having a layer was obtained. The thickness of the obtained layer of the photosensitive resin composition containing the blue (B) phosphor was 50 μm after drying.

Production Example 11 [Preparation of photosensitive film (D-1)] 41% by weight of methyl methacrylate / ethyl acrylate / methacrylic acid copolymer (weight ratio 53/30/17, weight average molecular weight 100,000) Methyl cellosolve / toluene (weight ratio 8: 2) solution 1
37 g (solid content 55 g), 34 g of bisphenol A polyoxyethylene dimethacrylate, γ-chloro-β-hydroxypropyl-β-methacryloyloxyethyl-O
-11 g of phthalate, 0.1 g of stabilizer (AW-500, manufactured by Kawaguchi Chemical Co., Ltd.), 1.2 g of tribromomethylphenylsulfone, silicone leveling agent (SH-19)
3, 0.04 g of Toray Silicon Co., Ltd.), 0.2 g of 1,7 bis- (9-acridinyl) heptane, 3 g of benzyl dimethyl ketal, 1.0 g of leuco crystal violet, 0.05 g of malachite green, and toluene 7
g, 13 g of methyl ethyl ketone and 3 g of methanol were blended to obtain a solution of the photosensitive resin composition.

The solution of the photosensitive resin composition was uniformly coated on a polyethylene terephthalate film having a thickness of 20 μm and dried for about 10 minutes with a hot air convection dryer at 110 ° C. to cover the polyethylene film having a thickness of 25 μm. A laminated photosensitive film (D-1) was obtained as a film. The film thickness of the photosensitive resin composition layer after drying was 50 μm.

Production Example 12 [Film having embedded layer (thermoplastic resin layer) (C
Preparation of -1)] A resin solution composed of the materials shown in Table 11 was
A 20 μm-thick polyethylene terephthalate film was evenly coated, dried with a hot air convection dryer at 80 to 110 ° C. for 10 minutes to remove the solvent, and a 25 μm-thick polyethylene film was laminated as a cover film. A film having an embedded layer (thermoplastic resin layer) was produced. The total thickness of the obtained embedded layer (thermoplastic resin layer) other than the polyethylene terephthalate film was 80 μm.

[0128]

[Table 11]

Example 1 [(I) Step of Forming Cured Barrier Rib Formed Part at Predetermined Position and Shape on Substrate] Stripe Width 80 μm
m, a silver electrode having a thickness of 15 μm in parallel with the longitudinal direction of the substrate,
The cover film of the photosensitive film (D-1) obtained in Production Example 11 was peeled off onto a transparent substrate for a back plate having a 40-inch diagonal (61 cm long, 81 cm wide) provided at regular intervals, and Heating temperature is 8 so that the resin composition layer is in contact with the substrate surface.
The laminate was laminated three times at 0 ° C., a pressure of 1 × 10 ⁴ N / m (linear pressure), and a feed speed of the substrate of 3 m / min. The thickness of the photosensitive resin composition layer on the substrate was 150 μm.

Next, on the photosensitive resin composition layer,
In parallel with the longitudinal direction of the substrate, the opening width between the barrier ribs (exposed portion) is 150 μm, and the width of the barrier rib (light shielding portion) is 70 μm.
m are superimposed so that the center of the opening width between the barrier ribs is the center of the electrode width, and a parallel light exposure machine HMW-590 manufactured by Oak Manufacturing Co., Ltd. is used. Then, ultraviolet irradiation of 120 mJ / cm ² was performed. After standing at room temperature for 15 minutes, it was spray-developed with a 1% by weight aqueous solution of sodium carbonate at 30 ° C. for 70 seconds,
A resist pattern was formed at a position other than the position where the barrier rib was formed. After development, dry at 80 ° C for 10 minutes.
After UV irradiation at ³ J / cm ² using a Toshiba UV irradiator manufactured by Toshiba Corporation, heating was performed at 160 ° C. for 10 minutes.

Next, at the position (between the relief pattern and the relief pattern) of the barrier rib of the substrate on which the relief pattern was formed other than the position where the barrier rib was formed, the (A) barrier rib material (A) obtained in Production Example 3 was obtained.
-1) was embedded by screen printing, defoamed under reduced pressure, and then dried at 80 ° C. for 30 minutes. The process from embedding to drying is repeated twice so as to minimize the loss from drying at the time of final filling to 160 ° C.
For 45 minutes to cure the (A) barrier rib material (A-1).

Then, unnecessary portions of the embedded (A) barrier rib material (A-1) and the surface of the relief pattern were polished flat using a No. 800 sandpaper. Next, (A) the substrate in which the barrier rib material (A-1) is embedded is placed in a 5% by weight aqueous sodium hydroxide solution at 40 ° C. for 1 hour.
After immersion for 5 minutes, the relief pattern was peeled off by immersion in warm water at 50 ° C., and then sufficiently washed with water. The opening width between the barrier ribs was 150 μm, and the width of the barrier ribs was 7 μm.
A substrate was formed in which a striped barrier rib formation portion having a thickness of 0 μm and a barrier rib height of 150 μm was formed.

[(II) Step of Forming a Multicolor Pattern at a Predetermined Position on the Cured Barrier Rib Forming Part] The barrier rib forming part of the substrate on which the cured barrier rib forming part obtained above was formed is formed. Having a layer of the photosensitive resin composition containing the phosphor (B) obtained in Production Example 8 such that the layer of the photosensitive resin composition containing the phosphor (B) is in contact with the side of the photosensitive resin composition containing the phosphor. While peeling off the polyethylene film of the element (B-1), a laminator (manufactured by Hitachi Chemical Co., Ltd.,
Using HLM-3000 (trade name), heating temperature is 60
C., the pressure was 2.5 × 10 ³ N / m (linear pressure), and the substrate was fed at a feed rate of 0.5 m / min.

Next, the polyethylene terephthalate film of the photosensitive element (B-1) having a layer of the photosensitive resin composition containing the phosphor (B) is peeled off, and the photosensitive resin composition containing the phosphor (B) is removed. Production Example 1 on the product layer
The film (C-1) having the embedding layer (thermoplastic resin layer) obtained in Step 2 was placed so that the polyethylene film was in contact with the layer of the photosensitive resin composition containing the phosphor (B),
Laminator (HLM-30, manufactured by Hitachi Chemical Co., Ltd.)
00 type), the heating temperature is 110 ° C., and the pressing pressure is 5
X 10 ³ N / m (linear pressure), the substrate is fed at a feed rate of 0.5 m / min, and (B) a layer of a photosensitive resin composition containing a phosphor is formed so as to follow the inner surface of the concave portion. did.

Next, the film (C-1) having the burying layer (thermoplastic resin layer) was peeled off, and (B) one of three layers between the barrier ribs was formed on the layer of the photosensitive resin composition containing the phosphor. A photomask having an active light transmission width substantially equal to the opening width formed at intervals of the book is placed at the center of the back plate substrate on which the barrier ribs having a diagonal width of 40 inches are formed. The center of the actinic ray transmission width of the photomask is located at a position parallel to the stripe direction. The actinic ray is irradiated at 200 mJ / cm ² using an HMW-201GX type exposure machine manufactured by Oak Manufacturing Co., Ltd. Was illuminated imagewise.

Next, the film was spray-developed with a 1% by weight aqueous solution of sodium carbonate at 30 ° C. for 40 seconds. After development
After drying at 80 ° C. for 10 minutes, ultraviolet irradiation at ³ J / cm ² was performed using a Toshiba UV irradiator manufactured by Toshiba Electric Materials Co., Ltd., followed by heating at 150 ° C. for 30 minutes.

The above pattern was formed by the photosensitive element (B-2) having the layer of the photosensitive resin composition containing the phosphor (B) obtained in Production Example 9 and the photosensitive element (B-2) obtained in Production Example 10. (B) The same applies to the photosensitive element (B-3) having the layer of the photosensitive resin composition containing the phosphor. A stripe of the layer of the photosensitive resin composition containing the blue phosphor was repeatedly formed on the inner surface of the concave portion to form a multicolor pattern.

[(III) Firing step] The cured barrier rib forming portion and the substrate on which the multicolor pattern is formed are heated from room temperature to 450 ° C. at a rate of 2 ° C./min. After reaching 450 ° C., heat treatment (firing) is performed at 450 ° C. for 1 hour, and the organic material in the barrier rib forming portion after curing and the organic components other than the phosphor and the binder in the multicolor pattern are collectively processed. After removal, a fired barrier rib and a multicolor phosphor pattern were formed to obtain a back plate for a plasma display panel.

[Evaluation of Plasma Display Panel Back Plate] The cross section of the plasma display panel back plate obtained above was visually observed with a stereoscopic microscope and an SEM, and the phosphor pattern formed between the barrier ribs was formed. As shown in FIG. 2, nine points (center a, center−) are set with the center A of the plasma display panel back plate as a reference position and each value 3 cm inside from the end of the plasma display panel back plate 5 as an evaluation position. Top b, center-bottom c, left-center d, left-top e, left-bottom f, right-center g, right-top h, right-bottom i) Are shown in Table 12. FIG. 2 is a schematic view showing an evaluation position of the back plate for a plasma display panel.
Is each evaluation position. The evaluation criteria are as follows. ：: The phosphor pattern is uniformly and symmetrically formed on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate. X: The phosphor pattern is not formed uniformly and symmetrically on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate.

Example 2 Example 1 was repeated except that the barrier rib precursor mixture (A-1) obtained in Production Example 3 was replaced with the barrier rib precursor mixture (A-2) obtained in Production Example 4. In the same manner as in Example 1, a back plate for a plasma display panel was obtained. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 12.

Example 3 Example 1 was repeated except that the barrier rib precursor mixture (A-1) obtained in Production Example 3 was replaced with the barrier rib precursor mixture (A-3) obtained in Production Example 5. In the same manner as in Example 1, a back plate for a plasma display panel was obtained. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 12.

Comparative Example 1 The procedure of Example 1 was repeated, except that the barrier rib precursor mixture (A-1) obtained in Production Example 3 was replaced with the barrier rib precursor mixture (A-4) obtained in Production Example 6. In the same manner as in Example 1, a back plate for a plasma display panel was obtained. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 12.

Comparative Example 2 In Example 1, [(I) a step of forming a cured rib formation portion at a predetermined position and shape on a substrate] was performed, and then the following [firing step] was performed. Then
Plasma display was performed in the same manner as in Example 1 except that [(II) the step of forming a multicolor pattern at a predetermined position on the barrier rib forming portion after curing] and [(III) the firing step] were performed. A back plate for a panel was obtained. [Firing Step] The substrate on which the barrier rib forming portion after curing is formed is heated from room temperature to 450 ° C. at a rate of 2 ° C./min, and after reaching 450 ° C., is heated at 450 ° C. for 1 hour (firing). The organic material in the barrier rib forming portion after curing was removed to obtain a substrate on which the fired barrier rib was formed. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 12.

[0144]

[Table 12]

From the results shown in Table 12, the phosphor pattern of the plasma display panel back plate (Examples 1 to 3) manufactured by using the method of manufacturing a plasma display panel back plate of the present invention is the same as that of the PDP substrate. A high-precision, high-quality back plate for a plasma display panel, which is uniformly and symmetrically formed on the inner surface of the recess (the barrier rib wall surface and the substrate surface), was obtained. On the other hand, the phosphor pattern of the back plate for a plasma display panel using the method of Comparative Example 1 and Comparative Example 2 is uniformly and symmetrically formed on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate. It was not formed (the position of the phosphor pattern was shifted), and was not practical for a plasma display panel back plate.

[0146]

According to the method for manufacturing a back plate for a plasma display panel according to the first aspect of the present invention, the number of steps is reduced, the strength of the barrier rib forming portion is improved, workability is improved, energy is reduced, and dimensional accuracy is improved. A back panel for a display panel can be manufactured with high yield. The method for manufacturing a back plate for a plasma display panel according to claim 2 is described in claim 1.
The effect of the manufacturing method of the back plate for a plasma display panel described above is exhibited, and the stripping liquid resistance of the barrier rib forming portion when removing the relief pattern is excellent.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of each step of a method for manufacturing a back plate for a plasma display panel according to the present invention.

FIG. 2 is a schematic diagram showing an evaluation position of a back plate for a plasma display panel.

[Explanation of symbols]

 1 Substrate 2a Barrier rib forming part after curing 2b Barrier rib after firing 3a First color pattern 3b Second color pattern 3c Third color pattern 4a First color phosphor pattern 4b Second color phosphor pattern 4c Third color phosphor pattern 5 Back plate for plasma display panel a center b center-top c center-bottom d left-center e left-top f left-bottom g right-center h right-top i right-bottom

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Kazuya Sato 4-3-1-1, Higashicho, Hitachi City, Ibaraki Prefecture Inside the Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Yumiko Sugiura 4-13 Higashimachi, Hitachi City, Ibaraki Prefecture No. 1 Hitachi Chemical Co., Ltd.Ibaraki Research Laboratory (72) Inventor Mariko Shimamura 4-3-1 Higashicho, Hitachi City, Ibaraki Prefecture Hitachi Chemical Co., Ltd.Ibaraki Research Laboratory (72) Inventor Yukiko Muramatsu Hitachi City, Ibaraki Prefecture 4-13-1, Higashicho, Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Seiji Tai 4-3-1-1, Higashicho, Hitachi City, Ibaraki Prefecture, Japan Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Hiroyuki Tanaka 4-13-1, Higashicho, Hitachi City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Yamazaki Plant F-term (reference) 5C027 AA09 5C040 GA03 GF18 GF18 GF19 GG09 JA02 JA15 JA21 KA09 KA14 MA26

Claims (2)

[Claims] 1. A barrier rib formed at a predetermined position and shape on a substrate using a barrier rib material containing (A) an inorganic material and (a) an organic material containing a polymer binder having an ethylenically unsaturated group. A plasma display characterized by forming a multicolored pattern containing a phosphor and an organic material at a predetermined position on the cured barrier rib forming portion by photolithography after curing the forming portion, and firing in this state. Manufacturing method of panel back plate. 2. The method according to claim 1, wherein the hardened barrier rib forming portion is (Ia)
A) a step of embedding a barrier rib material in a gap between relief patterns provided at predetermined positions on the substrate, a step of curing the barrier rib material, and a step of removing the relief pattern. The method for producing a back plate for a plasma display panel according to claim 1, which is obtained by the following steps: