JP2001068018A - Manufacture of back face plate for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a back face plate for PDP with good yield, a decreased man-hours, good workability, low energy, and superior dimensional accuracy. SOLUTION: An element for barrier rib formation is structured with a resin composition layer for barrier rib formation being formed on a supporting film, wherein a multi-color pattern containing phosphor and organic substances is formed by photolithographic process in the prescribed position on a barrier rib forming part provided on a board in a prescribed position and shape, followed by a baking process, and thus a back face plate for plasma display panel is accomplished.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a back plate for a plasma display panel.

[0002]

2. Description of the Related Art Conventionally, as one of flat panel displays, a plasma display panel (hereinafter, referred to as a PDP) capable of performing multicolor display by providing a phosphor which emits light by plasma discharge has been known. In the PDP, a flat front plate and a rear plate made of glass are disposed in parallel and opposed to each other, and both are held at a fixed interval by a fired barrier rib provided therebetween. , And discharges in a space surrounded by the back plate and the fired barrier ribs. In such a space, a phosphor for display is applied, and the phosphor is caused to emit light by ultraviolet rays generated from the sealing gas by discharge, so that the light can be visually recognized by an observer.

Conventionally, a back plate for a PDP has a barrier rib before curing by a printing method using a paste of a barrier rib material (a mixture of an inorganic material and a resin) on a flat plate on which a plurality of electrodes are arranged and arranged. After forming the barrier ribs before curing by a method of forming the barrier ribs before curing by using a photosensitive film, and curing the resin component in the barrier ribs as necessary,
By heating the barrier rib by heating to 00 to 650 ° C., the organic binder and the like are scattered and removed, and after cooling the substrate, using an organic binder and the like containing a phosphor,
After forming a multicolor pattern at a desired position,
It has been produced by baking the substrate at a temperature of about 650 ° C., scattering and removing an organic binder and the like, and forming a phosphor pattern.

As a method of forming a barrier rib before curing, a thick film printing method using a printing screen and a glass powder paste has been generally known, and a position using a photosensitive material has been known. Method of forming barrier ribs before curing with high accuracy (Japanese Patent Application Laid-Open Nos.
Japanese Patent Application Laid-Open No. 165540/1995, Japanese Patent Application Laid-Open No. 7-192626) have also been proposed. In any of these methods, after forming the barrier rib material at a desired position in any of the methods, they are used.
By firing at about 0 ° C., a fired barrier rib is obtained.

As a method of forming a phosphor pattern using a substrate on which barrier ribs have been formed after firing, a method of applying a slurry liquid or paste in which phosphors of each color are dispersed by a printing method such as screen printing. (Japanese Unexamined Patent Publication No.
JP-A-115027, JP-A-1-124930, JP-A-2-155142, etc.), and as a method of forming a phosphor pattern with high positional accuracy, a photosensitive material containing a phosphor is used. A method using an element (photosensitive film) (JP-A-6-273925, etc.) has been proposed.

A conventional back panel for a PDP is formed by forming a barrier rib before curing or a barrier rib after curing on a flat plate, baking it at 400 to 650 ° C., cooling it, and then using a printing method such as screen printing or a phosphor. After forming a multicolor pattern by a method of disposing a multicolor pattern at a desired position using a pattern mask, using a photosensitive film containing, the substrate is again heated to about 400 ° C. to 650 ° C. It was manufactured by heating to scatter and remove the organic binder and the like to form a phosphor pattern. However, the substrate shrinks due to heating at the time of firing the barrier rib before curing or the barrier rib after curing. In the case of a substrate having a size of about 50 cm square, the size is reduced by several tens to several hundreds of microns). Use pattern mask, it will not match, it was very difficult to perform satisfactory patterning. In addition, this problem is a very serious problem in manufacturing a large-screen PDP because the error increases as the display area of the PDP increases.

On the other hand, a pattern mask or a screen mask for a phosphor pattern is used in accordance with the reduction ratio of the substrate.
There is a case where the barrier ribs before curing or the barrier ribs after curing are slightly reduced in size from the molded size to correspond to each other, but the reduction width of the substrate during firing is not necessarily constant,
Since the reduction width is partially different, the yield of products is poor, and it is very difficult to manufacture a large-screen PDP with dimensional accuracy.

In addition, the barrier ribs of the PDP can be manufactured with excellent positional accuracy and shape, and the extra barrier rib material is extremely small in amount, so that the additive method (photography) can have features such as low cost and low pollution. Embedding method) has been proposed, but in the case of the photo embedding method, in order to embed the barrier rib material into the gap of the relief pattern,
It is necessary to paste the barrier rib material and use a screen printing method. Therefore, it is necessary to sufficiently stir the barrier rib material before embedding and to confirm the dispersibility of each component contained in the barrier rib. In addition, since the barrier rib of the PDP must be formed to a thick film of 100 μm to 250 μm, screen printing is required. It is necessary to repeat the process several times, and in some cases, when removing the relief pattern,
Since unnecessary barrier rib material on the relief pattern needs to be removed by polishing or the like, there is a problem that the process is complicated and long.

[0009]

SUMMARY OF THE INVENTION According to the first aspect of the present invention, the number of steps is reduced, workability is improved, energy is reduced,
An object of the present invention is to provide a method of manufacturing a PDP back plate that can produce a PDP back plate having excellent dimensional accuracy with high yield. The second aspect of the present invention provides a method of manufacturing a PDP back plate capable of forming a PDP barrier rib having an excellent shape. The third aspect of the present invention can provide a method of manufacturing a back plate for a PDP capable of forming barrier ribs having excellent strength.

[0010]

According to the present invention, a barrier rib forming element having a resin composition layer for forming a barrier rib is formed on a substrate film at a predetermined position and shape on a substrate. The present invention relates to a method for manufacturing a back plate for a plasma display panel, wherein a multicolor pattern containing a phosphor and an organic material is formed at a predetermined position on a barrier rib forming portion by a photolithographic method and fired in this state. The present invention also relates to a method for manufacturing a back plate for a plasma display panel, wherein the barrier rib forming resin composition layer contains an inorganic material and an organic binder. Further, the present invention is a plasma display in which after forming a barrier rib, after curing the barrier rib forming portion, a multicolor pattern including a phosphor and an organic material is formed at a predetermined position on the barrier rib forming portion by a photolithographic method. The present invention relates to a method for manufacturing a back panel for a panel.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The barrier rib forming element used in the present invention is a solution in which the components constituting the barrier rib forming resin composition layer are uniformly dissolved or dispersed in an organic solvent (barrier rib forming resin composition solution). Is coated on a support film and dried to form a resin composition layer for forming a barrier rib. Examples of the support film include a film made of polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, or the like and having a thickness of about 5 to 100 μm. As the coating method, a known method can be used, and examples thereof include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, and a curtain coating method. The drying temperature varies depending on the thickness of the barrier rib-forming resin composition layer, but is preferably from 60 to 130.
C., and the drying time is preferably 3 minutes to 1 hour.

In the barrier rib forming element having the support film and the barrier rib forming resin composition layer, a cover film may be further laminated on the barrier rib forming resin composition layer. As such a cover film, a film made of polyethylene, polypropylene, polyethylene terephthalate, polycarbonate or the like and having a thickness of about 5 to 100 μm can be mentioned. The barrier rib forming element thus obtained is
It can be stored in roll form or used.

The thickness of the barrier rib forming resin composition layer is as follows:
The thickness of the barrier rib forming resin composition layer covering the upper surface of the relief pattern can be made extremely thin as 1 μm or less, and the barrier rib forming resin composition layer covering the upper surface of the relief pattern can be removed in a later step before removing the relief pattern. The relief pattern per unit area of the substrate provided with the relief pattern, the void volume (V2) of the relief pattern, and the barrier rib forming resin composition per unit area, because they can be unnecessary or can be easily removed. The ratio ((V1) / (V2)) of the volume (V1) of the material layer is 1
The thickness is preferably in the range of 1.0 to 1.2, more preferably in the range of 1.02 to 1.18, and more preferably in the range of 1.05 to 1.15. It is particularly preferred that the thickness be as small as possible. Here, (V
If 1) / (V2) is less than 1, the resin composition for forming a barrier rib tends not to be sufficiently embedded in the gap between the relief patterns.
When 1) / (V2) exceeds 2, the thickness of the unnecessary resin composition layer for barrier rib formation that covers the upper surface of the relief pattern tends to be large. Considering the above points, the thickness of the barrier rib-forming resin composition layer is generally from 10 to 200.
μm.

The barrier rib-forming resin composition layer has a thickness of 100
The viscosity at ° C. is preferably 1 to 1 × 10 ⁷ Pa · sec, more preferably 2 to 1 × 10 ⁶ Pa · sec,
It is particularly preferably ⁵ to 1 × 10 ⁵ Pa · sec.
It is extremely preferable that the pressure be about 1 × 10 ⁴ Pa · sec. When the viscosity at 100 ° C. is less than 1 Pa · sec, the viscosity at room temperature becomes too low, and when used as a barrier rib forming element, the resin composition layer for forming a barrier rib tends to bleed from an end portion by flow. , There is a tendency for film formability to decrease. If it exceeds 1 × 10 ⁷ Pa · sec, the embedding property of the resin composition layer for forming a barrier rib into the gap between the relief patterns tends to decrease.

The barrier rib-forming resin composition solution used for manufacturing the barrier rib-forming element of the present invention contains an inorganic material, an organic material, an organic solvent and the like. As the inorganic material in the barrier rib forming resin composition solution,
Examples include inorganic pigments and inorganic binders. The inorganic pigment is not particularly limited, for example, titanium oxide, alumina,
Inorganic materials such as magnesia, zinc oxide, iron oxide, chromium oxide, and copper oxide may be mentioned, and these may be used alone or in combination of two or more. The inorganic binder is not particularly limited, and includes, for example, a known glass frit material such as a low melting point glass.

The organic material in the barrier rib forming resin composition solution is not particularly limited, and may be, for example, a known polymer, oligomer, monomer or the like. Examples of the polymer include polymethyl acrylate,
Polymethyl methacrylate, polystyrene, polyethylene, polyvinyl acetate, copolymer of ethylene and vinyl acetate, copolymer of ethylene and acrylate, copolymer of vinyl chloride and vinyl acetate, styrene and acrylate or methacryl Copolymer with acid ester, copolymer with vinyl toluene and acrylate or methacrylate, or vinyl having functional groups such as carboxyl group, hydroxyl group, amino group, isocyanate group, oxirane ring, and acid anhydride The copolymer has at least one ethylenically unsaturated group and an oxirane ring, an isocyanate group,
Polymer binder having an ethylenically unsaturated group, such as a radical polymerizable copolymer having an ethylenically unsaturated group in a side chain obtained by subjecting a compound having one functional group such as a hydroxyl group or a carboxyl group to an addition reaction Is mentioned. Examples of the oligomer include ethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, and the like.

As the monomer, for example, all of those conventionally known as radically polymerizable monomers can be used. For example, acrylic acid or methacrylic acid ester monomers (methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, i-propyl acrylate, i-propyl methacrylate, N-butyl acrylate, n-butyl methacrylate, i-acrylate
-Butyl, i-butyl methacrylate, s-butyl acrylate, s-butyl methacrylate, t-butyl acrylate, t-butyl methacrylate, pentyl acrylate, pentyl methacrylate, hexyl acrylate, hexyl methacrylate, acrylic Heptyl acid, heptyl methacrylate, 2-ethylhexyl methacrylate, 2-ethylhexyl methacrylate, octyl acrylate, octyl methacrylate, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, dodecyl acrylate, methacryl Dodecyl acrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, eicosyl acrylate, methacryl Eicosyl, docosyl acrylate, docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, methacrylic acid Phenyl, methoxyethyl acrylate, methoxyethyl methacrylate, methoxydiethylene glycol acrylate, methoxydiethylene glycol methacrylate, methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate,
Methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, glycidyl methacrylate, etc., styrene monomers (styrene, α-methylstyrene, pt-butylstyrene, etc.), polyolefin monomers (butadiene, isoprene, chloroprene, etc.) ), Vinyl monomers (vinyl chloride, vinyl acetate, etc.), nitrile monomers (acrylonitrile, methacrylonitrile, etc.), 1- (methacryloyloxyethoxycarbonyl) 2- (3′-chloro-2′-hydroxypropoxycarbonyl) benzene , Ethylene glycol diacrylate, ethylene glycol dimethacrylate,
Diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, hexapropylene glycol diacrylate, hexapropylene Glycol dimethacrylate,
Polypropylene glycol diacrylate, polypropylene glycol dimethacrylate, butylene glycol diacrylate, butylene glycol dimethacrylate, neopentylglycol t-tol diacrylate, neopentyl glycol dimethacrylate, 1,3-butanediol diacrylate, 1,3-butane Diol dimethacrylate, 1,4-butanediol diacrylate,
1,4-butanediol dimethacrylate, 1,5-pentanediol diacrylate, 1,5-pentanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol diacrylate, Pentaerythritol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, bisphenol A diacrylate, bisphenol A dimethacrylate, 2,2-bis (4-acryloxyethoxyphenyl) propane, 2,2-bis (4- Acryloxydiethoxyphenyl) propane, 2,2-bis (4-methacryloxydiethoxyphenyl) propane, 2,2-bis (4-acryloxypolyethoxyphenyl) propane, 2- bis (4-methacryloxy polyethoxy phenyl) propane, bisphenol A diglycidyl ether diacrylate, bisphenol A diglycidyl ether dimethacrylate, urethane diacrylate compounds, trimethylol propane triacrylate, trimethylol propane di methacrylate,
Pentaerythritol triacrylate, pentaerythritol trimethacrylate, ethylene oxide-modified trimethylolpropane triacrylate, ethylene oxide-modified trimethylolpropane trimethacrylate,
Trimethylolpropane triglycidyl ether triacrylate, trimethylolpropane triglycidyl ether trimethacrylate, tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol penta Examples include methacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexamethacrylate. These are used alone or in combination of two or more.

The carboxyl group, hydroxyl group, amino group,
Oxirane ring, as an essential vinyl monomer used for producing a vinyl copolymer having a functional group such as an acid anhydride,
For example, acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, cinnamic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, ethyl isocyanate methacrylate, glycidyl acrylate, glycidyl methacrylate And vinyl monomers having a functional group such as a carboxyl group such as maleic anhydride, a hydroxyl group, an amino group, an oxirane ring, and an acid anhydride. These are used alone or in combination of two or more.

There are no particular restrictions on other vinyl monomers used as needed in the production of the vinyl copolymer. For example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate , N-propyl acrylate, n-propyl methacrylate, i-propyl acrylate, i-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, i-butyl acrylate, i-butyl methacrylate, acrylic Acid
-Butyl, s-butyl methacrylate, t-butyl acrylate, t-butyl methacrylate, pentyl acrylate,
Pentyl methacrylate, hexyl acrylate, hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, methacrylic acid 2
-Ethylhexyl, octyl acrylate, octyl methacrylate, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate Octadecyl acrylate, octadecyl methacrylate, eicosyl acrylate, eicosyl methacrylate, docosyl acrylate, docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate,
Cyclohexyl methacrylate, cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, methoxyethyl acrylate, methoxyethyl methacrylate, methoxyethyl methacrylate, methoxydiethylene glycol methacrylate, Methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, diethylaminoethyl acrylate, diethylaminoethyl methacrylate, Dimethylaminopropyl acrylate, dimethylamino methacrylate Propyl, 2-fluoroethyl acrylate, 2-fluoroethyl methacrylate, 2-cyanoethyl acrylate, 2-cyanoethyl methacrylate, styrene, α-methylstyrene, vinyltoluene, vinyl chloride, vinyl acetate, N-vinylpyrrolidone, butadiene , Isoprene, chloroprene, acrylonitrile, methacrylonitrile and the like. These are used alone or in combination of two or more.

The compound having at least one ethylenically unsaturated group and one functional group such as an oxirane ring, an isocyanate group, a hydroxyl group, a carboxyl group, an amino group and an acid anhydride to be subjected to an addition reaction to a vinyl copolymer is given as For example,
Glycidyl acrylate, glycidyl methacrylate,
Acrylic glycidyl ether, α-ethylacryl glycidyl, crotonyl glycidyl ether, glycidyl crotonate, glycidyl isocrotonic acid, ethyl acrylate isocyanate, 2-hydroxyethyl acrylate,
Examples include 2-hydroxyethyl methacrylate, acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, cinnamic acid, acrylamide, methacrylamide, and maleic anhydride. These are used alone or in combination of two or more.

Hereinafter, examples of the polymer binder having an ethylenically unsaturated group will be listed. (1) A vinyl copolymer obtained by polymerizing methacrylic acid as an essential component is dissolved in an inert solvent, and a catalyst such as triethylamine, triethyldiamine, benzyltriethylammonium chloride, and a polymerization inhibitor such as hydroquinone are added. A polymer binder obtained by adding glycidyl methacrylate to a carboxyl group derived from methacrylic acid of a vinyl copolymer. (2) A vinyl copolymer obtained by polymerizing isocyanate ethyl methacrylate as an essential component is dissolved in an inert solvent, and a catalyst such as dibutyltin dilaurate, dibutyltin onside, triethylamine, triethyldiamine, benzyltriethylammonium chloride, etc. And a polymer binder obtained by adding a polymerization inhibitor such as hydroquinone, and subjecting 2-hydroxyethyl methacrylate to an isocyanate group derived from isocyanateethyl methacrylate of a vinyl copolymer.

(3) A vinyl copolymer obtained by polymerizing 2-hydroxyethyl methacrylate as an essential component is dissolved in an inert solvent, and dibutyltin dilaurate, dibutyltin oxide, triethylamine, triethyldiamine, benzyl chloride are dissolved. A polymer binder obtained by adding a catalyst such as triethylammonium and a polymerization inhibitor such as hydroquinone, and subjecting isocyanateethyl methacrylate to an addition reaction with a hydroxyl group derived from 2-hydroxyethyl methacrylate of a vinyl copolymer. (4) A vinyl polymer obtained by copolymerizing maleic anhydride as an essential component is dissolved in an inert solvent, and a catalyst such as triethylamine, triethyldiamine, benzyltriethylammonium chloride and a polymerization inhibitor such as hydroquinone are added. Polymer binder obtained by adding 2-hydroxyethyl acrylate to an acid anhydride.

(5) A vinyl copolymer obtained by copolymerizing 2-hydroxyethyl methacrylate as an essential component is dissolved in an inert solvent, and a catalyst such as triethylamine, triethyldiamine, benzyltriethylammonium chloride and hydroquinone are used. A polymer binder obtained by adding a polymerization inhibitor of the formula (1) to cause an addition reaction of maleic anhydride to a hydroxyl group derived from 2-hydroxyethyl methacrylate of a vinyl copolymer. (6) A vinyl copolymer obtained by copolymerizing methacrylic acid as an essential component is dissolved in an inert solvent, and a catalyst such as triethylamine, triethyldiamine, benzyltriethylammonium chloride and a polymerization inhibitor such as hydroquinone are added. A polymer binder obtained by subjecting a glycidyl methacrylate to an addition reaction with a carboxyl group derived from methacrylic acid of a vinyl copolymer, and further adding a maleic anhydride to a generated hydroxyl group.

In the present invention, the resin composition solution for forming a barrier rib is used for improving the strength of the barrier rib forming portion.
A photopolymerization initiator that generates free radicals upon irradiation with actinic light can be used. In the case where the photolithography method is used as a method for curing the barrier rib forming portion, it is necessary to impart photosensitivity to the barrier rib forming resin composition solution. The agent is an essential component.

The photopolymerization initiator which generates free radicals upon irradiation with active light is not particularly limited. Examples thereof include aromatic ketones (benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone) ), N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 4-methoxy-4,4'-diaminobenzophenone, 2-benzyl-2-dimethylamino-1 −
(4-Morophorinophenyl) -butanone-1,2,2
-Dimethoxy-1,2-diphenylethan-1-one,
1-hydroxy-cyclohexyl-phenyl-ketone,
2-methyl-1- (4- (methylthio) phenyl) -2
Morpholinopropanone-1,2,4-diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone, etc., benzoin ether (benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, etc.), benzoin (methyl benzoin, ethyl benzoin, etc.) , Benzyl derivatives (benzyldimethyl ketal, etc.), 2,4,5-triarylimidazole derivatives (2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) 4,5- Di (m-methoxyphenyl) imidazole dimer, 2- (0-fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl) 4,5-diphenylimidazole dimer, − (P
-Methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-
Phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, etc.), acridine derivative (9-phenylacridine,
1,7-bis (9,9'-acridinyl) heptane and the like
And the like. These are used alone or in combination of two or more.

When a photopolymerization initiator which generates free radicals upon irradiation with actinic light is used, the amount of the photopolymerization initiator is determined based on the total amount of the organic material in the resin composition solution for forming a barrier rib.
It is preferably 0.01 to 30 parts by weight, more preferably 0.1 to 20 parts by weight, based on 0 parts by weight. If the amount is less than 0.01 part by weight, the photocuring of the barrier rib-forming resin composition tends to be insufficient. If the amount exceeds 30 parts by weight, the activity of the barrier rib-forming resin composition on the exposed surface is reduced. Light absorption increases and the internal light curing tends to be insufficient.

In the barrier rib-forming resin composition solution of the present invention, in the step of curing the barrier rib-forming resin composition, which will be described later, the curing can be accelerated and the strength of the barrier rib-forming portion can be improved. Can be used.

The thermal polymerization initiator which generates free radicals upon heating is not particularly limited, and includes, for example, acetyl peroxide, cumyl peroxide, t-butyl peroxide, propionyl peroxide, benzoyl peroxide, 2-benzoyl peroxide. Chlorobenzoyl, 3-chlorobenzoyl peroxide, 4-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, 4-bromomethylbenzoyl peroxide, lauroyl peroxide, potassium peroxide, diisopropyl peroxycarbonate, tetralin hydroperoxide, 1-phenyl-2-methylpropyl-1-hydroperoxide, pertriphenylacetic acid
t-butyl, t-butyl hydroperoxide, formic acid t
-Butyl, t-butyl peracetate, t-butyl perbenzoate,
Peroxides such as t-butyl perphenylacetate, t-butyl per-4-methoxyacetate, t-butyl perN- (3-toluyl) carbamate, 2,2'-azobispropane, 2,2 '
-Dicyclo-2,2'-azobispropane, 1,1'-
Azo (methylethyl) diacetate, 2,2'-azobis (2-amidinopropane) hydrochloride, 2,2'-azobis (2-amidinopropane) nitrate, 2,2'-azobisisobutane, 2,2 ' -Azobisisobutylamide,
2,2'-azobisisobutyronitrile, methyl 2,2'-azobis-2-methylpropionate, 2,2'-dichloro-2,2'-azobisbutane, 2,2'-azobis-2-methyl Butyronitrile, dimethyl 2,2'-azobisisobutyrate, 1,1'-azobis (sodium 1-methylbutyronitrile-3-sulfonate), 2- (4-
Methylphenylazo) -2-methylmalonidinitrile,
4,4'-azobis-4-cyanovaleric acid, 3,5-dihydroxymethylphenylazo-2-methylmalonodinitrile, 2- (4-bromophenylazo) -2-allylmalonodinitrile, 2,2 ' -Azobis-2-methylvaleronitrile, dimethyl 4,4'-azobis-4-cyanovalerate, 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobiscyclohexanenitrile, 2, 2'-azobis-2-propylbutyronitrile, 1,1'-azobis-1-chlorophenylethane,
1,1'-azobis-1-cyclohexanecarbonitrile, 1,1'-azobis-1-cycloheptanenitrile, 1,1'-azobis-1-phenylethane,
Ethyl 1'-azobiscumene-4-nitrophenylazobenzylcyanoacetate, phenylazodiphenylmethane,
Phenylazotriphenylmethane, 4-nitrophenylazotriphenylmethane, 1,1'-azobis-1,2
Diphenylethane, poly (bisphenol A-4,
Azo compounds such as 4'-azobis-4-cyanopentaate) and poly (tetraethylene glycol-2,2'-azobisisobutyrate); 1,4-bis (pentamethylene) -2-tetrazene; , 4-dimethoxycarbonyl-1,4-diphenyl-2-tetrazen, benzenesulfonyl azide and the like. These are used alone or in combination of two or more.

When a thermal polymerization initiator which generates free radicals by heating is used, the amount is from 0 to 20 parts by weight based on 100 parts by weight of the total amount of the organic materials in the barrier rib forming resin composition solution. Preferably, 0.1 to 1
More preferably, it is 0 parts by weight.

The organic solvent used in the barrier rib-forming resin composition solution of the present invention is not particularly limited. For example, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate , 2,
2,4-trimethyl-1,3-pentanediol monoisobutyrate, isophorone, butyl carbitol, 3-
Examples include methoxybutyl acetate, butyl carbitol acetate, methylnaphthalene, terpineol and the like. These are used alone or in combination of two or more.

The amount of the organic solvent used is preferably 0 to 80 parts by weight, more preferably 0 to 60 parts by weight, based on 100 parts by weight of the total amount of the inorganic material and the organic material. If the amount exceeds 50 parts by weight, the formability of the barrier rib-forming portion tends to be poor.

In the resin composition solution for forming a barrier rib according to the present invention, the amount of the organic material is 100
The amount is preferably from 1 to 100 parts by weight, more preferably from 2 to 90 parts by weight, based on parts by weight. When the amount is less than 1 part by weight, the strength of the barrier rib forming portion tends to decrease, and when the amount exceeds 100 parts by weight, the volume of the barrier rib after firing tends to increase, and the barrier rib formed on the substrate tends to increase. Tend to peel off. In addition,
It is preferable that the difference between the volume of the barrier rib forming portion before firing and the volume of the barrier rib forming portion after firing is smaller.

The method of manufacturing the back plate for a plasma display panel according to the present invention includes, for example, (I) a step of forming a barrier rib forming portion at a predetermined position and shape on a substrate;
A method of performing each step of (I) a step of forming a multicolor pattern at a predetermined position on the barrier rib forming portion and (III) a baking step is exemplified.

The substrate according to the present invention may be a substrate on which electrodes are formed and whose surface is insulative or insulated, and which has heat resistance or is subjected to a heat treatment. There is no particular limitation, for example, glass (soda glass, high strain point glass, etc.), alumina, enamel, and the like. These substrates may be subjected to a surface treatment for adhesion. The thickness of these substrates is usually
0.5 to 10 mm.

Examples of the material of the electrode formed on the substrate in the present invention include Ag, Al, ITO (indium tin oxide), Cr—Cu—Cr, and the like.
In order to form an electrode using these materials, for example, a method such as a screen printing method, a sputtering method, or a photolithographic method can be used. The width of the electrode formed in a stripe shape is usually 50 to 150 μm.
And its thickness is usually 1 to 20 μm.

The barrier rib is formed by laminating a barrier rib forming element on a substrate provided with a plurality of removable relief patterns so that the barrier rib forming resin composition layer is in contact with the substrate, and forming a gap between the plurality of relief patterns. After embedding the resin composition for forming a barrier rib, the relief pattern is removed to form a pattern made of the resin composition for forming a barrier rib on a substrate.

The method of forming a relief pattern on a substrate can be performed by using a predetermined resin composition and applying a printing method or a photographic method, but from the viewpoint of the precision of the relief pattern, the photographic method is not suitable. preferable. The photographic method is a method in which a photosensitive resin composition layer is formed on a substrate, the photosensitive resin composition layer is exposed in a pattern, and developed to form a relief pattern on the substrate.

As a method of forming a photosensitive resin composition layer on a substrate, the photosensitive resin composition is applied directly on the substrate,
There is a method of drying the photosensitive resin layer of the photosensitive film on the substrate by laminating the photosensitive resin layer of the photosensitive film on the substrate with a laminator using a method of drying as necessary, a photosensitive film, and the like. From the viewpoint that the thickness (height) of the relief pattern can be increased, the latter method using a photosensitive film is preferable. The photosensitive film has a support film and a photosensitive resin layer.For example, a photosensitive resin composition is coated on a support film such as a polyethylene terephthalate film, and dried as necessary to form a photosensitive resin composition. Manufactured by forming layers.
As the photosensitive resin composition, known ones can be used without particular limitation, and examples thereof include a negative photosensitive resin composition and a positive photosensitive resin composition.

The negative-type photosensitive resin composition is not particularly limited and known ones can be used. Examples thereof include an ethylenically unsaturated compound, a carboxyl group-containing film-imparting polymer and a photopolymerization initiator as essential components. In addition, if necessary, a photopolymerizable composition containing a dye or pigment, other additives, and an organic solvent may be used. The positive photosensitive resin composition is not particularly limited and known ones can be used. For example, a 1,2-naphthoquinonediazide-based compound and a photo-plastic group-forming composition using an o-nitrobenzyl-based compound can be used. And acid-decomposable and acid-decomposable compositions using compounds, onium salts and the like.

The photosensitive resin composition layer formed on the substrate by using such a photosensitive resin composition is exposed to actinic rays through a negative mask having a predetermined pattern, or the like, and is exposed in a pattern form. After being heated accordingly, the photosensitive resin composition layer is selectively removed by development to form a plurality of relief patterns on the substrate. The developing method is not particularly limited, and examples thereof include wet development and dry development. In the case of wet development, a developer corresponding to the photosensitive resin composition is used. As the developer, for example,
A dilute aqueous solution of sodium carbonate or potassium carbonate is used, and examples of the developing method include an immersion method and a spray method. Further, the relief pattern formed on the substrate may be heated and / or exposed to light in a developing solution for the purpose of improving strength, solvent resistance, and the like.

The thickness (height) of the obtained relief pattern
Is about 50 to 250 μm, and if it is a striped or rectangular relief pattern, its width is 50 to 2 μm.
50 μm.

The lamination of the barrier rib forming element on the substrate having the relief pattern formed in this manner is performed by removing the cover film when the cover film is present on the barrier rib forming element, and then removing the relief pattern. In such a manner that the barrier rib-forming resin composition layer is in contact with the surface provided with the above, pressure bonding is performed by a pressure roll using a laminator or the like.

The pressure roll may be provided with a heating means so as to be able to heat and pressure, and the heating temperature at the time of pressure bonding is preferably 10 to 150 ° C., preferably 20 to 150 ° C.
The temperature is more preferably set to 135 ° C, particularly preferably 30 to 130 ° C. If the heating temperature is lower than 10 ° C., the embedding property of the relief pattern of the resin composition layer for forming a barrier rib into the gap tends to decrease.
When the temperature exceeds ℃, the resin composition layer for forming a barrier rib tends to be thermally cured. In addition, the pressure at the time of crimping is 5
0 to 1 × 10 ⁵ N / m, preferably 2.5 × 10 ⁵ N / m
More preferably to ^{2 ~5 × 10 4 N / m} , 5 × 10 2
It is particularly preferable to set to ４4 × 10 ⁴ N / m. If the pressure is less than 50 N / m, the embedding property of the resin composition for forming a barrier rib into the relief pattern gap tends to decrease. If the pressure exceeds 1 × 10 ⁵ N / m, the relief pattern tends to be broken. There is.

In order to improve the embedding property of the resin composition layer for forming the barrier rib into the gap of the relief pattern, the substrate provided with the relief pattern may be preheated at 30 to 140 ° C. for about 0.5 to 20 minutes. preferable. Further, for the same purpose, the surface of the pressure roll has a thickness of 20 mm.
It is also possible to use one made of a highly flexible material such as rubber or plastic of about 0 to 400 μm. Further, for the same purpose, the above-mentioned laminating operation by pressure bonding and heat pressure bonding can be performed under reduced pressure of 5 × 10 ⁴ Pa or less. After the lamination is completed, 30 to 20
In a range of 0 ° C., heating may be performed for 1 to 120 minutes. At this time, if a support film is present on the barrier rib forming resin composition layer, the support film is removed as necessary. Is also good.

The heating conditions, the pressure conditions, the preheating conditions of the substrate provided with the relief pattern, and the film pressure of the barrier rib forming resin composition of the barrier rib forming element of the present invention. By appropriately selecting the combination, the thickness of the barrier rib forming resin composition layer covering the upper surface of the relief pattern can be extremely reduced to 1 μm or less.

The resin composition for forming a barrier rib is buried in the gap between the relief patterns on the substrate as described above, and the buried resin composition for forming a barrier rib is cured if necessary, and then the relief pattern is removed. The curing of the barrier rib forming portion in the present invention is performed for the purpose of improving the strength of the barrier rib forming portion. Even without performing the curing step, a multicolor pattern is formed at a predetermined position on the barrier rib forming portion described later. In the step of forming, there may be a strength that can withstand without being deformed or broken. As the curing method in the present invention, for example, thermal curing, light curing, electron beam curing, ultrasonic curing, high frequency curing and the like, but from the viewpoint of workability, ease of material selection, etc.
It is preferred to use thermosetting. Further, these curing methods can be performed alone or in combination of two or more.

The heating temperature when performing thermosetting is 50 to
The temperature is preferably 300 ° C., more preferably 60 to 120 ° C., particularly preferably 70 to 220 ° C., and particularly preferably 80 to 200 ° C. If the heating temperature is lower than 50 ° C., the curing tends to be insufficient, and if it exceeds 300 ° C., the organic material in the barrier rib material tends to decompose during the curing reaction, and the substrate tends to shrink. . The heating time when performing thermosetting is preferably from 5 minutes to 8 hours, more preferably from 1 to 4 hours. If the heating time is less than 5 minutes, the curing tends to be insufficient. If the heating time exceeds 8 hours, the organic material in the barrier rib material tends to decompose during the curing reaction, and the substrate tends to shrink. .

After the hardening of this step, it is preferable to remove excess hardened barrier rib material adhered on the relief pattern for the purpose of facilitating the step of removing the relief pattern described later. As a removing method, for example, there is a method of performing wet polishing of an excessively cured barrier rib material adhered on the relief pattern using sandpaper. The sand paper used at this time is preferably # 100 to # 2000, but considering the roughness of the rib surface and the polishing rate,
It is more preferable to use sandpaper of # 1000 to # 1000. Further, the step of curing the barrier rib material may be performed after the step of removing the relief pattern described above.

The relief pattern can be removed by various methods. For example, when the relief pattern is removed using a stripping solution, the stripping solution to be used is a 1 to 10% by weight aqueous solution of sodium hydroxide or potassium hydroxide. Is mentioned. When the concentration is less than 1% by weight, the peeling effect tends to be too long due to the small effect of peeling, and when it exceeds 10% by weight, the resin composition for forming a barrier rib tends to be damaged. For the temperature of the stripper,
There is no particular limitation, and conditions for suitably performing the peeling of the relief pattern may be appropriately set. As the peeling method, any of the immersion method and the spray method is suitable, and the immersion method and the spray method may be used in combination.

The multicolor pattern in the present invention is formed of a pattern containing a phosphor and an organic material. Examples of the phosphor containing a phosphor and an organic material used when forming a multicolor pattern include, for example, phosphors emitting red, green and blue, and a photosensitive resin containing a phosphor containing one color each. And the like. The photosensitive resin composition containing a phosphor used in forming a multicolor pattern is not particularly limited as long as the photosensitive resin composition contains a phosphor as an essential component. Preferred are those containing a photopolymerizable unsaturated compound having an ethylenically unsaturated group, a photoinitiator that generates free radicals upon irradiation with active light, and a phosphor.
For example, JP-A-9-265906, JP-A-9-2
88973, JP-A-10-92312, JP-A-10-92313, JP-A-10-228103
And those described in Japanese Patent Application Laid-Open Publication No. H10-26095. Further, the blending amounts thereof and the additives can be used in accordance with the above-mentioned publication.

As a method of forming a multicolor pattern at a predetermined position on the barrier rib forming portion, for example, each photosensitive resin composition (one color each containing red, green, and blue phosphors) is used. Using a negative type), a layer of the photosensitive resin composition containing the above-described phosphor is laminated so as to follow the barrier rib forming portion after curing and the inner surface of the concave portion formed by the substrate, and actinic light is imaged. A method of forming a multicolor pattern including phosphors and organic materials that emit red, green, and blue light by repeatedly irradiating an unnecessary portion and removing unnecessary portions by development for each color is exemplified. . Further, the same can be carried out using a photosensitive resin composition (positive type).

As a method of laminating a layer of a photosensitive resin composition containing a fluorescent substance so as to follow the inner surface of the concave portion formed by the barrier rib forming portion and the substrate, for example, the substrate having the barrier rib forming portion formed thereon may be used. There are a method of directly applying, drying and laminating thereon, a method of laminating a photosensitive resin composition containing a phosphor as a photosensitive element by a known method, and the like. After uniformly laminating a layer of a photosensitive resin composition containing a phosphor on the inner surface of the concave portion of the substrate on which the barrier rib forming portion is formed, the transmission width is substantially equal to the opening width of the concave portion for forming the pattern. After irradiating actinic rays imagewise through a photomask having, using a known developer, spray, rocking immersion, brushing,
Development is performed by a known method such as scraping to remove unnecessary portions.

The above-described steps from lamination to development are repeated for each color to form a multicolor pattern comprising a layer of a photosensitive resin composition containing a phosphor that emits red, green and blue colors. Can be. Note that when forming a multicolor pattern, the layer of the photosensitive resin composition containing a fluorescent pair containing each phosphor that emits red, green, and blue independently, for each color of red, green, and blue Can be performed in any order.

The firing method is not particularly limited, and a known firing method can be used. In this firing step, the organic material in the barrier rib forming portion and the fluorescent material in the multicolor pattern containing the phosphor and the organic material are used. Organic components other than the body and the binder are removed by batch firing, and a fired barrier rib and a multicolor phosphor pattern can be formed on the substrate.

The firing temperature during firing is preferably from 350 to 800 ° C., more preferably from 400 to 600 ° C. When the firing temperature is lower than 350 ° C., the organic material in the barrier rib forming portion and the fluorescent substance in the multicolor pattern including the organic material and the organic component other than the binder tend not to be removed, and the firing temperature exceeds 800 ° C. Then, the phosphor in the multicolor pattern tends to deteriorate, and the substrate tends to deform. The firing time during firing is preferably 15 minutes to 28 hours, more preferably 1 to 15 hours, and particularly preferably 3 to 10 hours. If the baking time is shorter than 15 minutes, the organic material in the barrier rib forming portion after curing, and the organic components other than the phosphor and the binder in the multicolor pattern including the phosphor and the organic material tend not to be removed. Beyond time,
Phosphors in the multicolor pattern tend to degrade,
The substrate tends to deform. The rate of temperature rise during firing is 0.
It is preferably 5 to 50 ° C / min, more preferably 1 to 45 ° C / min.

The firing time at the highest temperature is 3 to 120.
Minutes, more preferably 5 to 90 minutes. Also, before reaching the maximum firing temperature, 30
It is preferable to provide a step of maintaining the temperature between 0 and 450 ° C., and the holding time is preferably set to 5 to 100 minutes. In this step, firing can be performed while blowing air or nitrogen gas, if necessary. The flow rate of air or nitrogen gas when firing while blowing air or nitrogen gas is 0 to 30.
The rate is preferably 0 liter / minute, more preferably 0 to 200 liter / minute. Further, the flow rate and type of air or nitrogen gas can be appropriately selected according to the temperature at the time of firing.

[0057]

EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples.

Production Example 1 [Production of barrier rib forming element] The materials shown in Table 1 were mixed for 15 minutes using a raikai machine to obtain a barrier rib forming resin composition solution (A-1).

[0059]

[Table 1]

The obtained barrier rib forming resin solution (A-
1) was uniformly applied on a polyethylene terephthalate film having a thickness of 50 μm and dried for 10 minutes by a hot air convection dryer at 110 ° C. to remove the solvent, thereby forming a resin composition layer for forming a barrier rib. The thickness of the obtained resin composition layer for forming a barrier rib was 50 μm. Next, a polyethylene film having a thickness of 25 μm was further laminated as a cover film on the resin composition layer for forming a barrier rib to prepare an element (E-1) for forming a barrier rib.

Production Example 2 [Production of Barrier Rib Forming Element] The materials shown in Table 2 were mixed for 15 minutes using a raikai machine to prepare a barrier rib forming resin composition layer solution (A-2).

[0062]

[Table 2]

The obtained solution (A-2) for forming a barrier rib-forming resin composition is uniformly applied on a 50 μm-thick polyethylene terephthalate film and dried with a hot air convection dryer at 110 ° C. for 10 minutes. The solvent was removed to form a barrier rib-forming resin composition layer. The thickness of the obtained resin composition layer for forming a barrier rib was 50 μm. Next, on the barrier rib forming resin composition layer, 2
A polyethylene film having a thickness of 5 μm was laminated as a cover film to produce a barrier rib forming element (E-2).

Production Example 3 [Polymer binder having an ethylenically unsaturated group (a-1)
Synthesis of a) A flask equipped with a stirrer, a reflux condenser, an inert gas inlet and a thermometer was charged with (1) shown in Table 3,
The temperature was raised to 80 ° C under a nitrogen gas atmosphere, and the reaction temperature was raised to 80 ±
While maintaining the temperature at 2 ° C., (2) shown in Table 3 was dropped uniformly over 4 hours. After the dropwise addition of (2), stirring was continued at 80 ± 2 ° C. for 6 hours, and then (3) and (4) shown in Table 3 were added dropwise. After the dropwise addition of (4), stirring was continued at 100 ° C. for 20 hours, and the mixture was cooled to room temperature, and had a weight average molecular weight of 60,000,
A photopolymerizable polymer binder (a-1) having an ethylenically unsaturated group in a side chain having an acid value of 0.5 mgKOH / g was obtained.

[0065]

[Table 3]

Production Example 4 [Production of Barrier Rib Forming Element] The materials shown in Table 4 were mixed for 15 minutes using a raikai machine to prepare a barrier rib forming resin composition layer solution (A-3).

[0067]

[Table 4]

The obtained solution (A-3) for forming a barrier rib-forming resin composition was uniformly applied on a polyethylene terephthalate film having a thickness of 50 μm, and dried with a hot air convection dryer at 110 ° C. for 10 minutes. The solvent was removed to form a barrier rib-forming resin composition layer. The thickness of the obtained resin composition layer for forming a barrier rib was 50 μm. Next, on the barrier rib forming resin composition layer, 2
A polyethylene film having a thickness of 5 μm was laminated as a cover film to prepare a barrier rib forming element (E-3).

Production Example 5 [Preparation of film-imparting polymer (d-1)]
A flask equipped with a reflux condenser, an inert gas inlet, and a thermometer was charged with (1) shown in Table 5 and heated to 80 ° C. in a nitrogen gas atmosphere while maintaining the reaction temperature at 80 ± 2 ° C. After dropping (2) shown in Table 5 over 4 hours, 80 ± 2
Stirring was continued for 6 hours at a temperature of 80,000.
0, and a film-giving polymer (d-1) having an acid value of 130 mgKOH / g was obtained.

[0070]

[Table 5]

Production Example 6 [Preparation of Photosensitive Element (B-1) Having Layer of Photosensitive Resin Composition Containing Phosphor] The materials shown in Table 6 were mixed for 15 minutes using a Raikai machine and red A solution of the photosensitive resin composition containing the phosphor was prepared.

[0072]

[Table 6]

The obtained solution was uniformly coated on a polyethylene terephthalate film having a thickness of 20 μm,
The solvent was removed by drying with a hot air convection dryer at 0 ° C. for 10 minutes to form a layer of a photosensitive resin composition containing a red phosphor. A photosensitive element (B-1) having a layer of the photosensitive resin composition containing the obtained red phosphor was obtained.

Production Example 7 [Preparation of Photosensitive Element (B-2) Having Layer of Photosensitive Resin Composition Containing Phosphor] The materials shown in Table 7 were mixed for 15 minutes using a Raikai machine to obtain a green color. A solution of the photosensitive resin composition containing the phosphor was prepared.

[0075]

[Table 7]

Thereafter, a layer of a photosensitive resin composition containing a green phosphor is formed in the same manner as in Production Example 6, and a photosensitive element having a layer of a photosensitive resin composition containing a green phosphor is formed. (B-2) was obtained. The thickness of the obtained layer of the photosensitive resin composition containing the green phosphor after drying is 50 μm.
m.

Production Example 8 [Preparation of Photosensitive Element (B-3) Having Layer of Photosensitive Resin Composition Containing Phosphor] The materials shown in Table 8 were mixed for 15 minutes using a Raikai machine, and blue A solution of the photosensitive resin composition containing the phosphor was prepared.

[0078]

[Table 8]

Thereafter, in the same manner as in Production Example 6, a layer of a photosensitive resin composition containing a green phosphor was formed, and a photosensitive element having a layer of a photosensitive resin composition containing a blue phosphor was prepared. (B-3) was obtained. The thickness of the obtained layer of the photosensitive resin composition containing the blue phosphor after drying is 50 μm.
m.

Production Example 9 [Preparation of photosensitive film (D-1)] 41% by weight of methyl methacrylate / ethyl acrylate / methacrylic acid copolymer (weight ratio 53/30/17, weight average molecular weight 100,000) Methyl cellosolve / toluene (weight ratio 8: 2) solution 1
37 g (solid content 55 g), 34 g of bisphenol A polyoxyethylene dimethacrylate, γ-chloro-β-hydroxypropyl-β-methacryloyloxyethyl-
O-phthalate 11 g, stabilizer (AW-500, manufactured by Kawaguchi Chemical Co., Ltd.) 0.1 g, tribromomethylphenylsulfone 1.2 g, silicone leveling agent (SH-1)
93, manufactured by Toray Silicone Co., Ltd.) 0.04 g, 1,7
-Bis- (9-acridinyl) heptane 0.2 g, benzyldimethyl ketal 3 g, leuco crystal violet 1 g, malachite green 0.05 g, toluene 7
g, 13 g of methyl ethyl ketone and 3 g of methanol were blended to obtain a solution of the photosensitive resin composition.

The solution of the photosensitive resin composition was uniformly coated on a polyethylene terephthalate film having a thickness of 20 μm, and dried with a hot air convection dryer at 110 ° C. for about 10 minutes to cover the polyethylene film having a thickness of 25 μm. It was laminated as a film to obtain a photosensitive film (D-1). The film thickness of the photosensitive resin composition layer after drying was 50 μm.

Production Example 10 [Film having embedded layer (thermoplastic resin layer) (C
-1) Preparation] A resin solution composed of the materials shown in Table 9 was mixed with 2
0 μm thick polyethylene terephthalate film uniformly coated, dried with a hot air convection dryer at 80 to 110 ° C. for 10 minutes to remove the solvent, a 25 μm thick polyethylene film was laminated as a cover film, A film having an embedded layer (thermoplastic resin layer) was produced. The total thickness of the obtained embedding layer (thermoplastic resin layer) other than the polyethylene terephthalate film was 80 μm.

[0083]

[Table 9]

Example 1 [Formation of Relief Pattern] Three layers of the photosensitive film obtained in Production Example 9 were laminated on a substrate to form a photosensitive resin layer having a thickness of 150 μm. A glass plate (3.0 mm thick) was used as a substrate. Lamination was performed under the conditions of a laminating roll temperature of 130 ° C., a roll pressure of 3.9 × 10 ⁵ Pa, and a speed of 1.0 m / min. Next, a negative mask was placed on the polyethylene terephthalate film, and 80 mJ using a 3 kW high-pressure mercury lamp (HMW-590, manufactured by Oak Manufacturing Co., Ltd.).
/ cm ² exposure was performed. 10 minutes at 80 ° C within 5 minutes after exposure
Heated for a minute. Next, after peeling off the polyethylene terephthalate film, spray development was performed with a 1% by weight aqueous sodium carbonate solution at 30 ° C. Then, it is immersed in a 0.5% by weight aqueous solution of hydrogen chloride at 20 ° C., washed with water, drained,
After drying at ℃ for 5 minutes, it was exposed to ² J / cm ² with a 7KW metal halide lamp (manufactured by Oak Manufacturing Co., Ltd.). Then at 150 ° C. for 10
0 heating.

Thus, a substrate having a rectangular cross-sectional shape and provided with a thick-film relief pattern (sheet glass 3 mm thick, vertical 1
0cm x 10cm, line / space = 100 / 70μ
m, relief thickness 150 μm).

[Formation of Barrier Rib] The polyethylene film of the barrier rib forming element (A-1) obtained in Production Example 1 was peeled from the substrate provided with such a relief pattern on the side on which the relief pattern was formed. , Laminator (HLM, manufactured by Hitachi Chemical Co., Ltd.)
-1500 type), the lamination temperature is 100 ° C.,
The laminating speed is 0.5 m / min and the pressing pressure (cylinder pressure) is 4 × 10 ⁵ Pa (thickness 3 mm, length 10 cm × width 10 c)
m, the linear pressure at this time was 9.8 × 10 ³ N /
In m), the barrier rib-forming resin composition layer was pressed and laminated via a polyethylene terephthalate film, and the barrier rib-forming resin composition layer was embedded in the gaps of the relief pattern. At this time, (V1) / (V2) is 1.0
It was 5.

Next, the barrier rib forming element (A-
The polyethylene terephthalate film on the surface not in contact with the relief pattern of 1) was peeled off, and heated at 160 ° C. for 45 minutes to cure the resin composition for forming a barrier rib. Next, it was immersed in a 5% by weight aqueous solution of sodium hydroxide at 45 ° C., and the relief pattern was peeled off and removed, thereby forming a pattern made of the resin composition for forming a barrier rib on the substrate.

[Step of Forming Multicolor Pattern at Predetermined Position on Barrier Rib Forming Part] On the side of the substrate on which the barrier rib forming part was formed, the barrier rib forming part was formed, and While peeling off the polyethylene film of the photosensitive element (B-1) having the layer of the photosensitive resin composition containing the obtained phosphor, a laminator (trade name: HLM-3000, manufactured by Hitachi Chemical Co., Ltd.) was used. The heating temperature is 60 ° C and the pressure is 2.5 × 10 ³ N / m
(Linear pressure), the substrates were stacked at a feed rate of 0.5 m / min.

Next, the polyethylene terephthalate film of the photosensitive element (B-1) having the layer of the photosensitive resin composition containing the phosphor is peeled off, and the layer of the photosensitive resin composition containing the phosphor is removed. Film having a buried layer (thermoplastic resin layer) obtained in Production Example 10 (C-
1) using a laminator (trade name: HLM-3000 type, manufactured by Hitachi Chemical Co., Ltd.) at a heating temperature of 110 ° C. so that the polyethylene film is in contact with the layer of the photosensitive resin composition containing the phosphor. The layers are laminated at a compression pressure of 5 × 10 ³ N / m (linear pressure) and a substrate feeding speed of 0.5 m / min so that the layer of the photosensitive resin composition containing the phosphor follows the inner surface of the recess. Formed.

Next, a buried layer (thermoplastic resin layer)
The film (C-1) having the structure (1) is peeled off, and one of three films is formed between the barrier ribs on the layer of the photosensitive resin composition containing the phosphor.
A photomask having an active light transmission width similar to the opening width formed at the interval between the books is placed at the center of the opening width between the barrier ribs at the center of the back plate substrate on which the diagonal barrier ribs are formed. The center of the actinic ray transmission width of the photomask is positioned and closely contacted so as to be parallel to the stripe direction. The actinic ray is imaged at 200 mJ / cm ² using an HMW-201GX type exposure machine by Oak Manufacturing Co., Ltd. Irradiation. Then, using a 1% by weight aqueous sodium carbonate solution at 30 ° C.
For 40 seconds. After development, dried at 80 ° C. for 10 minutes, using an ultraviolet irradiation device manufactured by Toshiba Electric Materials Co., Ltd.
Irradiation with ³ J / cm ² of ultraviolet light was performed.

Formation of the above-mentioned pattern. The photosensitive element (B-2) having the layer of the photosensitive resin composition containing the phosphor obtained in Production Example 7 and the layer of the photosensitive resin composition containing the phosphor obtained in Production Example 8 were used. The photosensitive element (B-3) is formed in the same manner as described above, and a stripe of a layer of a photosensitive resin composition containing red, green, and blue phosphors is repeatedly formed on the substrate on which the barrier rib forming portion is formed. A multicolor pattern formed on the inner surface was formed.

[Firing Step] The substrate on which the barrier rib forming portion and the multicolor pattern are formed as described above is heated from room temperature to 450 ° C. at a rate of 2 minutes / minute. Heat treatment (firing) at 450 ° C. for 1 hour,
The organic material in the barrier rib forming portion after curing and the organic components other than the phosphor in the multicolor pattern are collectively removed, and the fired barrier rib and the multicolor phosphor pattern are formed to form a back plate for a plasma display panel. I got

[Evaluation of Back Plate for Plasma Display Panel] The cross section of the back plate for plasma display panel obtained above was visually observed with a stereoscopic microscope and SEM, and the state of formation of the phosphor pattern formed between the barrier ribs was observed. Is set as a reference position with the center A of the back plate for a plasma display panel as a reference position, and nine positions (center a, center-up b, center-low c, Left-center d, left-top e,
Left-bottom f, right-center g, right-top h, right-bottom i)
Each of the evaluation positions was evaluated, and the results are shown in Table 10. The evaluation criteria are as follows. ：: The phosphor pattern is uniformly and symmetrically formed on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate. X: The phosphor pattern is not formed uniformly and symmetrically on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate.

Example 2 The procedure of Example 1 was repeated except that the photosensitive element (A-1) obtained in Production Example 1 was replaced with the photosensitive element (A-2) obtained in Production Example 2. In the same manner as in Example 1, a back plate for a plasma display panel was obtained. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 10.

Example 3 The procedure of Example 1 was repeated except that the photosensitive element (A-1) obtained in Production Example 1 was replaced with the photosensitive element (A-3) obtained in Production Example 4. In the same manner as in Example 1, a back plate for a plasma display panel was obtained. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 10.

Comparative Example 1 In Example 1, after performing [barrier rib formation], the following [firing step] is performed, and then a multicolor pattern is formed at a predetermined position on the barrier rib formation portion. A back plate for a plasma display panel was obtained in the same manner as in Example 1, except that the [Step] and [Baking step] were performed.

[Firing Step] The substrate on which the barrier rib forming portion after curing is formed is heated from room temperature to 450 at a rate of 2 ° C./min, and after reaching 450 ° C., heat-treated at 450 ° C. for 1 hour ( (Baking) to remove the organic material in the barrier rib forming portion after curing, to obtain a substrate on which the fired barrier ribs were formed. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 10.

[0098]

[Table 10]

From the results shown in Table 10, the phosphor pattern of the plasma display panel back plate (Examples 1 to 3) manufactured by using the method of manufacturing the plasma display panel back plate of the present invention is the same as that of the PDP substrate. A high-precision, high-quality back plate for a plasma display panel, which is uniformly and symmetrically formed on the inner surface of the recess (the barrier rib wall surface and the substrate surface), was obtained. On the other hand, the phosphor pattern of the back plate for a plasma display panel using the method of Comparative Example 1 is not uniformly and symmetrically formed on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate ( The position of the phosphor pattern was displaced), and as a back plate for a plasma display panel, it was not practical.

Comparative Example 2 A substrate provided with a relief pattern was manufactured in the same manner as in Example 1, and a rib paste (trade name: TR-Trademark, manufactured by Taiyo Ink Mfg. Co., Ltd.) as a barrier rib material was formed on the formed relief pattern. No. 0994) was uniformly embedded in the gap of the relief pattern using a squeegee, and then defoamed under reduced pressure (6.67 × 10 ² Pa) for 3 minutes and dried at 80 ° C. for 30 minutes. Such a process of embedding the rib paste → defoaming under reduced pressure → drying step was further repeated twice. Next, at 160 ° C,
The barrier rib material was cured by heating for 45 minutes. Then
Immersed in a 5% by weight aqueous solution of sodium hydroxide at 45 ° C,
An attempt was made to remove the relief pattern by peeling, but it was not possible to remove it. Table 11 shows the above results.

[0101]

[Table 11]

From Table 11, it can be seen that Examples 1 and 2 using the element for forming barrier ribs of the present invention were able to remove the relief pattern without performing a polishing step for removing unnecessary barrier rib material on the relief pattern. Was successfully removed and removed, and the shape of the obtained barrier rib was also found to be good. On the other hand, in Comparative Example 2 in which the barrier rib forming element of the present invention was not used, since the polishing step for removing unnecessary barrier rib material on the relief pattern was not performed, the relief pattern could not be removed. I understood.

[0103]

According to the method for manufacturing a back plate for a plasma display panel according to the first aspect, the number of steps can be reduced, and a back plate for a PDP having excellent workability, low energy, and excellent dimensional accuracy can be manufactured with high yield. The method for manufacturing a rear plate for a plasma display panel according to the second aspect has the effect of the method for manufacturing a rear panel for a plasma display panel according to the first aspect, and a barrier rib for a PDP having an excellent shape can be formed. The method for manufacturing a back plate for a plasma display panel according to the third aspect has the effect of the method for manufacturing a back panel for a plasma display panel according to the first aspect, and can form a barrier rib having excellent strength.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Akira Sasaki 4-3-1-1, Higashicho, Hitachi City, Ibaraki Prefecture Inside Hitachi Chemical Co., Ltd. No. 1 Hitachi Chemical Co., Ltd. Research Laboratory (72) Inventor Mariko Shimamura 4-3-1 Higashicho, Hitachi City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Research Laboratory (72) Inventor Seiji Tai, Hitachi City, Ibaraki Prefecture 4-13-1, Higashimachi Hitachi Chemical Co., Ltd. Research Laboratory F-term (reference) 5C027 AA09 AA10 5C040 GF02 GF18 GF19 GG03 GG09 JA03 JA15 JA19 KA08 KA16 KA16 KB04 MA26

Claims (3)

[Claims] 1. A predetermined position on a barrier rib forming portion formed at a predetermined position and shape on a substrate using a barrier rib forming element having a barrier rib forming resin composition layer on a support film. Form a multicolor pattern containing phosphor and organic material by photolithographic method,
A method for producing a back plate for a plasma display panel, characterized by firing in this state. 2. The method according to claim 1, wherein the resin composition layer for forming a barrier rib contains an inorganic material and an organic binder. 3. A multi-color pattern including a phosphor and an organic material is formed at a predetermined position on the barrier rib forming portion by a photolithographic method after the barrier rib forming portion is cured after forming the barrier rib. 3. The method for producing a back plate for a plasma display panel according to the above item 2.