JP2000181548A - Vacuum processor and method for controlling pressure therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid a harmful effect of measurement error due to the difference of pressure sensors and the change of detection sensitivity with time by setting 1st and 2nd setting pressure values based on the measured values of the 1st and 2nd pressure sensors before and after opening 1st and 2nd gate valves. SOLUTION: A controller 150 compares a pressure fluctuation within a transfer chamber 110 before and after opening a gate valve 130a separating atmospheric air from the chamber 110 with differential pressure preliminarily set by an operator between the atmospheric air and the chamber 110. It also compares the pressure fluctuations within both the chambers 110 and a process chamber 120 before and after opening a gate valve 131b separating the chamber 110 from the chamber 120 with differential pressure preliminarily set by the operator between the both chambers 110 and 120. And, when an abnormality takes place in the pressure fluctuation width inside the chamber 110 or 120 when it is opened, a correction is applied to each valve opening set pressure of the valves 130a and 131b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus used in a semiconductor manufacturing apparatus for performing processing in a reduced-pressure atmosphere, and a pressure control method therefor.

[0002]

2. Description of the Related Art Conventionally, a vacuum processing apparatus used in a semiconductor manufacturing process includes a process chamber (reaction chamber) capable of reducing pressure and a transfer chamber (preliminary chamber). It is generally known that a wafer is transferred to a decompressed process chamber and a predetermined process is performed by a process gas.

In such a vacuum processing apparatus, when a gate valve provided between the two chambers is opened, dust accumulated in the chamber flies up due to a gas flow caused by a pressure difference between the two chambers, and is placed on a wafer. The problem is that dust adheres.

In order to improve this, a conventional vacuum processing apparatus employs the following pressure control method.

FIG. 5 is a structural view of a conventional vacuum processing apparatus disclosed in Japanese Patent Application Laid-Open No. 63-137169.

In this vacuum processing apparatus, the pressure sensor 10
When it is detected that the pressure in the transfer chamber 103 becomes substantially equal to the pressure in the process chamber 104 based on the measured values of the pressure chambers 1 and 102, the valve 105 is opened, and the pressure difference between the chambers 103 and 104 is detected. Measured by 106. After adjusting the differential pressure between the chambers 103 and 104 to almost zero by the pressure regulator amount 107, the gate valve 108 between the chambers 103 and 104 is opened to prevent dust from rising due to the gas flow. .

FIG. 6 is a structural view of a conventional vacuum processing apparatus disclosed in Japanese Patent Application Laid-Open No. 7-66183.

In this vacuum processing apparatus, the transfer chamber 20
1 and the pressure difference between the process chamber 202 and the pressure difference are detected by a single pressure detector 210. The pressure detector 210 is used to perform basically the same operation as the vacuum processing apparatus of FIG. The pressure control method is adopted.

However, in the vacuum processing apparatus shown in FIGS. 5 and 6, when the gate valve provided between the process chamber and the transfer chamber is opened, it is impossible to prevent the flow of gas which may occur between the two chambers. Although possible, no consideration is given to preventing a gas flow that may occur between the transfer chamber and the outside when the gate valve provided between the outside of the chamber and the transfer chamber is opened. Further, in order to detect a differential pressure between the process chamber and the transfer chamber, it is necessary to provide a differential pressure detecting mechanism including a valve, and the structure around the chamber is complicated.

In view of the above, a vacuum processing apparatus as shown in FIG. 7 has been proposed, which takes into consideration the flow of gas between the transfer chamber and the outside and has a relatively simple structure without a differential pressure detecting mechanism.

FIG. 7 is a schematic view showing the structure of another conventional vacuum processing apparatus.

This vacuum processing apparatus has a transfer chamber 110 and a process chamber 120 which can be decompressed. The outside of the chamber and the transfer chamber 110 are communicated with each other via a gate valve 131a, and the transfer chamber 110 and the process chamber 120 are further connected. The connection is made through a gate valve 131b. Then, the transfer chamber 110 is connected to an air supply device 132a and an exhaust device 133a, whereby the pressure in the chamber is increased / decreased. Here, the exhaust device 133a always operates in a constant state, and the pressure control device 135a operates the exhaust device 133a in accordance with the measurement value of the pressure sensor 134a that measures the pressure of the transfer chamber 110.
The displacement of a is controlled.

Similarly, on the process chamber 120 side, an air supply device 132b and an exhaust device 133b and a pressure sensor 1
34b and a pressure control device 135b are provided.

Further, an input device 141, a storage device 142, and a transfer control device 143 are provided outside the chamber in addition to the atmospheric pressure sensor 134c. Input device 14
1 sets the pressures in the transfer chamber 110 and the process chamber 120 when the gate valves 131a and 131b are opened. The storage device 142 stores these valve opening set pressure values and the pressure sensors 134a and 134.
b, 134c are stored.

The transfer control device 143 refers to the data stored in the storage device 142 and reads the gate valve 131.
a, 131b, and controls the operation of the transfer device 112 for transferring the wafer in the chamber.
Further, a wafer standby buffer 111 is disposed in the transfer chamber 110, and several wafers to be processed can be kept on standby. Further, the transferred wafer is set in the process chamber 120. Table 121 is provided.

FIG. 8 is a flowchart showing a pressure control method of the vacuum processing apparatus shown in FIG.

In the vacuum processing apparatus shown in FIG. 7, the wafer stored in the wafer cassette 101 is transferred to the transfer chamber 1.
In the case of transfer to the transfer chamber 10, the operator first inputs the gate valve 13 on the transfer chamber 110 side from the input device 141.
A valve opening set pressure PT for opening 1a is input (step S101). The valve opening set pressure PT in this case is set near the atmospheric pressure and stored in the storage device 142.

Subsequently, based on the signal from the pressure sensor 134a on the transfer chamber 110 side, the air supply device 132a is controlled to supply air to the transfer chamber 110 (step S102). At this time, the pressure control device 135a
Until the pressure in the transfer chamber 110 becomes close to the atmospheric pressure, it works so as to suppress the exhaust action of the exhaust device 113a.

Then, the transfer control device 143 detects that the pressure P in the transfer chamber 110 has become near the atmospheric pressure PT by the pressure sensor 134a (step S10).
3) Open the gate valve 131a (step S10)
4). Thereafter, the wafer cassette 1 is transferred by the transfer device 112.
The wafer housed in the transfer chamber 110 is transferred to the transfer chamber 110.

On the other hand, when a wafer is transferred from the transfer chamber 110 to the process chamber 120, the operator first inputs the wafer from the input device 141 to the process chamber 120.
A valve opening set pressure PT for opening the side gate valve 131b is input (step S101). The valve opening set pressure PT in this case is
0 is set to a negative pressure corresponding to the decompression state of 0, and the storage device 14
2 is stored.

Subsequently, the transfer chamber 110 is evacuated and depressurized by the exhaust device 133a in order to keep the process chamber 120 in a depressurized atmosphere (step S102).

After detecting that the pressure sensor 134b has reached the valve opening set pressure (step S10).
3), the gate valve 131b is opened (step S104).

As described above, in the pressure control method for the vacuum processing apparatus, the valve opening set values for the transfer chamber 110 and the process chamber 120 are input from the input device 141, and the transfer chamber 110 or the process chamber 1 is input.
The gate valve 131a or 131b is opened when the pressure in 20 reaches the corresponding valve opening set pressure value.

Thus, by setting the valve opening set pressure value to a value near the atmosphere or the pressure in the chamber as described above, the gate valve 131a or 1
31b, the outside of the chamber and the transfer chamber 1
It is possible to prevent the flow of gas that can occur between the transfer chambers 10 and the flow of gas that can occur between the process chamber 120 and the transfer chamber 110.

[0025]

However, the conventional vacuum processing apparatus shown in FIG. 7 has the following problems.

The pressure sensor 134a of the transfer chamber 120
In many cases, a sensor capable of measuring an atmosphere reduced in pressure from the atmosphere is used, and the pressure sensor 134b used in the process chamber 120 is a pressure sensor capable of always measuring an atmosphere reduced in pressure. Usually, both chambers 11
When the measurement range of the pressure sensor is different between 0 and 120, the pressure detection method is also often different. In this case, the detection accuracy of the pressure sensors 134a and 134b changes depending on the measurement pressure range. Further, the pressure sensors 134a, 134
The detection accuracy decreases due to the change over time in the detection sensitivity of b.

Therefore, as described above, the pressure sensor 134
Even if the pressures in the chambers 110 and 120 are controlled based on the signals of the pressure sensors 134a and 134b, respectively.
This results in an error between the measured value of 134b and the actual pressure.

The wafer is transferred from outside the chamber to the transfer chamber 11.
0, when the measured value of the pressure sensor 134a is higher than the actual pressure,
The gas in the chamber will flow out of 10.
On the other hand, when it is low, there is a problem that dust floating around the chamber is taken into the transfer chamber 110 by sucking the air around the gate valve 131a.

Further, when a wafer is transferred from the transfer chamber 110 to the process chamber 120, when the pressure difference between the two chambers 110 and 120 shown in FIG. In addition, there is a problem that dust adheres to the wafer due to the rise of dust accumulated in the chambers 110 and 120. FIG. 9 shows the pressure fluctuation when the gate valve 131b is opened when there is a pressure difference between the chambers 110 and 120.
The pressure in P10 and P1 indicate the pressure in the process chamber 120.

As described above, in the conventional vacuum processing apparatus shown in FIG. 7, it was not possible to avoid the adverse effect of the measurement error due to the difference between the pressure sensors used in each chamber and the change over time in the detection sensitivity.

The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to measure a difference between pressure sensors used in a transfer chamber and a process chamber and a change in detection sensitivity with time. An object of the present invention is to provide a vacuum processing apparatus and a pressure control method for the vacuum processing apparatus that can avoid an adverse effect of an error.

[0032]

Means for Solving the Problems To achieve the above object, a vacuum processing apparatus according to the first invention is characterized by first and second chambers capable of reducing pressure, the first chamber and the atmosphere. A first gate valve capable of separating the first and second chambers from each other in atmosphere, and a second gate valve capable of separating the first and second chambers from each other in atmosphere.
, And first and second pressure sensors for individually measuring the pressures in the first and second chambers, respectively, and the measured value of the first or second pressure sensor is a predetermined value. In the vacuum processing apparatus for opening the first or second gate valve when the first or second set pressure value is reached, respectively, before and after opening the first or second gate valve. A set pressure control device for controlling the first or second set pressure value based on a measurement value of the first or second pressure sensor.

The features of the vacuum processing apparatus according to the second invention are as follows.
In the first aspect, the set pressure control device may include a measurement differential pressure obtained from a difference between a measurement value of the first or second pressure sensor before and after opening of the first or second gate valve. Calculating a set differential pressure obtained from a difference between the first and second set pressure values, and controlling the first or second set pressure value from a difference between the measured differential pressure and the set differential pressure. It is to have done.

The features of the vacuum processing apparatus according to the third invention are as follows.
In the first aspect, the apparatus further includes an atmospheric pressure sensor for measuring an atmospheric pressure, wherein the set pressure control device is configured to open the first or second gate valve and then connect the first chamber to the atmosphere or the first or second atmosphere. The measured values of the first and second pressure sensors or the atmospheric pressure sensor when the pressure fluctuation due to the pressure difference between the first and second chambers are stabilized are compared, and the first or second setting is determined from the comparison result. That is, the pressure is controlled.

The features of the vacuum processing apparatus according to the fourth invention are as follows.
First and second chambers that can be depressurized, a first gate valve that can atmospherically separate the first chamber from the atmosphere, and an atmosphere that can be atmospherically separated between the first and second chambers A second gate valve; and first and second pressure sensors for individually measuring pressures in the first and second chambers, wherein the measured values of the first and second pressure sensors are predetermined. When the first or second set pressure value is reached, using a vacuum processing apparatus for opening the first or second gate valve, respectively, before and after opening the first or second gate valve. Calculating a measured differential pressure obtained from a difference between measured values of the first and second pressure sensors later, and a set differential pressure obtained from a difference between the first and second set pressure values;
It is to control the first or second set pressure value from the difference between the measured differential pressure and the set differential pressure.

The features of the vacuum processing apparatus according to the fifth invention are as follows.
First and second chambers that can be depressurized, a first gate valve that can atmospherically separate the first chamber from the atmosphere, and an atmosphere that can be atmospherically separated between the first and second chambers A second gate valve; first and second pressure sensors for individually measuring pressures in the first and second chambers; and an atmospheric pressure sensor for measuring atmospheric pressure.
And the measured value of the second pressure sensor is a predetermined first or second
Using a vacuum processing apparatus that opens the first or second gate valve when the pressure reaches the set pressure value of
The first or second gate valve is opened, and the first or second gate valve is opened.
The first and second chambers when the pressure fluctuation due to the pressure difference between the first chamber and the atmosphere or the pressure difference between the first and second chambers is stabilized.
And comparing the measured values of the pressure sensor or the atmospheric pressure sensor, and controlling the first or second set pressure based on the comparison result.

[0037]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a vacuum processing apparatus and a pressure control method according to the present invention will be described.

(First Embodiment) FIG. 1 is a schematic diagram showing a configuration of a vacuum processing apparatus according to a first embodiment of the present invention.
The same elements as those in FIG. 7 are denoted by the same reference numerals, and description thereof will be omitted.

The vacuum processing apparatus of the present embodiment has a configuration in which a control device 150 is provided in the conventional vacuum processing apparatus shown in FIG.

The control device 150 controls the atmosphere and the transfer chamber 1
The pressure fluctuation in the transfer chamber 110 before and after opening the gate valve 131a separated by 10 and the differential pressure between the atmosphere and the transfer chamber set by the operator in advance are compared. Further, the transfer chamber 110 and the process chamber 1
The pressure fluctuations in the two chambers 110 and 120 before and after opening the gate valve 131b separating the two chambers 20 and the two chambers 11 preset by the operator.
Compare the pressure difference between 0,120. Then, when an abnormality occurs in the pressure fluctuation width inside the chamber 110 or 120 when the gate valve 131a or 131b is opened, correction is made to each valve opening set pressure for opening the gate valves 131a and 131b.

In this embodiment, the transfer chamber 11
The set pressure for opening the 0 side gate valve 131a is set as the gate valve opening set pressure Pt, and the set pressure for opening the gate valve 131b on the process chamber 120 side is set as the gate valve opening set pressure Pp.

Hereinafter, a pressure control method in the vacuum processing apparatus of the present embodiment will be specifically described with reference to flowcharts of FIGS. FIG. 2 is a flowchart showing a pressure control method for transferring a wafer from outside the chamber to the transfer chamber 110. FIG. 3 is a pressure control method for transferring a wafer from the transfer chamber 110 to the process chamber 120. It is a flowchart which shows a method.

(A) Pressure Control Method for Transferring Wafers from Outside the Chamber to the Transfer Chamber In FIG. 2, first, the gate valve opening set pressure P of the transfer chamber 110 arbitrarily set by the operator.
t, the atmospheric pressure Pz, and the allowable pressure ranges X1 and X2 are input by the input device 141 (step S11). At this time, the gate valve opening set pressure Pt is set to, for example, a pressure near the atmospheric pressure. These values are stored in the storage device 142.

Next, the pressure sensor 1 on the transfer chamber 110 side
Based on the signal of 34a, the air supply device 132a is controlled to start supplying air to the transfer chamber 110 (step S12), and the pressure of the transfer chamber 110 is measured by the pressure sensor 134a. Then, the transfer chamber 110
It is determined whether or not the relationship of X1 ≧ | Pt−Pt1 | (1) is established between the measured pressure value Pt1 and the gate valve opening set pressure Pt (step S1).
3).

While the above relational expression (1) is not established, the air supply by the air supply device 132a is continued. At this time, the pressure control device 135a controls so as to suppress the exhaust action of the exhaust device 113a until the above relational expression (1) is satisfied.

When the above relational expression (1) holds, the gate valve 131a is opened by the transfer control device 143 (step S14), and then the pressure of the transfer chamber 110 is measured by the pressure sensor 134a (step S15). This measured value Pt2 is stored in the storage device 142.

Then, the control device 150 controls the input device 14
The difference between the set differential pressure (Pz-Pt) set by 1 and the measured differential pressure (Pt1-Pt2) of the transfer chamber 110 when the gate valve 131a is opened is represented by ΔP = (Pz-Pt)-( Pt1−Pt2) (Step S16).

Thus, the transfer chamber 1 before and after opening the gate valve 131a separating the transfer chamber 110 from the atmosphere.
The pressure fluctuation in the transfer chamber 110 is compared with the atmospheric pressure set in advance by the operator and the pressure difference between the transfer chambers 110.

Subsequently, it is determined whether or not the relationship of | △ P | ≦ X2 is established with the allowable pressure range X2 (step S17).
The gate valve opening set pressure Pt on the 10 side is corrected so that Pt → Pt + と P (step S18). That is, the transfer chamber 11 when the gate valve 131a is opened.
If an abnormality occurs in the pressure fluctuation range inside the zero, the gate valve opening set pressure Pt is corrected.

Thus, when the wafer is transferred from outside the chamber to the transfer chamber 110, the pressure sensor 1
It is possible to correct the measurement error that fluctuates due to the change over time in the detection sensitivity of the detection valve 33a and control the airflow in the transfer chamber 110 when the gate valve 131a is opened.
It is possible to prevent dust from rising.

(B) Pressure Control Method for Transferring Wafer from Transfer Chamber to Process Chamber In FIG. 3, first, the gate valve opening set pressure P on the transfer chamber 110 side arbitrarily set by the operator.
t, the gate valve opening set pressure Pp on the process chamber 120 side, and the allowable pressure ranges X1, X2, X3 are input by the input device 141 (step S21). These setting values are stored in the storage device 142.

When the wafer is transferred from the transfer chamber 110 to the process chamber 120, the inside of the transfer chamber 110 is evacuated by the exhaust device 133a to reduce the pressure (step S2).
2).

Then, the measured pressure P of the transfer chamber 110
X1 ≧ | Pt−Pt1 | (2) is established between t1 and the gate valve opening set pressure Pt, and between the measured pressure Pp1 on the process chamber 120 side and the gate valve opening set pressure Pp. It is determined whether or not the relationship of X2 ≧ | Pp−Pp1 | (3) is established (step S2)
3).

After satisfying both of the relations (2) and (3), the gate valve 131b is opened (step S).
24) After that, the pressures in the transfer chamber 110 and the process chamber 120 are respectively measured by the pressure sensors 134a and 134a.
The measurement is performed at 34b (step S25).

Then, the set differential pressure (Pp1-Pt1) set by the input device 141 and the gate valve 1
The measured differential pressure (P
ΔP = (Pp−Pt) − (Pt1−Pt2), and the difference between this and the allowable pressure range X3 is as follows: | △ P | ≦ X3 (4) The control unit 142 calculates whether the condition is satisfied (step S27).

If the relational expression (4) does not hold, the controller 142 corrects the gate valve opening set pressure value Pt on the transfer chamber 110 side so that Pt → Pt + △ P (step S28). .

As described above, by constantly monitoring the differential pressure when the gate valve is opened, the pressure sensors 134a, 134
It is possible to correct a measurement error that fluctuates due to a measurement pressure region b or a change with time of the sensor itself. Thereby, the flow of gas in the chamber when the gate valve 131b is opened can be prevented, and the rising of dust can be suppressed.

In the present embodiment, the transfer chamber 110
Was corrected to the side gate valve opening set pressure Pt,
The gate valve opening set pressure Pp on the process chamber 120 side may be corrected.

(Second Embodiment) In this embodiment, when the pressure between the transfer chamber 110 and the process chamber 120 is balanced after the gate valve 131b is opened in the configuration of FIG. 134b
The gate valve opening set pressure is controlled by comparing the measured values. Hereinafter, the pressure control method of the present embodiment will be specifically described with reference to the flowchart shown in FIG.

In FIG. 4, first, the gate valve opening set pressure Pt of the transfer chamber 110 and the opening set pressure P of the process chamber 120 arbitrarily set by the operator.
p and the allowable pressure ranges Y1 and Y2 are input by the input device 141 (step S31).

When the wafer is transferred from the transfer chamber 110 to the process chamber 120, the inside of the transfer chamber 110 is evacuated by the exhaust device 133a to reduce the pressure (step S3).
2). When the gate valve 131b is opened, the relationship of Y1 ≦ | Pt−Pt1 | (5) is established between the pressure Pt1 of the transfer chamber 110 and the gate valve opening set pressure Pt, and the process chamber 120 is opened. Pressure P
It is determined whether or not the relationship of Y2 ≦ | Pp−Pp1 | (6) holds between p1 and the gate valve opening set pressure Pp (step S3).
3). After these relational expressions (5) and (6) are established, the gate valve 131b is opened (step S34).

Then, when the gate valve 131b is opened and the pressure between the transfer chamber 110 and the process chamber 120 is balanced, the pressure sensors 134a,
The pressures Pt2 and Pp2 of the transfer chamber 110 and the process chamber 120 are measured by 134b (step S34). Then, the difference between the measured value Pp2 (process chamber side) and Pt2 (transfer chamber side) is set as the sensor shift amount ΔP ΔP = Pp2−Pt2, and the gate valve opening set pressure Pp of the process chamber 120 is set as Correction is made so that Pp- △ P. Further, the transfer chamber 1
The gate valve opening set pressure Pt of 10 is corrected so that Pt → Pt + ｔP.

After opening the gate valve 131b separating the chambers 110 and 120, the chamber 1
When the pressures between the pressure chambers 10 and 120 are balanced, the pressure sensors 134a and
The measured values of the pressure sensors 134b are compared with each other, and the gate valve opening set pressures Pt and Pp are corrected according to the result. As described above, the difference between the pressure sensors 134a and 134b used in The adverse effects of measurement errors due to aging can be reduced.

It is needless to say that the pressure control method of the second embodiment can be applied to a case where a wafer is transferred from outside the chamber to the transfer chamber. That is, the atmospheric pressure may be measured by the atmospheric pressure sensor 134c instead of the unnecessary pressure measurement of the process chamber.

[0065]

As described above in detail, according to the present invention, it is possible to reduce the adverse effect of the measurement error due to the difference between the pressure sensors used in the first and second chambers and the aging of the detection sensitivity. Becomes possible. Accordingly, it is possible to prevent impurities deposited in the chamber from peeling off and flying up due to a large change in the pressure difference between the atmosphere and the first chamber or between the first and second chambers and adhering to the wafer as dust. Becomes possible.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating a configuration of a vacuum processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating a pressure control method when a wafer is transferred from outside the chamber to a transfer chamber according to the first embodiment.

FIG. 3 is a flowchart illustrating a pressure control method when a wafer is transferred from a transfer chamber to a process chamber according to the first embodiment.

FIG. 4 is a flowchart illustrating a pressure control method when a wafer is transferred from a transfer chamber to a process chamber according to a second embodiment.

FIG. 5 is a structural view of a conventional vacuum processing apparatus disclosed in the official gazette.

FIG. 6 is a structural view of a conventional vacuum processing apparatus disclosed in the official gazette.

FIG. 7 is a schematic view showing the structure of another conventional vacuum processing apparatus.

8 is a flowchart showing a pressure control method of the vacuum processing apparatus shown in FIG.

FIG. 9 is a diagram showing pressure fluctuation between chambers when a gate valve is opened.

[Explanation of symbols]

 110 transfer chamber 111 wafer standby buffer 112 transfer device 120 process chamber 131a, 131b gate valve 132a, 132b air supply device 133a, 133b exhaust device 134a, 134b pressure sensor 134c atmospheric pressure sensor 135a, 135b pressure control device 141 input device 142 storage device 143 Transport control device

Claims (5)

[Claims] 1. first and second chambers capable of reducing pressure;
A first gate valve for shutting off or opening the first chamber to the atmosphere, a second gate valve for shutting off or opening between the first and second chambers, and the first and second gate valves;
First and second pressure sensors for individually measuring the pressures in the chambers, respectively, and the measured value of the first or second pressure sensor reaches a predetermined first or second set pressure value. In the vacuum processing apparatus for opening the first or second gate valve when the first or second gate valve is opened, the measurement of the first or second pressure sensor before and after the opening of the first or second gate valve, respectively. A set pressure control device for controlling the first or second set pressure value based on the value. 2. The pressure control device according to claim 1, wherein the set pressure control device includes: a measured differential pressure obtained from a difference between measured values of the first or second pressure sensor before and after opening of the first or second gate valve; A configuration is provided in which a set differential pressure determined from a difference between the first and second set pressure values is calculated, and the first or second set pressure value is controlled from a difference between the measured differential pressure and the set differential pressure. The vacuum processing apparatus according to claim 1, wherein: 3. An atmospheric pressure sensor for measuring an atmospheric pressure, wherein the set pressure control device is configured to open the first or second gate valve and then open the first chamber and the atmosphere or the first and the second gate valves. The first and the second when the pressure between the two chambers is approximately in equilibrium.
2. The vacuum processing apparatus according to claim 1, further comprising a configuration for comparing measured values of said pressure sensor or said atmospheric pressure sensor and controlling said first or second set pressure based on a result of the comparison. 4. First and second decompressible chambers,
A first gate valve for shutting off or opening the first chamber and the atmosphere, a second gate valve for shutting off or opening the first and second chambers, and the first and second gate valves;
And first and second pressure sensors for individually measuring the pressure in the chambers, and the measured values of the first and second pressure sensors have reached predetermined first or second set pressure values. Sometimes, using the vacuum processing apparatus for opening the first or second gate valve, respectively, measuring the first and second pressure sensors before and after opening the first or second gate valve. Calculating a measured differential pressure obtained from a difference between the first and second set pressure values and a set differential pressure obtained from a difference between the first and second set pressure values; A pressure control method for a vacuum processing apparatus, comprising: controlling a set pressure value of the vacuum processing apparatus. 5. A first and a second chamber capable of reducing pressure,
A first gate valve for shutting off or opening the first chamber and the atmosphere, a second gate valve for shutting off or opening the first and second chambers, and the first and second gate valves;
First and second pressure sensors for individually measuring the pressure in the chamber, and an atmospheric pressure sensor for measuring the atmospheric pressure,
When the measured value of the first and second pressure sensors reaches a predetermined first or second set pressure value, using a vacuum processing device that opens the first or second gate valve, respectively. Opening the first or second gate valve, and the first and second pressure sensors when the pressure in the first chamber and the atmosphere or the pressure between the first and second chambers becomes substantially equilibrium; Alternatively, a pressure control method for a vacuum processing apparatus, comprising: comparing a measured value of the atmospheric pressure sensor; and controlling the first or second set pressure based on a result of the comparison.