JP2000180460A - Rotary sensor and its manufacture - Google Patents
Rotary sensor and its manufactureInfo
- Publication number
- JP2000180460A JP2000180460A JP10359519A JP35951998A JP2000180460A JP 2000180460 A JP2000180460 A JP 2000180460A JP 10359519 A JP10359519 A JP 10359519A JP 35951998 A JP35951998 A JP 35951998A JP 2000180460 A JP2000180460 A JP 2000180460A
- Authority
- JP
- Japan
- Prior art keywords
- case
- holder
- substrate
- end wall
- rotation sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Transmission And Conversion Of Sensor Element Output (AREA)
- Regulating Braking Force (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、車輪速センサな
どとして用いられる回転センサに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotation sensor used as a wheel speed sensor or the like.
【０００２】[0002]
【従来の技術】車輪速を検出する回転センサとして、特
表平５−５００７１０号公報には、回転検出素子をコイ
ルでなし、このコイルをモールド被覆（樹脂流し込み被
覆）したものが開示されている。そのモールド被覆は、
振動や塵埃の侵入から回転検出素子を保護するためであ
る。この種のセンサは自動車の車輪などに取付けられ
て、激しい振動及び塵埃に晒されるからである。2. Description of the Related Art As a rotation sensor for detecting wheel speed, Japanese Patent Application Laid-Open No. 5-500710 discloses a rotation sensor in which a coil is used as a rotation detecting element and the coil is coated with a resin (coated with resin). . The mold coating is
This is for protecting the rotation detecting element from vibration and dust intrusion. This is because such a sensor is mounted on a vehicle wheel or the like and is exposed to severe vibration and dust.
【０００３】一方、コイル式回転検出素子に比べて、検
出精度の高いものとして、この発明の一実施例を示す図
６のごとく、基板１上にホールＩＣなどの回転検出素子
２及びその制御用電子部品３を設け、この基板１をケー
ス４に封入した回転センサが開発されている。On the other hand, as shown in FIG. 6 showing an embodiment of the present invention, a rotation detecting element 2 such as a Hall IC and a control element for controlling the rotation detecting element 2 have higher accuracy than a coil type rotation detecting element. A rotation sensor provided with an electronic component 3 and enclosing the substrate 1 in a case 4 has been developed.
【０００４】[0004]
【発明が解決しようとする課題】上記ホールＩＣなどの
回転検出素子２からなる回転センサにあっては、そのケ
ース４内への塵埃侵入封止を開口部の樹脂溶着、Ｏリン
グの嵌着などで行っており、その効果が十分でなく、振
動に対しても十分な耐久性を有していない。In the rotation sensor including the rotation detecting element 2 such as a Hall IC, dust intrusion into the case 4 is sealed by resin welding of an opening, O-ring fitting, and the like. The effect is not sufficient, and it does not have sufficient durability against vibration.
【０００５】この発明は、上記ホールＩＣなどの回転検
出素子から成る回転センサにおいて、その回転検出素子
等の強固な封止を得ることを課題とする。An object of the present invention is to provide a rotation sensor including a rotation detecting element such as the above-mentioned Hall IC in which a strong sealing of the rotation detecting element and the like is obtained.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、この発明は、ケースの開口部をモールド被覆するこ
ととしたのである。モールド被覆はケースを強固に支持
して密封度も高く、振動及び塵埃に強いものとなる。In order to solve the above-mentioned problems, the present invention is to cover the opening of a case with a mold. The mold cover firmly supports the case, has a high sealing degree, and is resistant to vibration and dust.
【０００７】つぎに、モールド被覆は一般に樹脂の射出
成形によって行われ、この射出成形時、ケースには数ト
ンの射出圧（成形圧）が加わり、その圧力が基板及び回
転検出素子に加われば、基板上の電子部品及び回転検出
素子に何らかの悪影響を及ぼし、誤動作の要因となる。
このため、この発明は、ケースに対し、基板及び回転検
出素子を力学的に縁切りして、モールド被覆時に回転検
出素子などに成形圧が加わりにくくしたのである。Next, mold coating is generally performed by injection molding of a resin. During this injection molding, an injection pressure (molding pressure) of several tons is applied to the case, and if the pressure is applied to the substrate and the rotation detecting element, This has some adverse effect on the electronic components and the rotation detecting element on the substrate, and causes a malfunction.
For this reason, in the present invention, the substrate and the rotation detecting element are mechanically cut off from the case, so that a molding pressure is hardly applied to the rotation detecting element and the like at the time of coating the mold.
【０００８】[0008]
【発明の実施の形態】上記ケース内の密封度の高い発明
の実施形態としては、基板上に、回転検出素子及びその
制御用電子部品を設け、この基板をケース内に入れてそ
の挿入開口部を基板からのリード線を導き出してモール
ド被覆した構成を採用し得る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As an embodiment of the invention having a high degree of sealing in the case, a rotation detecting element and electronic components for controlling the rotation detecting element are provided on a substrate, and the substrate is placed in the case and the insertion opening is formed. May be adopted in which a lead wire is led out from a substrate and covered with a mold.
【０００９】この構成において、ホルダーに上記基板及
び回転検出素子を支持し、そのホルダーを上記ケースに
入れて、ケースの挿入開口部内面とホルダーの間隙を塞
ぐように上記モールド被覆を施したものとし得る。この
ように、基板等をホルダーで支持すれば、上記成形圧の
力学的な縁切りを容易に行い得る。In this configuration, the substrate and the rotation detecting element are supported by a holder, the holder is placed in the case, and the mold coating is applied so as to close a gap between the inner surface of the insertion opening of the case and the holder. obtain. In this way, if the substrate or the like is supported by the holder, it is possible to easily perform the dynamic cutting of the molding pressure.
【００１０】すなわち、上記ケースが一端閉塞の筒状で
あって、このケースにその他端開口から上記ホルダーを
挿入し、上記回転検出素子は基板から立ち上がって前記
ケースの一端壁内面に対向しており、かつ、前記ホルダ
ーの挿入先端は前記ケースの一端壁内面に圧接して前記
回転検出素子の前記ケース一端壁内面への圧接を阻止し
ている構成とし得る。In other words, the case is cylindrical with one end closed, the holder is inserted into the case through the other end opening, and the rotation detecting element rises from the substrate and faces the inner surface of one end wall of the case. Further, the insertion end of the holder may be configured to press against the inner surface of the one end wall of the case to prevent the rotation detecting element from pressing against the inner surface of the one end wall of the case.
【００１１】このように、ホルダーの挿入先端がケース
一端壁に圧接すれば、その圧接がホルダーを介してケー
スに加わる成形圧に抗し、ケース一端壁に対向する他の
部分であるホールＩＣには成形圧が加わらず、すなわ
ち、力学的に縁切りされ、ホールＩＣ等は圧接しない。As described above, when the insertion end of the holder presses against the one end wall of the case, the press contact resists the molding pressure applied to the case via the holder, and the other end of the Hall IC opposing the one end wall of the case. No molding pressure is applied, that is, the edge is mechanically cut off, and the Hall IC and the like are not pressed.
【００１２】このとき、上記ホルダーとケース一端壁内
面の圧接部に硬質金属片を介在すれば、その金属片によ
って成形圧を受け、金属片は圧縮されにくいため、成形
圧が回転検出素子に加わりにくく、損傷の恐れも少な
い。とくに、金属片を上記挿入方向における回転検出素
子の全幅に亘るものとすれば、その金属片の幅内のホル
ダー部分は圧縮されにくいため、成形圧は回転検出素子
に加わらず、損傷の恐れはより少なくなる。また、金属
片はケース一端壁内面に当接させるとよい。その当接に
よってホルダーを介した成形圧を直接に受けてその介在
部分の圧縮を阻止するからである。At this time, if a hard metal piece is interposed between the holder and the pressure contact portion between the inner surface of one end wall of the case, the metal piece receives the forming pressure and the metal piece is hardly compressed, so the forming pressure is applied to the rotation detecting element. Difficult and less likely to be damaged. In particular, if the metal piece extends over the entire width of the rotation detecting element in the above-described insertion direction, the holder portion within the width of the metal piece is difficult to be compressed. Less. Further, the metal piece is preferably brought into contact with the inner surface of one end wall of the case. This is because the abutment directly receives the molding pressure via the holder and prevents compression of the intervening portion.
【００１３】また、同様に、上記ホルダーの挿入先端を
前記ケースの一端壁内面に圧接して上記基板の前記ケー
ス一側壁内面への圧接を防止している構成とし得る。上
記と同様にして、ケース一端壁への圧接により基板の圧
接が防止されるからである。Similarly, the insertion end of the holder may be pressed against the inner surface of one end wall of the case to prevent the substrate from being pressed against the inner surface of one side wall of the case. This is because, similarly to the above, pressure contact of the substrate is prevented by pressure contact with one end wall of the case.
【００１４】上記回転検出素子には、ホールＩＣが好ま
しいが、他のものとして、ホール素子、半導体磁気抵抗
素子、強磁性体磁気抵抗素子、プロトン磁力計などの磁
気センサ素子などを採用し得る。The rotation detecting element is preferably a Hall IC, but may be a Hall element, a semiconductor magnetoresistive element, a ferromagnetic magnetoresistive element, or a magnetic sensor element such as a proton magnetometer.
【００１５】上記回転検出素子の圧損をなくした回転セ
ンサの製造方法にあっては、上記ケースにホルダーを、
その挿入先端がケース一端壁内面に当接するとともに前
記回転検出素子とケース一端壁内面とに間隙をもつよう
に挿入して、上記モールド被覆を行う構成を採用し得
る。In the method for manufacturing a rotation sensor in which the pressure loss of the rotation detecting element is eliminated, a holder is provided in the case,
It is possible to adopt a configuration in which the insertion end contacts the inner surface of the one end wall of the case and is inserted with a gap between the rotation detecting element and the inner surface of the one end wall to perform the above-described mold coating.
【００１６】このようにすれば、成形圧により、ホルダ
ーがケース一端壁に圧接されてホルダーが圧縮されて
も、その圧縮による回転検出素子のケース一端壁内面へ
の圧縮は上記間隙によって吸収されて回転検出素子の圧
損が防止される。With this configuration, even if the holder is pressed against the one end wall of the case due to the molding pressure and the holder is compressed, the compression of the rotation detecting element on the inner surface of the one end wall of the case due to the compression is absorbed by the gap. Pressure loss of the rotation detecting element is prevented.
【００１７】また、同様に、上記基板の挿入方向先端縁
とケース一端壁内面とに間隙をもつように挿入して、基
板の圧損を防止するものとし得る。このとき、回転検出
素子とケース一端壁にも上記間隙をもつようにするとよ
い。Similarly, the substrate may be inserted so as to have a gap between the leading edge of the substrate in the insertion direction and the inner surface of the one end wall of the case to prevent pressure loss of the substrate. At this time, it is preferable that the gap is also provided between the rotation detection element and one end wall of the case.
【００１８】さらに、上記基板の上記ホルダーの挿入方
向後端面とその後端面が対向するホルダーの面に間隙を
有した状態で、ホルダーに基板を支持するようにすれ
ば、モールド被覆時、その成形圧がホルダー後端から前
端に向かって働くが、その間隙の存在により、基板後端
面を介して成形圧の基板への作用がなく、基板上の電子
部品等の損傷が防止される。Further, if the substrate is supported by the holder in a state where there is a gap between the rear end surface of the substrate in the insertion direction of the holder and the rear end surface facing the rear end surface, the molding pressure during mold coating can be improved. Works toward the front end from the rear end of the holder, but due to the presence of the gap, no molding pressure acts on the substrate via the rear end surface of the substrate, and damage to electronic components and the like on the substrate is prevented.
【００１９】上記各間隙は、ホルダーの圧縮量を考慮し
て実験等により、回転検出素子又は基板の圧損が生じな
いように適宜に設定する。因みに、モールド被覆した後
は、回転検出素子及び基板はケース一端壁面に接してい
てもよく、要は、モールド時に圧損が生じる程の成形圧
が加わらなければよい。The above-mentioned gaps are appropriately set by experiments or the like in consideration of the amount of compression of the holder so that pressure loss of the rotation detecting element or the substrate does not occur. Incidentally, after the mold coating, the rotation detecting element and the substrate may be in contact with the wall surface of one end of the case. In short, it is sufficient that a molding pressure sufficient to cause a pressure loss at the time of molding is not applied.
【００２０】なお、上記基板前後面の間隙は必ずしも形
成する必要もなく、また、上記金属片を介在する場合、
上述のように、成形圧を金属片が受けて圧縮を防止する
ため、上記ケース一端壁との間隙は必ずしも設ける必要
はない。しかし、該間隙があれば、上述の作用によって
回転検出素子の圧損はより確実に防止される。It is not always necessary to form the gap between the front and rear surfaces of the substrate, and when the metal piece is interposed,
As described above, it is not always necessary to provide a gap between the metal piece and the one end wall of the case in order to prevent the metal piece from receiving the molding pressure and to prevent the metal piece from being compressed. However, if the gap exists, the pressure loss of the rotation detecting element is more reliably prevented by the above-described operation.
【００２１】[0021]
【実施例】一実施例を図１乃至図６に示し、この実施例
は、基板１上にホールＩＣ２及びその制御用抵抗３ａ、
コンデンサ３ｂなどの電子部品３を設け、この基板１を
円筒状金属ケース４に入れて、その挿入開口部を、基板
１からリード線５を導き出して車体取付ブラケット１１
とともにモールド被覆６をした回転センサである。1 to 6 show an embodiment. In this embodiment, a Hall IC 2 and a control resistor 3a for controlling the Hall IC 2 are provided on a substrate 1. FIG.
An electronic component 3 such as a capacitor 3b is provided, the substrate 1 is placed in a cylindrical metal case 4, and the insertion opening thereof is led out of the substrate 1 to lead the lead wire 5 to the vehicle body mounting bracket 11.
And a rotation sensor coated with a mold 6.
【００２２】基板１はガラス繊維入りエポキシ板から成
り、その上に抵抗３ａ、コンデンサ３ｂ及びホールＩＣ
２が実装され、それらの接続回路にリード線５の端子片
５ａが半田接続されている。ホールＩＣ２はリード線２
ａを介し基板１から立ち上がってケース４の一端閉塞壁
４ａに対向している。この電子部品３付の基板１は略円
柱状ホルダー７に支持される。The substrate 1 is made of an epoxy plate containing glass fiber, on which a resistor 3a, a capacitor 3b and a Hall IC
2 are mounted, and the terminal pieces 5a of the lead wires 5 are soldered to their connection circuits. Hall IC2 is lead wire 2
a, it rises from the substrate 1 and faces one end closing wall 4a of the case 4. The substrate 1 with the electronic component 3 is supported by a substantially cylindrical holder 7.
【００２３】ホルダー７は、図２に示すように、端子片
２ａ、２ａを埋込んで樹脂成形されたものであり、下面
に基板１を嵌め、その下にカバー８をその突部８ａをホ
ルダー７に嵌入することにより取付ける。このとき、基
板１の後端とそのホルダー７の対向面には間隙ｔ1 が、
基板１の先端とケース４の一端壁４ａ内面には間隙ｔ2
がそれぞれ形成される（図１（ａ）参照）。その間隙ｔ
1 、ｔ2 は例えば０．２ｍｍとする。As shown in FIG. 2, the holder 7 is formed by resin molding by embedding the terminal pieces 2a, 2a. The substrate 1 is fitted on the lower surface, the cover 8 is placed under the substrate 1, and the projection 8a is attached to the holder 8. 7 to be attached. At this time, a gap t 1 is formed between the rear end of the substrate 1 and the opposing surface of the holder 7.
A gap t 2 is provided between the tip of the substrate 1 and the inner surface of the one end wall 4 a of the case 4.
Are formed respectively (see FIG. 1A). The gap t
1 and t 2 are, for example, 0.2 mm.
【００２４】また、ホルダー７の先端部には基板１から
立ち上がったホールＩＣ２が嵌入してケース一端壁４ａ
に、例えば０．２ｍｍの間隙ｔ3 をもって対向している
（図４参照）。そのホールＩＣ２の後側に磁石９が嵌入
されており、この磁石９から出る磁力線が、この回転セ
ンサに対向するパルサリング（周囲歯車面又は周囲ＳＮ
極の磁石面等のリング）の回転によって変動し、その変
動によってホールＩＣ２を介しその回転数を検出する。
例えば、パルサリングを自動車の車軸に取付けて車輪速
を検出する。ホルダー７の先端部にはさらにホールＩＣ
２を被ってホルダー７のケース４への挿入方向（図１
（ａ）左右方向）におけるそのホールＩＣ２の全幅に亘
るＳＵＳ３０４などのＳＵＳ系からなる金属片１０が嵌
着されている。この金属片１０がホールＩＣ２の全幅に
亘ることにより、その金属片１０の幅内のホルダー７部
分は圧縮されにくく、ホールＩＣ２に後述の成形圧が加
わりにくい。Further, a Hall IC 2 rising from the substrate 1 is fitted into the tip of the holder 7, and the case end wall 4a
, For example, with a gap t 3 of 0.2 mm (see FIG. 4). A magnet 9 is fitted on the rear side of the Hall IC 2, and a magnetic line of force coming out of the magnet 9 forms a pulser ring (peripheral gear surface or peripheral SN) facing the rotation sensor.
The rotation speed is changed by the rotation of a ring such as a pole magnet surface, and the rotation speed is detected via the Hall IC 2 by the change.
For example, the pulsaring is attached to the axle of an automobile to detect the wheel speed. At the end of the holder 7 is a Hall IC
2 and the direction of insertion of the holder 7 into the case 4 (see FIG. 1).
A metal piece 10 made of SUS, such as SUS304, is fitted over the entire width of the Hall IC 2 ((a) in the left-right direction). Since the metal piece 10 extends over the entire width of the Hall IC 2, the holder 7 within the width of the metal piece 10 is not easily compressed, and a molding pressure described later is not easily applied to the Hall IC 2.
【００２５】この実施例は、図３に示すように、まず、
ブラケット１１付のケース４に基板１などを有するホル
ダー７を挿入して、その挿入開口部全周にホットメルト
１２を塗布して閉塞する。つぎに、図４に示すように、
リード線５を接続した後、それを金型Ｄ内に装填してそ
のキャビティにナイロン樹脂を射出することにより、ケ
ース４のホルダー挿入開口部周りをモールド被覆６す
る。リード線５はケース４へのホルダー７の挿入前に接
続することもできる。In this embodiment, as shown in FIG.
The holder 7 having the substrate 1 and the like is inserted into the case 4 with the bracket 11, and the hot melt 12 is applied over the entire opening of the insertion opening and closed. Next, as shown in FIG.
After the lead wire 5 is connected, the lead wire 5 is loaded into the mold D and a nylon resin is injected into the cavity to mold-coat 6 around the holder insertion opening of the case 4. The lead wire 5 can be connected before the holder 7 is inserted into the case 4.
【００２６】このとき、図４矢印のごとく、ホルダー７
には数トンの成形圧が加わり、図６の端子片５ａ先端Ｌ
字部が曲る程度に（図１（ａ）参照）ホルダー７は圧縮
されるが、金属片１０がその圧縮力に抗するとともに、
間隔ｔ3 の存在により、ホールＩＣ２にはその成形圧が
加わらない。また、間隙ｔ1 、ｔ2 の縮小により基板１
のホルダー７とケース一端壁４ａとの圧接が防止され
る。At this time, as shown by the arrow in FIG.
Of the terminal piece 5a shown in FIG.
The holder 7 is compressed to the extent that the character is bent (see FIG. 1A), but the metal piece 10 resists the compressive force,
The presence of interval t 3, the molding pressure is not applied to the Hall IC 2. Further, the substrate 1 is reduced by reducing the gaps t 1 and t 2.
Press contact between the holder 7 and the case end wall 4a is prevented.
【００２７】[0027]
【発明の効果】この発明は、以上のようにしたので、厳
しい振動及び塵埃に強い回転センサを得ることができる
とともに、基板、回転検出素子等の損傷が少ない検出精
度の高いものを得ることができる。As described above, according to the present invention, it is possible to obtain a rotation sensor that is resistant to severe vibrations and dust, and to obtain a substrate and a rotation detection element that have little damage and high detection accuracy. it can.
【図１】一実施例のホルダー部を示し、（ａ）は切断正
面図、（ｂ）は右側面図、（ｃ）は平面図FIGS. 1A and 1B show a holder part of an embodiment, wherein FIG. 1A is a cut front view, FIG. 1B is a right side view, and FIG.
【図２】同ホルダー部の分解斜視図FIG. 2 is an exploded perspective view of the holder.
【図３】同実施例の製作説明用図斜視図FIG. 3 is a perspective view for explaining the production of the embodiment.
【図４】同実施例の製作説明用断面図FIG. 4 is a sectional view for explaining the production of the embodiment.
【図５】同実施例の回転センサを示し、（ａ）は正面
図、（ｂ）は右側面図5A and 5B show the rotation sensor of the embodiment, wherein FIG. 5A is a front view, and FIG.
【図６】同断面図FIG. 6 is a sectional view of the same.
１ 基板 ２ ホールＩＣ（回転検出素子） ３ 電子部品 ４ 金属ケース ４ａ 金属ケース一端壁 ５ リード線 ６ モールド被覆 ７ ホルダー ９ 磁石 １０ 金属片 １１ 車体取付ブラケット ｔ1 、ｔ2 、ｔ3 間隙1 substrate 2 Hall IC (rotation detecting element) 3 electronic component 4 metal case 4a metal case one end wall 5 leads 6 molded cover 7 holder 9 magnet 10 metal piece 11 vehicle body mounting bracket t 1, t 2, t 3 gap
Claims (10)
御用電子部品３を設け、この基板１をケース４内に入れ
てその挿入開口部を基板１からのリード線５を導き出し
てモールド被覆６した回転センサ。1. A rotation detecting element 2 and an electronic component 3 for controlling the rotation detecting element 2 are provided on a substrate 1. The substrate 1 is placed in a case 4 and its insertion opening is formed by leading a lead wire 5 from the substrate 1. Rotation sensor with coating 6.
子２を支持し、そのホルダー７を上記ケース４に入れ
て、そのケース４の挿入開口部内面とホルダー７の間隙
を塞ぐように上記モールド被覆６を施したことを特徴と
する請求項１に記載の回転センサ。2. The holder 7 supports the substrate 1 and the rotation detecting element 2, and the holder 7 is placed in the case 4, and the mold is so formed as to close the gap between the inner surface of the insertion opening of the case 4 and the holder 7. The rotation sensor according to claim 1, wherein a coating (6) is provided.
て、このケース４にその他端開口から上記ホルダー７を
挿入し、上記回転検出素子２は、ホールＩＣであって上
記基板１から立ち上がって前記ケース４の一端壁４ａ内
面に対向しており、かつ、前記ホルダー７の挿入先端は
前記ケース４の一端壁４ａ内面に圧接して前記ホールＩ
Ｃ２の前記ケース一端壁４ａ内面への圧接を防止してい
ることを特徴とする請求項２に記載の回転センサ。3. The case 4 has a cylindrical shape with one end closed, and the holder 7 is inserted into the case 4 from the other end opening. The rotation detecting element 2 is a Hall IC and stands up from the substrate 1. And the insertion end of the holder 7 is pressed against the inner surface of the one end wall 4a of the case 4 so as to press the hole I.
The rotation sensor according to claim 2, wherein a pressure contact of C2 to the inner surface of the one end wall (4a) of the case is prevented.
の圧接部に硬質金属片１０を介在したことを特徴とする
請求項３に記載の回転センサ。4. The rotation sensor according to claim 3, wherein a hard metal piece is interposed between the holder and a pressure contact portion between the inner surface of the case end wall and the case.
上記回転検出素子２の全幅に亘ることを特徴とする請求
項４に記載の回転センサ。5. The rotation sensor according to claim 4, wherein the metal piece extends over the entire width of the rotation detecting element in the insertion direction.
て、このケース４にその他端開口から上記ホルダー７を
挿入し、そのホルダー７の挿入先端は前記ケース４の一
端壁４ａ内面に圧接して上記基板１の前記ケース一端壁
４ａ内面への圧接を防止していることを特徴とする請求
項２乃至５のいずれか一つに記載の回転センサ。6. The case 4 has a cylindrical shape with one end closed, and the holder 7 is inserted into the case 4 from the other end opening, and the insertion end of the holder 7 is pressed against the inner surface of one end wall 4a of the case 4. The rotation sensor according to any one of claims 2 to 5, wherein the substrate 1 is prevented from being pressed against the inner surface of the one end wall 4a of the case.
回転センサの製造方法であって、上記ケース４にホルダ
ー７を、その挿入先端がケース一端壁４ａ内面に当接す
るとともに上記回転検出素子２とケース一端壁４ａ内面
とに間隙ｔ3をもつように挿入して、上記モールド被覆
６を行うことを特徴とする回転センサの製造方法。7. The method for manufacturing a rotation sensor according to claim 3, wherein a holder 7 is inserted into the case 4 and an insertion end of the holder 7 contacts an inner surface of the case end wall 4a. and inserted into the detection element 2 and the case end wall 4a inner surface so as to have a gap t 3, the manufacturing method of the rotation sensor and performs the mold-coated 6.
であって、上記ケース４にホルダー７を、その挿入先端
がケース一端壁４ａ内面に当接するとともに上記基板１
の挿入方向先端縁とケース一端壁４ａ内面とに間隙ｔ2
をもつように挿入して、上記モールド被覆６を行うこと
を特徴とする回転センサの製造方法。8. The method of manufacturing a rotation sensor according to claim 6, wherein the holder has an insertion end in contact with the case and an inner surface of the case end wall.
The insertion direction leading end edge and clearance t 2 in the case end wall 4a inner surface
A method for manufacturing a rotation sensor, comprising:
において、上記基板１の挿入方向先端縁とケース一端壁
４ａ内面とに間隙ｔ2 をもつように、上記ケース４にホ
ルダー７を挿入することを特徴とする回転センサの製造
方法。9. A method of manufacturing a rotation sensor according to claim 7, so as to have a gap t 2 in the insertion direction leading end edge and the case end wall 4a inner surface of the substrate 1, insert the holder 7 to the case 4 A method of manufacturing a rotation sensor.
向後端面とその後端面が対向するホルダー７の面に間隙
ｔ1 を有した状態で、ホルダー７に基板１を支持するこ
とを特徴とする請求項７乃至９のいずれか一つに記載の
回転センサの製造方法。In a state in which 10. had a gap t 1 on the surface of the holder 7 the insertion direction rear end surface and the rear end face of the holder 7 of the substrate 1 is opposed, characterized in that for supporting the substrate 1 to the holder 7 A method for manufacturing the rotation sensor according to claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35951998A JP3649010B2 (en) | 1998-12-17 | 1998-12-17 | Rotation sensor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35951998A JP3649010B2 (en) | 1998-12-17 | 1998-12-17 | Rotation sensor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000180460A true JP2000180460A (en) | 2000-06-30 |
| JP3649010B2 JP3649010B2 (en) | 2005-05-18 |
Family
ID=18464924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35951998A Expired - Lifetime JP3649010B2 (en) | 1998-12-17 | 1998-12-17 | Rotation sensor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3649010B2 (en) |
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