JP2000169680A - Card material of polyester resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a card material having permanent antistatic properties and embossing processability of marking a letter and a figure in a three- dimensional way by making the card material include a polyester resin and a specific resin. SOLUTION: This card material comprises (A) 100 pts.wt. of a polyester resin being preferably an amorphous polyester resin and (B) 1-65 pts.wt., preferably 3-45 pts.wt. of a resin having 200-6,000 number-average molecular weight and containing a poly(alkylene oxide) glycol residue. A polyester comprising a dicarboxylic acid unit consisting essentially of a terephthalic acid unit and a glycol unit consisting essentially of an ethylene glycol unit and a 1,4- cyclohexanedimethanol unit, etc., are preferable as the component A. A poly(alkylene oxide)glycol residue-containing polyether amide, polyether ester, polyether ester amide, etc., may be cited as the component B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyester resin card material having a permanent antistatic property and having excellent embossability for three-dimensionally imprinting letters and numbers.

[0002]

2. Description of the Related Art Polyester resins are used in a wide range of fields because of their excellent moldability and mechanical properties.
In addition, it is also studied as a card material because of its excellent heat resistance and rigidity. As these card materials, it is necessary that the card is not warped or cracked by embossing for engraving letters and numbers three-dimensionally, and a multilayer sheet made of a rigid polyvinyl chloride resin is generally used. . However, since there is a problem that the polyvinyl chloride resin may generate a substance harmful to the human body when burned, card materials other than the polyvinyl chloride resin have been demanded.

As a card material other than polyvinyl chloride resin, 1,4-cyclohexanedimethanol derivative copolymerized polyester is known.

JP-A-53-94536 discloses a blend of polycarbonate and poly (1,4-cyclohexanedimethanol terephthalate-co-isophthalate). Also, JP-A-59-12
No. 0648 discloses a blend of a polycarbonate and a 1,4-cyclohexanedimethanol derivative copolymerized polyester. However, warpage due to embossing cannot be sufficiently reduced in these card materials. Further, the polyester resin has a high surface resistivity and a high volume resistivity as electrical properties, and is easily charged by friction or the like, and has disadvantages such as easily adhering dust and easily causing electrostatic damage. As a method of imparting antistatic properties to the polyester resin,
Japanese Patent Application Laid-Open No. 64-9242 discloses a method of applying an antistatic resin to the surface of a molded article. However, the effect of antistatic properties is temporary and has no sustainability, and it depends on the shape of the molded article. There are problems such as poor workability.

[0005]

DISCLOSURE OF THE INVENTION The present invention provides a card material such as a magnetic card and an IC card which is a polyester resin having excellent permanent antistatic properties and having excellent embossability and mechanical properties. The task is to do so.

[0006]

SUMMARY OF THE INVENTION The present inventors have conducted intensive studies to provide a card material such as a magnetic card or an IC card which is a polyester resin and has excellent permanent antistatic properties, embossability and mechanical properties. Reached the present invention.
That is, the present invention relates to (1) (A) polyester resin 1
00 parts by weight, and (B) a number average molecular weight of 200 to 600.
A card material comprising 1 to 65 parts by weight of a resin containing 0 poly (alkylene oxide) glycol residue, (2)
The card material according to the above (1), wherein the component (B) is a polyetheramide, a polyetherester or a polyetheresteramide, (3) (B)
The components are (a) a salt of an aminocarboxylic acid or lactam having 6 or more carbon atoms or a salt of a dicarboxylic acid with a diamine having 6 or more carbon atoms, and (b) a number average molecular weight of 200 to 600.
0 (poly (alkylene oxide) glycol) and (c) a polyetheresteramide obtained by copolymerizing a dicarboxylic acid having 4 to 20 carbon atoms such that the polyetherester unit content is 10 to 90% by weight. (4) The card material according to (1) or (2) above,
(A) The card material according to any one of the above (1) to (3), wherein the component is an amorphous polyester;
(5) The component (A) comprises a dicarboxylic acid unit mainly composed of a terephthalic acid unit, an ethylene glycol unit and 1,4-
(6) The card material as described in any of (1) to (4) above, which is a polyester comprising a glycol unit mainly composed of cyclohexanedimethanol units.
The component (A) comprises ethylene glycol unit (I) and 1,4
The card material according to any one of the above (1) to (5), comprising a polyester having a molar ratio [(I) / (II)] of -cyclohexanedimethanol unit (II) of 1 or more; 7) The component (A) comprises a polyester having an ethylene glycol unit (I) and a 1,4-cyclohexanedimethanol unit (II) having a molar ratio [(I) / (II)] of 1 or more, and an aromatic polycarbonate. The card material according to any one of the above (1) to (5), wherein the component (8) (A) is composed of an ethylene glycol unit (I) and a 1,4-cyclohexanedimethanol unit (II). A polyester having a molar ratio (I) / (II) of 1 or more, and an ethylene glycol unit (I) and 1,4-
Molar ratio of cyclohexanedimethanol units (II) (I)
/ (II) comprising a polyester smaller than 1 and an aromatic polycarbonate.
The card material according to any one of (5) and (9), wherein the component (A) is a molar ratio (I) / (II) of ethylene glycol unit (I) and 1,4-cyclohexanedimethanol unit (II).
Wherein the molar ratio (I) / (II) of the ethylene glycol unit (I) to the 1,4-cyclohexanedimethanol unit (II) is less than 1. The card material according to any one of (1) to (5), (10) and the epoxy compound (C) in an amount of 0.1 to 100 parts by weight of the component (A).
The card material according to any one of the above (1) to (9), which further comprises (D) an average particle size of 0.1 to 20 parts by weight.
An inorganic plate-like filler having a size of 5 to 20 μm is added to the component (A)
The card material according to any one of the above (1) to (10), wherein 2 to 50 parts by weight is blended with respect to parts by weight.
(12) The card material according to the above (11), wherein the component (D) is talc.
A card made of the card material according to any of (12),
(14) An embossed card made of the card material according to (13) above,

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The polyester resin (A) in the present invention is a polyester resin in a broad sense including a polycarbonate resin in addition to a normal polyester resin.

As the polyester resin, terephthalic acid, isophthalic acid, orthophthalic acid,
2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, methyl terephthalic acid, 4-4′-biphenyldicarboxylic acid,
2-2'-biphenyldicarboxylic acid, 1,2'-bis (4-carboxyphenoxy) -ethane, succinic acid, adipic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, octadecanedicarboxylic acid, dimer acid, And 1,4-cyclohexanedicarboxylic acid and the like, and glycol components such as ethylene glycol, propylene glycol, butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,10- Decanediol, 1,4-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 1,2-cyclohexanedimethanol, and 2,2-bis (2′-hydroxyethoxyphenyl)
Those using propane and the like can be mentioned.

Preferred examples of the polyester resin as the component (A) include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polycyclohexane dimethylene terephthalate, and copolymers thereof. The polyester resin as the component (A) may be crystalline or amorphous, and among them, an amorphous polyester resin is particularly preferable. The amorphous polyester resin as used herein refers to a polyester resin having a calorific value of crystallization of 5 cal / g or less when the temperature is lowered at a rate of 10 ° C./min from a molten state by a differential scanning calorimeter.

Among the amorphous polyester resins, polyesters comprising a dicarboxylic acid unit mainly composed of a terephthalic acid unit and a glycol unit mainly composed of an ethylene glycol unit and a 1,4-cyclohexanedimethanol unit are preferred. (I) and 1,4
A polyester resin having a molar ratio [(I) / (II)] of -cyclohexanedimethanol unit (II) of 1 or more is preferable.

As the polyester resin of the component (A),
Two or more polyester resins may be blended and used, and in this case, ethylene glycol unit (I)
A polyester having a molar ratio [(I) / (II)] of 1 to 1,4-cyclohexanedimethanol unit (II) is 1 or more;
And the molar ratio of ethylene glycol units (I) and 1,4-cyclohexanedimethanol units (II) [(I) /
(II)] is preferred because it is used by blending a polyester resin having a value of less than 1.

Above all, when using a polyester resin having a molar ratio [(I) / (II)] of ethylene glycol unit (I) and 1,4-cyclohexanedimethanol unit (II) of 1 or more, (I) / (II)] is not particularly limited, but is preferably 99 or less. Further, the molar ratio of ethylene glycol unit (I) to 1,4-cyclohexanedimethanol unit (II) [(I) / (I
I)] when using a polyester resin smaller than 1
The lower limit is not particularly limited, but is preferably 1/99 or more.

Further, a polyester having a molar ratio [(I) / (II)] of ethylene glycol unit (I) and 1,4-cyclohexanedimethanol unit (II) of 1 or more, and ethylene glycol unit (I) and 1,4 The molar ratio of 4-cyclohexanedimethanol units (II) [(I) / (I
(I)] A preferable blending ratio / molar ratio [(I) /
(II)] is 1 or more / polyester / molar ratio [(I)
/ (II)] is less than 1 by weight ratio of 5/95 to 95/5, and more preferably 30/70 to 90 /
10, preferably 40/60 to 80/2.
It is preferably 0.

The production method in the case of using a 1,4-cyclohexane dimethanol derivative copolymerized polyester as the component (A) is not particularly limited, but, for example, in the presence or absence of a catalyst such as an organic titanium compound. A method obtained by polycondensing terephthalic acid or its lower alkyl ester with 1,4-cyclohexanedimethanol and ethylene glycol. As the polymerization conditions, for example, the conditions described in U.S. Pat. No. 2,901,466 can be applied.

The 1,4-cyclohexanedimethanol derivative copolymerized polyester used as the component (A) has an acid content within the range not impairing the effects of the present invention, usually at most 20 mol%, preferably at most 10 mol%. As components, isophthalic acid, orthophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid,
1,5-naphthalenedicarboxylic acid, methyl terephthalic acid, 4-4′-biphenyldicarboxylic acid, 2-2′-biphenyldicarboxylic acid, 1,2′-bis (4-carboxyphenoxy) -ethane, succinic acid, adipic acid , Suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, octadecanedicarboxylic acid, dimer acid, and other dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid, and propylene glycol, 1,5-pentane as a glycol component. Diol, 1,6-hexanediol, 1,8-octanediol, 1,10-decanediol, 1,3-cyclohexanedimethanol,
1,2-cyclohexanedimethanol and 2,2-
Those obtained by copolymerizing other glycols such as bis (2'-hydroxyethoxyphenyl) propane can also be used.

Further, it is also possible to use an aromatic polycarbonate as the polyester resin of the component (A). As the aromatic polycarbonate, bisphenol A, that is, 2,2'-bis (4-hydroxyphenyl) propane, 4,4'-dihydroxydiphenylalkane or 4,4'-dihydroxydiphenylsulfone, 4,4'-dihydroxydiphenylether Preferred are those containing at least one selected from the group consisting of bisphenol A, that is, 2,2′-
Those produced using bis (4-hydroxyphenyl) propane as a main raw material are preferred. Specifically, a polycarbonate obtained by using the above bisphenol A or the like as a dihydroxy component and by a transesterification method or a phosgene method is preferable. Furthermore, a part of bisphenol A,
Preferably, 10 mol% or less is substituted with 4,4'-dihydroxydiphenylalkane, 4,4'-dihydroxydiphenylsulfone, 4,4'-dihydroxydiphenylether or the like.

The polyester resin of the component (A) may be composed of any of an amorphous polyester resin component alone, an aromatic polycarbonate component alone, and both components.
When an amorphous polyester is used, it is preferable to include an aromatic polycarbonate from the viewpoint of improving heat resistance. The mixing ratio of the amorphous polyester resin and the aromatic polycarbonate is not particularly limited, and an arbitrary ratio is used. A preferable weight ratio is (amorphous polyester resin) / (aromatic polycarbonate), and is 95/5 to 5/95. And more preferably 80/20 to 20/80.

The (B) number average molecular weight of the present invention is from 200 to 60.
Examples of the resin containing a poly (alkylene oxide) glycol residue of 00 include (1) poly (alkylene oxide) glycol, (2) polyether amide, polyether ester containing a poly (alkylene oxide) glycol residue, And polyetheresteramide,
(3) A vinyl polymer containing a poly (alkylene oxide) glycol residue is exemplified.

Specifically, (1) poly (alkylene oxide) glycols include polyethylene glycol, polypropylene oxide glycol, poly (tetramethylene oxide) glycol, poly (hexamethylene oxide) glycol, blocks of ethylene oxide and propylene oxide or random Copolymers and block or random copolymers of ethylene oxide and tetrahydrofuran are exemplified.

(2) The polyether amide, polyether ester and polyether ester amide containing a poly (alkylene oxide) glycol residue include (a1) a polyamide-forming component or (a2) a polyester-forming component and (b) Block or graft copolymer obtained from reaction with poly (alkylene oxide) glycol.

(A1) As a polyamide-forming component, as a salt of an aminocarboxylic acid or a lactam having 6 or more carbon atoms or a dicarboxylic acid with a diamine having 6 or more carbon atoms, ω-aminocaproic acid, ω-aminoenanthic acid,
ω-aminocaprylic acid, ω-aminopergonic acid, ω-aminocapric acid and 11-aminoundecanoic acid, 12-
Aminocarboxylic acids such as aminododecanoic acid or lactams such as caprolactam, enantholactam, caprylactam and laurolactam and diamines such as hexamethylenediamine-adipate, hexamethylenediamine-sebacate and hexamethylenediamine-isophthalate- Examples thereof include salts of dicarboxylic acids, and in particular, caprolactam, 12-aminododecanoic acid, and hexamethylenediamine-adipate are preferably used.

(A2) As the polyester-forming component, terephthalic acid, isophthalic acid,
Phthalic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, diphenyl-4,4'-
Dicarboxylic acid, diphenoxyethane dicarboxylic acid and 3
Aromatic dicarboxylic acids such as sodium sulfoisophthalate, 1,4-cyclohexanedicarboxylic acid, 1,2
Alicyclic dicarboxylic acids such as -cyclohexanedicarboxylic acid, 1,3-cyclopentanedicarboxylic acid, 1,3-dicarboxymethylcyclohexyl, 1,4-dicarboxymethylcyclohexyl and dicyclohexyl-4,4'-dicarboxylic acid and succinic acid; Acids, oxalic acid, adipic acid, sebacic acid and aliphatic dicarboxylic acids such as decanedicarboxylic acid and aliphatic diol as ethylene glycol, 1,2- or 1,3-propylene glycol,
Examples thereof include 1,2-, 1,3-, 2,3- or 1,4-butanediol, neopentyl glycol, 1,6-hexanediol and the like. Particularly, as the dicarboxylic acid, terephthalic acid, isophthalic acid, Ethylene glycol, 1,2- or 1,3-propylene glycol, and 1,4-butanediol as aliphatic diols with 1,4-cyclohexanedicarboxylic acid, sebacic acid, and decanedicarboxylic acid from the viewpoint of polymerizability, color tone and physical properties It is preferably used.

(B) The poly (alkylene oxide) glycol includes poly (ethylene oxide) glycol, poly (1,2-propylene oxide) glycol, poly (1,3-propylene oxide) glycol, poly (tetramethylene oxide) glycol, Examples include poly (hexamethylene oxide) glycol, a block or random copolymer of ethylene oxide and propylene oxide, and a block or random copolymer of ethylene oxide and tetrahydrofuran. Among these, poly (ethylene oxide) glycol is particularly preferably used because of its excellent antistatic properties.

The poly (alkylene oxide) glycol also includes those added to both terminals, such as hydroquinone, bisphenol A, and naphthalene.

(B) The number average molecular weight of the poly (alkylene oxide) glycol is preferably in the range of 200 to 6000 from the viewpoint of polymerizability and antistatic properties.

(A1) a polyamide-forming component or (a)
2) The reaction between the polyester-forming component and (b) poly (alkylene oxide) glycol may be an ester reaction or an amide reaction depending on the terminal group of (b) poly (alkylene oxide) glycol.

According to the above reaction, a third component such as dicarboxylic acid or diamine can be used.

In this case, terephthalic acid, isophthalic acid, phthalic acid, naphthalene-2,
Aromatic dicarboxylic acid represented by 6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, diphenyl-4,4'-dicarboxylic acid, diphenoxyethanedicarboxylic acid and sodium 3-sulfoisophthalate, 1,4-cyclohexane Alicyclic dicarboxylic acids represented by dicarboxylic acid, 1,2-cyclohexanedicarboxylic acid and dicyclohexyl-4,4'-dicarboxylic acid and fats represented by succinic acid, oxalic acid, adipic acid, sebacic acid and decanedicarboxylic acid Group dicarboxylic acids and the like, and particularly terephthalic acid, isophthalic acid, 1,4-cyclohexanedicarboxylic acid, sebacic acid, adipic acid and decanedicarboxylic acid are preferably used in view of polymerizability, color tone and physical properties of the resin composition.

If necessary, a tricarboxylic anhydride such as trimellitic anhydride can be used.

Examples of the diamine component include aromatic, alicyclic and aliphatic diamines. Among them, the aliphatic diamine hexamethylenediamine is preferably used for economic reasons.

(2) The content of the poly (alkylene oxide) glycol residue is preferably 30 to 90% by weight, more preferably 40 to 90% by weight in the structural unit of polyetheramide, polyetherester, and polyetheresteramide.
~ 80% by weight.

(3) Examples of the vinyl polymer containing a poly (alkylene oxide) glycol residue include polyethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, and ethylene.
Olefins such as propylene, 1-butene, styrene,
At least one vinyl monomer selected from aromatic vinyl monomers such as hinyltoluene and α-methylstyrene, maleimide monomers such as maleimide and N-phenylmaleimide, and vinyl cyanide monomers such as acrylonitrile. And a monomer containing at least one monomer selected from polyethylene glycol (meth) acrylate and methoxypolyethylene glycol (meth) acrylate on the above-mentioned (a1) rubbery polymer. And the like.

The proportion of the monomer containing a poly (alkylene oxide) glycol group is poly (alkylene oxide)
5 to 4 of vinyl polymer units containing a glycol residue
A range of 0% by weight is preferred.

In the present invention, the resin (B) has a volume resistivity of 1 in view of the antistatic property of the final resin composition obtained.
It preferably has an antistatic performance of 0 ¹³ Ωcm or less. Especially, it is preferably 10 ¹¹ Ωcm or less, more preferably 10 ⁹ Ωcm or less, and the lower limit is not limited, but is 10 ⁵ Ωcm or more, particularly 10 ⁶ Ωcm or more.
Ωcm or more is economical and preferable.

(B) The volume specific resistance value of the resin is ASTM
Measure according to D257. When measuring from a resin composition, a molded product obtained by compression molding, injection molding, or the like of an antistatic polymer separated from the resin composition is measured. As a simple method, poly (alkylene oxide) in an antistatic polymer according to ASTM D257 may be used.
Draw a line for the conductor unit content and volume resistivity of the glycol residue and then obtain the volume resistivity of the polymer by analyzing the conductor unit content in any antistatic polymer. Is possible.

The (A) polyester resin of the present invention and (B)
The compounding ratio of the resin is such that the component (B) is mixed in an amount of 1 to 65 parts by weight, preferably 3 to 45 parts by weight with respect to 100 parts by weight of the component (A). The effect of blending the resin (B) is to improve the embossability in addition to imparting permanent antistatic performance. Therefore, when the amount of the resin (B) is too small, the effect of the antistatic property and the embossability is reduced. It is not preferable because it is insufficient. On the other hand, if the amount is too large, the card material becomes flexible and the mechanical properties are inferior, which is not preferable.

The epoxy compound (C) used in the present invention is
As long as the epoxy compound has two or more functional groups in the molecule, there is no particular limitation, and known epoxy compounds can be used. For example, diglycidyl ether of 2,2-bis (4-hydroxyphenyl) propane and resorcinol Diglycidyl ether, 2-methyl-1,4-diglycidyloxybenzene, 2,6-diglycidyloxynaphthalene,
Diglycidyl ether of 1,6-hexanediol, diglycidyl ether of ethylene glycol, diglycidyl ether of polyethylene glycol, diglycidyl ether of propylene glycol, glycol diglycidyl ether of polypropylene, diglycidyl ether of polytetramethylene glycol, terephthalic acid Polyepoxy compounds such as diepoxy compounds such as diglycidyl ester, polyglycidyl ether of polyglycerol, polyglycidyl ether of diglycerol, polyglycidyl ether of glycerol, polyglycidyl ether of tetramethylolpropane, and polyglycidyl ether of sorbitol. , One or two of these
More than one species can be mixed.

The amount of the epoxy compound (C) is 0.1 to 20 parts by weight, more preferably 0.2 to 5 parts by weight, based on 100 parts by weight of the polyester resin (A), in view of the mechanical properties and surface appearance of the card material. It is preferable to mix parts.

The inorganic plate-like filler of the component (D) used in the present invention is a so-called plate-like inorganic filler, which is a filler having a three-dimensionally anisotropic particle shape and a biaxial orientation. preferable. Specifically, talc, kaolin, mica, sericite, basic magnesium carbonate, aluminum hydroxide,
Glass flake and the like can be mentioned. Two or more of these fillers may be used in combination. Of these, talc and kaolin are preferred, and talc is most preferred.

The amount of the inorganic plate-like filler to be added is preferably 2 to 50 parts by weight, more preferably 4 to 30 parts by weight, based on 100 parts by weight of the polyester resin (A). Within this range, the moldability is good, good sheets and cards are obtained, the effect of improving the embossability is high, and the transparency is also excellent.

The average particle size of the inorganic plate-like filler is preferably 0.5 to 20 μm at the stage after compounding, and more preferably 1 to 10 μm.
m is more preferred. Within this range, sheet and card formability is good, and the effect of improving embossability is high.
Also excellent in transparency.

The average particle size of the inorganic plate-like filler is determined by treating the card material of the present invention with an organic solvent or burning it in an electric furnace or the like to separate only the inorganic plate-like filler component, and then performing centrifugal sedimentation type particle size distribution measurement. It can be determined by measuring with a device.

These fillers include isocyanate compounds, organic silane compounds, organic titanate compounds,
The surface may be treated with a coupling agent such as an organic borane compound or an epoxy compound.

The card material of the present invention may further contain various other additives as long as the object of the present invention is not impaired. As these other additives, for example, glass fiber, carbon fiber, asbestos fiber, rock wool,
Reinforcing agents such as calcium carbonate, silica sand, bentonite, barium sulfate, glass beads, etc., or antioxidants (phosphorous, sulfuric, etc.), UV absorbers, heat stabilizers (hindered phenolic, etc.), lubricants, release agents Examples include a mold agent, a slip improver, an anti-blocking agent, a coloring agent containing a dye and a pigment, a flame retardant, a flame retardant auxiliary, a foaming agent, and a crosslinking agent. Further, other synthetic resins (for example, polyamide resin, polystyrene resin, acrylic resin, polyethylene resin, ethylene / vinyl acetate copolymer, phenoxy resin, epoxy resin, silicone resin, etc.) can be contained.

The card according to the present invention has a long side of 10 m.
It is a plate-shaped molded product having a size of m to 300 mm, a short side of 10 to 200 mm, and a thickness of 50 to 5000 μm (the long side and the short side may have the same length, that is, a square), and exceeds this A molded product with a spread is called a sheet.

The method for producing the card material of the present invention can be carried out by a known method. As a specific production method, (A), (B) and optionally added components (C) and / or (D), and various additives are added using a single-screw or twin-screw extruder. A method of uniformly melting and kneading may be mentioned. In addition, at the time of melt-kneading, a masterbatch method in which only specific components are preliminarily kneaded and then kneaded with the remaining components may be used.

As a method for producing a card made of the card material of the present invention, each component is melt-kneaded, then pelletized, and then processed into a card by generally known injection molding. There is a method of cutting into a card and processing into a card. Alternatively, a plurality of sheets made of the card material of the present invention may be laminated to form a multilayer sheet, and then cut into a specific size and processed into a card. At this time, a sheet made of another material may be used in combination. Further, between each layer of the multi-layer sheet, a layer such as an adhesive layer or an antenna circuit may be provided as necessary. Further, each layer may be printed or a magnetic material may be applied. Such a magnetic layer may be the entire surface of the sheet or a part of the sheet such as a stripe. Further, the sheet may be subjected to secondary processing such as press molding to be processed into a card shape.

As for the size of the card, the long side is 10 mm
It is preferably a rectangular shape having a width of 50 mm to 300 mm and a short side extending from 10 mm to 200 mm, and a thickness of 50 to 5000 μm, particularly a long side of 50 mm to 100 mm and a short side of 2 mm.
A rectangular shape having an extension of 5 mm to 80 mm and a thickness of 400 to 2000 μm is preferable. Above all, a rectangular shape having a long side of about 85 mm and a short side of about 54 mm and a thickness of 600 to 900 μm is more preferable.

The card according to the present invention is generally a card capable of recording information, in particular, a function capable of reading electrically, optically or magnetically, a function capable of recording writable information, and embossing. The present invention is suitable for a card having at least one function of a function capable of recording information according to the present invention. Specifically, a contact type IC card (smart card), a non-contact type IC card having an IC chip and an antenna circuit embedded in the card, a magnetic card such as a magnetic stripe card, an optical card, and the like are preferable. Applications include prepaid cards, credit cards, banking cards, various certification cards, and the like.

When the card material of the present invention is used for a card such as a magnetic card or an IC card which conforms to JIS X6301, usually, 2 to 30 parts by weight of titanium oxide is added to 100 parts by weight of the polyester resin of the present invention to obtain an opaque material. Used for

The thermoplastic resin composition of the present invention is excellent in embossability for imprinting characters and patterns, and thus is suitable for card applications such as magnetic cards and IC cards.

[0052]

EXAMPLES The effects of the present invention will be further described below with reference to examples. The tensile test was measured according to ASTM D638, and the tensile impact test was measured according to ASTM D1822. The amount of card warpage after embossed character engraving as embossing property is determined by embossing three lines of embossed characters on a card conforming to JIS X6301 using a manual embosser (NE-1600 manufactured by Nipponjiken Co., Ltd.).
01 and the card warpage was measured. The surface specific resistance value was measured using a super insulation resistance meter SM-10 manufactured by Toa Denpa Kogyo Co., Ltd.
% RH for 100 days, washed with an aqueous solution of detergent "Mama Royal" (manufactured by Lion Co., Ltd.), then washed thoroughly with distilled water to remove water on the surface. The measurement was carried out at room temperature of 23 ° C. and humidity of 50% RH. In addition, the tensile test, the tensile impact test, and the test piece of the surface specific resistance value were cut out from the card and performed.

REFERENCE EXAMPLE (1) The following thermoplastic resin was used as the polyester resin (A).

A-1: A polyester comprising a terephthalic acid unit, an ethylene glycol unit and a 1,4-cyclohexane dimethanol unit, and comprising an ethylene glycol unit (I) and a 1,4-cyclohexane dimethanol unit (II) The molar ratio (I) / (II) is about 70/30
(“Easter” GN071 manufactured by Eastman Chemical Company) was used.

A-2: a polyester comprising (a-1) a terephthalic acid unit, an ethylene glycol unit and a 1,4-cyclohexanedimethanol unit,
And the molar ratio of ethylene glycol unit (I) to 1,4-cyclohexanedimethanol unit (II) (I) / (II)
Is about 70/30 polyester (Eastman
"Easter" GN071 manufactured by Chemical Company, 60% by weight,
(A-2) a polyester comprising a terephthalic acid unit, an ethylene glycol unit and a 1,4-cyclohexane dimethanol unit, and a mole of ethylene glycol unit (I) and 1,4-cyclohexane dimethanol unit (II) 20% by weight of polyester ("Easter" DN003 manufactured by Eastman Chemical Company) having a ratio (I) / (II) of about 35/65, and an aromatic polycarbonate (Mitsubishi Engineering Plastics Co., Ltd.) as (a-3) "Iupilon" S3000) 20% by weight
Were collectively dry-blended using a V blender, and then melt-kneaded and pelletized with a twin screw extruder to obtain a resin composition.

A-3: A polyester comprising (a-1) a terephthalic acid unit, an ethylene glycol unit and a 1,4-cyclohexanedimethanol unit,
And the molar ratio of ethylene glycol unit (I) to 1,4-cyclohexanedimethanol unit (II) (I) / (II)
Is about 70/30 polyester (Eastman
"Easter" GN071 manufactured by Chemical Company, 40% by weight,
As (a-3), an aromatic polycarbonate ("Iupilon" S3 manufactured by Mitsubishi Engineering-Plastics Corporation)
000) was dry-blended in a lump using a V blender, and then melt-kneaded and pelletized with a twin-screw extruder to obtain a resin composition.

A-4: Aromatic polycarbonate ("Iupilon" manufactured by Mitsubishi Engineering-Plastics Corporation)
S3000) was used.

(2) The following preparation was carried out as the resin (B).

B-1: 50 parts by weight of caprolactam, polyethylene glycol 44.2 having a number average molecular weight of 1,000
Parts by weight and 7.6 parts by weight of terephthalic acid together with 0.2 parts by weight of "Irganox" 1098 (antioxidant) and 0.1 part by weight of an antimony trioxide catalyst were charged into a reaction vessel equipped with a helical ribbon stirring blade. Replace with 260 ° C
After heating and stirring for 60 minutes to obtain a transparent homogeneous solution,
Polymerization was performed for 4 hours at 0 ° C. and 0.5 mmHg or less to obtain a transparent polymer. The polymer was discharged in a gut shape on a cooling belt and pelletized to prepare a pellet-like polyetheresteramide. The volume resistivity of the obtained polyetheresteramide was 4 × 10 ⁸
In ohm cm, the polyetherester units were 45% by weight.

B-2: Nylon 6.6 salt (AH salt) 40
Parts by weight, ethylene oxide adduct of bisphenol A ("Newpole" BPE-20 manufactured by Sanyo Chemical Industries)
6.3 parts by weight, 41.9 parts by weight of polyethylene glycol having a number average molecular weight of 1,000, 14.3 parts by weight of dodecadionic acid, 0.2 part by weight of "Ilganox" 1098, and 0.02 part by weight of antimony trioxide B-1 The reaction vessel was charged with nitrogen, replaced with nitrogen, heated and stirred at 260 ° C. for 60 minutes to form a transparent homogeneous solution, and then reduced in pressure to 500 mmHg to remove water in the gas phase of the reaction vessel. 0.08 parts by weight were added. Then 260 ° C,
Polymerization was performed for 3 hours and 30 minutes under the condition of 0.5 mmHg or less to obtain a transparent polymer. Thereafter, a polyetheresteramide was prepared in the same manner as in B-1. The volume resistivity of the obtained polyetheresteramide was 1 × 10 ⁸ Ωcm.
The polyetherester unit was 40% by weight.

(3) The following compounds were used as the epoxy compound (C).

C-1: Glycidyl ether of 2,2-bis (4-hydroxyphenyl) propane ("Epicoat" EP1007) (epoxy equivalent 1750-2200)
g) was used.

C-2: Trimethylolpropane polyglycidyl ether ("Denacol" EX321) (epoxy equivalent: 145 g) was used.

(4) (D) The following were used as the inorganic plate-like filler.

D-1: Talc (LMS-300 manufactured by Fuji Talc Co., Ltd.) having an average particle size of 1.4 μm was used.

D-2: Talc having an average particle size of 5.5 μm (PKP-80 manufactured by Fuji Talc Kogyo KK) was used.

D-3: Talc having an average particle size of 12.0 μm (NK48 manufactured by Fuji Talc Kogyo KK) was used.

Examples 1 to 5, Comparative Examples 1 to 3 Raw materials having the composition ratios shown in Table 1 were dry-blended using a V blender, and then supplied to a single screw extruder set at a temperature of 240 ° C. Discharge from T die, thickness 1
00 μm and 300 μm sheets were obtained. There was no change in the average particle size of talc before and after blending. The inorganic plate-like filler used was a master batch which was preliminarily kneaded at a ratio of polyester resin / inorganic plate-like filler = 65/35 wt% by a twin screw extruder. The above 100 μm and 300 μm sheets were converted to 100/300/300/1
00 μm (“/” represents lamination) in this order and applied to a press molding machine at a temperature of 130 ° C., a pressure of 1 MPa, and a holding time of 1
Heat fusion was performed for 0 minutes to obtain a card conforming to JIS X6301.

[0069]

[Table 1]

Examples 6 to 9 and Comparative Examples 4 and 5 Raw materials having the composition ratios shown in Table 2 were collectively dry-blended using a V blender, and then mixed with a twin-screw extruder set to a temperature of 260 ° C. Melt kneading and pelletizing were performed to obtain a card material. This card material is heated to a cylinder temperature of 27.
It is supplied to an injection molding machine set at 0 ° C and a mold temperature of 60 ° C.
A card conforming to IS X6301 was molded.

[0071]

[Table 2]

Examples 10 to 12 and Comparative Examples 6 to 7 Raw materials having the composition ratios shown in Table 3 were dry blended using a V blender, and then supplied to a single screw extruder set at a temperature of 270 ° C. Discharge from T die, thickness 1
00 μm and 300 μm sheets were obtained. There was no change in the average particle size of talc before and after blending. The inorganic plate-like filler used was a master batch which was preliminarily kneaded at a ratio of polyester resin / inorganic plate-like filler = 65/35 wt% by a twin screw extruder. The above 100 μm and 300 μm sheets were converted to 100/300/300/1
00 μm (“/” indicates lamination) in that order and subjected to a press molding machine, temperature 160 ° C., pressure 1 MPa, holding time 1
Heat fusion was performed for 0 minutes to obtain a card conforming to JIS X6301.

[0073]

[Table 3]

Examples 13 to 16 and Comparative Examples 8 to 10 Raw materials having the composition ratios shown in Table 4 were dry-blended using a V blender, and then supplied to a single screw extruder set at a temperature of 280 ° C. Discharge from T die, thickness 1
00 μm and 300 μm sheets were obtained. There was no change in the average particle size of talc before and after blending. The inorganic plate-like filler used was a master batch which was preliminarily kneaded at a ratio of polyester resin / inorganic plate-like filler = 65/35 wt% by a twin screw extruder. The above 100 μm and 300 μm sheets were converted to 100/300/300/1
00 μm (“/” indicates lamination) in this order and subjected to a press molding machine, temperature 180 ° C., pressure 1 MPa, holding time 1
Heat fusion was performed for 0 minutes to obtain a card conforming to JIS X6301.

[0075]

[Table 4]

[0076]

The card material of the present invention is excellent in permanent antistatic properties and, when used in cards such as magnetic cards and IC cards, has little warpage even when embossed.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) C08L 77:12) B29K 67:00 B29L 7:00 F term (Reference) 2C005 HA30 JA02 JA08 JA11 JA26 JB23 KA37 KA40 LA03 LA06 LA09 LA29 4F209 AA24 AA29 AA32. DL006 FA016 FD010 FD016 FD060 FD070 GS00 5D006 CB01 CB03 CB06 DA01 FA00

Claims (14)

[Claims] 1. A resin containing 1 to 6 parts by weight of (A) a polyester resin and (B) a resin containing a poly (alkylene oxide) glycol residue having a number average molecular weight of 200 to 6000.
Card material consisting of 5 parts by weight. 2. The card material according to claim 1, wherein the component (B) is a polyetheramide, a polyetherester or a polyetheresteramide. 3. Component (B) is (a) a salt of an aminocarboxylic acid or lactam having 6 or more carbon atoms, or a salt of a diamine and a dicarboxylic acid having 6 or more carbon atoms, and (b) a compound having a number average molecular weight of 200 to 6000. Poly (alkylene oxide) glycol and (c) a polyetheresteramide obtained by copolymerizing a dicarboxylic acid having 4 to 20 carbon atoms such that the polyetherester unit is 10 to 90% by weight. Item 4. The card material according to Item 1 or 2. 4. The card material according to claim 1, wherein the component (A) is an amorphous polyester. (5) The component (A) is a polyester comprising a dicarboxylic acid unit mainly composed of terephthalic acid units and a glycol unit mainly composed of ethylene glycol units and 1,4-cyclohexanedimethanol units. The card material according to claim 1. 6. The component (A) comprises an ethylene glycol unit (I) and a 1,4-cyclohexanedimethanol unit (I).
The card material according to any one of claims 1 to 5, comprising a polyester having a molar ratio [(I) / (II)] of 1 or more. 7. The component (A) comprises an ethylene glycol unit (I) and a 1,4-cyclohexanedimethanol unit (I).
The card material according to any one of claims 1 to 5, comprising a polyester having a molar ratio [(I) / (II)] of 1 or more and an aromatic polycarbonate. 8. The component (A) comprises an ethylene glycol unit (I) and a 1,4-cyclohexanedimethanol unit (I).
A polyester wherein the molar ratio (I) / (II) of I) is 1 or more; and the molar ratio (I) / of ethylene glycol unit (I) and 1,4-cyclohexanedimethanol unit (II) /
The card material according to any one of claims 1 to 5, wherein (II) comprises a polyester smaller than 1 and an aromatic polycarbonate. 9. The component (A) comprises an ethylene glycol unit (I) and a 1,4-cyclohexanedimethanol unit (I).
A polyester wherein the molar ratio (I) / (II) of I) is 1 or more; and the molar ratio (I) / of ethylene glycol unit (I) and 1,4-cyclohexanedimethanol unit (II) /
The card material according to any one of claims 1 to 5, wherein (II) comprises a polyester smaller than 1. 10. The epoxy compound (C) may further comprise (A)
The card material according to any one of claims 1 to 9, which is contained in an amount of 0.1 to 20 parts by weight based on 100 parts by weight of the component. 11. The method according to claim 1, wherein (D) the average particle size is 0.5 to 20 μm.
2 to 50 parts by weight of the inorganic plate-like filler m is added to 100 parts by weight of the component (A).
10. The card material according to any of items 10 to 10. 12. The card material according to claim 11, wherein the component (D) is talc. 13. A card made of the card material according to claim 1. 14. An embossed card made of the card material according to claim 13.